RE100M0000S300

PART CODE: RE100M0000S300 SPECIFICATION SHEET SPECIFICATION SHEET NO. N0217-RE100M0000S300 DATE Feb. 17, 2021 REVISION A0 DESCRIPITION SMD Oscillator, 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads, COM32 series 100.0000MHz, 3.3V, +/-50ppm, Symmetry 45/55, Operating Temp. Range -40°C ~+85°C, Reflow Profile Condition 260 °C Max. HCMOS//15pF, Tristate via Pad 1, Supply Current 30mA Max. Tape/Reel, RoHS/RoHS III compliant CUSTOMER CUSTOMER PART NUMBER CROSS REF. PART NUMBER ORIGINAL PART NUMBER TGS COM3231BGI03 TLF-100M000 PART CODE RE100M0000S300 VENDOR APPROVE Issued/Checked/Approved DATE: Feb. 17, 2021 CUSTOMER APPROVE DATE: NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE100M0000S300 MHZ SMDSMD OSCILLATOR CRYSTAL 3225 2520 TYPE 4 PADS MAIN FEATURE • SMD Package, Seam Sealed, 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads • Low noise and Low current • Industry standard • Reflow Profile Condition 260 °C Max. • Cross more competitors part • RoHS/RoHS III compliant APPLICATION • PDA, PND, DSC, Smart phone, WiLAN, Bluetooth and more • Communication Electronics RFQ PART CODE GUIDE Request For Quotation RE 100M0000 S 300 1 2 3 4 1) RE: Part family Code for SMD Oscillator 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads, COM32 series 2) 100M0000: Frequency range code for 100.00000MHz 3) S: SMD type, Package Tape/Reel, 3000pcs/Reel 4) 300: Specification code for original part No.: TGS COM3231BGI03 TLF-100M000 MORE FREQUENCY RANGE AVAILABLE (MHz) 4.91520 12.000 12.2880 16.000 24.000 24.576 37.125 40.00 48.000 50.000 100.00 125.00 NextGen Components, Inc. sales@NextGenComponent.com 25.000 26.000 27.000 32.000 www.NextGenComponent.com PART CODE: RE100M0000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS DIMENSION (Unit: mm, Tol. +/-0.15mm) Image for reference Marking 1 Line 1: Company Code + Supply Voltage Line 2: Freq. Range + QC Code (A~Z) COM32 Marking 2 Line 1: Frequency Range Pin Function #1 Enable (Tri-State) #2 Ground #3 Output #4 VDD Recommend Pad Layout NextGen Components, Inc. Circuit Principle sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE100M0000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS ELECTRICAL PARAMETERS Parameter Part No. Symbol Units Value Min. Original Manufacturer Holder Type Typical Condition Max. TGS TGS Crystals COM32 SMD Oscillator, 3225 Type, L3.2*W2.5*H1.2mm, 4 Pads Supply Voltage 3 Enable/Disable Function 1 Overall Freq. Tolerance B ppm -50 +50 Operating Temp. Range G °C -40 +85 °C -55 +125 % 45 55 V OH V 90% V OL V Load pF Storage Temp. Range Symmetry Output I Output Waveform V 3.3 +/-10% Tri-State @ Control via pin 1 @25°C High (Logic “1”) 10% Low (Logic “0”) 15 03 HCMOS @OutputLoad 15pF Startup Time ms 10 Supply Current mA 30 Rise/ Fall time ns 10 Phase Jitter ps 1.0 @12KHz~20MHz ppm/year ±3 @1st year Aging Others Package T Tape/Reel RoHS Status LF RoHS III compliant Add Value N/A Internal Control Code * N/A Frequency Range -100M00 100.0000MHz Note: 1) Original Part Number: TGS COM3231BGI03 TLF-100M00 2) * Internal Control Code- 2 letter or digits; Blank: N/A NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE100M0000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS RELIABILITY Test Items Test Method And Conditions Reference Documents High Temperature High Humidity Storage Temperature: 85℃±3℃ Relative Humidity:85%RH Time: 96 Hours JIS C5023 High Temperature Storage Temperature: 125℃±3℃ Time: 96 Hours. MIL-STD-883E Method 1005.8 Low Temperature Storage Temperature: -40℃±3℃ Time: 96 Hours. MIL-STD-883E Method 1013 Thermal Shock Temperature 1: -55℃±5℃ Temperature 2: 85℃±5 ℃ Temperature change between T1 and T2 5 min 10cycles maintain T1 and T2 for 30 minutes each cycle MIL-STD-202F Method 107 Condition A Resistance to Solder Heat Solder Temperature: 260℃±5℃ Time: 10±1 Seconds MIL-STD-202F Method 210E Solderability The solder pot temperature is 245±5℃ , dwell time 5±0.5sec J-STD-002B Drop Test 3 Times Free Fall from 50cm height table to 3cm thickness hard wood board J-STD-002B Mechanical Shock Half sine wave,1000 G 3 Times for all 3 directions(X,Y Z) MIL STD 202F Method 213B Vibration Frequency Range: 10Hz～55Hz Amplitude: 0.75mm 2 Hours in each direction, total 6 Hours MIL-STD-883E Method 2007.3 Leakage Test Take measurements with a helium Leakage detector Leakage Rate≤1×10ˉ³Pa cm³/s MIL-STD-883E NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE100M0000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS SUGGESTED REFLOW PROFILE (For Reference Only) Total time: 200 Sec. Max. Solder melting point: 220℃ Profile Feature Pb-Free Assembly Average Ramp-up Rate (Ts Max to Tp) 3℃/second Max Preheat Temperature Min (Ts Min.) 125℃ Temperature Max (Ts Max.) 200℃ Time (ts Min. to ts Max.) 60～180 seconds Temperature (TL) 217℃ Time (tL) 60～150 seconds Time maintained above Peak/Classification Temperature (Tp) 260 ℃ Time within 5℃ of actual Peak Temperature (tp) 20～40 seconds Ramp-down rate 6 ℃ /Second Max. Time 25 ℃ to Peak Temperature 8 minutes Max. Suggest reflow times 3 Times Max. NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com PART CODE: RE100M0000S300 MHZ SMD OSCILLATOR 3225 TYPE 4 PADS TAPE/REEL (Unit: mm) All Devices are packed in accordance with EIA standard RS-481-2 and specifications, 3000pcs/Reel DISCLAIMER NextGen Components, Inc. reserves the right to make changes to the product(s) and or information contained herein without notice. No liability is assumed as a result of their use or application. No rights under any patent accompany the sale of any such product(s) or information NextGen Components, Inc. sales@NextGenComponent.com www.NextGenComponent.com