MIC2033
High-Accuracy, High-Side, Fixed Current-Limit Power Switch
Features
General Description
• ±5% Current-Limit Accuracy
• Input Supply Range from 2.5V to 5.5V
• Low Quiescent Current: 100 µA Typical (Switch
ON)
• 75 mΩ Typical RDS(ON) at 5V
• Current-Limit Options: 0.5A, 0.8A, 1A, and 1.2A
• Soft-Start Control via an External Capacitor
• Undervoltage Lockout (UVLO)
• Fast Response Time (10 µs) to Short-Circuit
Loads
• Fault Status Output Flag
• Logic Controlled Enable (Active-High, Active-Low)
• Thermal Shutdown
• Pin Compatible with MIC2005
• 6-Pin 2 mm x 2 mm Thin DFN and 6-Pin SOT-23
Packages
• Junction Temperature Range from –40°C to
+125°C
The MIC2033 is a high-side MOSFET power
distribution switch that provides increased system
reliability, utilizing 5% current-limit accuracy.
Applications
•
•
•
•
The MIC2033 has an operating input voltage range
from 2.5V to 5.5V, is internally current-limited and has
thermal shutdown to protect the device and system.
The MIC2033 is offered with either active-high or
active-low logic level enable input controls, has an
open-drain fault status output flag with a built-in 32 ms
delay that asserts low during over current or thermal
shutdown conditions.
The MIC2033 is available in several different fixed
current-limit options: 0.5A, 0.8A, 1A, and 1.2A. A
capacitor-adjustable soft-start circuit minimizes inrush
current in applications where high capacitive loads are
used.
The MIC2033 is offered in both 6-pin SOT-23 and 6-pin
2 mm x 2 mm thin DFN packages. The MIC2033 has
an operating junction temperature range of –40°C to
+125°C.
USB Peripherals and USB 2.0/3.0-Compatible
DTV/STB
Notebooks and Consumer Electronics
General Purpose Power Distribution
Package Types
MIC2033
SOT-23-6 (M6)
MIC2033
2x2 TDFN (MT) (Note 1)
VIN
1
6
VOUT
GND
2
5
EN
3
4
VOUT
1
CSLEW
CSLEW
2
FAULT/
FAULT/
3
EP
6
VIN
5
GND
4
EN
Note 1: Thin DFN ▲ = Pin 1 identifier.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 1
MIC2033
Typical Application Circuit
MIC2033
2x2 TDFN
VIN
5V
6
C1
47μF
6.3V
R1
10Kȍ
C3
0.1μF
4
3
2
VIN
VOUT
1
VOUT
5.0V/1A
C2
100μF
6.3V
EN
FAULT/
CSLEW
GND
5
Functional Block Diagram
POWER FET
VIN
UVLO
THERMAL
SENSOR
VOUT
SENSE FET
CURRENT
LIMIT
DELAY
FAULT/
EN
CSLEW
DS20005539B-page 2
CONTROL
SLEW RATE
CONTROL
REFERENCE
GND
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
VIN to GND................................................................................................................................................... –0.3V to +6V
VOUT to GND..................................................................................................................................................–0.3V to VIN
VCSLEW to GND ................................................................................................................................. –0.3V to VIN + 0.3V
VEN to GND.................................................................................................................................................. –0.3V to +6V
VFAULT/ to GND .................................................................................................................................. –0.3V to VIN + 0.3V
FAULT/ Current (IFAULT/) .........................................................................................................................................25 mA
Maximum Power Dissipation (PD).......................................................................................................... Internally Limited
ESD Rating (HBM) (Note 1) ....................................................................................................................................... 3 kV
ESD Rating (MM) (Note 1) ........................................................................................................................................ 300V
Operating Ratings ‡
Supply Voltage (VIN) ................................................................................................................................. +2.5V to +5.5V
VEN ............................................................................................................................................................ –0.3V to +5.5V
VCSLEW, VOUT ................................................................................................................................................–0.3V to VIN
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1.5 kΩ in series
with 100 pF.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 3
MIC2033
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF, CCSLEW = OPEN, COUT = 1 µF; TJ = +25°C, unless noted.
Bold values indicate –40°C ≤ TJ ≤ +125°C. (Note 1).
Symbol
Parameters
Min.
Typ.
Max.
Units
Conditions
V
—
Power Supply Input
VIN
Input Voltage Range
2.5
—
5.5
VUVLO
Input Supply Undervoltage
Lockout Threshold
2.0
2.25
2.5
1.9
2.15
2.4
VUVLOHYS
Input Supply Undervoltage
Lockout Threshold Hysteresis
—
100
—
—
0.75
5
V
mV
µA
Supply Current
IDD
VIN rising
VIN falling
VIN rising or VIN falling
Switch OFF; Active-High
Enable (A): VEN = 0V, VIN = 5V,
IOUT = 0A
Switch OFF; Active-Low
Enable (B): VEN = VIN = 5V,
IOUT = 0A
Switch ON; Active-High Enable
(A): VEN = 1.5V, VIN = 5V,
IOUT = 0A
—
100
300
—
100
177
—
85
145
—
75
125
0.22
15
0.475
0.5
0.525
MIC2033-05xxxx, VOUT =
0.8*VIN
0.76
0.8
0.84
MIC2033-08xxxx, VOUT =
0.8*VIN
0.95
1.0
1.05
MIC2033-10xxxx, VOUT =
0.8*VIN
1.14
1.2
1.26
MIC2033-12xxxx, VOUT =
0.8*VIN
—
—
0.5
1.5
—
—
µA
Switch ON; Active-Low Enable
(B): VEN = 0V, VIN = 5V,
IOUT = 0A
Power MOSFET
Switch On-Resistance
RDS(ON)
Output Leakage Current
ILKG
VIN = 2.5V, IOUT = 350 mA
mΩ
VIN = 3.3V, IOUT = 350 mA
VIN = 5V, IOUT = 350 mA
µA
Switch OFF, VOUT = 0V
Current-Limit
ILIMIT
Current-Limit Accuracy
A
I/O
Enable Voltage
IEN
Enable Input Current
—
1
—
µA
0V ≤ VEN ≤ 5V
RFLAG
Fault Flag Output Resistance
—
—
25
Ω
IOUT = 10 mA
Note 1:
2:
3:
4:
V
Logic-Low
VEN
Logic-High
Specification for packaged product only.
See Timing Diagrams.
CCSLEW values above 0.1 µF are not recommended.
For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation
of VOUT and the current limitation, allowing FAULT/ to be asserted before these.
DS20005539B-page 4
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VEN = 5V, CIN = 1 µF, CCSLEW = OPEN, COUT = 1 µF; TJ = +25°C, unless noted.
Bold values indicate –40°C ≤ TJ ≤ +125°C. (Note 1).
Symbol
Parameters
Min.
Typ.
Max.
Units
Conditions
IFLAG_OFF
Fault Flag Off Current
—
—
10
µA
VFLAG = VIN
RFAULT/
FAULT/ Output Resistance
—
—
25
Ω
IOUT = 10 mA
IFAULT/_OFF
FAULT/ Off Current
—
—
10
µA
VFAULT/ = VIN
ICSLEW
CSLEW Input Current (Note 2)
—
0.6
—
µA
VCSLEW = VIN
Thermal Protection
TTSD
Thermal Shutdown
Temperature
—
157
—
°C
TJ rising
TTSDHYS
Thermal Shutdown Hysteresis
—
15
—
°C
—
Timing Specifications (AC Parameters)
tRISE
Output Turn-on Rise Time
(Note 2)
—
700
—
µs
RLOAD = 10Ω; COUT = 1 µF
tFALL
Output Turn-off Fall Time
(Note 2)
—
32
—
µs
VEN = OFF; RLOAD = 10Ω;
COUT = 1 µF
tON_DLY
Output Turn-on Delay (Note 2)
—
700
—
µs
RLOAD = 10Ω; COUT = 1 µF
tOFF_DLY
Output Turn-off Delay (Note 2)
—
5
—
µs
RLOAD = 10Ω; COUT = 1 µF
tSC_RESP
Short Circuit Response Time
(Note 2, Note 3)
—
10
—
ms
VOUT = 0V (short-circuit);
CCSLEW = 0.1 µF
tSC_RESP
Short Circuit Response Time
(Note 2)
—
10
—
µs
VOUT = 0V (short-circuit);
CCSLEW = OPEN
tFAULT/
Overcurrent Fault Response
Delay Time (Note 2, Note 4)
16
32
49
ms
—
Note 1:
2:
3:
4:
Specification for packaged product only.
See Timing Diagrams.
CCSLEW values above 0.1 µF are not recommended.
For dynamic current loads faster than typically 30 mA/ms. Slower current loads will delay the deactivation
of VOUT and the current limitation, allowing FAULT/ to be asserted before these.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 5
MIC2033
TEMPERATURE SPECIFICATIONS
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
Note 1
Storage Temperature Range
TS
–65
—
+150
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 10s
Thermal Resistance SOT-23-6
JA
—
177.2
—
°C/W
—
Thermal Resistance 6-pin 2 mm x
2 mm DFN
JA
—
90
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Note 1:
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
DS20005539B-page 6
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Temperature.
Input Supply Current vs.
FIGURE 2-4:
RDS(ON) vs. Temperature.
FIGURE 2-2:
Temperature.
VIN OFF Current vs.
FIGURE 2-5:
RDS(ON) vs. Temperature.
FIGURE 2-3:
Temperature.
Undervoltage Lockout vs.
FIGURE 2-6:
RDS(ON) vs. Output Current.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 7
MIC2033
FIGURE 2-7:
RDS(ON) vs. Output Current.
FIGURE 2-10:
Temperature.
Current Limit vs.
FIGURE 2-8:
RDS(ON) vs. Output Current.
FIGURE 2-11:
Temperature.
Current Limit vs.
FIGURE 2-9:
RDS(ON) vs. Output Current.
FIGURE 2-12:
Temperature.
Current Limit vs.
DS20005539B-page 8
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
FIGURE 2-13:
Temperature.
Current Limit vs.
FIGURE 2-16:
Temperature.
FAULT/ Pin Resistance vs.
FIGURE 2-14:
Current.
VIN - VOUT vs. Output
FIGURE 2-17:
Temperature.
FAULT/ Response Time vs.
VIN
(2V/div)
VFAULT/
(2V/div)
VIN = 3.3V
ILOAD = 500mA
CCSLEW = 0.1μF
COUT = 1μF
VOUT
(2V/div)
IIN
(500mA/div)
Time (4ms/div)
FIGURE 2-15:
Current.
VIN - VOUT vs. Output
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
FIGURE 2-18:
Soft-Start Turn-On.
DS20005539B-page 9
MIC2033
VIN
(2V/div)
VFAULT/
(2V/div)
VIN = 3.3V
ILOAD = 500mA
CCSLEW = 0.1μF
COUT = 1μF
VOUT
(2V/div)
VIN
(2V/div)
IIN
(500mA/div)
VOUT
(2V/div)
IIN
(500mA/div)
Time (2ms/div)
FIGURE 2-19:
Time (100μs/div)
Soft-Start Turn-Off.
VEN
(5V/div)
FIGURE 2-22:
VOUT
(2V/div)
VFAULT/
(5V/div)
VIN = 5V
ILOAD = 500mA
CCSLEW = 0.1μF
COUT = 1μF
MIC2033-05BYM6
VOUT
(2V/div)
VIN = 5V
ILOAD = 500mA
CCSLEW = 0.1μF
COUT = 1μF
MIC2033-05BYM6
DS20005539B-page 10
Time (20μs/div)
MIC2033-05BYM6
FIGURE 2-23:
Current-Limit Response,
400 mA Steady State Load.
VFAULT/
(5V/div)
VOUT
(1V/div)
VIN
(2V/div)
VOUT
(2V/div)
FIGURE 2-21:
VIN = 3.3V
ILOAD = 400mA
(Steady State),
Output short applied
CCSLEW = 0.1μF
COUT = 1μF
Time (10ms/div)
Enable Turn-On.
VEN
(5V/div)
Turn-On into Short-Circuit.
IIN
(1A/div)
Time (100μs/div)
FIGURE 2-20:
VIN = 5V
ILOAD = Short Circut
CCSLEW = 0.1μF
CIN = 1μF
COUT = 1μF
MIC2033-12AYM6
Enable Turn-Off.
IIN
(500mA/div)
FIGURE 2-24:
VIN = 5V
ILOAD = MOSFET load turned
on such that VOUT = (0.8×VIN)
CCSLEW = OPEN
COUT = 1μF
MIC2033-10AYM6
Time (4ms/div)
Current-Limit Response.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
VFAULT/
(5V/div)
VIN = 5V
ILOAD = 0A to
S.C., 75ms pulse
CCSLEW = 0.1μF
COUT = 68μF
MIC2033-12AYM6
VIN
(2V/div)
VOUT
(2V/div)
VOUT
(2V/div)
IIN
(1A/div)
VFAULT/
(5V/div)
FIGURE 2-25:
Short-Circuit.
VIN
(2V/div)
VOUT
(2V/div)
IIN
(200mA/div)
Time (20ms/div)
Output Recovery from
VIN = 5V
ILOAD = 0A to S.C.
to 0A, 120ms pulse
CCSLEW = 0.1μF
COUT = 68μF
Time (10ms/div)
FIGURE 2-28:
VOUT
(2V/div)
IIN
(500mA/div)
Time (20ms/div)
FIGURE 2-26:
VOUT Recovery from
Thermal Shutdown.
Turn-On into 50% Overload.
VFAULT/
(5V/div)
IIN
(1A/div)
VFAULT/
(5V/div)
VIN = 5V
ILOAD =750mA (RLOAD = 6.6)
CCSLEW = 0.1μF
CIN = 1μF
COUT = 1μF
MIC2033-05BYM6
FIGURE 2-29:
VIN = 5V
ILOAD = 500mA to 1.5A overload
CCSLEW = 0.1μF
CIN = 1μF
COUT = 1μF
MIC2033-12AYM6
Time (40ms/div)
1.5A Overload Response.
VFAULT/
(5V/div)
VOUT
(2V/div)
IIN
(200mA/div)
FIGURE 2-27:
Overload.
VIN = 5V
ILOAD = 580mA (RLOAD = 8.6)
CCSLEW = 0.1μF
CIN = 1μF
COUT = 1μF
MIC2033-05BYM6
Time (10ms/div)
Turn-On into Minimal
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 11
MIC2033
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
SOT-23-6L
Pin Number
Thin DFN
Pin Name
1
6
VIN
2
5
GND
3
4
EN
4
3
FAULT/
Fault Status Flag (Output): Active-low, open-drain output. A
logic-low state indicates an overcurrent or thermal shutdown
condition. An overcurrent condition must last longer than tFAULT/ in
order to assert FAULT/. A pull-up resistor (10 kΩ recommended) to
an external supply is required.
5
2
CSLEW
Slew Rate Control: Adjustable soft-start input. Adding a small value
capacitor from CSLEW to VIN slows the turn-on time of the power
MOSFET.
6
1
VOUT
Switch Output: Power switch output.
—
EP
ePad
Exposed Pad: Exposed pad on bottom side of package. Connect to
electrical ground for optimum thermal dissipation.
DS20005539B-page 12
Description
Input: Power switch and logic supply input.
Ground: Input and output return pin.
Enable (Input): Logic compatible, enable control input that allows
turn-on/off of the switch. Do not leave the EN pin floating.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
4.0
FUNCTIONAL DESCRIPTION
The MIC2033 is a high-side MOSFET power
distribution switch providing increased system
reliability utilizing 5% current-limit accuracy. The
MIC2033 has an operating input voltage range from
2.5V to 5.5V and is internally current-limited and has
thermal shutdown that protects the device and system.
4.1
Soft-Start
Soft-start reduces the power supply input surge current
at startup by controlling the output voltage rise time.
The input surge appears while the output capacitor is
charged up. A slower output rise time will draw a lower
input surge current.
During soft-start, an internal current sink discharges
the external capacitor at CSLEW to ground to control
the ramp of the output voltage. The output voltage rise
time is dependent upon the value of CCSLEW, the input
voltage, output voltage, and the current limit. The value
of the CSLEW external capacitor is recommended to
be 0.1 µF.
4.2
Input Capacitor
A 1 µF to 100 µF ceramic input capacitor is
recommended for most applications. The input
capacitor must be placed on the same side of the board
and next to the MIC2033 to minimize the voltage
ringing during transient and short circuit conditions. It is
also recommended to use two vias for each end of the
capacitor to connect to the power and ground plane.
X7R or X5R dielectric ceramic capacitors are
recommended because of their temperature
performance. X7R-type capacitors change capacitance
by 15% over their operating temperature range and are
the most stable type of ceramic capacitors. Z5U and
Y5V dielectric capacitors change value by as much as
50% and 60% respectively over their operating
temperature ranges. To use a ceramic chip capacitor
with Y5V dielectric, the value must be much higher than
an X7R ceramic or a tantalum capacitor to ensure the
same capacitance value over the operating
temperature range.
4.3
Output Capacitor
The output capacitor type and placement criteria are
the same as the input capacitor.
or shorts on VOUT can result in stresses beyond the
device's absolute maximum ratings, even for short
cables, which will damage the device.
4.4
Enable
The MIC2033 offers either an active-high or active-low
enable input (EN) that allows ON/OFF control of the
switch output. The current through the device reduces
to near zero when the device is shutdown, with only
microamperes of leakage current. The EN input may be
directly tied to VIN or driven by a voltage that is equal to
or less than VIN, but do not leave this pin floating.
Care should be taken to ensure that the EN pin does
not exceed VIN by more than 500 mV at any time. This
includes at power-up and during load transients.
Whenever possible, it is recommended to tie EN to VIN
through a pull-up resistor and use an open-drain or
open-collector device to change the state.
4.5
Current Limit
The MIC2033 is available with four fixed current-limit
settings: 0.5A, 0.8A, 1A, and 1.2A. If the output current
exceeds the set current limit, then the MIC2033 switch
will enter constant current-limit mode. The maximum
allowable current limit may be less than the full
specified and/or expected current if the MIC2033 is not
mounted
on a circuit board with sufficiently low
thermal resistance. The MIC2033 responds within
10 µs to short-circuits to limit the output current and
also provides an output fault flag that will assert (low)
for an overcurrent condition that lasts longer than
32 ms.
4.6
Thermal Design
To help reduce the thermal resistance, the ePad
(underneath the IC) should be soldered to the PCB
ground and the placement of thermal vias either
underneath or near the ePad is highly recommended.
Thermal
design
requires
the
following
application-specific parameters:
•
•
•
•
Maximum ambient temperature (TA)
Output current (IOUT)
Input voltage (VIN)
Current Limit (ILIMIT)
Care must be taken when choosing the output
capacitance for inductive loads. Without sufficient
capacitance or clamping devices, sudden disconnects
When the MIC2033 is in constant current-limit mode, it
may exceed the overtemperature threshold. If this
occurs, the overtemperature condition will shut down
the MIC2033 switch and the fault status flag will go
active (assert low). After the switch cools down, it will
turn on again. The MIC2033 power dissipation can be
maximized by either lowering the thermal resistance on
the exposed pad (only the DFN package has an
exposed pad) on the printed circuit board, or by limiting
the maximum allowable ambient temperature.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 13
The exact amount of capacitance depends upon the
specific application. For example, USB applications will
typically use 150 µF, whereas local consumers, such
as microcontrollers, may require as little as 1 µF.
MIC2033
4.7
Thermal Measurements
It is always wise to measure the IC’s case temperature
to make sure that it is within its operating limits.
Although this might seem like a very elementary task, it
is very easy to get erroneous results. The most
common mistake is to use the standard thermal couple
that comes with the thermal voltage meter. This thermal
couple wire gauge is large, typically 22 gauge, and
behaves like a heatsink, resulting in a lower case
measurement.
There are two suggested methods for measuring the IC
case temperature: a thermal couple or an infrared
thermometer. If a thermal couple is used, it must be
constructed of 36 gauge wire or higher to minimize the
wire heatsinking effect. In addition, the thermal couple
tip must be covered in either thermal grease or thermal
glue to make sure that the thermal couple junction is
making good contact to the case of the IC. This thermal
couple from Omega (5SC-TT-K-36-36) is adequate for
most applications.
To avoid this messy thermal couple grease or glue, an
infrared thermometer is recommended. Most infrared
thermometers’ spot size is too large for an accurate
reading on small form factor ICs. However, an IR
thermometer from Optris has a 1 mm spot size, which
makes it ideal for the 2 mm x 2 mm DFN package. Also,
get the optional stand. The stand makes it easy to hold
the beam on the IC for long periods of time.
DS20005539B-page 14
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
5.0
TIMING DIAGRAMS
V
EN
0
tFALL
tRISE
90%
VOUT
90%
10%
10%
0
t
FIGURE 5-1:
Output Rise/Fall Time.
V
EN
50%
50%
0
tON_DLY
tOFF_DLY
90%
VOUT
10%
0
t
FIGURE 5-2:
Turn-On/Off Delay.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 15
MIC2033
V
FAULT/
0
tFAULT/
VOUT
0
tSC_RESP
ILIMIT
IOUT
0
FIGURE 5-3:
DS20005539B-page 16
t
Short-Circuit Response Time and Overcurrent Fault Flag Delay.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
6-Lead SOT-23*
XXX
6-Lead TDFN*
XXX
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
36A
Example
3A5
722
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 17
MIC2033
6-Lead TDFN 2 mm x 2 mm Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
DS20005539B-page 18
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
6-Lead SOT-23 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 19
MIC2033
NOTES:
DS20005539B-page 20
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
APPENDIX A:
REVISION HISTORY
Revision A (March 2018)
• Converted Micrel document MIC2033 to Microchip data sheet DS20005539A.
• Minor text changes throughout.
• Value of C1 updated in Typical Application Circuit.
• Maximum value of input capacitor corrected in
Input Capacitor section.
• VEN to GND corrected maximum value in Absolute Maximum Ratings †.
• VEN and VFAULT/ combined in Operating Ratings
‡.
• CCSLEW value corrected to OPEN in Figure 2-24.
• CSLEW external capacitor value in the Soft-Start
section corrected to 0.1 µF.
Revision B (January 2022)
• Updated package marking drawing in Section 6.1,
Package Marking Information.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
DS20005539B-page 21
MIC2033
NOTES:
DS20005539B-page 22
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
MIC2033
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
–
X
XX
X
XX
Current Enable Temperature Package
Limit
Device:
MIC2033:
Current Limit:
05
55
08
10
12
Enable:
A
B
=
=
Active-High
Active-Low
Temperature:
Y
=
–40°C to +125°C
Package:
M6 =
MT =
SOT-23-6L
6-Lead 2 mm x 2 mm TDFN (Note 1)
T5
TR
500/Reel
3,000/Reel
Media Type:
Note 1:
=
=
=
=
=
=
=
–
XX
Examples:
a)
MIC2033-05AYM6-T5: High-Accuracy, High-Side,
b)
MIC2033-55AYMT-TR: High-Accuracy, High-Side,
c)
MIC2033-08BYM6-TR:
d)
MIC2033-10BYMT-T5: High-Accuracy, High-Side,
e)
MIC2033-12AYM6-T5: High-Accuracy, High-Side,
f)
MIC2033-12BYMT-TR: High-Accuracy, High-Side,
Fixed Current-Limit Power
Switch, 0.5A Current Limit,
Active-High Enable, –40°C
to +125°C Temp. Range,
SOT-23-6L Package, 500/
Reel
Media
Type
High-Accuracy, High-Side, Fixed CurrentLimit Power Switch
0.5A
0.55A
0.8A
1.0A
1.2A
Fixed Current-Limit Power
Switch, 0.55A Current Limit
Active-High Enable, –40°C
to +125°C Temp. Range,
6-Pin 2 mm x 2 mm TDFN
Package, 3,000/Reel
Fixed Current-Limit Power
Switch, 1.0A Current Limit
Active-Low Enable, –40°C
to +125°C Temp. Range,
6-Pin 2 mm x 2 mm TDFN
Package, 500/Reel
Thin DFN is a GREEN RoHS-compliant package. Lead finish is
NiPdAu. Mold compound is Halogen Free.
Fixed Current-Limit Power
Switch, 1.2A Current Limit,
Active-High Enable, –40°C
to +125°C Temp. Range,
SOT-23-6L Package, 500/
Reel
Note 1:
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
High-Accuracy, High-Side,
Fixed Current-Limit Power
Switch, 0.8A Current Limit,
Active-Low Enable, –40°C
to +125°C Temp. Range,
SOT-23-6L
Package,
3,000/Reel
Fixed Current-Limit Power
Switch, 1.2A Current Limit
Active-Low Enable, –40°C
to +125°C Temp. Range,
6-Pin 2 mm x 2 mm TDFN
Package, 3,000/Reel
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20005539B-page 23
MIC2033
NOTES:
DS20005539B-page 24
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2018 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-5224-9574-1
DS20005539B-page 25
Worldwide Sales and Service
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DS20005539B-page 26
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09/14/21
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