ESP32-WROVER-I

ESP32-WROVER Datasheet Version 2.0 Espressif Systems Copyright © 2018 www.espressif.com About This Document This document provides the specifications for the ESP32-WROVER modules with a PCB antenna or an IPEX antenna. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Certification Download certificates for Espressif products from www.espressif.com/en/certificates. Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, OR ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2018 Espressif Inc. All rights reserved. Contents 1 Overview 1 2 Pin Definitions 3 2.1 Pin Layout 3 2.2 Pin Description 4 2.3 Strapping Pins 5 3 Functional Description 7 3.1 CPU and Internal Memory 7 3.2 External Flash and SRAM 7 3.3 Crystal Oscillators 7 3.4 RTC and Low-Power Management 8 4 Peripherals and Sensors 9 5 Electrical Characteristics 10 5.1 Absolute Maximum Ratings 10 5.2 Recommended Operating Conditions 10 5.3 DC Characteristics (3.3 V, 25 °C) 10 5.4 Wi-Fi Radio 11 5.5 BLE Radio 11 5.6 5.5.1 Receiver 11 5.5.2 Transmitter 12 Reflow Profile 13 6 Schematics 14 7 Peripheral Schematics 15 8 Physical Dimensions 17 9 Recommended PCB Land Pattern 18 10U.FL Connector Dimensions 19 11Learning Resources 20 11.1 Must-Read Documents 20 11.2 Must-Have Resources 20 Revision History 21 List of Tables 1 ESP32-WROVER Ordering Information 1 2 ESP32-WROVER Specifications 1 3 Pin Definitions 4 4 Strapping Pins 5 5 Absolute Maximum Ratings 10 6 Recommended Operating Conditions 10 7 DC Characteristics (3.3 V, 25 °C) 10 8 Wi-Fi Radio Characteristics 11 9 Receiver Characteristics – BLE 12 10 Transmitter Characteristics – BLE 12 List of Figures 1 Pin Layout of ESP32-WROVER (Top View) 3 2 Reflow Profile 13 3 Schematics of ESP32-WROVER 14 4 Peripheral Schematics of ESP32-WROVER 15 5 Discharge Circuit for VDD33 Rail 15 6 Reset Circuit 16 7 Physical Dimensions of ESP32-WROVER 17 8 Recommended PCB Land Pattern of ESP32-WROVER 18 9 U.FL Connector Dimensions 19 1. Overview 1. Overview ESP32-WROVER is a powerful, generic WiFi-BT-BLE MCU module that targets a wide variety of applications, ranging from low-power sensor networks to the most demanding tasks, such as voice encoding, music streaming and MP3 decoding. This module is provided in two versions: one with a PCB antenna, the other with an IPEX antenna. ESP32WROVER features a 4 MB external SPI flash and an additional 8 MB SPI Pseudo static RAM (PSRAM). The ordering information on the two variants of ESP32-WROVER is listed as follows: Table 1: ESP32-WROVER Ordering Information Module ESP32-WROVER (PCB) ESP32-WROVER (IPEX) Chip embedded Flash PSRAM Dimensions (mm) ESP32-D0WDQ6 4 MB 8 MB (18.00±0.10)x(31.40±0.10)x(3.30±0.10) For detailed ordering information, please see Espressif Product Ordering Information. For dimensions of the IPEX connector, please see Chapter 10. The information in this datasheet is applicable to both modules. At the core of this module is the ESP32-D0WDQ6 chip*. The chip embedded is designed to be scalable and adaptive. There are two CPU cores that can be individually controlled, and the CPU clock frequency is adjustable from 80 MHz to 240 MHz. The user may also power off the CPU and make use of the low-power co-processor to constantly monitor the peripherals for changes or crossing of thresholds. ESP32 integrates a rich set of peripherals, ranging from capacitive touch sensors, Hall sensors, SD card interface, Ethernet, high-speed SPI, UART, I²S and I²C. Note: * For details on the part numbers of the ESP32 family of chips, please refer to the document ESP32 Datasheet. The integration of Bluetooth, Bluetooth LE and Wi-Fi ensures that a wide range of applications can be targeted, and that the module is all-around: using Wi-Fi allows a large physical range and direct connection to the Internet through a Wi-Fi router, while using Bluetooth allows the user to conveniently connect to the phone or broadcast low energy beacons for its detection. The sleep current of the ESP32 chip is less than 5 µA, making it suitable for battery powered and wearable electronics applications. The module supports a data rate of up to 150 Mbps, and 20 dBm output power at the antenna to ensure the widest physical range. As such the module does offer industry-leading specifications and the best performance for electronic integration, range, power consumption, and connectivity. The operating system chosen for ESP32 is freeRTOS with LwIP; TLS 1.2 with hardware acceleration is built in as well. Secure (encrypted) over the air (OTA) upgrade is also supported, so that users can upgrade their products even after their release, at minimum cost and effort. Table 2 provides the specifications of ESP32-WROVER. Table 2: ESP32-WROVER Specifications Categories Items Specifications Certification RF certification FCC/CE-RED/SRRC/TELEC Wi-Fi certification Wi-Fi Alliance Espressif Systems 1 ESP32-WROVER Datasheet V2.0 1. Overview Categories Test Items Specifications Bluetooth certification BQB Green certification RoHS/REACH Reliablity HTOL/HTSL/uHAST/TCT/ESD 802.11 b/g/n (802.11n up to 150 Mbps) Wi-Fi Protocols A-MPDU and A-MSDU aggregation and 0.4 µs guard interval support Frequency range 2.4 GHz ~ 2.5 GHz Protocols Bluetooth v4.2 BR/EDR and BLE specification NZIF receiver with –97 dBm sensitivity Bluetooth Radio Class-1, class-2 and class-3 transmitter AFH Audio CVSD and SBC SD card, UART, SPI, SDIO, I2 C, LED PWM, Motor PWM, Module interfaces I2 S, IR, pulse counter, GPIO, capacitive touch sensor, ADC, DAC Hardware On-chip sensor Hall sensor Integrated crystal 40 MHz crystal Integrated SPI flash 4 MB Integrated PSRAM 8 MB Operating voltage/Power supply 2.3 V ~ 3.6 V Operating current Average: 80 mA Minimum current delivered by power supply Recommended operating temperature range Package size Espressif Systems 500 mA –40 °C ~ 85 °C (18.00±0.10) mm x (31.40±0.10) mm x (3.30±0.10) mm 2 ESP32-WROVER Datasheet V2.0 2. Pin Definitions 2. Pin Definitions 2.1 Pin Layout Keepout Zone 1 GND GND 38 2 VDD33 IO23 37 3 EN IO22 36 4 SENSOR_VP TXD0 35 5 SENSOR_VN RXD0 34 6 IO34 IO21 33 7 IO35 NC 32 IO19 31 39 GND 8 IO32 9 IO33 IO18 30 10 IO25 IO5 29 11 IO26 NC 28 12 IO27 NC 27 13 IO14 IO4 26 14 IO12 IO0 25 15 GND IO2 24 16 IO13 IO15 23 17 SD2 SD1 22 18 SD3 SD0 21 19 CMD CLK 20 Figure 1: Pin Layout of ESP32-WROVER (Top View) Espressif Systems 3 ESP32-WROVER Datasheet V2.0 2. Pin Definitions 2.2 Pin Description ESP32-WROVER has 38 pins. See pin definitions in Table 3. Table 3: Pin Definitions Name No. Type Function GND 1 P Ground 3V3 2 P Power supply EN 3 I Module-enable signal. Active high. SENSOR_VP 4 I GPIO36, ADC1_CH0, RTC_GPIO0 SENSOR_VN 5 I GPIO39, ADC1_CH3, RTC_GPIO3 IO34 6 I GPIO34, ADC1_CH6, RTC_GPIO4 IO35 7 I GPIO35, ADC1_CH7, RTC_GPIO5 IO32 8 I/O IO33 9 I/O IO25 10 I/O GPIO25, DAC_1, ADC2_CH8, RTC_GPIO6, EMAC_RXD0 IO26 11 I/O GPIO26, DAC_2, ADC2_CH9, RTC_GPIO7, EMAC_RXD1 IO27 12 I/O GPIO27, ADC2_CH7, TOUCH7, RTC_GPIO17, EMAC_RX_DV IO14 13 I/O IO12 14 I/O GND 15 P IO13 16 I/O SHD/SD2* 17 I/O GPIO9, SD_DATA2, SPIHD, HS1_DATA2, U1RXD SWP/SD3* 18 I/O GPIO10, SD_DATA3, SPIWP, HS1_DATA3, U1TXD SCS/CMD* 19 I/O GPIO11, SD_CMD, SPICS0, HS1_CMD, U1RTS SCK/CLK* 20 I/O GPIO6, SD_CLK, SPICLK, HS1_CLK, U1CTS SDO/SD0* 21 I/O GPIO7, SD_DATA0, SPIQ, HS1_DATA0, U2RTS SDI/SD1* 22 I/O GPIO8, SD_DATA1, SPID, HS1_DATA1, U2CTS IO15 23 I/O IO2 24 I/O IO0 25 I/O IO4 26 I/O NC1 27 - - NC2 28 - - IO5 29 I/O GPIO5, VSPICS0, HS1_DATA6, EMAC_RX_CLK IO18 30 I/O GPIO18, VSPICLK, HS1_DATA7 Espressif Systems GPIO32, XTAL_32K_P (32.768 kHz crystal oscillator input), ADC1_CH4, TOUCH9, RTC_GPIO9 GPIO33, XTAL_32K_N (32.768 kHz crystal oscillator output), ADC1_CH5, TOUCH8, RTC_GPIO8 GPIO14, ADC2_CH6, TOUCH6, RTC_GPIO16, MTMS, HSPICLK, HS2_CLK, SD_CLK, EMAC_TXD2 GPIO12, ADC2_CH5, TOUCH5, RTC_GPIO15, MTDI, HSPIQ, HS2_DATA2, SD_DATA2, EMAC_TXD3 Ground GPIO13, ADC2_CH4, TOUCH4, RTC_GPIO14, MTCK, HSPID, HS2_DATA3, SD_DATA3, EMAC_RX_ER GPIO15, ADC2_CH3, TOUCH3, MTDO, HSPICS0, RTC_GPIO13, HS2_CMD, SD_CMD, EMAC_RXD3 GPIO2, ADC2_CH2, TOUCH2, RTC_GPIO12, HSPIWP, HS2_DATA0, SD_DATA0 GPIO0, ADC2_CH1, TOUCH1, RTC_GPIO11, CLK_OUT1, EMAC_TX_CLK GPIO4, ADC2_CH0, TOUCH0, RTC_GPIO10, HSPIHD, HS2_DATA1, SD_DATA1, EMAC_TX_ER 4 ESP32-WROVER Datasheet V2.0 2. Pin Definitions Name No. Type Function IO19 31 I/O GPIO19, VSPIQ, U0CTS, EMAC_TXD0 NC 32 - - IO21 33 I/O GPIO21, VSPIHD, EMAC_TX_EN RXD0 34 I/O GPIO3, U0RXD, CLK_OUT2 TXD0 35 I/O GPIO1, U0TXD, CLK_OUT3, EMAC_RXD2 IO22 36 I/O GPIO22, VSPIWP, U0RTS, EMAC_TXD1 IO23 37 I/O GPIO23, VSPID, HS1_STROBE GND 38 P Ground Notice: * Pins SCK/CLK, SDO/SD0, SDI/SD1, SHD/SD2, SWP/SD3 and SCS/CMD, namely, GPIO6 to GPIO11 are connected to the SPI flash integrated on the module and are not recommended for other uses. 2.3 Strapping Pins ESP32 has five strapping pins, which can be seen in Chapter 6 Schematics: • MTDI • GPIO0 • GPIO2 • MTDO • GPIO5 Software can read the values of these five bits from register ”GPIO_STRAPPING”. During the chip’s system reset (power-on-reset, RTC watchdog reset and brownout reset), the latches of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down. The strapping bits configure the device’s boot mode, the operating voltage of VDD_SDIO and other initial system settings. Each strapping pin is connected to its internal pull-up/pull-down during the chip reset. Consequently, if a strapping pin is unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of the strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32. After reset, the strapping pins work as normal-function pins. Refer to Table 4 for a detailed boot-mode configuration by strapping pins. Table 4: Strapping Pins Voltage of Internal LDO (VDD_SDIO) Pin Default MTDI Pull-down Espressif Systems 3.3 V 1.8 V 0 1 5 ESP32-WROVER Datasheet V2.0 2. Pin Definitions Booting Mode Pin Default SPI Boot Download Boot GPIO0 Pull-up 1 0 GPIO2 Pull-down Don’t-care 0 Enabling/Disabling Debugging Log Print over U0TXD During Booting Pin Default U0TXD Active U0TXD Silent MTDO Pull-up 1 0 Timing of SDIO Slave Pin Default MTDO GPIO5 Falling-edge Input Falling-edge Input Rising-edge Input Rising-edge Input Falling-edge Output Rising-edge Output Falling-edge Output Rising-edge Output Pull-up 0 0 1 1 Pull-up 0 1 0 1 Note: • Firmware can configure register bits to change the settings of ”Voltage of Internal LDO (VDD_SDIO)” and ”Timing of SDIO Slave” after booting. • The MTDI is internally pulled high in the module, as the flash and SRAM in ESP32-WROVER only support a power voltage of 1.8 V (output by VDD_SDIO). Espressif Systems 6 ESP32-WROVER Datasheet V2.0 3. Functional Description 3. Functional Description This chapter describes the modules and functions integrated in ESP32-WROVER. 3.1 CPU and Internal Memory ESP32-D0WDQ6 contains two low-power Xtensa® 32-bit LX6 microprocessors. The internal memory includes: • 448 KB of ROM for booting and core functions. • 520 KB of on-chip SRAM for data and instructions. • 8 KB of SRAM in RTC, which is called RTC FAST Memory and can be used for data storage; it is accessed by the main CPU during RTC Boot from the Deep-sleep mode. • 8 KB of SRAM in RTC, which is called RTC SLOW Memory and can be accessed by the co-processor during the Deep-sleep mode. • 1 Kbit of eFuse: 256 bits are used for the system (MAC address and chip configuration) and the remaining 768 bits are reserved for customer applications, including flash-encryption and chip-ID. 3.2 External Flash and SRAM ESP32 supports multiple external QSPI flash and SRAM chips. More details can be found in Chapter SPI in the ESP32 Technical Reference Manual. ESP32 also supports hardware encryption/decryption based on AES to protect developers’ programs and data in flash. ESP32 can access the external QSPI flash and SRAM through high-speed caches. • The external flash can be mapped into CPU instruction memory space and read-only memory space simultaneously. – When external flash is mapped into CPU instruction memory space, up to 11 MB + 248 KB can be mapped at a time. Note that if more than 3 MB + 248 KB are mapped, cache performance will be reduced due to speculative reads by the CPU. – When external flash is mapped into read-only data memory space, up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads are supported. • External SRAM can be mapped into CPU data memory space. Up to 4 MB can be mapped at a time. 8-bit, 16-bit and 32-bit reads and writes are supported. ESP32-WROVER integrates a 4 MB of external SPI flash and an 8 MB PSRAM for more memory space. 3.3 Crystal Oscillators The module uses a 40-MHz crystal oscillator. Espressif Systems 7 ESP32-WROVER Datasheet V2.0 3. Functional Description 3.4 RTC and Low-Power Management With the use of advanced power-management technologies, ESP32 can switch between different power modes. For details on ESP32’s power consumption in different power modes, please refer to section ”RTC and Low-Power Management” in ESP32 Datasheet. Espressif Systems 8 ESP32-WROVER Datasheet V2.0 4. Peripherals and Sensors 4. Peripherals and Sensors Please refer to Section Peripherals and Sensors in ESP32 Datasheet. Note: External connections can be made to any GPIO except for GPIOs in the range 6-11, 16, or 17. GPIOs 6-11 are connected to the module’s integrated SPI flash and PSRAM. GPIOs 16 and 17 are connected to the module’s integrated PSRAM. For details, please see Chapter 6 Schematics. Espressif Systems 9 ESP32-WROVER Datasheet V2.0 5. Electrical Characteristics 5. Electrical Characteristics 5.1 Absolute Maximum Ratings Stresses beyond the absolute maximum ratings listed in the table below may cause permanent damage to the device. These are stress ratings only, and do not refer to the functional operation of the device that should follow the recommended operating conditions. Table 5: Absolute Maximum Ratings Symbol Parameter Min Max Unit VDD33 Power supply voltage –0.3 3.6 V Cumulative IO output current - 1,100 mA Storage temperature –40 150 °C Ioutput 1 Tstore 1. The module worked properly after a 24-hour test in ambient temperature at 25 °C, and the IOs in three domains (VDD3P3_RTC, VDD3P3_CPU, VDD_SDIO) output high logic level to ground. Please note that pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 2. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. 5.2 Recommended Operating Conditions Table 6: Recommended Operating Conditions Symbol Parameter Min Typical Max Unit VDD33 - 2.3 3.3 3.6 V IV DD Current delivered by external power supply 0.5 - - A T Operating temperature –40 - 85 °C 5.3 DC Characteristics (3.3 V, 25 °C) Table 7: DC Characteristics (3.3 V, 25 °C) Symbol CIN VIH Parameter Min Pin capacitance - High-level input voltage 0.75×VDD 1 Typ Max 2 - - Unit pF 1 VDD +0.3 V 1 VIL Low-level input voltage –0.3 - 0.25×VDD IIH High-level input current - - 50 nA IIL Low-level input current - - 50 nA - - VOH VOL High-level output voltage 0.8×VDD Low-level output voltage High-level source current 1 IOH 1 (VDD = 3.3 V, VOH >= 2.64 V, output drive strength set to the maximum) Espressif Systems V V 1 - - 0.1×VDD V VDD3P3_CPU power domain 1, 2 - 40 - mA VDD3P3_RTC power domain 1, 2 - 40 - mA - 20 - mA VDD_SDIO power domain 1, 10 3 ESP32-WROVER Datasheet V2.0 5. Electrical Characteristics Symbol Parameter Min Typ Max Unit - 28 - mA Low-level sink current IOL (VDD1 = 3.3 V, VOL = 0.495 V, output drive strength set to the maximum) RP U Resistance of internal pull-up resistor - 45 - kΩ RP D Resistance of internal pull-down resistor - 45 - kΩ VIL_nRST Low-level input voltage of CHIP_PU to reset the chip - - 0.6 V Notes: 1. Please see Appendix IO_MUX of ESP32 Datasheet for IO’s power domain. VDD is the I/O voltage for a particular power domain of pins. 2. For VDD3P3_CPU and VDD3P3_RTC power domain, per-pin current sourced in the same domain is gradually reduced from around 40 mA to around 29 mA, VOH >=2.64 V, as the number of current-source pins increases. 3. Pins occupied by flash and/or PSRAM in the VDD_SDIO power domain were excluded from the test. 5.4 Wi-Fi Radio Table 8: Wi-Fi Radio Characteristics Parameter Condition Min Typical Max Unit Input frequency - 2412 - 2484 MHz Output impedance* - - * - Ω TX power 11n, MCS7 12 13 14 dBm 11b mode 17.5 18.5 20 dBm 11b, 1 Mbps - –98 - dBm 11b, 11 Mbps - –89 - dBm 11g, 6 Mbps - –92 - dBm 11g, 54 Mbps - –74 - dBm 11n, HT20, MCS0 - –91 - dBm 11n, HT20, MCS7 - –71 - dBm 11n, HT40, MCS0 - –89 - dBm 11n, HT40, MCS7 - –69 - dBm 11g, 6 Mbps - 31 - dB 11g, 54 Mbps - 14 - dB 11n, HT20, MCS0 - 31 - dB 11n, HT20, MCS7 - 13 - dB Sensitivity Adjacent channel rejection ∗ For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas, users do not need to concern about the output impedance. 5.5 BLE Radio 5.5.1 Receiver Espressif Systems 11 ESP32-WROVER Datasheet V2.0 5. Electrical Characteristics Table 9: Receiver Characteristics – BLE Parameter Conditions Min Typ Max Unit Sensitivity @30.8% PER - - –97 - dBm Maximum received signal @30.8% PER - 0 - - dBm Co-channel C/I - - +10 - dB F = F0 + 1 MHz - –5 - dB F = F0 – 1 MHz - –5 - dB F = F0 + 2 MHz - –25 - dB F = F0 – 2 MHz - –35 - dB F = F0 + 3 MHz - –25 - dB F = F0 – 3 MHz - –45 - dB 30 MHz ~ 2000 MHz –10 - - dBm 2000 MHz ~ 2400 MHz –27 - - dBm 2500 MHz ~ 3000 MHz –27 - - dBm 3000 MHz ~ 12.5 GHz –10 - - dBm - –36 - - dBm Adjacent channel selectivity C/I Out-of-band blocking performance Intermodulation 5.5.2 Transmitter Table 10: Transmitter Characteristics – BLE Parameter Conditions Min Typ Max Unit RF transmit power - - 0 - dBm Gain control step - - 3 - dBm RF power control range - –12 - +12 dBm F = F0 ± 2 MHz - –52 - dBm F = F0 ± 3 MHz - –58 - dBm F = F0 ± > 3 MHz - –60 - dBm ∆ f 1avg - - - 265 kHz ∆ f 2max - 247 - - kHz ∆ f 2avg /∆ f 1avg - - –0.92 - - ICFT - - –10 - kHz Drift rate - - 0.7 - kHz/50 µs Drift - - 2 - kHz Adjacent channel transmit power Espressif Systems 12 ESP32-WROVER Datasheet V2.0 5. Electrical Characteristics Temperature (℃) 5.6 Reflow Profile Peak Temp. 235 ~ 250℃ 250 Preheating zone 150 ~ 200℃ 60 ~ 120s 217 200 Reflow zone !217℃ 60 ~ 90s Cooling zone -1 ~ -5℃/s Soldering time > 30s Ramp-up zone 1 ~ 3℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: 217℃ 7LPH60 ~ 90s; Peak Temp.: 235 ~ 250℃ (