MCP47DA1
6-Bit Windowed Volatile DAC with Command Code
Package Types
Features:
MCP47DA1
• 6-Bit DAC:
- 65 Taps: 64 Resistors with Taps to Full Scale
and Zero Scale (Wiper Code 00h to 40h)
- 7-bit Serial Data (00h to 7Fh, 00h - 20h =
Zero Scale and 60h-7Fh = Full Scale)
• VREF Pull-down Resistance: 30 k (typical)
• VOUT Voltage Range:
- 1/3 * VREF to 2/3 * VREF
• I2C™ Protocol:
- Supports SMBus 2.0 Write Byte/Word
Protocol Formats
- Supports SMBus 2.0 Read Byte/Word
Protocol Formats
- Slave Addresses: 5Ch and 7Ch
• Brown-out Reset Protection (1.5V, typical)
• Power-on Default Wiper Setting (Mid-scale)
• Low-Power Operation: 100 µA Static Current (typ.)
• Wide Operating Voltage Range:
- 2.7V to 5.5V – Device Characteristics
Specified
- 1.8V to 2.7V – Device Operation
• Low Tempco: 15 ppm (typical)
• 100 kHz (typical) Bandwidth (-3 dB) Operation
• Extended Temperature Range (-40°C to +125°C)
• Small Packages, SOT-23-6, SC70-6
• Lead Free (Pb-free) Package
VDD 1
A
VSS 2
B
W
6 VREF
5 VOUT
SCL 3
4 SDA
SOT-23-6, SC70-6
Device Block Diagram
VSS
SDA
SCL
10 K
Power-up
and
Brown-out
Control
VREF
A
Wiper Register (RAB = 10K)
VDD
2-Wire
Interface
and
Control
Logic
VOUT
B
10 K
Description:
The MCP47DA1 devices are volatile, 6-Bit digital
potentiometers with a buffered output. The wiper
setting is controlled through an I2C serial interface. The
MCP47DA1. I2C slave addresses of “010 1110” and
“011 1110” are supported. The MCP47DA1 has a
windowed output (1/3 to 2/3 of VREF).
Applications:
2
• PC Servers (I C Protocol with Command Code)
• Set Point or Offset Trimming
• Cost-sensitive Mechanical Trim Pot Replacement
00h - 7Fh
40h
5Ch, 7Ch 1.8V to 5.5V
VOUT
Range
POR/BOR
Value
30.0
VDD
Operating
Range ( 1)
Data
Value
Range
64
I2C™ Slave
Address
VREF
Resistance
I2C™ 65
# of
Resistors
MCP47DA1
# of Taps
Device
Interface
Device Features
Package(s)
1/3 VREF to SOT-23-6,
SC70-6
2/3 VREF
Note 1: Analog characteristics only tested from 2.7V to 5.5V.
2012-2013 Microchip Technology Inc.
DS25118D-page 1
MCP47DA1
NOTES:
DS25118D-page 2
2012-2013 Microchip Technology Inc.
MCP47DA1
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on VDD with respect to VSS ......................................................................................................... 0.6V to +7.0V
Voltage on SCL, and SDA with respect to VSS ..................................................................................................... -0.6V to VDD + 0.3V
Voltage on all other pins (VOUT and VREF) with respect to VSS ..................................................................... -0.3V to VDD + 0.3V
Input clamp current, IIK (VI < 0, VI > VDD) .............................................................................................................±20 mA
Output clamp current, IOK (VO < 0 or VO > VDD)...................................................................................................±20 mA
Maximum output current sunk by any Output pin ...................................................................................................25 mA
Maximum output current sourced by any Output pin .............................................................................................25 mA
Maximum current out of VSS pin ...........................................................................................................................100 mA
Maximum current into VDD pin ..............................................................................................................................100 mA
Maximum current into VREF pin..............................................................................................................................250 uA
Maximum current sourced by VOUT pin ..................................................................................................................40 mA
Maximum current sunk by VREF pin ........................................................................................................................40 mA
Package power dissipation (TA = +50°C, TJ = +150°C)
SOT-23-6...................................................................................................................................................525 mW
SC70-6 ......................................................................................................................................................480 mW
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied ...............................................................................................-40°C to +125°C
ESD protection on all pins 6 kV (HBM)
400V (MM)
1.5 kV (CDM) (for SOT-23)
1.5 kV (CDM) (for SC-70)
Latch-up (JEDEC JESD78A) at +125°C ............................................................................................................. ±100 mA
Soldering temperature of leads (10 seconds) ....................................................................................................... +300°C
Maximum Junction Temperature (TJ) ................................................................................................................... +150°C
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
2012-2013 Microchip Technology Inc.
DS25118D-page 3
MCP47DA1
AC/DC CHARACTERISTICS
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to +5.5V. CL = 1 nF, RL = 5 k .
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Supply Voltage
VDD
2.7
—
5.5
V
Analog Characteristics specified
1.8
—
5.5
V
Digital Characteristics specified
—
—
1.65
V
RAM retention voltage (VRAM) < VBOR
VDD Start Voltage
to ensure wiper to
default Reset
state
VBOR
VDD Rise Rate to
ensure Power-on
Reset
VDDRR
Delay after device
exits the Reset
state
(VDD > VBOR) to
Digital Interface
Active
TBORD
Delay after device
exits the Reset
state
(VDD > VBOR) to
VOUT valid
TOUTV
Supply Current
(Note 6)
VREF Input Range
Note 1:
2:
3:
4:
5:
6:
7:
IDD
VREF
Note 5
—
—
Conditions
V/ms
1
µS
20
µS
Within ± 0.5 LSb of VREF/2
(for default POR/BOR wiper value).
—
130
200
µA
Serial Interface Active,
Write all 0’s to volatile wiper,
No Load on VOUT
VDD = 5.5V, VREF = 1.5V,
FSCL = 400 kHz
—
100
160
µA
Serial Interface Inactive (Static),
(Stop condition, SCL = SDA = VIH),
No Load on VOUT
Wiper = 0, VDD = 5.5V, VREF = 1.5V
1
—
VDD
V
For VDD 3.0V
VREF VDD
For VDD < 3.0V
VREF (VDD - 1.0V)/(2/3) (Note 7)
Resistance is defined as the resistance between the VREF pin and the VSS pin.
INL and DNL are measured at VOUT from Code = 20h (Zero Scale) through Code = 60h (Full Scale).
This specification by design.
Non-linearity is affected by wiper resistance (RW), which changes significantly over voltage and
temperature.
POR/BOR is not rate dependent.
Supply current is independent of VREF current.
See Section 7.1.3.
DS25118D-page 4
2012-2013 Microchip Technology Inc.
MCP47DA1
AC/DC CHARACTERISTICS (CONTINUED)
Standard Operating Conditions (unless otherwise specified)
Operating Temperature
–40°C TA +125°C (extended)
DC Characteristics
Parameters
All parameters apply across the specified operating ranges unless noted.
VDD = +2.7V to +5.5V. CL = 1 nF, RL = 5 k .
Typical specifications represent values for VDD = 5.5V, TA = +25°C.
Sym.
Min.
Typ.
Max.
Units
Conditions
Minimum Output
Voltage
VOUT(MIN)
—
VREF / 3
—
V
Device Output minimum drive
Maximum Output
Voltage
VOUT(MAX)
—
2 * VREF/3
—
V
Device Output maximum drive
Output Amplifier
Degree (°) CL = 400 pF, RL =
Phase Margin
PM
—
66
—
Slew Rate
SR
—
0.55
—
V/µs
Short Circuit
Current
ISC
5
15
24
mA
Settling Time
tSETTLING
—
6
—
µs
External Reference (VREF) (Note 3)
CVREF
—
7
—
pF
THD
—
-73
—
dB
Major Code
Transition Glitch
—
45
—
nV-s
Digital
Feedthrough
—
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001
000
101
Wiper
Code
101
Actual
transfer
function
Wiper 100
Code
011
111
110
110
Narrow code < 1 LSb
100
011
010
VOUT Output Voltage
Ideal transfer
function
FIGURE B-5:
DNL ACCURACY.
001
000
INL < 0
VOUT Output Voltage
FIGURE B-4:
DS25118D-page 70
INL ACCURACY.
2012-2013 Microchip Technology Inc.
MCP47DA1
B.13
Settling Time
The Settling time is the time delay required for the VOUT
voltage to settle into its new output value. This time is
measured from the start of code transition, to when the
VOUT voltage is within the specified accuracy.
In the MCP47DA1, the settling time is a measure of the
time delay until the VOUT voltage reaches within 0.5
LSb of its final value, when the volatile DAC register
changes from 40h to 50h.
See Figure 2-89 through Figure 2-92 for Settling Time
oscilloscope screen captures.
B.14
Major-Code Transition Glitch
Major-code transition glitch is the impulse energy
injected into the DAC analog output when the code in
the DAC register changes state. It is normally specified
as the area of the glitch in nV-Sec, and is measured
when the digital code is changed by 1 LSb at the major
carry transition (Example: wiper code changes from
“011111” to “100000”, or from “100000” to
“011111”).
B.15
Digital Feedthrough
The Digital feedthrough is the glitch that appears at the
analog output caused by coupling from the digital input
pins of the device. The area of the glitch is expressed
in nV-Sec, and is measured with a full-scale change
(Example: all 0s to all 1s and vice versa) on the digital
input pins. The digital feedthrough is measured when
the DAC is not writing to the output register.
2012-2013 Microchip Technology Inc.
B.16
Power-Supply Rejection Ratio
(PSRR)
PSRR indicates how the output of the DAC is affected
by changes in the supply voltage. PSRR is the ratio of
the change in VOUT to a change in VDD for full-scale
output of the DAC. The VOUT is measured while the
VDD is varied +/- 10%, and expressed in dB or µV/V.
B.17
Ratiometric Temperature
Coefficient
The ratiometric temperature coefficient quantifies the
error in the ratio of the resistor setting (Resistance from
VREF pin to wiper position (RVREF-W) and the wiper
position to Ground (RW-VSS) due to temperature drift.
This error also includes the drift of the output driver
over temperature. This is typically the critical error
when using a DAC.
See Figure 2-56 through Figure 2-66 for Tempco
characterization graphs.
B.18
Absolute Temperature Coefficient
The absolute temperature coefficient quantifies the
error in the end-to-end output voltage (Nominal output
voltage VOUT) due to temperature drift. For a DAC, this
error is typically not an issue, due to the ratiometric
aspect of the output.
Note:
Due to the three resistor implementation
of the MCP47DA1 (R1, RAB, and R2), R1,
RAB and R2 are implemented so that they
have a common tempco over-process.
DS25118D-page 71
MCP47DA1
NOTES:
DS25118D-page 72
2012-2013 Microchip Technology Inc.
MCP47DA1
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Device
Device:
I2C™
X
XXX
/XX
I2C Slave Temperature Package
Address
Range
MCP47DA1: 6-bit Single DAC with I2C interface
MCP47DA1T: 6-bit Single DAC with I2C interface
(Tape and Reel)
Slave
Address:
A0 = 5Ch
A1 = 7Ch
Temperature
Range:
E
Package:
OT = Plastic Small Outline Transistor
(SOT-23), 6-lead
LT = Plastic Small Outline Transistor
(SC70), 6-lead
Examples:
a)
MCP47DA1-A0E/OT:
b)
MCP47DA1T-A0E/OT:
c)
MCP47DA1-A1E/OT:
d)
MCP47DA1T-A1E/OT:
e)
MCP47DA1T-A0E/LT:
f)
MCP47DA1T-A1E/LT:
= -40°C to +125°C
2012-2013 Microchip Technology Inc.
6-bit DAC,
SOT-23-6,
Address = 5Ch.
6-bit DAC,
SOT-23-6,
Address = 5Ch,
Tape and Reel.
6-bit DAC,
SOT-23-6,
Address = 7Ch.
6-bit DAC,
SOT-23-6,
Address = 7Ch,
Tape and Reel.
6-bit DAC,
SC70-6,
Address = 5Ch.
6-bit DAC,
SC70-6,
Address = 7Ch.
DS25118D-page 73
MCP47DA1
NOTES:
DS25118D-page 74
2012-2013 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2012-2013, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620770900
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2012-2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS25118D-page 75
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DS25118D-page 76
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11/29/12
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