MCP4024T-503E/OT

MCP4021/2/3/4 Low-Cost NV Digital POT with WiperLock™ Technology Package Types • Nonvolatile Digital Potentiometer in SOT-23, SOIC, MSOP and DFN Packages • 64 Taps: 63 Resistors with Taps to Terminal A and Terminal B • Simple Up/Down (U/D) Protocol • Power-on Recall of Saved Wiper Setting • Resistance Values: 2.1 k, 5 k, 10 k or 50 k • Low Tempco: - Absolute (Rheostat): 50 ppm (0°C to 70°C Typ.) - Ratiometric (Potentiometer): 10 ppm (Typ.) • Low Wiper Resistance: 75 (Typ.) • WiperLock™ Technology to Secure the wiper setting in nonvolatile memory (EEPROM) • High-Voltage Tolerant Digital Inputs: up to 12.5V • Low-Power Operation: 1 µA Max Static Current • Wide Operating Voltage: 2.7V to 5.5V • Extended Temperature Range: –40°C to +125°C • Wide Bandwidth (-3 dB) Operation: - 4 MHz (Typ.) for 2.1 k Device MCP4021 MCP4022 SOIC, MSOP, DFN Potentiometer SOT-23-6 Rheostat VDD 1 VSS 2 A 3 A B W W 4 8 U/D VDD 1 7 NC VSS 2 6 B U/D 3 A 6 A W 5 W 4 CS B 5 CS MCP4023 MCP4024 SOT-23-6 Potentiometer SOT-23-5 Rheostat VDD 1 VSS 2 U/D 3 A W B 6 A VDD 1 5 W VSS 2 4 CS U/D 3 5 W W B A 4 CS Block Diagram A VDD Description VSS The MCP4021/2/3/4 devices are nonvolatile, 6-bit digital potentiometers that can be configured as either a potentiometer or rheostat. The wiper setting is controlled through a simple Up/Down (U/D) serial interface. Power-Up and Brown-Out Control 2-Wire Interface and Control Logic CS U/D These device’s implement Microchip’s WiperLock technology, which allows application-specific calibration settings to be secured in the EEPROM without requiring the use of an additional write-protect pin. Wiper Register (Resistor Array) Features W EEPROM and WiperLock Technology B Device Features Device Wiper Configuration Memory Type Resistance (typical) Options (k) VDD # of Control WiperLock Operating Steps Interface Technology Wiper () Range MCP4021 Potentiometer (1) EE 2.1, 5.0, 10.0, 50.0 75 64 2.7V - 5.5V U/D Yes MCP4022 Rheostat EE 2.1, 5.0, 10.0, 50.0 75 64 2.7V- 5.5V U/D Yes MCP4023 Potentiometer EE 2.1, 5.0, 10.0, 50.0 75 64 2.7V - 5.5V U/D Yes MCP4024 Rheostat EE 2.1, 5.0, 10.0, 50.0 75 64 2.7V - 5.5V U/D Yes Note 1: Floating either terminal (A or B) allows the device to be used in Rheostat mode. .  2006-2017 Microchip Technology Inc. DS20001945F-page 1 MCP4021/2/3/4 1.0 ELECTRICAL CHARACTERISTICS † Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings † VDD ............................................................................................................. 6.5V CS and U/D inputs w.r.t VSS................................... –0.3V to 12.5V A, B and W terminals w.r.t VSS................... –0.3V to VDD + 0.3V Current at Input Pins ..................................................±10 mA Current at Supply Pins ...............................................±10 mA Current at Potentiometer Pins ...................................±2.5 mA Storage temperature ....................................–65°C to +150°C Ambient temp. with power applied ...............–55°C to +125°C ESD protection on all pins  4 kV (HBM), 400V (MM) Maximum Junction Temperature (TJ) . .........................+150°C AC/DC CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 5.5V, VSS = 0V, TA = +25°C. Parameters Sym Min Typ Max Units Operating Voltage Range VDD 2.7 — 5.5 V CS Input Voltage VCS VSS — 12.5 V Supply Current IDD Resistance (± 20%) RAB Resolution N Step Resistance RS Note 1: 2: 3: 4: 5: 6: 7: 8: 9: Conditions The CS pin will be at one of three input levels (VIL, VIH or VIHH). (Note 6) — 45 — µA 5.5V, CS = VSS, fU/D = 1 MHz — 15 — µA 2.7V, CS = VSS, fU/D = 1 MHz — 0.3 1 µA Serial Interface Inactive (CS = VIH, U/D = VIH) — 0.6 3 mA EE Write cycle, TA = +25°C 1.68 2.1 2.52 k -202 devices(Note 1) 4.0 5 6.0 k -502 devices(Note 1) 8.0 10 12.0 k -103 devices(Note 1) 40.0 50 60.0 k -503 devices(Note 1) — RAB / 63 64 Taps —  No Missing Codes Note 6 Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V). MCP4021/23 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4022/24 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 µA 10 k 450 µA 210 µA 50 k 90 µA 40 µA Comments 2.7V MCP4022 includes VWZSE MCP4024 includes VWFSE Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0, "Resistor" for additional information. The MCP4021 is externally connected to match the configurations of the MCP4022 and MCP4024, and then tested. This parameter is not tested, but specified by characterization. DS20001945F-page 2  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 5.5V, VSS = 0V, TA = +25°C. Parameters Sym Min Typ Max Units RW — 70 125  — 70 325  — 50 — ppm/°C TA = –20°C to +70°C — 100 — ppm/°C TA = –40°C to +85°C — 150 — ppm/°C TA = –40°C to +125°C VWA/T — 10 — ppm/°C MCP4021 and MCP4023 only, code = 1Fh Full-Scale Error VWFSE -0.5 -0.1 +0.5 LSb Code 3Fh (MCP4021/23 only) Zero-Scale Error VWZSE -0.5 +0.1 +0.5 LSb Code 00h (MCP4021/23 only) Wiper Resistance (Note 3, Note 4) R/T Nominal Resistance Tempco Ratiometeric Tempco Monotonicity N Yes Conditions 5.5V 2.7V Bits Potentiometer Integral Non-linearity INL -0.5 ±0.25 +0.5 LSb MCP4021/23 only (Note 2) Potentiometer Differential Nonlinearity DNL -0.5 ±0.25 +0.5 LSb MCP4021/23 only (Note 2) VA,VW,VB Vss — VDD V Maximum current through A, W or B IW — — 2.5 mA Note 6 Leakage current into A, W or B IWL — 100 — nA MCP4021 A = W = B = VSS — 100 — nA MCP4022/23 A = W = VSS — 100 — nA MCP4024 W = VSS CAW — 75 — pF f =1 MHz, code = 1Fh Capacitance (Pw) CW — 120 — pF f =1 MHz, code = 1Fh Capacitance (PB) CBW — 75 — pF f =1 MHz, code = 1Fh Bandwidth -3 dB BW — 4 — MHz -202 devices — 2 — MHz -502 devices — 1 — MHz -103 devices — 200 — kHz -503 devices Resistor Terminal Input Voltage Range (Terminals A, B and W) Capacitance (PA) Note 1: 2: 3: 4: 5: 6: 7: 8: 9: Note 5, Note 6 Code = 1F, output load = 30 pF Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V). MCP4021/23 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4022/24 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 µA 10 k 450 µA 210 µA 50 k 90 µA 40 µA Comments 2.7V MCP4022 includes VWZSE MCP4024 includes VWFSE Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0, "Resistor" for additional information. The MCP4021 is externally connected to match the configurations of the MCP4022 and MCP4024, and then tested. This parameter is not tested, but specified by characterization.  2006-2017 Microchip Technology Inc. DS20001945F-page 3 MCP4021/2/3/4 AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 5.5V, VSS = 0V, TA = +25°C. Parameters Sym Rheostat Integral Non-linearity MCP4021 (Note 4, Note 8) MCP4022 and MCP4024 (Note 4) Rheostat Differential Non-linearity MCP4021 (Note 4, Note 8) MCP4022 and MCP4024 (Note 4) Note 1: 2: 3: 4: 5: 6: 7: 8: 9: R-INL R-DNL Min Typ Max Units -0.5 ±0.25 +0.5 LSb -8.5 +4.5 +8.5 LSb -0.5 ±0.25 +0.5 LSb -5.5 +2.5 +5.5 LSb -0.5 ±0.25 +0.5 LSb -3 +1 +3 LSb -0.5 ±0.25 +0.5 LSb -1 +0.25 +1 LSb -0.5 ±0.25 +0.5 LSb -1 +0.5 +2 LSb -0.5 ±0.25 +0.5 LSb -1 +0.25 +1.25 LSb -0.5 ±0.25 +0.5 LSb -1 0 +1 LSb -0.5 ±0.25 +0.5 LSb -0.5 0 +0.5 LSb Conditions -202 devices (2.1 k 2.7V (Note 7) 5.5V -502 devices (5 k 2.7V (Note 7) 5.5V -103 devices (10 k 5.5V 2.7V (Note 7) -503 devices (50 k 2.7V (Note 7) -202 devices (2.1 k 2.7V (Note 7) 5.5V 5.5V -502 devices (5 k 5.5V 2.7V (Note 7) -103 devices (10 k 2.7V (Note 7) -503 devices (50 k 2.7V (Note 7) 5.5V 5.5V Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V). MCP4021/23 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4022/24 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 µA 10 k 450 µA 210 µA 50 k 90 µA 40 µA Comments 2.7V MCP4022 includes VWZSE MCP4024 includes VWFSE Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0, "Resistor" for additional information. The MCP4021 is externally connected to match the configurations of the MCP4022 and MCP4024, and then tested. This parameter is not tested, but specified by characterization. DS20001945F-page 4  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 AC/DC CHARACTERISTICS (CONTINUED) Electrical Specifications: Unless otherwise indicated, all parameters apply across the specified operating ranges. TA = –40°C to +125°C, 2.1 k5 k10 kand50 kdevicesTypical specifications represent values for VDD = 5.5V, VSS = 0V, TA = +25°C. Parameters Sym Min Typ Max Units VIH 0.7 VDD — — V Conditions Digital Inputs/Outputs (CS, U/D) Input High Voltage VIL — — 0.3 VDD V High-Voltage Input Entry Voltage (Threshold for WiperLock Technology) VIHH 8.5(9) — 12.5(6) V +7°C to +125°C 9.0 — (6) V –40°C to +125°C High-Voltage Input Exit Voltage VIHH — — VDD+0.8(6) V CS Pull-up/Pull-down Resistance RCS — 16 — k CS Weak Pull-up/Pull-down Current IPU — 170 — µA VDD = 5.5V, VCS = 3V Input Leakage Current IIL –1 — 1 µA VIN = VDD CIN, COUT — 10 — pF fC = 1 MHz N 0h — 3Fh hex Endurance — 1M — Cycles EEPROM Range N 0h — 3Fh hex Initial Factory Setting N Input Low Voltage CS and U/D Pin Capacitance 12.5 VDD = 5.5V, VCS = 3V RAM (Wiper) Value Value Range EEPROM Endurance 1Fh hex WiperLock Technology = Off Power Requirements Power Supply Sensitivity (MCP4021 and MCP4023 only) Note 1: 2: 3: 4: 5: 6: 7: 8: 9: PSS — 0.0015 0.0035 %/% VDD = 4.5V to 5.5V, VA = 4.5V, Code = 1Fh — 0.0015 0.0035 %/% VDD = 2.7V to 4.5V, VA = 2.7V, Code = 1Fh Resistance is defined as the resistance between terminal A to terminal B. INL and DNL are measured at VW with VA = VDD and VB = VSS. (–202 devices VA = 4V). MCP4021/23 only, test conditions are: IW = 1.9 mA, code = 00h. MCP4022/24 only, test conditions are: Current at Voltage Device Resistance 5.5V 2.7V 2.1 k 2.25 mA 1.1 mA 5 k 1.4 mA 450 µA 10 k 450 µA 210 µA 50 k 90 µA 40 µA Comments MCP4022 includes VWZSE MCP4024 includes VWFSE Resistor terminals A, W and B’s polarity with respect to each other is not restricted. This specification by design Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and temperature. See Section 6.0, "Resistor" for additional information. The MCP4021 is externally connected to match the configurations of the MCP4022 and MCP4024, and then tested. This parameter is not tested, but specified by characterization.  2006-2017 Microchip Technology Inc. DS20001945F-page 5 MCP4021/2/3/4 tCSHI tCSLO CS tLUC 1/fUD tLO tLCUF tLUC tLCUF U/D tHI tLCUR tS tS W FIGURE 1-1: Increment Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +2.7V to 5.5V, TA = -40°C to +125°C. Parameters Sym Min Typ Max Units CS Low Time tCSLO 5 — — µs CS High Time tCSHI 500 — — ns U/D to CS Hold Time tLUC 500 — — ns CS to U/D Low Setup Time tLCUF 500 — — ns CS to U/D High Setup Time tLCUR 3 — — µs U/D High Time tHI 500 — — ns U/D Low Time tLO 500 — — ns Up/Down Toggle Frequency fUD — — 1 MHz tS 0.5 — — µs 2.1 k CL = 100 pF 1 — — µs 5 k CL = 100 pF 2 — — µs 10 k CL = 100 pF 10 5 — µs 50 k CL = 100 pF Wiper Settling Time Conditions Wiper Response on Power-Up tPU — 200 — ns Internal EEPROM Write Time twc — — 5 ms @25°C — — 10 ms -40°C to +125°C DS20001945F-page 6  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 tCSHI tCSLO CS 1/fUD tLUC tLUC tHI tLCUF U/D tLO tLCUR tS tS W FIGURE 1-2: Decrement Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +2.7V to 5.5V, TA = –40°C to +125°C. Parameters Sym Min Typ Max Units CS Low Time tCSLO 5 — — µs CS High Time tCSHI 500 — — ns U/D to CS Hold Time tLUC 500 — — ns CS to U/D Low Setup Time tLCUF 500 — — ns CS to U/D High Setup Time tLCUR 3 — — µs U/D High Time tHI 500 — — ns U/D Low Time tLO 500 — — ns Up/Down Toggle Frequency fUD — — 1 MHz tS 0.5 — — µs 2.1 k CL = 100 pF 1 — — µs 5 k CL = 100 pF 2 — — µs 10 k CL = 100 pF 10 5 — µs 50 k CL = 100 pF Wiper Settling Time Conditions Wiper Response on Power-Up tPU — 200 — ns Internal EEPROM Write Time twc — — 5 ms @25°C — — 10 ms -40°C to +125°C  2006-2017 Microchip Technology Inc. DS20001945F-page 7 MCP4021/2/3/4 tCSHI tCSLO 12V CS 5V tHUC 1/fUD tLO tHCUF tHUC tHCUF U/D tHI tHCUR tS tS W FIGURE 1-3: High-Voltage Increment Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +2.7V to 5.5V, TA = -40°C to +125°C. Parameters Sym Min Typ Max Units CS Low Time tCSLO 5 — — µs CS High Time tCSHI 500 — — ns U/D High Time tHI 500 — — ns U/D Low Time tLO 500 — — ns Up/Down Toggle Frequency fUD — — 1 MHz HV U/D to CS Hold Time tHUC 1.5 — — µs HV CS to U/D Low Setup Time tHCUF 8 — — µs HV CS to U/D High Setup Time tHCUR 4.5 — — µs tS 0.5 — — µs 2.1 k CL = 100 pF 1 — — µs 5 k CL = 100 pF 2 — — µs 10 k CL = 100 pF 10 5 — µs 50 k CL = 100 pF Wiper Settling Time Conditions Wiper Response on Power-Up tPU — 200 — ns Internal EEPROM Write Time twc — — 5 ms @25°C — — 10 ms –40°C to +125°C DS20001945F-page 8  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 tCSHI tCSLO CS 12V 5V 1/fUD tHUC tHUC tHI tHCUF U/D tLO tHCUR tS tS W FIGURE 1-4: High-Voltage Decrement Timing Waveform. SERIAL TIMING CHARACTERISTICS Electrical Specifications: Unless otherwise noted, all parameters apply across the specified operating ranges. Extended (E): VDD = +2.7V to 5.5V, TA = -40°C to +125°C. Parameters Sym Min Typ Max Units CS Low Time tCSLO 5 — — µs CS High Time tCSHI 500 — — ns U/D High Time tHI 500 — — ns U/D Low Time tLO 500 — — ns Up/Down Toggle Frequency fUD — — 1 MHz HV U/D to CS Hold Time tHUC 1.5 — — µs HV CS to U/D Low Setup Time tHCUF 8 — — µs HV CS to U/D High Setup Time tHCUR 4.5 — — µs tS 0.5 — — µs 2.1 k CL = 100 pF 1 — — µs 5 k CL = 100 pF 2 — — µs 10 k CL = 100 pF 10 5 — µs 50 k CL = 100 pF Wiper Settling Time Conditions Wiper Response on Power-Up tPU — 200 — ns Internal EEPROM Write Time twc — — 5 ms @25°C — — 10 ms –40°C to +125°C  2006-2017 Microchip Technology Inc. DS20001945F-page 9 MCP4021/2/3/4 TEMPERATURE CHARACTERISTICS Electrical Specifications: Unless otherwise indicated, VDD = +2.7V to +5.5V, VSS = GND. Parameters Sym Min Typ Max Units Specified Temperature Range TA -40 — +125 °C Operating Temperature Range TA -40 — +125 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 5L-SOT-23 JA — 255 — °C/W Thermal Resistance, 6L-SOT-23 JA — 230 — °C/W Thermal Resistance, 8L-DFN (2x3) JA — 85 — °C/W Thermal Resistance, 8L-MSOP JA — 206 — °C/W Thermal Resistance, 8L-SOIC JA — 117 — °C/W Conditions Temperature Ranges Thermal Package Resistances DS20001945F-page 10  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 2.0 TYPICAL PERFORMANCE CURVES Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 250 2.7V -40°C 2.7V 25°C 2.7V 85°C 2.7V 125°C 5.5V -40°C 5.5V 25°C 5.5V 85°C 5.5V 125°C 70 60 50 40 30 150 ICS 100 20 50 10 RCS 0 0.20 0 0.40 0.60 fU/D (MHz) 0.80 1.00 FIGURE 2-1: Device Current (IDD) vs. U/D Frequency (fU/D) and Ambient Temperature (VDD = 2.7V and 5.5V). 9 8 12 CS VPP Threshold (V) 500.0 VDD = 5.5V 400.0 300.0 200.0 VDD = 2.7V 100.0 0.0 7 6 5 4 VCS (V) 3 2 1 FIGURE 2-4: CS Pull-up/Pull-down Resistance (RCS) and Current (ICS) vs. CS Input Voltage (VCS) (VDD = 5.5V). 600.0 Device Current (IDD) (µA) 1000 800 600 400 200 0 -200 -400 -600 -800 -1000 200 RCS (kOhms) Device Current (IDD) (µA) 80 Ics (µA) Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 1.8V Entry 2.7V Entry 5.5V Entry 1.8V Exit 2.7V Exit 5.5V Exit 10 8 6 4 2 0 -40 25 85 125 Ambient Temperature (°C) FIGURE 2-2: Write Current (IWRITE) vs. Ambient Temperature and VDD. -40 -20 0 20 40 60 80 100 Ambient Temperature (°C) 120 FIGURE 2-5: CS High Input Entry/Exit Threshold vs. Ambient Temperature and VDD. Device Current (IDD) (µA) 0.8 0.7 VDD = 5.5V 0.6 0.5 0.4 0.3 VDD = 2.7V 0.2 0.1 0.0 -40 25 85 125 Ambient Temperature (°C) FIGURE 2-3: Device Current (ISHDN) vs. Ambient Temperature and VDD. (CS = VDD).  2006-2017 Microchip Technology Inc. DS20001945F-page 11 MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. INL 100 0.075 120 0.05 100 0.025 80 0 DNL 60 -0.025 40 -0.05 RW 20 -0.1 0 8 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 300 0 DNL RW 100 -0.05 0 -0.1 0 8 60 16 24 32 40 48 Wiper Setting (decimal) 56 FIGURE 2-7: 2.1 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). DS20001945F-page 12 0.2 40 0 DNL RW -0.2 -0.4 8 16 24 32 40 48 Wiper Setting (decimal) 56 FIGURE 2-8: 2.1 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). -40C Rw -40C INL -40C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 400 INL 0.6 0.4 500 0.1 0.8 INL 0 0.05 200 125C Rw 125C INL 125C DNL 0 Error (LSb) Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL 85C Rw 85C INL 85C DNL 80 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-6: 2.1 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 400 25C Rw 25C INL 25C DNL 20 -0.075 0 -40C Rw -40C INL -40C DNL Error (LSb) 125C Rw 125C INL 125C DNL INL 10 8 6 300 4 200 2 100 Error (LSb) 85C Rw 85C INL 85C DNL Wiper Resistance (Rw)(ohms) Wiper Resistance (Rw)(ohms) 120 25C Rw 25C INL 25C DNL Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL Error (LSb) 140 0 RW DNL 0 -2 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 FIGURE 2-9: 2.1 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V).  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 2500 -40°C 25°C 85°C 125°C 2000 2060 RWB (Ohms) Nominal Resistance (RAB) (Ohms) 2080 VDD = 5.5V 2040 1500 1000 2020 500 VDD = 2.7V 2000 0 -40 0 40 80 Ambient Temperature (°C) 120 FIGURE 2-10: 2.1 k – Nominal Resistance () vs. Ambient Temperature and VDD.  2006-2017 Microchip Technology Inc. 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-11: 2.1 k – RWB () vs. Wiper Setting and Ambient Temperature. DS20001945F-page 13 MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. WIPER WIPER U/D U/D FIGURE 2-12: 2.1 k – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). FIGURE 2-15: 2.1 k – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). WIPER WIPER U/D U/D FIGURE 2-13: 2.1 k – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V). FIGURE 2-16: 2.1 k – Low-Voltage Increment Wiper Settling Time (VDD = 5.5V). WIPER VDD FIGURE 2-14: Response Time. DS20001945F-page 14 2.1 k – Power-Up Wiper  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 125C Rw 125C INL 125C DNL 0.075 120 0.05 100 0.025 INL 80 0 DNL 60 -0.025 40 -0.05 RW 20 8 16 24 32 40 48 60 0 DNL 40 -0.2 RW -0.4 -0.6 8 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 600 0.075 300 0.025 250 0 DNL -0.025 RW 150 24 100 -0.05 50 -40C Rw -40C INL -40C DNL 500 -0.075 400 25C Rw 25C INL 25C DNL 0 -0.125 8 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-18: 5 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V).  2006-2017 Microchip Technology Inc. 40 48 56 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 5 4 3 INL 300 2 200 1 100 0 -0.1 0 32 FIGURE 2-19: 5 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 0.1 0.05 INL 200 16 Wiper Setting (decimal) Wiper Resistance (Rw)(ohms) Wiper Resistance (Rw)(ohms) 350 25C Rw 25C INL 25C DNL 0.4 0.2 0 Error (LSb) -40C Rw -40C INL -40C DNL 0.6 INL 56 FIGURE 2-17: 5 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 400 125C Rw 125C INL 125C DNL 80 Wiper Setting (decimal) 450 85C Rw 85C INL 85C DNL 0 -0.1 0 25C Rw 25C INL 25C DNL 20 -0.075 0 -40C Rw -40C INL -40C DNL Error (LSb) 100 85C Rw 85C INL 85C DNL Error (LSb) Wiper Resistance (Rw)(ohms) 120 25C Rw 25C INL 25C DNL Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL Error (LSb) 140 RW DNL 0 0 8 16 24 32 40 48 -1 56 Wiper Setting (decimal) FIGURE 2-20: 5 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). DS20001945F-page 15 MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 6000 2.7V Vdd 5.5V Vdd 4925 4900 4875 VDD = 5.5V 4850 -40°C 25°C 85°C 125°C 5000 RWB (Ohms) Nominal Resistance (RAB) (Ohms) 4950 4000 3000 2000 1000 4825 VDD = 2.7V 0 4800 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (°C) FIGURE 2-21: 5 k – Nominal Resistance () vs. Ambient Temperature and VDD. DS20001945F-page 16 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-22: 5 k – RWB () vs. Wiper Setting and Ambient Temperature.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. WIPER WIPER U/D U/D FIGURE 2-23: 5 k – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). FIGURE 2-25: 5 k – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). WIPER WIPER U/D FIGURE 2-24: 5 k – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V).  2006-2017 Microchip Technology Inc. U/D FIGURE 2-26: 5 k – Low-Voltage Increment Wiper Settling Time (VDD = 5.5V). DS20001945F-page 17 MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 125C Rw 125C INL 125C DNL 0.05 120 0.025 100 DNL 80 0 INL 60 -0.025 40 -0.05 RW 20 -0.075 0 -40C Rw -40C INL -40C DNL 80 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 350 125C Rw 125C INL 125C DNL INL 250 -0.025 200 -0.05 150 RW 100 0.05 60 0 40 -0.05 RW -0.1 -0.15 500 0.025 0 300 -0.075 8 16 24 32 40 48 Wiper Setting (decimal) 56 -40C Rw -40C INL -40C DNL 400 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 0 -0.125 0 8 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-28: 10 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). DS20001945F-page 18 2.5 1.5 INL 300 0.5 200 -0.5 DNL RW 100 -1.5 -0.1 50 0.1 FIGURE 2-29: 10 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 0.05 DNL 0.15 DNL 0 Error (LSb) Wiper Resistance (Rw)(ohms) 400 125C Rw 125C INL 125C DNL 0 FIGURE 2-27: 10 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 450 85C Rw 85C INL 85C DNL INL 16 24 32 40 48 56 Wiper Setting (decimal) Wiper Resistance (Rw)(ohms) 8 25C Rw 25C INL 25C DNL 20 -0.1 0 -40C Rw -40C INL -40C DNL Error (LSb) 85C Rw 85C INL 85C DNL Error (LSb) Wiper Resistance (Rw)(ohms) 100 25C Rw 25C INL 25C DNL Error (LSb) -40C Rw -40C INL -40C DNL Wiper Resistance (Rw)(ohms) 120 0 -2.5 0 8 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-30: 10 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V).  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 12000 10250 10230 10210 10190 10170 10150 10130 10110 10090 10070 10050 -40°C 25°C 85°C 125°C 10000 VDD = 5.5V RWB (Ohms) Nominal Resistance (RAB) (Ohms) Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 8000 6000 4000 2000 VDD = 2.7V 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (°C) FIGURE 2-31: 10 k – Nominal Resistance () vs. Ambient Temperature and VDD.  2006-2017 Microchip Technology Inc. 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-32: 10 k – RWB () vs. Wiper Setting and Ambient Temperature. DS20001945F-page 19 MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. WIPER WIPER U/D FIGURE 2-33: 10 k – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). WIPER U/D FIGURE 2-34: 10 k – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V). DS20001945F-page 20 U/D FIGURE 2-35: 10 k – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). WIPER U/D FIGURE 2-36: 10 k – Low-Voltage Increment Wiper Settling Time (VDD = 5.5V).  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 0.1 125C Rw 125C INL 125C DNL 200 0.05 DNL 120 0 INL 80 -0.05 RW 40 8 16 24 32 40 48 -0.1 0 8 125C Rw 125C INL 125C DNL 400 300 600 0.025 500 -0.025 INL 200 -0.05 -0.075 RW 0 -0.1 8 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-38: 50 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V).  2006-2017 Microchip Technology Inc. 24 32 40 48 56 FIGURE 2-39: 50 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). 0.05 0 0 16 Wiper Setting (decimal) DNL 100 -0.05 0 -40C Rw -40C INL -40C DNL Wiper Resistance (Rw)(ohms) 85C Rw 85C INL 85C DNL 0.1 0 RW 50 56 Error (LSb) Wiper Resistance (Rw)(ohms) 500 25C Rw 25C INL 25C DNL 0.15 0.05 DNL FIGURE 2-37: 50 k Pot Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 5.5V). -40C Rw -40C INL -40C DNL 125C Rw 125C INL 125C DNL INL Wiper Setting (decimal) 600 85C Rw 85C INL 85C DNL 100 -0.15 0 25C Rw 25C INL 25C DNL 150 -0.1 0 -40C Rw -40C INL -40C DNL Error (LSb) 85C Rw 85C INL 85C DNL 25C Rw 25C INL 25C DNL 85C Rw 85C INL 85C DNL 125C Rw 125C INL 125C DNL 1.5 1 RW 400 0.5 INL 300 0 DNL 200 -0.5 100 -1 0 Error (LSb) Wiper Resistance (Rw)(ohms) 160 25C Rw 25C INL 25C DNL Wiper Resistance (Rw)(ohms) -40C Rw -40C INL -40C DNL Error (LSb) 200 -1.5 0 8 16 24 32 40 48 56 Wiper Setting (decimal) FIGURE 2-40: 50 k Rheo Mode – RW (), INL (LSb), DNL (LSb) vs. Wiper Setting and Ambient Temperature (VDD = 2.7V). DS20001945F-page 21 MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. 60000 49600 -40C 25C 85C 125C 50000 49400 VDD = 5.5V 49200 49000 48800 VDD = 2.7V 48600 48400 RWB (Ohms) Nominal Resistance (RAB) (Ohms) 49800 40000 30000 20000 10000 48200 48000 0 -40 -20 0 20 40 60 80 100 120 Ambient Temperature (°C) FIGURE 2-41: 50 k – Nominal Resistance () vs. Ambient Temperature and VDD. DS20001945F-page 22 0 8 16 24 32 40 48 Wiper Setting (decimal) 56 64 FIGURE 2-42: 50 k – RWB () vs. Wiper Setting and Ambient Temperature.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. U/D U/D WIPER WIPER FIGURE 2-43: 50 k – Low-Voltage Decrement Wiper Settling Time (VDD = 2.7V). FIGURE 2-46: 50 k – Low-Voltage Increment Wiper Settling Time (VDD = 2.7V). U/D U/D WIPER WIPER FIGURE 2-44: 50 k – Low-Voltage Decrement Wiper Settling Time (VDD = 5.5V). FIGURE 2-47: 50 k - Low-Voltage Increment Wiper Settling Time (VDD = 5.5V). WIPER VDD FIGURE 2-45: Response Time. 50 k – Power-Up Wiper  2006-2017 Microchip Technology Inc. DS20001945F-page 23 MCP4021/2/3/4 Note: Unless otherwise indicated, TA = +25°C, VDD = 5V, VSS = 0V. -3dB Frequency (MHz) 4.5 4 A 2.1 k: +5V 3.5 3 VIN 2.5 5 k: 2 1.5 10 k: 1 0.5 W ~ OFFSET GND DUT B + VOUT - 50 k: 2.5V DC 0 -40 25 125 Temperature (°C) FIGURE 2-48: Temperature. DS20001945F-page 24 -3 dB Bandwidth vs. FIGURE 2-49: Circuit. -3 dB Bandwidth Test  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number MCP4021 (SOIC-8) MCP4022 MCP4024 Symbol MCP4023 (SOT-23-5) (SOT-23-6) Buffer Type 1 1 1 VDD P — Positive Power Supply Input 2 2 VSS P — Ground 3 6 — A I/O A Potentiometer Terminal A 4 5 5 W I/O A Potentiometer Wiper Terminal 5 4 4 CS I TTL 6 — — B I/O A Potentiometer Terminal B 7 — — NC — — No Connection 8 3 3 U/D I TTL Chip Select Input Increment/Decrement Input A = Analog input O = Output Positive Power Supply Input (VDD) The VDD pin is the device’s positive power supply input. The input power supply is relative to VSS and can range from 2.7V to 5.5V. A decoupling capacitor on VDD (to VSS) is recommended to achieve maximum performance. 3.2 Function 2 Legend: TTL = TTL compatible input I = Input P = Power 3.1 Pin Type Ground (VSS) 3.4 Potentiometer Wiper (W) Terminal The terminal W pin is connected to the internal potentiometer’s terminal W (the wiper). The wiper terminal is the adjustable terminal of the digital potentiometer. The terminal W pin does not have a polarity relative to terminals A or B pins. The terminal W pin can support both positive and negative current. The voltage on terminal W must be between VSS and VDD. The VSS pin is the device ground reference. 3.5 3.3 The terminal B pin is connected to the internal potentiometer’s terminal B (available on some devices). The potentiometer’s terminal B is the fixed connection to the 0x00 terminal of the digital potentiometer. Potentiometer Terminal A The terminal A pin is connected to the internal potentiometer’s terminal A (available on some devices). The potentiometer’s terminal A is the fixed connection to the 0x3F terminal of the digital potentiometer. The terminal A pin is available on the MCP4021, MCP4022 and MCP4023 devices. The terminal A pin does not have a polarity relative to the terminal W or B pins. The terminal A pin can support both positive and negative current. The voltage on terminal A must be between VSS and VDD. The terminal A pin is not available on the MCP4024. The potentiometer’s terminal A is internally floating. Potentiometer Terminal B The terminal B pin is available on the MCP4021 device. The terminal B pin does not have a polarity relative to the terminal W or A pins. The terminal B pin can support both positive and negative current. The voltage on terminal B must be between VSS and VDD. The terminal B pin is not available on the MCP4022, MCP4023 and MCP4024 devices. For the MCP4023 and MCP4024, the internal potentiometer’s terminal B is internally connected to VSS. Terminal B does not have a polarity relative to terminals W or A. Terminal B can support both positive and negative current. For the MCP4022, terminal B is internally floating.  2006-2017 Microchip Technology Inc. DS20001945F-page 25 MCP4021/2/3/4 3.6 Chip Select (CS) The CS pin is the chip select input. Forcing the CS pin to VIL enables the serial commands. These commands can increment and decrement the wiper. Depending on the command, the wiper may (or may not) be saved to nonvolatile memory (EEPROM). Forcing the CS pin to VIHH enables the high-voltage serial commands. These commands can increment and decrement the wiper and enable or disable the WiperLock technology. The wiper is saved to nonvolatile memory (EEPROM). 3.7 Increment/Decrement (U/D) The U/D pin input is used to increment or decrement the wiper on the digital potentiometer. An increment moves the wiper one step toward terminal A, while a decrement moves the wiper one step toward terminal B. The CS pin has an internal pull-up resistor. The resistor will become “disabled” when the voltage on the CS pin is below the VIH level. This means that when the CS pin is “floating”, the CS pin will be pulled to the VIH level (serial communication (the U/D pin) is ignored). And when the CS pin is driven low (VIL), the resistance becomes very large to reduce the device current consumption when serial commands are occurring. See Figure 2-4 for additional information. DS20001945F-page 26  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 4.0 GENERAL OVERVIEW EQUATION 4-1: The MCP402X devices are general purpose digital potentiometers intended to be used in applications where a programmable resistance with moderate bandwidth is desired. Applications generally suited for the MCP402X devices include: • • • • Set point or offset trimming Sensor calibration Selectable gain and offset amplifier designs Cost-sensitive mechanical trim pot replacement There are 63 resistors in a string between terminal A and terminal B. The wiper can be set to tap onto any of these 63 resistors thus providing 64 possible settings (including terminal A and terminal B). Figure 4-1 shows a block diagram for the resistive network of the device. Equation 4-1 shows the calculation for the step resistance, while Equation 4-2 illustrates the calculation used to determine the resistance between the wiper and terminal B. A N = 62 RS 3Eh RW (1) RW (1) N = 61 RS 3Dh W N=1 RS 01h RW (1) RW (1) N=0 B 00h Analog Mux Note 1: The wiper resistance is tap dependent. That is, each tap selection resistance has a small variation. This variation effects the smaller resistance devices (2.1 k) more. FIGURE 4-1: EQUATION 4-2: RWB CALCULATION R AB N - + RW R WB = ------------63 1 LSb is the ideal resistance difference between two successive codes. If we use N = 1 and RW = 0 in Equation 4-2, we can calculate the step size for each increment or decrement command. The MCP4021 device offers a voltage divider (potentiometer) with all terminals available on pins. The MCP4022 is a true rheostat, with terminal A and the wiper (W) of the variable resistor available on pins. The MCP4023 device offers a voltage divider (potentiometer) with terminal B connected to ground. The MCP4024 device is a rheostat device with terminal A of the resistor floating, terminal B connected to ground, and the wiper (W) available on pin. The MCP4021 can be externally configured to implement any of the MCP4022, MCP4023 or MCP4024 configurations. 4.1 3Fh RW (1) RS R AB R S = --------63 N = 0 to 63 (decimal) The digital potentiometer is available in four nominal resistances (RAB), where the nominal resistance is defined as the resistance between terminal A and terminal B. The four nominal resistances are 2.1 k, 5 k, 10 k and 50 k N = 63 RS CALCULATION Serial Interface A 2-wire synchronous serial protocol is used to increment or decrement the digital potentiometer’s wiper terminal. The Increment/Decrement (U/D) protocol utilizes the CS and U/D input pins. Both inputs are tolerant of signals up to 12.5V without damaging the device. The CS pin can differentiate between two high-voltage levels, VIH and VIHH. This enables additional commands without requiring additional input pins. The high-voltage commands (VIHH on the CS pin) are similar to the standard commands, except that they control (enable, disable, ...) the state of the nonvolatile WiperLock technology feature. The simple U/D protocol uses the state of the U/D pin at the falling edge of the CS pin to determine if Increment or Decrement mode is desired. Subsequent rising edges of the U/D pin move the wiper. The wiper value will not underflow or overflow. The new wiper setting can be saved to EEPROM, if desired, by selecting the state of the U/D pin during the rising edge of the CS pin. The nonvolatile wiper enables the MCP4021/2/3/4 to operate stand alone (without microcontroller control). Resistor Block Diagram.  2006-2017 Microchip Technology Inc. DS20001945F-page 27 MCP4021/2/3/4 serial • Incrementing or decrementing the wiper setting • Writing the wiper setting to the nonvolatile memory Enabling and disabling the WiperLock technology feature requires high-voltage serial commands (CS = VIHH). Incrementing and decrementing the wiper requires high-voltage commands when the feature is enabled. The high-voltage threshold (VIHH) is intended to prevent the wiper setting from being altered by noise or intentional transitions on the U/D and CS pins, while still providing flexibility for production or calibration environments. Both the CS and U/D input pins are tolerant of signals up to 12V. This allows the flexibility to multiplex the digital pot’s control signals onto application signals for manufacturing/calibration. 4.3 Power-up When the device powers up, the last saved wiper setting is restored. While VDD < Vmin (2.7V), the electrical performance may not meet the data sheet specifications (see Figure 4-2). The wiper may be unknown or initialized to the value stored in the EEPROM. Also the device may be capable of incrementing, decrementing and writing to its EEPROM, if a valid command is detected on the CS and U/D pins. VDD Outside Specified AC/DC Range Typical RAB Value the DEFAULT FACTORY SETTINGS SELECTION WiperLoc Technology Setting The WiperLock technology prevents commands from doing the following: TABLE 4-1: Wiper Code The MCP4021/2/3/4 device’s WiperLock technology allows application-specific calibration settings to be secured in the EEPROM without requiring the use of an additional write-protect pin. The default settings of the MCP4021/2/3/4 device’s from the factory are shown in Table 4-1. Default POR Wiper Setting The WiperLock Technology Package Code 4.2 –202 Mid-scale 1Fh Disabled 2.1 k –502 Mid-scale 1Fh Disabled 5.0 k –103 Mid-scale 1Fh Disabled 10.0 k –503 Mid-scale 1Fh Disabled 50.0 k It is good practice in your manufacturing flow to configure the device to your desired settings. 4.4 Brown-Out If the device VDD is below the specified minimum voltage, care must be taken to ensure that the CS and U/D pins do not “create” any of the serial commands. When the device VDD drops below Vmin (2.7V), the electrical performance may not meet the data sheet specifications (see Figure 4-2). The wiper may be unknown or initialized to the value stored in the EEPROM. Also the device may be capable of incrementing, decrementing and writing to its EEPROM if a valid command is detected on the CS and U/D pins. 4.5 Serial Interface Inactive The serial interface is inactive any time the CS pin is at VIH and all write cycles are completed. EEPROM Write Protect 2.7V VWP VSS FIGURE 4-2: DS20001945F-page 28 Power-up and Brown-out.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5.0 SERIAL INTERFACE 5.2 5.1 Overview The MCP402X devices support 10 serial commands. The commands can be grouped into the following types: The MCP4021/2/3/4 utilizes a simple 2-wire interface to increment or decrement the digital potentiometer’s wiper terminal (W), store the wiper setting in nonvolatile memory and turn the WiperLock technology feature on or off. This interface uses the Chip Select (CS) pin, while the U/D pin is the Up/Down input. The Increment/Decrement protocol enables the device to move one step at a time through the range of possible resistance values. The wiper value is initialized with the value stored in the internal EEPROM upon power-up. A wiper value of 00h connects the wiper to terminal B. A wiper value of 3Fh connects the wiper to terminal A. Increment commands move the wiper toward terminal A, but will not increment to a value greater than 3Fh. Decrement commands move the wiper toward terminal B, but will not decrement below 00h. Refer to Section 1.0 “Electrical Characteristics”, AC/DC Electrical Characteristics table for detailed input threshold and timing specifications. Communication is unidirectional. Therefore, the value of the current wiper setting cannot be read out of the MCP402X device. TABLE 5-1: Serial Commands • Serial Commands • High-voltage Serial Commands All the commands are shown in Table 5-1. The command type is determined by the voltage level on the CS pin. The initial state that the CS pin must be driven is VIH. From VIH, the two levels that the CS pin can be driven are: • VIL • VIHH If the CS pin is driven from VIH to VIL, a serial command is selected. If the CS pin is driven from VIH to VIHH, a high-voltage serial command is selected. High-voltage serial commands control the state of the WiperLock technology. This is a unique feature, where the user can determine whether or not to “lock” or “unlock” the wiper state. High-voltage serial commands increment/decrement the wiper regardless of the status of the WiperLock technology. COMMANDS Command Name Increment without Writing Wiper Setting to EEPROM Increment with Writing Wiper Setting to EEPROM Decrement without Writing Wiper Setting to EEPROM Saves Wiper Value in EEPROM High Voltage on CS pin? After Command Wiper is “locked”/ ”unlocked” Works when Wiper is “locked”? — — unlocked Note 1 Yes — unlocked Note 1 — — unlocked Note 1 Decrement with Writing Wiper Setting to EEPROM Yes — unlocked Note 1 Write Wiper Setting to EEPROM Yes — unlocked Note 1 High-Voltage Increment and Disable WiperLock Technology Yes Yes unlocked Yes High-Voltage Increment and Enable WiperLock Technology Yes Yes locked Yes High-Voltage Decrement and Disable WiperLock Technology Yes Yes unlocked Yes High-Voltage Decrement and Enable WiperLock Technology Yes Yes locked Yes Write Wiper Setting to EEPROM and Disable WiperLock Technology Yes Yes unlocked Yes Write Wiper Setting to EEPROM and Enable WiperLock Technology Yes Yes locked Yes Note 1: This command will only complete if wiper is “unlocked” (WiperLock Technology is Disabled).  2006-2017 Microchip Technology Inc. DS20001945F-page 29 MCP4021/2/3/4 5.2.1 INCREMENT WITHOUT WRITING WIPER SETTING TO EEPROM The EEPROM value has not been updated to this new wiper value, so if the device voltage is lowered below the RAM retention voltage of the device, once the device returns to the operating range, the wiper will be loaded with the wiper setting in the EEPROM. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin increment the wiper setting toward terminal A. This is shown in Figure 5-1. After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered. This is since an EEPROM write cycle (twc) is not active. After the wiper is incremented to the desired position, the CS pin should be forced to VIH to ensure that “unexpected” transitions (on the U/D pin do not cause the wiper setting to increment. Driving the CS pin to VIH should occur as soon as possible (within device specifications) after the last desired increment occurs. Note: The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. VIH VIL CS 1 U/D 2 3 5 4 6 VIH VIL X EEPROM X Wiper X X X X X+1 X+2 X+3 X+4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable Note: If WiperLock technology enabled, wiper will not move. FIGURE 5-1: DS20001945F-page 30 Increment without Writing Wiper Setting to EEPROM.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5.2.2 INCREMENT WITH WRITING WIPER SETTING TO EEPROM To ensure that “unexpected” transitions on the U/D pin do not cause the wiper setting to increment, the U/D pin should be driven low and the CS pin forced to VIH as soon as possible (within device specifications) after the last desired increment occurs. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin increment the wiper setting toward terminal A. This is shown in Figure 5-2. After the CS pin is driven to VIH (from VIL), all other serial commands are ignored until the EEPROM write cycle (twc) completes. After the wiper is incremented to the desired position, the U/D pin should be driven low (VIL). Then when the CS pin is forced to VIH, the wiper value is written to the EEPROM. Therefore, if the device voltage is lowered below the RAM retention voltage of the device, once the device returns to the operating range, the wiper will be loaded with this wiper setting (stored in the EEPROM). Note: The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. VIH VIH VIL CS tWC VIH 1 2 3 4 5 6 VIL U/D X EEPROM X Wiper X X X X X+1 X+2 X+3 X+4 X+4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable Note: If WiperLock technology enabled, wiper will not move. FIGURE 5-2: Increment with Writing Wiper Setting to EEPROM.  2006-2017 Microchip Technology Inc. DS20001945F-page 31 MCP4021/2/3/4 5.2.3 DECREMENT WITHOUT WRITING WIPER SETTING TO EEPROM The EEPROM value has not been updated to this new wiper value, so, if the device voltage is lowered below the RAM retention voltage of the device, once the device returns to the operating range, the wiper will be loaded with the wiper setting in the EEPROM. This mode is achieved by initializing the U/D pin to a low state (VIL) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin will decrement the wiper setting toward terminal B. This is shown in Figure 5-3. After the CS pin is driven to VIH (from VIL), any other serial command may immediately be entered, since an EEPROM write cycle (tWC) is not started. After the wiper is decremented to the desired position, the U/D pin should be forced low (VIL) and the CS pin should be forced to VIH. This will ensure that “unexpected” transitions on the U/D pin do not cause the wiper setting to decrement. Driving the CS pin to VIH should occur as soon as possible (within device specifications) after the last desired increment occurs. Note: The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. VIH VIL CS 1 U/D EEPROM Wiper 2 3 4 5 VIH 6 VIL VIL X X X X X X X-1 X-2 X-3 X-4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable Note: If WiperLock technology enabled, wiper will not change. FIGURE 5-3: DS20001945F-page 32 Decrement without Writing Wiper Setting to EEPROM.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5.2.4 DECREMENT WITH WRITING WIPER SETTING TO EEPROM To ensure that “unexpected” transitions on the U/D pin do not cause the wiper setting to decrement, the U/D pin should be driven low (VIL) and the CS pin forced to VIH as soon as possible (within device specifications) after the last desired increment occurs. This mode is achieved by initializing the U/D pin to a low state (VIL) prior to achieving a low state (VIL) on the CS pin. Subsequent rising edges of the U/D pin decrement the wiper setting (toward terminal B). This is shown in Figure 5-4. After the CS pin is driven to VIH (from VIL), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. After the wiper is decremented to the desired position, the U/D pin should remain high (VIH). Then when the CS pin is raised to VIH, the wiper value is written to the EEPROM. Therefore, if the device voltage is lowered below the RAM retention voltage of the device, once the device returns to the operating range, the wiper will be loaded with this wiper setting (stored in the EEPROM). Note: The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. VIH VIL CS tWC 1 U/D 2 3 4 5 6 VIH VIL EEPROM Wiper X X X X X X X-1 X-2 X-3 X-4 X-4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable Note: If WiperLock technology enabled, wiper will not change. FIGURE 5-4: Decrement with Writing Wiper Setting to EEPROM.  2006-2017 Microchip Technology Inc. DS20001945F-page 33 MCP4021/2/3/4 5.2.5 WRITE WIPER SETTING TO EEPROM To write the current wiper setting to EEPROM, force both the CS pin and U/D pin to VIH. Then force the CS pin to VIL. Before there is a rising edge on the U/D pin, force the CS pin to VIH. This causes the wiper setting value to be written to EEPROM. Note: After the U/D pin is forced to VIL, each rising edge on the U/D pin will cause the wiper to increment. This is the same command as the “Increment with Writing Wiper Setting to EEPROM“command, but the U/D pin is held at VIL, so the wiper is not incremented. When the CS pin is forced to VIH, the wiper value is written to the EEPROM. Therefore, if the device voltage is lowered below the RAM retention voltage of the device, once the device returns to the operating range, the wiper will be loaded with this wiper setting (stored in the EEPROM). To ensure that “unexpected” transitions on the U/D pin do not cause the wiper setting to increment, force the CS pin to VIH as soon as possible (within device specifications) after the U/D pin is forced to VIL. After the CS pin is driven to VIH (from VIL), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. VIH VIH VIL CS VIH tWC 5 VIL U/D EEPROM Wiper 6 X X+4 X+4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable FIGURE 5-5: DS20001945F-page 34 Write Wiper Setting to EEPROM.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5.2.6 HIGH-VOLTAGE INCREMENT AND DISABLE WiperLock TECHNOLOGY After the CS pin is driven to VIH (from VIHH), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to the CS pin being driven to VIHH. Subsequent rising edges of the U/D pin increment the wiper setting toward terminal A. Set the U/D pin to the high state (VIH) prior to forcing the CS pin to VIH. This begins a write cycle and disables the WiperLock technology feature (See Figure 5-6). Note: The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. VIHH VIH VIH CS VIH 1 U/D VIL EEPROM X Wiper X 2 3 tWC 4 X X X X X+1 X+2 X+3 X+4 5 6 VIH X+4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable FIGURE 5-6: High-Voltage Increment and Disable WiperLock Technology.  2006-2017 Microchip Technology Inc. DS20001945F-page 35 MCP4021/2/3/4 5.2.7 HIGH-VOLTAGE INCREMENT AND ENABLE WiperLock TECHNOLOGY After the CS pin is driven to VIH (from VIHH), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. This mode is achieved by initializing the U/D pin to a high state (VIH) prior to the CS pin being driven to VIHH. Subsequent rising edges of the U/D pin increment the wiper setting toward terminal A. Set the U/D pin to the low state (VIL) prior to forcing the CS pin to VIH. This begins a write cycle and enables the WiperLock technology feature (See Figure 5-7). Note: The wiper value will not overflow. That is, once the wiper value equals 0x3F, subsequent increment commands are ignored. VIHH VIH VIH CS VIH 1 U/D VIL EEPROM X Wiper 2 3 tWC 4 5 6 VIL X X X X X X+1 X+2 X+3 X+4 X+4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable FIGURE 5-7: DS20001945F-page 36 High-Voltage Increment and Enable WiperLock Technology.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5.2.8 HIGH-VOLTAGE DECREMENT AND DISABLE WiperLock TECHNOLOGY After the CS pin is driven to VIH (from VIHH), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. This mode is achieved by initializing the U/D pin to a low state (VIL) prior to the CS pin being driven to VIHH. Subsequent rising edges of the U/D pin decrement the wiper setting toward terminal B. Set the U/D pin to the low state (VIL) prior to forcing the CS pin to VIH. This begins a write cycle and disables the WiperLock Technology feature (See Figure 5-8). Note: The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. VIHH VIH VIH CS 1 U/D 2 3 tWC 4 5 EEPROM Wiper 6 VIH VIL VIL X X X X X X X-1 X-2 X-3 X-4 X-4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable FIGURE 5-8: High-Voltage Decrement and Disable WiperLock Technology.  2006-2017 Microchip Technology Inc. DS20001945F-page 37 MCP4021/2/3/4 5.2.9 HIGH-VOLTAGE DECREMENT AND ENABLE WiperLock TECHNOLOGY After the CS pin is driven to VIH (from VIHH), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. This mode is achieved by initializing the U/D pin to the low state (VIL) prior to driving the CS pin to VIHH. Subsequent rising edges of the U/D pin decrement the wiper setting toward terminal B. Set the U/D pin to a high state (VIH) prior to forcing the CS pin to VIH. This begins a write cycle and enables the WiperLock technology feature (See Figure 5-9). Note: The wiper value will not underflow. That is, once the wiper value equals 0x00, subsequent decrement commands are ignored. VIHH VIH VIH CS 1 U/D EEPROM Wiper 2 3 tWC 4 VDD 5 6 VIH VIL X X X X X X X-1 X-2 X-3 X-4 X-4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable FIGURE 5-9: DS20001945F-page 38 High-Voltage Decrement and Enable WiperLock Technology.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5.2.10 WRITE WIPER SETTING TO EEPROM AND DISABLE WiperLock TECHNOLOGY This mode is achieved by keeping the U/D pin static (either at VIL or at VIH), while the CS pin is driven from VIH to VIHH and then returned to VIH. When the falling edge of the CS pin occurs (from VIHH to VIH), the wiper value is written to EEPROM and the WiperLock technology is disabled (See Figure 5-10). To ensure that unexpected transitions on the U/D pin do not cause the wiper setting to change, force the CS pin to VIH as soon as possible (within device specifications) after the CS pin is forced to VIHH. After the CS pin is driven to VIH (from VIHH), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. VIHH VIH VIH CS tWC U/D EEPROM Wiper VIH VIL X X+4 X+4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable FIGURE 5-10: Write Wiper Setting to EEPROM and Disable WiperLock Technology.  2006-2017 Microchip Technology Inc. DS20001945F-page 39 MCP4021/2/3/4 5.2.11 WRITE WIPER SETTING TO EEPROM AND ENABLE WiperLock TECHNOLOGY This mode is achieved by initializing the U/D and CS pins to a high state (VIH) prior to the CS pin being driven to VIHH (from VIH). Set the U/D pin to a low state (VIL) prior to forcing the CS pin to VIH (from VIHH). This begins a write cycle and enables the WiperLock technology feature (See Figure 5-11). To ensure that “unexpected” transitions on the U/D pin do not cause the wiper setting to increment, force the CS pin to VIH as soon as possible (within device specifications) after the U/D pin is forced to VIL. After the CS pin is driven to VIH (from VIHH), all other serial commands are ignored until the EEPROM write cycle (tWC) completes. VIHH VIH VIH CS VIH U/D EEPROM Wiper tWC VIL X X+4 X+4 WiperLock Technology Enable WiperLock Technology WiperLock Technology Disable FIGURE 5-11: DS20001945F-page 40 Write Wiper Setting to EEPROM and Enable WiperLock Technology.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5.3 CS High Voltage Depending on the requirements of the system, the use of high voltage (VIHH) on the CS pin, may or may not be required during system operation. Table 5-2 shows possible system applications, and whether a high voltage (VIHH) is required on the system. The MCP402X supports six high-voltage commands (the CS input voltage must meet the VIHH specification). TABLE 5-2: GP0 is a general purpose I/O pin, while GP2 can either be a general purpose I/O pin or it can output the internal clock. HIGH-VOLTAGE APPLICATIONS High Voltage System Operation Production calibration only - system should not update wiper setting The circuit in Figure 5-13 shows the method used on the MCP402X Nonvolatile Digital Potentiometer Evaluation Board. This method requires that the system voltage be approximately 5V. This ensures that when the PIC10F206 enters a brown-out condition, there is an insufficient voltage level on the CS pin to change the stored value of the wiper. The MCP402X Non-volatile Digital Potentiometer Evaluation Board User’s Guide (DS51546) contains a complete schematic. From Calibration Unit WiperLock Technology disabled during system operation Not Required Wiper setting can be updated and “locked” during system operation Required For the serial commands, configure the GP2 pin as an input (high impedance). The output state of the GP0 pin will determine the voltage on the CS pin (VIL or VIH). For high-voltage serial commands, force the GP0 output pin to output a high level (VOH) and configure the GP2 pin to output the internal clock. This will form a charge pump and increase the voltage on the CS pin (when the system voltage is approximately 5V). PIC10F206 5.3.1 TECHNIQUES TO FORCE THE CS PIN TO VIHH The circuit in Figure 5-12 shows a method using the TC1240A doubling charge pump. When the SHDN pin is high, the TC1240A is off, and the level on the CS pin is controlled by the PIC® microcontrollers (MCUs) IO2 pin. When the SHDN pin is low, the TC1240A is on and the VOUT voltage is 2 * VDD. The resistor R1 allows the CS pin to go higher than the voltage such that the PIC MCU’s IO2 pin “clamps” at approximately VDD. PIC® MCU TC1240A C+ VIN CSHDN MCP402X GP2 CS C1 C2 FIGURE 5-13: MCP402X Non-volatile Digital Potentiometer Evaluation Board (MCP402XEV) implementation to Generate the VIHH Voltage. C1 VOUT IO1 IO2 R1 GP0 MCP402X R1 CS C2 FIGURE 5-12: Using the TC1240A to Generate the VIHH Voltage.  2006-2017 Microchip Technology Inc. DS20001945F-page 41 MCP4021/2/3/4 6.0 RESISTOR Digital potentiometer applications can be divided into two categories: • Rheostat configuration • Potentiometer (or voltage divider) configuration Figure 6-1 shows a block diagram for the MCP402X resistors. A RW RS (1) N = 62 3Eh RW (1) RS TABLE 6-1: TYPICAL STEP RESISTANCES Typical Resistance () Total (RAB) Step (RS) MCP402X-202E 2100 33.33 MCP402X-502E 5000 79.37 MCP402X-103E 10000 158.73 MCP402X-503E 50000 793.65 3Dh N = 61 RW (1) RS The total resistance of the device has minimal variation due to operating voltage (see Figure 2-6, Figure 2-17, Figure 2-27 or Figure 2-37). Part Number 3Fh N = 63 Step resistance (RS) is the resistance from one tap setting to the next. This value will be dependent on the RAB value that has been selected. Table 6-1 shows the typical step resistances for each device. Terminal A and B, as well as the wiper W, do not have a polarity. These terminals can support both positive and negative current. W 01h N=1 RS RW (1) RW (1) N=0 B 00h Analog Mux Note 1: The wiper resistance is tap dependent. That is, each tap selection resistance has a small variation. This variation effects the smaller resistance devices (2.1 k) more. FIGURE 6-1: DS20001945F-page 42 Resistor Block Diagram.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 6.1 Resistor Configurations 6.1.1 6.1.2 RHEOSTAT CONFIGURATION When used as a rheostat, two of the three digital potentiometer’s terminals are used as a resistive element in the circuit. With terminal W (wiper) and either terminal A or terminal B, a variable resistor is created. The resistance will depend on the tap setting of the wiper and the wiper’s resistance. The resistance is controlled by changing the wiper setting. The unused terminal (B or A) should be left floating. Figure 6-2 shows the two possible resistors that can be used. Reversing the polarity of the A and B terminals will not affect operation. POTENTIOMETER CONFIGURATION When used as a potentiometer, all three terminals are tied to different nodes in the circuit. This allows the potentiometer to output a voltage proportional to the input voltage. This configuration is sometimes called voltage divider mode. The potentiometer is used to provide a variable voltage by adjusting the wiper position between the two endpoints as shown in Figure 6-3. Reversing the polarity of the A and B terminals will not affect operation. V1 A W A B W RAW or RBW B V2 FIGURE 6-3: Resistor FIGURE 6-2: Rheostat Configuration. This allows the control of the total resistance between the two nodes. The total resistance depends on the “starting” terminal to the wiper terminal. At the code 00h, the RBW resistance is minimal (RW), but the RAW resistance in maximized (RAB + RW). Conversely, at the code 3Fh, the RAW resistance is minimal (RW), but the RBW resistance in maximized (RAB + RW). The resistance step size (RS) equates to one LSb of the resistor. Note: V3 To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. Potentiometer Configuration. The temperature coefficient of the RAB resistors is minimal by design. In this configuration, the resistors all change uniformly, so minimal variation should be seen. The wiper resistor temperature coefficient is different from the RAB temperature coefficient. The voltage at node V3 (Figure 6-3) is not dependent on this wiper resistance, just the ratio of the RAB resistors, so this temperature coefficient in most cases can be ignored. Note: To avoid damage to the internal wiper circuitry in this configuration, care should be taken to insure the current flow never exceeds 2.5 mA. The change in wiper-to-end terminal resistance over temperature is shown in Figure 2-6, Figure 2-17, Figure 2-27 and Figure 2-37. The most variation over temperature will occur in the first few codes due to the wiper resistance coefficient affecting the total resistance. The remaining codes are dominated by the total resistance tempco RAB.  2006-2017 Microchip Technology Inc. DS20001945F-page 43 MCP4021/2/3/4 6.2 Wiper Resistance Wiper resistance is the series resistance of the wiper. This resistance is typically measured when the wiper is positioned at either zero-scale (00h) or full-scale (3Fh). The slope of the resistance has a linear area (at the higher voltages) and a nonlinear area (at the lower voltages), where resistance increases faster than the voltage drop (at low voltages). The wiper resistance in potentiometer-generated voltage divider applications is not a significant source of error. The wiper resistance in rheostat applications can create significant nonlinearity as the wiper is moved toward zero-scale (00h). The lower the nominal resistance, the greater the possible error. Wiper resistance is significant depending on the devices operating voltage. As the device voltage decreases, the wiper resistance increases (see Figure 6-4 and Table 6-2). In a rheostat configuration, this change in voltage needs to be taken into account, particularly for the lower resistance devices. For the 2.1 k device, the maximum wiper resistance at 5.5V is approximately 6% of the total resistance, while at 2.7V, it is approximately 15.5% of the total resistance. In a potentiometer configuration, the wiper resistance variation does not effect the output voltage seen on the terminal W pin. TABLE 6-2: RW VDD Note: The slope of the resistance has a linear area (at the higher voltages) and a nonlinear area (at the lower voltages). FIGURE 6-4: Relationship of Wiper Resistance (RW) to Voltage. Since there is minimal variation of the total device resistance over voltage, at a constant temperature (see Figure 2-6, Figure 2-17, Figure 2-27 or Figure 2-37), the change in wiper resistance over voltage can have a significant impact on the INL and DNL error. TYPICAL STEP RESISTANCES AND RELATIONSHIP TO WIPER RESISTANCE RW / RS (%) (1) Resistance () Typical Wiper (RW) RW = Typical RW = Max RW = Max @ 5.5V @ 2.7V RW = Typical RW = Max RW = Max @ 5.5V @ 2.7V Total (RAB) Step (RS) Typical 2100 33.33 75 125 325 225.0% 375.0% 975.0% 3.57% 5.95% 15.48% 5000 79.37 75 125 325 94.5% 157.5% 409.5% 1.5% 2.50% 6.50% 10000 158.73 75 125 325 47.25% 78.75% 204.75% 0.75% 1.25% 3.25% 50000 793.65 75 125 325 9.45% 15.75% 40.95% 0.15% 0.25% 0.65% Note 1: 2: Max @ Max @ 5.5V 2.7V RW / RAB (%) (2) RS is the typical value. The variation of this resistance is minimal over voltage. RAB is the typical value. The variation of this resistance is minimal over voltage. DS20001945F-page 44  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 6.3 Operational Characteristics Understanding the operational characteristics of the device’s resistor components is important to the system design. 6.3.1 6.3.1.1 6.3.1.2 Differential Non-Linearity (DNL) DNL error is the measure of variations in code widths from the ideal code width. A DNL error of zero would imply that every code is exactly 1 LSb wide. ACCURACY Integral Nonlinearity (INL) INL error for these devices is the maximum deviation between an actual code transition point and its corresponding ideal transition point after offset and gain errors have been removed. These endpoints are from 0x00 to 0x3F. Refer to Figure 6-5. Positive INL means higher resistance than ideal. Negative INL means lower resistance than ideal. 111 110 101 Digital Input Code 100 011 010 Actual Transfer Function Ideal Transfer Function Wide Code, > 1 LSb 001 INL < 0 000 111 110 Narrow Code < 1 LSb Actual Transfer Function Digital Pot Output 101 Digital Input Code FIGURE 6-6: 100 6.3.1.3 011 Ideal Transfer Function 010 001 000 INL < 0 Digital Pot Output FIGURE 6-5: INL Accuracy.  2006-2017 Microchip Technology Inc. DNL Accuracy. Ratiometric Temperature Coefficient The ratiometric temperature coefficient quantifies the error in the ratio RAW/RWB due to temperature drift. This is typically the critical error when using a potentiometer device (MCP4021 and MCP4023) in a voltage divider configuration. 6.3.1.4 Absolute Temperature Coefficient The absolute temperature coefficient quantifies the error in the end-to-end resistance (nominal resistance RAB) due to temperature drift. This is typically the critical error when using a rheostat device (MCP4022 and MCP4024) in an adjustable resistor configuration. DS20001945F-page 45 MCP4021/2/3/4 6.3.2 MONOTONIC OPERATION Monotonic operation means that the device’s resistance increases with every step change (from terminal A to terminal B or terminal B to terminal A). The wiper resistance is different at each tap location. When changing from one tap position to the next (either increasing or decreasing), the RW is less than the RS. When this change occurs, the device voltage and temperature are the same for the two tap positions. RS63 0x3F RS62 Digital Input Code 0x3E 0x3D RS3 0x03 RS1 0x02 RS0 0x01 0x00 RW n=? (@ tap) R = RSn + RW(@ Tap n) BW n=0 Resistance (RBW) FIGURE 6-7: DS20001945F-page 46 Resistance, RBW.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 7.0 DESIGN CONSIDERATIONS In the design of a system with the MCP402X devices, the following considerations should be taken into account: • The power supply • The layout 7.1 Power Supply Considerations The typical application will require a bypass capacitor in order to filter high-frequency noise, which can be induced onto the power supply's traces. The bypass capacitor helps to minimize the effect of these noise sources on signal integrity. Figure 7-1 illustrates an appropriate bypass strategy. 7.2 Layout Considerations Inductively-coupled AC transients and digital switching noise can degrade the input and output signal integrity, potentially masking the MCP402X’s performance. Careful board layout will minimize these effects and increase the Signal-to-Noise Ratio (SNR). Bench testing has shown that a multi-layer board utilizing a low-inductance ground plane, isolated inputs, isolated outputs and proper decoupling are critical to achieving the performance that the silicon is capable of providing. Particularly harsh environments may require shielding of critical signals. If low noise is desired, breadboards and wire-wrapped boards are not recommended. In this example, the recommended bypass capacitor value is 0.1 µF. This capacitor should be placed as close (within 4 mm) to the device power pin (VDD) as possible. The power source supplying these devices should be as clean as possible. If the application circuit has separate digital and analog power supplies, VDD and VSS should reside on the analog plane. VDD 0.1 µF VDD W B U/D CS VSS FIGURE 7-1: Connections. PIC® Microcontroller A MCP4021/2/3/4 0.1 µF VSS Typical Microcontroller  2006-2017 Microchip Technology Inc. DS20001945F-page 47 MCP4021/2/3/4 8.0 APPLICATIONS EXAMPLES VDD Nonvolatile digital potentiometers have a multitude of practical uses in modern electronic circuits. The most popular uses include precision calibration of set point thresholds, sensor trimming, LCD bias trimming, audio attenuation, adjustable power supplies, motor control overcurrent trip setting, adjustable gain amplifiers and offset trimming. The MCP4021/2/3/4 devices can be used to replace the common mechanical trim pot in applications where the operating and terminal voltages are within CMOS process limitations (VDD = 2.7V to 5.5V). 8.1 R1 MCP4021 A CS U/D W VOUT B R2 Set Point Threshold Trimming Applications that need accurate detection of an input threshold event often need several sources of error eliminated. Use of comparators and operational amplifiers (op amps) with low offset and gain error can help achieve the desired accuracy, but in many applications, the input source variation is beyond the designer’s control. If the entire system can be calibrated after assembly in a controlled environment (like factory test), these sources of error are minimized, if not entirely eliminated. Figure 8-1 illustrates a common digital potentiometer configuration. This configuration is often referred to as a “windowed voltage divider”. Note that R1 and R2 are not necessary to create the voltage divider, but their presence is useful when the desired threshold has limited range. It is “windowed” because R1 and R2 can narrow the adjustable range of VTRIP to a value much less than VDD – VSS. If the output range is reduced, the magnitude of each output step is reduced. This effectively increases the trimming resolution for a fixed digital potentiometer resolution. This technique may allow a lower-cost digital potentiometer to be utilized (64 steps instead of 256 steps). The MCP4021’s and MCP4023’s low DNL performance is critical to meeting calibration accuracy in production without having to use a higher precision digital potentiometer. EQUATION 8-1: V TRIP CALCULATING THE WIPER SETTING FROM THE DESIRED VTRIP R 2 + R WB = V DD  -----------------------------------  R 1 + R AB + R 2 FIGURE 8-1: Using the Digital Potentiometer to Set a Precise Output Voltage. 8.1.1 TRIMMING A THRESHOLD FOR AN OPTICAL SENSOR If the application has to calibrate the threshold of a diode, transistor or resistor, a variation range of 0.1V is common. Often, the desired resolution of 2 mV or better is adequate to accurately detect the presence of a precise signal. A “windowed” voltage divider, utilizing the MCP4021 or MCP4023, would be a potential solution, as shown in Figure 8-2. VDD VDD Rsense VCC+ R1 MCP4021 A CS U/D VTRIP W B R2 FIGURE 8-2: Calibration. Comparator MCP6021 0.1 µF VCC– Set Point or Threshold R AB = R Nominal D R WB = R AB   ------  63 V TRIP D =   --------------    R 1 + R AB + R 2  – R 2   63   V DD   Where: D = Digital Potentiometer Wiper Setting (0-63) DS20001945F-page 48  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 8.2 Operational Amplifier Applications Figure 8-3, Figure 8-4 and Figure 8-5 illustrate typical amplifier circuits that could replace fixed resistors with the MCP4021/2/3/4 to achieve digitally-adjustable analog solutions. A B A A W A W R3 B MCP4022 MCP4021 R3 A R4 B W Pot2 VDD – Op Amp VIN W Pot1 MCP4022 + VOUT MCP6021 1 fc = ----------------------------- 2   R Eq  C R2 Op Amp R1 VOUT – FIGURE 8-4: Trimming Offset and Gain in a Noninverting Amplifier. B – MCP6291 Op Amp VW R2 A W VDD MCP402X R4 + R1 R1 MCP4021 VIN VDD MCP4021 Figure 8-4 shows a circuit that allows a non-inverting amplifier to have its’ offset and gain to be independently trimmed. The MCP4021 is used along with resistors R1 and R2 to set the offset voltage. The sum of R1 + R2 resistance should be significantly greater (> 100 times) the resistance value of the MCP4021. This allows each increment or decrement in the MCP4021 to be a fine adjustment of the offset voltage. The input voltage of the op amp (VIN) should be centered at the op amps VW voltage. The gain is adjusted by the MCP4022. If the resistance value of the MCP4022 is small compared to the resistance value of R3, then this is a fine adjustment of the gain. If the resistance value of the MCP4022 is equal (or large) compared to the resistance value of R3, then this is a course adjustment of the gain. In general, trim the course adjustments first and then trim the fine adjustments. R3 VDD VIN VOUT + MCP6001 W B Thevenin R =  R 1 + R AB – R WB    R 2 + R WB  + R w Equivalent Eq FIGURE 8-5: Programmable Filter. R2 FIGURE 8-3: Trimming Offset and Gain in an Inverting Amplifier.  2006-2017 Microchip Technology Inc. DS20001945F-page 49 MCP4021/2/3/4 8.3 Temperature Sensor Applications VDD Thermistors are resistors with very predictable variation with temperature. Thermistors are a popular sensor choice when a low-cost, temperature-sensing solution is desired. Unfortunately, thermistors have nonlinear characteristics that are undesirable, typically requiring trimming in an application to achieve greater accuracy. There are several common solutions to trim and linearize thermistors. Figure 8-6 and Figure 8-7 are simple methods for linearizing a 3-terminal NTC thermistor. Both are simple voltage dividers using a Positive Temperature Coefficient (PTC) resistor (R1) with a transfer function capable of compensating for the linearity error in the Negative Temperature Coefficient (NTC) thermistor. The circuit, illustrated by Figure 8-6, utilizes a digital rheostat for trimming the offset error caused by the thermistor’s part-to-part variation. This solution puts the digital potentiometer’s RW into the voltage divider calculation. The MCP4021/2/3/4’s RAB temperature coefficient is 50 ppm (-20°C to +70°C). RW’s error is substantially greater than RAB’s error because RW varies with VDD, wiper setting and temperature. For the 50 k devices, the error introduced by RW is, in most cases, insignificant as long as the wiper setting is > 6. For the 2 k devices, the error introduced by RW is significant because it is a higher percentage of RWB. For these reasons, the circuit illustrated in Figure 8-6 is not the most optimum method for “exciting” and linearizing a thermistor. VDD R1 NTC Thermistor MCP4021 VOUT R2 FIGURE 8-7: Thermistor Calibration using a Digital Potentiometer in a Potentiometer Configuration. 8.4 Wheatstone Bridge Trimming Another common configuration to “excite” a sensor (such as a strain gauge, pressure sensor or thermistor) is the wheatstone bridge configuration. The wheatstone bridge provides a differential output instead of a single-ended output. Figure 8-8 illustrates a wheatstone bridge utilizing one to three digital potentiometers. The digital potentiometers in this example are used to trim the offset and gain of the wheatstone bridge. VDD R1 NTC Thermistor VOUT 2.1 k MCP4022 R2 A W MCP4022 FIGURE 8-6: Thermistor Calibration using a Digital Potentiometer in a Rheostat Configuration. The circuit illustrated by Figure 8-7 utilizes a digital potentiometer for trimming the offset error. This solution removes RW from the trimming equation along with the error associated with RW. R2 is not required, but can be utilized to reduce the trimming “window” and reduce variation due to the digital potentiometer’s RAB part-to-part variability. DS20001945F-page 50 VOUT MCP4022 50 k FIGURE 8-8: Trimming. MCP4022 50 k Wheatstone Bridge  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 9.0 DEVELOPMENT SUPPORT 9.1 Evaluation/Demonstration Boards Currently there are three boards that are available that can be used to evaluate the MCP4021/2/3/4 family of devices. 1. The MCP402X Digital Potentiometer Evaluation Board kit (MCP402XEV) contains a simple demonstration board utilizing a PIC10F206, the MCP4021 and a blank PCB, which can be populated with any desired MCP4021/2/3/4 device in a SOT-23-5, SOT-23-6 or 150 mil SOIC 8-pin package. This board has two push buttons to control when the PIC® microcontroller generates MCP402X serial commands. The example firmware demonstrates the following commands: • Increment • Decrement • High-Voltage Increment and Enable WiperLock Technology • High-Voltage Decrement and Enable WiperLock Technology • High-Voltage Increment and Disable WiperLock Technology • High-Voltage Decrement and Disable WiperLock Technology The populated board (with the MCP4021) can be used to evaluate the other MCP402X devices by appropriately jumpering the PCB pads. 2. 3. 4. The SOT-23-5/6 Evaluation Board (VSUPEV2) can be used to evaluate the characteristics of the MCP4022, MCP4023 and MCP4024 devices. The 8-pin SOIC/MSOP/TSSOP/DIP Evaluation Board (SOIC8EV) can be used to evaluate the characteristics of the MCP4021 device in either the SOIC or MSOP package. The MCP4XXX Digital Potentiometer Daughter Board allows the system designer to quickly evaluate the operation of Microchip Technology's MCP42XXX and MCP402X Digital Potentiometers. The board supports two MCP42XXX devices and an MCP402X device, which can be replaced with an MCP401X device. The board also has a voltage doubler device (TC1240A), which can be used to show the WiperLock Technology feature of the MCP4021. These boards may be purchased directly from the Microchip web site at www.microchip.com.  2006-2017 Microchip Technology Inc. DS20001945F-page 51 MCP4021/2/3/4 10.0 PACKAGING INFORMATION 10.1 Package Marking Information Example: 5-Lead SOT-23 (MCP4024) XXNN DP25 Part Number Code MCP4024T-202E/OT DPNN MCP4024T-502E/OT DQNN MCP4024T-103E/OT DRNN MCP4024T-503E/OT DSNN Note: Applies to 5-Lead SOT-23 Example: 6-Lead SOT-23 (MCP4022 / MCP4023) XXNN BA25 Part Number Code MCP4022 MCP4023 MCP402xT-202E/CH BANN MCP402xT-502E/CH BBNN BENN BFNN MCP402xT-103E/CH BCNN BGNN MCP402xT-503E/CH BDNN BHNN Note: Applies to 6-Lead SOT-23 Legend: XX...X Y YY WW NNN e3 * Note: DS20001945F-page 52 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Package Marking Information 8-Lead DFN (2x3) (MCP4021) Example: AAA 640 25 Part Number Code MCP4021T-202E/MC AAA MCP4021T-502E/MC AAB MCP4021T-103E/MC AAC MCP4021T-503E/MC AAD Note: Applies to 8-Lead DFN 8-Lead MSOP (MCP4021) Example: 8-Lead MSOP (MCP4021) 402122 640256 8-Lead SOIC (150 mil) (MCP4021) Example: 402153E e3 1640 SN^^ NNN 256 Part Numbers 8L-MSOP 8L-SOIC Code MCP4021-202E/MS MCP4021-202E/SN 22 MCP4021-502E/MS MCP4021-502E/SN 52 MCP4021-103E/MS MCP4021-103E/SN 13 MCP4021-503E/MS MCP4021-503E/SN 53  2006-2017 Microchip Technology Inc. DS20001945F-page 53 MCP4021/2/3/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 0.20 C 2X D e1 A D N E/2 E1/2 E1 E (DATUM D) (DATUM A-B) 0.15 C D 2X NOTE 1 1 2 e B NX b 0.20 C A-B D TOP VIEW A A A2 0.20 C SEATING PLANE A SEE SHEET 2 C A1 SIDE VIEW Microchip Technology Drawing C04-028D [OT] Sheet 1 of DS20001945F-page 54  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging c T L L1 VIEW A-A SHEET 1 Units Dimension Limits Number of Pins N e Pitch e1 Outside lead pitch Overall Height A Molded Package Thickness A2 Standoff A1 E Overall Width E1 Molded Package Width D Overall Length L Foot Length Footprint L1 I Foot Angle c Lead Thickness b Lead Width MIN 0.90 0.89 - 0.30 0° 0.08 0.20 MILLIMETERS NOM 6 0.95 BSC 1.90 BSC 2.80 BSC 1.60 BSC 2.90 BSC 0.60 REF - MAX 1.45 1.30 0.15 0.60 10° 0.26 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-091D [OT] Sheet 2 of  2006-2017 Microchip Technology Inc. DS20001945F-page 55 MCP4021/2/3/4 5-Lead Plastic Small Outline Transistor (OT) [SOT23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging X SILK SCREEN 5 Y Z C G 1 2 E GX RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch C Contact Pad Spacing X Contact Pad Width (X5) Contact Pad Length (X5) Y Distance Between Pads G Distance Between Pads GX Overall Width Z MIN MILLIMETERS NOM 0.95 BSC 2.80 MAX 0.60 1.10 1.70 0.35 3.90 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2091A [OT] DS20001945F-page 56  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.15 C A-B D e1 A D E 2 E1 E E1 2 2X 0.15 C D 2X 0.20 C A-B e 6X b B 0.20 C A-B D TOP VIEW C A A2 SEATING PLANE 6X A1 0.10 C SIDE VIEW R1 L2 R c GAUGE PLANE L Ĭ (L1) END VIEW Microchip Technology Drawing C04-028C (CH) Sheet 1 of 2  2006-2017 Microchip Technology Inc. DS20001945F-page 57 MCP4021/2/3/4 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits N Number of Leads e Pitch Outside lead pitch e1 Overall Height A Molded Package Thickness A2 Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Foot Length L Footprint L1 Seating Plane to Gauge Plane L1 φ Foot Angle c Lead Thickness Lead Width b MIN 0.90 0.89 0.00 0.30 0° 0.08 0.20 MILLIMETERS NOM 6 0.95 BSC 1.90 BSC 1.15 2.80 BSC 1.60 BSC 2.90 BSC 0.45 0.60 REF 0.25 BSC - MAX 1.45 1.30 0.15 0.60 10° 0.26 0.51 Notes: 1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25mm per side. 2. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. Microchip Technology Drawing C04-028C (CH) Sheet 2 of 2 DS20001945F-page 58  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 6-Lead Plastic Small Outline Transistor (CH, CHY) [SOT-23] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging GX Y Z C G G SILK SCREEN X E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch C Contact Pad Spacing X Contact Pad Width (X3) Y Contact Pad Length (X3) G Distance Between Pads Distance Between Pads GX Z Overall Width MIN MILLIMETERS NOM 0.95 BSC 2.80 MAX 0.60 1.10 1.70 0.35 3.90 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-2028B (CH)  2006-2017 Microchip Technology Inc. DS20001945F-page 59 MCP4021/2/3/4 /HDG3ODVWLF'XDO)ODW1R/HDG3DFNDJH0&±[[PP%RG\>')1@ 1RWH G& '!&" & 7 #3!*  ! ! &  7 %&& #& && @JJ333' 'J 7 D e b N N L K E2 E EXPOSED PAD NOTE 1 2 1 2 NOTE 1 1 D2 BOTTOM VIEW TOP VIEW A A3 A1 NOTE 2 K&! ' !Q'&! U"'+ %! QQ;; U U UY Z [ & Y \ &  [   &#%%    = ?&&7 !! 9 ;G Y Q &  >? Y ]#& ; ;$ ! ##Q &  9 ^ ;$ ! ##]#& ; = ^ = +  = 9 ?&&Q & Q 9  = ?&& & ;$ ! ## _  ^ ^ ?&&]#& =>? 9>? == 1RWHV  !"# $% &" '*+"&'"!&+ & #3&& & #   7 '  '  $ ! #& +!& #! 9 7 !!3!"& #  ' !#&  ;?@ >!' !  & $&" !33&"&&  ! ;G@  %   ' !*"!"3&"&&  *%%'& " ! !    3 ? 9? DS20001945F-page 60  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2006-2017 Microchip Technology Inc. DS20001945F-page 61 MCP4021/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001945F-page 62  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2006-2017 Microchip Technology Inc. DS20001945F-page 63 MCP4021/2/3/4 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001945F-page 64  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 2X 0.10 C A–B D A D NOTE 5 N E 2 E1 2 E1 E NOTE 1 2 1 e B NOTE 5 NX b 0.25 C A–B D TOP VIEW 0.10 C C SEATING PLANE A A2 8X A1 SIDE VIEW 0.10 C h R0.13 h R0.13 H SEE VIEW C VIEW A–A 0.23 L (L1) VIEW C Microchip Technology Drawing No. C04-057-SN Rev D Sheet 1 of 2  2006-2017 Microchip Technology Inc. DS20001945F-page 65 MCP4021/2/3/4 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm (.150 In.) Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Units Dimension Limits Number of Pins N e Pitch Overall Height A Molded Package Thickness A2 § Standoff A1 Overall Width E Molded Package Width E1 Overall Length D Chamfer (Optional) h Foot Length L L1 Footprint Foot Angle c Lead Thickness b Lead Width Mold Draft Angle Top Mold Draft Angle Bottom MIN 1.25 0.10 0.25 0.40 0° 0.17 0.31 5° 5° MILLIMETERS NOM 8 1.27 BSC 6.00 BSC 3.90 BSC 4.90 BSC 1.04 REF - MAX 1.75 0.25 0.50 1.27 8° 0.25 0.51 15° 15° Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. REF: Reference Dimension, usually without tolerance, for information purposes only. 5. Datums A & B to be determined at Datum H. Microchip Technology Drawing No. C04-057-SN Rev D Sheet 2 of 2 DS20001945F-page 66  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging SILK SCREEN C Y1 X1 E RECOMMENDED LAND PATTERN Units Dimension Limits E Contact Pitch Contact Pad Spacing C Contact Pad Width (X8) X1 Contact Pad Length (X8) Y1 MIN MILLIMETERS NOM 1.27 BSC 5.40 MAX 0.60 1.55 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing C04-2057-SN Rev B  2006-2017 Microchip Technology Inc. DS20001945F-page 67 MCP4021/2/3/4 NOTES: DS20001945F-page 68  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 APPENDIX A: REVISION HISTORY Revision F (December 2017) The following is the list of modifications: 1. 2. Updated the High-Voltage Input Entry Voltage entry in the “AC/DC Characteristics” table. Updated Table 6-1 “Typical Step Resistances”. Revision E (December 2006) The following is the list of modifications: 1. 2. 3. Added device designators in conditions column to associate units (MHz) in Bandwidth –3 dB parameter in the table “AC/DC Characteristics” table. Added device designations in conditions column for R-INL and R-DNL specifications. Added disclaimers to package outline drawings. Revision D (October 2006) The following is the list of modifications: 1. 2. 3. 4. 5. 6. Changed the EEPROM write cycle time (TWC) from a maximum of 5 ms to a maximum of 10 ms (overvoltage and temperature) with a typical of 5 ms. For the 10 k device, the rheostat differential nonlinearity specification at 2.7V was changed from ±0.5 LSb to ±1.0 LSb. Figure 2-9 in Section 2.0 “Typical Performance Curves” was updated with the correct data. Added Figure 2-48 for –3 db Bandwidth information. Updated available Development Tools. Added disclaimer to package outline drawings. Revision C (November 2005) The following is the list of modifications: 1. 2. 3. Enhanced Descriptions. Reordered Sections. Added 8-lead MSOP and DFN packages. Revision B (April 2005) The following is the list of modifications: 1. 2. Updated part numbers in Product Identifcation Section (PIS). Added Appendix A: Revision History. Revision A (April 2005) • Original release of this document.  2006-2017 Microchip Technology Inc. DS20001945F-page 69 MCP4021/2/3/4 NOTES: DS20001945F-page 70  2006-2017 Microchip Technology Inc. MCP4021/2/3/4 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. Device XXX X /XX Resistance Temperature Package Version Range Device: MCP4021: MCP4021T: MCP4022: MCP4022T: MCP4023: MCP4023T: MCP4024: MCP4024T: Single Potentiometer with U/D Interface Single Potentiometer with U/D Interface (Tape and Reel) (SOIC, MSOP) Single Rheostat with U/D interface Single Rheostat with U/D interface (Tape and Reel) (SOT-23-6) Single Potentiometer to GND with U/D Interface Single Potentiometer to GND with U/D Interface (Tape and Reel) (SOT-23-6) Single Rheostat to GND with U/D Interface Single Rheostat to GND with U/D Interface (Tape and Reel)(SOT-23-5) Examples: a) b) c) d) e) f) g) h) i) j) k) l) m) n) o) p) q) r) s) t) MCP4021-103E/MS: MCP4021-103E/SN: MCP4021T-103E/MC: MCP4021T-103E/MS: MCP4021T-103E/SN: MCP4021-202E/MS: MCP4021-202E/SN: MCP4021T-202E/MC: MCP4021T-202E/MS: MCP4021T-202E/SN: MCP4021-502E/MS: MCP4021-502E/SN: MCP4021T-502E/MC: MCP4021T-502E/MS: MCP4021T-502E/SN: MCP4021-503E/MS: MCP4021-503E/SN: MCP4021T-503E/MC: MCP4021T-503E/MS: MCP4021T-503E/SN: 10 k, 8-LD MSOP 10 k, 8-LD SOIC T/R, 10 k, 8-LD DFN T/R, 10 k, 8-LD MSOP T/R, 10 k, 8-LD SOIC 2.1 k, 8-LD MSOP 2.1 k, 8-LD SOIC T/R, 2.1 k, 8-LD DFN T/R, 2.1 k, 8-LD MSOP T/R, 2.1 k, 8-LD SOIC 5 k, 8-LD MSOP 5 k, 8-LD SOIC T/R, 5 k, 8-LD DFN T/R, 5 k, 8-LD MSOP T/R, 5 k, 8-LD SOIC 50 k, 8-LD MSOP 50 k, 8-LD SOIC T/R, 50 k, 8-LD DFN T/R, 50 k, 8-LD MSOP T/R, 50 k, 8-LD SOIC a) b) c) d) MCP4022T-202E/CH MCP4022T-502E/CH MCP4022T-103E/CH MCP4022T-503E/CH 2.1 k, 6-LD SOT-23 5 k, 6-LD SOT-23 10 k, 6-LD SOT-23 50 k, 6-LD SOT-23 Resistance Version: 202 = 2.1 k 502 = 5 k 103 = 10 k 503 = 50 k Temperature Range: E = -40°C to +125°C a) b) c) d) MCP4023T-202E/CH MCP4023T-502E/CH MCP4023T-103E/CH MCP4023T-503E/CH 2.1 k, 6-LD SOT-23 5 k, 6-LD SOT-23 10 k, 6-LD SOT-23 50 k, 6-LD SOT-23 Package: CH MC MS SN OT = = = = = a) b) c) d) MCP4024T-202E/OT MCP4024T-502E/OT MCP4024T-103E/OT MCP4024T-503E/OT 2.1 k, 5-LD SOT-23 5 k, 5-LD SOT-23 10 k, 5-LD SOT-23 50 k, 5-LD SOT-23 Plastic Small Outline Transistor, 6-lead Plastic Dual Flat No Lead (2x3x0.9 mm), 8-lead Plastic MSOP, 8-lead Plastic SOIC, (150 mil Body), 8-lead Plastic Small Outline Transistor, 5-lead  2006-2017 Microchip Technology Inc. DS20001945F-page 71 MCP4021/2/3/4 NOTES: DS20001945F-page 72  2006-2017 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV Trademarks The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ, KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2017, Microchip Technology Incorporated, All Rights Reserved. ISBN: 978-1-5224-2436-9 == ISO/TS 16949 ==  2006-2017 Microchip Technology Inc. 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