VRRM
CH3D10065G
Silicon Carbide Schottky Diode
Features
=
650
V
IF ( TC≤135℃) =
14.5
A
25
nC
QC
=
Package
Zero Reverse Recovery Current
Zero Forward Recovery Voltage
Positive Temperature Coefficient on VF
Temperature-independent Switching
175°C Operating Junction Temperature
Benefits
TO-263-2
Replace Bipolar with Unipolar Device
Reduction of Heat Sink Size
Parallel Devices Without Thermal Runaway
Essentially No Switching Losses
Applications
Switch Mode Power Supplies
Power Factor Correction
Motor drive, PV Inverter, Wind Power Station
Part Number
Package
Marking
CH3D10065G
TO-263-2
CH3D10065G
Maximum Ratings
Symbol
Parameter
Value
Unit
Test Conditions
VRRM
Repetitive Peak Reverse Voltage
650
V
TC = 25℃
VRSM
Surge Peak Reverse Voltage
650
V
TC = 25℃
DC Blocking Voltage
650
V
TC = 25℃
Forward Current
29
14.5
10
A
VR
IF
TC ≤ 25℃
TC ≤ 135℃
TC ≤ 153℃
IFSM
Non-Repetitive Forward Surge Current
85
A
TC = 25℃, tp = 8.3ms, Half Sine Wave
Ptot
Power Dissipation
129
W
TC = 25℃
TC
Maximum Case Temperature
153
℃
-55 to
175
℃
TJ, TSTG
Operating Junction and Storage Temperature
WS3A010065J
Version 2.0
1
Note
Fig.3
Electrical Characteristics
Symbol
Parameter
VF
Forward Voltage
IR
Reverse Current
Typ.
Max.
1.4
1.65
1.75
2.3
1
20
5
100
Unit
V
µA
575
C
Total Capacitance
57
Total Capacitive Charge
25
IF = 10A, TJ = 25℃
Note
Fig.1
IF = 10A, TJ = 175℃
VR = 650V, TJ = 25℃
VR = 650V, TJ = 175℃
Fig.2
VR = 0V, TJ = 25℃, f = 1MHz
/
pF
VR = 200V, TJ = 25℃, f = 1MHz
Fig.5
VR = 400V, TJ = 25℃, f = 1MHz
46
QC
Test Conditions
/
nC
VR = 650V, IF = 10A
di/dt = 200A/µs, TJ = 25℃
Fig.4
Thermal Characteristics
Symbol
Parameter
Typ.
Unit
Note
1.16
℃/W
Fig.6
RθJC
Thermal Resistance from Junction to Case
RθJA
Thermal Resistance from Junction to Ambient
80
℃/W
Tsold
Soldering Temperature
260
℃
IF (A)
IR (μA)
Typical Performance
VF (V)
VR (V)
Figure 1. Forward Characteristics
WS3A010065J
Version 2.0
Figure 2. Reverse Characteristics
2
QC (nC)
PTot (W)
Typical Performance
VR (V)
TC (℃)
Figure 4. Total Capacitive Charge vs. Reverse Voltage
C (pF)
Thermal Resistance(℃/W)
Figure 3. Power Derating
VR (V)
T(sec)
Figure 5. Total Capacitance vs. Reverse Voltage
WS3A010065J
Version 2.0
Figure 6. Transient Thermal Impedance
3
Package Dimensions
Package TO-263-2
Symbol
Min. (mm)
Typ. (mm)
Max. (mm)
A
9.9
10.1
10.3
B
9.90
10.1
10.3
C
8.50
8.7
8.90
D
4.85
5.05
5.25
E
3.00
3.2
3.40
F
1.05
1.25
1.45
G
0.60
0.8
1.00
H
2.34
2.54
2.74
I
4.40
4.6
4.80
J
2.40
2.6
2.80
K
2.55
1.75
2.95
Simplified Diode Model
Equivalent IV Curve for Model
Mathematical Equation
VF=Vt + IF×Rdiff
IF=f(VF)
Vt = -0.0011×Tj + 0.97 [V]
Rdiff = 1×10-6×Tj2 + 9×10-5×Tj + 0.043 [Ω]
Note:
Tj = Diode Junction Temperature In Degrees Celsius,
valid from 25°C to 175°C
IF= Forward Current
Less than 20A
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