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APTGF25H120T3G

APTGF25H120T3G

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    SP3

  • 描述:

    IGBT 模块 NPT 全桥反相器 1200 V 40 A 208 W 底座安装 SP3

  • 数据手册
  • 价格&库存
APTGF25H120T3G 数据手册
APTGF25H120T3G Full - Bridge NPT IGBT Power Module VCES = 1200V IC = 25A @ Tc = 80°C Application  Welding converters  Switched Mode Power Supplies  Uninterruptible Power Supplies  Motor control 28 27 26 25 Features  Non Punch Through (NPT) Fast IGBT - Low voltage drop - Low tail current - Switching frequency up to 50 kHz - Soft recovery parallel diodes - Low diode VF - Low leakage current - RBSOA and SCSOA rated - Symmetrical design  Kelvin emitter for easy drive  Very low stray inductance  High level of integration  Internal thermistor for temperature monitoring 20 19 18 23 22 29 16 30 15 31 14 13 32 2 3 4 7 8 10 11 12 All multiple inputs and outputs must be shorted together Example: 13/14 ; 29/30 ; 22/23 … Benefits  Outstanding performance at high frequency operation  Direct mounting to heatsink (isolated package)  Low junction to case thermal resistance  Solderable terminals both for power and signal for easy PCB mounting  Low profile  Easy paralleling due to positive TC of VCEsat  Each leg can be easily paralleled to achieve a phase leg of twice the current capability  RoHS compliant Absolute maximum ratings Parameter Collector - Emitter Breakdown Voltage IC Continuous Collector Current ICM VGE PD Pulsed Collector Current Gate – Emitter Voltage Maximum Power Dissipation RBSOA Reverse Bias Safe Operating Area TC = 25°C Max ratings 1200 40 25 100 ±20 208 Tj = 125°C 50A@1150V TC = 25°C TC = 80°C TC = 25°C Unit V A V W These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note APT0502 on www.microsemi.com www.microsemi.com 1-7 APTGF25H120T3G – Rev 3 October, 2012 Symbol VCES APTGF25H120T3G All ratings @ Tj = 25°C unless otherwise specified Electrical Characteristics Symbol Characteristic ICES Zero Gate Voltage Collector Current VCE(sat) Collector Emitter saturation Voltage VGE(th) IGES Gate Threshold Voltage Gate – Emitter Leakage Current Test Conditions Min Tj = 25°C Tj = 125°C T j = 25°C VGE =15V IC = 25A Tj = 125°C VGE = VCE , IC = 1mA VGE = 20V, VCE = 0V Typ VGE = 0V VCE = 1200V 2.5 3.2 4.0 4 Max 250 500 3.7 Unit µA V 6 400 V nA Max Unit Dynamic Characteristics Symbol Cies Coes Cres Qg Qge Qgc Td(on) Tr Td(off) Tf Td(on) Tr Td(off) Characteristic Input Capacitance Output Capacitance Reverse Transfer Capacitance Total gate Charge Gate – Emitter Charge Gate – Collector Charge Turn-on Delay Time Rise Time Turn-off Delay Time Test Conditions VGE = 0V VCE = 25V f = 1MHz VGE = 15V VBus = 600V IC =25A Inductive Switching (25°C) VGE = 15V VBus = 600V IC = 25A RG = 22 Inductive Switching (125°C) VGE = 15V VBus = 600V IC = 25A RG = 22 VGE = 15V Tj = 125°C VBus = 600V IC = 25A Tj = 125°C RG = 22 Fall Time Turn-on Delay Time Rise Time Turn-off Delay Time Tf Fall Time Eon Turn-on Switching Energy Eoff Turn-off Switching Energy Min Typ 1650 250 110 160 10 70 60 50 305 pF nC ns 30 60 50 346 ns 40 3.5 mJ 1.5 Reverse diode ratings and characteristics VRRM IRM IF Test Conditions Min VR=1200V Forward Current VF Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge Er Reverse Recovery Energy Max 1200 Maximum Peak Repetitive Reverse Voltage Maximum Reverse Leakage Current Typ IF = 25A VGE = 0V IF = 25A VR = 600V di/dt =1000A/µs www.microsemi.com Unit V Tj = 25°C Tj = 125°C 100 250 Tc = 80°C Tj = 25°C Tj = 125°C 25 2.1 1.9 Tj = 25°C 95 Tj = 125°C 190 Tj = 25°C 2.1 Tj = 125°C Tj = 25°C Tj = 125°C 4.5 0.75 1.5 µA A V ns µC mJ 2-7 APTGF25H120T3G – Rev 3 October, 2012 Symbol Characteristic APTGF25H120T3G Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information). Symbol Characteristic Resistance @ 25°C R25 B 25/85 T25 = 298.15 K RT  Min Typ 50 3952 Max Unit k K Min Typ Max 0.6 1.2 Unit R25 T: Thermistor temperature   1 1  RT: Thermistor value at T   exp  B25 / 85   T25 T   Thermal and package characteristics Symbol Characteristic RthJC VISOL TJ TSTG TC Torque Wt IGBT Diode Junction to Case Thermal Resistance RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz Operating junction temperature range Storage Temperature Range Operating Case Temperature Mounting torque Package Weight To heatsink M4 4000 -40 -40 -40 2 °C/W V 150 125 100 3 110 °C N.m g See application note 1901 - Mounting Instructions for SP3 Power Modules on www.microsemi.com www.microsemi.com 3-7 APTGF25H120T3G – Rev 3 October, 2012 SP3 Package outline (dimensions in mm) APTGF25H120T3G Typical Performance Curve Output characteristics (VGE=15V) 250µs Pulse Test < 0.5% Duty cycle 70 50 TJ=125°C 40 30 20 10 16 TJ=25°C 12 8 TJ=125°C 4 0 0 1 2 3 4 5 6 7 VCE, Collector to Emitter Voltage (V) 0 8 VGE, Gate to Emitter Voltage (V) Transfer Characteristics 120 250µs Pulse Test < 0.5% Duty cycle 100 80 60 40 TJ=125°C 20 TJ=25°C 0 2.5 5 7.5 10 12.5 VGE, Gate to Emitter Voltage (V) TJ = 125°C 250µs Pulse Test < 0.5% Duty cycle 8 7 Ic=50A 6 5 Ic=25A 4 3 2 Ic=12.5A 1 0 9 10 11 12 13 14 IC = 25A TJ = 25°C 16 2 2.5 3 3.5 VCE=240V VCE=600V 14 12 10 VCE=960V 8 6 4 2 0 0 15 16 6 30 60 90 120 150 180 On state Voltage vs Junction Temperature 250µs Pulse Test < 0.5% Duty cycle VGE = 15V 5 3 Ic=12.5A 2 1 0 -50 Breakdown Voltage vs Junction Temp. 60 Ic, DC Collector Current (A) 1.10 1.05 1.00 0.95 0.90 0.85 0.80 Ic=50A Ic=25A 4 VGE, Gate to Emitter Voltage (V) Collector to Emitter Breakdown Voltage (Normalized) 1.5 Gate Charge (nC) On state Voltage vs Gate to Emitter Volt. 9 1 Gate Charge 18 15 VCE, Collector to Emitter Voltage (V) 0 0.5 VCE, Collector to Emitter Voltage (V) -25 0 25 50 75 100 TJ, Junction Temperature (°C) 125 DC Collector Current vs Case Temperature 50 40 30 20 10 0 -50 -25 0 25 50 75 100 125 TJ, Junction Temperature (°C) www.microsemi.com -50 -25 0 25 50 75 100 125 150 TC, Case Temperature (°C) 4-7 APTGF25H120T3G – Rev 3 October, 2012 0 Ic, Collector Current (A) 250µs Pulse Test < 0.5% Duty cycle TJ=25°C 60 VCE, Collector to Emitter Voltage (V) Output Characteristics (VGE=10V) 20 Ic, Collector Current (A) Ic, Collector Current (A) 80 APTGF25H120T3G Turn-Off Delay Time vs Collector Current td(off), Turn-Off Delay Time (ns) VCE = 600V RG = 22Ω 70 65 VGE = 15V 60 55 50 5 15 25 35 45 400 VGE=15V, TJ=125°C 350 300 250 200 55 5 ICE, Collector to Emitter Current (A) Current Rise Time vs Collector Current VCE = 600V RG = 22Ω 120 45 tf, Fall Time (ns) tr, Rise Time (ns) 35 45 55 Current Fall Time vs Collector Current 80 VGE=15V 40 TJ = 125°C 40 35 TJ = 25°C 30 25 5 15 25 35 45 VCE = 600V, VGE = 15V, RG = 22Ω 20 55 5 ICE, Collector to Emitter Current (A) VCE = 600V RG = 22Ω 8 TJ=125°C, VGE=15V 6 TJ=25°C, VGE=15V 4 2 0 55 4 VCE = 600V VGE = 15V RG = 22Ω 3 TJ = 125°C 2 TJ = 25°C 1 0 5 15 25 35 45 ICE, Collector to Emitter Current (A) 55 5 Switching Energy Losses vs Gate Resistance 15 25 35 45 ICE, Collector to Emitter Current (A) 55 Reverse Bias Safe Operating Area 60 VCE = 600V VGE = 15V TJ= 125°C Eon, 25A IC, Collector Current (A) 4 15 25 35 45 ICE, Collector to Emitter Current (A) Turn-Off Energy Loss vs Collector Current Turn-On Energy Loss vs Collector Current 10 Eoff, Turn-off Energy Loss (mJ) Eon, Turn-On Energy Loss (mJ) 25 50 0 Switching Energy Losses (mJ) 15 ICE, Collector to Emitter Current (A) 160 5 VGE=15V, TJ=25°C VCE = 600V RG = 22Ω 3 Eoff, 25A 2 1 0 50 40 30 20 10 0 0 10 20 30 40 50 60 0 400 800 1200 VCE, Collector to Emitter Voltage (V) Gate Resistance (Ohms) www.microsemi.com 5-7 APTGF25H120T3G – Rev 3 October, 2012 td(on), Turn-On Delay Time (ns) Turn-On Delay Time vs Collector Current 75 APTGF25H120T3G Fmax, Operating Frequency (kHz) Cies 1000 Coes 100 Cres 10 0 10 20 30 40 VCE, Collector to Emitter Voltage (V) Thermal Impedance (°C/W) 0.5 100 80 ZVS VCE = 600V D = 50% RG = 22Ω TJ = 125°C TC= 75°C 60 40 Hard switching ZCS 20 50 0 0 10 20 30 IC, Collector Current (A) 40 Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration 0.7 0.6 Operating Frequency vs Collector Current 120 0.9 0.7 0.4 0.3 0.2 0.1 0.5 0.3 0.1 Single Pulse 0.05 0 0.00001 0.0001 0.001 0.01 0.1 1 10 Rectangular Pulse Duration (Seconds) www.microsemi.com 6-7 APTGF25H120T3G – Rev 3 October, 2012 C, Capacitance (pF) Capacitance vs Collector to Emitter Voltage 10000 APTGF25H120T3G DISCLAIMER The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modified, by any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an officer of Microsemi. Microsemi reserves the right to change the configuration, functionality and performance of its products at anytime without any notice. This product has been subject to limited testing and should not be used in conjunction with lifesupport or other mission-critical equipment or applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or use of Microsemi products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright or other intellectual property right. Any performance specifications believed to be reliable but are not verified and customer or user must conduct and complete all performance and other testing of this product as well as any user or customers final application. User or customer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is the customer’s and user’s responsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi specifically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost profit. The product is subject to other terms and conditions which can be located on the web at http://www.microsemi.com/legal/tnc.asp Life Support Application Seller's Products are not designed, intended, or authorized for use as components in systems intended for space, aviation, surgical implant into the body, in other applications intended to support or sustain life, or for any other application in which the failure of the Seller's Product could create a situation where personal injury, death or property damage or loss may occur (collectively "Life Support Applications"). Buyer agrees not to use Products in any Life Support Applications and to the extent it does it shall conduct extensive testing of the Product in such applications and further agrees to indemnify and hold Seller, and its officers, employees, subsidiaries, affiliates, agents, sales representatives and distributors harmless against all claims, costs, damages and expenses, and attorneys' fees and costs arising, directly or directly, out of any claims of personal injury, death, damage or otherwise associated with the use of the goods in Life Support Applications, even if such claim includes allegations that Seller was negligent regarding the design or manufacture of the goods. www.microsemi.com 7-7 APTGF25H120T3G – Rev 3 October, 2012 Buyer must notify Seller in writing before using Seller’s Products in Life Support Applications. Seller will study with Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the new proposed specific part.
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