L293N

L293 PUSH-PULL FOUR CHANNEL DRIVER WITH DIODES 600mA OUTPUT CURRENT CAPABILITY PER CHANNEL 1.2A PEAK OUTPUT CURRENT (non repetitive) PER CHANNEL ENABLE FACILITY OVERTEMPERATURE PROTECTION LOGICAL ”0” INPUT VOLTAGE UP TO 1.5 V (HIGH NOISE IMMUNITY) INTERNAL CLAMP DIODES SOP(12+4+4) Powerdip (12+2+2) ORDERING NUMBERS: DESCRIPTION The Device is a monolithic integrated high voltage, high current four channel driver designed to accept standard DTL or TTL logic levels and drive inductive loads (such as relays solenoides, DC and stepping motors) and switching power transistors. To simplify use as two bridges each pair of channels is equipped with an enable input. A separate supply input is provided for the logic, allowing operation at a lower voltage and internal clamp diodes are included. This device is suitable for use in switching applications at frequencies up to 5 kHz. L293M L293N The L293D is assembled in a 16 lead plastic packaage which has 4 center pins connected together and used for heatsinking The L293DD is assembled in a 20 lead surface mount which has 8 center pins connected together and used for heatsinking. ORDERING INFORMATION DEVICE Package Type MARKING Packing Packing Qty L293N DIP16 L293D TUBE 1000/box L293M/ SOP20 L293DD REEL 2000/reel BLOCK DIAGRAM http://www.hgsemi.com.cn 1 2018 AUG L293 ABSOLUTE MAXIMUM RATINGS Symbol Parameter Value Unit V VS Supply Voltage 36 V SS Logic Supply Voltage 36 V Input Voltage 7 V Enable Voltage 7 V Vi V en Io P tot Tstg, Tj Peak Output Current (100 µs non repetitive) Total Power Dissipation at Tpins = 90 °C Storage and Junction Temperature 1.2 A 4 W – 40 to 150 °C PIN CONNECTIONS (Top view) Powerdip(12+2+2) SOP(12+4+4) THERMAL DATA Symbol DIP SOP Rth j-pins Thermal Resistance Junction-pins Decription max. – 14 °C/W Unit Rth j-amb Thermal Resistance junction-ambient max. 80 50 (*) °C/W Rth j-case Thermal Resistance Junction-case max. 14 – (*) With 6sq. cm on board heatsink. http://www.hgsemi.com.cn 2 2018 AUG L293 ELECTRICAL CHARACTERISTICS (for each channel, VS = 24 V, VSS = 5 V, Tamb = 25 °C, unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Unit VS Supply Voltage (pin 10) VSS 36 V V SS Logic Supply Voltage (pin 20) 4.5 36 V IS Total Quiescent Supply Current (pin 10) Vi = L ; IO = 0 ; Ven = H 2 6 mA Vi = H ; IO = 0 ; Ven = H 16 24 mA Ven = L ISS Total Quiescent Logic Supply Current (pin 20) Vi = L ; IO = 0 ; Ven = H 44 4 mA 60 mA Vi = H ; IO = 0 ; Ven = H 16 22 mA Ven = L 16 24 mA – 0.3 1.5 V V IL Input Low Voltage (pin 2, 9, 12, 19) VIH Input High Voltage (pin 2, 9, 12, 19) VSS ≤ 7 V 2.3 VSS V VSS > 7 V 2.3 7 V IIL Low Voltage Input Current (pin 2, 9, 12, 19) VIL = 1.5 V – 10 µA IIH High Voltage Input Current (pin 2, 9, 12, 19) 2.3 V ≤ VIH ≤ VSS – 0.6 V 100 µA – 0.3 1.5 V VSS V 30 Ven L Enable Low Voltage (pin 1, 11) Ven H Enable High Voltage (pin 1, 11) VSS ≤ 7 V 2.3 VSS > 7 V 2.3 Ien L Low Voltage Enable Current (pin 1, 11) Ven L = 1.5 V Ien H High Voltage Enable Current (pin 1, 11) 2.3 V ≤ Ven H ≤ VSS – 0.6 V VCE(sat)H Source Output Saturation Voltage (pins 3, 8, 13, 18) IO = – 0.6 A VCE(sat)L Sink Output Saturation Voltage (pins 3, 8, 13, 18) VF 7 V – 100 µA ± 10 µA 1.4 1.8 V IO = + 0.6 A 1.2 1.8 V Clamp Diode Forward Voltage IO = 600nA 1.3 V tr Rise Time (*) 0.1 to 0.9 VO 250 ns tf Fall Time (*) 0.9 to 0.1 VO 250 ns ton Turn-on Delay (*) 0.5 Vi to 0.5 VO 750 ns toff Turn-off Delay (*) 0.5 Vi to 0.5 VO 200 ns – 30 (*) See fig. 1. http://www.hgsemi.com.cn 3 2018 AUG L293 Figure 1: Switching Times TRUTH TABLE (one channel) Inpu t Enable (*) Output H L H L H H L L H L Z Z Z = High output impedance (*) Relative to the considered channel Figure 2: Junction to ambient thermal resistance vs. area on board heatsink (SOP12+4+4 package) http://www.hgsemi.com.cn 4 2018 AUG L293 Important statement: Huaguan Semiconductor Co,Ltd. reserves the right to change the products and services provided without notice. Customers should obtain the latest relevant information before ordering, and verify the timeliness and accuracy of this information. Customers are responsible for complying with safety standards and taking safety measures when using our products for system design and machine manufacturing to avoid potential risks that may result in personal injury or property damage. Our products are not licensed for applications in life support, military, aerospace, etc., so we do not bear the consequences of the application of these products in these fields. Our documentation is only permitted to be copied without any tampering with the content, so we do not accept any responsibility or liability for the altered documents. http://www.hgsemi.com.cn 5 2018 AUG