RB520S-40

Plastic-Encap sulate Diodes Schottky Barrier Diode PINNING DESCRIPTION PIN FEATURES z Small surface mounting type z Low IR z High reliability 1 Cathode 2 Anode 1       D1         2 Top View Marking Code: "D1" Simplified outline SOD-523 and symbol MARKING: D1 The marking bar indicates the cathode Solid dot = Green molding compound device,if none, the normal device. Maximum Ratings and Electrical Characteristics, Single Diode @TA=25℃ Symbol Limit Unit DC reverse voltage VR 40 V Mean rectifying current IO 0.2 A IFSM 1 A Power Dissipation PD 150 mW Thermal resistance from junction to ambient RθJA Parameter Non-repetitive peak forward surge current@t=8.3ms 667 Junction temperature TJ 125 Storage temperature TSTG -55~+150 ℃/W ℃ Electrical Ratings @TA=25℃ Parameter Symbol Forward voltage VF Reverse current IR Min Typ Max 0.304 0.446 0.605 2.837 0.39 0.55 1 10 Unit V μA Conditions IF=10mA IF=100mA VR=10V VR=40V 1 of 3 Copyright © All right reserved： Heyuan China Base Electronics Technology Co., Ltd. C REVERSE CURRENT IR C o Ta =2 5 1 0.1 0.01 0.0 0.2 0.4 FORWARD VOLTAGE VF Characteristics o Ta=100 C 10 o Ta=25 C 1 0.1 0.8 0 (V) 10 20 REVERSE VOLTAGE 30 VR 40 (V) Power Derating Curve 200 150 PD (mW) Ta=25℃ f=1MHz POWER DISSIPATION CAPACITANCE BETWEEN TERMINALS CT (pF) 0.6 Capacitance Characteristics 100 Reverse 100 o Ta =1 00 (mA) 10 IF FORWARD CURRENT Characteristics (uA) Forward 100 10 1 0 5 10 REVERSE VOLTAGE 15 VR 20 100 50 0 0 50 100 AMBIENT TEMPERATURE (V) 2 of 3 Copyright © All right reserved： Heyuan China Base Electronics Technology Co., Ltd. 150 Ta (℃ )     PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-523 3 of 3 Copyright © All right reserved： Heyuan China Base Electronics Technology Co., Ltd.