TAI-TECH
P1
SMD Power Inductor
TMPC0518HP-Series(G)-D
1. Features
1. Carbonyl Powder.
2. Compact design.
Halogen
3. High current,low DCR,high efficiency.
4. Very low acoustic noise and very low leakage flux noise.
Halogen-free
5. High reliability.
6. 100% Lead(Pb)-Free and RoHS compliant.
7. Operating temperature -40~+125℃(Including self - temperature rise)
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter .
3. Dimensions
C
L
D
H
A
1R0
2019
E
B
Recommend PC Board Pattern
G
Series
TMPC0518HP
A(mm)
B(mm)
5.7±0.3
C(mm)
5.2±0.2
1.6±0.2
D(mm)
1.1±0.3
E(mm)
2.5±0.3
4. Part Numbering
TMPC
0518
HP
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
F: Code
-
1R0
MG
D
E
-
L(mm)
G(mm)
H(mm)
6.2
2.2
2.8
Note: 1. The above PCB layout reference only.
2. Recommend solder paste thickness at
0.12mm and above.
D
F
BxC
H:Carbonyl Powder,P:PAD broaden
1R0=1.00uH
M=±20% ,Y=±30%
Marking: Black.1R0 and 2019(20 YY,19 WW,follow production date).
TAI-TECH
P2
5. Specification
Part Number
Inductance
L0 (uH)±20%
I rms ( A )
I sat ( A )
DCR(mΩ)
Typ.@25℃
DCR(mΩ)
Max.@25℃
TMPC0518HP-R15YG-D
0.15±30%
15.5
27.0
3.5
3.9
TMPC0518HP-R22MG-D
0.22
13.0
22.0
4.2
5.0
TMPC0518HP-R33MG-D
0.33
11
15
7.5
8.6
TMPC0518HP-R47MG-D
0.47
10
14
9.8
11.3
TMPC0518HP-R56MG-D
0.56
9.5
13.5
11
13
TMPC0518HP-R68MG-D
0.68
9
13
12.4
14.3
TMPC0518HP-1R0MG-D
1.0
6.8
10
18.2
21
TMPC0518HP-1R5MG-D
1.5
6.0
9.0
26
30
TMPC0518HP-2R2MG-D
2.2
4.5
7.5
42
48.3
TMPC0518HP-3R3MG-D
3.3
3.5
5.0
60
69
TMPC0518HP-4R7MG-D
4.7
3.0
4.5
85
98
TMPC0518HP-5R6MG-D
5.6
2.5
4.0
110
127
TMPC0518HP-6R8MG-D
6.8
2.4
3.5
118
137
TMPC0518HP-8R2MG-D
8.2
2.3
3.0
143
165
TMPC0518HP-100MG-D
10.0
2.3
2.8
165
190
TMPC0518HP-150MG-D
15.0
1.7
2.3
275
318
Note:
1. Test frequency : Ls : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃
5. Saturation Current (Isat) will cause L0 to drop approximately 30%.
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
6. Typical Performance Curves
P3
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