SPECIFICATIONS FOR APPROVAL
GP
Customer Part No.:
HELE. Part No:
Application For:
Products:
Accepted Model:
Type & Freq.: HSX531S / 22.1184MHz
Sample Order No:
X1H022118DK1H
CRYSTAL
Date:
EOS-F10150-1
2015/01/15
Approved By :
HARMONY ELECTRONICS CORP.
HARMONY ELECTRONICS (THAILAND) CO., LTD.
HARMONY ELECTRONICS (SHENZHEN) CORP., LTD.
TAIPEI OFFICE:
公司:(114)
台北市內湖區堤頂大道 2 段 409 號 2 樓
2F., NO.409, SEC.2, TIDING BLVD.,
NEIHU DISTRICT, TAIPEI CITY 114,
TAIWAN
TEL:886-2-26588883
FAX:886-2-26588683
TAIWAN FACTORY:
工廠:(831)
高雄市大寮區大發工業區華東路 39 號
No.39, HWA DONG RD., DALLIAO
DIST.,DAFA INDUSTRIAL PARK.,
KAOHSIUNG CITY 831, TAIWAN
TEL: (07)787-1555-6
FAX: (07)787-1557
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2015/01/15 F. S. TSAI
Check
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Y. W. LEE
U. F. CHEN
HARMONY
THAILAND FACTORY:
66MOO 5, KAONGU-BEOKPRAI RD.,
T.BEOKPRAI, A. BANPONG,
RAJCHABUREE PROVINCE 70110,
THAILAND
TEL: (032)221994-6,
200740-1
FAX: (032)200742
SHENZHEN FACTORY:
深圳市福永鎮塘尾村塘橋路聚源工業區
QIAO TANG RD., TANGWEI VILLAGE
FU YONG TOWN SHENZHEN CITY
CHINA
TEL: 0755-27309272 /
27309262
FAX: 0755-27309755
Country of origin TAIWAN FACTORY
THAILAND FACTORY
CHINA FACTORY
Rev.
Spec. No.
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HSX531S SPECIFICATION
INDEX
ITEM
PAGE
1. QUARTZ CRYSTAL UNIT SPECIFICATION.............
3
2. MARKING & DIMENSIONS....................
4
3. INSIDE STRUCTURE.......................
5
4. EMBOSS CARRIER TAPE&REEL.................
6
a. DIMENSIONS OF CARRIER TAPE................
6
b. DIMENSIONS OF REEL....................
6
c. STORAGE CONDITION.....................
7
d. STANDARD PACKING QUANTITY................
7
e. MATERIAL OF TAPE......................
7
f. LABEL CONTENTS.......................
7
g. TAPING DIMENSION.......................
8
h. JOINT OF TAPE........................
8
i. RELEASE STRENGHT OF COVER TAPE.............
8
j. PACKAGE..........................
9
5. MECHANICAL PERFORMANCE.................
10
6. ENVIRONMENTAL PERFORMANCE...............
10
7. SUPPLEMENT ........................
11-12
8. FLOW CHART.........................
13
9. Environmental Workload Chemical Substance Components List.....
14
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
Confirm
2015/01/15 F. S. TSAI
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U. F. CHEN
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2
1.QUARTZ CRYSTAL UNIT SPECIFICATION
1. Frequency:
22.118400MHz
2. Holder type :
HSX531S
3. Frequency tolerance:
+/-20ppm at 25deg.C +/-3deg.C
4. Equivalent resistance:
50 ohms Max. / SERIES
5. Storage temperature range:
-40deg.C To +85deg.C
6. Operable temperature range:
-10deg.C To +60deg.C
7. Temperature drift:
+/-50 ppm
8. Loading capacitance (CL) :
20.0 pF
9. Drive level:
10uW
10. Shunt Capacitance:
7.0 pF Max.
11. Insulation resistance :
More than 500M ohms at DC 100V
12. Mode of oscillation:
Fundamental
13. Circuit:
Measured in HP/E5100A,S&A 250B
14. Shocking :
Dropping from 75 cm height 3 times on firm wood
Variation :
-10deg.C To +60deg.C
(300uW Max.)
Frequency less than +/-5 ppm
Resistance less than +/- 15 ﹪or 2ohms max.
15. Aging:
Less than +/- 5 ppm/Year
16. Holder
HSX531S Seam type
17. Dimensions and marking
Refer to page.4
18. Emboss carrier tape & reel
Refer to page.6 and page.8
19. Moisture Sensitivity Level
Level 1
20. Note:
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
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ELECTRONICS
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3
2. HSX531S MARKING & DIMENSIONS
Chamfer index mark depends on the ceramic base supplier.
*Marking should be printed as following:
Nominal Frequency, Logo, Manufactured year & month
*Nominal frequency = 3 number after decimal point MAX.
( ex. 12.000 MHz 12.000 )
*Manufacturing Lot No.
(Year) ex. 2000 shall be marked as ‘ 0 ’ (As shown on the Table-1)
(Month) ex. June shall be marked as ‘ F ‘ (As shown on the Table-2)
Marking : Laser marking
(Table-1)
Year
2000 2001 2002 2003 2004 2005 2006 2007 2008 2009
2010 2011 2012 2013 2014 2015 2016 2017 2018 2019
Code
0
1
2
3
4
5
6
7
8
9
(Table-2)
Jan. Feb. Mar. Apr. May. Jun.
Jul. Aug. Sep. Oct. Nov. Dec.
A
B
C
D
E
F
G
H
J
K
L
M
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
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4
3. INSIDE STRUCTURE
PAD(6)
ELECTRODE(7)
PAD(6)
Cap(2)
CRYSTAL BLANK(4)
ADHESIVE(5)
Base(1)
※Reference drawing
(1) Base
Alumina Ceramic (Al2O3)
(6) Metallized Pad: W
Ni Plating
Au Plating
(2) Cap
Fe-Ni
(3) Crystal Enclosure Seal
Seal Seam
(4) Crystal Blank
Rectangular At-Cut Quartz Crystal Blank
(5) Adhesive
Silver Conductive Silicon Resin
(7) Electrode
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
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The use prohibition chemistry
substance of Table 1 of DHE-0204-1
(HE-QA-24) is not included in this
item.
Country of origin TAIWAN FACTORY
THAILAND FACTORY
CHINA FACTORY
Spec. No.
Rev.
Page
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ELECTRONICS
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5
4. HSX531S EMBOSS CARRIER TAPE & REEL
a.) Dimensions of Carrier Tape
b.) Dimensions of Reel
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
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2015/01/15 F. S. TSAI
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X1H022118DK1H
ELECTRONICS
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6
(Table-2)
(UNIT: mm)
MARK
DIMENSIONS‧ANGLE
Diameter
A
ψ180+0/-3
Inner Width
W1
12.8+/-0.3
Outer Width
W2
15.5+/-1.0
Out Line diameter
B
ψ60.5+/-0.5
F1
3.0+0.5/-0
F2
4.0+0.5/-0
F3
5.0+0.5/-0
Q
120deg
C
ψ13.2+/-0.5
E
3.0+/-0.2
ITEM
FLANCE
HUB
Center
Core slit
Width
Position
Spindle diameter
Key Ditch
Width
c.) Storage condition
Temperature: +40deg.C Max.
Relative Humidity: 80% Max.
d.) Standard packing quantity
1,000PCS / REEL
e.) Material of the tape
Tape
Carrier tape
Top tape
Material
A – PET
Polyester
f.) Label contents
Sticks label for every reel.
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
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7
g.) Taping dimension
Cover-tape
Leader
Carrier-tape
Cover-tape
Terminal
Carrier-tape
Terminal
The length of cover-tape in the leader is more than 400 mm including
empty embossed area.
After all products were packaged, must remain more than twenty
pieces or 400 mm empty area, which should be sealed by cover-tape.
The tip of cover-tape shall be fixed temporary by paper tape and roll
around the core of reel one round.
The empty embossed area which are sealed by top cover-tape must
remain more the 40 mm.
Components
Leader
Emptv compartments
Emptv compartments
Top cover-tape
Embossed Carrier-tape
h.) Joint of tape
The carrier-tape and top cover-tape should not be jointed.
i.) Release strength of cover tape
It has to between 0.1N to 0.7N under following condition.
Pulling direction 165° to 180°
Speed
300mm/min.
Otherwise unless specified.
165°~ 180°
Pulling direction
Other standards shall be based on JIS C 0806-1990.
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
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2015/01/15 F. S. TSAI
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X1H022118DK1H
ELECTRONICS
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8
j.) Package
TYPE:
SPEC. No.:
Parts No.:
Lot No.:
Label
Up side(Produce)
Q.C
PASS
H10
FREQ.:
Q'TY:
MHz
PCS
HSF
HARMONY ELECTRONICS CORP.
Under side(Fixing Hole)
One reel quantity: [1000pcs]&[3000pcs]
1 Top and bottom with 2.3cm thickness
foam-rubber cushion for protection
2 Carton's Q'TY:1~15 pcs.
3 Carton Type=A,B ,C use 4 trigon pillar to fasten the Reel.
4 Need to add 3 pages dry agent in each outer box.
use 4 trigon pilla
OR
Green Product
ROHS Compliant
Carton Type
A
B
Reel
Gree
n Pr
oduc
ROHS
t
Co mp
lia
D
C
630/531/ 321/221
Produce Type 840/751 421
211/111
OTHER
15
15
15
1~7
200
200
200
195
200
200
200
195
230/260
230
230
150
nt
1.Every Carton with 3 desiccant.
2.Top and bottom with 2.3cm thickness
foam-rubber cushion for protection
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
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ELECTRONICS
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9
5. Mechanical Performance
1
2
Specifications
Code
Item
Test Methods
Natural Drop
Drop 3 times from the height of 75cm onto min. 30mm thickness hard
wooden board
Refer to: JIS C 60068-2-6
Frequency 10-55Hz, Sine Wave full amplitude of 0.8mm to X,Y and Z
3 axes, Duration of 2 hours to each axis.
Refer to: MIL-HDBK-781A 6.5.2/ JIS C 60068-2-6
Leak Rate 1.0x10-8 Pa-m3/sec. Max. measured by Helium leak
detector..
After applying ROSIN Flux, dipping in solder bath at 245℃+/-5℃ for
3+/-0.5 sec.
Refer to: JIS C 60068-2-20
Vibration
3
Sealing Tightness
4
Solder ability
A
A
--B
6. Environment Performance
Item
1
2
3
4
Humidity
Storage in Low
Temperature
Storage in High
Temperature
Temperature cycles
Specifications code
A
B
Temperature 60℃+/-2℃,RH 90~95%, Duration of 240 hours
Back to room temperature first, then in 1~2 hours, the component shall
be checked.
Refer to: JIS C 60068-2-3
-40℃+/-2℃, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
Refer to: JIS C 60068-2-1
+85℃+/-2℃, Duration of 240 hours.
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
Refer to: JIS C 60068-2-2
-40℃+/-2℃(30min)↔+85℃+/-2℃(30min) 25 cycles
Back to the room temperature first, then in 1~2 hours, the component
shall be checked.
Refer to: JIS C 0025
QUARTZ CRYSTAL SPECIFICATION
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A
A
A
A
Specifications
Frequency variation shall be within +/-5ppm and equivalent resistance shall be within
the specification after the test
More than 90% of lead shall be covered by new solder.
Tittle HSX531S
Date
Specifications
Code
Test Methods
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ELECTRONICS
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10
7. Supplement
7.1.Soldering
7.2.Please stay with our proposed reflow condition and do then soldering 2 times max.
Available for Lead Free Soldering
Temperature
260 deg.C
220 deg.C
(3)
160~180deg.C
(2)
(1)
Time
(1) Preheat
160~180 deg.C 120sec.
(2) Primary heat 220
deg.C 60sec.
(3) Peak
260
deg.C 10sec. Max.
7.3.Land pattern layout(Example)
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
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11
7.4.Solder iron (Example)
Bit temp.:350℃ max., Time: 3sec max. , Each terminal solder a 1 time max.
7.5.Mounting
This component is designed for automatic insertion.
However, you are requested to do the trial with your insertion machine in order to be
Sure of proper operation and no damage of component.
Please pay attention to board warp which may damage the component and cause
Soldering process.
Avoid mounting and processing by Ultrasonic welding because this method has a possibility
of an excessive vibration spreading inside the crystal products and becoming the cause of
characteristic deterioration and not oscillating.
7.6.Cleaning
Cleaning liquid which corrodes Nickel shall not be used
It may cause the problem on the surface, color, marking etc.
Ultra-sonic cleaning is possible, however, you are requested to check on your board.
Because we only checked as single unit.
7.7.Storage
Please keep away from high temperature and high humidity, which may cause put Solderbility.
No direct Sunlight, No dew as well.
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
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ELECTRONICS
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12
8. Flow Chard
LID(外 殼 蓋 )
BLANK(晶 片 )
BLANK進 料 檢 查
LID進 料 檢 查
1
Incoming Inspection
of Lid
LID洗 淨
2
Lid Cleaning and Dry
BASE(基 座 )
5
6
7
8
9
10
11
12
13
14
15
16
17
Incoming Inspection
of Base
3
化學蝕刻
Etching
BASE(基 座 )洗 淨
4
Base Cleaning
頻率選別
Frequency Sorting
晶片排盤
Blank Filling
洗 淨 +微 蝕 刻
Blank Cleaning (Individule
cleaning+flash etching)
基礎蒸著
Base Plating
押入接著
Blank Mounting and
Bonding
接著硬化
Bonding Curing
接著外觀檢查
24
Bonding Inspection
氣 密 檢 查 I (Air)
Sealing Inspection I (Air Leak)
調整蒸著
Partial Adjustment (Ion Partial)
25
氣 密 檢 查 II (氦 氣 加 壓 )
Sealing Inspection II
(He Pressurization)
中 間 檢 查 ($)
Middle Check
26
氣 密 檢 查 II (He )
Sealing Inspection II (He Leak)
高真空烘烤
High Vacuum Anneal
27
LID點 焊
Temporary Positioning
18
熔 接 (se am)
19
強 勵 振 Overdrive
20
Re low
28
Sealing (seam)
21
老 化 Aging
22
印字排盤
23
BASE(基 座 )進 料 檢 查
Incoming Inspection
of Crystal blank
29
30
31
溫度特性抽檢
Temperature characteristics
adjustment inspection
最 終 檢 查 ($)
Final Inspection
TAPPING外 觀 檢 查
Appearance inspection after Taping
出 貨 檢 查 ($)
Outgoing Inspection
出貨捆包
Packing
Mark Loading
印 字 +外 觀 檢 查
出 貨 Shipment
Laser Marking and
Appearance Inspection
($): 特 殊 特 性
(For Critical prcoess had been monitored)
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
Date
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9. Environmental Workload Chemical Substance Components List
Environmental Workload Chemical Substance Components List
TYPE
H(D)SX531S
PERCENTAGE
40.4(mg)
ppm
SILICON(Si)
0.15756
63.65
GOLD(Au)
0.15756
63.65
COBALT AND ITS COMPOUND(Co)
2.56944
1038.05
MOLYBDENUM AND ITS COMPOUND(Mo)
0.12928
52.23
SILVER(Ag)
0.71104
287.26
COPPER(Cu)
0.10100
40.80
CHROMIUM AND ITS COMPOUND(Cr)
0.06868
27.75
11.11000
4488.44
MANGANESE AND ITS COMPOUND(Mn)
0.06464
26.11
WOLFRAM AND ITS COMPOUND(W)
0.15352
62.02
NICKEL AND ITS COMPOUND(Ni)
6.13676
2479.25
IRON(Fe)
9.45764
3820.89
Chemical Substance Components
ALUMINIUM(Al)
Tittle HSX531S
QUARTZ CRYSTAL SPECIFICATION
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14
REV.
No.
DATE
REASON
0
2015/01/15
New
CONTENTS
Tittle HSX531S
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