HC3-3R3-R

Technical Data 4122 Effective February 2017 Supersedes October 2015 HC3 High current power inductors Applications • Distributed power systems DC-DC converters • General-purpose low voltage supplies • Computer systems • Servers • Point of Load (POL) converters • Industrial Equipment Environmental data • Storage temperature range (component): -40°C to +125°C • Operating temperature range: -40°C to +125°C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020D compliant. Product description • Compact footprint • Designed for high density, high current/low voltage applications • Foil technology that adds higher reliability factor over the traditional magnet wire used for higher frequency circuit designs • Inductance range from 0.50uH to 6.52uH • Current range from 30 to 120 Amps • Ferrite core material Packaging • Supplied in bulk packaging, 24 parts per tray Pb HC3 High current power inductors  Technical Data 4122 Effective February 2017 Product specifications Part number5 OCL1 (μH) ±20% lrms2 (amps) lsat3 (amps) DCR (mΩ) maximum @ 20°C Volt-μsec4 (V-μs) ref. HC3-R50-R 0.50 78.00 120 0.42 17.33 HC3-1R0-R 1.05 78.00 78 0.42 17.33 HC3-2R2-R 2.05 55.50 60 0.70 26.01 HC3-3R3-R 3.63 42.45 46 1.20 34.65 HC3-4R7-R 4.98 33.80 38 2.17 43.30 HC3-5R6-R 5.68 33.80 34.5 2.17 43.30 HC3-6R0-R 6.52 33.80 30.0 2.17 43.30 3. Peak current for approximately 30% rolloff (@20°C). 4. Applied Volt-Time product (V-μs) across the inductor. This value represents the applied V-μs at 300kHz necessary to generate a core loss equal to 10% of the total losses for a 40°C temperature rise. 5. Part number definition - HC3-xxx-R: HC3 = Product code and size -xxx = Inductance value R = Decimal point (if no “R” is present, last character equals number of zeros ) -R Suffix = RoHS compliant 1. OCL (Open Circuit Inductance) Test parameters: 300kHz, .25Vrms, 0.0ADC & Isat. 2. DC current for approximately ∆T of 40°C without core loss De-rating is necessary for AC currents. PCB layout, trace thickness and width, air flow and proximity of other heat generating components will affect temperature rise. It is recommended that the temperature of the part not exceed 125°C under worst case conditions verified in the end application. Dimensions–mm TOP VIEW RECOMMENDED PCB PAD LAYOUT FRONT VIEW SCHEMATIC 14.5 typ 1 30.0 max 22.0 HC3-xxx wwllyy R 4.0 typ HT max 2 5.50 19.0 5.50 3.0 typ 25.3 max Part marking: HC3-xxx (-xxx= inductance value, R= decimal point, if no R is present then last character equals number of zeros) wwllyy= date code, R= Revision level 2 www.eaton.com/electronics Part number Height max HC3-R50-R 18.0 HC3-1R0-R 17.5 HC3-2R2-R 17.5 HC3-3R3-R 17.5 HC3-4R7-R 17.5 HC3-5R6-R 17.5 HC3-6R0-R 17.5 HC3 High current power inductors Technical Data 4122 Effective February 2017  Inductance characteristics OCL vs Isat 100 90 80 % of OCL 70 60 50 40 30 20 10 0 0 10 20 30 40 50 60 70 80 90 100 110 120 130 % of Isat Core loss Irms DERATING W ITH CO RE LOSS for HC3 % Applied Volt-u Seconds 10 30 50 70 90 110 130 150 170 190 %of Irms specified from zero ripple application 30 40 50 60 70 80 100kHz 200kHz 300kHz 400kHz 500kHz 90 100 www.eaton.com/electronics 3 HC3 High current power inductors  Technical Data 4122 Effective February 2017 Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3