MIC2025/2075
Single-Channel Power Distribution Switch
Features
General Description
•
•
•
•
•
The MIC2025 and MIC2075 are high-side MOSFET
switches optimized for general-purpose power
distribution requiring circuit protection.
•
•
•
•
•
•
•
•
140 mΩ Maximum On-Resistance
2.7V to 5.5V Operating Range
500 mA Minimum Continuous Output Current
Short-Circuit Protection with Thermal Shutdown
Fault Status Flag with 3 ms Filter Eliminates False
Assertions
Undervoltage Lockout
Reverse Current Flow Blocking (No “Body Diode”)
Circuit Breaker Mode (MIC2075) Reduces Power
Consumption
Logic-Compatible Input
Soft-Start Circuit
Low Quiescent Current
Pin Compatible with MIC2525
UL File #E179633
Applications
•
•
•
•
•
•
USB Peripherals
General Purpose Power Switching
ACPI Power Distribution
Notebook PCs
PDAs
PC Card Hot Swap
The MIC2025/75 are internally current limited and have
thermal shutdown that protects the device and load.
The MIC2075 offers “smart” thermal shutdown that
reduces current consumption in fault modes. When a
thermal shutdown fault occurs, the output is latched off
until the faulty load is removed. Removing the load or
toggling the enable input will reset the device output.
Both devices employ soft-start circuitry that minimizes
inrush current in applications where highly capacitive
loads are employed. A fault status output flag is
provided that is asserted during overcurrent and
thermal shutdown conditions.
The MIC2025/75 are available in the 8-Pin MSOP and
8-Pin SOIC packages.
Package Type
MIC2025/2075
8-Pin SOIC (YM)
8-Pin MSOP(YMM)
MIC2025/75
2018 Microchip Technology Inc.
EN
1
8
OUT
FLG
2
7
IN
GND
3
6
OUT
NC
4
5
NC
DS20006030A-page 1
MIC2025/2075
Functional Block Diagram
EN
THERMAL
SHUTDOWN
OSC.
1.2V
REFERENCE
UVLO
CHARGE
PUMP
IN
CURRENT
LIMIT
GATE
CONTROL
FLAG
RESPONSE
DELAY
OUT
FLG
GND
Typical Application Circuit
VCC
2.7V to 5.5V
10k
Logic Controller
VIN
1μF
ON/OFF
OVERCURRENT
GND
MIC2025/75
EN
OUT
FLG
IN
GND
OUT
NC
Load
NC
0.1μF
DS20006030A-page 2
2018 Microchip Technology Inc.
MIC2025/2075
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN) .................................................................................................................................... –0.3V to +6V
Fault Flag Voltage (VFLG)............................................................................................................................................+6V
Fault Flag Current (IFLG) .........................................................................................................................................25 mA
Output Voltage (VOUT) ................................................................................................................................................+6V
Output Current (IOUT)............................................................................................................................. Internally Limited
Enable Input (IEN) ................................................................................................................................. –0.3V to VIN + 3V
ESD Rating .......................................................................................................................................................... (Note 1)
Operating Ratings ‡
Supply Voltage (VIN) ................................................................................................................................. +2.7V to +5.5V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended.
TABLE 1-1:
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = +5V; TA = +25°C, Bold values indicate –40°C ≤ TA ≤ +85°C; unless otherwise
specified.
Parameter
Supply Current
Symbol
Min.
Typ.
Max.
Units
—
0.75
5
µA
MIC20x5-1, VEN ≤ 0.8V (switch off),
OUT = open
—
0.75
5
µA
MIC20x5-2, VEN ≥ 2.4V (switch off),
OUT = open
—
—
160
µA
MIC20x5-1, VEN ≥ 2.4V (switch on),
OUT = open
—
—
160
µA
MIC20x5-2, VEN ≤ 0.8V (switch on),
OUT = open
IDD
Conditions
—
2.1
2.4
V
Low-to-High Transition
VEN
0.8
1.9
—
V
High-to-Low Transition
—
200
—
mV
—
Enable Input Current
IEN
–1
0.01
1
µA
VEN = 0V to 5.5V
Control Input Capacitance
—
—
1
—
pF
—
—
90
140
mΩ
VIN = 5V, IOUT = 500 mA
Enable Input Voltage
Enable Input Hysteresis
Switch Resistance
RDS(ON)
—
100
160
mΩ
VIN = 3.3V, IOUT = 500 mA
Output Leakage Current
—
—
—
10
µA
MIC2025/2075 (output off)
OFF Current in Latched
Thermal Shutdown
—
—
50
—
µA
MIC2075
(during thermal shutdown state)
Output Turn-On Delay
tON
1
2.5
6
ms
RL = 10Ω, CL = 1 µF, (see Timing
Diagrams)
tR
0.5
2.3
5.9
ms
RL = 10Ω, CL = 1 µF, (see Timing
Diagrams)
tOFF
—
50
100
µs
RL = 10Ω, CL = 1 µF, (see Timing
Diagrams)
Output Turn-On Rise Time
Output Turn-Off Delay
2018 Microchip Technology Inc.
DS20006030A-page 3
MIC2025/2075
Electrical Characteristics: VIN = +5V; TA = +25°C, Bold values indicate –40°C ≤ TA ≤ +85°C; unless otherwise
specified.
Parameter
Symbol
Min.
Typ.
Max.
Units
tF
—
50
100
µs
RL = 10Ω, CL = 1 µF, (see Timing
Diagrams)
Short-Circuit Output Current
ILIMIT
0.5
0.7
1.25
A
VOUT = 0V, enabled into
short-circuit
Current-Limit Threshold (See
Figure 2-22)
—
0.60
0.85
1.25
A
Ramped load applied to output
Short-Circuit Response Time
—
—
24
—
µs
VOUT = 0V to IOUT = ILIMIT
(short applied to output)
1.5
3
7
ms
VIN = 5V, apply VOUT = 0V until
FLG low
1.5
3
8
ms
VIN = 3.3V, apply VOUT = 0V until
FLG low
2.2
2.5
2.7
V
2.0
2.3
2.5
V
VIN Falling
—
8
25
Ω
IL = 10 mA, VIN = 5V
—
11
40
Ω
IL = 10 mA, VIN = 3.3V
—
—
10
µA
VFLAG = 5V
Output Turn-Off Fall Time
Overcurrent Flag Response
Delay
Undervoltage Lockout
Threshold
Error Flag Output Resistance
Error Flag Off Current
Overtemperature Threshold
DS20006030A-page 4
tD
Conditions
VIN Rising
—
140
—
°C
TJ increasing
—
120
—
°C
TJ decreasing
2018 Microchip Technology Inc.
MIC2025/2075
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Storage Temperature Range
TS
–65
—
+150
°C
—
Ambient Temperature Range
TA
–40
—
+85
°C
—
Junction Temperature Range
TJ
—
—
—
°C
Internally Limited
Thermal Resistance SOIC 8-LD
JA
—
160
—
°C/W
—
Thermal Resistance MSOP 8-LD
JA
—
206
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA).
Test Circuit
VOUT
Device
Under OUT
Test
IOUT
RL
FIGURE 1-1:
CL
MIC2025/2075 Test Circuit.
2018 Microchip Technology Inc.
DS20006030A-page 5
MIC2025/2075
Timing Diagrams
tR
tF
90%
90%
VOUT
10%
FIGURE 1-2:
10%
Output Rise and Fall Times.
VEN
50%
tOFF
tON
90%
VOUT
10%
FIGURE 1-3:
Active-Low Switch Delay Time (MIC20x5-2).
VEN
50%
tOFF
tON
VOUT
90%
10%
FIGURE 1-4:
DS20006030A-page 6
Active-High Switch Delay Times (MIC20x5-1).
2018 Microchip Technology Inc.
MIC2025/2075
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
180
200
160
120
5V
CURRENT (PA)
CURRENT (PA)
140
100
80
60
3.3V
40
150
-40qC
100
50
+25qC
+85qC
20
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
FIGURE 2-1:
Temperature.
Supply On-Current vs.
0
2.5
FIGURE 2-4:
Voltage.
5.5
Supply On-Current vs. Input
200
160
140
120
3.3V
100
5V
80
60
40
IOUT = 500mA
RESISTANCE (m:)
ON-RESISTANCE (m:)
3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
+85qC
100
+25qC
50
-40qC
IOUT = 500mA
20
0
2.5
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
FIGURE 2-2:
Temperature.
On-Resistance vs.
VIN = 3.3V
VIN = 5V
RL=10:
CL=1PF
1
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
FIGURE 2-3:
Temperature.
On-Resistance vs. Input
4.0
3
2
5.5
5.0
Turn-On rise Time vs.
2018 Microchip Technology Inc.
RISE TIME (ms)
4
3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
FIGURE 2-5:
Voltage.
5
RISE TIME (ms)
150
+85qC
3.0
+25qC
-40qC
2.0
1.0
0
2.5
FIGURE 2-6:
Voltage.
RL=10:
CL=1PF
3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
5.5
Turn-On Rise Time vs. Input
DS20006030A-page 7
MIC2025/2075
800
1000
+25qC
800
CURRENT LIMIT (mA)
CURRENT LIMIT (mA)
700
VIN = 3.3V
600
400
VIN = 5V
200
600
+85qC
500
-40qC
400
300
200
100
0
2.5
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
Short-Circuit Current-Limit
1200
1000
VIN = 3.3V
800
600
VIN = 5V
400
200
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
FIGURE 2-8:
Temperature.
Current-Limit Threshold vs.
FIGURE 2-10:
vs. Input Voltage.
CURRENT LIMIT THRESHOLD (mA)
CURRENT LIMIT THRESHOLD (mA)
FIGURE 2-7:
vs. Temperature.
FIGURE 2-11:
Input Voltage.
VEN RISING
1.5
VEN FALLING
1.0
0.5
VIN = 5V
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
Enable Threshold vs.
ENABLE THRESHOLD (V)
ENABLE THRESHOLD (V)
5.5
Current-Limit Threshold vs.
2.5
2.0
DS20006030A-page 8
5.5
Short-Circuit Current-Limit
1200
1100
1000
900
800
700
600 +85qC
+25qC
-40qC
500
400
300
200
100
0
2.5 3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
2.5
FIGURE 2-9:
Temperature.
3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
2.0
VEN RISING
1.5
1.0
VEN FALLING
0.5
TA = 25qC
0
2.5
FIGURE 2-12:
Voltage.
3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
5.5
Enable Threshold vs. Input
2018 Microchip Technology Inc.
MIC2025/2075
VIN = 3.3V
VIN
VFLG
(1V/div.) (1V/div.)
4
VIN = 5V
2
VOUT
(2V/div.)
3
1
IOUT
(100mA/div.)
DELAY TIME (ms)
5
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
FIGURE 2-13:
Flag Delay vs. Temperature.
2.5V
VEN = VIN
VIN = 5V
CL = 57μF
RL = 35
TIME (10ms/div.)
FIGURE 2-16:
(MIC2025-1).
UVLO VIN Rising
3
VIN
VFLG
(2V/div.) (2V/div.)
4
+85qC
+25qC
2
-40qC
1
0
2.5
FIGURE 2-14:
Voltage.
2.3V
VOUT
IOUT
(100mA/div.) (2V/div.)
DELAY TIME (ms)
5
3.0 3.5 4.0 4.5 5.0
INPUT VOLTAGE (V)
VEN = VIN
VIN = 5V
CL = 57μF
RL = 35
5.5
Flag Delay vs. Input
TIME (25ms/div.)
FIGURE 2-17:
(MIC2025-1).
UVLO VIN Falling
2.0
VIN FALLING
1.5
1.0
IOUT
(200mA/div.)
UVLO THRESHOLD (V)
VIN RISING
2.5
VEN
VOUT
VFLG
(5V/div.) (5V/div.) (10V/div.)
3.0
0.5
0
-40 -20 0 20 40 60 80 100
TEMPERATURE (qC)
FIGURE 2-15:
Temperature.
UVLO Threshold vs.
2018 Microchip Technology Inc.
640mA
VIN = 5V
CL = 147μF
RL = 35
144mA
TIME (1ms/div.)
FIGURE 2-18:
(MIC2025-1).
Turn-On Response
DS20006030A-page 9
VIN
VFLG
(5V/div.) (10V/div.)
VIN = 5V
CL = 47μF
Short Removed
VOUT
(5V/div.)
VIN = 5V
CL = 147μF
RL = 35
144mA
IOUT
(500mA/div.)
IOUT
(200mA/div.)
VEN
VOUT
VFLG
(5V/div.) (5V/div.) (10V/div.)
MIC2025/2075
Short-Circuit
Current (650mA)
Current-Limit
Threshold
(780mA)
Thermal
Shutdown
TIME (2.5ms/div.)
FIGURE 2-19:
(MIC2025-1).
TIME (100ms/div.)
Turn-Off Response
FIGURE 2-22:
Current-Limit Response
(Ramped Load Into Short MIC2025-1).
Load
VIN = 5V
RL = 35
CL = 310μF
CL = 210μF
VOUT
(5V/div.)
VFLG
(5V/div.)
VEN
VFLG
(5V/div.) (10V/div.)
No
Load
VIN = 5V
CL = 47μF
IOUT
(5A/div.)
IOUT
(200mA/div.)
CL = 110μF
CL = 10μF
640mA
Short-Circuit Current
TIME (500ms/div.)
TIME (1ms/div.)
VEN
VFLG
(5V/div.) (10V/div.)
FIGURE 2-20:
(MIC2025-1).
In-Rush Current Response
FIGURE 2-23:
Current-Limit Transient
Response (Enable Into Short MIC2025-1).
No
Load
Load
3.1ms (tD)
VIN = 5V
CL = 47μF
TIME (1ms/div.)
FIGURE 2-21:
(MIC2025-1).
DS20006030A-page 10
Enable Into Short
VOUT
(5V/div.)
640mA
Short-Circuit
Current
IOUT
(5A/div.)
VOUT
IOUT
(500mA/div.) (2V/div.)
VIN = 5V
24μs
640mA
Short-Circuit Current
TIME (10ms/div.)
FIGURE 2-24:
Current-Limit Transient
Response (MIC2025-1).
2018 Microchip Technology Inc.
VOUT
(5V/div.)
VEN
VFLG
(5V/div.) (10V/div.)
MIC2025/2075
Output
Latched Off
IOUT
(500mA/div.)
Ramped Load to a Short
Output is Reset
(Load Removed)
Thermal
Shutdown
VIN = 5V
TIME (100ms/div.)
VIN = 5V
Enable Reset
Output Reset
IOUT
(500mA/div.)
VOUT
(5V/div.)
VEN
VFLG
(5V/div.) (10V/div.)
FIGURE 2-25:
Thermal Shutdown
Response (Output Reset By Removing Load
MIC2075-1).
Ramped Load to a Short
RL = 35
Thermal
Shutdown
RL = 35
TIME (100ms/div.)
FIGURE 2-26:
Thermal Shutdown
Response (Output Reset By Toggling Enable
MIC2075-1).
2018 Microchip Technology Inc.
DS20006030A-page 11
MIC2025/2075
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin
Name
1
EN
Switch Enable (Input): Active-high (-1) or Active-low (-2).
2
FLG
Fault Flag (Output): Active-low, open-drain output. Indicates overcurrent or
thermal shutdown conditions. Overcurrent condition must exceed tD in order
to assert FLG.
3
GND
4
NC
5
NC
6, 8
OUT
7
IN
DS20006030A-page 12
Description
Ground.
Not internally connected.
Not internally connected.
Supply (Output): Pins must be connected together.
Supply voltage (Input).
2018 Microchip Technology Inc.
MIC2025/2075
4.0
FUNCTIONAL DESCRIPTION
4.1
Input and Output
IN is the power supply connection to the logic circuitry
and the drain of the output MOSFET. OUT is the source
of the output MOSFET. In a typical circuit, current flows
from IN to OUT toward the load. If VOUT is greater than
VIN, current will flow from OUT to IN, since the switch is
bidirectional when enabled. The output MOSFET and
driver circuitry are also designed to allow the MOSFET
source to be externally forced to a higher voltage than
the drain (VOUT > VIN) when the switch is disabled. In
this situation, the MIC2025/75 prevents undesirable
current flow from OUT to IN.
4.2
Thermal Shutdown
Thermal shutdown is employed to protect the device
from damage should the die temperature exceed safe
margins due mainly to short circuit faults. Thermal
shutdown shuts off the output MOSFET and asserts the
FLG output if the die temperature reaches 140°C. The
MIC2025 will automatically reset its output should the
die temperature cool down to 120°C. The MIC2025
output and FLG signal will continue to cycle on and off
until the device is disabled or the fault is removed.
Figure 4-2 depicts typical timing. If the MIC2075 goes
into thermal shutdown, its output will latch off and a
pull-up current source is activated. This allows the
output latch to automatically reset when the load (such
as a USB device) is removed. The output can also be
reset by toggling EN. Refer to Figure 4-1 for details.
Depending on PCB layout, package, ambient
temperature, etc., it may take several hundred
milliseconds from the incidence of the fault to the
output MOSFET being shut off. The worst-case
scenario of thermal shutdown is that of a short-circuit
fault and is shown in Figure 2-25 and Figure 2-26.
Load Removed
(Output Reset)
VE N
Short-Circuit Faul
t
VOUT
ID C
Load/Fault
Removed
VOUT
ILIMIT
IDC
IOUT
Thermal Shutdown
Reached
VF L G
tD
FIGURE 4-2:
4.3
MIC2025-2 Timing.
Power Dissipation
The device’s junction temperature depends on several
factors such as the load, PCB layout, ambient
temperature, and package type. Equations that can be
used to calculate power dissipation and junction
temperature are found in Equation 4-1 and
Equation 4-2.
EQUATION 4-1:
P D = R DS on I OUT2
EQUATION 4-2:
T J = P D JA + T A
Where:
TJ =
Junction Temperature
TA =
Ambient Temperature
JA =
The Thermal Resistance of the
Package
ILIMIT
IOUT
Short-Circuit Faul
t
VE N
Thermal Shutdown
Reached
VF L G
tD
FIGURE 4-1:
MIC2075-2 Timing: Output
Reset by Removing Load.
4.4
Current Sensing and Limiting
The current-limit threshold is preset internally. The
preset level prevents damage to the device and
external load but still allows a minimum current of
500 mA to be delivered to the load.
The current-limit circuit senses a portion of the output
MOSFET switch current. The current-sense resistor
shown in the Functional Block Diagram is virtual and
has no voltage drop. The reaction to an overcurrent
condition varies with three scenarios:
2018 Microchip Technology Inc.
DS20006030A-page 13
MIC2025/2075
4.4.1
SWITCH ENABLED INTO
SHORT-CIRCUIT
If a switch is enabled into a heavy load or short-circuit,
the switch immediately enters into a constant-current
mode, reducing the output voltage. The FLG signal is
asserted indicating an overcurrent condition. See
Figure 2-21.
4.4.2
SHORT-CIRCUIT APPLIED TO
ENABLED OUTPUT
When a heavy load or short-circuit is applied to an
enabled switch, a large transient current may flow until
the current-limit circuitry responds. Once this occurs,
the device limits current to less than the short-circuit
current limit specification. See Figure 2-23.
4.4.3
CURRENT-LIMIT RESPONSE RAMPED LOAD
The MIC2025/75 current-limit profile exhibits a small
foldback effect of about 200 mA. Once this current-limit
threshold is exceeded the device switches into a
constant current mode. It is important to note that the
device will supply current until the current-limit
threshold is exceeded. See Figure 2-22.
DS20006030A-page 14
4.5
Fault Flag
The FLG signal is an N-channel open-drain MOSFET
output. FLG is asserted (active-low) when either an
overcurrent or thermal shutdown condition occurs. In
the case of an overcurrent condition, FLG will be
asserted only after the flag response delay time, tD, has
elapsed. This ensures that FLG is asserted only upon
valid overcurrent conditions and that erroneous error
reporting is eliminated. For example, false overcurrent
conditions can occur during hot plug events when a
highly capacitive load is connected and causes a high
transient inrush current that exceeds the current-limit
threshold. The FLG response delay time tD is typically
3 ms.
4.6
Undervoltage Lockout
Undervoltage lockout (UVLO) prevents the output
MOSFET from turning on until VIN exceeds
approximately 2.5V. Undervoltage detection functions
only when the switch is enabled.
2018 Microchip Technology Inc.
MIC2025/2075
5.0
APPLICATION INFORMATION
5.1
Supply Filtering
A 0.1 µF to 1 µF bypass capacitor positioned close to
VIN and GND of the device is strongly recommended
to control supply transients. Without a bypass
capacitor, an output short may cause sufficient ringing
on the input (from supply lead inductance) to damage
internal control circuitry.
5.2
Printed Circuit Board Hot-Plug
VBUS, soft-start is necessary. Although the hub can
consume up to 500 mA from the upstream bus, the hub
must consume only 100 mA max at start-up, until it
enumerates with the host prior to requesting more
power. The same requirements apply for bus-powered
peripherals that have no downstream ports.
Equation 5-4 shows a bus-powered hub.
MIC2025-2
1
VC C
2
The MIC2025/75 are ideal inrush current-limiters for
hot plug applications. Due to their integrated charge
pumps, the MIC2025/75 present a high impedance
when off and slowly become a low impedance as their
integrated charge pumps turn on. This soft-start feature
effectively isolates power supplies from highly
capacitive loads by reducing inrush current.
Equation 5-1 shows how the MIC2075 may be used in
a card hot-plug application.
In cases of extremely large capacitive loads (>400 µF),
the length of the transient due to inrush current may
exceed the delay provided by the integrated filter. Since
this inrush current exceeds the current-limit delay
specification, FLG will be asserted during this time. To
prevent the logic controller from responding to FLG
being asserted, an external RC filter, as shown in
Equation 5-2, can be used to filter out transient FLG
assertion. The value of the RC time constant should be
selected to match the length of the transient, less
tD(min) of the MIC2025/75.
5.3
to "Hot"
Receptacle
0.1
μF
3
4
EN
OUT
FLG
IN
GND
OUT
NC
NC
8
7
Backend
Function
6
5
CB U L K
GND
Adaptor Card
FIGURE 5-1:
Hot-Plug Application.
V+
Logic Controller
MIC2025
10k
1
OVERCURRENT
R
C
2
3
4
FIGURE 5-2:
EN
OUT
FLG
IN
GND
OUT
NC
NC
8
7
6
5
Transient Filter.
Universal Serial Bus (USB) Power
Distribution
The MIC2025/75 are ideally suited for USB (Universal
Serial Bus) power distribution applications. The USB
specification defines power distribution for USB host
systems such as PCs and USB hubs. Hubs can either
be self-powered or bus-powered (that is, powered from
the bus). Equation 5-3 shows a typical USB Host
application that may be suited for mobile PC
applications employing USB. The requirement for USB
host systems is that the port must supply a minimum of
500 mA at an output voltage of 5V ±5%. In addition, the
output power delivered must be limited to below 25 VA.
Upon an overcurrent condition, the host must also be
notified. To support hot-plug events, the hub must have
a minimum of 120 µF of bulk capacitance, preferably
low ESR electrolytic or tantalum. Please refer to
Application Note 17 for more details on designing
compliant USB hub and host systems.
For bus-powered hubs, USB requires that each
downstream port be switched on or off under control by
the host. Up to four downstream ports each capable of
supplying 100 mA at 4.4V minimum are allowed. In
addition, to reduce voltage droop on the upstream
2018 Microchip Technology Inc.
DS20006030A-page 15
MIC2025/2075
VC C
5.0V
4.50V to 5.25V
Upstream VB U S
100mA max.
VB U S
10k
3.3V
MIC5203-3.3
IN
D+
1μF
D–
3.3V USB Controller
VIN
OUT
1μF
GND
Ferrite
Beads
MIC2025/75
ON/OFF
EN
OVERCURRENT
GND
GND
FLG
IN
GND
OUT
NC
VB U S
OUT
D+
0.01μF
120μF
D–
USB
Port
GND
NC
0.1μF
Data
Data
FIGURE 5-3:
USB Host Application.
1.5k
3.3V
USB Upstream
Connector
MIC5203-3.3
(LDO)
VB U S
IN
D+
D–
OUT
USB Logic Controller
VIN
GND
GND
ON/OFF
OVERCURRENT
GND
0.1μF
0.1μF
1.5K
DS20006030A-page 16
EN
IN
GND
OUT
NC
VB U S
OUT
FLG
D+
120μF
0.01μF
D–
GND
NC
USB Downstream
Connector
(Up to four
ganaged ports)
0.1μF
Data
Data
FIGURE 5-4:
Ferrite
Beads
MIC2025/75
USB Bus-Powered Hub.
2018 Microchip Technology Inc.
MIC2025/2075
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
8-Lead SOIC*
XXXX
-XXX
WNNN
8-Lead MSOP*
XXXX
-XXXX
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
2025
-2YM
3031
Example
2025
-1YMM
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2018 Microchip Technology Inc.
DS20006030A-page 17
MIC2025/2075
8-Lead SOIC-8 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006030A-page 18
2018 Microchip Technology Inc.
MIC2025/2075
8-Lead MSOP-8 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 Microchip Technology Inc.
DS20006030A-page 19
MIC2025/2075
DS20006030A-page 20
2018 Microchip Technology Inc.
MIC2025/2075
APPENDIX A:
REVISION HISTORY
Revision A (June 2018)
• Converted Micrel document MIC2025/2075 to
Microchip data sheet DS20006030A.
• Minor text changes throughout.
2018 Microchip Technology Inc.
DS20006030A-page 21
MIC2025/2075
NOTES:
DS20006030A-page 22
2018 Microchip Technology Inc.
MIC2025/2075
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
–X
X
Control/
Enable
XX
–XX
Package Media Type
Junction
Temperature
Range
Examples:
a) MIC2025-1YM:
Single Channel Power Distribution
Switch, Active-High Control
Enable, –40°C to +85°C Temp.
Range, 8-Lead SOIC Package,
95/Tube
Device:
MIC2025: Single Channel Power Distribution Switch
MIC2075: Single Channel Power Distribution Switch
with Circuit Breaker Mode
b) MIC2025-2YMM:
Single Channel Power Distribution
Switch, Active-Low Control Enable,
–40°C to +85°C Temp. Range,
8-Lead MSOP Package, 100/Tube
Control/Enable:
1
2
=
=
Active-High
Active-Low
c) MIC2025-1YM-TR:
Junction
Temperature Range:
Y
=
–40°C to +85°C (RoHs Compliant, PbFree, Halogen Free)
Single Channel Power Distribution
Switch, Active-High Control
Enable, –40°C to +85°C Temp.
Range, 8-Lead SOIC Package,
2,500/Reel
d) MIC2025-2YMM-TR:
Package:
M
=
MM =
8-Lead SOIC
8-Lead MSOP
Single Channel Power Distribution
Switch, Active-Low Control Enable,
–40°C to +85°C Temp. Range,
8-Lead MSOP Package, 2,500/
Reel
Media Type:
Blank =
Blank =
TR =
95/Tube
100/Tube
2,500/Reel
e) MIC2075-1YM
Single Channel Power Distribution
Switch with Circuit Breaker Mode,
Active-High Control Enable, –40°C
to +85°C Temp. Range, 8-Lead
SOIC Package, 95/Tube
f) MIC2075-1YM-TR:
Single Channel Power Distribution
Switch with Circuit Breaker Mode,
Active-High Control Enable, –40°C
to +85°C Temp. Range, 8-Lead
SOIC Package, 2,500/Reel
g) MIC2075-2YMM-TR:
Single Channel Power Distribution
Switch with Circuit Breaker Mode,
Active-Low Control Enable, –40°C
to +85°C Temp. Range,8-Lead
MSOP Package, 2,500/Reel
Note 1:
2018 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006030A-page 23
MIC2025/2075
DS20006030A-page 24
2018 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BeaconThings, BitCloud, CryptoMemory,
CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KEELOQ,
KEELOQ logo, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, RightTouch, SAM-BA, SpyNIC, SST, SST
Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, Mindi, MiWi, motorBench, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PureSilicon, QMatrix, RightTouch logo, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip Technology
Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3276-0
== ISO/TS 16949 ==
2018 Microchip Technology Inc.
DS20006030A-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
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Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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DS20006030A-page 26
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2018 Microchip Technology Inc.
10/25/17
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