BM70/71
Bluetooth® Low Energy (BLE) Module
Features
• Qualified for Bluetooth SIG v5.0 core specification
• Certified to FCC, ISED, MIC, KCC, NCC, SRRC
and ANATEL radio regulations
• Certified by European RED Assessed Radio
module
• Compliant to RoHS
• Supports UART interface
• Supports transparent UART data service of BLE
• The BM70 module supports 3-channel pulsewidth modulation (PWM) and the BM71 module
supports 1-channel PWM
• Supports Precision Temperature Sensor (PTS) for
ambient temperature detection
• Supports 12-bit ADC (ENOB=10 or 8 bits) for
battery and voltage detection
• Provides 8-channel ADC for the BM70 module
and 5-channel ADC for the BM71 module
• Features 18 general purpose I/O (GPIO) pins for
the BM70 module and 9 GPIO pins for the BM71
module
• Features integrated 32 MHZ crystal
• Small and compact surface mount module
• Castellated surface mount pads for easy and
reliable host PCB mounting
FIGURE 1:
BM70 MODULE
FIGURE 2:
BM71 MODULE
RF Features
•
•
•
•
•
ISM band 2.402 GHz to 2.480 GHz operation
Channels: 0 to 39
Receive Sensitivity: typical -90 dBm (LE)
Transmit Power: 0 dBm (typical)
Received Signal Strength Indication (RSSI)
monitor with 1 dB resolution
MAC/Baseband/Higher Layer Features
• Secure AES128 encryption
• GAP, GATT, SMP, L2CAP and integrated public
profile support
• To create custom GATT services, refer to the
“BM70/71 Bluetooth® Low Energy Module User’s
Guide” (DS50002542) for details.
• Configurable role as peripheral/central, client/
server
2015-2021 Microchip Technology Inc.
Antenna
• Chip antenna (BM7xBLES1FC2) range based on
open air measurement and phone-module
connection:
- BM70: up to 50m
- BM71: up to 10m
• External antenna (BM7xBLE01FC2) connection
through RF pad
Power Management
• Two low power modes supported, with wake up
through GPIO or internal timer
• Average current: Tx=3.3 mA and Rx=3.2 mA with
buck at 3.0V VBAT input and 18.75 ms connection
interval, when transmitting full data packets to
achieve a data rate of approximately 8.6 kbps
DS60001372L-Page 1
BM70/71
Operating Conditions
• Operating voltage range: 1.9V to 3.6V
• Operating temperature: -40ºC to +85ºC
Applications
•
•
•
•
•
•
•
Internet of Things (IoT)
Secure Payment
Wearable Devices
Home and Security
Health and Fitness
Beacons
Industrial and Data Logger
General Description
The BM70/71 module offers BLE solutions for embedded applications. It conforms to the Bluetooth 5 core
specification to enhance the throughput and security
for the IoT applications. It also supports beacon
technology to enhance the user experience for the IoT
applications, and enables users to control the cloud
and receive data without opening the application
through a smartphone.
The BM70/71 module has an integrated Bluetooth
stack and is available in different form factors to
optimize space, cost, and RF performance. The poweroptimized design minimizes the current consumption
and extends battery life for portable and wearable
applications.
DS60001372L-Page 2
2015-2021 Microchip Technology Inc.
BM70/71
Table of Contents
1.0 Device Overview .............................................................................................................................................................................. 5
2.0 Application Information .................................................................................................................................................................. 13
3.0 Module Configuration..................................................................................................................................................................... 25
4.0 Antenna.......................................................................................................................................................................................... 27
5.0 Electrical Characteristics................................................................................................................................................................ 37
6.0 Physical Dimensions ...................................................................................................................................................................... 43
7.0 Soldering Recommendations ......................................................................................................................................................... 51
8.0 Ordering Guide .............................................................................................................................................................................. 53
Appendix A: Certification Notices......................................................................................................................................................... 55
Appendix B: Revision History............................................................................................................................................................... 63
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The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
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To determine if an errata sheet exists for a particular device, please check with one of the following:
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When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
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2015-2021 Microchip Technology Inc.
DS60001372L-Page 3
BM70/71
NOTES:
DS60001372L-Page 4
2015-2021 Microchip Technology Inc.
BM70/71
1.0
DEVICE OVERVIEW
The BM70/71 module is built around Microchip
Technology IS1870/71 BLE Integrated Circuit (IC). The
IS1870/71 IC includes an on board Bluetooth stack, a
power management subsystem, a 2.4 GHz transceiver,
and an RF power amplifier. The user can embed
Bluetooth functionality into any product using the
BM70/71 module.
The BM70/71 module enables the following features:
•
•
•
•
Simple integration and programming
Reduced development time
Superior wireless module with a low-cost system
Interoperability with Apple® iOS and Android™
OS
• A wide range of applications
FIGURE 1-1:
The BM70/71 module can independently maintain a low
power wireless connection. Low power and flexible
power management features maximize the lifetime of the
BM70/71 module in battery-operated devices. A wide
operating temperature range enables its applications in
indoor and outdoor environments.
The BM70/71 module is a small, compact, and
surface-mounted module with castellated pads for easy
and reliable host PCB mounting. The relatively small
form factor of the module is targeted for applications,
such as wearable sports, fitness devices and so on.
1.1
Interface Description
Figure 1-1 and Figure 1-2 illustrate an example of the
BM70/71 module-based system.
BM70 MODULE BLOCK DIAGRAM
Note 1: SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 module by changing the
default firmware. For more details, contact a local Microchip representative.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 5
BM70/71
FIGURE 1-2:
BM71 MODULE BLOCK DIAGRAM
Note 1: SPI and I2C peripherals of the IS1870/71 IC can be enabled on the BM70/71 module by changing the
default firmware. For more details, contact a local Microchip representative.
DS60001372L-Page 6
2015-2021 Microchip Technology Inc.
BM70/71
Figure 1-3 through Figure 1-6 illustrate the pin diagrams
of the BM70/71 module.
FIGURE 1-3:
BM70BLE01FC2 PIN DIAGRAM
FIGURE 1-4:
BM70BLES1FC2 PIN DIAGRAM
2015-2021 Microchip Technology Inc.
DS60001372L-Page 7
BM70/71
FIGURE 1-5:
BM71BLE01FC2 PIN DIAGRAM
FIGURE 1-6:
BM71BLES1FC2 PIN DIAGRAM
DS60001372L-Page 8
2015-2021 Microchip Technology Inc.
BM70/71
Table 1-1 provides pin descriptions of the BM70/71
module.
TABLE 1-1:
BM70/71 PIN DESCRIPTION
BM70BLE0 BM70BLE BM71BLE BM71BLE
Pin Name
1FC2
S1FC2
01FC2
S1FC2
—
1
—
—
GND
Type
Power
Description
Ground reference
—
2
—
—
GND
Power
Ground reference
1
3
12
13
GND
Power
Ground reference
2
4
11
14
VBAT
Power
Battery input. Voltage range: 1.9V to
3.6V
—
—
10
—
BK_IN
Power
Buck input. Voltage range: 1.9V to 3.6V
3
5
—
—
P2_2
DIO
4
6
—
—
VDD_IO
Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
5
7
—
—
VDD_IO
Power
I/O positive supply. Do not connect.
Ensure VDD_IO and MCU I/O voltage are
compatible
6
8
—
—
ULPC_O
Power
1.2V programmable ULPC LDO output
for AON-logic and retention memory supply. Internal use only, do not connect to
other devices
7
9
—
—
P2_3
DI
8
10
—
—
BK_O
Power
1.55V buck output. Internal use only, do
not connect to other devices
—
—
13
6
P1_6
DIO
P1_6, when connected to the host MCU,
set the MCU pin connected to P1_6
either high impedance or drive pin to low
during firmware start-up (approximately
22 msec)
—
—
14
5
P1_7
DIO
P1_7
9
11
15
15
P2_7/TX_
IND
DIO
AI
DO
GPIO: P2_7
ADC Input: AD14
TX_IND
10
12
—
—
P1_1
DIO
AI
GPIO: P1_1
ADC Input: AD9
11
13
2
3
P1_2
DIO
AI
GPIO, default pull-high input
AD10
12
14
3
4
P1_3
DIO
AI
GPIO, default pull-high input
AD11
13
15
8
11
P0_0
DIO
AI
DI
GPIO, default pull-high input
AD0
UART flow-control CTS
14
16
—
—
P1_0
DIO
AI
GPIO, default pull-high input
AD8
15
17
6
9
P3_6
DIO
DO
DO
GPIO, default pull-high input
PWM0
UART flow-control RTS
16
18
16
16
P2_0
DI
2015-2021 Microchip Technology Inc.
GPIO, default pull-high input PWM1
GPIO, default pull-high input PWM2
System configuration, default pull-high
input
H: Application mode
L: Test mode
DS60001372L-Page 9
BM70/71
TABLE 1-1:
BM70/71 PIN DESCRIPTION (CONTINUED)
BM70BLE0 BM70BLE BM71BLE BM71BLE
Pin Name
1FC2
S1FC2
01FC2
S1FC2
Type
Description
17
19
—
—
P2_4
DIO
18
20
—
—
NC
—
No connection
DI
Module Reset (active-low) (internal pull
up)
Legend:
19
A = Analog
21
D = Digital
7
10
RST_N
GPIO, default pull-high input
I = Input
O = Output
20
22
5
7
HCI_RXD
DI
HCI UART data input
21
23
4
8
HCI_TXD
DO
HCI UART data output
22
24
—
—
P3_1
DIO
GPIO: P3_1
23
25
—
—
P3_2
DIO
GPIO: P3_2
24
26
—
—
P3_3
DIO
GPIO: P3_3
25
27
—
—
P3_4
DIO
GPIO: P3_4
26
28
—
—
P3_5
DIO
DO
GPIO, default pull-high input
LED1
27
29
—
—
P0_7
DIO
AI
GPIO, default pull-high input
AD7
28
30
9
12
P0_2/LED
DIO
AI
P02
AD2
29
31
17
2
GND
Power
Ground reference
—
32
—
—
GND
Power
Ground reference
30
—
1
—
BT_RF
AI
—
33
—
—
GND
Power
Legend:
External antenna connection (50 Ohm)
Only for BM70BLE01FC2 and
BM71BLE01FC2
No connection for BM71BLES1FC2
Ground reference
A = Analog
D = Digital
I = Input
O = Output
DS60001372L-Page 10
2015-2021 Microchip Technology Inc.
BM70/71
Table 1-2 provides the hardware features of the
BM70/71 module.
Note:
I2C and SPI are accessible using specific
firmware versions that support these
peripheral interfaces. Please refer to the
BM70/71 product page on the Microchip
web site for the latest firmware.
TABLE 1-2:
BM70/71 MODULE HARDWARE FEATURES
Feature/ Modules
BM70BLES1FC2
BM70BLE01FC2
BM71BLES1FC2
BM71BLE01FC2
Module
H/W
Default
IS1870
Firmware
Module
H/W
Default
IS1870
Firmware
Module
H/W
Default
IS1871
Firmware
Module
H/W
Default
IS1871
Firmware
UART
1
1
1
1
1
1
1
1
GPIO (see Note 2)
18
13
18
13
9
4
9
4
12-bit ADC channels
8
6
8
6
5
3
5
3
PWM
3
2
3
2
1
0
1
0
Total pins
33
—
30
—
16
—
17
—
On board antenna with
CAN
Yes
—
—
—
Yes
—
—
—
—
—
Yes
—
—
—
Yes
—
Yes
—
—
—
Yes
—
—
—
12x22x2.4
—
12x15x1.6
—
9x11.5x2.1
—
6x8x1.6
—
Configuration
No Antenna
Government regulatory
RF certified
Size (mm)
Note 1:
2:
The GPIO, ADC and PWM numbers used are based on disabling the LED indication and UART Hardware
flow-control (RTS/CTS) functionality, see Table 1-1.
For a detailed explanation of GPIO, refer to the “BM70/71 Bluetooth® Low Energy Module User’s Guide”
(DS50002542).
2015-2021 Microchip Technology Inc.
DS60001372L-Page 11
BM70/71
Table 1-3 provides the details of the test pads used for
the production test on the bottom of the BM70/71
module. See Figure 1-3 through Figure 1-6 for more
details.
TABLE 1-3:
BM70BLE
01FC2
TEST PADS DETAILS
BM70BLE
S1FC2
BM71BLE
01FC2
BM71BLE
S1FC2
Pin Name
Type
Description
TP-1
TP-1
TP-3
TP-3
VCC_PA
Power
1.55V RF PA LDO
TP-2
TP-2
TP-1
TP-1
CLDO_O
Power
1.2V CLDO output
TP-3
TP-3
TP-2
TP-2
VCC_RF
Power
1.28V RF LDO output
—
—
TP-4
TP-4
ULPC_O
Power
1.2V ULPC LDO output
—
—
TP-5
TP-5
BK_O
Power
1.55V buck output
DS60001372L-Page 12
2015-2021 Microchip Technology Inc.
BM70/71
2.0
APPLICATION INFORMATION
2.1
Reference Schematics
Figure 2-1 through Figure 2-8 illustrate the BM70/71
module reference schematics for the various Stock
Keeping Units (SKUs). The GPIOs are configurable,
and the connection depends on the user’s application
circuit.
It is recommended to use an external Reset IC in all
applications. An example of using this circuit with the
MCP111-195 is illustrated in Figure 2-1, Figure 2-3,
Figure 2-5, and Figure 2-7. This Reset IC prevents the
Flash data corruption, when VBAT drops below 1.9V
(this includes brown-out, power-down, and power-up
conditions).
FIGURE 2-1:
The RF antenna impedance matching circuit in
Figure 2-3 and Figure 2-5 require users to implement
by the selected antenna specification.
For battery-powered applications, it is recommended to
use the following external circuits as illustrated in
Figure 2-2, Figure 2-4, Figure 2-6, and Figure 2-8. The
first circuit (left side) ensures that the LED indicator is
bright enough in applications with VBAT > 3.0V. The
second circuit (right side) provides protection from battery voltage reverse connection.
If a fixed voltage source is applied to VBAT (e.g. 3.3V),
the soft start output is necessary to prevent the inrush
voltage over 3.6V to damage the Flash.
BM70BLES1FC2 REFERENCE CIRCUIT
2015-2021 Microchip Technology Inc.
DS60001372L-Page 13
BM70/71
FIGURE 2-2:
BM70BLES1FC2 REFERENCE CIRCUIT
FIGURE 2-3:
BM70BLE01FC2 REFERENCE CIRCUIT
DS60001372L-Page 14
2015-2021 Microchip Technology Inc.
BM70BLE01FC2 REFERENCE CIRCUIT
FIGURE 2-5:
BM71BLE01FC2 REFERENCE CIRCUIT
Ant enna
Mat c hi ng
* Not e 2
L1
NP-0402
1
P3_6
RST_N
MCP111-195
C4
1u/6.3V
P0_2
P0_0
P0_2
Power I nput
( 1. 9V~3. 6V)
5
6
7
8
9
HCI_RXD
P3_6
RST_N
P0_0
P0_2
VBAT
C3
10u/6.3V
GND
P2_0
P2_7
P1_7
1
2
C2
2
1
P1_6
HCI_RXD
2
1
VSS
VDD
Vout
BK_O
ULPC_O
VCC_PA
VCC_RF
CLDO_O
BK_IN
VBAT
GND
P1_6
U1
3
R1
4K7/1%
10
11
12
13
VBAT
HCI_TXD
P1_3
P1_2
BT_RF
VBAT
2
1. 9V RESET I C
C1
2
FP1
FP-BM71BLE01FC2
4 HCI_TXD
P1_3
3
P1_2
2
1
1
ANT1
ANT3216LL00R2400A
1
FIGURE 2-4:
2
BM70/71
TP-5
TP-4
TP-3
TP-2
TP-1
17
16 P2_0
15 P2_7
14 P1_7
Conf i gur abl e
P1_7
P1_6
P0_0
P3_6
I/O
P1_3
P1_2
P2_7
* Not e 1
Conf i gur at i on
Tes t Poi nt
1
1
1
1
1
P2_0
VBAT
HCI_RXD
HCI_TXD
I nt er f ac e
P2_0
MODE
LOW Tes t Mode
Hi gh APP Mode
Note 1: Place the capacitor C3 as close as possible to the module. Connect the BK_IN and VBAT trace at C3.
2: The antenna matching component value depends on the user’s antenna and PCB layout.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 15
BM70/71
FIGURE 2-6:
BM71BLE01FC2 REFERENCE CIRCUIT
FIGURE 2-7:
BM71BLES1FC2 REFERENCE CIRCUIT
Note 1: Place the capacitor C3 as close as possible to the module.
DS60001372L-Page 16
2015-2021 Microchip Technology Inc.
BM70/71
FIGURE 2-8:
BM71BLES1FC2 REFERENCE CIRCUIT - OPTIONAL
2015-2021 Microchip Technology Inc.
DS60001372L-Page 17
BM70/71
2.2
External Configuration and
Programming
The BM70/71 module can be configured and
programmed using an external configuration and
programming tool. Figure 2-9 illustrates the minimum
signals required for configuring and programming the
module using host PCB.
FIGURE 2-9:
DS60001372L-Page 18
Configuration and programming modes can be
configured using the P2_0 pin. Refer to 3.4, System
Configuration for details.
EXTERNAL CONFIGURATION AND PROGRAMMING
2015-2021 Microchip Technology Inc.
BM70/71
2.3
2.3.1
Host MCU Interface
HOST MCU INTERFACE OVER
UART
Figure 2-10 and Figure 2-11 illustrate the interfacing
between the BM70/71 and host MCU using UART.
UART uses Host Control Interface (HCI) to share the
FIGURE 2-10:
communication among the Host MCU and BM70/71
module. The interface also illustrates the power
scheme using a 3.3V Low Drop Out (LDO) regulator
that supplies 3.3V to the BM70/71 (BAT_IN) and MCU
VDD. This power scheme ensures that the BM70/71
module and MCU I/O voltages are compatible.
BM70 MODULE TO MCU INTERFACE
Note 1: Ensure that VBAT(=I/O Voltage) and MCU VDD voltages are compatible.
2: Control and indication ports are configurable.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 19
BM70/71
FIGURE 2-11:
BM71 MODULE TO MCU INTERFACE
Note 1: Ensure that VBAT(=I/O Voltage) and MCU VDD voltages are compatible.
2: Control and indication ports are configurable.
3: 10 μF (X5R) and 330 Ohm resistor are required for the BM71 module.
4: BK_IN connect to VBAT for BM71BLE01FC2.
DS60001372L-Page 20
2015-2021 Microchip Technology Inc.
BM70/71
2.3.2
UART READY AFTER EXTERNAL
RESET
In MCU applications, the time between Reset and the
BM70/71 module UART port ready for Test mode and
Application mode, after an external Reset (RST_N)
FIGURE 2-12:
must be notified. Figure 2-12 illustrates the timing
diagram of the BM70/71 module UART port ready for
Test mode and Application mode after Reset.
TIMING DIAGRAM OF BM70/71 MODULE UART READY FOR TEST MODE AFTER
RESET
2015-2021 Microchip Technology Inc.
DS60001372L-Page 21
BM70/71
2.3.3
UART READY AFTER POWER-ON
RESET
Figure 2-13 illustrates the timing diagram of the BM70
module UART port ready for Test mode and Application mode after Power-on Reset (POR).
cated by the status pins, or by a status report UART
command. This status pin or status report UART
command is sent to inform the MCU that the BM70/71
module is ready for communication.
In Application mode, when the BM70/71 module is
ready to communicate with the host MCU after reset,
the BM70/71 module may have internal status indi-
FIGURE 2-13:
DS60001372L-Page 22
TIMING DIAGRAM OF BM70 MODULE UART READY FOR TEST MODE AFTER
POWER-ON
2015-2021 Microchip Technology Inc.
BM70/71
2.4
Typical Hosted Configuration
Figure 2-14 illustrates the typical hosted configuration
for the BM71 module. It also illustrates an application
using a coin cell battery at VBAT input. For the BM71
FIGURE 2-14:
module, a 10 μF capacitor (X5R/X7R) is applied to the
BAT_IN pin. Only on the BM71 module, the BK_IN pin
of the module must be connected to the BAT_IN pin.
BM71 MODULE TYPICAL HOSTED CONFIGURATION
Note 1: Hardware functions can include ADC and PWM. Refer to “BM70/71 Bluetooth® Low Energy Module
User’s Guide” (DS50002542) for a full description of all possible configurable behavior and hardware.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 23
BM70/71
2.5
Power-Drop Protection
To prevent the BM70/71 module from disruptions,
when the voltage drops to less than 1.9V, an “Open
Drain” Reset chip with a delay time of ≤ 10 ms that triggers Reset at 1.8V output voltage is recommended.
Figure 2-15 illustrates the Reset circuit block diagram.
FIGURE 2-15:
DS60001372L-Page 24
RESET CIRCUIT BLOCK DIAGRAM
2015-2021 Microchip Technology Inc.
BM70/71
urable; refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542) for the full
description.
MODULE CONFIGURATION
The BM70/71 module features and services can be
configured to fit a wide range of application requirements. Refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542) for details of all
device behavior along with information on how to
configure the IS8170/71 IC on the BM70/71 module.
Refer to 3.1“UART Interface” through 3.4“System
Configuration” that describe default behavior of the
BM70/71 module, which can be easily changed.
The BM70/71 module I/O pins are configurable as either
control or indication signal. The control signals are
input to the BM70/71 module and the indication signals
are output from the BM70/71 module. Table 3-1 and
Table 3-2 provide default pin functions of the default
firmware logic in the IS1870/71 IC on the BM70/71
module. For different BM70/71 module application
requirements, the I/O pin assignment is configurable
and can fit a wide range of application requirements.
For additional information related to I/O pin assignment, refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542).
UART Interface
The BM70/71 module UART pins, TXD and RXD, are
connected to the UART pins of the host MCU. By
default, the UART characteristics are set to a baud rate
of 115200, with 8-bit data, 1 stop bit, no parity, and no
hardware flow control. These characteristics are config-
If hardware function is enabled,
LED0 is fixed to this pin
If hardware function is enabled,
TX_IND is fixed to this pin
If hardware function is enabled,
UART_CTS is fixed to this pin
If hardware function is enabled,
UART_RTS is fixed to this pin
PAIRING_KEY(1)
UART_RX_IND(1)
LINK_DROP(1)
RSSI_IND(1)
CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM70 MODULE
LOW_BATTERY_IND(1)
N/C(1)
PINS
TABLE 3-1:
Control and Indication I/O Pins
STATUS1_IND(1)
3.1
3.2
RF_ACTIVE_IND(1)
3.0
P1_0
P3_1
Default
P3_2
Default
P3_3
Default
P3_4
Default
P0_7
Default
P1_1
Default
P2_2
Default
P2_4
Default
P3_5
Default
P3_6
P0_0
P2_7
P0_2
Default
Default
Default
Default
Note 1: These signals are part of the remappable hardware functionality and can be input/output on different GPIO
pins of the module. Refer to the “BM70/71 Bluetooth® Low Energy Module User’s Guide” (DS50002542) for
details.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 25
BM70/71
P1_6
Default
P1_7
Default
P1_2
Default
P1_3
Default
P3_6
Default
P0_0
Default
P2_7
Default
P0_2
3.3
Default
Reset (RST_N)
The Reset input pin (RST_N) is used to reset the
BM70/71 module with an active-low pulse with a minimum pulse width of 63 ns.
TABLE 3-3:
3.4
System Configuration
Table 3-3 provides the system configuration settings of
the P2_0 pin that places the BM70/71 module into various operational modes. The P2_0 pin has an internal
pull up.
SYSTEM CONFIGURATION SETTINGS
P2_0
Note:
If hardware function is enabled,
LED0 is fixed to this pin
If hardware function is enabled,
TX_IND is fixed to this pin
If hardware function is enabled,
UART_CTS is fixed to this pin
If hardware function is enabled,
UART_RTS is fixed to this pin
STATUS2_IND
STATUS1_IND
RF_ACTIVE_IND
PAIRING_KEY
UART_RX_IND
LINK_DROP
CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM71 MODULE
RSSI_IND
LOW_BATTERY_IND
PINS
TABLE 3-2:
Operational Mode
High
Application mode
Low
Test mode (calibration of the IS1870/71 IC), Configuration mode (programming of configuration
parameters for default firmware), Firmware Update mode (programming of internal flash memory of IS1870/71 IC).
For more details and information on the use of these different modes, refer to the “BM70/71 Bluetooth® Low
Energy Module User’s Guide” (DS50002542).
DS60001372L-Page 26
2015-2021 Microchip Technology Inc.
BM70/71
4.0
ANTENNA
4.1
Antenna Characteristics
4.1.1
BM70BLES1FC2 CERAMIC CHIP
ANTENNA
The BM70BLES1FC2 module contains an inbuilt
ceramic chip antenna. Figure 4-1 illustrates the
antenna radiation pattern of the ceramic chip antenna
on the BM70BLES1FC2 module.
FIGURE 4-1:
BM70BLES1FC2 ANTENNA RADIATION PATTERN
Table 4-1 provides the antenna radiation pattern details
of the BM70BLES1FC2 module.
TABLE 4-1:
Parameter
BM70BLES1FC2 ANTENNA
RADIATION PATTERN
DETAILS
Values
Frequency
2450 MHz
Peak Gain
1.63 dBi
Efficiency
71.55%
2015-2021 Microchip Technology Inc.
DS60001372L-Page 27
BM70/71
4.1.2
BM71BLES1FC2 CERAMIC CHIP
ANTENNA
The BM71BLES1FC2 module contains an inbuilt
ceramic chip antenna. Figure 4-2 illustrates the
antenna radiation pattern of the ceramic chip antenna
on the BM71BLES1FC2 module.
FIGURE 4-2:
BM71BLES1FC2 ANTENNA RADIATION PATTERN
Table 4-2 provides the antenna radiation pattern details
of the BM71BLES1FC2 module.
TABLE 4-2:
BM71BLES1FC2 ANTENNA
RADIATION PATTERN
DETAILS
Parameter
Values
Frequency
2442 MHz
Peak Gain
0.1 dBi
Efficiency
42.7%
DS60001372L-Page 28
2015-2021 Microchip Technology Inc.
BM70/71
4.2
Antenna Placement
For a Bluetooth wireless product, the antenna
placement affects the whole system performance. The
antenna requires free space to radiate the RF signals
and it cannot be surrounded by the ground plane.
FIGURE 4-3:
Figure 4-3 illustrates a typical example of good and
poor antenna placement of the BM70BLES1FC2
module on the main application board with the ground
plane.
BM70BLES1FC2 ANTENNA PLACEMENT EXAMPLES
2015-2021 Microchip Technology Inc.
DS60001372L-Page 29
BM70/71
Figure 4-4 illustrates a typical example of good and
poor antenna placement of the BM71BLES1FC2 module on the main application board with the ground
plane.
FIGURE 4-4:
DS60001372L-Page 30
BM71BLES1FC2 ANTENNA PLACEMENT EXAMPLES
2015-2021 Microchip Technology Inc.
BM70/71
4.3
Antenna Considerations
Table 4-3 provides the part number and manufacturer
details of the antenna used on the BM70BLES1FC2
module.
TABLE 4-3:
BM70BLES1FC2 ANTENNA DETAILS
Description
Part Number
Manufacturer
ANT ANT3216A063R2400A PIFA 2.4 GHZ L3.2W1.6
ANT3216A063R2400A
YAGEO
Description
Part Number
Manufacturer
ANT ANT3216LL00R2400A 2.4 GHZ L3.2W1.6
ANT3216LL00R2400A
YAGEO
Table 4-4 provides the part number and manufacturer
details of the antenna used on the BM71BLES1FC2
module.
TABLE 4-4:
BM71BLES1FC2 ANTENNA DETAILS
2015-2021 Microchip Technology Inc.
DS60001372L-Page 31
BM70/71
4.4
4.4.1
Host PCB Mounting Suggestion
BM70BLES1FC2 HOST PCB
MOUNTING
Figure 4-5 illustrates the host PCB mounting suggestions for the BM70BLES1FC2 module, showing the
minimum ground plane area to the left and right of the
module for best antenna performance.
FIGURE 4-5:
DS60001372L-Page 32
The area under the antenna must not contain any top,
inner or bottom copper layer, while designing the host
PCB. A low-impedance ground plane ensures the best
radio performance (best range, low noise). The ground
plane can be extended beyond the minimum recommended as required for the host PCB EMC noise
reduction. For best range performance, keep all
external metal away from the ceramic chip antenna by
a minimum of 30 mm.
BM70BLES1FC2 HOST PCB MOUNTING SUGGESTION
2015-2021 Microchip Technology Inc.
BM70/71
4.4.2
BM70BLE01FC2 HOST PCB
MOUNTING
Figure 4-6 illustrates the mounting suggestions for the
BM70BLE01FC2 module and also shows a connection
to UFL connector. A low-impedance ground plane will
ensure the best radio performance (best range, low
noise).
50 Ohm micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test
points. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it must
be a 50 Ohm controlled impedance.
The pin 30 (BT_RF) is connected to an external
antenna connector, a PCB trace antenna, or a component (ceramic chip) antenna through a host PCB
FIGURE 4-6:
BM70BLE01FC2 HOST PCB MOUNTING SUGGESTIONS
2015-2021 Microchip Technology Inc.
DS60001372L-Page 33
BM70/71
4.4.3
BM71BLES1FC2 HOST PCB
MOUNTING
Figure 4-7 illustrates the mounting suggestions for the
BM71BLES1FC2 module. It also shows the area
around the antenna, required for the best antenna performance.
FIGURE 4-7:
DS60001372L-Page 34
The area under the antenna must not contain any top,
inner, or bottom copper layer while designing the host
PCB. A low-impedance ground plane ensures the best
radio performance (best range, low noise). The ground
plane can be extended beyond the minimum recommended as required for the host PCB EMC noise
reduction. For best range performance, keep all external metal away from the ceramic chip antenna by a
minimum of 30 mm.
BM71BLES1FC2 HOST MOUNTING SUGGESTION
2015-2021 Microchip Technology Inc.
BM70/71
4.4.4
BM71BLE01FC2 HOST PCB
MOUNTING
Figure 4-8 illustrates the mounting suggestions for the
BM71BLE01FC2 module. It also shows a connection to
the UFL connector. A low-impedance ground plane
ensures the best radio performance (best range, low
noise).
FIGURE 4-8:
The pin 1 (BT_RF) is connected to an external antenna
connector, a PCB trace antenna, or a component
(ceramic chip) antenna through a host PCB 50 Ohm
micro-strip trace. The micro-strip trace can be
extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test
points. It is recommended that the micro-strip trace be
as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it must
be a 50 Ohm controlled impedance.
BM71BLE01FC2 HOST PCB MOUNTING SUGGESTION
2015-2021 Microchip Technology Inc.
DS60001372L-Page 35
BM70/71
NOTES:
DS60001372L-Page 36
2015-2021 Microchip Technology Inc.
BM70/71
5.0
ELECTRICAL CHARACTERISTICS
This section provides an overview of the BM70/71 module electrical characteristics. Additional information will be
provided in future revisions of this document as it becomes available.
Absolute Maximum Ratings
Ambient temperature under bias for modules parts ending with 0002......................................................-20°C to +70°C
Ambient temperature under bias for modules parts ending with 0B0x......................................................-40°C to +85°C
Storage temperature .............................................................................................................................. -40°C to +125°C
Voltage on VDD with respect to VSS ......................................................................................................... -0.3V to +3.6V
Voltage of any digital pin ............................................................................................................-0.3V to VDD + 0.3 ≤ 3.9
Maximum output current sink by any I/O pin..........................................................................................................12 mA
Maximum output current sourced by any I/O pin....................................................................................................12 mA
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions,
above those indicated in the operation listings of this specification, is not implied. Exposure to maximum
rating conditions for extended periods may affect device reliability.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 37
BM70/71
Table 5-1 provides the recommended operating conditions of the BM70/71 module.
TABLE 5-1:
RECOMMENDED OPERATING CONDITIONS
Symbol
Min.
Typ.
Max.
3.6V
PMU
VDD (VBAT, BK_IN, AVDD)
1.9V
3.0V
RST_N
1.9V
3.0V
3.6V
Other I/O
1.9V
—
3.6V
0.7 VDD
—
VDD
VSS
—
0.3 VDD
0.8 VDD
—
VDD
GPIO
VIH (Input High Voltage)
VIL (Input Low Voltage)
VOH (Output High Voltage) (High drive, 12 mA)
VOL (Output Low Voltage) (High drive, 12 mA)
Pull up resistance
Pull down resistance
VSS
—
0.2 VDD
34 kOhm
48 kOhm
74 kOhm
29 kOhm
47 kOhm
86 kOhm
Supply Current (see Note 1)
Peak Tx mode current at VDD=3V,
Tx=0 dBm, Buck mode
—
10 mA at +25°C
13 mA at
+70°C/+85°C
Peak Rx mode current at VDD=3V,
Buck mode
—
10 mA at +25°C
13 mA at
+70°C/+85°C
“Reduced current consumption” low power mode
current (see Note 2)
—
60 μA at +25°C
“Shutdown” low power mode current (see Note 2)
1.0 μA
—
2.9 μA
Note 1: The current measurements are characterized across a sample of BM70/71 modules at room temperature
(+25°C), unless otherwise noted.
2: For more details on “Reduced current consumption” or “Shutdown” low power modes, refer to the “BM70/71
Bluetooth® Low Energy Module User’s Guide” (DS50002542).
Note:
For more details on “Analog to Digital Converter (ADC) and Precision Temperature Sensor (PTS)
specifications, refer to “IS1870/71 Bluetooth® Low Energy SoC data sheet” (DS60001371).
DS60001372L-Page 38
2015-2021 Microchip Technology Inc.
BM70/71
Table 5-2 provides the RF specifications of the
BM70/71 module.
TABLE 5-2:
RF SPECIFICATIONS
Parameter
Min.
Typ.
Max.
2402 MHz
—
2480 MHz
—
0 dBm
—
-25 dBm
—
3 dBm
Transmitter
Frequency
Output Power
RF Power Control Range
In-band Spurious (N±2)
—
-38.5 dBm
—
In-band Spurious (N±3)
—
-43.25 dBm
—
Modulation Characteristic - Frequency
Deviation (see Note 1)
—
247 kHz
—
2402 MHz
—
2480 MHz
Sensitivity Level (interference active)
—
-90 dBm
—
Interference
Performance
Co-channel
—
17 dB
—
Adjacent
± 1 MHz
—
0 dB
—
Adjacent
± 2 MHz
—
-25 dB
—
Adjacent >=
± 3 MHz
—
-32 dB
—
—
-37.5 dBm
—
Receiver
Frequency
Inter-modulation Characteristic (n=3,4,5)
Maximum Usable Level
0 dBm
Note 1: Tested by transmitting known ‘00001111’b patterns.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 39
BM70/71
5.1
5.1.1
Current Consumption Details
Tx/Rx CURRENT CONSUMPTION
DETAILS
Figure 5-1 illustrates the Tx/Rx peak current
consumption of 12 mA during an advertising event.
However, the average current consumption is only
around 230 μA while advertising at an interval of
approximately 100 ms, see Figure 5-2. This is due to
the “Reduced Current Consumption” Low Power mode
being
enabled
(configuration
parameter
UART_RX_IND). Reducing the current draw to
approximately 60 μA, while not actively transmitting the
FIGURE 5-1:
DS60001372L-Page 40
advertisings packets, refer to the “BM70/71 Bluetooth®
Low Energy Module User’s Guide” (DS50002542) for
more details.
The overall average current consumption is measured
with a 3.3V VBAT input, and is affected by the way the
IS1870/71 IC on the BM70/71 module has been configured to operate. A low average current value can be
achieved by choosing the minimum settings for the
advertising interval and connection interval, which
meet the data throughput requirements of the intended
application. The lower or less frequent the interval time
periods, the lower the overall average current to be
drawn.
TX/RX PEAK CURRENT CONSUMPTION OF AN ADVERTISING EVENT
2015-2021 Microchip Technology Inc.
BM70/71
Figure 5-2 illustrates the oscilloscope screen, captured
when the auto operation and Low Power mode is active
on the BM70/71 module. Refer to the “BM70/71 Bluetooth® Low Energy Module User’s Guide”
(DS50002542) for more details on the auto operation.
FIGURE 5-2:
TX/RX AVERAGE CURRENT CONSUMPTION WHILE BM70/71 MODULE IS
ADVERTISING
For additional information on the current consumption
measurements, test conditions and test environment
setup, refer to the “BM70/71 Bluetooth® Low Energy
Module User’s Guide” (DS50002542).This user guide
provides detailed information about the behavior of the
default internal logic of the IS1870/71 IC on the
BM70/71 module.
2015-2021 Microchip Technology Inc.
DS60001372L-Page 41
BM70/71
Table 5-3 provides the average current consumption
measurements for the BM70/71 module in Application
mode.
TABLE 5-3:
BM70/71 APPLICATION MODE CURRENT CONSUMPTION MEASUREMENTS
Test Mode
Advertising (see Note 1,2,3)
Connected (see Note 1,2,4)
Interval [ms]
Average Current Consumption
20
1.061 mA
50
505 μA
100
298 μA
500
113 μA
1000
89 μA
18.75
2.23 mA
50
2.13 mA
100
2.10 mA
500
83 μA
1000
80 μA
Note 1: These measurements are done at an operating temperature of +25°C at 3.3V and are characterized across
a sample of BM70/71 modules.
2: These measurements are taken with version 1.06 firmware, loaded into the module with “Reduced Current
Consumption” Low Power mode enabled. For more details on Low Power modes and current consumption
configuration, refer to “BM70/71 Bluetooth® Low Energy Module User's Guide” (DS50002542).
3: The advertising packet data payload is approximately 15 bytes in length.
4: The amount of data being transmitted between two peer devices can affect the average current measured.
The average current measurements are done with only the necessary Bluetooth packets being exchanged
to keep the connection active at the stated interval.
DS60001372L-Page 42
2015-2021 Microchip Technology Inc.
BM70/71
6.0
PHYSICAL DIMENSIONS
6.1
BM70BLES1FC2
Figure 6-1 illustrates the physical dimensions of the
BM70BLES1FC2 module.
FIGURE 6-1:
BM70BLES1FC2 MODULE DIMENSIONS
2015-2021 Microchip Technology Inc.
DS60001372L-Page 43
BM70/71
Figure 6-2 illustrates the recommended PCB footprint.
Ensure that no top copper layer is near the test pin
area.
FIGURE 6-2:
DS60001372L-Page 44
BM70BLES1FC2 RECOMMENDED PCB FOOTPRINT
2015-2021 Microchip Technology Inc.
BM70/71
6.2
BM70BLE01FC2
Figure 6-3 illustrates the physical dimensions of the BM70BLE01FC2 module.
FIGURE 6-3:
BM70BLE01FC2 MODULE DIMENSIONS
2015-2021 Microchip Technology Inc.
DS60001372L-Page 45
BM70/71
Figure 6-4 illustrates the recommended PCB footprint.
FIGURE 6-4:
DS60001372L-Page 46
BM70BLE01FC2 RECOMMENDED PCB FOOT PRINT
2015-2021 Microchip Technology Inc.
2015-2021 Microchip Technology Inc.
6.3
BM71BLES1FC2
Figure 6-5 illustrates the physical dimensions of the BM71BLES1FC2 module.
FIGURE 6-5:
BM71BLES1FC2 MODULE DIMENSIONS
BM70/71
DS60001372L-Page 47
BM70/71
Figure 6-6 illustrates the recommended PCB footprint. Ensure that no top copper layer is near the test pin area.
FIGURE 6-6:
DS60001372L-Page 48
BM71BLES1FC2 RECOMMENDED PCB FOOTPRINT
2015-2021 Microchip Technology Inc.
2015-2021 Microchip Technology Inc.
6.4
BM71BLE01FC2
Figure 6-7 illustrates the physical dimensions of the BM71BLE01FC2 module.
FIGURE 6-7:
BM71BLE01FC2 MODULE DIMENSIONS
BM70/71
DS60001372L-Page 49
BM70/71
Figure 6-8 illustrates the recommended PCB footprint.
FIGURE 6-8:
DS60001372L-Page 50
BM71BLE01FC2 RECOMMENDED PCB FOOTPRINT
2015-2021 Microchip Technology Inc.
BM70/71
7.0
SOLDERING
RECOMMENDATIONS
The BM70/71 module is assembled using a standard
lead-free, reflow profile, IPC/JEDEC J-STD-020. The
BM70/71 module can be soldered to the host PCB by
using the standard lead or lead-free solder reflow
profiles.
To avoid any damage to the BM70/71 module, follow
these recommendations:
• Refer to the “AN233 Solder Reflow Recommendation” (DS00233) document for the soldering
reflow recommendations
• Do not exceed the peak temperature (TP) of
+260˚C
• Use no-clean flux solder paste
• Do not wash the BM70/71 module, as moisture
can be trapped under the shield
• Use only one flow. If the PCB requires multiple
flows, apply the BM70/71 module on the final flow
Figure 7-1 illustrates the reflow profile of the BM70/71
module.
FIGURE 7-1:
REFLOW PROFILE
2015-2021 Microchip Technology Inc.
DS60001372L-Page 51
BM70/71
NOTES:
DS60001372L-Page 52
2015-2021 Microchip Technology Inc.
2015-2021 Microchip Technology Inc.
8.0
ORDERING GUIDE
Table 8-1 provides the ordering information for the BM70/71 module.
TABLE 8-1:
BM70/71 MODULE ORDERING INFORMATION
Orderable Part
Number
(see Note 1 and 2)
Firmware
Version
Antenna
Shield
Pin #
Regulatory
Certification
Regulatory Model
No. (see Note 3)
Bluetooth BLE
module,
(12x15x1.6 mm)
-20°C to +70°C
V1.03
External
No
30
No
N/A
BM70BLE01FC2-00
02AA
BM70
Bluetooth BLE
module,
(12x15x2.4 mm)
-20°C to +70°C
V1.03
On board
Yes
33
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2
BM70BLES1FC2-00
02AA
BM71
Bluetooth BLE
module,
(6x8x1.6 mm)
-20°C to +70°C
V1.06
External
No
17
No
N/A
BM71BLE01FC2-00
02AA
BM71
Bluetooth BLE
module,
(9x11.5x2.1 mm)
-20°C to +70°C
V1.06
On board
Yes
16
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2
BM71BLES1FC2-00
02AA
BM70
Bluetooth BLE
module,
(12x15x1.6 mm)
-40°C to +85°C
V1.06
External
No
30
No
N/A
BM70BLE01FC2-0B
03AA
BM70
Bluetooth BLE
module,
(12x15x2.4 mm)
-40°C to +85°C
V1.06
On board
Yes
33
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2
BM70BLES1FC2-0B
03AA
BM71
Bluetooth BLE
module,
(6x8x1.6 mm)
-40°C to +85°C
V1.06
External
No
17
No
N/A
BM71BLE01FC2-0B
02AA
BM71
Bluetooth BLE
module,
(9x11.5x2.1 mm)
-40°C to +85°C
V1.06
On board
Yes
16
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2
BM71BLES1FC2-0B
02AA
BM70
Bluetooth BLE
module,
(12x15x2.4 mm)
-40°C to +85°C
V1.11
On board
Yes
33
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM70BLES1FC2
BM70BLES1FC2-0B
04AA
BM71
Bluetooth BLE
module,
(9x11.5x2.1 mm)
-40°C to +85°C
V1.11
On board
Yes
16
FCC, ISED, CE,
MIC, KCC,
NCC, SRRC
BM71BLES1FC2
BM71BLES1FC2-0B
04AA
Description
BM70
Note 1: With the introduction of the IS187xSF-202 IC, the PC tools provided by Microchip which change/control Bluetooth operation have been revised.
The correct tool version must be paired with the applicable module/IC part number.
All module parts ending with BM7xBLEX1FC2-0BxxAA must use the PC tools ending with 0BxxAA.
All module parts ending with BM7xBLEX1FC2-0002AA must use the PC tools ending with 0002AA.
2: The numbers listed under “Orderable Part Number” must be used when purchasing a specific module from Microchip.
3: “Regulatory Model No.” column represents the Model No. listed in Microchip's regulatory notices. The extensions used to order/buy a specific version of the
module are listed in the “Orderable Part Number”.
BM70/71
DS60001372L-Page 53
Operating
Temperature
Range
Module
BM70/71
NOTES:
DS60001372L-Page 54
2015-2021 Microchip Technology Inc.
BM70/71
APPENDIX A:
CERTIFICATION
NOTICES
The BM70 module (BM70BLES1FC2) has received the
regulatory approval for the following countries:
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM70ABCDEFGH
• Canada/ISED
- IC: 12246A-BM70BLES1F2
- HVIN: BM70BLES1F2
• Europe/CE
• Japan/MIC: 202-SMD069
• Korea/KCC: MSIP-CRM-mcp-BM70BLES1FC2
• Taiwan/NCC No: CCAN15LP0500T1
• China/SRRC: CMIIT ID: 2015DJ7135
The BM71 module (BM71BLES1FC2) has received the
regulatory approval for the following countries:
• BT SIG/QDID:74246
• United States/FCC ID: A8TBM71S2
• Canada/ISED
- IC: 12246A-BM71S2
- HVIN: BM71BLES1FC2
• Europe/CE
• Japan/MIC: 005-101150
• Korea/KCC: MSIP-CRM-mcp-BM71BLES1FC2
• Taiwan/NCC No: CCAN16LP0010T5
• China/SRRC: CMIIT ID: 2016DJ2787
• Brazil/ANATEL: 02699-19-08759
A.1
United States
The BM70/71 Module has received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators”
single-modular approval in accordance with Part
15.212 Modular Transmitter approval. Single-modular
transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated
into another device, that must demonstrate compliance
with FCC rules and policies independent of any host. A
transmitter with a modular grant can be installed in different end-use products (referred to as a host, host
product, or host device) by the grantee or other equipment manufacturer, then the host product may not
require additional testing or equipment authorization
for the transmitter function provided by that specific
module or limited module device.
The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or
operating conditions necessary for compliance.
example, compliance must be demonstrated: to regulations for other transmitter components within a host
product; to requirements for unintentional radiators
(Part 15 Subpart B), such as digital devices, computer
peripherals, radio receivers, etc.; and to additional
authorization requirements for the non-transmitter
functions on the transmitter module (i.e., Verification, or
Declaration of Conformity) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain
digital logic functions).
A.1.1
LABELING AND USER
INFORMATION REQUIREMENTS
The BM70 module has been labeled with its own FCC
ID number, and if the FCC ID is not visible when the
module is installed inside another device, then the outside of the finished product into which the module is
installed must also display a label referring to the
enclosed module. This exterior label should use the following wording:
For the BM70 module:
Contains Transmitter Module
FCC ID: A8TBM70ABCDEFGH
or
Contains FCC ID: A8TBM70ABCDEFGH
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation
Due to the limited size of the BM71, the FCC Identifier
(FCC ID) is displayed in the datasheet only and it cannot be displayed on the module. Therefore, the FCC ID
must be placed on the outside of the finished product
into which the module is installed must also display a
label referring to the enclosed module.
This exterior label can use wording as follows:
For the BM71 module:
Contains Transmitter Module FCC ID: A8TBM71S2
or
Contains FCC ID: A8TBM71S2
This device complies with Part 15 of the FCC
Rules. Operation is subject to the following two
conditions: (1) this device may not cause harmful
interference, and (2) this device must accept any
interference received, including interference that
may cause undesired operation
The host product itself is required to comply with all
other applicable FCC equipment authorizations, regulations, requirements and equipment functions that are
not associated with the transmitter module portion. For
2015-2021 Microchip Technology Inc.
DS60001372L-Page 55
BM70/71
The user's manual for the product must include the following statement:
This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed
to provide reasonable protection against harmful
interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However,
there is no guarantee that interference will not occur
in a particular installation. If this equipment does
cause harmful interference to radio or television
reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna
• Increase the separation between the equipment
and receiver
• Connect the equipment into an outlet on a circuit
different from that to which the receiver is connected
• Consult the dealer or an experienced radio/TV
technician for help
Additional information on labeling and user information
requirements for Part 15 devices can be found in KDB
Publication 784748, which is available at the FCC
Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB)
https://apps.fcc.gov/oetcf/kdb/index.cfm.
A.1.2
RF EXPOSURE
All transmitters regulated by FCC must comply with RF
exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining
whether proposed or existing transmitting facilities,
operations or devices comply with limits for human
exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).
From the FCC Grant: Output power listed is conducted.
This grant is valid only when the module is sold to OEM
integrators and must be installed by the OEM or OEM
integrators. This transmitter is restricted for use with
the specific antenna(s) tested in this application for
Certification and must not be co-located or operating in
conjunction with any other antenna or transmitters
within a host device, except in accordance with FCC
multi-transmitter product procedures. This module is
approved for installation into mobile or/and portable
host platforms
DS60001372L-Page 56
A.1.3
APPROVED ANTENNAS
To maintain modular approval in the United States, only
the antenna types that have been tested shall be used.
It is permissible to use different antenna, provided the
same antenna type, antenna gain (equal to or less
than), with similar in-band and out-of band characteristics (refer to specification sheet for cutoff frequencies).
For BM70, the approval is received using the antenna
listed in Table 4-3.
For BM71, the approval is received using the antenna
listed in Table 4-4.
A.1.4
HELPFUL WEB SITES
Federal
Communications
http://www.fcc.gov
Commission
(FCC):
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):
https://apps.fcc.gov/oetcf/kdb/index.cfm.
A.2
Canada
The BM70/71 module has been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio
Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-247 and RSS-Gen.
Modular approval permits the installation of a module in
a host device without the need to recertify the device.
A.2.1
LABELING AND USER
INFORMATION REQUIREMENTS
Labeling Requirements for the Host product (from
RSP-100, Issue 12, Section 5): The host product shall
be properly labeled to identify the module within the
host device.
On the BM71, due to the limited module size, the IC
identifier is displayed in the data sheet only and it cannot be displayed on the module label.
The Innovation, Science and Economic Development
Canada certification label of a module shall be clearly
visible at all times when installed in the host device;
otherwise, the host device must be labeled to display
the Innovation, Science and Economic Development
Canada certification number of the module, preceded
by the word “Contains”, or similar wording expressing
the same meaning, as follows:
For the BM70 module:
Contains IC: 12246A-BM70BLES1F2
For the BM71 module:
Contains IC: 12246A-BM71S2
2015-2021 Microchip Technology Inc.
BM70/71
User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4, RSS-Gen, Issue 5, March 2019):
User manuals for license-exempt radio apparatus shall
contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the
device or both:
This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation,
Science and Economic Development Canada’s
license-exempt RSS(s). Operation is subject to
the following two conditions:
1. This device may not cause interference;
2. This device must accept any interference,
including interference that may cause undesired
operation of the device.
L’émetteur/récepteur exempt de licence contenu
dans le présent appareil est conforme aux CNR
d’Innovation, Sciences et Développement
économique Canada applicables aux appareils
radio exempts de licence. L’exploitation est
autorisée aux deux conditions suivantes:
1. L’appareil ne doit pas produire de brouillage;
2. L’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est
susceptible d’en compromettre le fonctionnement.
Transmitter Antenna (From Section 6.8 RSS-GEN,
Issue 5, March 2019): User manuals, for transmitters
shall display the following notice in a conspicuous location:
This radio transmitter [IC: 12246A-BM70BLES1F2
and IC: 12246A-BM71S2] has been approved by
Innovation, Science and Economic Development
Canada to operate with the antenna types listed
below, with the maximum permissible gain indicated. Antenna types not included in this list that
have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for
use with this device.
Le présent émetteur radio
[IC: 12246A-BM70BLES1F2 and
IC: 12246A-BM71S2] a été approuvé par Innovation, Sciences et Développement économique
Canada pour fonctionner avec les types
d'antenne énumérés cidessous et ayant un gain
admissible maximal. Les types d'antenne non
inclus dans cette liste, et dont le gain est
supérieur au gain maximal indiqué pour tout type
figurant sur la liste, sont strictement interdits
pour l'exploitation de l'émetteur.
Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved
for use with the transmitter, indicating the maximum
permissible antenna gain (in dBi) and required impedance for each.
2015-2021 Microchip Technology Inc.
A.2.2
RF EXPOSURE
All transmitters regulated by the Innovation, Science
and Economic Development Canada (ISED) must
comply with RF exposure requirements listed in
RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands).
This transmitter is restricted for use with a specific
antenna tested in this application for certification, and
must not be co-located or operating in conjunction with
any other antenna or transmitters within a host device,
except in accordance with Innovation, Science and
Economic Development Canada multi-transmitter
guidelines.
The installation of the transmitter must ensure compliance is demonstrated according to the ISED SAR procedures.
A.2.3
APPROVED ANTENNAS
For BM70, the approval is received using the antenna
listed in Table 4-3.
For BM71, the approval is received using the antenna
listed in Table 4-4.
A.2.4
HELPFUL WEB SITES
Innovation, Science and Economic Development Canada (ISED): http://www.ic.gc.ca/
A.3
Europe
The BM70/71 module is Radio Equipment Directive
(RED) assessed, CE marked, and have been manufactured and tested with the intention of being integrated
into a final product.
The BM70/71 module has been tested to RED
2014/53/EU Essential Requirements mentioned in the
following European Compliance table.
TABLE A-1:
EUROPEAN COMPLIANCE
Certification
Standards
Article
Safety
EN 62368
Health
EN 62311
3.1(a)
Electro Magnetic
Compatibility (EMC)
EN 301 489
3.1(b)
Radio
EN 300 328
3.2
The ETSI provides guidance on modular devices in
“Guide to the application of harmonised standards covering Article 3.1(b) and Article 3.2 of the Directive
2014/53/EU RED to multi-radio and combined radio
and non-radio equipment” document available at
http://www.etsi.org/deliver/etsi_eg/203300_203399/20
3367/01.01.01_60/eg_203367v010101p.pdf.
DS60001372L-Page 57
BM70/71
Note:
A.3.1
To maintain conformance to the standards
listed in the preceding European Compliance table, the module shall be installed in
accordance with the installation instructions in this data sheet and shall not be
modified. When integrating a radio module into a completed product the integrator
becomes the manufacturer of the final
product and is therefore responsible for
demonstrating compliance of the final
product with the essential requirements
against the RED.
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product, which contains the
BM70/71 module, must follow the CE marking requirements.
A.3.2
A.4
If the manufacturer of the combined equipment installs
the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the
one used for the assessment of the radio product) and
according to the installation instructions for the radio
product, then no additional assessment of the combined equipment against article 3.2 of the RED is
required.
UKCA (UK Conformity Assessed)
The BM70/71 module is a UK conformity assessed
radio module that meets all the essential requirements
according to CE RED requirements.
A.4.1
CONFORMITY ASSESSMENT
From ETSI Guidance Note EG 203367, section 6.1
Non-radio products are combined with a radio product:
A.3.3
• Radio Equipment Directive (2014/53/EU):
https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en
• European Conference of Postal and Telecommunications Administrations (CEPT):
http://www.cept.org
• European Telecommunications Standards Institute (ETSI): http://www.etsi.org
• The Radio Equipment Directive Compliance
Association (REDCA): http://www.redca.eu/
LABELING REQUIREMENTS FOR
MODULE AND USER’S
REQUIREMENTS
The label on the final product that contains the
BM70/71 module must follow the UKCA marking
requirements.
APPROVED ANTENNAS
For BM70, the approval is received using the antenna
listed in Table 4-3.
For BM71, the approval is received using the antenna
listed in Table 4-4.
A.3.3.1
SIMPLIFIED EU DECLARATION OF
CONFORMITY
Hereby, Microchip Technology Inc. declares that the
radio equipment type BM70/71 is in compliance with
Directive 2014/53/EU.
The full text of the EU declaration of conformity, for this
product, is available at (under Documents > Certifications):
• http://www.microchip.com/BM70
• http://www.microchip.com/BM71
A.3.4
HELPFUL WEBSITES
A document that can be used as a starting point in
understanding the use of Short Range Devices (SRD)
in Europe is the European Radio Communications
Committee (ERC) Recommendation 70-03 E, which
can be downloaded from the European Communications Committee (ECC) at: http://www.ecodocdb.dk/
The UKCA mark above is printed on the module itself
or on the packing label.
Additional details for the label requirement are available at:
https://www.gov.uk/guidance/using-the-ukca-marking#check-whether-you-need-to-use-the-new-ukca-m
arking.
A.4.2
UKCA DECLARATION OF
CONFORMITY
Hereby, Microchip Technology Inc. declares that the
radio equipment type BM70/71 is in compliance with
the Radio Equipment Regulations 2017.
Additional helpful web sites are:
DS60001372L-Page 58
2015-2021 Microchip Technology Inc.
BM70/71
The full text of the UKCA declaration of conformity for
this product is available (under Documents > Certifications) at:
on the module label. The final product in which this
module is being used must have a label referring to the
type certified module inside:
• http://www.microchip.com/BM70
• http://www.microchip.com/BM71
A.4.3
APPROVED ANTENNAS
For BM70, the approval is received using the antenna
listed in Table 4-3.
For BM71, the approval is received using the antenna
listed in Table 4-4.
A.4.4
HELPFUL WEB SITES
For more information on the UKCA regulatory approvals, refer to the https://www.gov.uk/guidance/placing-manufactured-goods-on-the-market-in-great-britai
n.
A.5
Japan
The BM70/71 module has received type certification
and is labeled with its own technical conformity mark
and certification number as required to conform to the
technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant
to the Radio Act of Japan.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed. Additional testing may be
required:
• If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product
Safety Electrical Appliance and Material (PSE)
testing. The integrator should contact their conformance laboratory to determine if this testing is
required
• There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered
by VCCI: http://www.vcci.jp/vcci_e/index.html
A.5.1
For the BM71 module, due to the limited module size,
the technical conformity logo and ID are displayed in
the data sheet only and cannot be displayed on the
module label. The final product in which this module is
being used must have a label referring to the type certified module inside:
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow Japan marking requirements. The integrator of the module should refer to the
labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website.
A.5.2
HELPFUL WEB SITES
Ministry of Internal Affairs and Communications (MIC):
http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses
(ARIB): http://www.arib.or.jp/english/
A.6
Korea
The BM70/71 module has received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
A.6.1
LABELING AND USER
INFORMATION REQUIREMENTS
The label on the final product which contains the
BM70/71 module must follow KC marking requirements. The integrator of the module should refer to the
labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.
The BM70 module is labeled with its own KC mark. The
final product requires the KC mark and certificate number of the module:
For the BM70 module, due to a limited module size, the
technical conformity logo and ID is displayed in the
data sheet and/or packaging and cannot be displayed
2015-2021 Microchip Technology Inc.
DS60001372L-Page 59
BM70/71
On the BM71 module, due to the limited module size
(9.0 mm x 11.5 mm) the KC mark and identifier is displayed in the data sheet only and cannot be displayed
on the module label. The final product requires the KC
mark and certificate number of the module:
A.6.2
HELPFUL WEB SITES
Korea Communications Commission (KCC):
http://www.kcc.go.kr
National Radio Research Agency (RRA):
http://rra.go.kr
A.7
Taiwan
The BM70/71 module has received compliance
approval in accordance with the Telecommunications
Act. Customers seeking to use the compliance
approval in their product should contact Microchip
Technology sales or distribution partners to obtain a
Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
A.7.1
LABELING AND USER
INFORMATION REQUIREMENTS
For the BM70 module, due to the limited module size,
the NCC mark and ID are displayed in the data sheet
only and cannot be displayed on the module label:
On the BM71 module, due to the limited module size
(9.0 mm x 11.5 mm) the NCC mark and identifier is displayed in the data sheet only and cannot be displayed
on the module label.
DS60001372L-Page 60
2015-2021 Microchip Technology Inc.
BM70/71
The user's manual should contain following warning
(for RF device) in traditional Chinese:
注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機,非經許
可,
公司、商號或使用者均不得擅自變更頻率、加大功率或
變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及
干擾合法通信;
經發現有干擾現象時,應立即停用,並改善至無干擾時
方得繼續使用。
前項合法通信,指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用
電波輻射性
電機設備之干擾。
A.7.2
A.8
Commission
(NCC):
Brazil
The BM71BLES1FC2/BM71BLE01FC2 module has
received compliance approval in accordance with the
Telecommunications Act of the Federal Republic of
Brazil National Telecommunications Agency (ANATEL). Refer to CoC available in the BM71 product webpage for expiry date. Customers seeking to use the
compliance approval in their product must contact
Microchip Technology Inc. sales or distribution partners
to obtain a Letter of Authority.
Integration of this module into a final product does not
require additional radio certification provided installation instructions are followed and no modifications of
the module are allowed.
Modelo: BM71BLES1FC2
China
The BM70/71 module has received certification of conformity in accordance with the China MIIT Notice
2014-01 of State Radio Regulation Committee (SRRC)
certification scheme. Integration of this module into a
final product does not require additional radio certification, provided installation instructions are followed and
no modifications of the module are allowed. Refer to
SRRC certificate available in the BM70 or BM71 product page for expiry date.
A.8.1
A.9
For BM71BLES1FC2:
HELPFUL WEB SITES
National Communications
http://www.ncc.gov.tw
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC
approved Radio module CMIIT ID: 2016DJ2787”.
LABELING AND USER
INFORMATION REQUIREMENTS
The BM70 module is labeled with its own CMIIT ID as
follows:
02699-19-08759
"Este equipamento não tem direito à proteção contra
interferência prejudicial e não pode causar interferência
em sistemas devidamente autorizados".
The End product (Host) manual must include the following statement:
Este
product
contém
a
placa
Modelo
BM71BLES1FC2 código de homologação ANATEL
02699-19-08759.
When Host system is using an approved Full Modular
Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC
approved Radio module CMIIT ID: 2015DJ7135”.
On the BM71 module, due to the limited module size
(9.0 mm x 11.5 mm) the CMIIT ID is displayed in the
data sheet only and cannot be displayed on the module
label:
2015-2021 Microchip Technology Inc.
DS60001372L-Page 61
BM70/71
For BM71BLE01FC2:
Modelo: BM71BLE01FC2
02699-19-08759
"Este equipamento não tem direito à proteção contra
interferência prejudicial e não pode causar interferência
em sistemas devidamente autorizados".
The End product (Host) manual must include the following statement:
Este
product
contém
a
placa
Modelo
BM71BLE01FC2 código de homologação ANATEL
02699-19-08759.
A.9.1
HELPFUL WEB SITES
• ANATEL: www.anatel.gov.br.
A.10
Other Regulatory Information
• For information on the approvals received from
the other countries’ jurisdictions, which are not
covered here, are available at (under Documents
> Certifications):
- http://www.microchip.com/BM70
- http://www.microchip.com/BM71
• Should other regulatory jurisdiction certification be
required by the customer, or the customer needs
to recertify the module for other reasons, contact
Microchip for the required utilities and documentation.
DS60001372L-Page 62
2015-2021 Microchip Technology Inc.
BM70/71
APPENDIX B:
REVISION HISTORY
Revision A (October 2015)
This is the initial released version of the document.
Revision B (October 2015)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
TABLE B-1:
MAJOR SECTION UPDATES
Section
“Features”
Update Description
This section was updated with certification informations. The data
from this section was reformatted and distributed in other sections.
“MAC/Baseband/Higher Layer Features”, • These sections are newly added.
“External antenna (BM7xBLE01FC2) connection through RF pad”, “Operating Conditions”,and FIGURE 2: “BM71 MODULE”
“General Description”
This section was previously placed in chapter 1 and was moved
here.
1.0 “Device Overview”
Table 1-2, Table 1-4 and Table 1-5 were added.
2.0 “Application Information”
This chapter contains information that was previously located in
Appendix A and Electrical Characteristics.
8.0 “Ordering Guide”
Table 8-1 was updated with Y-axis information and certification
information.
Appendix A: “Certification Notices”
This section was updated with images for the Certification Marking
and their numbers. The regulatory information was updated to be
the latest.
5.0 “Electrical Characteristics”
Table 5-3 was added.
Revision C (November 2015)
Updated Appendix A: “Certification Notices”.
Revision D (March 2016)
This revision includes the following changes as well as
minor updates to text and formatting incorporated
throughout the document.
TABLE D-1:
MAJOR SECTION UPDATES
Section
Update Description
1.1 “Interface Description”
This section was updated with a note.
Updated Figure 1-1, Figure 1-2, Figure 1-6
2.1 “Reference Schematics”
Figure 2-1 through Figure 2-8, Figure 2-10, Figure 5-1, Figure 5-2,
Figure 2-11, Figure 4-1 and Table 4-1, Table 8-1
“Absolute Maximum Ratings”
Updated this section.
5.1.1 “Tx/Rx current consumption details”
Updated this section with new content.
8.0 “Ordering Guide”
This section was updated with a note.
Appendix A: “Certification Notices”
Content has been updated
2015-2021 Microchip Technology Inc.
DS60001372L-Page 63
BM70/71
Revision E (January 2017)
This revision includes the following changes as well as
minor updates to text and formatting, which were
incorporated throughout the document.
TABLE E-1:
MAJOR SECTION UPDATES
Section
Update Description
“Features”
Updated this section.
“MAC/Baseband/Higher Layer Features”
Updated this section.
• “External antenna (BM7xBLE01FC2)
connection through RF pad”
Updated the average current details.
“Operating Conditions”
Updated the operating temperature details.
1.0 “Device Overview”
Updated Figure 1-1, Figure 1-2, Table 1-1 and Table 1-2
Deleted Table 1-4
2.0 “Application Information”
Updated Figure 2-9 through Figure 2-11 and Figure 2-14
3.0 “Module Configuration”
Added Table 3-2 and updated this section.
4.3 “Antenna Considerations”
Added new section.
5.0 “Electrical Characteristics”
Updated ambient temperature details for part numbers ending with
0002 and 0B0x.
Deleted Table 5-2. Updated Table 5-1, Table 5-3. Added Table 5-2
8.0 “Ordering Guide”
Updated Table 8-1
Appendix A: “Certification Notices”
Updated this section.
Revision F (May 2017)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE F-1:
MAJOR SECTION UPDATES
Section
Update Description
1.0 “Device Overview”
Updated Table 1-1, Figure 1-6
6.0 “Physical dimensions”
Updated Figure 6-5 and Figure 6-6
8.0 “Ordering Guide”
Added Regulatory model information in Table 8-1
Appendix A: “Certification Notices”
Added the report number of “Radio” certification and notes in
Table A-1
Revision G (January 2018)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE G-1:
MAJOR SECTION UPDATES
Section
Update Description
“Features”
Updated Canada certification information.
1.0 “Device Overview”
Updated the NOTE.
2.0 “Application Information”
Updated 2.1“Reference Schematics”, Figure 2-1, Figure 2-3,
Figure 2-5 and Figure 2-7.
8.0 “Ordering Guide”
Updated Table 8-1 with Canada regulatory certification
information and deleted Microchip IC information.
DS60001372L-Page 64
2015-2021 Microchip Technology Inc.
BM70/71
TABLE G-1:
MAJOR SECTION UPDATES
Section
Appendix A: “Certification Notices”
Update Description
Updated the United States, Canada and Europe certification information.
Updated KDB and ECC URL links.
Revision H (July 2018)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE H-1:
MAJOR SECTION UPDATES
Section
Update Description
Document
Updated Bluetooth Specification.
Table 8-1
Updated Ordering Guide for New FW Version.
Appendix A: “Certification Notices”
Updated Regulatory Approval Section.
Revision J (January 2019)
This revision includes the following changes as well as
minor updates to text and formatting were incorporated
throughout the document.
TABLE J-1:
MAJOR SECTION UPDATES
Section
Update Description
Antenna
Added Antenna range values.
Table 1-1
Updated P1_6 pin.
Revision K (March 2021)
This revision includes the following change.
TABLE K-1:
MAJOR SECTION UPDATES
Section
Update Description
Figure 2-1
Updated Figure 2-5.
Appendix A: “Certification Notices”
•
•
•
•
•
•
Updated Approved Antennas section in United States section
Updated with latest standards in Canada section
Revamped Europe section
Updated China section with expiry date
Added Brazil related notice for BM71
Updated Other Regulatory Information
Revision L (November 2021)
This revision includes the following changes:
TABLE L-1:
MAJOR SECTION UPDATES
Section
A.4 “UKCA (UK Conformity Assessed)”
2015-2021 Microchip Technology Inc.
Update Description
Added UKCA regulatory approval information.
DS60001372L-Page 65
BM70/71
NOTES:
DS60001372L-Page 66
2015-2021 Microchip Technology Inc.
BM70/71
THE MICROCHIP WEBSITE
CUSTOMER SUPPORT
Microchip provides online support via our WWW site at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
Users of Microchip products can receive assistance
through several channels:
• Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
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Distributor or Representative
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Technical Support
Customers
should
contact
their
distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://microchip.com/support
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
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registration instructions.
2015-2021 Microchip Technology Inc.
DS60001372L-page 67
BM70/71
NOTES:
DS60001372L-page 68
2015-2021 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2021, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2015-2021 Microchip Technology Inc. and its subsidiaries
ISBN: 978-1-5224-9282-5
DS60001372L-page 69
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DS60001372L-page 70
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2015-2021 Microchip Technology Inc. and its subsidiaries
09/14/21