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W968D6DAGX7I

W968D6DAGX7I

  • 厂商:

    WINBOND(华邦)

  • 封装:

    -

  • 描述:

  • 数据手册
  • 价格&库存
W968D6DAGX7I 数据手册
W968D6DA 256Mb Async./Page,Syn./Burst CellularRAM TABLE OF CONTENTS 1. GENERAL DESCRIPTION ........................................................................................................ 4 2. FEATURES ................................................................................................................................ 4 3. ORDERING INFORMATION ..................................................................................................... 4 4. PIN CONFIGURATION .............................................................................................................. 5 4.1 Ball Assignment................................................................................................................................. 5 5. PIN DESCRIPTION.................................................................................................................... 6 5.1 Signal Description ............................................................................................................................. 6 6. BLOCK DIAGRAM .................................................................................................................... 7 6.1 Block Diagram ................................................................................................................................... 7 6.2 CellularRAM - Interface Configuration Options .................................................................................. 8 7. INSTRUCTION SET................................................................................................................... 9 7.1 Bus Operation ................................................................................................................................... 9 8. FUNCTIONAL DESCRIPTION ................................................................................................ 10 8.1 Power Up Initialization ..................................................................................................................... 10 8.1.1 Power-Up Initialization Timing ...................................................................................................................... 10 8.2 Bus Operating Modes ...................................................................................................................... 10 8.2.1 Asynchronous Modes ................................................................................................................................... 10 8.2.1.1 READ Operation(ADV# LOW) .................................................................................................................................11 8.2.1.2 WRITE Operation (ADV# LOW) ...............................................................................................................................11 8.2.2 Page Mode READ Operation ....................................................................................................................... 12 8.2.2.1 Page Mode READ Operation (ADV# LOW) .............................................................................................................12 8.2.3 BURST Mode Operation .............................................................................................................................. 12 8.2.3.1 Burst Mode READ (4-word burst) ............................................................................................................................13 8.2.3.2 Burst Mode WRITE (4-word burst) ...........................................................................................................................14 8.2.3.3 Refresh Collision During Variable-Latency READ Operation ...................................................................................15 8.2.4 Mixed-Mode Operation ................................................................................................................................. 16 8.2.4.1 WAIT Operation .......................................................................................................................................................16 8.2.4.2 Wired-OR WAIT Configuration .................................................................................................................................16 8.2.5 LB#/ UB# Operation ..................................................................................................................................... 17 8.3 Low Power Operation ...................................................................................................................... 17 8.3.1 Standby Mode Operation ............................................................................................................................. 17 8.3.2 Temperature Compensated Refresh ............................................................................................................ 17 8.3.3 Partial Array Refresh .................................................................................................................................... 17 8.3.4 Deep Power-Down Operation ...................................................................................................................... 17 8.4 Registers ......................................................................................................................................... 18 8.4.1 Access Using CRE ....................................................................................................................................... 18 8.4.1.1 Configuration Register WRITE, Asynchronous Mode Followed by READ ARRAY Operation .................................18 8.4.1.2 Configuration Register WRITE – CE# control ..........................................................................................................19 8.4.1.3 Configuration Register WRITE, Synchronous Mode Followed by READ ARRAY Operation ...................................20 8.4.1.4 Register READ, Asynchronous Mode Followed by READ ARRAY Operation .........................................................21 8.4.1.5 Register READ, Synchronous Mode Followed by READ ARRAY Operation ...........................................................22 8.4.2 Software Access ........................................................................................................................................... 23 8.4.2.1 Load Configuration Register ....................................................................................................................................23 8.4.2.2 Read Configuration Register ....................................................................................................................................24 8.4.3 Bus Configuration Register .......................................................................................................................... 24 8.4.3.1 Bus Configuration Register Definition ......................................................................................................................25 8.4.3.2 Burst Length (BCR[2:0]) Default = Continuous Burst ...............................................................................................26 8.4.3.3 Burst Wrap (BCR[3]) Default = No Wrap..................................................................................................................26 8.4.3.4 Sequence and Burst Length.....................................................................................................................................27 8.4.3.5 Drive Strength (BCR[5:4]) Default = Outputs Use Half-Drive Strength.....................................................................28 8.4.3.6 Table of Drive Strength ............................................................................................................................................28 Publication Release Date: Feb. 17, 2020 Revision: A01-004 -1- W968D6DA 8.4.3.7 WAIT Signal in Synchronous Burst Mode ................................................................................................................28 8.4.3.8 WAIT Config. (BCR[8]) .............................................................................................................................................28 8.4.3.9 WAIT Polarity (BCR[10]) ..........................................................................................................................................28 8.4.3.10 WAIT Configuration During Burst Operation ..........................................................................................................29 8.4.3.11 WAIT Function by Configuration (WC) – Lat=2, WP=0 ..........................................................................................29 8.4.3.12 Latency Counter (BCR[13:11]) ...............................................................................................................................30 8.4.3.13 Initial Access Latency (BCR[14]) ............................................................................................................................30 8.4.3.14 Allowed Latency Counter Settings in Variable Latency Mode ................................................................................30 8.4.3.15 Latency Counter (Variable Initial Latency, No Refresh Collision) ...........................................................................31 8.4.3.16 Latency Counter (Variable Initial Latency, With Refresh Collision) ........................................................................31 8.4.3.17 Allowed Latency Counter Settings in Fixed Latency Mode ....................................................................................32 8.4.3.18 Latency Counter (Fixed Latency) ...........................................................................................................................32 8.4.3.19 Burst Write Always Produces Fixed Latency..........................................................................................................33 8.4.3.20 Burst Interrupt ........................................................................................................................................................33 8.4.3.21 End-of-Row Condition ............................................................................................................................................33 8.4.3.22 Burst Termination or Burst Interrupt At the End of Row .........................................................................................33 8.4.3.23 Operating Mode (BCR[15]) ....................................................................................................................................33 8.4.4 Refresh Configuration Register .................................................................................................................... 34 8.4.4.1 Refresh Configuration Register Mapping .................................................................................................................34 8.4.4.2 Partial Array Refresh (RCR[2:0] Default = Full Array Refresh ..................................................................................34 8.4.4.3 Address Patterns for PAR (RCR[4] = 1) ...................................................................................................................35 8.4.4.4 Deep Power-Down (RCR[4]) ....................................................................................................................................35 8.4.4.5 Page Mode Operation (RCR[7]) ...............................................................................................................................35 8.4.5 Device Identification Register ....................................................................................................................... 35 8.4.5.1 Device Identification Register Mapping ....................................................................................................................35 8.4.6 Virtual Chip Enable Function ........................................................................................................................ 35 9. ELECTRICAL CHARACTERISTIC.......................................................................................... 36 9.1 Absolute Maximum DC, AC Ratings ................................................................................................ 36 9.2 Electrical Characteristics and Operating Conditions ........................................................................ 37 9.3 Deep Power-Down Specifications.................................................................................................... 38 9.4 Partial Array Self Refresh Standby Current ..................................................................................... 38 9.5 Capacitance .................................................................................................................................... 38 9.6 AC Input-Output Reference Waveform ............................................................................................ 38 9.7 AC Output Load Circuit.................................................................................................................... 38 10. TIMING REQUIREMENTS ..................................................................................................... 39 10.1 Read, Write Timing Requirements ................................................................................................. 39 10.1.1 Asynchronous READ Cycle Timing Requirements .................................................................................... 39 10.1.2 Burst READ Cycle Timing Requirements ................................................................................................... 40 10.1.3 Asynchronous WRITE Cycle Timing Requirements ................................................................................... 41 10.1.4 Burst WRITE Cycle Timing Requirements ................................................................................................. 42 10.2 TIMING DIAGRAMS ...................................................................................................................... 43 10.2.1 Initialization Period ..................................................................................................................................... 43 10.2.2 DPD Entry and Exit Timing Parameters ..................................................................................................... 43 10.2.3 Initialization and DPD Timing Parameters ................................................................................................. 43 10.2.4 Asynchronous READ .................................................................................................................................. 44 10.2.5 Asynchronous READ Using ADV# ............................................................................................................. 45 10.2.6 Page Mode READ ...................................................................................................................................... 46 10.2.7 Single-Access Burst READ Operation-Variable Latency ........................................................................... 47 10.2.8 4-Word Burst READ Operation-Variable Latency ...................................................................................... 48 10.2.9 Single-Access Burst READ Operation-Fixed Latency................................................................................ 49 10.2.10 4-Word Burst READ Operation-Fixed Latency......................................................................................... 50 10.2.11 READ Burst Suspend ............................................................................................................................... 51 10.2.12 Burst READ at End-of-Row (Wrap Off) .................................................................................................... 52 10.2.13 Burst READ Row Boundary Crossing ...................................................................................................... 53 Publication Release Date: Feb. 17, 2020 Revision: A01-004 -2- W968D6DA 10.2.14 CE#-Controlled Asynchronous WRITE .................................................................................................... 54 10.2.15 LB# / UB# Controlled Asynchronous WRITE ........................................................................................... 55 10.2.16 WE# - Controlled Asynchronous WRITE ................................................................................................. 56 10.2.17 Asynchronous WRITE Using ADV# ......................................................................................................... 57 10.2.18 Burst WRITE Operation-Variable Latency Mode ..................................................................................... 58 10.2.19 Burst WRITE Operation-Fixed Latency Mode .......................................................................................... 59 10.2.20 Burst WRITE at End of Row (Wrap off) .................................................................................................... 60 10.2.21 Burst WRITE Row Boundary Crossing .................................................................................................... 61 10.2.22 Burst WRITE Followed by Burst READ .................................................................................................... 62 10.2.23 Burst READ Interrupted by Burst READ or WRITE ................................................................................. 63 10.2.24 Burst WRITE Interrupted by Burst WRITE or READ–Variable Latency Mode ......................................... 64 10.2.25 Burst WRITE Interrupted by Burst WRITE or READ-Fixed Latency Mode .............................................. 65 10.2.26 Asynchronous WRITE Followed by Burst READ ..................................................................................... 66 10.2.27 Asynchronous WRITE (ADV# LOW) Followed by Burst READ ............................................................... 67 10.2.28 Burst READ Followed By Asynchronous WRITE (WE# - Controlled) ...................................................... 68 10.2.29 Burst READ Followed By Asynchronous WRITE Using ADV# ................................................................ 69 10.2.30 Asynchronous WRITE Followed by Asynchronous READ - ADV# LOW ................................................. 70 10.2.31 Asynchronous WRITE Followed by Asynchronous READ ....................................................................... 71 11. PACKAGE DESCRIPTION.................................................................................................... 72 11.1 Package Dimension....................................................................................................................... 72 12. REVISION HISTORY ............................................................................................................. 73 Publication Release Date: Feb. 17, 2020 Revision: A01-004 -3- W968D6DA 1. GENERAL DESCRIPTION Winbond CellularRAM™ products are high-speed, CMOS pseudo-static random access memories developed for low-power, portable applications. The device has a DRAM core organized. These devices include an industrystandard burst mode Flash interface that dramatically increases read/write bandwidth compared with other lowpower SRAM or Pseudo SRAM offerings. To operate seamlessly on a burst Flash bus, CellularRAM products incorporate a transparent self refresh mechanism. The hidden refresh requires no additional support from the system memory controller and has no significant impact on device READ/WRITE performance. Two user-accessible control registers define device operation. The Bus Configuration Register (BCR) defines how the CellularRAM device interacts with the system memory bus and is nearly identical to its counterpart on burst mode Flash devices. The Refresh Configuration Register (RCR) is used to control how refresh is performed on the DRAM array. These registers are automatically loaded with default settings during power-up and can be updated anytime during normal operation. Special attention has been focused on standby current consumption during self refresh. CellularRAM products include three mechanisms to minimize standby current. Partial array refresh (PAR) enables the system to limit refresh to only that part of the DRAM array that contains essential data. Temperature compensated refresh (TCR) uses an on-chip sensor to adjust the refresh rate to match the device temperature—the refresh rate decreases at lower temperatures to minimize current consumption during standby. Deep power-down (DPD) enables the system to halt the refresh operation altogether when no vital information is stored in the device. The system configurable refresh mechanisms are accessed through the RCR. This CellularRAM device is compliant with the industry-standard CellularRAM 1.5 generation feature set established by the CellularRAM Workgroup. It includes support for both variable and fixed latency, with 3 output-device drivestrength settings, additional wrap options, and a device ID register (DIDR). 2. FEATURES •Supports asynchronous, page, and burst operations • Low-power features • VCC, VCCQ Voltages: On-chip temperature compensated refresh (TCR) 1.7V–1.95V VCC Partial array refresh (PAR) 1.7V–1.95V VCCQ Deep power-down (DPD) mode • Random access time: 70ns • Configuration: • Burst mode READ and WRITE access: 256Mb 16Mx16 4, 8, 16, or 32 words, or continuous burst VCC core voltage supply: 1.8V Burst wrap or sequential VCCQ I/O voltage supply: 1.8V  Package: 54 Ball VFBGA Max clock rate: 133 MHz (tCLK = 7.5ns) • Page mode READ access:  Active current (ICC1)
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