SPD81152A-2/TR

SPD81152A SPD81152A 1-Line, 400W, TVS Http//:www.sh-willsemi.com Descriptions SPD81152A protect sensitive electronics against voltage transients induced by inductive load switching and lightning. Ideal for the protection of I/O interfaces, VCC bus and other integrated circuits. Features  For surface mount application  Excellent clamping capability  Low profile package  Fast response time: Typically less than SMA (DO-214AC) 1.0ps from 0V to 16.7V  Low inductance  GPP Schematic Diagram Mechanical Data  Case: Molded plastic  Mounting position: Any  Weight: 0.063 grams YYWW UM YY WW UM = Year Code = Week Code = Device Code Marking (Top View) Order information Device SPD81152A-2/TR Will Semiconductor Ltd. 1 Dim (mm) Shipping 5.1*2.6*2.1 5000/Tape&Reel Revision 1.2, 2017/10/17 SPD81152A Absolute maximum ratings Rating Symbol Value Units Peak Pulse Power on 10/1000µs waveform PPPM 400 W Peak Pulse Current of on 10/1000µs waveform IPPM 16.4 A TJ -55~150 ℃ Operating Temperature TOP -40~125 ℃ Storage Temperature Range TSTG -55~150 ℃ Junction Temperature Notes : 2 1. Mounted on 5.0mm (0.03mm thick) Copper Pads to each teminal Electrical characteristics (TA=25 oC, unless otherwise noted) Reverse Breakdown Voltage Part Stand off VBR@ IT Number Voltage Current (V) (Bi) VR IT SPD81152A (V) MIN MAX 15.0 16.7 19.2 Test Maximum Maximum Clamping Peak Pulse Voltage VC Current @IPP IPP (A) (V) (A) 24.4 16.4 (mA) 1.0 Maximum Reverse Leakage IR @ VR (μA) 1.0 Typical characteristics (TA=25oC, unless otherwise noted) 100 100 10/1000µs 75 % Of Rated Power PPPM – Peak Pulse Power – (kW) Non-repetitive pulse waveform 10 1 50 25 0.1 0.1µs 0 1µs 10µs 100µs 1ms 0 10ms td - Pulse Width (sec.) Fig. 1 Peak Pulse Power Will Semiconductor Ltd. 25 50 75 100 125 TA – Ambient Temperature (℃) Fig. 2 Pulse Derating Curve 2 Revision 1.2, 2017/10/17 150 SPD81152A Package outline dimensions (Unit:mm) SMA D B A C E F G Symbol H Dimensions in millimeter Min. Max. A 3.990 4.500 B 2.540 2.790 C 4.930 5.280 D 1.250 1.650 E 0.152 0.305 F 1.980 2.290 G 0.780 1.520 H - 0.203 Recommend land pattern (Unit: mm) 2.1 2.0 2.1 Notes: 1.8 This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met. Will Semiconductor Ltd. 3 Revision 1.2, 2017/10/17