B1101NG--20C000133U1930 数据手册
Side View Chip LED
B1101NG--20C000133U1930
Harvatek Surface Mount CHIP LED Data Sheet
B1101NG--20C000133U1930
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
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Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
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Side View Chip LED
B1101NG--20C000133U1930
DISCLAIMER ......................................................................................................................................... 3
PRODUCT SPECIFICATIONS............................................................................................................. 4
ATTENTION: ELECTROSTATIC DISCHARGE (ESD) PROTECTION ................................................ 4
LABEL SPECIFICATIONS ................................................................................................................... 5
PRODUCT SPECIFICATIONS............................................................................................................. 5
PRODUCT FEATURES ......................................................................................................................... 6
ELECTRO-OPTICAL CHARACTERISTICS ...................................................................................... 6
PACKAGE OUTLINE DIMENSION AND RECOMMENDED SOLDERING PATTERN FOR REFLOW
SOLDERING ............................................................................................................................. 7
ABSOLUTE MAXIMUM RATINGS ................................................................................................. 7
PRECAUTION FOR USE ............................................................................................................. 8
CHARACTERISTICS OF B1101NG ............................................................................................. 9
PACKAGING ........................................................................................................................................ 10
TAPE DIMENSION ................................................................................................................... 10
REEL DIMENSION ................................................................................................................... 11
PACKING ............................................................................................................................... 11
DRY PACK............................................................................................................................................. 12
BAKING ................................................................................................................................ 12
PRECAUTIONS ....................................................................................................................... 12
REFLOW SOLDERING ...................................................................................................................... 13
REWORKING .......................................................................................................................... 13
CLEANING ............................................................................................................................. 13
REVISE HISTORY.................................................................................................................... 14
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
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Version 1.3
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Side View Chip LED
B1101NG--20C000133U1930
DISCLAIMER
HARVATEK reserves the right to make changes without further notice to any products herein to
improve reliability, function or design. HARVATEK does not assume any liability arising out of
the application or use of any product or circuit described herein; neither does it convey any
license under its patent rights, nor the rights of others.
LIFE SUPPORT POLICY
HARVATEK’s products are not authorized for use as critical components in life support devices
or systems without the express written approval of the President of HARVATEK or HARVATEK
INTERNATIONAL. As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical
implant into the body, or (b) support or sustain life, and (c) whose failure to perform when
properly used in accordance with instructions for use provided in the labeling, can be
reasonably expected to result in a significant injury of the user.
2. A critical component in any component of a life support device or system whose failure to
perform can be reasonably expected to cause the failure of the life support device or system, or
to affect its safety or effectiveness.
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
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Side View Chip LED
B1101NG--20C000133U1930
Product Specifications
Specification
Luminous
NG:180.0-450.0 mcd
Intensity(Iv)
@20mA/ Ts= 25℃;Tolerance: + 10%
Wavelength
NG:520-535 nm
Material
Quantity
@20mA/ TS= 25℃;Tolerance: + 0.5nm
Vf
NG:2.7-3.9 V(0.2V/BIN)
@20mA/ TS= 25℃ ;Tolerance: + 0.05V
Ir
< 10 µA @ VR = 5 V
Resin
Clear
Epoxy resin
Carrier tape
EIA 481-1A specs
Conductive black tape
Reel
EIA 481-1A specs
Conductive black
Label
HT standard
Paper
Packing bag
250x230mm
Aluminum laminated bag/ no-zipper
One reel per bag
Carton
HT standard
Paper
Non-specified
3000pcs per reel
Others:
Each immediate box consists of 5 reels. The 5 reels may not necessarily have the same lot number or the same bin
combinations of Iv, λD and Vf. Each reel has a label identifying its specification; the immediate box consists of a product label
as well.
ATTENTION: Electrostatic Discharge (ESD) protection
The symbol to the left denotes that ESD precaution is needed. ESD protection for GaP and AlGaAs based
chips is necessary even though they are relatively safe in the presence of low static-electric discharge. Parts
built with AlInGaP, GaN, or/and InGaN based chips are STATIC SENSITIVE devices. ESD precaution must
be taken during design and assembly.
If manual work or processing is needed, please ensure the device is adequately protected from ESD during the process.
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
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Side View Chip LED
B1101NG--20C000133U1930
Label Specifications
▓Harvatek P/N:
B
110
1
NG--
20C-
0001
33
Product
Package
Dice Qty
Color
Current
Series Number
Taping
B:PCB
3.2(L)x1.0(W)x1.5(H) mm
1:Single
Green
20mA
X001~XZZZ
1.Taping style
2. Qty
▓ Lot No.:
Product specifications
▓Luminous Intensity (Iv) Bin:
Color
Bin Code
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
Spec. Range
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Side View Chip LED
B1101NG--20C000133U1930
NG
S
180.0-285.0 mcd
T
285.0-360.0 mcd
U
360.0-450.0 mcd
Note: It maintains a tolerance of ±10% on Luminous Intensity
▓Wavelength Bin:
Color
Bin Code
Spec. Range
B
520.0-525.0 nm
C
525.0-530.0 nm
D
530.0-535.0 nm
NG
Note: It maintains a tolerance of ±0.5nm on Wavelength Bin
▓ Forward Voltage (Vf) Bin:
Color
Bin Code
Spec. Range
G8
2.7-2.9 V
H7
2.9-3.1 V
H8
3.1-3.3 V
J7
3.3-3.5 V
J8
3.5-3.7 V
K7
3.7-3.9 V
NG
Note: It maintains a tolerance of ±0.05V on forward voltage measurements
Product Features
Electro-Optical Characteristics
(TSoldering , 25 ℃)
Series
Emitting Color
Material
Wavelength λ(nm)
VF(V)
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
IV(mcd)
Viewing
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Side View Chip LED
B1101NG--20C000133U1930
typ
max
λD
λP
△λ
Typical
3.3
3.9
527
520
40
285.0
Angle
2
X=140
B1101NG--20
NG
InGaN
Y=115
Package Outline Dimension and Recommended Soldering Pattern for Reflow Soldering
Unit: mm Tolerance: +/-0.1
Outline Dim.
Soldering Pattern
Soldering terminals may shift in the x, y direction.
Absolute Maximum Ratings
(TSoldering 25 ℃)
Series
PD (mW)
IF (mA)
IFP (mA)*
TOP (℃)
TST (℃)
Power
Forward
Pulse Forward
Operating
Storage
Dissipation
Current
Temperature
Temperature
78
20
-40~+85
-40~+100
Color
NG
Current
80
*Condition for IFP is pulse of 1/10 duty and 0.1msec width
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
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1
2
Side View Chip LED
B1101NG--20C000133U1930
Precaution for Use
1. The chips should not be used directly in any type of fluid such as water, oil, organic
solvent, etc.
2. When the LEDs are illuminating, the maximum ambient temperature should be first
considered before operation.
3. LEDs must be stored in a clean environment. A sealed container with a nitrogen
atmosphere is necessary if the storage period is over 3 months after shipping.
4. The LEDs must be used within 4 weeks after unpacked. Unused products must be
repacked in an anti-electrostatic package, folded to close any opening and then stored in
a dry and cool space.
5. The appearance and specifications of the products may be modified for improvement
without further notice.
6. The LEDs are sensitive to the static electricity and surge. It is strongly recommended to
use a grounded wrist band and anti-electrostatic glove when handling the LEDs.
If a voltage over the absolute maximum rating is applied to LEDs, it will damage LEDs.
Damaged LEDs will show some abnormal characteristics such as remarkable increase
of leak current, lower turn-on voltage and getting unlit at low current.
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
****************
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Version 1.3
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Side View Chip LED
B1101NG--20C000133U1930
Characteristics of B1101NG
Directive Characteristics
Directive Characteristics
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
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Side View Chip LED
B1101NG--20C000133U1930
Packaging
Tape Dimension
Dim. A
Dim. B
Dim. C
Qty/Reel
3.40±0.10
1.70±0.10
1.20±0.10
3K
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
****************
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Side View Chip LED
B1101NG--20C000133U1930
Reel Dimension
Packing
5 or 10 boxes per carton is available depending on shipment quantity.
Official Product
HT Part No. B1101NG--20C000133U1930
Tentative Product
****************
Specifications are subject to change without notice. Data and
drawings herein are copyrighted.
****************
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Version 1.3
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Side View Chip LED
B1101NG--20C000133U1930
Dry Pack
All SMD optical devices are MOISTURE SENSITIVE. Avoid exposure to moisture at all times
during transportation or storage. Every reel is packaged in a moisture protected anti-static bag.
Each bag is properly sealed prior to shipment.
A humidity indicator will be included in the moisture protected anti-static bag prior to shipment.
The packaging sequence is as follows:
Baking
Baking before soldering is recommended when the package has been unsealed for 4 weeks.
The conditions are as followings:
1. 60±3℃×(12~24hrs)and
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