AS3823-ZQFT

ams AG Tobelbader Strasse 30 8141 Unterpremstaetten Austria T +43 3136 500-0 F +43 3136 525-01 info@ams.com www.ams.com Unterpremstätten, July 17, 2014 Process Change Notification PCN18-2014 Installation of improved fab metallization process for 0.35 µm technologies Dear Customer, AMS management team decided to take the next step in the roadmap towards advanced technology nodes. Within the next year 0.18µm technology will be ramped up in Fab B. This offers the possibility to reengineer and improve installed process steps. Therefore, please be informed that ams will modify Fab B 0.35µm metallization processes towards improved single process steps established in semiconductor industry for advanced technologies already for years. The modified process combines following single process steps: • tungsten CMP replaces tungsten etchback process • decreasing of aluminium metallization deposition temperature from 300°C to 200°C • adaption of ARC layer for new aluminium metallization These changes are applicable to all metal layers. Products affected: Please refer to product list on page 6 Bankverbindungen/ Bankaccounts UniCredit Bank Austria AG, Graz IBAN EUR AT28 1200 0763 1316 1100 BIC BKAUATWW IBAN USD AT60 1200 0763 1316 1106 BIC BKAUATWW Firmenbuchgericht Graz Firmenbuch Nr. FN 34109k DVR 0420352 UID/VAT ATU 28560205 Purpose of Change: The installation of enhanced single processes as part of ramp up of 0.18µm technology in Fab B enables the improvement of established 0.35µm technology. Already established process moduls in Fab B will be roled out to less advanced 0.35µm technology node at ams. The applied changes are triggered by continuous improvements towards lower defect density and higher yield. Furthermore the changes increase process robustness and manufacturability due to better layer uniformity. The new processes will provide additional flexibility and capacity to further improve responsiveness and on time delivery to ams customers. Single Process Changes: See detailed information in appendix Qualification Strategy: ams is qualifying process change based on established change management flow including safe launch phase. The qualification includes: Inline and defect data review Wafer acceptance test Waferprobetest results Process reliability (electromicration) – three lot qualification Product reliability test (HTOL) - three lot qualification Detailed qualification results can be provided upon request. Target Date of Implementation: September 2014 Sample Availability: Sample availability has to be aligned page 2/6 Risk Assessment: The risk is classified as low based on following facts: • State of the art metalization scheme for advanced process nodes • Improved topography / layer uniformity - no plug recess • Reduced defect density / higher yield • Metallization and interconnect qualification, see above • Process and line control via established fault detection and classification (FDC) system, reliability monitoring and MRB approach Detailed risk assessment is covered by updated process FMEA. Please be advised that unless we receive your written refusal concerning this PCN within 30 days, the PCN shall be deemed accepted. If you do have further questions, please do not hesitate to contact us. Best Regards, Udo Theißl ams AG QC Manager Appendix: Detailed information: Process comparison: OLD PROCESS contact Contact/via formation liner Liner deposition WxD Tungsten deposition Tungsten etch back MxD Metal deposition Arc layer NEW PROCESS contact liner WxD CMP Ti/TiN MxD Contact/via formation Liner deposition Tungsten deposition Tungsten CMP Ti / TiN Redeposition Metal deposition Arc layer page 3/6 Metallization and interconnect – schematic Old process: New process: page 4/6 X-Section: STEM Old Process: New process: page 5/6 Products affected: AS1122 x AS2522x AS2523x AS3421x AS3422x AS3728x AS3820x AS3821x AS3822x AS3823x AS3910x AS3911x AS3922x AS5013x AS5600x page 6/6