MCP73830/L
Single-Cell Li-Ion/Li-Polymer Battery Charge Management
Controllers in 2x2 TDFN
Features:
Description:
• Complete Linear Charge Management Controller:
- Integrated pass transistor
- Integrated current sense
- Integrated Reverse Discharge Protection
• Constant-Current/Constant Voltage Operation
• High-Accuracy Preset Voltage Regulation:
- 4.20V +0.75%
• Programmable Charge Current:
- MCP73830L: 20 mA-200 mA
- MCP73830: 100 mA-1000 mA
• Soft Start to Avoid Inrush Current
• Preconditioning:
- 10% and no preconditioning
• Fixed Elapsed Timer: 4 Hours
• Fixed Preconditioning Timer: 1 Hour
• Automatic Recharge: No Auto-Recharge is also
Available with Selected Options
• Automatic End-of-Charge (EOC) Control
Termination:
- 7.5% and 10%
• Automatic Power-Down when Input Power
Removed
• Undervoltage Lockout (UVLO)
• Chip/Charge Enable Pin (CE)
• Packaging:
- TDFN-6 (2x2 mm)
• Temperature Range: -40°C to +85°C
The MCP73830/L are highly integrated, Li-Ion battery
charge management controllers for use in space-limited
applications. The MCP73830/L devices provide specific
charge algorithms for single-cell Li-Ion/Li-Polymer batteries to achieve optimal capacity and safety in the shortest
charging time possible. Along with its small physical size,
the low number of external components makes the
MCP73830/L ideally suitable for portable applications.
The MCP73830L employs a constant-current/constant
voltage charge algorithm. The minimum 20 mA regulated constant, fast charge current enables the design
in small Li-Ion batteries and low supply current applications. The fast charge, constant-current value is set
with one external resistor, from 20 mA to 200 mA. The
MCP73830 allows up to 1000 mA charge current for
applications that require faster constant current.
The MCP73830/L devices provide a thermal foldback
function that limits the charge current, based on die
temperature during high-power or high-ambient conditions. This thermal regulation optimizes the charge
cycle time while maintaining device reliability.
The MCP73830/L devices are fully specified over the
ambient temperature range of -40°C to +85°C. The
MCP73830/L is available in a 6 lead, TDFN package.
Package Types (Top View)
VSS 1
Applications:
•
•
•
•
MCP73830/L
2x2 TDFN *
STAT 2
Bluetooth Headsets
Portable Media Players
Rechargeable 3D Glasses
Toy and Gaming Controllers
6 PROG
EP
7
VBAT 3
5 CE
4 VDD
* Includes Exposed Thermal Pad (EP); see Table 3-1.
TABLE 1:
AVAILABLE FACTORY PRESET OPTIONS
Charge Voltage
Preconditioning Charge Current
End-of-Charge Control
Auto-Recharge
4.2V
10%/Disabled
7.5%/10%
Yes/No
2011-2019 Microchip Technology Inc.
DS20005049E-page 1
MCP73830/L
Typical Application
MCP73830/L
4
VDD
VBAT
3
+
4.7 µF
4.7 µF
Regulated
Wall Cube
2
STAT
PROG
1 k
2 k
5
Lo Hi
CE
VSS
1-Cell
Li-Ion
Battery
6
–
1
Functional Block Diagram
Direction
Control
VDD
VBAT
PROG
G = 0.001
CA
–
+
VREF
PRECONDITION
–
+
CHRG
VREF
VREF
+
–
VA
–
+
UVLO
+
–
CE
TERM
UVLO,
Reference,
Charge
Control,
Timer and
Status Logic
+
–
STAT
VREF
VREF
VREF
VDD
VSS
DS20005049E-page 2
2011-2019 Microchip Technology Inc.
MCP73830/L
1.0
ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Absolute Maximum Ratings†
VDD, VBAT .........................................................................7.0V
All Inputs and Outputs w.r.t. VSS ..............-0.3 to (VDD + 0.3)V
Maximum Junction Temperature, TJ ............ Internally Limited
Storage temperature .....................................-65°C to +150°C
ESD protection on all pins
Human Body Model (1.5 k in Series with 100 pF)2 kV
Machine Model (200 pF, No Series Resistance) .............300V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG(Typical) + 1.0V].
Parameters
Sym.
Min.
Typ.
Max.
Input Voltage Range
VDD
Supply Current
ISS
Units
Conditions
3.75
—
6
V
—
0.6
2
µA
Shutdown;
VDD VSTOP – 300 mV
—
500
900
µA
Charging
—
25
50
µA
Standby; CE = VDD
—
10
15
µA
Charge Complete;
VDD is Present
—
0.5
—
µA
Shutdown
(VDD VBAT or VDD < VSTOP)
—
0.5
—
µA
Standby; CE = VDD
3.6
3.75
V
VDD Low-to-High
VDD High-to-Low
Supply Input
Battery Discharge Current
Output Reverse
Leakage Current
IDISCHARGE
Undervoltage Lockout
UVLO Start Threshold
VSTART
3.45
UVLO Stop Threshold
VSTOP
3.15
3.3
3.45
V
UVLO Hysteresis
VHYS
—
300
—
mV
Voltage Regulation (Constant Voltage Mode)
Regulated Output
Voltage Options
VREG
—
4.20
—
V
VDD = [VREG(Typical) + 1V];
IOUT = 30 mA
Output Voltage
Tolerance
VRTOL
-0.75
—
0.75
%
TA= -5°C to +55°C
Line Regulation
VBAT/VBAT)/
VDD|
—
0.2
0.3
%/V
Load Regulation
VBAT/VBAT|
—
0.2
0.3
%
IOUT = 30 mA – 150 mA;
VDD = [VREG(Typical) + 1V]
PSRR
—
52
—
dB
IOUT = 30 mA; 10 Hz to 1 kHz
—
47
—
dB
IOUT = 30 mA; 10 Hz to 10 kHz
Supply Ripple
Attenuation
Note 1:
VDD = [VREG(Typical) + 1V] to 6V;
IOUT = 30 mA
Not production tested. Ensured by design.
2011-2019 Microchip Technology Inc.
DS20005049E-page 3
MCP73830/L
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG(Typical) + 1.0V].
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Current Regulation (Fast Charge, Constant-Current Mode)
Fast Charge Current
Regulation
MCP73830L
IREG
Fast Charge Current
Regulation
MCP73830
IREG
Charge Current
Tolerance
IRTOL
20
—
200
mA
—
20
—
mA
PROG = 10 k
—
200
—
mA
PROG = 1 k
100
—
1000
mA
—
100
—
mA
PROG = 10 k
—
1000
—
mA
PROG = 1 k
—
10
—
%
VDD = 4.5V; TA = -5°C to +55°C
Preconditioning Current Regulation (Trickle Charge Constant Current Mode)
Precondition Current
Ratio
IPREG/IREG
Precondition Voltage
Threshold Ratio
—
10
—
%
PROG = 1 kto 10 k
—
100
—
%
No Preconditioning
VPTH/VREG
70
72
75
%
VBAT Low-to-High;
TA = -5°C to +55°C
VPHYS
—
100
—
mV
ITERM/IREG
5.6
7.5
9.4
%
8
10
12
%
PROG = 1 kto 10 k;
VDD = 4.5V; TA = -5°C to +55°C
94.5
96.5
98.5
%
VBAT High-to-Low
—
0
—
%
No Automatic Recharge
RDSON
—
500
—
m
Sink Current
ISINK
—
16
30
mA
Low Output Voltage
VOL
—
0.4
1
V
ISINK = 4 mA
ILK
—
0.01
1
µA
High Impedance; VDD on Pin
RPROG
1
—
10
k
Automatic Power- Down
Entry Threshold
VPDENTRY
—
VBAT + 50 mV
—
V
VDD Falling
Automatic Power-Down
Exit Threshold
VPDEXIT
—
VBAT + 150 mV
—
V
VDD Rising
Input High-Voltage Level
VIH
1.5
—
—
V
Input Low-Voltage Level
VIL
—
—
0.8
V
Input Leakage Current
ILK
—
5
8
µA
Precondition
Hysteresis
Charge Termination
Charge Termination
Current Ratio
Automatic Recharge
Recharge Voltage
Threshold Ratio
VRTH/VREG
Pass Transistor On-Resistance
On-Resistance
VDD = 4.5V; TJ = +105°C (Note 1)
Status Indicator – STAT
Input Leakage Current
PROG Input
Charge Impedance
Range
Automatic Power-Down
Charge Enable (CE)
Note 1:
VDD = 5V; TA= -5°C to +55°C
Not production tested. Ensured by design.
DS20005049E-page 4
2011-2019 Microchip Technology Inc.
MCP73830/L
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG(Typical) + 1.0V].
Parameters
Sym.
Min.
Typ.
Max.
Units
Die Temperature
TSD
—
150
—
C
Die Temperature
Hysteresis
TSDHYS
—
10
—
C
Conditions
Thermal Shutdown
Note 1:
Not production tested. Ensured by design.
AC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits apply for VDD = [VREG(Typical) + 0.3V] to 6V,
TA = -40°C to +85°C. Typical values are at +25°C, VDD = [VREG(Typical) + 1.0V].
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
tELAPSED
3.5
4.0
4.5
Hours
tPRECHG
0.8
1
1.2
Hours
Status Output Turn-Off
tOFF
—
—
500
µs
ISINK = 1 mA to 0 mA (Note 1)
Status Output Turn-On
tON
—
—
500
µs
ISINK = 0 mA to 1 mA (Note 1)
Elapsed Timer
Elapsed Timer Period
Preconditioning Timer
Preconditioning Timer Period
Status Indicator
Note 1:
Not production tested. Ensured by design.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise indicated, all limits apply for VDD = [VREG(Typical) + 0.3V] to 6V.
Typical values are at +25°C, VDD = [VREG(Typical) + 1.0V].
Parameters
Sym.
Min.
Typ.
Max.
Units
TA
-40
—
+85
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
91
—
°C/W
JC
—
19
—
°C/W
Conditions
Temperature Ranges
Specified Temperature Range
Thermal Package Resistances
Thermal Resistance, TDFN-6 (2x2)
2011-2019 Microchip Technology Inc.
4-Layer JC51-7 Standard
Board, Natural Convection
DS20005049E-page 5
MCP73830/L
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 30 mA and TA= +25°C, Constant Voltage mode.
FIGURE 2-1:
Battery Regulation Voltage
(VBAT) vs. Supply Voltage (VDD).
FIGURE 2-4:
Battery Regulation Voltage
(VBAT) vs. Charge Current (IOUT).
4.30
4.25
VREG (V)
4.20
4.15
4.10
4.05
IOUT = 100 mA
VDD = 5.2V
4.00
-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-2:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
FIGURE 2-5:
Charge Current (IOUT) vs.
Programming Resistor (RPROG), MCP73830L.
4.30
4.25
IDIS (µA)
VREG (V)
4.20
4.15
4.10
4.05
IOUT = 30 mA
VDD = 5.2V
4.00
-45 -35 -25 -15 -5
5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-3:
Battery Regulation Voltage
(VBAT) vs. Ambient Temperature (TA).
DS20005049E-page 6
5.0
4.8
4.6
4.4
4.2
4.0
3.8
3.6
3.4
34
3.2
3.0
VDD = VREG
VBAT = 3.2V
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temp (°C)
FIGURE 2-6:
Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
2011-2019 Microchip Technology Inc.
MCP73830/L
7.0
6.6
6.2
5.8
5.4
5.0
4.6
4.2
3.8
38
3.4
3.0
300
VDD = VREG
VBAT = 4.0V
275
250
IREG (mA)
IDIS (µA)
Note: Unless otherwise indicated, VDD = [VREG(Typical) + 1V], IOUT = 10 mA and TA= +25°C, Constant Voltage mode.
225
200
175
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80
Temp (°C)
VDD = 5.2V
RPROG = 4 k
150
-45 -35 -25 -15 -5
5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-7:
Output Leakage Current
(IDISCHARGE) vs. Ambient Temperature (TA).
FIGURE 2-10:
Charge Current (IOUT) vs.
Ambient Temperature (TA), MCP73830.
FIGURE 2-8:
Output Leakage Current
(IDISCHARGE) vs. Battery Regulation Voltage
(VBAT).
FIGURE 2-11:
Charge Current (IOUT) vs.
Supply Voltage (VDD), MCP73830.
1200
1100
IREG (mA)
1000
900
800
700
VDD = 5.2V
RPROG = 1 k
-45 -35 -25 -15 -5 5 15 25 35 45 55 65 75 85
Temp (°C)
FIGURE 2-9:
Charge Current (IOUT) vs.
Ambient Temperature (TA), MCP73830.
2011-2019 Microchip Technology Inc.
FIGURE 2-12:
Charge Current (IOUT) vs.
Supply Voltage (VDD), MCP73830.
DS20005049E-page 7
MCP73830/L
3.0
PIN DESCRIPTION
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MCP73830/L
TDFN
3.1
Symbol
I/O
Function
1
VSS
—
Battery management 0V reference.
2
STAT
O
Battery charge status output.
3
VBAT
I/O
Charge control output. Regulates the charge current and battery voltage.
The pin is disconnected during Shutdown mode.
4
VDD
I
Input power supply.
5
CE
I
Charge enable pin. Pull the pin high to disable the device; it is internally
pulled down. Leave the pin floating if not used.
6
PROG
I/O
Battery charge current regulation program.
7
EP
—
Exposed pad.
Battery Management 0V Reference
(VSS)
3.5
Charge Enable (CE)
Connect to the negative terminal of the battery and
input supply.
The MCP73830/L devices are always enabled with an
internal pull-down resistor. Pulling the CE pin high will
enter Standby mode.
3.2
3.6
Status Output (STAT)
STAT is an open-drain logic output for connection to an
LED for charge status indication in stand-alone
applications. Alternatively, a pull-up resistor can be
applied for interfacing to a host microcontroller. Refer to
Table 5-1 for a summary of the status output during a
charge cycle.
3.3
Battery Charge Control Output
(VBAT)
Connect to the positive terminal of the battery. Bypass
to VSS with a minimum of 1 µF to ensure loop stability
when the battery is disconnected.
3.4
Current Regulation Set (PROG)
The fast charge current is set by placing a resistor from
PROG to VSS during Constant-Current (CC) mode.
Refer to Section 5.4 “Constant-Current Mode – Fast
Charge” for details.
3.7
Exposed Pad (EP)
The Exposed Thermal Pad (EP) should be connected to
the exposed copper area on the Printed Circuit Board
(PCB) for thermal enhancement purposes. Additional
vias on the copper area under the MCP73830/L devices
can improve the performance of heat dissipation and
simplify the assembly process.
Battery Management Input Supply
(VDD)
A supply voltage of [VREG (Typical) + 0.3V] to 6.0V is
recommended. Bypass to VSS with a minimum of 1 µF.
DS20005049E-page 8
2011-2019 Microchip Technology Inc.
MCP73830/L
4.0
DEVICE OVERVIEW
The MCP73830/L devices are simple, but fully
integrated, linear charge management controllers.
Figure 4-1 depicts the operational flow algorithm.
SHUTDOWN MODE
VDD < (UVLO)
VDD < (VBAT)*
VBAT > 96.5% VREG
STAT = High-Z
STANDBY MODE*
CE = High
STAT = High-Z
PRE-TIMER FAULT
No Charge Current
STAT = Flash (2 Hz)
Preconditioning Timer
Suspended
*Continuously monitored
CE = Low
VBAT > VPTH
CE = Low
VBAT < VPTH
PRECONDITIONING
MODE
Charge Current = IREG
STAT = Low
VBAT VPTH
TIMER FAULT
No Charge Current
STAT = High-Z
Timer Suspended
CONSTANT-CURRENT
MODE
Charge Current = IPREG
STAT = Low
Preconditioning Timer
Suspended
Elapsed Timer Enabled
VBAT = VREG
CONSTANT VOLTAGE
MODE
Charge Voltage = VREG
STAT = Low
IBAT < ITERM
No Auto-Recharge Option
FIGURE 4-1:
CHARGE COMPLETE
MODE
No Charge Current
STAT = High-Z
Timer Reset
VBAT < VRTH
Recharge Mode
(available when selected device
has automatic recharge option)
The MCP73830/L Flowchart.
2011-2019 Microchip Technology Inc.
DS20005049E-page 9
MCP73830/L
5.0
DETAILED DESCRIPTION
5.1
Undervoltage Lockout (UVLO)
An internal Undervoltage Lockout (UVLO) circuit
monitors the input voltage and keeps the charger in
Shutdown mode until the input supply rises above the
UVLO threshold. In the event a battery is present when
the input power is applied, the input supply must rise
approximately 150 mV above the battery voltage
before the MCP73830/L devices become operational.
The UVLO circuit places the device in Shutdown mode
if the input supply falls to approximately +50 mV above
the battery voltage. The UVLO circuit is always active.
If the input supply is below the UVLO threshold, or
approximately 150 mV of the voltage at the VBAT pin,
the MCP73830/L devices are placed in Shutdown
mode.
5.2
Charge Qualification
When the input power is applied, the input supply must
rise 150 mV above the battery voltage before the
MCP73830/L devices become operational.
The automatic power-down circuit places the device in
Shutdown mode if the input supply falls to within
+50 mV of the battery voltage.
The automatic circuit is always active. Any time the
input supply is within +50 mV of the voltage at the
VBAT pin, the MCP73830/L are placed in Shutdown
mode.
For a charge cycle to begin, the automatic
power-down exit conditions must be met (VDD 3.6V
and VDD VBAT + 150mV) and the charge enable input
must be above the input high threshold. The battery
voltage should be less than 96.5% of VREG.
5.2.1
BATTERY MANAGEMENT INPUT
SUPPLY (VDD)
The VDD input is the input supply to the MCP73830/L.
The MCP73830/L devices automatically enter
Power-Down mode if the voltage on the VDD input falls
to within +50 mV of the battery voltage. This feature
prevents draining the battery pack when the VDD
supply is not present.
5.2.2
5.2.3
BATTERY DETECTION
The MCP73830/L devices detect the battery presence
by monitoring the voltage at VBAT. The charge flow will
initiate when the voltage on VBAT is pulled below the
VRECHARGE threshold. Refer to Section 1.0 “Electrical Characteristics” for VRECHARGE values. The value
will be the same for non-automatic recharge devices.
When VBAT > VREG + Hysteresis, the charge will be
suspended or not started, depending on the condition,
to prevent the overcharge that may occur.
5.3
Preconditioning
If the voltage at the VBAT pin is less than the
preconditioning threshold, the MCP73830/L devices
enter Preconditioning mode. The preconditioning
threshold is factory set. Refer to Section 1.0 “Electrical Characteristics” for preconditioning threshold
options.
In this mode, the MCP73830/L devices supply 10% of
the fast charge current (established with the value of
the resistor connected to the PROG pin) to the battery.
When the voltage at the VBAT pin rises above the
preconditioning threshold, the MCP73830/L devices
enter the Constant-Current (Fast Charge) mode.
Note:
5.3.1
The MCP73830/L devices also offer
options with no preconditioning.
TIMER EXPIRED DURING
PRECONDITIONING MODE
If the internal timer expires before the voltage threshold
is reached for Fast Charge mode, a timer Fault is indicated, and the charge cycle terminates. The
MCP73830/L devices remain in this condition until the
battery is removed, the input power is cycled or CE is
toggled. If the battery is removed, the MCP73830/L
devices enter Standby mode, where they remain until a
battery is reinserted.
Note:
The typical preconditioning timers for the
MCP73830/L are 60 minutes.
BATTERY CHARGE CONTROL
OUTPUT (VBAT)
The battery charge control output is the drain terminal
of an internal P-channel MOSFET. The MCP73830/L
devices provide constant current and voltage regulation to the battery pack by controlling this MOSFET in
the linear region. The battery charge control output
should be connected to the positive terminal of the
battery pack.
DS20005049E-page 10
2011-2019 Microchip Technology Inc.
MCP73830/L
5.4
Constant-Current Mode – Fast
Charge
During Constant-Current mode, the programmed
charge current is supplied to the battery or load.
The charge current is established using a single resistor
from PROG to VSS. The program resistor and the charge
current are calculated using the following equation:
EQUATION 5-1:
MCP73830L
5.7
MCP73830/L devices with automatic recharge options
continuously monitor the voltage at the VBAT pin during
the Charge Complete mode. If the voltage drops below
the recharge threshold, another charge cycle begins
and current is once again supplied to the battery or
load. The recharge threshold is factory set. Refer to
Section 1.0 “Electrical Characteristics” for recharge
threshold options.
Note:
200
IREG = -------------------RPROG
RPROG = kilohms (k)
IREG = milliampere (mA)
EQUATION 5-2:
MCP73830
1000
IREG = -------------------RPROG
Where:
RPROG = kilohms (k)
IREG = milliampere (mA)
Constant-Current mode is maintained until the voltage
at the VBAT pin reaches the regulation voltage, VREG.
When Constant-Current mode is invoked, the internal
timer is reset.
5.4.1
TIMER EXPIRED DURING
CONSTANT-CURRENT/FAST
CHARGE MODE
If the internal 4-hour timer expires before the recharge
voltage threshold is reached, a timer Fault is indicated
and the charge cycle terminates. The MCP73830/L
devices remain in this condition until the battery is
reinserted, or the input power or CE is cycled.
5.5
Constant Voltage Mode
When voltage at the VBAT pin reaches the regulation
voltage, VREG, the constant voltage regulation begins.
The regulation voltage is factory set to 4.2V with a
tolerance of ±0.75%.
5.6
Charge Termination
The charge cycle is terminated when, during Constant
Voltage mode, the average charge current diminishes
below a threshold established with the value of 7.5%,
10% of fast charge current or the internal timer has
expired. A 1 ms filter time on the termination comparator ensures that transient load conditions do not
result in premature charge cycle termination. The timer
period is factory set. Refer to Section 1.0 “Electrical
Characteristics” for the timer period value.
2011-2019 Microchip Technology Inc.
The MCP73830/L also offer options with
no automatic recharge.
For the MCP73830/L with no recharge option, the
devices will go into Standby mode when a termination
condition is met. The charge will not restart until the
battery voltage is below the automatic recharge
threshold and one of the following conditions is met:
• Battery is removed from the system and inserted
again.
• VDD is removed and plugged in again.
• CE is cycled.
The automatic recharge voltage threshold is always
active, regardless of whether the automatic recharge
option is selected or not.
5.8
Thermal Regulation
The MCP73830/L should limit the charge currents
based on the die temperature. The thermal regulation
optimizes the charge cycle time while maintaining
device reliability. Figure 5-1 depicts the thermal regulation for the MCP73830/L devices. Refer to
Section 1.0 “Electrical Characteristics” for thermal
package resistances and Section 6.1.1.3 “Thermal
Considerations” for calculating power dissipation.
.
0D[LPXP&KDUJH&XUUHQW
P$
Where:
Automatic Recharge
0LPLPXP
0D[LPXP
0&3
5352* Nȍ
FIGURE 5-1:
-XQFWLRQ7HPSHUDWXUH &
Thermal Regulation.
DS20005049E-page 11
MCP73830/L
5.9
Thermal Shutdown
The MCP73830/L devices suspend charging if the die
temperature exceeds +150°C. Charging will resume
when the die temperature has cooled by approximately +10°C. The thermal shutdown is a secondary
safety feature in the event that there is a failure within
the thermal regulation circuitry.
5.10
Status Indicator
The charge status output of the MCP73830/L is
open-drain, and as such, has two different states: Low
(L) and High-Impedance (High-Z). The charge status
outputs can be used to illuminate the LEDs. Optionally,
the charge status output can be used as an interface
to a host microcontroller. The faulty indication of a preconditioning timer also indicates defective batteries
when it fails to pass the preconditioning threshold
during the given time.
TABLE 5-1:
STATUS OUTPUTS
Charge Cycle State
STAT
Shutdown
High-Z
No Battery Present
High-Z
Preconditioning
L
Constant-Current Fast Charge
L
Constant Voltage
L
Charge Complete
High-Z
Timer Fault
High-Z
Preconditioning Timer Fault
Flashing
(2 Hz)
Table 5-1 summarizes the state of the status outputs
during a charge cycle.
DS20005049E-page 12
2011-2019 Microchip Technology Inc.
MCP73830/L
6.0
APPLICATIONS
the preferred charge algorithm for dual Lithium-Ion or
Lithium-Polymer cell’s constant current, followed by
constant voltage. Figure 6-1 depicts a typical
stand-alone application circuit, while Figure 6-2 depicts
the accompanying charge profile.
The MCP73830/L devices are designed to operate in
conjunction with a host microcontroller or in
stand-alone applications. The MCP73830/L provide
4
VDD
VBAT
3
+
4.7 µF
4.7 µF
Regulated
Wall Cube
2
PROG
STAT
1 k
2 k
5
Lo Hi
VSS
CE
1-Cell
Li-Ion
Battery
6
–
1
MCP73830/L
FIGURE 6-1:
Typical Application Circuit.
6.1.1
7$ &
/L,RQ%DWWHU\ P$K
&KDUJH&XUUHQW $
%DWWHU\9ROWDJH 9
7LPH 0LQXWHV
FIGURE 6-2:
(Li-Ion Battery).
6.1
Typical Charge Profile
Application Circuit Design
Due to the low efficiency of linear charging, the most
important factors are thermal design and cost, which
are a direct function of the input voltage, output current
and thermal impedance between the battery charger
and the ambient cooling air. The worst-case situation is
when the device has transitioned from Preconditioning
mode to Constant-Current mode. In this situation, the
battery charger has to dissipate the maximum power. A
trade-off must be made between the charge current,
cost and thermal requirements of the charger.
2011-2019 Microchip Technology Inc.
COMPONENT SELECTION
Selection of the external components in Figure 6-1 is
crucial to the integrity and reliability of the charging
system. The following discussion is intended as a guide
for the component selection process.
6.1.1.1
Charge Current
The preferred fast charge current for Li-Ion/Li-Poly cells
is below the 1C rate, with an absolute maximum current
at the 2C rate. The recommended fast charge
current should be obtained from the battery manufacturer. For example, a 500 mAh battery pack with
0.7C preferred fast charge current has a charge current
of 350 mA. Charging at this rate provides the shortest
charge cycle times without degradation to the battery
pack performance or life.
Note:
Please consult with your battery supplier,
or refer to the battery data sheet, for the
preferred charge rate.
6.1.1.2
Input Overvoltage Protection (IOVP)
Input overvoltage protection must be used when the
input power source is hot-pluggable; this includes USB
cables and wall-type power supplies. The cabling of
these supplies acts as an inductor. When the supplies
are connected/disconnected from the system, large
voltage transients are created which may damage the
system circuitry. These transients should be snubbed
out. A transzorb, unidirectional or bidirectional, connected from the V+ input supply connector to the 0V
ground reference will snub the transients. An example
of this can be seen in Figure 6-3.
DS20005049E-page 13
MCP73830/L
Cable Resistance
0.5
4
TVS
Regulated
Wall Cube
VDD
VBAT
3
CIN
2
SMAJ5.0A/AC
5
PROG
STAT
VSS
CE
6
1
2 mm x 2 mm DFN
MCP73830/L
FIGURE 6-3:
6.1.1.3
Input Overvoltage Protection Example.
Thermal Considerations
The worst-case power dissipation in the battery charger
occurs when the input voltage is at the maximum and the
device has transitioned from Preconditioning mode to
Constant-Current mode. In this case, the power
dissipation is:
EQUATION 6-1:
The actual junction temperature is described in
equation 6-3:
EQUATION 6-3:
T J = T A + 10.45 C + 0.55W HA
Where:
TJ = Junction Temperature
PowerDissipation = V DDMAX – V PTHMIN I REGMAX
Where:
VDDMAX = The maximum input voltage
IREGMAX = The maximum fast charge current
VPTHMIN = The minimum transition threshold
voltage
Power dissipation with a 5V, ±10% input voltage
source, 200 mA, ±10%, and preconditioning threshold
voltage at 3.0V is:
EQUATION 6-2:
PowerDissipation = (5.5V – 3.0V) 220 mA = 0.55W
This power dissipation with the battery charger in the
2x2 TDFN-6 package will result in a temperature of
approximately +10.45C (PCB mounted, infinite heat
sink) above room temperature.
In the worst case (minimum PCB copper, natural
convection), the temperature will increase by +50.1°C
above the room temperature.
DS20005049E-page 14
TA = Ambient Temperature
+10.45C = Temperature Increase due to JC
HA = Heat Sink to Ambient Thermal
Resistance
The MCP73830/L devices are stable with or without a
battery load. In order to maintain good AC stability in
Constant Voltage mode, a minimum capacitance of
1 µF is recommended to bypass the VBAT pin to VSS.
This capacitance provides compensation when there is
no battery load. In addition, the battery and interconnections appear inductive at high frequencies. These
elements are in the control feedback loop during
Constant Voltage mode. Therefore, the bypass capacitance may be necessary to compensate for the
inductive nature of the battery pack.
A minimum of 16V rated 1 µF is recommended to apply
for the output capacitor and a minimum of 25V rated
1 µF is recommended to apply for the input capacitor
for typical applications.
TABLE 6-1:
MLCC CAPACITOR EXAMPLE
MLCC
Capacitors
Temperature
Range
Tolerance
X7R
-55C to +125C
±15%
X5R
-55C to +85C
±15%
2011-2019 Microchip Technology Inc.
MCP73830/L
Virtually any good quality output filter capacitor can be
used independent of the capacitor’s minimum Effective
Series Resistance (ESR) value. The actual value of the
capacitor (and its associated ESR) depends on the
output load current. A 1 µF ceramic, tantalum or aluminum electrolytic capacitor at the output is usually
sufficient to ensure stability.
6.1.1.4
Reverse-Blocking Protection
The MCP73830/L devices provide protection from a
faulted or shorted input. Without the protection, a
faulted or shorted input would discharge the battery
pack through the body diode of the internal pass
transistor.
6.2
PCB Layout Issues
For optimum voltage regulation, place the battery pack
as close as possible to the device’s VBAT and VSS pins,
which is recommended to minimize voltage drops
along the high current carrying PCB traces.
FIGURE 6-5:
Typical Layout (Top Metal).
FIGURE 6-6:
Typical Layout (Bottom).
If the PCB layout is used as a heat sink, adding many
vias in the heat sink pad can help conduct more heat to
the backplane of the PCB, thus reducing the maximum
junction temperature. Figure 6-5 and Figure 6-6 depict
a typical layout with PCB heat sinking.
FIGURE 6-4:
Typical Layout (Top).
2011-2019 Microchip Technology Inc.
DS20005049E-page 15
MCP73830/L
7.0
PACKAGING INFORMATION
7.1
Package Marking Information
6-Lead TDFN (2x2 mm)
Example
Part Number
XXX
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005049E-page 16
Code
MCP73830T-2AAI/MYY
2AA
MCP73830LT-0AAI/MYY
0AA
MCP73830LT-0BCI/MYY
0BC
0AA
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2011-2019 Microchip Technology Inc.
MCP73830/L
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2011-2019 Microchip Technology Inc.
DS20005049E-page 17
MCP73830/L
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005049E-page 18
2011-2019 Microchip Technology Inc.
MCP73830/L
APPENDIX A:
REVISION HISTORY
Revision E (August 2019)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
Updated Section 1.0, "Electrical
Characteristics".
Updated Section 5.0, "Detailed Description".
Added label to Figure 5-1.
Corrected charge current unit in Figure 6-2.
Added clarifying information to Figure 6-3.
Changed temperature value in power
dissipation with the battery charger in the
2x2 TDFN-6 package.
Updated the “Product Identification System”
page with information regarding additional
factory options.
Revision D (July 2014)
The following is the list of modifications:
1.
2.
3.
4.
5.
6.
7.
Added the “Available Factory Preset
Options” table.
Removed any mention of Fixed Elapse Timer
having a disabled option.
Removed any mention of an option with no
precondition timer.
Corrected the flow-chart in Figure 4-1,
specifying STAT = High Z in the Charge
Complete Mode text box.
Updated Table 5-1.lab
Added the Section 6.1.1.2, "Input Overvoltage
Protection (IOVP)".
Added Figure 6-3.
Revision C (August 2013)
The following is the list of modifications:
1.
2.
Updated the “Temperature Specifications”
table.
Updated Section 6.1.1.3, "Thermal Considerations".
Revision B (December 2011)
The following is the list of modifications:
1.
2.
Updated Figure 4-1.
Removed the MCP73830 and MCP73830L
options from the “Product Identification
System” section.
Revision A (September 2011)
• Original release of this document.
2011-2019 Microchip Technology Inc.
DS20005049E-page 19
MCP73830/L
NOTES:
DS20005049E-page 21
2011-2019 Microchip Technology Inc.
MCP73830/L
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
Examples:
XX
Standard Temperature
Range
Options
Package
MCP73830T:
Single-Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
MCP73830/LT: Single-Cell Li-Ion/Li-Polymer Battery Device,
Tape and Reel
Standard
Options:
IREG
(mA)
VREG
(V)
VPRECONDITION
(%)
Device:
X
IPRECONDITION
(%)
Device
-XXX
ITERM
(%)
RTH
(%)
MCP73830LT
0AA
200
4.2
10
71.5
7.5
96.5
MCP73830LT
0BC
200
4.2
100
71.5
10
96.5
MCP73830T
2AA
1000
4.2
10
71.5
7.5
96.5
Temperature
Range:
I
Package:
MY = Plastic Thin Dual Flat, No Lead Package, 2x2x0.8 mm Body
(TDFN), 6-Lead
a) MCP73830T-2AAI/MYY: Tape and Reel,
Single-Cell
Li-Ion/Li-Polymer Battery
Device
b) MCP73830T-0AAI/MYY: Tape and Reel,
Single-Cell
Li-Ion/Li-Polymer
Battery Device
c) MCP73830LT-0BCI/MYY: Tape and Reel,
Single-Cell
Li-Ion/Li-Polymer Battery
Device
= -40C to +85C (Industrial)
*Y = Nickel gold manufacturing designator. Only available on the
TDFN package.
Contact sales for additional factory options.
2011-2019 Microchip Technology Inc.
DS20005049E-page 21
MCP73830/L
NOTES:
DS20005049E-page 20
2011-2019 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
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are registered trademarks of Microchip Technology Incorporated in
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ZENA are trademarks of Microchip Technology Incorporated in the
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SQTP is a service mark of Microchip Technology Incorporated in
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The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
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All other trademarks mentioned herein are property of their
respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2011-2019 Microchip Technology Inc.
ISBN: 978-1-5224-4961-4
DS20005049E-page 23
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DS20005049E-page 24
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