PRELIMINARY SPECIFICATIONS
GP
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSX531S / 22.1184MHz
Sample Order No:
Date:
X1H022118FK1H-V
CRYSTAL
2012/06/05
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN (R.O.C.)
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路 39 號
No.39, Huadong Rd., Daliao Dist.,Dafa
Industrial Park., Kaohsiung City 831,
Taiwan (R.O.C.)
TEL: 886-7-787-1555~6
FAX: 886-7-787-1557
Tittle HSX531S
Date
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6, 200740-1
FAX: (032)200742
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SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-7309272 / 7309262
FAX: 0755-7309755
TAIWAN FACTORY
THAILAND FACTORY
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HSX531S
SPECIFICATION
INDEX
ITEM
PAGE
1. QUARTZ CRYSTAL UNIT SPECIFICATION．．．．．．．．．．．．．
3
2. MARKING & DIMENSIONS．．．．．．．．．．．．．．．．．．．．
4
3. INSIDE STRUCTURE．．．．．．．．．．．．．．．．．．．．．．．
5
4. EMBOSS CARRIER TAPE&REEL．．．．．．．．．．．．．．．．．
6
a. DIMENSIONS OF CARRIER TAPE．．．．．．．．．．．．．．．．
6
b. DIMENSIONS OF REEL．．．．．．．．．．．．．．．．．．．．
6
c. STORAGE CONDITION．．．．．．．．．．．．．．．．．．．．．
7
d. STANDARD PACKING QUANTITY．．．．．．．．．．．．．．．．
7
e. MATERIAL OF TAPE．．．．．．．．．．．．．．．．．．．．．．
7
f. LABEL CONTENTS．．．．．．．．．．．．．．．．．．．．．．．
7
g. TAPING DIMENSION．．．．．．．．．．．．．．．．．．．．．．．
8
h. JOINT OF TAPE．．．．．．．．．．．．．．．．．．．．．．．．
8
i. RELEASE STRENGHT OF COVER TAPE．．．．．．．．．．．．．
8
j. PACKAGE．．．．．．．．．．．．．．．．．．．．．．．．．．
9
5. MECHANICAL PERFORMANCE．．．．．．．．．．．．．．．．．
10
6. ENVIRONMENTAL PERFORMANCE．．．．．．．．．．．．．．．
10
7. SUPPLEMENT ．．．．．．．．．．．．．．．．．．．．．．．．
11-12
8. FLOW CHART．．．．．．．．．．．．．．．．．．．．．．．．．
13
9. Environmental Workload Chemical Substance Components List．
14
Tittle HSX531S
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1. QUARTZ CRYSTAL UNIT SPECIFICATION
1. Frequency:
22.118400MHz
2. Holder type :
HSX531S
3. Frequency tolerance:
+/-30ppm at 25deg.C +/-3deg.C
4. Equivalent resistance:
50 ohms Max. / SERIES
5. Storage temperature range:
-40deg.C To +85deg.C
6. Operable temperature range:
-40deg.C To +85deg.C
7. Temperature drift:
+/-30 ppm
8. Loading capacitance (CL) :
20.0 pF
9. Drive level:
10uW
10. Shunt Capacitance:
7.0 pF Max
11. Insulation resistance :
More than 500M ohms at DC 100V
12. Mode of oscillation:
Fundamental
13. Circuit:
Measured in HP/E5100A,S&A 250B
14. Shocking :
Dropping from 50 cm height 3 times on firm wood
Variation :
-40deg.C To +85deg.C
(300uW Max)
Frequency less than +/-5 ppm
Resistance less than +/- 15 ﹪or 2ohms max.
15. Aging:
Less than +/- 5 ppm/Year
16. Holder
HSX531S Seam type
17.Dimensions and marking
Refer to page.4
18 Emboss carrier tape & reel
Refer to page.6 and page.7
19. Note:
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2. HSX531S MARKING & DIMENSIONS
Chamfer index mark depends on the ceramic base supplier.
*Marking should be printed as following:
Nominal Frequency, Logo, Manufactured year & month
*Nominal frequency = 3 number after decimal point MAX.
( ex. 12.000 MHz Æ 12.000 )
*Manufacturing Lot No.
(Year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1)
(Month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2)
Marking : Laser marking
(Table-1)
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009
Year
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Code
0
1
2
3
4
5
6
7
8
9
(Table-2)
Jan. Feb. Mar. Apr. May. Jun. Jul. Aug. Sep. Oct. Nov. Dec.
A
B
C
D
E
F
G
H
J
K
L
M
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3. INSIDE STRUCTURE
※Reference drawing
(1) Base
Alumina Ceramic (Al2O3)
Metallized Pad:
Ni Plating
Au Plating
The use prohibition chemistry
substance of Table 1 of DHE-0204-1
(HE-QA-24) is not included in this
item.
(2) Cap
Fe-Ni
(3) Crystal Enclosure Seal
Seal Seam
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) Adhesive
Silver Conductive Silicon Resin
(6) PAD
Alumina Ceramic (Ni. Au)
(7) Electrode
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4. HSX531S EMBOSS CARRIER TAPE & REEL
a.) Dimensions of Carrier Tape
b.) Dimensions of Reel
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(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
12.8+/-0.3
Outer Width
W2
Out Line diameter
B
15.5+/-1.0
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
q
C
120deg
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Center
Core slit
Width
Position
Spindle diameter
Key Ditch
Width
c.) Storage condition
Temperature: +40deg.C Max.
Relative Humidity: 80% Max.
d.) Standard packing quantity
1,000PCS / REEL
e.) Material of the tape
Tape
Carrier tape
Top tape
Material
A – PET
Polyester
f.) Label contents
Sticks label for every reel.
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g.) Taping dimension
Cover-tape
Leader
Carrier-tape
Cover-tape
Terminal
Carrier-tape
Terminal
The length of cover-tape in the leader is more than 400 mm
including empty embossed area.
After all products were packaged, must remain more than
twenty pieces or 400 mm empty area, which should be sealed
by cover-tape.
The tip of cover-tape shall be fixed temporary by paper tape and
roll around the core of reel one round.
The empty embossed area which are sealed by top cover-tape
must remain more the 40 mm.
Components
Leader
Emptv compartments
Emptv compartments
Top cover-tape
Embossed Carrier-tape
h.) Joint of tape
The carrier-tape and top cover-tape should not be jointed.
i.) Release strength of cover tape
It has to between 0.1N to 0.7N under following condition.
Pulling direction 165° to 180°
Speed
300mm/min.
Otherwise unless specified.
165°~ 180°
Pulling direction
Other standards shall be based on JIS C 0806-1990.
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j.) Package
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5. Mechanical Performance
Test Methods
1
Natural Drop
2
Vibration
3
Sealing Tightness
4
Solderability
Drop 3 times from the height of 50cm onto min. 30mm thickness
hard wooden board
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X,Y
and Z 3 axes, Duration of 2 hours to each axis.
Leak Rate 1.0x10-8 Pa-m3/sec. Max. measured by Helium leak
detector..
After applying ROSIN Flux, dipping in solder bath at 245℃+/-5℃
for 3+/-0.5 sec.
6.
Environment Performance
Item
1
2
3
4
Humidity
Storage in Low
Temperature
Storage in High
Temperature
Temperature
cycles
A
B
A
--B
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours
Back to room temperature first, then in 1~2 hours, the
component shall be checked.
-40℃+/-2℃, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
+85℃+/-2℃, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
-40℃+/-2℃(30min)↔+85℃+/-2℃(30min) 25 cycles
Back to the room temperature first, then in 1~2 hours, the
component shall be checked.
A
A
A
A
Specifications
Frequency variation shall be within +/-5ppm and equivalent resistance shall
be within the specification after the test
More than 90% of lead shall be covered by new solder.
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Specifications
Code
Test Methods
Specifications code
Date
Specifications
Code
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7.
Supplement
7.1.Soldering
7.2.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
7.3.Land pattern layout(Example)
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7.4.Solder iron (Example)
Bit temp.:350℃max.,Time:3sec max. ,Each terminal solder a 1 time max.
7.5.Mounting
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be
Sure of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering process.
7.6.Cleaning
Cleaning liquid which corrodes Nickel shall not be used
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
7.7.Storage
Please keep away from high temperature and high humidity ,which may cause put
Solderbility. No direct Sunlight, No dew as well.
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8. Flow Chard
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9. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
H(D)SX531S
PERCENTAGE
40.4(mg)
ppm
SILICON(Si)
0.15756
63.65
GOLD(Au)
0.15756
63.65
COBALT AND ITS COMPOUND(Co)
2.56944
1038.05
MOLYBDENUM AND ITS COMPOUND(Mo)
0.12928
52.23
SILVER(Ag)
0.71104
287.26
COPPER(Cu)
0.10100
40.80
CHROMIUM AND ITS COMPOUND(Cr)
0.06868
27.75
11.11000
4488.44
MANGANESE AND ITS COMPOUND(Mn)
0.06464
26.11
WOLFRAM AND ITS COMPOUND(W)
0.15352
62.02
NICKEL AND ITS COMPOUND(Ni)
6.13676
2479.25
IRON(Fe)
9.45764
3820.89
Chemical Substance Components
ALUMINIUM(Al)
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REV.
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REASON
No.
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2012/06/05
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CONTENTS
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