ESP32-S2-MINI-1-N4

ESP32­S2­MINI­1 & ESP32­S2­MINI­1U Datasheet 2.4 GHz Wi­Fi (802.11 b/g/n) module Built around ESP32­S2 series of SoC, Xtensa® single­core 32­bit LX7 microprocessor 4 MB flash and optional 2 MB PSRAM in chip package 37 GPIOs, rich set of peripherals On­board PCB antenna or external antenna connector Version 1.0 Espressif Systems Copyright © 2021 www.espressif.com About This Document This document provides the specifications for ESP32-S2-MINI-1 and ESP32-S2-MINI-1U modules. Document Updates Please always refer to the latest version on https://www.espressif.com/en/support/download/documents. Revision History For revision history of this document, please refer to the last page. Documentation Change Notification Espressif provides email notifications to keep customers updated on changes to technical documentation. Please subscribe at www.espressif.com/en/subscribe. Certification Download certificates for Espressif products from www.espressif.com/en/certificates. 1 Module Overview 1 Module Overview 1.1 Features (compatible with ISO 11898-1), USB OTG 1.1, CPU and On­Chip Memory ADC, DAC, touch sensor, temperature sensor • ESP32-S2FH4 or ESP32-S2FN4R2 chip embedded, Xtensa® single-core 32-bit LX7 microprocessor, up to 240 MHz Integrated Components on Module • 40 MHz crystal oscillator • 128 KB ROM • 320 KB SRAM Antenna Options • 16 KB SRAM in RTC • On-board PCB antenna (ESP32-S2-MINI-1) • 4 MB embedded flash • External antenna via a connector • 2 MB embedded PSRAM (ESP32-S2FN4R2 only) (ESP32-S2-MINI-1U) Wi­Fi Operating Conditions • 802.11 b/g/n • Operating voltage/Power supply: 3.0 ~ 3.6 V • Bit rate: 802.11n up to 150 Mbps • Operating ambient temperature: –40 ~ 85 °C • A-MPDU and A-MSDU aggregation • 0.4 µs guard interval support Certification • Green certification: RoHS/REACH • Center frequency range of operating channel: 2412 ~ 2484 MHz • RF certification: FCC/CE-RED/SRRC/IC Peripherals Test • GPIO, SPI, LCD, UART, I2C, I2S, Camera ® interface, IR, pulse counter, LED PWM, TWAI • HTOL/HTSL/uHAST/TCT/ESD 1.2 Description ESP32-S2-MINI-1 and ESP32-S2-MINI-1U are two powerful, generic Wi-Fi MCU modules that have a rich set of peripherals. They are an ideal choice for a wide variety of application scenarios relating to Internet of Things (IoT), wearable electronics and smart home. The ordering information of the two modules is listed as follows: Table 1: Ordering Information Module ESP32-S2-MINI-1 (ANT) ESP32-S2-MINI-1U (CONN) Ordering code Chip embedded ESP32-S2-MINI-1-N4 ESP32-S2FH4 ESP32-S2-MINI-1-N4R2 ESP32-S2FN4R2 ESP32-S2-MINI-1U-N4 ESP32-S2FH4 ESP32-S2-MINI-1U-N4R2 ESP32-S2FN4R2 Module dimensions (mm) 15.4 × 20.0 × 2.4 15.4 × 15.4 × 2.4 Notes: For dimensions of the external antenna connector, please see Section 7.3. Espressif Systems 3 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 1 Module Overview ESP32-S2-MINI-1 comes with a on-board PCB antenna, and ESP32-S2-MINI-1U with an U.FL connector for external antenna. Both ESP32-S2-MINI-1 and ESP32-S2-MINI-1U have two variants: • integrating the ESP32-S2FH4 chip (which is embedded with a 4 MB high-temperature flash), or • integrating the ESP32-S2FN4R2 chip (which is embedded with a 4 MB flash and 2 MB PSRAM) The two variants only differ in the chip integrated. In this datasheet unless otherwise stated, ESP32-S2-MINI-1 refers to both ESP32-S2-MINI-1-N4 and ESP32-S2-MINI-1-N4R2, whereas ESP32-S2-MINI-1U refers to both ESP32-S2-MINI-1U-N4 and ESP32-S2-MINI-1U-N4R2. The ESP32-S2FH4 chip and the ESP32-S2FN4R2 chip falls into the same category, namely ESP32-S2 chip series. ESP32-S2 series of chips has an Xtensa® 32-bit LX7 CPU that operates at up to 240 MHz. It has a low-power co-processor that can be used instead of the CPU to save power while performing tasks that do not require much computing power, such as monitoring of peripherals. ESP32-S2 series integrates a rich set of peripherals, ranging from SPI, I2S, UART, I2C, LED PWM, TWAI® , LCD, Camera interface, ADC, DAC, touch sensor, temperature sensor, as well as up to 43 GPIOs. It also includes a full-speed USB On-The-Go (OTG) interface to enable USB communication. The ESP32-S2FH4 chip and the ESP32-S2FN4R2 chip vary in: • temperature of embedded flash • whether a PSRAM is embedded For details, please refer to Section Family Member Comparison in ESP32-S2 Series Datasheet. 1.3 Applications • Generic Low-power IoT Sensor Hub • Smart Building • Generic Low-power IoT Data Loggers • Industrial Automation • Cameras for Video Streaming • Smart Agriculture • Over-the-top (OTT) Devices • Audio Applications • USB Devices • Health Care Applications • Speech Recognition • Wi-Fi-enabled Toys • Image Recognition • Wearable Electronics • Mesh Network • Home Automation • Retail & Catering Applications • Smart Home Control Panel • Smart POS Machines Espressif Systems 4 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback Contents Contents 1 Module Overview 3 1.1 Features 3 1.2 Description 3 1.3 Applications 4 2 Block Diagram 8 3 Pin Definitions 9 3.1 Pin Layout 9 3.2 Pin Description 10 3.3 Strapping Pins 12 4 Electrical Characteristics 14 4.1 Absolute Maximum Ratings 14 4.2 Recommended Operating Conditions 14 4.3 DC Characteristics (3.3 V, 25 °C) 14 4.4 Current Consumption Characteristics 15 4.5 Wi-Fi RF Characteristics 16 4.5.1 Wi-Fi RF Standards 16 4.5.2 Transmitter Characteristics 16 4.5.3 Receiver Characteristics 16 5 Schematics 18 6 Peripheral Schematics 20 7 Physical Dimensions and PCB Land Pattern 21 7.1 Physical Dimensions 21 7.2 Recommended PCB Land Pattern 23 7.3 Dimensions of External Antenna Connector 25 8 Product Handling 26 8.1 Storage Condition 26 8.2 ESD 26 8.3 Reflow Profile 26 9 MAC Addresses and eFuse 27 10 Learning Resources 28 10.1 Must-Read Documents 28 10.2 Must-Have Resources 28 Revision History Espressif Systems 29 5 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback List of Tables List of Tables 1 Ordering Information 2 Pin Definitions 10 3 Strapping Pins 12 4 Absolute Maximum Ratings 14 5 Recommended Operating Conditions 14 6 DC Characteristics (3.3 V, 25 °C) 14 7 Current Consumption Depending on RF Modes 15 8 Current Consumption Depending on Work Modes 15 9 Wi-Fi RF Standards 16 10 Transmitter Characteristics 16 11 Receiver Characteristics 17 Espressif Systems 3 6 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback List of Figures List of Figures 1 ESP32-S2-MINI-1 Block Diagram 8 2 ESP32-S2-MINI-1U Block Diagram 8 3 ESP32-S2-MINI-1 Pin Layout (Top View) 9 4 ESP32-S2-MINI-1U Pin Layout (Top View) 10 5 ESP32-S2-MINI-1 Schematics 18 6 ESP32-S2-MINI-1U Schematics 19 7 Peripheral Schematics 20 8 ESP32-S2-MINI-1 Physical Dimensions 21 9 ESP32-S2-MINI-1U Physical Dimensions 22 10 ESP32-S2-MINI-1 Recommended PCB Land Pattern 23 11 ESP32-S2-MINI-1U Recommended PCB Land Pattern 24 12 Dimensions of External Antenna Connector 25 13 Reflow Profile 26 Espressif Systems 7 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 2 Block Diagram 2 Block Diagram ESP32-S2-MINI-1 40 MHz Crystal 40 MHz Crystal 3V3 3V3 ESP32-S2-MINI-1 Antenna Antenna RF Matching EN EN ESP32-S2FH4 ESP32-S2FN4R2 ESP32-S2FH4 ESP32-S2FN4R2 FLASH PSRAM(opt.) (QSPI) (QSPI) FLASH (QSPI) PSRAM(opt.) (QSPI) RF Matching GPIOs GPIOs Figure 1: ESP32­S2­MINI­1 Block Diagram ESP32-S2-MINI-1U 40 MHz Crystal 40 MHz Crystal 3V3 3V3 ESP32-S2-MINI-1U Antenna Antenna RF Matching EN EN ESP32-S2FH4 ESP32-S2FN4R2 ESP32-S2FH4 RF Matching GPIOs FLASH PSRAM(opt.) ESP32-S2FN4R2 (QSPI) (QSPI) FLASH (QSPI) GPIOs PSRAM(opt.) (QSPI) Figure 2: ESP32­S2­MINI­1U Block Diagram Espressif Systems 8 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 3 Pin Definitions 3 Pin Definitions 3.1 Pin Layout GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin 59 Pin 58 Pin 57 Pin 56 Pin 55 Pin 54 Pin 53 Pin 52 Pin 51 Pin 50 Pin 49 Pin 48 Pin 47 Pin 46 Pin 62 GND Pin 60 Keepout Zone Pin 65 GND GND Pin 1 Pin 45 EN GND Pin 2 Pin 44 IO46 3V3 Pin 3 Pin 43 GND IO0 Pin 4 Pin 42 GND IO1 Pin 5 Pin 41 IO45 IO2 Pin 6 Pin 40 RXD0 IO3 Pin 7 Pin 39 TXD0 Pin 38 IO42 Pin 37 IO41 Pin 36 IO40 IO4 Pin 8 IO5 Pin 9 GND GND GND GND Pin 61 GND GND GND GND GND Pin 27 Pin 28 Pin 29 Pin 30 NC IO33 IO34 GND Pin 63 GND Pin 26 IO35 IO26 Pin 31 Pin 25 Pin 15 IO21 IO11 Pin 24 IO36 IO20 Pin 32 IO19 Pin 14 Pin 23 IO10 IO18 IO37 Pin 22 Pin 33 IO17 Pin 13 Pin 21 IO9 IO16 IO38 Pin 20 Pin 34 IO15 Pin 12 Pin 19 IO8 IO14 IO39 Pin 18 Pin 35 IO13 Pin 11 Pin 17 IO7 Pin 16 Pin 10 IO12 IO6 Pin 64 GND Figure 3: ESP32­S2­MINI­1 Pin Layout (Top View) Espressif Systems 9 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Pin 60 Pin 59 Pin 58 Pin 57 Pin 56 Pin 55 Pin 54 Pin 53 Pin 52 Pin 51 Pin 50 Pin 49 Pin 48 Pin 47 Pin 46 3 Pin Definitions Pin 62 GND Pin 65 GND GND Pin 1 Pin 45 EN GND Pin 2 Pin 44 IO46 3V3 Pin 3 Pin 43 GND IO0 Pin 4 Pin 42 GND Pin 41 IO45 Pin 40 RXD0 IO1 Pin 5 IO2 Pin 6 IO3 Pin 7 IO4 Pin 8 IO5 Pin 9 IO6 Pin 10 GND GND GND GND Pin 61 GND GND GND GND GND Pin 39 TXD0 Pin 38 IO42 Pin 37 IO41 Pin 36 IO40 Pin 29 Pin 30 IO34 GND Pin 28 IO33 IO26 Pin 27 Pin 26 IO21 NC Pin 24 Pin 25 IO20 Pin 22 Pin 23 Pin 63 GND IO19 IO35 IO18 Pin 31 Pin 21 Pin 15 Pin 20 IO36 IO11 IO17 IO10 Pin 32 IO16 IO37 Pin 14 Pin 19 Pin 33 Pin 18 Pin 13 IO14 IO38 IO9 IO15 IO8 Pin 17 IO39 Pin 34 Pin 16 Pin 35 IO12 Pin 11 Pin 12 IO13 IO7 Pin 64 GND Figure 4: ESP32­S2­MINI­1U Pin Layout (Top View) Note: The pin diagram shows the approximate location of pins on the module. For the actual mechanical diagram, please refer to Figure 7.1 Physical Dimensions. 3.2 Pin Description The module has 65 pins. See pin definitions in Table 2. Table 2: Pin Definitions Name No. Type Function GND 1, 2, 30, 42, 43, 46-65 P Ground 3V3 3 P Power supply IO0 4 I/O/T RTC_GPIO0, GPIO0 IO1 5 I/O/T RTC_GPIO1, GPIO1, TOUCH1, ADC1_CH0 IO2 6 I/O/T RTC_GPIO2, GPIO2, TOUCH2, ADC1_CH1 IO3 7 I/O/T RTC_GPIO3, GPIO3, TOUCH3, ADC1_CH2 IO4 8 I/O/T RTC_GPIO4, GPIO4, TOUCH4, ADC1_CH3 IO5 9 I/O/T RTC_GPIO5, GPIO5, TOUCH5, ADC1_CH4 IO6 10 I/O/T RTC_GPIO6, GPIO6, TOUCH6, ADC1_CH5 IO7 11 I/O/T RTC_GPIO7, GPIO7, TOUCH7, ADC1_CH6 IO8 12 I/O/T RTC_GPIO8, GPIO8, TOUCH8, ADC1_CH7 Espressif Systems 10 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 3 Pin Definitions Name No. Type Function IO9 13 I/O/T RTC_GPIO9, GPIO9, TOUCH9, ADC1_CH8, FSPIHD IO10 14 I/O/T RTC_GPIO10, GPIO10, TOUCH10, ADC1_CH9, FSPICS0, FSPIIO4 IO11 15 I/O/T RTC_GPIO11, GPIO11, TOUCH11, ADC2_CH0, FSPID, FSPIIO5 IO12 16 I/O/T RTC_GPIO12, GPIO12, TOUCH12, ADC2_CH1, FSPICLK, FSPIIO6 IO13 17 I/O/T RTC_GPIO13, GPIO13, TOUCH13, ADC2_CH2, FSPIQ, FSPIIO7 IO14 18 I/O/T RTC_GPIO14, GPIO14, TOUCH14, ADC2_CH3, FSPIWP, FSPIDQS IO15 19 I/O/T RTC_GPIO15, GPIO15, U0RTS, ADC2_CH4, XTAL_32K_P IO16 20 I/O/T RTC_GPIO16, GPIO16, U0CTS, ADC2_CH5, XTAL_32K_N IO17 21 I/O/T RTC_GPIO17, GPIO17, U1TXD, ADC2_CH6, DAC_1 IO18 22 I/O/T RTC_GPIO18, GPIO18, U1RXD, ADC2_CH7, DAC_2, CLK_OUT3 IO19 23 I/O/T RTC_GPIO19, GPIO19, U1RTS, ADC2_CH8, CLK_OUT2, USB_D- IO20 24 I/O/T RTC_GPIO20, GPIO20, U1CTS, ADC2_CH9, CLK_OUT1, USB_D+ IO21 25 I/O/T RTC_GPIO21, GPIO21 IO26 26 I/O/T SPICS1, GPIO26 NC 27 — IO33 28 I/O/T SPIIO4, GPIO33, FSPIHD IO34 29 I/O/T SPIIO5, GPIO34, FSPICS0 IO35 31 I/O/T SPIIO6, GPIO35, FSPID IO36 32 I/O/T SPIIO7, GPIO36, FSPICLK IO37 33 I/O/T SPIDQS, GPIO37, FSPIQ IO38 34 I/O/T GPIO38, FSPIWP IO39 35 I/O/T MTCK, GPIO39, CLK_OUT3 IO40 36 I/O/T MTDO, GPIO40, CLK_OUT2 IO41 37 I/O/T MTDI, GPIO41, CLK_OUT1 IO42 38 I/O/T MTMS, GPIO42 TXD0 39 I/O/T U0TXD, GPIO43, CLK_OUT1 RXD0 40 I/O/T U0RXD, GPIO44, CLK_OUT2 IO45 41 I/O/T GPIO45 IO46 44 I GPIO46 NC High: on, enables the chip. EN 45 I Low: off, the chip powers off. Note: Do not leave the EN pin floating. Notice: 1. IO18 on the module is pulled up to VDD33 through a 10 kΩ resistor. For details, please refer to Figure 5 and Figure 6. 2. IO26 is used by the embedded PSRAM on the ESP32-S2-MINI-1-N4R2 and ESP32-S2-MINI-1U-N4R2 modules, and cannot be used for other purposes. 3. For peripheral pin configurations, please refer to ESP32-S2 Series Datasheet. Espressif Systems 11 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 3 Pin Definitions 3.3 Strapping Pins ESP32-S2 series of chips has three strapping pins: GPIO0, GPIO45, GPIO46. The pin-pin mapping between ESP32-S2 series of chips and the module is as follows, which can be seen in Chapter 5 Schematics: • GPIO0 = IO0 • GPIO45 = IO45 • GPIO46 = IO46 Software can read the values of corresponding bits from register ”GPIO_STRAPPING”. During the chip’s system reset (power-on-reset, RTC watchdog reset, brownout reset, analog super watchdog reset, and crystal clock glitch detection reset), the latches of the strapping pins sample the voltage level as strapping bits of ”0” or ”1”, and hold these bits until the chip is powered down or shut down. IO0, IO45 and IO46 are connected to the internal pull-up/pull-down. If they are unconnected or the connected external circuit is high-impedance, the internal weak pull-up/pull-down will determine the default input level of these strapping pins. To change the strapping bit values, users can apply the external pull-down/pull-up resistances, or use the host MCU’s GPIOs to control the voltage level of these pins when powering on ESP32-S2 series of chips. After reset, the strapping pins work as normal-function pins. Refer to Table 3 for a detailed boot-mode configuration of the strapping pins. Table 3: Strapping Pins VDD_SPI Voltage 1 Pin IO45 3 Default 3.3 V Pull-down 0 1.8 V 1 Booting Mode 2 Pin Default SPI Boot Download Boot IO0 Pull-up 1 0 IO46 Pull-down Don’t-care 0 Enabling/Disabling ROM Code Print During Booting 4 5 Pin Default Enabled Disabled IO46 Pull-down See the fifth note See the fifth note Note: 1. Firmware can configure register bits to change the settings of ”VDD_SPI Voltage”. 2. The strapping combination of GPIO46 = 1 and GPIO0 = 0 is invalid and will trigger unexpected behavior. 3. Internal pull-up resistor (R1) for IO45 is not populated in the module, as the flash in the module works at 3.3 V by default (output by VDD_SPI). Please make sure IO45 will not be pulled high when the module is powered up by external circuit. 4. ROM code can be printed over TXD0 (by default) or DAC_1 (IO17), depending on the eFuse bit. 5. When eFuse UART_PRINT_CONTROL value is: 0, print is normal during boot and not controlled by IO46. 1 and IO46 is 0, print is normal during boot; but if IO46 is 1, print is disabled. Espressif Systems 12 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 3 Pin Definitions 2 and IO46 is 0, print is disabled; but if IO46 is 1, print is normal. 3, print is disabled and not controlled by IO46. Espressif Systems 13 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 4 Electrical Characteristics 4 Electrical Characteristics 4.1 Absolute Maximum Ratings Table 4: Absolute Maximum Ratings Symbol Parameter Min Max VDD33 TST ORE Unit Power supply voltage –0.3 3.6 V Storage temperature –40 105 °C 4.2 Recommended Operating Conditions Table 5: Recommended Operating Conditions Symbol Parameter Min Typ Max Unit VDD33 Power supply voltage 3.0 3.3 3.6 V IV DD Current delivered by external power supply 0.5 — — A TA Operating ambient temperature –40 — 85 °C Humidity Humidity condition — — 85 %RH 4.3 DC Characteristics (3.3 V, 25 °C) Table 6: DC Characteristics (3.3 V, 25 °C) Symbol Parameter Min CIN Pin capacitance — VIH High-level input voltage Typ 2 0.75 × VDD 1 — Max Unit — pF 1 VDD + 0.3 1 V VIL Low-level input voltage –0.3 — 0.25 × VDD IIH High-level input current — — 50 nA Low-level input current — — 50 nA IIL 2 High-level output voltage 0.8 × VDD — — V VOL 2 Low-level output voltage — — 0.1 × VDD V — 40 — mA — 28 — mA 45 — kΩ 45 — kΩ — 1 VOH IOH IOL High-level source current (VDD1 = 3.3 V, VOH >= 2.64 V, PAD_DRIVER = 3) Low-level sink current (VDD1 = 3.3 V, VOL = 0.495 V, PAD_DRIVER = 3) RP U Pull-up resistor — RP D Pull-down resistor — VIH_nRST VIL_nRST Chip reset release voltage 0.75 × VDD Chip reset voltage Espressif Systems 1 V –0.3 14 1 — VDD + 0.3 0.25 × VDD 1 V V ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 4 Electrical Characteristics Note: 1. VDD is the I/O voltage for a particular power domain of pins. 2. VOH and VOL are measured using high-impedance load. 4.4 Current Consumption Characteristics With the use of advanced power-management technologies, the module can switch between different power modes. For details on different power modes, please refer to Section RTC and Low-Power Management in ESP32-S2 Series Datasheet. Table 7: Current Consumption Depending on RF Modes Work mode Description TX Active (RF working) RX Peak (mA) 802.11b, 20 MHz, 1 Mbps, @19.5 dBm 310 802.11g, 20 MHz, 54 Mbps, @15 dBm 220 802.11n, 20 MHz, MCS7, @13 dBm 200 802.11n, 40 MHz, MCS7, @13 dBm 160 802.11b/g/n, 20 MHz 63 802.11n, 40 MHz 68 Note: • The current consumption measurements are taken with a 3.3 V supply at 25 °C of ambient temperature at the RF port. All transmitters’ measurements are based on a 100% duty cycle. • The current consumption figures for in RX mode are for cases when the peripherals are disabled and the CPU idle. Table 8: Current Consumption Depending on Work Modes Work mode Modem-sleep Description The CPU is powered on Light-sleep 240 MHz 22 mA 160 MHz 17 mA Normal speed: 80 MHz 14 mA — 550 µA The ULP co-processor is powered on. 235 µA ULP sensor-monitored pattern Deep-sleep Power off Current consumption (Typ) 22 µA @1% duty RTC timer + RTC memory 25 µA RTC timer only 20 µA CHIP_PU is set to low level, the chip is powered off. 1 µA Note: • The current consumption figures in Modem-sleep mode are for cases where the CPU is powered on and the cache idle. • When Wi-Fi is enabled, the chip switches between Active and Modem-sleep modes. Therefore, current consumption changes accordingly. Espressif Systems 15 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 4 Electrical Characteristics • In Modem-sleep mode, the CPU frequency changes automatically. The frequency depends on the CPU load and the peripherals used. • During Deep-sleep, when the ULP co-processor is powered on, peripherals such as GPIO and I2C are able to operate. • The ”ULP sensor-monitored pattern” refers to the mode where the ULP coprocessor or the sensor works periodically. When touch sensors work with a duty cycle of 1%, the typical current consumption is 22 µA. 4.5 Wi­Fi RF Characteristics 4.5.1 Wi­Fi RF Standards Table 9: Wi­Fi RF Standards Name Description Center frequency range of operating channel note1 2412 ~ 2484 MHz Wi-Fi wireless standard IEEE 802.11b/g/n 11b: 1, 2, 5.5 and 11 Mbps 20 MHz Data rate 11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps 11n: MCS0-7, 72.2 Mbps (Max) 40 MHz 11n: MCS0-7, 150 Mbps (Max) Antenna type PCB antenna, IPEX antenna 1. Device should operate in the center frequency range allocated by regional regulatory authorities. Target center frequency range is configurable by software. 2. For the modules that use IPEX antennas, the output impedance is 50 Ω. For other modules without IPEX antennas, users do not need to concern about the output impedance. 4.5.2 Transmitter Characteristics Table 10: Transmitter Characteristics Parameter TX Power note1 Rate Typ 11b, 1 Mbps 19.5 11b, 11 Mbps 19.5 11g, 6 Mbps 18 11g, 54 Mbps 15 11n, HT20, MCS0 18 11n, HT20, MCS7 13.5 11n, HT40, MCS0 18 11n, HT40, MCS7 13.5 Unit dBm 1. Target TX power is configurable based on device or certification requirements. 4.5.3 Receiver Characteristics Espressif Systems 16 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 4 Electrical Characteristics Table 11: Receiver Characteristics Parameter RX Sensitivity RX Maximum Input Level Adjacent Channel Rejection Espressif Systems Rate Typ 1 Mbps –97 2 Mbps –95 5.5 Mbps –93 11 Mbps –88 6 Mbps –92 9 Mbps –91 12 Mbps –89 18 Mbps –86 24 Mbps –83 36 Mbps –80 48 Mbps –76 54 Mbps –74 11n, HT20, MCS0 –92 11n, HT20, MCS1 –88 11n, HT20, MCS2 –85 11n, HT20, MCS3 –82 11n, HT20, MCS4 –79 11n, HT20, MCS5 –75 11n, HT20, MCS6 –73 11n, HT20, MCS7 –72 11n, HT40, MCS0 –89 11n, HT40, MCS1 –85 11n, HT40, MCS2 –83 11n, HT40, MCS3 –79 11n, HT40, MCS4 –76 11n, HT40, MCS5 –72 11n, HT40, MCS6 –70 11n, HT40, MCS7 –68 11b, 1 Mbps 5 11b, 11 Mbps 5 11g, 6 Mbps 5 11g, 54 Mbps 0 11n, HT20, MCS0 5 11n, HT20, MCS7 0 11n, HT40, MCS0 5 11n, HT40, MCS7 0 11b, 11 Mbps 35 11g, 6 Mbps 31 11g, 54 Mbps 14 11n, HT20, MCS0 31 11n, HT20, MCS7 13 11n, HT40, MCS0 19 11n, HT40, MCS7 8 17 Unit dBm dBm dB ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 5 3 This is the reference design of the module. 3 GND XOUT C4 TBD The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. GND R4 GND GND RF_ANT 1 2 L2 GND TBD ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 C11 C12 TBD TBD PCB_ANT GND GND The values of C11, L2 and C12 vary with the actual PCB board. GND LNA_IN GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VDDA LNA_IN VDD3P3 VDD3P3 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 U1 15 16 17 18 19 20 21 22 23 24 25 26 27 28 GND ANT1 VDD33 C15 0.1uF GND 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 62 VDD33 0.1uF GND GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 SPID SPIQ SPICLK SPICS0 SPIWP SPIHD VDD_SPI SPICS1 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO0 GPIO1 GPIO2 D1 GPIO3 ESD GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GND GPIO9 GPIO10 GPIO11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 63 GND ESP32-S2-MINI-1 EN IO46 GND GND IO45 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 GND GND U2 GPIO26 C13 C14 0.1uF 1uF ESP32-S2FH4 ESP32-S2FN4R2 GND 10K ESP32-S2-MINI-1(pin-out) GND VDD33 C16 0.1uF GND Figure 5: ESP32­S2­MINI­1 Schematics GND GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 VDD_SPI R11 GPIO21 0.1uF GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 C9 0.1uF C10 56 55 54 53 52 51 50 49 48 47 46 45 44 43 C8 1uF CHIP_PU GPIO46 VDDA XTAL_P XTAL_N VDDA GPIO45 U0RXD U0TXD MTMS MTDI VDD3P3_CPU MTDO MTCK C7 10uF GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 C6 GND VDD33 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 VDD3P3_RTC XTAL_32K_P XTAL_32K_N DAC_1 DAC_2 GPIO19 GPIO20 VDD3P3_RTC_IO GPIO21 57 GND 2.0nH GND L1 CHIP_PU GPIO46 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO33 GPIO34 0.1uF VDD33 C 499 0 R3 C5 18 Submit Documentation Feedback GND EPAD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VDD33 IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 NC IO33 IO34 GND GND 40MHz(±10ppm) 100pF 65 CHIP_PU GPIO46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 GPIO37 GPIO36 GPIO35 64 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 C2 GND GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 1 GND Y1 2 C1 TBD GND C3 1uF XIN GND 4 GND VDD33 A 1 5 Schematics VDD33 B 2 5 Schematics Espressif Systems D 4 GND 5 3 3 C4 TBD The values of C1 and C4 vary with the selection of the crystal. The value of R4 varies with the actual PCB board. GND R4 RF_ANT L2 GND TBD ANT1 C11 C12 IPEX TBD TBD GND The values of C11, L2 and C12 vary with the actual PCB board. GND LNA_IN GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VDDA LNA_IN VDD3P3 VDD3P3 GPIO0 GPIO1 GPIO2 GPIO3 GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GPIO9 U1 VDD33 C15 GND 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 VDD33 0.1uF GND GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 SPID SPIQ SPICLK SPICS0 SPIWP SPIHD VDD_SPI SPICS1 42 41 40 39 38 37 36 35 34 33 32 31 30 29 GPIO38 GPIO37 GPIO36 GPIO35 GPIO34 GPIO33 GPIO0 GPIO1 GPIO2 D1 GPIO3 ESD GPIO4 GPIO5 GPIO6 GPIO7 GPIO8 GND GPIO9 GPIO10 GPIO11 GND GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 GND U2 GND ESP32-S2-MINI-1U EN IO46 GND GND IO45 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 GND 65 CHIP_PU GPIO46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 GPIO38 GPIO37 GPIO36 GPIO35 64 GPIO26 C13 C14 0.1uF 1uF ESP32-S2FH4 ESP32-S2FN4R2 GND 10K 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 63 VDD_SPI R11 0.1uF 62 GPIO33 GPIO34 4 3 2 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 GND GND ESP32-S2-MINI-1U(pin-out) GND VDD33 C16 GPIO21 GND 15 16 17 18 19 20 21 22 23 24 25 26 27 28 GND GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 0.1uF C10 56 55 54 53 52 51 50 49 48 47 46 45 44 43 C9 0.1uF CHIP_PU GPIO46 VDDA XTAL_P XTAL_N VDDA GPIO45 U0RXD U0TXD MTMS MTDI VDD3P3_CPU MTDO MTCK C8 1uF GND VDD33 GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 VDD3P3_RTC XTAL_32K_P XTAL_32K_N DAC_1 DAC_2 GPIO19 GPIO20 VDD3P3_RTC_IO GPIO21 57 C7 10uF GND C6 1 A GND 2.0nH GPIO10 GPIO11 GPIO12 GPIO13 GPIO14 19 Submit Documentation Feedback 0.1uF VDD33 L1 499 0 R3 C5 CHIP_PU GPIO46 GPIO45 U0RXD U0TXD GPIO42 GPIO41 GPIO40 GPIO39 EPAD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 NC IO33 IO34 GND VDD33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 GND 40MHz(±10ppm) 100pF GPIO12 GPIO13 GPIO14 GPIO15 GPIO16 GPIO17 GPIO18 GPIO19 GPIO20 GPIO21 GPIO26 4 1 C2 GND GND XOUT C1 TBD Y1 2 C3 1uF GND GND XIN VDD33 GND B 1 GND VDD33 C 2 5 Schematics Espressif Systems D 4 0.1uF GND Figure 6: ESP32­S2­MINI­1U Schematics GND 6 Peripheral Schematics 6 Peripheral Schematics This is the typical application circuit of the module connected with peripheral components (for example, power supply, antenna, reset button, JTAG interface, and UART interface). C1 C3 22uF 0.1uF GND IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 GND JP4 1 2 1 2 Boot Option 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 63 GND GND GND GND 3V3 IO0 IO1 IO2 IO3 IO4 IO5 IO6 IO7 IO8 IO9 IO10 IO11 EN IO46 GND GND IO45 RXD0 TXD0 ESP32-S2-MINI-1/ESP32-S2-MINI-1U IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 GND IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 NC IO33 IO34 GND VDD33 GND U1 GND 65 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 EN IO46 C2 R1 GND C7 12pF(NC) 0(NC) 0(NC) R6 R4 X1: ESR = Max. 70 KΩ UART JP2 TMS TDI TDO TCK 1 2 3 4 1 2 3 4 JTAG R7 GND 0 0 C6 NC: No component. 1 2 3 4 GND 64 IO33 IO34 IO12 IO13 IO14 IO15 IO16 IO17 IO18 IO19 IO20 IO21 IO26 R3 R5 NC 2 X1 32.768kHz(NC) 1 2 3 4 TBD SW1 R2 1 C4 12pF(NC) GND JP1 IO45 RXD0 TXD0 IO42 IO41 IO40 IO39 IO38 IO37 IO36 IO35 C8 GND TBD VDD33 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 62 EPAD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND 61 60 59 58 57 56 55 54 53 52 51 50 49 48 47 46 GND TBD 0 EN 0.1uF GND JP3 USB_D+ USB_D- 2 1 C5 USB OTG 2 1 TBD GNDGND Figure 7: Peripheral Schematics Note: • Soldering the EPAD to the ground of the base board is not a must, though doing so can get optimized thermal performance. If users do want to solder it, they need to ensure that the correct quantity of soldering paste is applied. • To ensure the power supply to the ESP32-S2 series of chips during power-up, it is advised to add an RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and C = 1 µF. However, specific parameters should be adjusted based on the power-up 4 3 timing of the module and the power-up and reset 2 sequence timing of the chip. For ESP32-S2’s power-up and reset sequence timing diagram, please refer to Section Power Scheme in ESP32-S2 Series Datasheet. Espressif Systems 20 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 7 Physical Dimensions and PCB Land Pattern 7 Physical Dimensions and PCB Land Pattern 7.1 Physical Dimensions Unit: mm 0.8 0.7 Top view 4.5 1.2 2.4±0.15 15.5 14.8 13.2 12.3 11.5 10.6 0.5 13.55 Ø 0. 5 0.6 1.2 14 0.6 20±0.15 4.5 15.4±0.15 4.5 10.6 11.5 12.3 13.2 14.8 Side view Bottom view Figure 8: ESP32­S2­MINI­1 Physical Dimensions Espressif Systems 21 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 7 Physical Dimensions and PCB Land Pattern Unit: mm 0.8 0.85 0.6 1.2 0.7 Top view 4.5 1.2 0.5 14 0.6 14.8 13.2 12.3 11.5 10.6 3.2 13.55 15.4±0.15 1.6 15.4±0.15 2.4±0.15 4.5 10.6 11.5 12.3 13.2 14.8 Side view Bottom view Figure 9: ESP32­S2­MINI­1U Physical Dimensions Note: For information about tape, reel, and product marking, please refer to Espressif Module Package Information. Espressif Systems 22 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 7 Physical Dimensions and PCB Land Pattern 7.2 Recommended PCB Land Pattern Unit: mm : Pad Antenna Area Pin 1 1.2 4.5 0.6 4.5 1.2 20 14.8 13.2 12.3 11.5 10.6 0.6 4.5 15.4 10.6 11.5 12.3 13.2 14.8 Figure 10: ESP32­S2­MINI­1 Recommended PCB Land Pattern Espressif Systems 23 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 7 Physical Dimensions and PCB Land Pattern Unit: mm : Pad 15.4 Pin 1 4.5 0.6 15.4 14.8 13.2 12.3 11.5 10.6 4.5 1.2 1.2 0.6 10.6 11.5 12.3 13.2 14.8 Figure 11: ESP32­S2­MINI­1U Recommended PCB Land Pattern Espressif Systems 24 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 7 Physical Dimensions and PCB Land Pattern 7.3 Dimensions of External Antenna Connector ESP32-S2-MINI-1U uses the third generation external antenna connector as shown in Figure 12. This connector is compatible with the following connectors: • W.FL Series connector from Hirose • MHF III connector from I-PEX • AMMC connector from Amphenol Unit: mm Tolerance: +/-0.1 mm CONTACT 1.7 2.00±0.10 A A GROUND CONTACT 2.05±0.10 0.85 0.57 1.7 CONTACT 1.40 0.10 HOUSING HOUSING MATERIAL: THERMOPLASTIC, WHITE, UL 94V-0; SHELL CONTACT MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; SECTION: A-A SCALE: 1:1 SHELL MATERIAL: COPPER ALLOY, GOLD PLATED ALL OVER; PERFORMANCE: CONTACT RESISTANCE: 20mOHM Max. DIELECTRIC WITHSTANDING VOLTAGE: 200V AC FOR 1MINUTE; INSULATION RESISTANCE: 500MOHM Min. Figure 12: Dimensions of External Antenna Connector Espressif Systems 25 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 8 Product Handling 8 Product Handling 8.1 Storage Condition The products sealed in Moisture Barrier Bag (MBB) should be stored in a noncondensing atmospheric environment of < 40 °C/90%RH. The module is rated at moisture sensitivity level (MSL) 3. After unpacking, the module must be soldered within 168 hours with factory conditions 25±5 °C and /60%RH. The module needs to be baked if the above conditions are not met. 8.2 ESD • Human body model (HBM): 2000 V • Charged-device model (CDM): 500 V • Air discharge: 6000 V • Contact discharge: 4000 V Temperature (℃) 8.3 Reflow Profile Peak Temp. 235 ~ 250 ℃ 250 Preheating zone 150 ~ 200 ℃ 60 ~ 120 s 217 200 Reflow zone 217 ℃ 60 ~ 90 s Cooling zone –1 ~ –5 ℃/s Soldering time > 30 s Ramp-up zone 1 ~ 3 ℃/s 100 50 25 Time (sec.) 0 0 50 100 150 200 250 Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s Reflow zone — Temp.: >217 ℃ 60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy Figure 13: Reflow Profile Note: Solder the module in a single reflow. Espressif Systems 26 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 9 MAC Addresses and eFuse 9 MAC Addresses and eFuse The eFuse in ESP32-S2 family of chips has been burnt into 48-bit mac_address. The actual addresses the chip uses in station or AP modes correspond to mac_address in the following way: • Station mode: mac_address • AP mode: mac_address + 1 There are seven blocks in eFuse for users to use. Each block is 256 bits in size and has independent write/read disable controller. Six of them can be used to store encrypted key or user data, and the remaining one is only used to store user data. Espressif Systems 27 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback 10 Learning Resources 10 Learning Resources 10.1 Must­Read Documents The following link provides documents related to ESP32-S2. • ESP32-S2 Datasheet This document provides an introduction to the specifications of the ESP32-S2 hardware, including overview, pin definitions, functional description, peripheral interface, electrical characteristics, etc. • ESP-IDF Programming Guide It hosts extensive documentation for ESP-IDF ranging from hardware guides to API reference. • ESP32-S2 Technical Reference Manual The manual provides detailed information on how to use the ESP32-S2 memory and peripherals. • Espressif Products Ordering Information 10.2 Must­Have Resources Here are the ESP32-S2-related must-have resources. • ESP32-S2 BBS This is an Engineer-to-Engineer (E2E) Community for ESP32-S2 where you can post questions, share knowledge, explore ideas, and help solve problems with fellow engineers. Espressif Systems 28 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback Revision History Revision History Date Version Release notes • Added module variants embedded with the ESP32-S2FN4R2 chip • Added module description to the title page 2021-06-25 V1.0 • Updated Chapter 1 Module Overview • Added description in Section 7.3 Dimensions of External Antenna Connector • Replaced ”chip family” with ”chip series” following Espressif’s taxonomy • Added TWAI to Chapter 1 Module Overview • Updated Table 7 Current Consumption Characteristics 2020-12-17 V0.6 • Updated the capacitance value of RC delay circuit to 1 µF in Chapter 6 Peripheral Schematics • Updated note in Section 8.3 Reflow Profile 2020-09-23 V0.5 Espressif Systems Preliminary release. 29 ESP32-S2-MINI-1 & ESP32-S2-MINI-1U Datasheet v1.0 Submit Documentation Feedback Disclaimer and Copyright Notice Information in this document, including URL references, is subject to change without notice. ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO WARRANTIES TO ITS AUTHENTICITY AND ACCURACY. NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE. All liability, including liability for infringement of any proprietary rights, relating to use of information in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any intellectual property rights are granted herein. The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a registered trademark of Bluetooth SIG. www.espressif.com All trade names, trademarks and registered trademarks mentioned in this document are property of their respective owners, and are hereby acknowledged. Copyright © 2021 Espressif Systems (Shanghai) Co., Ltd. All rights reserved.