WCM4532F2SF-900T20

P1 TAI-TECH Wire Wound Type Common Mode Filter WCM4532F2SF-900T20 ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 15/07/30 新發行 楊祥忠 林志鴻 孔妍暄 備 註 www.tai-tech.com.tw P2 TAI-TECH Wire Wound Type Common Mode Filter WCM4532F2SF-900T20 1. Features 1. High common mode impedance at high frequency cause excellent noise suppression performance. 2. WCM4532F2SF series realizes small size and low profile. 4.5x3.2x2.8 mm. 3. 100% Lead(Pb) & Halogen-Free and RoHS compliant. Halogen Pb Halogen-free Pb-free 2. Dimension Recommended PC Board Pattern A C 1 2 G2 B H 3 4 G1 D L D PC board should be designed so that products can prevent damage from mechanical stress when warping the board. Products shall be positioned in the sideway direction against the mechanical stress to prevent failure. D D Series A(mm) B(mm) C(mm) D1(mm) D2(mm) L(mm) H(mm) G1(mm) G2(mm) 4532F2SF 4.5±0.2 3.2±0.2 2.8±0.2 1.0±0.1 1.2±0.1 4.8 3.8 2.5 0.7 Units: mm 3. Part Numbering WCM 4532 A B F 2 S F C D E F - 900 T 20 G H I A: Series B: Dimension C: Material Ferrite Core D: Number of Lines 2=2 lines E: Type S=Shielded , N=Unshielded F: Lead free G: Impedance 900=90Ω H: Packaging I: Rated Current T=Taping and Reel 20=2000mA 4. Specification TAI-TECH Part Number WCM4532F2SF-900T20 DC Common mode Impedance Test Frequency Resistance (MHz) (Ω) (Ω) max. 90±25% 100 0.05 Rated Current (mA) max. 2000 www.tai-tech.com.tw Withstand IR Rated Volt. (Vdc) max. Volt. (Vdc) (Ω) min. max. 50 125 10M P3 TAI-TECH WCM4532F2SF-900 1000 IMPEDANCE(Ohm) Common Mode 100 Normal Mode 10 1 0.1 1 10 100 1000 10000 FREQUENCY(MHz) 5.Schematic Diagram 6. Materials No. Description Specification a. Upper Plate Ferrite b. Core Ferrite Core c Termination Tin( Pb Free) d Wire Enameled Copper Wire 7. Reliability and Test Condition Item Performance Test Condition Electrical Characteristics Test Agilent-4291A+ Agilent -16197A Z(common mode) DCR Refer to standard electrical characteristics list. Agilent-4338B Agilent4339 I.R. Operating Temperature -40℃~+125℃(Including self - temperature rise) Storage Temperature(on board) Temperature Rise Test Rated Current < 1A ∆T 20℃Max Rated Current ≧ 1A ∆T 40℃Max www.tai-tech.com.tw 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer P4 TAI-TECH Item Performance Test Condition Mechanical Performance Test Preheat: 150℃,60sec.。 Solder: Sn99.5%-Cu0. 5%。 Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Solderability Test More than 95% of terminal electrode should be covered with solder. Dip time: 4±1sec。 Depth: completely cover the termination Appearance：No damage. Impedance：within±15% of initial value RDC：within ±15% of initial value and shall not exceed the specification value Temperature (°C) Time (s) Temperature ramp/immersion and emersion rate Number of heat cycles 260 ±5 (solder temp) 10 ±1 25mm/s ±6 mm/s 1 Solder Heat Resistance Depth: complet ely cover the termination Preconditioning:Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a force (>0805:1kg ,