XKB2-A2T-WWC

DIGI® WIRELESS CONNECTIVITY KIT Provides a hands-on way to learn how to use XBee® RF modules for device connectivity and sensor networking Starting with very simple examples, we provide step-bystep guidance in assembling the kit components to create reliable wireless communications, working control systems, and sensing networks with incredible battery life and robust security. The kit is designed for anyone getting started in the world of XBee: hardware/software engineers, product managers, educators, students and even young inventors. All examples are explained in-depth and include videos showcasing wireless communication in action. Some examples also incorporate the XBee Java Library, which can be used to integrate XBees modules into Java-based devices and applications. Each example is designed to be easy for anyone to use, and those with some programming background should find it simple to extend the examples to additional applications or use-cases. The Kit Includes: 3 2 XBee Grove Development Boards 3 2 XBee 802.15.4 Modules 3 2 Micro-USB Cables 3 2 XBee Stickers PART NUMBER DESCRIPTION XKB2-AT-WWC Wireless Connectivity Kit w/ XBee S1 802.15.4 XKB2-A2T-WWC Wireless Connectivity Kit w/ XBee S2C 802.15.4 XBee 802.15.4 Modules Included in the Kit XBee and XBee-PRO 802.15.4 modules are embedded solutions providing wireless connectivity to devices. These modules use the IEEE 802.15.4 networking protocol for fast point-to-multipoint or peer-to-peer networking. They are designed for high-throughput applications requiring low latency and predictable communication timing. www.digi.com XBee 802.15.4 modules are ideal for low-power, low-cost applications. These modules are easy-to-use, share a common footprint, and are fully interoperable with other XBee products utilizing the same technology. Module users have the ability to substitute one XBee module for another with minimal development time and risk. SPECIFICATIONS XBee® S2C 802.15.4 | XBee-PRO® S2C 802.15.4 PERFORMANCE TRANSCEIVER CHIPSET Silicon Labs EM357 SoC DATA RATE RF 250 Kbps, Serial up to 1 Mbps INDOOR/URBAN RANGE 200 ft (60 m) 300 ft (90 m) OUTDOOR/RF LINE-OF-SIGHT RANGE 4000 ft (1200 m) 2 miles (3200 m) TRANSMIT POWER 3.1 mW (+5 dBm) / 6.3 mW (+8 dBm) boost mode 63 mW (+18 dBm) RECEIVER SENSITIVITY (1% PER) -100 dBm / -102 dBm boost mode -101 dBm FEATURES SERIAL DATA INTERFACE UART, SPI CONFIGURATION METHOD API or AT commands, local or over-the-air (OTA) FREQUENCY BAND ISM 2.4 GHz FORM FACTOR Through-Hole, Surface Mount HARDWARE S2C INTERFERENCE IMMUNITY DSSS (Direct Sequence Spread Spectrum) ADC INPUTS (4) 10-bit ADC inputs DIGITAL I/O 15 ANTENNA OPTIONS Through-Hole: PCB Antenna, U.FL Connector, RPSMA Connector, or Integrated Wire SMT: RF Pad, PCB Antenna, or U.FL Connector OPERATING TEMPERATURE -40º C to +85º C DIMENSIONS (L X W X H) AND WEIGHT Through-Hole: 0.960 x 1.087 in (2.438 x 2.761 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) Through-Hole: 0.960 x 1.297 in (2.438 x 3.294 cm) SMT: 0.866 x 1.33 x 0.120 in (2.199 x 3.4 x 0.305 cm) NETWORKING AND SECURITY PROTOCOL ZigBee PRO 2007, HA-Ready with support for binding/multicasting UPDATABLE TO DIGIMESH PROTOCOL Yes UPDATABLE TO ZIGBEE PROTOCOL Yes ENCRYPTION 128-bit AES RELIABLE PACKET DELIVERY Retries/Acknowledgements IDS PAN ID and addresses, cluster IDs and endpoints (optional) CHANNELS 16 channels 15 channels SUPPLY VOLTAGE 2.1 to 3.6V 2.7 to 3.6V TRANSMIT CURRENT 33 mA @ 3.3 VDC / 45 mA boost mode 120 mA @ 3.3 VDC RECEIVE CURRENT 28 mA @ 3.3 VDC / 31 mA boost mode 31 mA @ 3.3 VDC POWER-DOWN CURRENT