HV5812P-G

HV5812 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid Features • • • • • • • General Description HVCMOS® Technology for High Performance Operating Voltage of up to 80V High-speed Source Driver 5V CMOS Logic Circuitry Up to 5 MHz Data Input Rate Excellent Noise Immunity Flexible High-voltage Supplies The HV5812 is a 20-channel serial-input vacuum fluorescent display driver. It combines a 20-bit CMOS shift register, data latches and control circuitry with high-voltage MOSFET outputs. The HV5812 is primarily designed for vacuum fluorescent displays. The CMOS shift register and latches allow direct interfacing with microprocessor-based systems. Data input rates are typically over 5 MHz with 5V logic supply. Especially useful for interdigit blanking, the blanking input disables the output source drives and turns on the sink drivers. Using with TTL may require external pull-up resistors to ensure an input logic high. Applications • Display Driver Package Types 28-lead PDIP (Top view) 1 28 28-lead PLCC (Top view) 4 1 28 28-lead SOW (Top view) 26 1 28 See Table 2-1 for pin information.  2016 Microchip Technology Inc. DS20005629A-page 1 HV5812 Functional Block Diagram BL STROBE VPP HVOUT1 VDD HVOUT2 DATA IN CLK DATA OUT GND 20-bit Shift Register 20-bit Latch HVOUT3 HVOUT20  DS20005629A-page 2  2016 Microchip Technology Inc. HV5812 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings† Supply Voltage, VDD................................................................................................................................ –0.5V to +7.5V Supply Voltage, VPP .................................................................................................................................. –0.5V to +90V Logic Input Levels ............................................................................................................................ –0.3V to VDD +0.3V Maximum Operating Junction Temperature .........................................................................................................+125°C Storage Temperature ............................................................................................................................–55°C to +150°C Power Dissipation: 28-lead PDIP ......................................................................................................................................... 2000 mW 28-lead PLCC........................................................................................................................................ 1900 mW 28-Lead SOW........................................................................................................................................ 1700 mW † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Parameter Sym. Min. Typ. Max. Unit Supply Voltage VDD 4.5 — 5.5 V Supply Voltage VPP 20 — 80 V TJ –40 — +125 °C Operating Junction Temperature Conditions DC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated. Parameter Sym. Min. Typ. Max. Unit IDSS — –5 –15 µA Output Leakage Current 78 78.5 — 77 78 — 4.5 4.7 — — 1.5 3 HVOUT High-level Output VOH DATA OUT HVOUT Low-level Output VOL DATA OUT V V VOUT = 0V, TA = +70°C IOUT = –25 mA, VPP = 80V, TJ = +25°C  IOUT = –25 mA, VPP = 80V, TJ = +125°C  IOUT = –200 µA, VDD = 5V IOUT = 1 mA, TJ = +25°C, VDD = 5V V IOUT = 1 mA, TJ = +125°C, VDD = 5V IOUT = +200 µA, VDD = 5V — 2.3 4 — 200 250 V ISINK 2 3.5 — mA High-level Logic Input Voltage VIH 3.5 — 5.3 V — 0.8 V Output Pull-down Current Conditions VOUT = 5V to VPP, VDD = 5V VDD = 5V Low-level Logic Input Voltage VIL –0.3 High-level Logic Input Current IIH — 0.05 0.5 µA VIN = VDD, VDD = 5V Low-level Logic Input Current IIL — –0.05 –0.5 µA VIN = 0.8V, VDD = 5V — 100 300 — 100 300 — 10 100 — 10 100 Quiescent VDD Supply Current IDDQ Quiescent VPP Supply Current IPPQ  2016 Microchip Technology Inc. µA µA All outputs high, VDD = 5V All outputs low, VDD = 5V All outputs high, no load All outputs low, no load DS20005629A-page 3 HV5812 AC ELECTRICAL CHARACTERISTICS Electrical Specifications: Over recommended operating conditions; TA = 25°C unless otherwise indicated. Parameter Sym. Min. Typ. Max. tPHL — 2000 — tPLH — 1000 — Output Fall Time tr — 1450 Output Rise Time tf — Data Set-up Time tSU Data Hold Time Blanking to Output Delay Unit Conditions ns CL = 30 pF, 50% to 50%, VDD=5V — ns CL = 30 pF, 90% to 10%, VDD = 5V 650 — ns CL = 30 pF, 10% to 90%, VDD = 5V 75 — — ns See Timing Waveforms. tH 75 — — ns See Timing Waveforms. Minimum Data Pulse Width tPWD 150 — — ns See Timing Waveforms. Minimum Clock Pulse Width tPWCLK 150 — — ns See Timing Waveforms. Minimum Time between Clock Activation and Strobe tCKS 300 — — ns See Timing Waveforms. Minimum Strobe Pulse Width tPWS 100 — — ns SeeTiming Waveforms. Typical Time between Strobe Activation and Output Transition tSTO — 500 — ns See Timing Waveforms. Maximum Clock Frequency fCLK — 8 — — 5 — MHz TJ = +25°C, VDD = 5V TJ = +125°C, VDD = 5V TEMPERATURE SPECIFICATIONS Parameter Sym. Min. Typ. Max. Unit Operating Junction Temperature TJ –40 — +125 °C Storage Temperature TS –55 — +150 °C Conditions TEMPERATURE RANGE PACKAGE THERMAL RESISTANCE 28-lead PDIP JA — 43 — °C/W 28-lead PLCC JA — 48 — °C/W 28-lead SOW JA — 55 — °C/W DS20005629A-page 4  2016 Microchip Technology Inc. HV5812 Timing Waveforms tPWCLK CLK 50% VIH 50% VIL tSU DATA IN 50% VIH tPWD 50% VIL th STROBE tPWS tCKS 50% VIH 50% BL 50% 50% tPHL HVOUT tSTO 90% tr  2016 Microchip Technology Inc. 90% 50% 10% 10% tf VIL VIH tPLH 50% VIL VOH VOL DS20005629A-page 5 HV5812 2.0 PIN DESCRIPTION The details on the pins of HV5812 28-lead PDIP, 28-lead PLCC and 28-lead SOW are listed on Table 2-1. Refer to Package Types for the location of pins. TABLE 2-1: PIN FUNCTION TABLE Pin Number Pin Name 1 VPP 2 Data Out Serial data output. Data output for cascading to the data input of the next device. 3 HVOUT20 High-voltage output 4 HVOUT19 High-voltage output 5 HVOUT18 High-voltage output 6 HVOUT17 High-voltage output 7 HVOUT16 High-voltage output 8 HVOUT15 High-voltage output 9 HVOUT14 High-voltage output 10 HVOUT13 High-voltage output 11 HVOUT12 High-voltage output 12 HVOUT11 High-voltage output 13 BLANKING 14 GND 15 CLOCK 16 STROBE Strobe 17 HVOUT10 High-voltage output 18 HVOUT9 High-voltage output 19 HVOUT8 High-voltage output 20 HVOUT7 High-voltage output 21 HVOUT6 High-voltage output 22 HVOUT5 High-voltage output 23 HVOUT4 High-voltage output 24 HVOUT3 High-voltage output 25 HVOUT2 High-voltage output 26 HVOUT1 High-voltage output 27 Data In Serial data input 28 VDD DS20005629A-page 6 Description High-voltage power rail Blank Logic and high-voltage ground Data shift register clock Low-voltage logic power rail  2016 Microchip Technology Inc. HV5812 3.0 FUNCTIONAL DESCRIPTION Follow the steps below to power up and power down the HV5812: POWER-UP AND POWER-DOWN SEQUENCE Power-up Step Power-down Description Step 1 Connect ground. 1 2 Apply VDD. 2 3 Set all inputs (Data, CLK, etc.) to a known state 3 4 4 Apply VPP. (Note 1) Note 1: The VPP should not drop below VDD during operation. Shift Register Contents I1 I2 I3... IN-1 IN Remove VPP. Remove all inputs. Remove VDD. Disconnect ground. , FUNCTION TABLE (Note 1) Serial Clock Data Input Input Description Serial Strobe Data Input Output Latch Contents Output Contents I1 I2 I3... IN-1 IN Blanking I1 I2 I3... IN-1 IN H L to H H R1 R2...RN–2 RN–1 RN–1 — — — — — — — — — — L L to H L R1 R2...RN–2 RN–1 RN–1 — — — — — — — — — — X H to L R1 R2 R3...RN–1 RN RN — — — — — — — — — — — — X X X...X X X L R1 R2 R3...RN–1 RN — — — — — — — P1 P2 P3...PN–1 PN PN H P1 P2 P3...PN–1 PN L P1 P2 P3...PN–1 PN — — — — — — — — X X X...X X H L L L...L L Note 1: L = Low logic level H = High logic level X = Irrelevant  P = Present state R = Previous state VDD VPP VDD L/T GND GND GND Logic Inputs FIGURE 3-1: HVOUT Data Out INPUT Logic Data Output High Voltage Outputs IO Circuits.  2016 Microchip Technology Inc. DS20005629A-page 7 HV5812 4.0 PACKAGE MARKING INFORMATION 4.1 Packaging Information 28-lead PDIP XXXXXX e3 YYWWNNN Example XXXXXXXXX e3 YYWWNNN HV5812PJ e3 1611231 XXXXXXX e3 YYWWNNN e3 * Note: DS20005629A-page 8 HV5812P e3 1625859 28-lead PLCC 28-lead SOW Legend: XX...X Y YY WW NNN Example Example HV5812WG e3 1678896 Product Code or Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for product code or customer-specific information. Package may or not include the corporate logo.  2016 Microchip Technology Inc. HV5812 28-Lead PDIP (.600in Row Spacing) Package Outline (P) 1.565x.580in body, .250in height (max), .100in pitch D 28 E1 Note 1 (Index Area) E b1 1 D1 D1 b Top View View B View B A Seating Plane A A2 A1 L eA eB e A Side View View A - A Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU DSULQWHGLQGLFDWRU Symbol Dimension (inches) A A1 A2 b b1 D D1 E † .590 E1 † .140* .015 .125 .014 .030 1.380 .065 - - - - - - - - - .070 1.565 .085* .625 .580 MAX .250 .055* .195 .023 eA .100 BSC .600 BSC .485 MIN NOM † e eB L .600* .115 - - .700 .200 -('(&5HJLVWUDWLRQ069DULDWLRQ$%,VVXH%-XQH 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ ‚7KLVGLPHQVLRQGLIIHUVIURPWKH-('(&GUDZLQJ Drawings not to scale.  2016 Microchip Technology Inc. DS20005629A-page 9 HV5812 28-Lead PLCC Package Outline (PJ) .453x.453in. body, .180in. height (max), .050in. pitch .048/.042 x 45O D D1 1 4 .056/.042 x 45O 26 28 .150 MAX Note 1 (Index Area) 075 MAX E1 E Note 2 .020max (3 Places) Top View Vertical Side View View A b1 A Base .020 MIN Plane A1 A2 Seating Plane e b Horizontal Side View R View A Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Notes: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU a printed indicator. 2. $FWXDOVKDSHRIWKLVIHDWXUHPD\YDU\ Symbol Dimension (inches) A A1 A2 b b1 D D1 E E1 MIN .165 .090 .062 .013 .026 .485 .450 .485 .450 NOM .172 .105 - - - .490 .453 .490 .453 MAX .180 .120 .083 .021 .032 .495 .456 .495 .456 e R .050 BSC .035 .025 .045 JEDEC Registration MS-018, Variation AB, Issue A, June, 1993. Drawings not to scale. DS20005629A-page 10  2016 Microchip Technology Inc. HV5812 28-Lead SOW (Wide Body) Package Outline (WG) 17.90x7.50mm body, 2.65mm height (max), 1.27mm pitch D θ1 28 E1 E Gauge Plane L2 Note 1 (Index Area 0.25D x 0.75E1) L Seating Plane θ L1 1 Top View View B A View B h A A2 h Seating Plane b e A1 Note 1 A Side View View A - A Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging. Note: 1. $3LQLGHQWL¿HUPXVWEHORFDWHGLQWKHLQGH[DUHDLQGLFDWHG7KH3LQLGHQWL¿HUFDQEHDPROGHGPDUNLGHQWL¿HUDQHPEHGGHGPHWDOPDUNHURU a printed indicator. Symbol MIN Dimension NOM (mm) MAX A A1 A2 b D E E1 2.15* 0.10 2.05 0.31 17.70* 9.97* 7.40* 2.65 0.30 2.55* 0.51 17.90 18.10* 10.30 10.63* 7.50 7.60* e 1.27 BSC h L 0.25 0.40 0.75 1.27 L1 1.40 REF L2 0.25 BSC ș ș 0O 5O - - 8 O 15O JEDEC Registration MS-013, Variation AE, Issue E, Sep. 2005. 7KLVGLPHQVLRQLVQRWVSHFL¿HGLQWKH-('(&GUDZLQJ Drawings are not to scale. S # S 28SO G 0 1309  2016 Microchip Technology Inc. DS20005629A-page 11 HV5812 NOTES: DS20005629A-page 12  2016 Microchip Technology Inc. HV5812 APPENDIX A: REVISION HISTORY Revision A (October 2016) • Converted Supertex Doc# DSFP-HV5812 to Microchip DS20005629A • Changed the packaging quantity of 28-lead PLCC (PJ M904) from 500/Reel to 750/Reel and 28-lead SOW (WG) from 1000/Reel to 1600/Reel • Made minor text changes throughout the document  2016 Microchip Technology Inc. DS20005629A-page 13 HV5812 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device XX - Package Options X - Environmental X Media Type Device: HV5812 = 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid Packages: P PJ WG = = = 28-lead PDIP 28-lead PLCC 28-lead SOW Environmental: G = Lead (Pb)-free/RoHS-compliant Package Media Types: (blank) = = = = 13/Tube for a P Package 38/Tube for a PJ Package 1600/Reel f or a WG Package 750/Reel for a PJ Package M904 DS20005629A-page 14 Examples: a) HV5812P-G: b) HV5812PJ-G: c) HV5812PJ-G-M904: d) HV5812WG-G: 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead PDIP, 13/Tube 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead PLCC, 38/Tube 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead PLCC, 750/Reel 20-Channel Serial-Input Vacuum Fluorescent Display Driver for Anode or Grid, 28-lead SOW, 1600/Reel  2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2016 Microchip Technology Inc. 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