HYG060N08NS1D

HYG060N08NS1D/U/V N-Channel Enhancement Mode MOSFET Feature  Pin Description 80V/80A RDS(ON)=5.7 mΩ(typ.)@VGS = 10V  100% Avalanche Tested  Reliable and Rugged  G D S G Lead-Free and Green Devices Available (RoHS Compliant) G TO-252-2L D D S TO-251-3L TO-251-3S Applications  Switching application  Power management for inverter systems N-Channel MOSFET Ordering and Marking Information Package Code D: TO-252-2L D U V G060N08 G060N08 G060N08 XYMXXXXXX XYMXXXXXX XYMXXXXXX U: TO-251-3L V:TO-251-3S Date Code XYMXXXXXX Note: HUAYI lead-free products contain molding compounds/die attach materials and 100% matte tin plate TermiNation finish;which are fully compliant with RoHS. HUAYI lead-free products meet or exceed the lead-Free requirements of IPC/JEDEC J-STD-020 for MSL classification at lead-free peak reflow temperature. HUAYI defines “Green” to mean lead-free (RoHS compliant) and halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by weight). HUAYI reserves the right to make changes, corrections, enhancements, modifications, and improvements to this pr -oduct and/or to this document at any time without notice. www.hymexa.com V1.0 1 S HYG060N08NS1D/U/V Absolute Maximum Ratings Symbol Parameter Rating Unit Common Ratings (Tc=25°C Unless Otherwise Noted) VDSS Drain-Source Voltage 80 V VGSS Gate-Source Voltage ±20 V TJ Junction Temperature Range -55 to 175 °C TSTG Storage Temperature Range -55 to 175 °C Tc=25°C 80 A Tc=25°C 300 A Tc=25°C 80 A Tc=100°C 56 A Tc=25°C 75 W Tc=100°C 37.5 W 2 °C/W 110 °C/W 205 mJ IS Source Current-Continuous(Body Diode) Mounted on Large Heat Sink IDM Pulsed Drain Current * ID Continuous Drain Current PD Note: Maximum Power Dissipation RJC Thermal Resistance, Junction-to-Case RJA Thermal Resistance, Junction-to-Ambient ** EAS SinglePulsed-Avalanche Energy *** L=0.3mH * Repetitive rating；pulse width limited by max.junction temperature. ** Surface mounted on 1in2 FR-4 board. *** Limited by TJmax , starting TJ=25°C, L = 0.3mH, RG= 25Ω, VGS =10V. Electrical Characteristics(Tc =25°C Unless Otherwise Noted) Symbol Parameter Test Conditions HYG060N08NS1 Unit Min Typ. Max 80 - - V - - 1 μA - - 50 μA Static Characteristics BVDSS Drain-Source Breakdown Voltage IDSS Drain-to-Source Leakage Current VGS(th) IGSS RDS(ON) VGS=0V,IDS= 250μA VDS= 80V,VGS=0V TJ=125°C Gate Threshold Voltage VDS=VGS, IDS= 250μA 2 3 4 V Gate-Source Leakage Current VGS=±20V,VDS=0V - - ±100 nA Drain-Source On-State Resistance VGS= 10V,IDS=40A - 5.7 6.5 mΩ ISD=40A,VGS=0V - 0.94 1.2 V - 45 - ns - 63 - nC Diode Characteristics VSD Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge ISD=40A,dISD/dt=100A/μs www.hymexa.com V1.0 2 HYG060N08NS1D/U/V Electrical Characteristics (Cont.) (Tc =25°C Unless Otherwise Noted) Symbol Parameter Test Conditions HYG060N08NS1 Min Typ. Max Unit Dynamic Characteristics RG Gate Resistance VGS=0V,VDS=0V,F=1MHz - 3.2 - Ciss Input Capacitance VGS=0V, - 2960 - Coss Output Capacitance VDS= 25V, - 1150 - Crss Reverse Transfer Capacitance Frequency=1.0MHz - 60 - td(ON) Turn-on Delay Time - 13 - Tr Turn-on Rise Time VDD= 40V,RG=4.0Ω, - 69 - td(OFF) Turn-off Delay Time IDS= 40A,VGS= 10V - 33 - - 84 - - 48 - - 15 - - 13 - Tf Turn-off Fall Time Gate Charge Ω pF ns Characteristics Qg Total Gate Charge Qgs Gate-Source Charge Qgd Gate-Drain Charge VDS = 64V, VGS= 10V, IDs= 40A nC Note: *Pulse test，pulse width ≤ 300us，duty cycle ≤ 2% www.hymexa.com V1.0 3 HYG060N08NS1D/U/V Typical Operating Characteristics ID-Drain Current(A) Voltage Figure 2: Drain Current Power Dissipation (w) Figure 1: Power Dissipation Tc-Case Temperature(℃) Tc-Case Temperature(℃) Impedance Thermal Normalized Transient Figure 4: Thermal Transient Impedance Zθ jc Voltage ID-Drain Current(A) Figure 3: Safe Operation Area Maximum Effective Transient Thermal Impedance, Junction-to-Case RDS(ON)-ON-Resistance(mΩ) VDS-Drain-Source Voltage (V) Voltage Figure 6: Drain-Source On Resistance Voltage Figure 5: Output Characteristics ID-Drain Current(A) VDS-Drain-Source Voltage(V) ID-Drain Current(A) www.hymexa.com V1.0 4 HYG060N08NS1D/U/V Typical Operating Characteristics(Cont.) Voltage IS-Source Current (A) Figure 8: Source-Drain Diode Forward Voltage Normalized On-Resistance Figure 7: On-Resistance vs. Temperature Tj-Junction Temperature (℃) VSD-Source-Drain Voltage(V) Figure 10: Gate Charge Characteristics VGS-Gate-Source Voltage (V) Voltage C-Capacitance(pF) 12 VDS-Drain-Source Voltage (V) Voltage Figure 9: Capacitance Characteristics Q G-Gate Charge (nC) www.hymexa.com V1.0 5 HYG060N08NS1D/U/V Avalanche Test Circuit Switching Time Test Circuit Gate Charge Test Circuit www.hymexa.com V1.0 6 HYG060N08NS1D/U/V Device Per Unit Package Type Unit Quantity TO-252-2L TO-252-2L TO-251-3L TO-251-3S Tube Reel Tube Tube 75 2500 75 75 Package Information TO-252-2L COMMON DIMENSIONS SYMBOL mm MIN NOM MAX A 2.20 2.30 2.40 A1 0.00 - 0.20 A2 0.97 1.07 1.17 b 0.68 0.78 0.90 b3 5.20 5.33 5.50 c 0.43 0.53 0.63 D 5.98 6.10 6.22 D1 5.30REF E 6.40 6.60 6.80 E1 4.63 - - e www.hymexa.com 2.286BSC H 9.40 10.10 10.50 L 1.38 1.50 1.75 L1 2.90REF L2 0.51BSC L3 0.88 - 1.28 L4 - - 1.00 L5 1.65 1.80 1.95 θ 0° - 8° V1.0 7 HYG060N08NS1D/U/V TO-251-3L COMMON DIMENSIONS SYMBOL mm MIN NOM MAX A 2.20 2.30 2.40 A2 0.97 1.07 1.17 b 0.68 0.78 0.90 b2 0.00 0.04 0.10 b2' 0.00 0.04 0.10 b3 5.20 5.33 5.50 c 0.43 0.53 0.63 D 5.98 6.10 6.22 D1 5.30REF E 6.40 6.60 6.80 E1 4.63 - - e 2.286BSC H 16.22 16.52 16.82 L1 9.15 9.40 9.65 L3 0.88 1.02 1.28 L5 1.65 1.80 1.95 www.hymexa.com V1.0 8 HYG060N08NS1D/U/V TO-251-3S COMMON DIMENSIONS SYMBOL mm MIN NOM MAX A 2.20 2.30 2.40 A2 0.97 1.07 1.17 b 0.68 0.78 0.90 b3 5.20 5.33 5.50 c 0.43 0.53 0.63 D 5.98 6.10 6.22 D1 5.30REF E 6.40 6.60 6.80 E1 4.63 - - e 2.286BSC H 10.00 11.22 11.44 L1 3.90 4.10 4.30 L3 0.88 1.02 1.28 L5 1.65 1.80 1.95 www.hymexa.com V1.0 9 HYG060N08NS1D/U/V Classification Profile Classification Reflow Profiles Profile Feature Preheat & Soak Temperature min (Tsmin) Temperature max (Tsmax) Time (Tsmin to Tsmax) (ts) Average ramp-up rate (Tsmaxto TP) Liquidous temperature (TL) Time at liquidous (tL) Peak package body Temperature (Tp)* Time (tP)** within 5°C of the specified classification temperature (Tc) Average ramp-down rate (Tpto Tsmax) Time 25°C to peak temperature Sn-Pb Eutectic Assembly Pb-Free Assembly 100 °C 150 °C 150 °C 200 °C 60-120 seconds 60-120 seconds 3 °C/second max. 3°C/second max. 183 °C 217 °C 60-150 seconds 60-150 seconds See Classification Temp in table 1 SeeClassification Tempin table 2 20** seconds 30** seconds 6 °C/second max. 6 °C/second max. 6 minutes max. 8 minutes max. *Tolerance for peak profile Temperature (T p) is defined as a supplier minimum and a user maximum. ** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum. www.hymexa.com V1.0 10 HYG060N08NS1D/U/V Table 1.SnPb Eutectic Process – Classification Temperatures (Tc) Package Volume mm³ Volume mm³ Thickness