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AP30N10D

AP30N10D

  • 厂商:

    APM-MICROELECTRONICS(永源微)

  • 封装:

  • 描述:

  • 数据手册
  • 价格&库存
AP30N10D 数据手册
AP30N10D 100V N-Channel Enhancement Mode MOSFET Description The AP30N10D uses advanced trench technology to provide excellent RDS(ON), low gate charge and operation with gate voltages as low as 4.5V. This device is suitable for use as a Battery protection or in other Switching application. General Features VDS = 100V ID = 30A RDS(ON) < 47mΩ @ VGS=10V Application Battery protection Load switch Uninterruptible power supply Package Marking and Ordering Information Product ID Pack AP30N10D TO-252-3L Marking Qty(PCS) AP30N10D XXX YYYY 2500 Absolute Maximum Ratings Tc=25℃ unless otherwise noted Symbol Parameter VDS Rating Units Drain-Source Voltage 100 V VGS Gate-Source Voltage ±20 V ID@TC=25℃ Continuous Drain Current, VGS @ 10V1 30 A ID@TC=100℃ Continuous Drain Current, VGS @ 10V1 13.5 A Continuous Drain Current, VGS @ 10V1 4.2 A Continuous Drain Current, VGS @ 10V1 3.4 A 45 A 36.5 mJ ID@TA=25℃ ID@TA=70℃ IDM EAS Pulsed Drain Current2 Single Pulse Avalanche Energy3 IAS Avalanche Current 27 A PD@TC=25℃ Total Power Dissipation4 52.1 W PD@TA=25℃ Total Power Dissipation4 2 W TSTG Storage Temperature Range -55 to 150 ℃ TJ Operating Junction Temperature Range -55 to 150 ℃ 62 ℃/W 2.4 ℃/W RθJA Thermal Resistance Junction-ambient RθJC Junction-Case1 Thermal Resistance 1 1 AP30N10D Rve3.8 臺灣永源微電子科技有限公司 AP30N10D 100V N-Channel Enhancement Mode MOSFET Symbol BVDSS Parameter Drain-Source Breakdown Voltage △BVDSS/△TJ BVDSS Temperature Coefficient Conditions Min. Typ. Max. Unit 100 --- --- V Reference to 25℃ , ID=1mA --- 0.098 --- V/℃ VGS=10V , ID=20A --- 38 47 VGS=0V , ID=250uA RDS(ON) VGS(th) Static Drain-Source On-Resistance2 Gate Threshold Voltage VGS=4.5V , ID=15A --1.3 40 --- 50 2.5 mΩ V △VGS(th) VGS(th) Temperature Coefficient ----- -5.52 --- --10 mV/℃ IDSS Drain-Source Leakage Current VGS=VDS , ID =250uA VDS=80V , VGS=0V , TJ=25℃ VDS=80V , VGS=0V , TJ=55℃ --- --- 100 IGSS Gate-Source Leakage Current VGS=±20V , VDS=0V --- --- ±100 nA gfs Forward Transconductance VDS=5V , ID=20A --- 28.7 --- S Rg Gate Resistance VDS=0V , VGS=0V , f=1MHz --- 1.6 3.2 Ω Qg Total Gate Charge (10V) --- 60 84 Qgs Gate-Source Charge --- 9.7 14 Qgd Gate-Drain Charge --- 11.8 16.5 Td(on) Turn-On Delay Time --- 10.4 21 Tr VDS=80V , VGS=10V , ID=20A uA nC Rise Time VDD=50V , VGS=10V , RG=3.3 --- 46 83 Turn-Off Delay Time ID=20A --- 54 108 Fall Time --- 10 20 Ciss Input Capacitance --- 3848 5387 Coss Output Capacitance --- 137 192 Crss Reverse Transfer Capacitance --- 82 115 IS Continuous Source Current1,5 --- --- 22 A --- --- 45 A Td(off) Tf Current2,5 VDS=15V , VGS=0V , f=1MHz VG=VD=0V , Force Current ns pF ISM Pulsed Source VSD Diode Forward Voltage2 VGS=0V , IS=1A , TJ=25℃ --- --- 1.2 V trr Reverse Recovery Time --- 30 --- nS Qrr Reverse Recovery Charge IF=20A , dI/dt=100A/µs , TJ=25℃ --- 37 --- nC Note : 1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper. 2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2% 3.The EAS data shows Max. rating . The test condition is V DD=25V,VGS=10V,L=0.1mH,IAS=27A 4.The power dissipation is limited by 150℃ junction temperature 5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation. 2 AP30N10D Rve3.8 臺灣永源微電子科技有限公司 AP30N10D 100V N-Channel Enhancement Mode MOSFET Typical Characteristics 37.0 55 ID= 1 2 A VGS=10V 44 36.5 RD S O N( m Ω ) ID Drain Current (A) VGS=7V VGS=5V 33 36.0 VGS=4.5V 35.5 22 35.0 VGS=3V 11 34.5 0 0 1 2 3 4 5 VDS , Drain-to-Source Voltage (V) 34.0 4 6 8 10 VGS (V) Fig.1 Typical Output Characteristics Fig.2 On-Resistance vs. Gate-Source Voltage 12 IS Source Current(A) 10 8 6 TJ=150℃ 4 TJ=25℃ 2 0 0.00 0.25 0.50 0.75 1.00 Normalized On Resistance VSD , Source-to-Drain Voltage (V) Fig.3 Forward Characteristics Of Reverse diode 2.5 1.8 2.0 1.4 Normalized VGS(th) (V) Fig.4 Gate-Charge Characteristics 1.5 1 0.6 1.0 0.2 -50 0 50 100 TJ ,Junction Temperature (℃ ) 0.5 -50 0 50 100 150 TJ , J u n c t i o n T e m p℃) e ra ture ( Fig.6 Normalized RDSON vs. TJ 臺灣永源微電子科技有限公司 3 Fig.5 Normalized VGS(th) vs. TJ AP30N10D Rve3.8 150 AP30N10D 100V N-Channel Enhancement Mode MOSFET 10000 100.00 F=1.0MHz 100us 10.00 1000 1ms -ID (A) Capacitance (pF) Ciss 10ms 100ms DC 1.00 Coss 100 Crss 0.10 Tc=25o C Single Pulse 10 1 5 9 13 17 21 25 0.01 0.1 VDS , Drain to Source Voltage (V) Fig.7 Capacitance 1 10 100 -VDS (V) 1000 Fig.8 Safe Operating Area Normalized Thermal Response (RθJC) 1 DUTY=0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 PDM SINGLE PULSE TON T D = TON/T TJpeak = TC + PDM x RθJC 0.001 0.00001 0.0001 0.001 0.01 0.1 1 10 t , Pulse Width (s) Fig.9 Normalized Maximum Transient Thermal Impedance EAS= VDS 90% BVDSS 1 L x IAS2 x 2 BVDSS BVDSS-VDD VDD IAS 10% VGS Td(on) Tr Ton Td(off) Tf Toff AP30N10D Rve3.8 4 Fig.10 Switching Time Waveform VGS Fig.11 Unclamped Inductive Switching Waveform 臺灣永源微電子科技有限公司 AP30N10D 100V N-Channel Enhancement Mode MOSFET Package Mechanical Data E Dimensions A B2 Ref. C2 Millimeters L V1 Min. 2.50 0.083 0.098 A2 0 0.10 0 0.004 B 0.66 0.86 0.026 0.034 B2 5.18 5.48 0.202 0.216 C 0.40 0.60 0.016 0.024 C2 0.44 0.58 0.017 0.023 D 5.90 6.30 0.232 0.248 6.80 0.252 Min. D H C B DETAIL A V1 V2 D1 5.30REF D1 G A2 V1 Max. 0.209REF E 6.40 E1 4.63 G 4.47 4.67 H 9.50 10.70 0.374 0.421 L 1.09 1.21 0.043 0.048 L2 1.35 1.65 0.053 0.176 7° V2 0.268 0.182 V1 L2 Typ. Max. 2.10 A E1 Typ. Inches 0.184 0.065 7° 0° 6° 0° 6° DETAIL A TO-252 Reel Spectification-TO-252 B 0 P0 P2 Dimensions T Ref. E D A B0 A D1 W F t1 K0 P1 A0 B B B 5° 29 Φ3 A A 20 Φ13 Millimeters Inches Min. Typ. Max. Min. Typ. Max. W 15.90 16.00 16.10 0.626 0.630 0.634 E 1.65 1.75 1.85 0.065 0.069 0.073 F 7.40 7.50 7.60 0.291 0.295 0.299 D0 1.40 1.50 1.60 0.055 0.059 0.063 D1 1.40 1.50 1.60 0.055 0.059 0.063 P0 3.90 4.00 4.10 0.154 0.157 0.161 P1 7.90 8.00 8.10 0.311 0.315 0.319 P2 1.90 2.00 2.10 0.075 0.079 0.083 A0 6.85 6.90 7.00 0.270 0.271 0.276 B0 10.45 10.50 10.60 0.411 0.413 0.417 K0 2.68 2.78 2.88 0.105 0.109 0.113 T 0.24 t1 0.10 10P0 39.80 0.27 0.009 0.011 0.004 40.00 40.20 1.567 1.575 1.583 5 AP30N10D Rve3.8 臺灣永源微電子科技有限公司 AP30N10D 100V N-Channel Enhancement Mode MOSFET Attention 1,Any and all APM Microelectronics products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your APM Microelectronics representative nearest you before using any APM Microelectronics products described or contained herein in such applications. 2,APM Microelectronics assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specifications of any and all APM Microelectronics products described or contained herein. 3, Specifications of any and all APM Microelectronics products described or contained here instipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’s products or equipment. 4, APM Microelectronics Semiconductor CO., LTD. strives to supply high quality high reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. Whendesigning equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design,and structural design. 5,In the event that any or all APM Microelectronics products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. 6, No part of this publication may be reproduced or transmitted in any form or by any means,electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of APM Microelectronics Semiconductor CO., LTD. 7, Information (including circuit diagrams and circuit parameters) herein is for example only; it is not guaranteed for volume production. APM Microelectronics believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. 8, Any and all information described or contained herein are subject to change without notice due to product/technology improvement,etc. When designing equipment, refer to the "Delivery Specification" for the APM Microelectronics product that you Intend to use. 6 AP30N10D Rve3.8 臺灣永源微電子科技有限公司
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