LC2632
28V, 2A, 500KHz Synchronous Step-Down DC/DC Converter
DESCRIPTION
FEATURES
The LC2632 is a fully integrated, synchronous
rectified step-down converter that provides wide
4.2V to 28V input voltage range and 2A
continuous load current capability. The LC2632
can operate at PFM mode to achieve high
efficiency and reduce power loss at light load. In
shutdown mode, the Max supply current is about
3μA.
The LC2632 protection function includes cycle-bycycle current limit, UVLO and thermal shutdown.
Besides, internal soft-start prevents inrush
current at fast power-on. This device uses slope
compensated current mode control which
provides fast load transient response. Internal
loop compensation function reduces the external
compensator components and simplifies the
design process.
The LC2632 requires a minimum number of
readily available standard external components
and is available in ESOP-8 (Exposed Pad) package
and provides good thermal conductance.
PIN OUT & MARKING
BST
SW
GND
APPLICATIONS
Distributed power system
Flat panel television and monitors
STB (set-top-box)
Networking, XDSL modem
ORDERING INFORMATION
PART No.
PACKAGE
Tape&Reel
NC
GW
LLDYW
VIN
Wide input voltage range: 4.2V to 28V
2A output current
0.8V reference voltage
Low RDS(ON) integrated power MOSFET
(180/110mΩ)
3μA(Max) shutdown current
Integrated internal compensation
High efficiency at light load
Internal 1ms soft-start
Cycle-by-cycle current limit
Over-temperature protection with auto recovery
Under voltage lockout(UVLO)
Hiccup short circuit protection
Available in ESOP8 exposed pad package
RoHS compliant
EN
LC2632CS8TR
ESOP-8
2500/Reel
NC
FB
ESOP8
GW: Product Code
LL: Lot No.
D: Fab code
YW: Date code
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LC2632
TYPICAL APPLICATION
CIN &COUT use ceramic capacitors application circuit
CIN &COUT use electrolytic capacitors application circuit
Note: If the input voltage is below 12V, R1 can be set to 0K and R2 can be removed.
Table1. recommended component values
VIN=24V, the recommended BOM list is shows as below.
VOUT
5V
3.3V
2.8V
2.5V
1.8
1.2V
5V
3.3V
2.8V
2.5V
1.8
1.2V
C1
C2
10uF/MLCC
10uF/MLCC
100uF/35V/ECL
0.1uF/MLCC
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L
R3
R4
3.3uH-6.8uH
2.2uH-4.7uH
2.2uH-4.7uH
2.2uH-4.7uH
2.2uH-4.7uH
2.2uH-3.3uH
3.3uH-6.8uH
2.2uH-4.7uH
2.2uH-4.7uH
2.2uH-4.7uH
2.2uH-3.3uH
2.2uH-3.3uH
68K
47K
30K
39K
15K
7.5K
68K
47K
30K
39K
15K
7.5K
13K
15K
12K
18K
12K
15K
13K
15K
12K
18K
12K
15K
2
C5
22uF/MLCC
220uF/6.3V/ECL
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LC2632
ABSOLUTE MAXIMUM RATING
Parameter
Value
Supply voltage VIN
Switch node voltage VSW
Boost voltage VBST
Enable voltage VEN
The others pins
Operating temperature range
Storage temperature range
Lead temperature (soldering, 10s)
-0.3V to 30V
-0.3V to (VIN+0.5V)
VSW-0.3V to VSW+5V
-0.3V to 12V
-0.3V to 6V
-40C to 85C
-65C to 150C
300C
Note: Exceed these limits to damage to the device. Exposure to absolute maximum rating conditions may affect
device reliability.
RECOMMENDED WORK CONDITIONS
Item
Min
Supply voltage VIN
Ambient temperature
Recommended
Max.
Unit
28
85
V
C
4.2
-40
ELECTRICAL CHARACTERISTICS
(VIN =12V, TA=25C, unless otherwise stated)
Parameter
Conditions
Input voltage range
UVLO threshold
UVLO hysteresis
Supply current in operation
Supply current in shutdown
Regulated feedback voltage
High-side switch on resistance
Low-side switch on resistance
High-side switch leakage current
Upper switch current limit
Oscillation frequency
Maximum duty cycle
Minimum on time
EN input voltage “H”
EN input voltage “L”
Thermal shutdown
Min
Typ
4.2
Vin rising
Vin falling
VEN = 5V, VFB = 1V
VEN = 0V
3.8V≤VIN ≤28V
VBST-SW = 5V
VIN = 5V
VEN = 0V, VSW = 0V
Minimum duty cycle
0.784
3.8
200
150
1
0.8
180
110
0.1
Max
Unit
28
V
V
mV
uA
uA
V
mΩ
mΩ
uA
A
KHz
%
ns
V
V
°C
0.816
10
3
500
93
100
1.5
0.6
160
PIN DESCRIPTION
PIN #
NAME
DESCRIPTION
1
2
3
4
5
6
7
8
BST
VIN
SW
GND
FB
NC
EN
NC
9
Thermal PAD
High side power transistor gate drive boost input.
Power input. Bypass with a 22uF ceramic capacitor to GND.
Power switching node to connect inductor.
Ground.
Feedback input with reference voltage set to 0.8V.
No connection
Enable input. Set this pin to high level to enable the part, low level to disable.
No connection
Ground. The exposed pad must be soldered to a large PCB area and connected to GND for
maximum power dissipation.
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LC2632
ELECTRICAL PERFORMANCE
Efficiency vs. Iout
Efficiency vs. Iout
Vout=3.3V
100%
100%
90%
90%
80%
80%
70%
70%
Efficiency(%)
Efficiency(%)
Vout=1.2V
60%
50%
40%
Vin=5V
Vin=12V
Vin=19V
Vin=24V
Vin=28V
30%
20%
10%
0%
0.0
0.0
0.1
Iout (A)
1.0
60%
50%
40%
Vin=5V
Vin=12V
Vin=19V
Vin=24V
Vin=28V
30%
20%
10%
0%
10.0
0.0
Efficiency vs. Iout
0.0
0.1
Iout (A)
1.0
10.0
Vout vs. Iout
Vout=5.0V
Vout=1.2V
1.22
100%
90%
1.21
80%
60%
Vout (V)
Efficiency(%)
70%
50%
40%
30%
Vin=12V
Vin=19V
Vin=24V
Vin=28V
20%
10%
0%
0.0
0.0
0.1
Iout (A)
1.0
1.20
1.19
Vin=5V
Vin=12V
Vin=19V
Vin=24V
Vin=28V
1.18
1.17
0.0
10.0
0.5
Vout vs. Iout
3.34
5.04
3.33
5.03
3.32
5.02
3.31
5.01
Vout (V)
Vout (V)
5.05
3.30
3.29
Vin=5V
Vin=12V
Vin=19V
Vin=24V
Vin=28V
3.28
3.27
3.26
3.25
1.0
1.5
5.00
4.99
4.98
Vin=12V
Vin=19V
Vin=24V
Vin=28V
4.97
4.96
4.95
2.0
0.0
Iout (A)
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2.0
Vout=5.0V
3.35
0.5
1.5
Vout vs. Iout
Vout=3.3V
0.0
1.0
Iout (A)
0.5
1.0
1.5
2.0
Iout (A)
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LC2632
Steady State Waveform
Steady State Waveform
Vin=12V, Vout=3.3V, Cin=Cout=10uF*2, L=4.7uH, Iout=0A
Ch1—Vin, Ch2—Vout, Ch3—VSW, Ch4—ISW
Vin=12V, Vout=3.3V, Cin=Cout=10uF*2, L=4.7uH, Iout=2A
Ch1—Vin, Ch2—Vout, Ch3—VSW, Ch4—ISW
Load Transient
Load Transient
Vin=12V, Vout=3.3V, Iout=0.01~1A
Ch2—Vout, Ch4—IL
Vin=12V, Vout=3.3V, Iout=1~2A
Ch2—Vout, Ch4—IL
BLOCK DIAGRAM
BST
VIN
Vref
Internal
LDO
+
+
-
FB
VIN
-
OSC
Control
Logic
EN
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5
SW
GND
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LC2632
FUNCTIONAL DECRIPTIONS
greatly reduces the average short-circuit current
to alleviate thermal issues and to protect the
regulator. The LC2632 exits hiccup mode once
the overcurrent condition is removed.
Loop operation
The LC2632 is a wide input range, high-efficiency,
DC-to-DC step-down switching regulator, capable of
delivering up to 2A of output current, integrated
with a 180/110mΩ synchronous MOSFET pair,
eliminating the need for external diode. It uses a
PWM current-mode control scheme. An error
amplifier integrates error between the FB signal
and the internal reference voltage. The output of
the integrator is then compared to the sum of a
current-sense signal and the slope compensation
ramp. This operation generates a PWM signal that
modulates the duty cycle of the power MOSFETs to
achieve regulation for output voltage.
Light load operation
Traditionally, a fixed constant frequency PWM DCDC regulator always switches even when the output
load is small. When energy is shuffling back and
forth through the power MOSFETs, power is lost
due to the finite RDSONs of the MOSFETs and
parasitic capacitances. At light load, this loss is
prominent and efficiency is therefore very low.
LC2632 employs a proprietary control scheme that
improves efficiency in this situation by enabling the
device into a power save mode during light load,
thereby extending the range of high efficiency
operation.
Internal soft-start
The soft-start is important for many applications
because it eliminates power-up initialization
problems. The controlled voltage ramp of the
output also reduces peak inrush current during
start-up, minimizing start-up transient events to the
input power bus.
Startup and shutdown
If both VIN and EN are higher than their appropriate
thresholds, the chip starts. The reference block
starts first, generating stable reference voltage and
currents, and then the internal regulator is enabled.
The regulator provides stable supply for the
remaining circuitries. Three events can shut down
the chip: EN low, VIN low and thermal shutdown. In
the shutdown procedure, the signaling path is first
blocked to avoid any fault triggering. The COMP
voltage and the internal supply rail are then pulled
down. The floating driver is not subject to this
shutdown command.
Over-current-protection and hiccup
The LC2632 has a cycle-by-cycle over-current
limit for when the inductor current peak value
exceeds the set current-limit threshold. First,
when the output voltage drops until FB falls
below the Under-Voltage (UV) threshold
(typically 300mV) to trigger a UV event, the
LC2632 enters hiccup mode to periodically restart
the part. This protection mode is especially useful
when the output is dead-shorted to ground. This
APPLICATIONS INFORMATION
Setting output voltages
Selecting the inductor
The external resistor divider is used to set the
output voltage. The feedback resistor R1 also sets
the feedback loop bandwidth with the internal
compensation capacitor. R2 is then given by:
Use a 2.2μH-to-6.8μH inductor with a DC current
rating of at least 25% higher than the maximum
load current for most applications. For most
designs, derive the inductance value from the
following equation:
Where ΔIL is the inductor ripple current. Choose
an inductor current approximately 30% of the
maximum load current. The maximum inductor
peak current is:
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LC2632
frequency. For simplification, the output ripple
can be approximated with:
Under light-load conditions (below 100mA), use a
larger inductor to improve efficiency.
[
]
Selecting the output capacitor
The characteristics of the output capacitor also
affect the stability of the regulation system. The
LC2632 can be optimized for a wide range of
capacitance and ESR values.
The output capacitor maintains the DC output
voltage. Use ceramic, tantalum, or low-ESR
electrolytic capacitors. Use low ESR capacitors to
limit the output voltage ripple. Estimate the
output voltage ripple with:
[
]
[
]
Where L is the inductor value and RESR is the
equivalent series resistance (ESR) of the output
capacitor.
For ceramic capacitors, the capacitance
dominates the impedance at the switching
frequency and causes most of the output voltage
ripple. For simplification, estimate the output
voltage ripple with:
[
Selecting the external boost diode
It is recommended to add an external Boost Diode
to improve efficiency and stability in these
situations when the input voltage is fixed at
5.0V.Any a readily and cheap diode can meet the
need of these application such as 1N4148.
]
For tantalum or electrolytic capacitors, the ESR
dominates the impedance at the switching
PCB LAYOUT RECOMMENDATION
The device’s performance and stability are
dramatically affected by PCB layout. It is
recommended to follow these general guidelines
shown as below:
1. Place the input capacitors and output capacitors
as close to the device as possible. The traces which
connect to these capacitors should be as short and
wide as possible to minimize parasitic inductance
and resistance.
2. Place feedback resistors close to the FB pin.
3. Keep the sensitive signal (FB) away from the
switching signal (SW).
4. The exposed pad of the package should be
soldered to an equivalent area of metal on the PCB.
This area should connect to the GND plane and
have multiple via connections to the back of the
PCB as well as connections to intermediate PCB
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layers. The GND plane area connecting to the
exposed pad should be maximized to improve
thermal performance.
5. Multi-layer PCB design is recommended.
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LC2632
PACKAGE OUTLINE
Package
ESOP8
Devices per reel
2500
Unit
mm
Package specification:
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