WSK140N03
N-Ch MOSFET
Product Summery
General Description
The WSK140N03 is the highest performance
trench N-ch MOSFET with extreme high cell
density , which provide excellent RDSON and
gate charge for most of the synchronous
buck converter applications .
BVDSS
30V
RDSON
ID
4mΩ
140A
Applications
The WSK140N03 meet the RoHS and Green
Product requirement , 100% EAS
guaranteed with full function reliability
approved.
z High Frequency Point-of-Load Synchronous
Buck Converter
z Networking DC-DC Power System
Features
z Advanced high cell density Trench technology
z Super Low Gate Charge
TO-263-2L Pin Configuration
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
30
V
VGS
Gate-Source Voltage
ID@TC=25℃
±20
V
1
140
A
1
A
Continuous Drain Current, VGS @ 10V
ID@TC=100℃
Continuous Drain Current, VGS @ 10V
72
IDM
Pulsed Drain Current2
225
A
3
EAS
Single Pulse Avalanche Energy
145
mJ
IAS
Avalanche Current
53.8
A
3
86.8
W
3
Total Power Dissipation
2
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
PD@TC=25℃
PD@TA=25℃
www.winsok.tw
Total Power Dissipation
Page 1
Rev1.0.Jun.2019
WSK140N03
N-Ch MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON)
Static Drain-Source On-Resistance2
VGS(th)
Gate Threshold Voltage
Min.
Typ.
Max.
30
---
---
V
Reference to 25℃ , ID=1mA
---
0.098
---
V/℃
VGS=10V , ID=12A
---
---
4
mΩ
VGS=4.5V , ID=12A
---
---
6
mΩ
1
---
2.5
V
---
-6.57
---
mV/℃
VDS=24V , VGS=0V , TJ=25℃
---
---
1
VDS=24V , VGS=0V , TJ=55℃
---
---
2
---
±100
nA
S
VGS=0V , ID=250uA
VGS=VDS , ID =250uA
△VGS(th)
VGS(th) Temperature Coefficient
IDSS
Drain-Source Leakage Current
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
gfs
Forward Transconductance
VDS=5V , ID=30A
---
26.5
---
---
31.6
---
---
6.1
---
Qg
Total Gate Charge (10V)
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
---
13.8
---
Turn-On Delay Time
---
11.2
---
Td(on)
Unit
VDS=20V , VGS=4.5V , ID=12A
uA
nC
Rise Time
VDD=15V,VGS=10V,
---
49
---
Turn-Off Delay Time
RG=1.5Ω, ID=20A.
---
35
---
Fall Time
---
7.8
---
Ciss
Input Capacitance
---
3075
---
Coss
Output Capacitance
---
400
---
Crss
Reverse Transfer Capacitance
---
315
---
Min.
Typ.
Max.
Unit
---
---
110
A
---
---
225
A
---
---
1.2
V
Tr
Td(off)
Tf
VDS=15V , VGS=0V , f=1MHz
ns
pF
Diode Characteristics
Symbol
IS
ISM
VSD
Parameter
Conditions
1,6
Continuous Source Current
2,6
Pulsed Source Current
2
Diode Forward Voltage
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25℃
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper,t≦10sec.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=53.8A
4.The power dissipation is limited by 150℃ junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
www.winsok.tw
Page 2
Rev1.0.Jun.2019
WSK140N03
N-Ch MOSFET
Typical Characteristics
12
5.0
VGS=7V
8
4.5
VGS=5V
RDSON (mΩ)
ID Drain Current (A)
ID=12A
VGS=10V
10
VGS=4.5V
6
VGS=3V
4
4.0
2
0
3.5
0
0.25
0.5
VDS , Drain-to-Source Voltage (V)
0.75
2
Fig.1 Typical Output Characteristics
8
10
10
ID= 1 2 A
VGS Gate to Source Voltage (V)
10
8
6
TJ=150℃
TJ=25℃
4
2
0
0.2
0.4
0.6
0.8
1
8
6
4
2
0
0
VSD , Source-to-Drain Voltage (V)
20
40
60
QG , T o t a l G a t e C h a
Fig.3 Forward Characteristics of Reverse
80
Fig.4 Gate-Charge Characteristics
2.0
Normalized On Resistance
1.5
Normalized VGS(th)
6
VGS (V)
Fig.2 On-Resistance vs. G-S Voltage
12
IS Source Current(A)
4
1.5
1
1.0
0.5
0.5
0
-50
25
100
TJ ,Junction Temperature (℃ )
-50
175
Fig.5 Normalized VGS(th) vs. TJ
www.winsok.tw
25
100
175
TJ , Junction Temperature (℃)
Fig.6 Normalized RDSON vs. TJ
Page 3
Rev1.0.Jun.2019
WSK140N03
N-Ch MOSFET
10000
1000.00
F=1.0MHz
10us
Capacitance (pF)
Ciss
100.00
100us
10.00
10ms
100ms
DC
1000
ID (A)
Coss
Crss
1.00
100
0.10
TC=25℃
Single Pulse
0.01
10
1
5
9
13
17
VDS Drain to Source Voltage(V)
21
0.1
25
1
10
100
VDS (V)
Fig.7 Capacitance
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJC)
1
DUTY=0.5
0.3
0.1
0.1
0.05
PDM
TON
T
0.02
D = TON/T
0.01
0.01
0.00001
TJpeak = TC + PDM x RθJC
SINGLE PULSE
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
EAS=
VDS
90%
BVDSS
1
L x IAS2 x
2
BVDSS
BVDSS-VDD
VDD
IAS
10%
VGS
Td(on)
Tr
Ton
Td(off)
Tf
Toff
Fig.10 Switching Time Waveform
www.winsok.tw
VGS
Fig.11 Unclamped Inductive Switching Waveform
Page 4
Rev1.0.Jun.2019
Attention
1,AnyandallWinsokpowerproductsdescribedorcontainedhereindonothavespecificationsthatcanhandle
applicationsthatrequireextremelyhighlevelsofreliability,suchaslifeͲsupportsystems,aircraft'scontrolsystems,or
otherapplicationswhosefailurecanbereasonablyexpectedtoresultinseriousphysicaland/ormaterialdamage.
ConsultwithyourWinsokpowerrepresentativenearestyoubeforeusinganyWinsokpowerproductsdescribedor
containedhereininsuchapplications.
2,Winsokpowerassumesnoresponsibilityforequipmentfailuresthatresultfromusingproductsatvaluesthatexceed,
evenmomentarily,ratedvalues(suchasmaximumratings,operatingconditionranges,orotherparameters)listedin
productsspecificationsofanyandallWinsokpowerproductsdescribedorcontainedherein.
3,SpecificationsofanyandallWinsokpowerproductsdescribedorcontainedhereinstipulatetheperformance,
characteristics,andfunctionsofthedescribedproductsintheindependentstate,andarenotguaranteesofthe
performance,characteristics,andfunctionsofthedescribedproductsasmountedinthecustomer’sproductsor
equipment.Toverifysymptomsandstatesthatcannotbeevaluatedinanindependentdevice,thecustomershouldalways
evaluateandtestdevicesmountedinthecustomer’sproductsorequipment.
4,WinsokpowerSemiconductorCO.,LTD.strivestosupplyhighͲqualityhighͲreliabilityproducts.However,anyandall
semiconductorproductsfailwithsomeprobability.Itispossiblethattheseprobabilisticfailurescouldgiverisetoaccidents
oreventsthatcouldendangerhumanlivesthatcouldgiverisetosmokeorfire,orthatcouldcausedamagetoother
property.Whendesigningequipment,adoptsafetymeasuressothatthesekindsofaccidentsoreventscannotoccur.Such
measuresincludebutarenotlimitedtoprotectivecircuitsanderrorpreventioncircuitsforsafedesign,redundantdesign,
andstructuraldesign.
5,IntheeventthatanyorallWinsokpowerproducts(includingtechnicaldata,services)describedorcontainedhereinare
controlledunderanyofapplicablelocalexportcontrollawsandregulations,suchproductsmustnotbeexportedwithout
obtainingtheexportlicensefromtheauthoritiesconcernedinaccordancewiththeabovelaw.
6,Nopartofthispublicationmaybereproducedortransmittedinanyformorbyanymeans,electronicormechanical,
includingphotocopyingandrecording,oranyinformationstorageorretrievalsystem,orotherwise,withouttheprior
writtenpermissionofWinsokpowerSemiconductorCO.,LTD.
7,Information(includingcircuitdiagramsandcircuitparameters)hereinisforexampleonly;itisnotguaranteedfor
volumeproduction. Winsokpowerbelievesinformationhereinisaccurateandreliable,butnoguaranteesaremadeor
impliedregardingitsuseoranyinfringementsofintellectualpropertyrightsorotherrightsofthirdparties.
8,Anyandallinformationdescribedorcontainedhereinaresubjecttochangewithoutnoticeduetoproduct/technology
improvement,etc.Whendesigningequipment,refertothe"DeliverySpecification"fortheWinsokpowerproductthatyou
Intendtouse.
9,thiscatalogprovidesinformationasofSep.2014. Specificationsandinformationhereinaresubjecttochangewithout
notice.