HV825
High-Voltage EL Lamp Driver IC
Features
•
•
•
•
•
•
•
General Description
®
Processed with HVCMOS Technology
1.0 to 1.6V Operating Supply Voltage
DC to AC Conversion
Output Load of Typically up to 6.0 nF
Adjustable Output Lamp Frequency
Adjustable Converter Frequency
Enable Function
The HV825 is a high-voltage driver designed for driving EL lamps typically up to 6.0 nF. The input supply
voltage range is from 1.0V to 1.6V. The device uses a
single inductor and a minimum number of passive
components. The typical output voltage that can be
applied to the EL lamp is ±56V.
The HV825 can be enabled/disabled by connecting
the RSW-Osc resistor to VDD/GND.
The HV825 has two internal oscillators to drive a switching bipolar junction transistor (BJT), and a high-voltage
EL lamp driver. The frequency for the switching BJT is
set by an external resistor connected between the RSW-
Applications
•
•
•
•
•
Pagers
Portable Transceivers
Cellular Phones
Remote Control Units
Calculators
Osc
pin and the VDD supply pin. The EL lamp driver fre-
quency is set by an external resistor connected between
the REL-Osc pin and the VDD pin. An external inductor is
connected between the LX and VDD pins. A 0.01 to
0.1 µF, 100V capacitor is connected between the CS pin
and the GND pin. The EL lamp is connected between
the VA pin and the VB pin.
The switching BJT charges the external inductor and
discharges it into the 0.01 to 0.1 µF, 100V capacitor at
the CS pin. The voltage at the CS pin will start to
increase. The outputs VA and VB are configured as an
H-bridge, and are switching in opposite states to
achieve a peak-to-peak voltage of two times the VCS
voltage across the EL lamp.
Typical Application Circuit
ON = VDD
OFF = 0V
0ȍ
1
VDD
REL-Osc
2
RSW-Osc
VA
7
3
CS
VB
6
4
LX
GND
5
8
Nȍ
560 μH
1N4148
VDD = VIN = 1.5V
0.1 μF
2
0.01 μF
100V
2015 Microchip Technology Inc.
EL Lamp
1.0 nF
16V
DS20005450A-page 1
HV825
Package Types
VDD
1
8
REL-Osc
RSW-Osc
2
7
VA
CS
3
6
VB
LX
4
5
GND
8-Lead SOIC / 8-Lead MSOP
Block Diagram
LX
CS
VDD
RSW-Osc
Switch
Osc
Q
VA
GND
Q
Output
Osc
Q
VB
REL-Osc
Q
Test Circuit
ON = VDD
OFF = GND
Enable
0ȍ
Nȍ
560 μH1
1N4148
VDD = VIN = 1.0V - 1.6V
0.1 μF
0.01 μF
100V
1:
1
VDD
REL-Osc
2
RSW-Osc
VA
7
3
CS
VB
6
4
LX
GND
5
8
Nȍ
4.7 nF
Equivalent to
1.5 in2 lamp
CSW
1.0 nF
Murata part # LGH4N561K04
DS20005450A-page 2
2015 Microchip Technology Inc.
HV825
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings(†)
VDD pin............................................................................................................................................................ 0.5 to 2.5V
Package Power Dissipation (MSOP-8) ................................................................................................................300 mW
Package Power Dissipation (SO-8)......................................................................................................................400 mW
Operating Ambient Temperature Range ................................................................................................... -25°C to +85°C
Storage Temperature Range...................................................................................................................-65°C to +150°C
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in
the operation listings of this specification is not implied. Exposure above maximum rating conditions for extended periods
may affect device reliability
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all specifications apply at TA = 25°C over recommended
operating conditions.
Parameters
On-resistance of switching transistor
VDD supply current
(including inductor current)
Sym.
Min.
Typ.
Max.
Unit
RON
—
—
15
Ω
IIN
—
30
38
mA
Conditions
I = 50 mA
VDD = 1.5V. See test circuit.
Quiescent VDD supply current
IDDQ
—
—
1.0
µA
RSW-OSC = GND
Output voltage on VCS
VCS
52
56
62
V
VDD = 1.5V. See test circuit.
Differential output voltage across lamp
VA-B
104
112
124
V
VDD = 1.5V. See test circuit.
VA-B output drive frequency
fEL
400
—
—
Hz
VDD = 1.5V. See test circuit.
Switching transistor frequency
fSW
—
30
—
KHz
VDD = 1.5V. See test circuit.
Switching transistor duty cycle
D
—
88
—
%
VDD
1.0
—
1.6
V
Load capacitance
CL
0
6
—
nF
Operating temperature
TA
-25
—
+85
°C
Low-level input voltage to
RSW-OSC resistor
VIL
0
—
0.2
V
VDD = 1.0–1.6V
High-level input voltage to
RSW-OSC resistor
VIH
VDD–0.5
—
VDD
V
VDD = 1.0–1.6V
Recommended Operating Conditions
Supply voltage
Enable/Disable Table
Typical Thermal Resistance
Package
Θja
8-Lead SOIC
101°C/W
8-Lead MSOP
216°C/W
2015 Microchip Technology Inc.
DS20005450A-page 3
HV825
2.0
APPLICATION INFORMATION
2.1
Typical Performance
TYPICAL PERFORMANCE
Lamp
Size
VIN
1.5 in²
1.5V 30 mA
Note:
2.2
IDD
VCS
fEL
Brightness
56V
450 Hz
3.65 ft-lm
Results use Murata part # LQH4N561K04,
max DC resistance = 14.5Ω
Diode
A fast reverse recovery diode is used (1N4148 or
equivalent).
2.3
CS Capacitor
A 0.01 to 0.1 µF, 100V capacitor to GND is used to
store the energy transferred from the inductor.
2.4
LX Inductor
The inductor LX is used to boost the low input voltage.
Table 2-1 shows the performance of the typical
application circuit.
TABLE 2-1:
2.6
REL-Osc Resistor
The lamp frequency is controlled via the REL-Osc pin.
The lamp frequency increases as REL-Osc decreases.
As the lamp frequency increases, the amount of current
drawn from the battery will increase and the output
voltage VCS will decrease. This is because the lamp will
draw more current from VCS when driven at higher
frequencies.
When the internal switch is on, the inductor is being
charged. When the internal switch is off, the charge in
the inductor will be transferred to the high voltage
capacitor CS. The energy stored in the capacitor is
connected to the internal H-bridge and therefore to the
lamp. In general, smaller value inductors, which can
handle more current, are more suitable to drive larger
lamps. As the inductor value decreases, the switching
frequency of the inductor (controlled by RSW-Osc)
should be increased to avoid saturation.
The test circuit uses a Murata (LQH4N561) 560 µH
inductor. Using different inductor values or inductors
from different manufacturers will affect the
performance.
As the inductor value decreases, smaller RSW-Osc
values should be used. This will prevent inductor
saturation. An inductor with the same inductance value
(560 µH) but lower series resistance will charge faster.
The RSW-Osc resistor value needs to be decreased to
prevent inductor saturation and high current
consumption.
2.7
CSW Capacitor
A 1 nF capacitor is recommended from the RSW-Osc pin
to GND. This capacitor is used to shunt any switching
noise that may couple into the RSW-Osc pin. A CSW
larger than 1 nF is not recommended.
In general, as the lamp size increases, a larger REL-Osc
is recommended to provide higher VCS. However, the
color of the lamp is dependent upon its frequency and
the shade of the color will change slightly with different
frequencies.
2.5
RSW-Osc Resistor
The switching frequency of the inductor is controlled via
the RSW-Osc. The switching frequency increases as the
RSW-Osc decreases. As the switching frequency
increases, the amount of current drawn from the
battery will decrease and the output voltage VCS will
also decrease.
DS20005450A-page 4
2015 Microchip Technology Inc.
HV825
3.0
PACKAGING INFORMATION
3.1
Package Marking Information
8-Lead MSOP*
Example:
8-Lead SOIC*
XXXXX
YWWNNN
HV825
5011L7
XXXXXXX
^^YYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Example:
HV825LG
e3 1343
1L7
Product Code or Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for product code or customer-specific information. Package may or
not include the corporate logo.
2015 Microchip Technology Inc.
DS20005450A-page 5
HV825
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging
DS20005450A-page 6
2015 Microchip Technology Inc.
HV825
Note: For the most current package drawings, see the Microchip Packaging Specification at www.microchip.com/packaging.
2015 Microchip Technology Inc.
DS20005450A-page 7
HV825
APPENDIX A:
REVISION HISTORY
Revision A (November 2015)
• Initial release of this document in the Microchip
format. This replaces version CO72913.
DS20005450A-page 8
2015 Microchip Technology Inc.
HV825
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
XX
Device
Package
Options
–
X
Environmental
X
–
Media Type
Device:
HV825
=
High Voltage EL Lamp Driver IC
Package:
LG
MG
=
=
8-lead SOIC
8-lead MSOP
Environmental:
G
=
Lead (Pb)-free/ROHS-compliant Package
Media Type:
(blank)
=
2500/Reel for LG and MG packages
2015 Microchip Technology Inc.
Examples:
a) HV825LG-G:
High Voltage EL Lamp Driver IC
8-lead SOIC package, 2500/reel
b) HV825MG-G:
High Voltage EL Lamp Driver IC
8-lead MSOP package, 2500/reel
DS20005450A-page 9
HV825
NOTES:
DS20005450A-page 10
2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0001-1
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005450A-page 11
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
Germany - Dusseldorf
Tel: 49-2129-3766400
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Austin, TX
Tel: 512-257-3370
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Kaohsiung
Tel: 886-7-213-7828
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
07/14/15
DS20005450A-page 12
2015 Microchip Technology Inc.