RS3007
300mA, Low Power Consumption,
High Voltage CMOS LDO Regulator
1 FEATURES
3 DESCRIPTIONS
•
Low Quiescent Current IQ: 3uA (TYP)
•
300mA Nominal Output Current
•
Low Dropout Voltage
•
Low Temperature Coefficient
•
High Input Voltage (up to 45V)
•
Output Voltage Accuracy: ±1%/±2%
•
Fixed Output Voltage: 1.8V, 2.5V, 3.0V, 3.3V
and 5.0V
•
Current Limit Protection
•
Over Temperature Protection
•
SOT23-3, SOT23-5, SOT89-3L and SOT223
and SOP8 Packages
2 APPLICATIONS
•
Smart Power Network Equipment
•
Portable Power Tools
•
BMS systems
•
Motor control system/Industrial control
system
•
Power Meter/Instrument
•
White Goods
•
Vehicle-mounted system
•
Battery-Powered Equipment
•
Automotive Head Unit
•
Security Equipment
•
Communication Equipment
The RS3007 series is a set of Low power high voltage
regulators implemented in CMOS technology. Which
can provide 300mA output current. The device allows
input voltage as high as 45V.It is very suitable for multicell battery systems, bus voltage power supply
systems and other high DC voltage systems. Wide
input voltage can make it well withstand the impact of
surge voltage and ensure the stability of output
voltage.
The RS3007 series only consume 3uA (typical), Which
is particularly important in battery power system, can
reduce the standby power consumption of the whole
system.
The RS3007 is available in Green SOT23-3, SOT23-5,
SOT89-3L and SOT223 and SOP8 packages, for the
different application’s requirements.
Device Information (1)
PART NUMBER
RS3007
(1)
PACKAGE
BODY SIZE (NOM)
SOT23-3(3)
1.60mm×2.92mm
SOT23-5(5)
1.60mm×2.92mm
SOT89-3L(3)
2.45mm×4.50mm
SOT223(3)
3.50mm×7.00mm
SOP8(8)
4.90mm×3.90mm
For all available packages, see the orderable addendum at the
next page of the data sheet.
4 Typical Application Schematic
VIN
VIN
CIN
1uF
VOUT
VOUT
RS3007
COUT
1uF
GND
REV A.4
1 / 20
www.run-ic.com
RS3007
Table of Contents
1 FEATURES .......................................................................................................................................................1
2 APPLICATIONS ................................................................................................................................................1
3 DESCRIPTIONS ................................................................................................................................................1
4 Typical Application Schematic.......................................................................................................................1
5 Revision History ..............................................................................................................................................3
6 PACKAGE/ORDERING INFORMATION (1) ......................................................................................................4
7 Pin Configuration and Functions (Top View) ...............................................................................................6
8 Specifications ..................................................................................................................................................8
8.1 Absolute Maximum Ratings ........................................................................................................................8
8.2 ESD Ratings................................................................................................................................................8
8.3 Recommended Operating Conditions .........................................................................................................8
8.4 Thermal Information ....................................................................................................................................9
8.5 ELECTRICAL CHARACTERISTICS ........................................................................................................ 10
8.6 TYPICAL CHARACTERISTICS ............................................................................................................... 11
9 DETAILED DESCRIPTION ............................................................................................................................ 13
9.1 Overview .................................................................................................................................................. 13
9.2 Functional Block Diagram ........................................................................................................................ 13
9.3 Thermal Considerations ........................................................................................................................... 13
9.4 Applications Note: .................................................................................................................................... 13
10 PACKAGE OUTLINE DIMENSIONS ........................................................................................................... 14
11 TAPE AND REEL INFORMATION .............................................................................................................. 19
2 / 20
www.run-ic.com
RS3007
5 Revision History
Note: Page numbers for previous revisions may different from page numbers in the current version.
VERSION
Change Date
A.1
2020/03/16
A.2
2020/06/03
A.3
2020/09/11
A.4
2023/05/29
Change Item
Initial version completed
1) Added part-number to ordering information table
2) Added SOT223(L Type) package
1) Added part-number to ordering information table
2) Added SOT223 and SOP8 package
3) Added 3.0 and 5.0 VOUT Accuracy of 1%
1) Change SOT23-5, SOT23-3 and SOT89-3L (L-Type) Thermal Information on
Page 6 @A.3 Version.
2) Added the TAPE AND REEL INFORMATION
3) Update RS3007-2.5YE3 PACKAGE OPTION on Page 5 @A.3 Version.
4) Delete RS3007-3.3AYD3 ORDERING NUMBER on Page 5 @A.3 Version.
3 / 20
www.run-ic.com
RS3007
6 PACKAGE/ORDERING INFORMATION (1)
PRODUCT
ORDERING
NUMBER
VOUT(V)
VOUT
Accuracy
PACKAGE
LEAD
PACKAGE
MARKING(2)
RS3007-1.8YF3
1.8
±2%
SOT23-3
SE18
Tape and Reel,3000
RS3007-1.8SYF5
1.8
±2%
SOT23-5
SE18
Tape and Reel,3000
SE18L
Tape and Reel,1000
RS3007-1.8
PACKAGE OPTION
RS3007-1.8YE3L
1.8
±2%
SOT89-3L
L-Type
RS3007-1.8YE3
1.8
±2%
SOT89-3L
SE18
Tape and Reel,1000
RS3007-2.5YF3
2.5
±2%
SOT23-3
SE25
Tape and Reel,3000
RS3007-2.5SYF5
2.5
±2%
SOT23-5
SE25
Tape and Reel,3000
RS3007-2.5YE3L
2.5
±2%
SOT89-3L
L-Type
SE25L
Tape and Reel,1000
RS3007-2.5YE3
2.5
±2%
SOT89-3L
SE25
Tape and Reel,1000
RS3007-3.0YF3
3.0
±2%
SOT23-3
SE30
Tape and Reel,3000
RS3007-3.0SYF5
3.0
±2%
SOT23-5
SE30
Tape and Reel,3000
RS3007-3.0YE3L
3.0
±2%
SOT89-3L
L-Type
SE30L
Tape and Reel,1000
RS3007-3.0YE3
3.0
±2%
SOT89-3L
SE30
Tape and Reel,1000
RS3007-3.0YD3
3.0
±2%
SOT223
SE30
Tape and Reel,2500
RS3007-3.0YD3L
3.0
±2%
SOT223
L-Type
SE30L
Tape and Reel,2500
RS3007-3.3YF3
3.3
±2%
SOT23-3
SE33
Tape and Reel,3000
RS3007-3.3SYF5
3.3
±2%
SOT23-5
SE33
Tape and Reel,3000
RS3007-3.3YE3L
3.3
±2%
SOT89-3L
L-Type
SE33L
Tape and Reel,1000
RS3007-3.3YE3
3.3
±2%
SOT89-3L
SE33
Tape and Reel,1000
RS3007-3.3YD3
3.3
±2%
SOT223
SE33
Tape and Reel,2500
RS3007-3.3YD3L
3.3
±2%
SOT223
L-Type
SE33L
Tape and Reel,2500
RS3007-5.0YF3
5.0
±2%
SOT23-3
SE50
Tape and Reel,3000
RS3007-5.0SYF5
5.0
±2%
SOT23-5
SE50
Tape and Reel,3000
RS3007-5.0YE3L
5.0
±2%
SOT89-3L
L-Type
SE50L
Tape and Reel,1000
RS3007-5.0YE3
5.0
±2%
SOT89-3L
SE50
Tape and Reel,1000
RS3007-5.0YD3
5.0
±2%
SOT223
SE50
Tape and Reel,2500
±2%
SOT223
L-Type
SE50L
Tape and Reel,2500
RS3007-2.5
RS3007-3.0
RS3007-3.3
RS3007-5.0
RS3007-5.0YD3L
5.0
4 / 20
www.run-ic.com
RS3007
PRODUCT
RS3007-3.0
RS3007-3.3
RS3007-5.0
ORDERING
NUMBER
VOUT(V)
VOUT
Accuracy
PACKAGE
LEAD
PACKAGE
MARKING(2)
PACKAGE OPTION
RS3007-3.0AYF3
3.0
±1%
SOT23-3
SE30
Tape and Reel,3000
RS3007-3.0ASYF5
3.0
±1%
SOT23-5
SE30
Tape and Reel,3000
RS3007-3.0AYK
3.0
±1%
SOP-8
SE30
Tape and Reel,4000
RS3007-3.3AYF3
3.3
±1%
SOT23-3
SE33
Tape and Reel,3000
RS3007-3.3ASYF5
3.3
±1%
SOT23-5
SE33
Tape and Reel,3000
RS3007-3.3AYK
3.3
±1%
SOP-8
SE33
Tape and Reel,4000
RS3007-5.0AYF3
5.0
±1%
SOT23-3
SE50
Tape and Reel,3000
RS3007-5.0ASYF5
5.0
±1%
SOT23-5
SE50
Tape and Reel,3000
RS3007-5.0AYK
5.0
±1%
SOP-8
SE50
Tape and Reel,4000
NOTE:
(1) This information is the most current data available for the designated devices. This data is subject to change without notice and revision
of this document. For browser-based versions of this data sheet, refer to the right-hand navigation.
(2) There may be additional marking, which relates to the lot trace code information (data code and vendor code), the logo or the
environmental category on the device.
5 / 20
www.run-ic.com
RS3007
7 Pin Configuration and Functions (Top View)
VIN
VOUT
NC
3
5
4
SEXX
SEXX
1
GND
2
1
2
VOUT
VIN
GND
SOT23-3
SOT23-5
VIN
GND
SEXXL
SEXX
3
1
EN
VIN
3
GND
VOUT
SOT223
SEXXL
1
2
3
1
2
3
GND
VIN
VOUT
VOUT
GND
VIN
SOT89-3L(L-Type)
2
SOT89-3L
1
2
3
GND
VOUT
VIN
SOT223(L-Type)
NOTE: XX indicate Output Voltage, xx indicate Date Code
For example: SE33(VOUT=3.3V)
PIN DESCRIPTION
PIN
NAME
SOT23-3
SOT23-5
GND
1
2
SOT89-3L
(L-Type)
1
VOUT
2
5
VIN
3
EN
NC
FUNCTION
2
SOT223
(L-Type)
1
3
1
2
3
1
2
3
3
1
/
3
/
/
/
/
/
4
/
/
/
/
SOT89-3L
6 / 20
SOT223
2
Ground
Regulator Output.
Recommended output
capacitor range: 1μF to 10μF.
Regulator Input. Up to 45V
input voltage. At least 1μF
supply bypass capacitor is
recommended.
Enable pin. Drive this pin high
to enable the device, Low to
put the device into low current
shutdown.
No internal connection
www.run-ic.com
RS3007
Pin Configuration and Functions (Top View)
EN
1
8
GND
VIN
2
7
GND
VOUT
3
6
GND
NC
4
5
GND
SOIC-8(SOP8)
PIN DESCRIPTION
PIN
NAME
FUNCTION
SOIC-8(SOP8)
EN
1
VIN
2
VOUT
3
Enable pin.
Drive this pin high to enable the device, Low to put the device into low current shutdown.
Regulator Input. Up to 45V input voltage.
At least 1μF supply bypass capacitor is recommended.
Regulator Output. Recommended output capacitor range: 1μF to 10μF.
NC
4
No internal connection
GND
5, 6, 7, 8
Ground
7 / 20
www.run-ic.com
RS3007
8 Specifications
8.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN
MAX
UNIT
V
VIN
Input voltage
-0.3
55
VEN
VEN voltage range
-0.3
VIN
V
TJ
PN Junction temperature (3)
175
°C
PD
Continuous power dissipation (4)
Tstg
Storage temperature range
(1)
(2)
(3)
(4)
-40
W
Internally limited
-65
°C
150
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages are with respect to the GND pin.
The maximum power dissipation is a function of TJ(MAX), RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD = (T J(MAX) - TA) / RθJA. All numbers apply for packages soldered directly onto a PCB.
Internal thermal shutdown circuitry protects the device from permanent damage. The actual chip output current is subject to the inputoutput voltage difference, ambient temperature and PCB heat dissipation design.
8.2 ESD Ratings
The following ESD information is provided for handling of ESD-sensitive devices in an ESD protected area only.
V(ESD)
Electrostatic discharge
VALUE
UNIT
Human-body model (HBM)
±4000
V
Charge device model (CDM)
±1500
V
ESD SENSITIVITY CAUTION
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
8.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) (1)
MIN
MAX
UNIT
VIN
Input supply voltage
2.5
45
V
IOUT
Output current
0
300
mA
CIN
Capacitor of VIN pin
1
10
uF
COUT
Capacitor of VOUT pin
1
10
uF
ESR
Equivalent series resistance
5
100
mΩ
TA
Operating temperature
-40
+85 (2)
°C
(1) All voltages are with respect to the GND pin.
(2) The chip’s operating temperature is determined by the junction temperature (TJ), the relationship between TA and TJ, please refer to the
application note as below. The larger the TA, the smaller the space left for the chip temperature rise.
8 / 20
www.run-ic.com
RS3007
8.4 Thermal Information
RS3007
THERMAL METRIC
SOT233
SOT2
3-5
5
PINS
SOT893L
SOT89-3L
(L-Type)
SOT223
(L-Type)
SOT223
SOIC-8
3 PINS
3 PINS
3 PINS
3 PINS
8 PINS
312.5
250
75
208.3
120
84.5
110
°C/W
0.4
0.5
1.7
0.6
1.1
1.5
1.2
W
3 PINS
RθJA
PD
Junction-to-ambient
thermal resistance
Power Dissipation (1)
UNIT
(1) Internal thermal shutdown circuitry protects the device from permanent damage. The actual chip output current is subject to the inputoutput voltage difference, ambient temperature and PCB heat dissipation design.
9 / 20
www.run-ic.com
RS3007
8.5 ELECTRICAL CHARACTERISTICS
(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise
noted.)
PARAMETER
Input Voltage
SYMBOL
TEMP
MIN
MAX
UNITS
+25°C
2.5(1)
45
V
IOUT = 10mA
+25°C -2.0
2.0
%
IOUT = 10mA, A Type
+25°C -1.0
1.0
%
IQ
No load
+25°C
3.0
4.0
uA
IQ-OFF
VEN =0V
+25°C
0.1
1.0
uA
300
350
-
mA
VOUT =1.8V
-
450
550
VOUT =2.5V
-
385
485
-
350
450
VOUT =3.3V
-
335
435
VOUT =5.0V
-
300
400
+25°C
-
0.05
0.2
%/V
VIN
Output Voltage Accuracy (2)
Ground Pin Current
Shutdown Current
Max Output Current
CONDITIONS
(3)
Dropout Voltage (4)
Line Regulation
+25°C
VDROP
IOUT=
100mA
VOUT =3.0V
+25°C
ΔVOUT
VIN = VOUT + 2V to 36V, IOUT = 1mA
ΔVIN × VOUT
TYP
mV
Load Regulation
ΔVOUT
VIN =VOUT+1V, IOUT = 1mA to 50mA
+25°C
-
5
20
mV
Output Current Limit
I_LMT
VIN =VOUT+1V
+25°C
300
450
-
mA
Short-Circuit Current
Ishort
VOUT = 0
+25°C
-
100
-
mA
-
72
-
-
77
-
-
60
-
1.2
-
-
V
-
-
0.4
V
-
100
-
ppm/°C
-
100
-
uVrms
-
170
-
°C
-
20
-
°C
Power Supply Rejection
Ratio
EN Input Threshold
PSRR
f = 217Hz
VOUT = 3.3V,
f = 1KHz
IOUT = 10mA
f = 10KHz
VENH
VENL
ΔVOUT
Output Voltage Temperature
IOUT = 1mA
Coefficient (5)
ΔTA × VOUT
VIN =VOUT+1V, IOUT = 1mA, VOUT=3.0V
Output Noise Voltage
en
f = 10Hz to 100KHz
Thermal Shutdown
TSHDN
Temperature
Thermal Shutdown
TSDH
Hysteresis Temperature
+25°C
+25°C
FULL
dB
NOTES:
1. VIN >= VOUT (NOMINAL), whichever is greater.
2. Option ±1% output voltage accuracy.
3. Maximum output current is affected by the PCB layout, size of metal trace, the thermal conduction path between metal layers, ambient
temperature and the other environment factors of system. Attention should be paid to the dropout voltage when V IN < VOUT + VDROP.
4. The dropout voltage is defined as VIN - VOUT, when VOUT is 100mV below the value of VOUT for VIN = VOUT (NOMINAL) + 2V.
5. Output voltage temperature coefficient is defined as the worst-case voltage change divided by the total temperature range.
10 / 20
www.run-ic.com
RS3007
8.6 TYPICAL CHARACTERISTICS
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise
noted.)
VIN=5.3V to 6.3V,IOUT=50mA
VIN=0V to 5.3V,I OUT=50mA
2V/div
VOUT
2V/div
VIN
50mV/div
VOUT
1V/div
VIN
Time(100us/div)
Time(1ms/div)
Figure 1. Line Transient Response
Figure 2. Power-Up/Power-Down Output
Waveform
VOUT=3.3V
VOUT=3.3V
VOUT
50mA/div
100mA/div
IOUT
20mV/div
50mV/div
VOUT
IOUT
IOUT=10mA to 50mA
IOUT=1mA to 100mA
Time(500us/div)
Time(500us/div)
Figure 4. Load Transient Response
Figure 3. Load Transient Response
3.31
3.31
VOUT=3.3V
Output Voltage(V)
Output Voltage(V)
VOUT=3.3V
3.305
3.3
3.295
3.3
3.29
3.28
3.27
3.29
4
14
24
34
44
0
54
50
100
150
200
250
300
Output Current(mA)
Input Voltage(V)
Figure 5. Line Regulation
Figure 6. Load Regulation
11 / 20
www.run-ic.com
RS3007
TYPICAL CHARACTERISTICS
3.33
1400
3.32
1200
3.31
1000
VDROP(mV)
Output voltage(V)
NOTE: The graphs and tables provided following this note are a statistical summary based on a limited number of samples
and are provided for informational purposes only.
(VIN = VOUT + 2V, CIN = COUT = 1μF, VOUT = 3.3V, Full = -40°C to +85°C, typical values are at TA = +25°C, unless otherwise
noted.)
3.3
3.29
3.28
800
600
400
3.27
1#
2#
3#
3.26
3.25
-40 -20
0
20
40
60
Temperature(℃)
1#
2#
3#
200
0
80 100 120
0
100
150
200
250
300
350
IOUT(mA)
Figure 7. VOUT vs Temperature
Figure 8. VDROP vs IOUT
5
1800
4.5
1600
4
1400
3.5
VDROP(mV)
1200
3
IQ(uA)
50
1000
2.5
2
800
600
1.5
1
0.5
0
-40 -20
0
20
40
60
-40℃
25℃
85℃
125℃
400
1#
2#
3#
200
0
80 100 120
0
Temperature(℃)
50
100
150
200
250
300
350
IOUT(mA)
Figure 9. IQ vs Temperature
Figure 10. VDROP - IOUT vs Temperature
3.35
3.33
3.34
3.32
3.33
3.32
VOUT(V)
VOUT(V)
3.31
3.31
3.3
3.29
3.29
-40℃
25℃
85℃
125℃
3.28
3.27
0
50
100
150
200
250
3.3
-40℃
25℃
85℃
125℃
3.28
3.27
IOUT=10mA
3.26
300
5
IOUT(mA)
10
15
20
25
VIN(V)
30
35
40
Figure 12. VOUT - VIN vs Temperature
Figure 11. VOUT - IOUT vs Temperature
12 / 20
www.run-ic.com
RS3007
9 DETAILED DESCRIPTION
9.1 Overview
The RS3007 low-dropout regulators (LDO) consumes only 3µA of quiescent current at light load and delivers
excellent line and load transient performance. These characteristics, combined with low noise and good PSRR
with low dropout voltage, make this device ideal for portable consumer applications.
9.2 Functional Block Diagram
9.3 Thermal Considerations
When the junction temperature is too high, the thermal protection circuitry sends a signal to the control logic
that will shut down the IC. The IC will restart when the temperature has sufficiently cooled down. The maximum
power dissipation is dependent on the thermal resistance of the case and the circuit board, the temperature
difference between the die junction and the ambient air, and the rate of air flow. The GND pin must be connected
to the ground plane for proper dissipation.
9.4 Applications Note:
1) The phase compensation circuit and ESR of the output capacitor are used inside the circuit to compensate,
so a capacitor larger than 1.0uF must be connected to the ground.
2) It is recommended to use 1uF polar capacitors for input and output, and to keep the capacitors as close to
the VIN and VOUT pins of LDO as possible.
3) Pay attention to the use conditions of input and output voltages and load currents to avoid the power
consumption (PD) inside the IC exceeding the maximum power consumption allowed by the package.
PD = (VIN - VOUT) × IOUT
TPN = PD × RθJA +T
TPN is junction temperature
T is ambient temperature。
4) When the input voltage VIN is greater than 2.5V, if VIN is also higher than the output set value plus the device
dropout voltage, VOUT is equal to the set value. Otherwise, VOUT is equal to VIN minus the dropout voltage. If
VIN lower than 2.5V, the VOUT is:
VOUT = VIN - VDropout
13 / 20
www.run-ic.com
RS3007
10 PACKAGE OUTLINE DIMENSIONS
SOT23-3
D
1.90
b
2.59
E1
E
0.99
0.95
0.69
e
e1
RECOMMENDED LAND PATTERN (Unit: mm)
0.2
A A2
c
θ
L
A1
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950(BSC)
0.037(BSC)
e1
1.800
2.000
0.071
0.079
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
14 / 20
www.run-ic.com
RS3007
SOT23-5
D
1.90
b
2.59
E1
E
0.99
0.95
0.69
e
e1
RECOMMENDED LAND PATTERN (Unit: mm)
0.2
A A2
c
θ
L
A1
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.050
1.250
0.041
0.049
A1
0.000
0.100
0.000
0.004
A2
1.050
1.150
0.041
0.045
b
0.300
0.500
0.012
0.020
c
0.100
0.200
0.004
0.008
D
2.820
3.020
0.111
0.119
E
1.500
1.700
0.059
0.067
E1
2.650
2.950
0.104
0.116
e
0.950(BSC)
0.037(BSC)
e1
1.800
2.000
0.071
0.079
L
0.300
0.600
0.012
0.024
θ
0°
8°
0°
8°
15 / 20
www.run-ic.com
RS3007
SOT89-3L
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.400
1.600
0.055
0.063
b
0.320
0.520
0.013
0.020
b1
0.400
0.580
0.016
0.023
c
0.350
0.440
0.014
0.017
D
4.400
4.600
0.173
0.181
D1
1.550 REF
0.061 REF
E
2.300
2.600
0.091
0.102
E1
3.940
4.250
0.155
0.167
e
1.500 BSC
0.060 BSC
e1
3.000 BSC
0.118 BSC
L
0.900
1.200
16 / 20
0.035
0.047
www.run-ic.com
RS3007
SOT223
D
b2
E
E1
A
VIEW B
0.25
L
SEE VIEW B
A
e
e1
b
WITH PLATING
A2
c
A
BASE METAL
A1
SECTION A-A
Dimensions In Millimeters
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
-
1.800
-
0.071
A1
0.02
0.10
0.001
0.004
A2
1.55
1.65
0.061
0.065
b
0.66
0.84
0.026
0.033
b2
2.90
3.10
0.114
0.122
c
0.23
0.33
0.009
0.013
D
6.30
6.70
0.248
0.263
E
6.70
7.30
0.263
0.287
E1
3.30
3.70
0.130
0.145
e
2.30 BSC
0.090 BSC
e1
4.60 BSC
0.181 BSC
L
0.90
-
17 / 20
0.035
-
www.run-ic.com
RS3007
SOIC-8(SOP8)
b
e
5.2
E
E1
2.2
D
1.27
0.6
RECOMMENDED LAND PATTERN (Unit: mm)
A2
c
A
A1
L
Dimensions In Millimeters
θ
Dimensions In Inches
Symbol
Min
Max
Min
Max
A
1.350
1.750
0.053
0.069
A1
0.100
0.250
0.004
0.010
A2
1.350
1.550
0.053
0.061
b
0.330
0.510
0.013
0.020
c
0.170
0.250
0.007
0.010
D
4.800
5.000
0.189
0.197
e
1.270(BSC)
0.050(BSC)
E
5.800
6.200
0.228
0.244
E1
3.800
4.000
0.150
0.157
L
0.400
1.270
0.016
0.050
θ
0°
8°
0°
8°
NOTE:
A. All linear dimension is in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion. Mold flash and protrusion shall not exceed 0.15 per side.
D. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
E. REF: Reference Dimension, usually without tolerance, for information purposes only.
18 / 20
www.run-ic.com
RS3007
11 TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSION
Reel
Diameter
Reel Width(W1)
DIRECTION OF FEED
NOTE: The picture is only for reference. Please make the object as the standard.
KEY PARAMETER LIST OF TAPE AND REEL
SOT23-3
Reel
Diameter
7’’
Reel
Width(mm)
9.0
A0
(mm)
3.20
B0
(mm)
3.30
K0
(mm)
1.30
P0
(mm)
4.0
P1
(mm)
4.0
P2
(mm)
2.0
W
(mm)
8.0
Pin1
Quadrant
Q3
SOT23-5
7’’
9.5
3.20
3.20
1.40
4.0
4.0
2.0
8.0
Q3
SOT89-3L
7’’
13.2
4.85
4.45
1.85
4.0
8.0
2.0
12.0
Q3
SOT223
13’’
12.4
6.765
7.335
1.88
4.0
8.0
2.0
12.0
Q3
SOIC-8(SOP8)
13’’
12.4
6.40
5.40
2.10
4.0
8.0
2.0
12.0
Q1
Package Type
NOTE:
1. All dimensions are nominal.
2. Plastic or metal protrusions of 0.15mm maximum per side are not included.
19 / 20
www.run-ic.com
RS3007
IMPORTANT NOTICE AND DISCLAIMER
Jiangsu RUNIC Technology Co., Ltd. will accurately and reliably provide technical and reliability data (including
data sheets), design resources (including reference designs), application or other design advice, WEB tools,
safety information and other resources, without warranty of any defect, and will not make any express or implied
warranty, including but not limited to the warranty of merchantability Implied warranty that it is suitable for a
specific purpose or does not infringe the intellectual property rights of any third party.
These resources are intended for skilled developers designing with RUNIC products You will be solely
responsible for: (1) Selecting the appropriate products for your application; (2) Designing, validating and testing
your application; (3) Ensuring your application meets applicable standards and any other safety, security or
other requirements; (4) RUNIC and the RUNIC logo are registered trademarks of RUNIC INCORPORATED. All
trademarks are the property of their respective owners; (5) For change details, review the revision history
included in any revised document. The resources are subject to change without notice. Our company will not
be liable for the use of this product and the infringement of patents or third-party intellectual property rights due
to its use.
20 / 20
www.run-ic.com
工商网监
湘ICP备2023018690号
