CP30B1775018P

Technical Datasheet CP30_1775018 Cool Power Technologies 30W Series Isolated DC/DC Converter Features • • • • • • • • • • • • • • • • • • • Ultra-wide input voltage range: 9 – 36Vin Output: 3.3 V at 7.5 A, 25W max. Tiny 0.94” X 0.94” x 0.35” max ht (Thru-hole) 0.94” X 0.94” x 0.396” Surface Mount 1” x 1” x 0.41” Encapsulated Product RoHS 3 Directive 2015/863/EU No minimum load/capacitance required On-board input differential “PI" LC-filter Withstands 50 V input transients Fixed-frequency operation Meets UL94, V-0 flammability rating Full protection (OTP, OCP, OVP, UVLO w/auto-restart) Remote ON/OFF - positive or negative enable logic options Output voltage trim range: ±10% (see Output Voltage Trim Equations section) Weight: 0.266 oz [7.54 g] (open frame), 0.67 oz [19g] (encapsulated) Basic Insulation w/2250VDC I/O isolation (open frame), 1600VDC (encapsulated) Complies with UL/CSA60950-1, TUV per IEC/EN60950-1, 2nd edition Compliant to REACH (EC) No 1907/2006, 205 SVHC update Designed to meet Class B conducted emissions per FCC and EN55032 when used with external filter (see EMC Compliance section below.) Description The “Cool Power Technologies” CP30_1775018 DC-DC converter is an open frame isolated 1” X 1” DCDC module that conforms to industry standard pinout and trim equations. The converter operates over an input voltage range of 9 to 36 VDC, and provides a tightly regulated output voltage with an output current rating of 7.5 A. The output is fully isolated from the input and the converter meets Basic Insulation requirements with 2250VDC I/O isolation rating open frame, 1600VDC for the encapsulated version. The standard feature set includes remote On/Off (positive or negative enable), input undervoltage lockout, output overvoltage protection, overcurrent and short circuit protections, output voltage trim and overtemperature shutdown with hysteresis. The high efficiency of the CP30_1775018 allows operation over a wide ambient temperature range with minimal derating. www.dcdc.com 603-893-2330 - 1- 1- Technical Datasheet CP30_1775018 TABLE OF CONTENTS SECTION PAGE FEATURES & DESCRIPTION APPLICATION DIAGRAM 1 2 ELECTRICAL SPECIFICATIONS CHARACTERISTIC PERFORMANCE CURVES CHARACTERISTIC WAVEFORMS APPLICATION NOTES • • RIPPLE MEASUREMENTS TEST SET-UP OUTPUT VOLTAGE TRIM EQUATIONS • THERMAL DERATING • EMC COMPLIANCE MECHANICAL OUTLINE & PCB FOOTPRINT ORDERING INFORMATION 3 6 7 9 9 10 11 13 14 16 APPLICATION DIAGRAM www.dcdc.com 603-893-2330 - 2- 2- Technical Datasheet CP30_1775018 ELECTRICAL SPECIFICATIONS 9–36Vin, 3.3V/7.5Aout Conditions: TA = 25 ºC, Airflow = 300 LFM, Vin = 24 VDC, Cin = 100 µF, unless otherwise specified. Input Characteristics Parameter Conditions Min 1 Typ Max Unit Operating Input Voltage Range 9 24 36 VDC Input Under-Voltage Lock-out Turn-on Threshold Turn-off Threshold 8.8 8.2 9 8.4 9.2 8.7 VDC Input Voltage Transient 100ms 50 VDC Maximum Input Current VIN = 9VDC; IOUT = 7.5A 3.4 A Input Standby Current Converter Disabled 2 5 mA Input No-Load Current Converter Enabled 75 mA RMS 40 mA Input Reflected Ripple Current 5Hz to 50MHz See Fig 15 for setup 5 Input Voltage Ripple Rejection 120Hz 50 Short Circuit Input Current Inrush Current All - Conditions Min 3.251 10 mAPK-PK dB 0.1 A2/s Typ Max Unit 3.30 3.349 VDC 7.5 A 11 15 A Output Characteristics Parameter Output Voltage Set point Output Current 0 Output Current Limit Inception 9 Peak Short-Circuit Current 10mΩ Short 20 25 A RMS Short-Circuit Current 10mΩ Short 3 5 ARMS 4700 uF 50 mVPK-PK ±0.1 ±0.1 3.40 %Vo %Vo V External Load Capacitance3 Output Ripple and Noise 20 MHz bandwidth Output Regulation Line: Load: Overall Output Regulation: 0 1 uF Ceramic + 10uF Tantalum See Fig 16 for setup ±0.02 ±0.04 Over line, load & temp. 3.20 www.dcdc.com 603-893-2330 - 3- 3- Technical Datasheet CP30_1775018 ELECTRICAL SPECIFICATIONS (continued) 9–36Vin, 3.3V/7.5Aout Conditions: TA = 25 ºC, Airflow = 300 LFM, Vin = 24 VDC, Cin = 100 µF, unless otherwise specified. Absolute Maximum Ratings Parameter Input Voltage Conditions Min Continuous Operation Max Unit 0 36 VDC w/derating -40 +85 °C Open Frame -40 +123 °C Encapsulated Module -40 +105 °C -55 +125 °C Max Unit Operating Ambient Temperature Operating Temperature Tref , see Thermal Derating section Storage Temperature Typ Feature Characteristics Parameter Conditions Min Switching Frequency 480 Output Voltage Trim Range2 Output Over-voltage Protection Over-temperature Protection Peak Backdrive Output Current during startup into prebiased output Backdrive Output Current in OFF state Power On to Output Turn-ON Time Enable to Output Turn-ON Time Output Enable ON/OFF Negative Enable Converter ON Converter OFF Positive Enable Converter ON Converter OFF Enable Pin Current Source/Sink Output Voltage Overshoot @ Startup Auto-Restart Period Typ -10 Non-latching 115 130 kHz +10 % 140 % Avg. PCB temp, non-latching 135 Sinking current from external voltage source equal to VOUT – 0.6V and connected to the output via 1Ω resistor. COUT=220µF, Aluminum 350 500 mA Converter disabled 0 5 mA VOUT = 0.9*VOUT_NOM 10 20 mS VOUT = 0.9*VOUT_NOM 10 20 mS -0.7 2.4 0.8 15 VDC VDC 2.4 -0.7 0.25 20 1.2 1 VDC VDC mA 0 2 %Vo All voltages are WRT –Vin. Converter has internal pull-up of approx. 5V (OVP, OCP) 50 °C ms www.dcdc.com 603-893-2330 - 4- 4- Technical Datasheet CP30_1775018 ELECTRICAL SPECIFICATIONS (continued) 9–36Vin, 3.3V/7.5Aout Conditions: Ta = 25 ºC, Airflow = 300 LFM, Vin = 24 VDC, Cin = 100 µF, unless otherwise specified. Efficiency Parameter Full Load 60% Load Conditions Min Typ Max Unit Vin = 12Vin 87 89 % Vin = 24Vin 87 88 % Vin = 12Vin 88 89 % Vin = 24Vin 86 87 % Conditions Min Typ Max Unit 80 120 mV Dynamic Response Parameter Load Change 25%-50% or 50%– 75% of Iout Max, di/dt = 0.1 A/µs Cout = 1 µF ceramic + 10 µF tantalum See Fig 16 Settling Time to 1% of Vout Load Change 25%-75% or 75%– 25% of Iout Max, di/dt = 0.2 A/µs 50 Cout = 1 µF ceramic + 2000 µF Oscon µS 50 Settling Time to 1% of Vout 100 mV 50 µS 1000 pF Isolation Specifications Isolation Capacitance Isolation Resistance Isolation Voltage Input to Output Open frame Input to Output – Encapsulated 10 MΩ 2250 VDC 1600 VDC Reliability Per Telcordia SR-332, Issue 2: Method I, Case 3 (IO=80% of IO_max, TA=40°C, airflow = 200 lfm, 90% confidence) MTBF 4,502,120 Hours FITs (failures in 109 hours) 221 /109 Hours Notes: 1) Unit will regulate at 9Vin up to 60% maximum load. Full rated load requires 10Vin minimum. 2) 10% trim-up limited to 11 - 32 Vin range. 3) Additional load capacitance capability possible – please consult factory. www.dcdc.com 603-893-2330 - 5- 5- Technical Datasheet CP30_1775018 CHARACTERISTIC CURVES: 5 95% 90% Efficiency 85% Power Dissipation (W) 12Vin 9Vin 80% 24Vin 36Vin 75% 70% 65% 60% 4 36Vin 9Vin 3 24Vin 12Vin 2 1 55% 50% 0.75 1.5 2.25 3 3.75 4.5 5.25 Output Current (A) 6 6.75 0 0.75 7.5 Figure 1. Efficiency vs Output Current, 300lfm airflow, 25°C ambient. 2.25 3 3.75 4.5 5.25 Output Current (A) 6 6.75 7.5 Figure 2. Power Dissipation vs. Load Current, 300lfm airflow, 25°C ambient. 7.5 7.5 N/C ~40LFM (0.2m/s) Output Current (A) N/C ~40LFM (0.2m/s) 6.0 Output Current (A) 1.5 100 LFM (0.5 m/s) 200 LFM (1.0 m/s) 4.5 3.0 1.5 6.0 100 LFM (0.5 m/s) 200 LFM (1.0 m/s) 4.5 3.0 1.5 0.0 0.0 25 40 55 70 85 Ambient Temperature (°C) 25 40 55 70 85 Ambient Temperature (°C) Figure 3. Output Current Derating vs Ambient Temperature & Airflow (Open Frame module) Vin = 24 V Figure 4. Output Current Derating vs Ambient Temperature & Airflow (Open Frame module) Vin = 12 V Output Current (A) 7.5 6.0 N/C ~20LFM (0.1 m/s) 100 LFM (0.5 m/s) 4.5 200 LFM (1.0 m/s) 3.0 1.5 0.0 25 40 55 70 85 Ambient Temperature (°C) Figure 5. Output Current Derating vs Ambient Temperature & Airflow (Encapsulated module) Vin = 12V,24V Figure 6. Thermal Image of CP30B1775018 7.5A output, 70C Ambient, 200lfm airflow, Vin = 24V, Tmax = 118°C www.dcdc.com 603-893-2330 - 6- 6- Technical Datasheet CP30_1775018 CHARACTERISTIC WAVEFORMS: Figure 7. Input Reflected Ripple Current (10mA/div), time scale – 2uS/div. Vin=Vin_nom, full load (see Fig 15) Figure 8. . Output Voltage Ripple (20mV/div), time scale – 1uS/div. Vin=Vin_nom, full load Cout=1uF ceramic + 10uF Tantalum (see Fig 16) Figure 9. Startup Waveform via Enable Pin, time scale 2mS/div. Vin=Vin_nom, Iout=no load Cout=0, Ch1=Vout (1V/div), Ch2=enable (10V/div) Figure 10. Startup Waveform via Input Voltage, time scale 2mS/div. Vin=Vin_nom, Iout=full load Cout=4700uF, Ch1=Vout (1V/div), Ch2=Vin (10V/div) Figure 11. Startup Waveform via Enable Pin, time scale 2mS/div. Vin=Vin_nom, Iout=no load Cout=4700uF, Ch1=Vout (1V/div), Ch2=enable (10V/div) Figure 12. Load Transient Response (100mV/div), di/dt=0.1A/uS, 50%-75%-50% of full load, Cout=Fig16 time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div) www.dcdc.com 603-893-2330 - 7- 7- Technical Datasheet CP30_1775018 Figure 13. Load Transient Response (100mV/div), di/dt=0.1A/uS, 25%-50%-25% of full load, Cout=Fig16 time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div) Figure 14. Load Transient Response 100mV/div), di/dt=0.2A/uS, 25% - 75% - 25% of full load +2000uF low ESR Oscon, time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div) www.dcdc.com 603-893-2330 - 8- 8- Technical Datasheet CP30_1775018 Application Notes INPUT REFLECTED RIPPLE TEST SETUP: TO OSCILLOSCOPE Current Probe Vin(+) Lsource: 10 uH DC Source Csource: 220 uF ESR < 0.1 OHM @ 20 ºC, 100 kHz 100 uF ESR < 0.7 OHM Vin(-) Note: Measure input reflected-ripple current with a simulated source inductance (Ltest) of 10 uH. Capacitor CS offsets possible source impedance. Figure 15. Input Reflected-ripple Current Test Setup. OUTPUT RIPPLE TEST SETUP: COPPER STRIP Vout(+) 1.0 uF 10 uF SCOPE RESISTIVE LOAD Vout(-) Use a 1.0µF X7R ceramic capacitor and 10µF @20V low ESR tantalum capacitor. Scope measurement made using a BNC socket. Position the load 3 in. [76mm] from module. Figure 16. Peak-to-Peak Output Noise Measurement Test Setup. www.dcdc.com 603-893-2330 - 9- 9- Technical Datasheet CP30_1775018 Application Notes (cont) OUTPUT VOLTAGE TRIM: Output voltage adjustment is accomplished by connecting an external resistor between the Trim Pin and either the +Vout or –Vout pins. • TRIM UP EQUATION: Rtrim_up( Ω ) 6325 − 2050 Vdes − 3.3 Where Rtrim_up is the resistance value in ohms and Vdes is the desired output voltage. E.g. to trim the output up 10%, Rtrim_up Enable 6325 3.63 − 3.3 − 2050 ⋅ Ω or Rtrim_up = 19.17 kOhm. -Vout Rtrim_up -Vin Rload Trim +Vin +Vout Figure 17. Trim UP circuit configuration • TRIM-DOWN EQUATION: 5100 ⋅ ( Vdes − 1.24 ) Rtrim_down ( Ω ) 3.3 − Vdes − 2050 Where Rtrim_down is the resistance value in ohms and Vdes is the desired output voltage. Enable -Vout -Vin Rload Trim +Vin Rtrim_down +Vout Figure 18. Trim DOWN circuit configuration www.dcdc.com 603-893-2330 - 10 - 10 - Technical Datasheet CP30_1775018 Application Notes (cont) Thermal Derating • It is preferable that the DC-DC module have an unobstructed flow of air across it for best thermal performance. Components taller than ~ 2mm in front of the module can deflect airflow and possibly create hotspots. • Significant cooling is achieved through conductive flow from the modules I/O pins to the host PCB. Sufficiently large traces connecting the dc-dc converter to the source and load will help ensure thermal derating performance will meet or exceed the derating curves published in this datasheet. • If the module is expected to be operated near the load limits defined in the derating curves, insystem verification of module derating performance should be performed to ensure long-term system reliability. Peak temperatures are to be measured using infrared thermography or by gluing a fine gauge (AWG #40) thermocouple at the Tref location(s) shown below. Temperature at the specified location(s) should be kept below 123ºC for open frame units, 105ºC for encapsulated modules in order to maintain optimum converter reliability. Open Frame Encapsulated Input Undervoltage Lockout • The converter is disabled until the input voltage has exceeded the UVLO turn-on threshold. Once the input voltage exceeds this level (see Input Under-Voltage Lock-out in Electrical Specifications table) the module will commence soft-start. Hysteresis of 1-3 volts minimizes the likelihood of pulling the input voltage below the turn-off threshold during startup which could create an undesirable on/off cycling condition. The converter will continue to operate until the input voltage subsequently falls below the UVLO turn-off threshold. Enable Pin Function • The module has a remote enable function that allows it to be turned on or off remotely. The Enable pin is referenced to the negative input pin (-Vin) of the converter. Modules can be ordered with either negative or positive enable. • The negative enable option the module will not turn on unless the enable pin is connected to – Vin. The positive enable option allows the converter to turn on as soon as voltage sufficient to exceed the UVLO of the converter has been applied to the input terminals. In this case the module is turned off by connecting the Enable pin to –Vin. On/off thresholds are located in the Electrical Specifications table. www.dcdc.com 603-893-2330 - 11 - 11 - Technical Datasheet CP30_1775018 Application Notes (cont) Output Overvoltage Protection • The module has an independent feedback loop that will disable the output of the converter if a voltage greater than about 125% of the nominal set point is detected. When this threshold is reached, the converter will shut down and remain off for the amount of time specified by the Auto-Restart Period. The converter will attempt a restart once this period of time has elapsed. Output Overtemperature Protection • To provide protection under certain fault conditions, the unit is equipped with a thermal shutdown circuit. The unit will shutdown if the average PCB temperature exceeds approx. 135ºC, but the thermal shutdown is not intended as a guarantee that the unit will survive temperatures beyond its rating. The module will automatically restart once it has cooled below the shutdown temperature minus hysteresis (typically 20 deg C.) SMT Version Layout Considerations (if applicable) • Copper traces with sufficient cross-section must be provided for all output & input pins. SMT pads tied to internal power/ground planes must have multiple vias around each SMT pad to couple expected current loads from module pins into internal traces/planes. One 0.024” (0.6mm) diameter via for each 4A of expected source or load current must be provided as close to the termination as possible, preferably in the direction of current flow from SMT pad to load. Vias must be at least 0.024” (0.6 mm) away from the SMT pad to prevent solder from flowing into the vias. • SMT pads on the host card are to be 0.075” (1.9mm) diameter. Solder paste screen opening should be 0.070” diameter and the screen should be 0.006” (0.15 mm) thick (other thicknesses are possible; 0.006” provides a good compromise between solder volume and coplanarity compensation.) Paralleling Converters • Modules may be paralleled but it is recommended that the total power draw not exceed the output power rating of a single module. External sharing controllers are recommended for reliability and to ensure equal distribution of the load to the converters. www.dcdc.com 603-893-2330 - 12 - 12 - Technical Datasheet CP30_1775018 Application Notes (cont) EMC Compliance To meet Class B compliance for EN55032 (CISPR 32) or FCC part 15 sub part j, the following input filter is required: Figure 19. EMI Filter L1 = C1,C2,C3 = C4 = C5,C6 = 0.77 mH Common Mode Inductor (Pulse P0422NL) 2.2uF ceramic 100uF electrolytic 10nF (@2kV if output is ref. to gnd.) 80 70 60 EN55022 ClassB Average Limits dBuV 50 40 30 20 10 0 150k 300k 500k 1M 3M 5M 10M 30M Frequency (Hz) Figure 20. CP30_1775018 Conducted Emissions using above specified input filter. Vin = 24V, Full Resistive Load www.dcdc.com 603-893-2330 - 13 - 13 - Technical Datasheet CP30_1775018 MODULE PIN ASSIGNMENT: PIN # 1 DESIGNATION VIN (+) 2 3 4 5 6 VIN (-) On/Off VOUT (-) Trim VOUT (+) NOTES 1) All dimensions in inches [mm] Tolerances: .xx ± 0.02 [.x ± .5] .xxx ± 0.010 [.xx ± .25] 2) TH pins Ø 0.040” [1.02] with Ø 0.070” [1.77] standoff shoulders. 3) SMT pins are Ø 0.070” lead-free 4) Keep Out Area – no copper traces or vias should be placed in this area. 5) All pins are gold plated with nickel under plating (ROHS). 6) Weight: 7.54 g (0.266 oz.) open frame, 19g (0.67 oz.) encapsulated 7) Workmanship: Meets or exceeds IPC-A-610 Class II MECHANICAL OUTLINE - Open Frame: Through-hole Surface Mount Note: keep out area should be free of copper traces www.dcdc.com 603-893-2330 - 14 - 14 - Technical Datasheet CP30_1775018 MECHANICAL OUTLINE – Encapsulated Module: www.dcdc.com 603-893-2330 - 15 - 15 - Technical Datasheet CP30_1775018 Ordering Information: Product Series Package Configuration No. of Outputs Output Voltage Output Current Input Voltage Enable logic option SMT Option CP30 B or C 1 7 750 18 N or P S 9 – 36V N = Negative P = Positive Blank = No Enable or Trim Pin Surface Mount 30W 1x1 Series B = Open Frame 1 output C = Encapsulated 3.3V 7.5A Rev 1.01, 1-March-21 www.dcdc.com 603-893-2330 - 16 - 16 -