Viking eUSB
Embedded USB Manual
~
Industrial Products
Manual
PSFDUC3XXXXYXX
Revision H
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10/27/2017
Viking Technology
Page 1 of 20
Revision History
Date
Revision
A
9/12/14
B
11/4/14
Description
Initial release VRFDUC3(L)032GYCNxx PN for SM3252
VRFDUC3032GYCNE1 (12/13/2013)
Update PN table for new PN’s and 16GB (A1, 6/2/2014)
Revised Standby Current and Operating Current based on 3.3V
NAND devices (A2, 7/8/14)
Removed firmware upgrade capability (A3, 8/8/14) Add
VRFDUC31024YCG PN (9/12/14). Update PN table description
Add tolerance info to Mechanical Dimensions
C
3/27/15
Revise PN table to match PSG
D
6/16/15
Revise PN table
4GB P/N at 5.0V 2-CH: VRFDUC3(L)4096YxHyy
4GB P/N at 3.3V 2-CH: VRFDUC3(L)4096YxH3yy
E
9/1/2015
F
11/9/2015
G
6/12/16
H
10/27/2017
Manual
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Add VRFDUC3(L)2048YxE3yy and VRFDUC3(L)2048YxEyy
per PSG update
update with performance based on IOmeter06 for SMI 3252
controller
Added Part Number VRFDUC3(L)2048YxGyy. Added Note 6 on
Figure 3-4 Dimensions (Version 2, standard profile) to show
maximum component height on secondary side (Bottom) is
3.7 ± 0.06 mm[0.145± 0.003 inches]
specify the SCSI commands supported by the SMI 325/3252
controller. Change logo and color scheme . Add
VRFDUC3(L)2048YxG3yy and PN decoder
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Legal Information
Legal Information
Copyright© 2017 Sanmina Corporation. All rights reserved. The information in
this document is proprietary and confidential to Sanmina Corporation. No part of
this document may be reproduced in any form or by any means or used to make
any derivative work (such as translation, transformation, or adaptation) without
written permission from Sanmina. Sanmina reserves the right to revise this
documentation and to make changes in content from time to time without
obligation on the part of Sanmina to provide notification of such revision or
change.
Sanmina provides this documentation without warranty, term or condition of any
kind, either expressed or implied, including, but not limited to, expressed and
implied warranties of merchantability, fitness for a particular purpose, and noninfringement. While the information contained herein is believed to be accurate,
such information is preliminary, and should not be relied upon for accuracy or
completeness, and no representations or warranties of accuracy or
completeness are made. In no event will Sanmina be liable for damages arising
directly or indirectly from any use of or reliance upon the information contained in
this document. Sanmina may make improvements or changes in the product(s)
and/or the program(s) described in this documentation at any time.
Sanmina, Viking Technology, Viking Modular Solutions, and the Viking logo are
trademarks of Sanmina Corporation. Other company, product or service names
mentioned herein may be trademarks or service marks of their respective
owners.
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Ordering Information: eUSB Family
Viking High Performance USB embedded Drive Ordering Information
Part Number
VRFDUC3(L)2048YxE3yy
VRFDUC3(L)2048YxG3yy
VRFDUC3(L)4096YxH3yy
VRFDUC3(L)8192YxK3yy
VRFDUC3(L)016GYxK3yy
VRFDUC3(L)030GYxN3yy
Capacity
2GB
2GB
4GB
8GB
16GB
30GB
Device Density
8Gb
8Gb
16Gb
32Gb
32Gb
64Gb
Voltage
3.3
3.3
3.3
3.3
3.3
3.3
#
Devices
2
2
2
2
4
4
Channels
2
2
2
2
2
2
LBA
3,928,176
3,928,176
7,835,184
15,649,200
31,277,232
62,533,296
VRFDUC3(L)2048YxEyy
VRFDUC3(L)2048YxGyy
VRFDUC3(L)4096YxHyy
VRFDUC3(L)8192YxKyy
VRFDUC3(L)016GYxKyy
VRFDUC3(L)030GYxNyy
2GB
2GB
4GB
8GB
16GB
30G
8Gb
8Gb
16Gb
32Gb
32Gb
64Gb
5
5
5
5
5
5
2
2
2
2
4
4
2
2
2
2
2
2
3,928,176
3,928,176
7,835,184
15,649,200
31,277,232
62,533,296
Notes:
1. DUC3xxxx signifies standard profile, DUC3Lxxxx signifies low profile.
2. x = C for Commercial temperature range: 0 to 70°C (32 to 158° F)
or I for Industrial temperature range: -40 to 85°C (-40 to 185° F)
3. Storage capacity listed will vary due to formatting and additional functions,
and therefore is not available for storage.
4. USB’s ship formatted from the factory unless otherwise requested.
5. All eUSBs are based on SLC flash unless otherwise requested.
6. All capacities are available in 3.3V versions.
7. yy indicates BOM specific information
8. “L” indicate low profile
9. Maximum of 4KB per page
Part Number Decoder
VRFDUC3(L)xxxxYCy(3)(M)zz
Manual
PSFDUC3XXXXYXX
Revision H
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Form Factor
xxxx
=Capacity
(GB)
Controller
Temp
Blank=eUSB Std
Profile
L=eUSB Low Profile
4G=4096
8G=8192
16G=016G
32G=032G
Y=
SMI3252
(USB)
I=(-40 to +85 ºC)
C=(0 to +70'c)
y=
Device
code
Voltage
NAND
M=MLC
3 = 3.3V
Blank=5V
Blank=
SLC
Customer
unique
Alpha
Numeric
zz=wildcard
characters
Blank=
Generic
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Table of Contents
1
INTRODUCTION
7
1.1
Product Overview
7
1.2
Features
7
1.3
Block Diagram
8
1.4
USB Interface
9
2
PRODUCT SPECIFICATIONS
9
2.1
Performance
9
2.2
Timing
9
2.3
Power-up AC timing Requirements
9
2.4 Electrical Characteristics
2.4.1 Absolute Maximum Ratings
2.4.2 DC Operating Conditions and Characteristics
2.4.3 Power Consumption
2.4.4 Capacitance
10
10
10
10
11
2.5 Environmental Conditions
2.5.1 Temperature and Altitude
11
11
2.6
Reliability
11
3
MECHANICAL INFORMATION
13
4
PIN AND SIGNAL DESCRIPTIONS
17
4.1
Signal and Power Description Tables
17
5
COMMAND SETS
18
6
CERTIFICATIONS AND COMPLIANCE
19
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7
REFERENCES
19
Table of Tables
1
Table 2-1: Sustained Read and Write Bandwidth _____________________________________ 9
Table 2-2: Maximum Sustained Read and Write Bandwidth _____________________________ 9
Table 2-3: Timing Specifications __________________________________________________ 9
Table 2-4: Absolute Maximum Ratings ____________________________________________ 10
Table 2-5: Voltage and Current Ratings ____________________________________________ 10
Table 2-6: Power Consumption __________________________________________________ 11
Table 2-7: Bus Line Capacitance _________________________________________________ 11
Table 2-8: Temperature and Altitude Related Specifications ____________________________ 11
Table 2-9: Reliability Specifications _______________________________________________ 11
Table 4-1: eUSB Connector Pin Signal Definitions ___________________________________ 17
Table 5-1: SCSI Feature Set ____________________________________________________ 18
Table 5-2: SCSI Error Codes List _________________________________________________ 19
Table 6-1: Device Certifications __________________________________________________ 19
Table of Figures
Figure 1-1: High-Level Block Diagram ______________________________________________ 8
Figure 3-1: Location of PCB # marking ____________________________________________ 13
Figure 3-2: Dimensions (Version-1) _______________________________________________ 14
Figure 3-3: Dimensions (Version-2, low profile) ______________________________________ 15
Figure 3-4: Dimensions (Version 2, standard profile) __________________________________ 16
Figure 4-1: Connector Pin Assignments ____________________________________________ 17
Manual
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1 Introduction
1.1 Product Overview
Viking Technology’s Embedded USB (eUSB) module provides a rugged, reliable
and cost effective non-volatile memory, solutions to OEM customers in the
Communication, Networking, Embedded and Industrial markets. The eUSB
module is a secure pluggable device and a drop-in replacement for Intel® ZU130 Value Solid State Drive with a USB 2.0 interface, ECC and global wearleveling. Additional options such as MLC (Multi Level Cell) technology and ESD
protection are also available.
Viking’s rugged industrial designed USB’s offer the highest flash storage
reliability and performance in harsh environments such as shock, vibration,
humidity, altitude, ESD, and extreme temperatures. Viking USB’s meet JEDEC
JESD22 standards and pass numerous qualifications including MIL-STDs and
NEBS.
Viking can also provide specialized services to OEMs designing customized
hardware and systems by offering:
Locked BOM control with customer product change notification (PCN)
Pre-installed software, custom software imaging and ID strings
Custom packaging and labeling
Comprehensive supply-chain management
Customer specified testing
30k volt ESD protection
Conformal coating
Localized Field Application Engineering for complete pre and post sale
technical support
1.2 Features
The embedded USB drive delivers the following features:
USB 2.0 high speed compatible (supports Bulk-Only transport protocol)*
Up to 35 MB/s Read Speed and 23 MB/s Write Speed (Dual Channel)
Up to 23 MB/s Read Speed and 12 MB/s Write Speed (Single Channel)
Host Interface Speed 60MB/s
Drive Activity indicator signal
Low power Dissipation- less than 0.45W active; less than 1mW standby
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Solid state, Non-volatile NAND Memory
RoHS Compliant
Static Wear Leveling
* With exception of 3.3V only operation, USB specification is 5V.
1.3 Block Diagram
Figure 1-1: High-Level Block Diagram
USB/NAND
CONTROLLER
VOLTAGE
REGULATOR
5V – 3.3V
3.3V
5.0V
5V
RAM BUFFER
LOCAL
MICROPROCESSOR
USB ENDPOINT
CONTROLLER
HOST
CONNECTOR
DM
`
FLASH NAND
DP
DATA BUFFER
GND
#ACTIVE
FLASH MEMORY
INTERFACE
(DUAL CHANNEL)
ECC
OSCILLATOR
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1.4 USB Interface
The USB interface is compliant with the USB 2.0 specification.
The USB interface connects the host computer to the embedded USB.
The USB interface runs at a maximum speed of 2.0 Gbps (gigabits per
second). If the host computer is unable to negotiate a speed of 2.0 Gbps,
the USB interface automatically renegotiates to lower speeds.
2 Product Specifications
2.1 Performance
The host interface speed is 60MB/s with a read/write bandwidth shown in the
following tables.
Table 2-1: Sustained Read and Write Bandwidth1
Access Type
Read, Dual Channel
Write, Dual Channel
MB/s
Up to 31.2
Up to 17.4
Notes:
1.Based on VRFDUC3L032GYCNE1 MicSLC SM3252 using IOMETER06
2.Based on VRFDUC3L016GYIKK1 TosSLC SM3252 using IOMETER06
Table 2-2: Maximum Sustained Read and Write Bandwidth
Access Type
Read, Dual Channel
Write, Dual Channel
MB/s
Max up to 35
Max up to 23
2.2 Timing
Table 2-3: Timing Specifications
2.3 Power-up AC timing Requirements
Parameter
Symbol
Min.
Typical
Max.
Unit
Powerup to Ready (from 2.7V
VBUS)
tRESET
100
150
250
ms
Notes:
1. This power-up timing can be changed to 10ms upon request. The long power-up delay is designed to
accommodate slow power-up times of rack systems.
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2.4 Electrical Characteristics
2.4.1 Absolute Maximum Ratings
Table 2-4: Absolute Maximum Ratings
Parameter
Symbol
Value
Unit
5.0 Supply Voltage
VBUS
-0.3 ~ 5.5
V
3.3 Supply Voltage
VBUS
-0.3 ~ 4.0
V
Input Voltage
VIN
GND - 0.5 ~ VCC + 0.5
V
Storage Temperature
TST
-55 ~ 150
C
Notes:
1. Permanent device damage may occur if ‘ABSOLUTE MAXIMUM RATINGS’ are exceeded. Functional
operation should be restricted to recommended operating condition. Exposure to higher than
recommended voltage for extended periods of time could affect device reliability.
2.4.2 DC Operating Conditions and Characteristics
Table 2-5: Voltage and Current Ratings
Parameter
Symbol
Min.
Typical
Max.
Unit
5.0 Supply voltage (± 5%)
3.3 Supply voltage (± 5%)
Regulated Output Voltage (internal eUSB
voltage)
Input high voltage
VBUS
VBUS
4.75
3.14
5.0
3.3
5.25
3.465
V
V
VDD33O
2.9
3.3
3.6
V
VIH
VIL
VOH
VOL
2.0
2.4
-
16.5 + 6.6
16.5 + 13.2
16.5 + 19.8
132 + 9.9
132 + 19.8
132 + 39.6
0.8
V
V
V
V
µA
µA
µA
mA
mA
mA
Input low voltage
Output high voltage
Output low voltage
Standby Current
2
Operating Current
2
1 Flash Device
2 Flash Devices
4 Flash Devices
1 Flash Device
2 Flash Devices
4 Flash Devices
ISTB
IOP
0.4
23.1 + 33
23.1 + 66
23.1 + 132
165 + 19.8
165 + 39.6
165 + 79.2
Notes:
1. Recommended operating conditions (Voltages referenced to GND, TA = 0 to 70C)
2. Based on 3.3V NAND
2.4.3 Power Consumption
All onboard power requirements of the eUSB are derived from the 5V or
3.3V input rail.
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Table 2-6: Power Consumption
Power
Standby
Operating
Typical
1
450
units
mW
mW
2.4.4 Capacitance
Table 2-7: Bus Line Capacitance
Parameter
Bus line capacitance
Symbol
Min
Max
Unit
CL
-
20
pF
2.5 Environmental Conditions
2.5.1 Temperature and Altitude
Table 2-8: Temperature and Altitude Related Specifications
Conditions
Commercial
Temperature
Industrial
1
Temperature
Humidity (noncondensing)
Max Temperature
Gradient
Altitude
Storage Time
Duration
Operating
0 to 70°C
(32 to 158° F)
-40 to 85°C
(-40 to 185° F)
Shipping
-40 to 85°C
(-40 to 185° F)
-40 to 85°C
(-40 to 185° F)
Storage
-40 to 85°C
(-40 to 185° F)
-40 to 85°C
(-40 to 185° F)
5% to 95%
5% to 95%
5% to 95%
20°C/Hour
(36°F/Hour)
-304.8 to 24,384 m
(-1,000 to 80,000 ft)
n/a
n/a
-304.8 to 24,384 m
(-1,000 to 80,000 ft)
-304.8 to 24,384 m
(-1,000 to 80,000 ft)
n/a
n/a
1 year
Notes:
1. SLC flash based products are available in the following temperature ranges:
a) Commercial temperature range of 0 to 70°C (32 to 158° F)
b) Industrial temperature range -40 to 85°C (-40 to 185° F)
2.6 Reliability
Table 2-9: Reliability Specifications
Parameter
Value
Mean Time Between Failures (MTBF)
Power On/Off Cycles
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2
1
2,500,000 hours
50,000 cycles
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Parameter
Read Endurance
3
Write or Erase Endurance
Wear-leveling
Data retention
Value
Unlimited
(specified by the flash component)
Global
>10 years
Notes:
1. MTBF is calculated based on a Part Stress Analysis. It assumes nominal voltage, with all other
o
parameters within specified range. Telcordia method SR-332 component FIT rate at 55 c.
2. Power On/Off Cycles defined as power being removed from the drive, and then restored. Note that host
systems and drive enclosures may remove power from the drive for reasons other than a system
shutdown.
3. SLC NAND has a higher endurance then MLC NAND
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3 Mechanical Information
The dimensions of the eUSB (version-1) are based on the following
PCB #s: 1208, 1209
As an example, the 1208 PCB would have a 0001208A marking that is
silkscreened at the bottom edge of the PCB near the mounting hole on the same
side as the connector (at bottom side of the eUSB) as shown in the following
figure.
Figure 3-1: Location of PCB # marking
PCB #
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Figure 3-2: Dimensions (Version-1)
See Note 5
See Note 5
Notes:
1. PCB number is silkscreened on the PCB
2. Dimensions shown in millimeters [inches]
3. Max screw penetration is 5mm at all 4 locations.
4. The module connector height is 7.4 ± 0.13 [0.290± 0.005] plus standoff
~ 0.45mm ± 0.13 when mounted to a PCB.
5. Connector height with standoff is 8.00± 0.13 [0.315± 0.005]
6. PCB Tolerance is +/- 0.127mm [0.005 inch], unless otherwise stated
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The dimensions of the eUSB (version 2) are based on the following
PCB #s: 1448, 1449
Figure 3-3: Dimensions (Version-2, low profile)
PCB thickness
Primary Side
(Top View)
(Bottom View)
Overall
thickness
Side View
Low profile Module Connector:
SAMTEC SMM-105-02-F-D-LC-09-P-TR
Pitch: 2.00mm
Secondary Side
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Figure 3-4: Dimensions (Version 2, standard profile)
PCB thickness
See Note 4
Primary Side
(Top View)
(Bottom View)
Secondary Side
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Overall
thickness
Side View
Notes:
1. Standard Profile Module Connector:
SAMTEC SSM-105-L-DV-LC-009-P-TR
Pitch: 2.54mm
2. Dimensions shown in millimeters
3. Max screw penetration is 5mm at all 4
locations.
4. The module connector height is
7.4 ± 0.13mm [0.290± 0.005 inches]
5. PCB Tolerance is +/- 0.127mm
[0.005 inch], unless otherwise stated
6. Maximum component height on
secondary side (Bottom) is
3.7 ± 0.06 mm[0.145± 0.003 inches]
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4 Pin and Signal Descriptions
Figure 4-1: Connector Pin Assignments
4.1 Signal and Power Description Tables
Table 4-1: eUSB Connector Pin Signal Definitions
Pin
1
2
3
4
5
6
7
8
9
Signal Name
VBUS
NC
DM
NC
DP
NC
GND
NC
N/A
Type
Power
NC
I/O
NC
I/O
NC
Power
NC
Key
10
#Activity
I/O
Description
3.3 or 5V power supply
Not connected
USB 2.0 Data Negative Pin
Not connected
USB 2.0 Data Positive Pin
Not connected
Ground
Not connected
Polarization
Status signal that indicates when the drive is busy.
This signal may be used to drive a low current
LED or other logic on the host to indicate drive
status to the user or system. This signal is active
low and has a 4mA drive strength.
Notes:
1. * Available custom options: Pin 2 Chassis ground option; Pin 4 Hardware /WP; Pin 6 Hardware /Reset.
Custom options available on locked BOMs only.
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5 Command Sets
The tables below summarize the supported SCSI feature set and commands.
Table 5-1: SCSI Feature Set
SCSI Command
OpCode
TEST_UNIT_READY
0x00
REZERO_UNIT
0x01 *
REQUEST_SENSE
0x03
FORMAT
0x04
INQUIRY
0x12
MODE_SELECT_6
0x15 *
MODE_SENSE_6
0x1A
START_STOP_UNIT
0x1B
SEND_DIAGNOSTIC
0x1D *
PREVENT/ALLOW MEDIUM REMOVE
0x1E +
READ_FORMAT_CAPACITIES
0x23
READ_CAPACITY
0x25
READ_10
0x28
WRITE_10
0x2A
SEEK
0x2B *
WRITE_AND_VERIFY
0x2E
VERIFY
0x2F *
SYNCHRONIZE_CACHE
0x35 *
READTOC
0x43
PLAY_AUDIO_10
0x45 *
MODE_SELECT_10
0x55 *
MODE_SENSE_10
0x5A
READ_12
0xA8
WRITE_12
0xAA
Notes:
1. SM3252BB/SM325AC SMI Controller
2. Note *: Recognize the command and just response PASS status. No other process.
3. Note +: Recognize the command and just response PASS or Fail status. No other process.
4. Note others : Support command function but not full as described in spec. For example: Command
WRITE_AND_VERIFY has write function only.
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Table 5-2: SCSI Error Codes List
6 Certifications and Compliance
Table 6-1: Device Certifications
Certification/Compliance
RoHS
EU WEEE Compliant
Safety
Description
Viking Technology, Sanmina Corporation ("Viking") shall use
commercially reasonable efforts to provide components, parts,
materials, products and processes to customers that do not contain:
(i) lead, mercury, hexavalent chromium, polybrominated biphenyls
(PBB) and polybrominated diphenyl ethers (PBDE) above 0.1% by
weight in homogeneous material or (ii) cadmium above 0.01% by
weight of homogeneous material, except as provided in any
exemption(s) from RoHS requirements (including the most current
version of the "Annex" to Directive\ 2002/95/EC of 27 January,
2003), as codified in the specific laws of the EU member countries.
Viking strives to obtain appropriate contractual protections from its
suppliers in connection with the RoHS Directives.
The Waste Electrical and Electronic Equipment Directive (WEEE
Directive) is the European Community directive 2002/96/EC on
waste electrical and electronic equipment (WEEE) which, together
with the RoHS Directive 2002/95/EC, became European Law in
February 2003, setting collection, recycling and recovery targets for
all types of electrical goods.
All printed circuit boards (PCBs) have a flammability rating of
UL94V-0.
7 References
USB Specification, version 2.0
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Index
Dimensions ................................... 14
Endurance .................................... 12
Environmental Conditions ............. 11
Erase Endurance .......................... 12
Humidity ........................................ 11
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MTBF ............................................ 11
Power Consumption ................ 10, 11
Temperature.................................. 11
Timing Specifications ...................... 9
Wear-leveling ................................ 12
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