TSD1G

TSD1G Taiwan Semiconductor 1A, 400V ESD Capability Rectifier FEATURES ● ● ● ● ● ● ● ● KEY PARAMETERS High ESD capability Glass passivated chip junction Ideal for automated placement Low forward voltage drop High surge current capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 1 A VRRM 400 V IFSM 40 A TJ MAX 175 °C Package DO-214AC (SMA) Configuration Single die APPLICATIONS ● ● ● ● Switching mode power supply (SMPS) Adapters Lighting application Converter MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AC (SMA) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.060g (approximately) DO-214AC (SMA) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL Marking code on the device TSD1G UNIT TSD1G Repetitive peak reverse voltage VRRM 400 V Reverse voltage, total rms value VR(RMS) 280 V Forward current Peak forward surge current, 8.3ms single half sine-wave superimposed on rated load Junction temperature IF 1 A IFSM 40 A TJ - 55 to +175 °C Storage temperature TSTG - 55 to +175 °C 1 Version: E2102 TSD1G Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 39 °C/W Junction-to-ambient thermal resistance RӨJA 86 °C/W Junction-to-case thermal resistance RӨJC 43 °C/W Thermal Performance Note: Units mounted on PCB (5mm x 5mm Cu pad test board) ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER CONDITIONS SYMBOL IF = 0.5A, TJ = 25°C Forward voltage IF = 1.0A, TJ = 25°C (1) IF = 0.5A, TJ = 125°C VF IF = 1.0A, TJ = 125°C Reverse current @ rated VR (2) Junction capacitance TJ = 25°C TYP MAX UNIT 0.85 1.00 V 0.89 1.25 V 0.72 0.90 V 0.77 1.10 V - 1 µA - 50 µA 14 - pF IR TJ = 125°C 1MHz, VR = 4.0V CJ Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms IMMUNITY TO ELECTRICAL STATIC DISCHARGE TO THE FOLLOWING STANDARDS (TA = 25°C unless otherwise noted) STANDARD AEC-Q101-001 IEC 61000-4-2 ISO 10605 TEST TYPE Human body model(contact mode) Contact mode TEST CONDITIONS SYMBOL C=100pF,R=1.5kΩ C=150pF,R=330Ω Vc CLASS VALUE TYP H3B ≥8kV N/A 4 ≥8kV 20kV 4 ≥15kV 25kV Air-discharge mode C=150pF,R=330Ω Contact mode C=330pF,R=330Ω L4 ≥15kV 20kV Air-discharge mode C=330pF,R=330Ω L4 ≥25kV 25kV ORDERING INFORMATION ORDERING CODE PACKAGE PACKING TSD1G DO-214AC (SMA) 7,500 / Tape & Reel 2 Version: E2102 TSD1G Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Typical Junction Capacitance 40 CAPACITANCE (pF) 1 0 30 20 10 f=1.0MHz Vsig=50mVp-p 0 25 50 75 100 125 150 175 1 10 LEAD TEMPERATURE (°C) REVERSE VOLTAGE (V) Fig.4 Typical Forward Characteristics 10 INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.3 Typical Reverse Characteristics 1 TJ=125°C 0.1 0.01 TJ=25°C 0.001 10 20 30 40 50 60 70 80 100 90 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) 10 10 1 1 0.1 UF1DLW =125°C TTJJ=125°C TJ=125°C TJ=25°C (A) AVERAGE FORWARD CURRENT (A) 2 TJ=25°C 0.01 0.1 0.001 0.5 0.6 0.7 0.8 0.3 0.4 0.5 0.6 Pulse width 300μs 1% duty cycle Pulse width 0.9 0.7 1.0 0.8 1.1 0.9 1.2 1 1.1 FORWARD VOLTAGE (V) 3 Version: E2102 1.2 TSD1G Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AC (SMA) SUGGESTED PAD LAYOUT MARKING DIAGRAM 4 P/N = Marking Code G = Green Compound YW = Date Code F = Factory Code Version: E2102 TSD1G Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: E2102