SMD1210P035TF

SMD1210 Series Surface Mountable PTC Resettable Fuse Features：      RoHS Compliant ＆ Halogen Free faster tripping, 1210 Dimension, Surface mountable, Solid state Operation Current: 0.05A~2.00A Maximum Voltage: 6V~60Vdc Operating Temperature：-40℃ TO 85℃ Product Dimensions Terminal pad materials :Tin-Plated Nickle-copper Terminal pad solderability : Meets EIA specification RS 186-9E and ANSI/J-STD-002 Category 3. Pig.1 Unit ：mm Model Marking A B C D E Min Max Min Max Min Max Min Min SMD1210P005TF JZ 3.00 3.43 2.35 2.80 0.60 1.25 0.15 0.10 SMD1210P010TF JN 3.00 3.43 2.35 2.80 0.60 1.25 0.15 0.10 SMD1210P020TF JF 3.00 3.43 2.35 2.80 0.50 1.00 0.15 0.10 SMD1210P035TF JB 3.00 3.43 2.35 2.80 0.35 0.90 0.15 0.10 SMD1210P035TF/30 JB 3.00 3.43 2.35 2.80 0.35 1.00 0.15 0.10 SMD1210P050TF JG 3.00 3.43 2.35 2.80 0.35 0.90 0.15 0.10 SMD1210P075TF JA 3.00 3.43 2.35 2.80 0.35 0.85 0.15 0.10 SMD1210P110TFT JK 3.00 3.43 2.35 2.80 0.40 1.10 0.15 0.10 SMD1210P110TF/16 JK 3.00 3.43 2.35 2.80 0.40 1.40 0.15 0.10 SMD1210P150TFT JK 3.00 3.43 2.35 2.80 0.60 1.40 0.15 0.10 SMD1210P175TF JK 3.00 3.43 2.35 2.80 0.60 1.40 0.15 0.10 SMD1210P200TF JK 3.00 3.43 2.35 2.80 0.60 1.50 0.15 0.10 1/6 SMD1210 Series Surface Mountable PTC Resettable Fuse Thermal Derating Chart-IH（A） Model Maximum ambient operating temperatures（℃） -40 -20 0 25 40 50 60 70 85 SMD1210P005TF 0.08 0.07 0.06 0.05 0.04 0.04 0.03 0.03 0.02 SMD1210P010TF 0.16 0.14 0.12 0.10 0.08 0.07 0.06 0.05 0.05 SMD1210P020TF 0.29 0.26 0.22 0.20 0.16 0.14 0.13 0.11 0.08 SMD1210P035TF 0.47 0.45 0.40 0.35 0.33 0.28 0.24 0.21 0.18 SMD1210P035TF/30 0.47 0.45 0.40 0.35 0.33 0.28 0.24 0.21 0.18 SMD1210P050TF 0.76 0.67 0.58 0.50 0.43 0.40 0.36 0.32 0.28 SMD1210P075TF 1.00 0.97 0.86 0.75 0.64 0.59 0.54 0.48 0.40 SMD1210P110TFT 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58 SMD1210P110TF/16 1.60 1.42 1.26 1.10 0.94 0.86 0.80 0.70 0.58 SMD1210P150TFT 2.30 2.02 1.76 1.50 1.24 1.11 1.00 0.85 0.65 SMD1210P175TF 2.45 2.22 2.01 1.75 1.45 1.26 1.10 0.98 0.80 SMD1210P200TF 2.60 2.44 2.35 2.00 1.78 1.67 1.50 1.45 1.10 Vmax Imax Ihold Itrip Pd (Vdc) (A) (A) (A) Max. (W) Current Time Rimin R1max (A) (Sec) () () SMD1210P005TF 30 100 0.05 0.15 0.6 0.25 1.50 2.8 50 SMD1210P010TF 30 100 0.10 0.30 0.6 0.50 0.60 0.8 15 SMD1210P020TF 30 100 0.20 0.40 0.6 8.0 0.02 0.40 5 SMD1210P035TF 6 100 0.35 0.75 0.6 8.0 0.20 0.20 1.3 SMD1210P035TF/30 30 100 0.35 0.75 0.6 8.0 0.20 0.20 1.3 SMD1210P050TF 13.2 100 0.50 1.00 0.6 8.0 0.10 0.18 0.9 SMD1210P075TF 6 100 0.75 1.50 0.6 8.0 0.10 0.07 0.4 SMD1210P110TFT 8 100 1.10 2.20 0.6 8.0 0.30 0.05 0.21 SMD1210P110TF/16 16 100 1.10 2.20 0.8 8.0 0.30 0.05 0.25 SMD1210P150TFT 6 100 1.50 3.00 0.8 8.0 0.50 0.03 0.21 SMD1210P175TF 6 100 1.75 3.50 0.8 8.0 0.60 0.02 0.08 SMD1210P200TF 6 100 2.00 4.00 0.8 8.0 1.00 0.015 0.07 Electrical Characteristic Model 2/6 Maximum time to trip Resistence SMD1210 Series Surface Mountable PTC Resettable Fuse Test Procedures And Requirements Test Test Conditions Accept/Reject Criteria Resistance In still air @ 25℃ Specified current，Vmax ，25℃ Tmaximum Time to Trip Time to Trip Rmin≤R≤R max Hold Current Trip Cycle Life 30min，at IH No tri p Vmax，Imax，100cycles No arcing or burning Trip Endurance Vmax，1 hours No arcing or burning Physical Characteristics and Environmental Specifications Physical Characteristics Terminal materials : Tin-Plated Nickle-copper Soldering Meets EIA spec ificatio n RS 186-9E and ANSI/J-STD- 002 Cat egory 3. z on e Environmental Specifications Test Conditions Resistance Change Passive aging Humidity aging 85℃,1000hours ±10% 85℃/85%RH.1000 hours ±5% Thermal shock Solvent Resistance MIL-STD-202,Method 107G MIL-STD-202,Method 215 no change Vibration ML-STD-883C,Test Condition A No chage +85℃/-40℃,20times -30% typical resistance change Electrical Specifications: I hold = Hold Current. Maximum current device will not trip in 25°C still air. I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air. Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax). 3/6 SMD1210 Series Surface Mountable PTC Resettable Fuse Imax = Maximum fault current device can withstand without damage at rated voltage (Vmax). Pd=Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage. Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C. R1max = Maximum device resistance is measured one hour post reflow. Recommended pad layout (mm) Solder reflow conditions ● Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free. ● Devices are not designed to be wave soldered to the bottom side of the board. ● Recommended maximum paste thickness is 0.25mm (0.010inch). ● Devices can be cleaned using standard industry methods and solvents. ● Soldering temprature profile meets RoHs leadfree process. Notes: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements 4/6 SMD1210 Series Surface Mountable PTC Resettable Fuse Tape Specification And Reel Dimensions Coverning Specifications EIA 481-1(Unit:mm) W 8.0± 0.3 P0 4.0 ± 0.10 P1 4.0 ± 0.10 P2 2.0 ± 0.05 A0 2.82± 0.10 B0 3.46± 0.10 D0 1.55 ± 0.05 F 3.5 0± 0.05 E1 1.75 ± 0.10 T 0.25 ± 0.10 Leader min. 390 Trailer min. 160 Reel Dimensions A 178±1.0 N 59±1 W1 8.5+1.0/-0.2 W2 12.0±1 \ Packaging Quantity Model Quantity Model Quantity SMD1210P005TF 4000 SMD1210P075TF 4000 SMD1210P010TF 4000 SMD1210P110TFT 4000 SMD1210P020TF 4000 SMD1210P110TF/16 3500 SMD1210P035TF 4000 SMD1210P150TFT 4000 SMD1210P035TF/30 4000 SMD1210P175TF 3000 SMD1210P050TF 4000 SMD1210P200TF 3000 5/6 SMD1210 Series Surface Mountable PTC Resettable Fuse Storage The maximum ambient temperature shall not exceed 38℃. Storage temperatures higher than 38℃ could result in the deformation of packaging materials. The maximum relative humidity recommended for storage is 60%. High humidity with high temperature can accelerate the oxidation of the solder plating on the termination and reduce the solderability of the components. Sealed plastic bags with desiccant shall be used to reduce the oxidation of the termination and shall only be opened prior to use. The products shall not be stored in areas where harmful gases containing sulfur or chlorine are present WARNING • Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame. • PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated fault conditions or prolonged trip events are anticipated. • Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and mechanical procedures for electronic components. • Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC. • Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space. • Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the devices.PPTC SMD can be cleaned by standard methods. • Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or reflow profilecould negatively impact solderability performance of our devices. 6/6