MIC33153
4 MHz 1.2A Internal Inductor PWM Buck Regulator
with HyperLight Load® and Power Good
Features
General Description
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The MIC33153 is a high-efficiency 4 MHz 1.2A
synchronous buck regulator with an internal inductor,
HyperLight Load® mode, Power Good (PG) output
indicator, and programmable soft-start. HyperLight
Load® provides very high efficiency at light loads and
ultra-fast transient response which makes the
MIC33153 perfectly suited for supplying processor
core voltages.
•
•
•
•
•
•
•
•
•
•
•
•
•
Internal Inductor
Simplifies Design to Two External Capacitors
Input Voltage: 2.7V to 5.5V
Output Voltage: Fixed or Adjustable (0.62V to
3.6V)
Up to 1.2A Output Current
Up to 93% Peak Efficiency
85% Typical Efficiency at 1 mA
Power Good (PG) Output
Programmable Soft-Start
22 µA Typical Quiescent Current
4 MHz PWM Operation in Continuous Mode
Ultra-Fast Transient Response
Low Ripple Output Voltage
- 35 mVPP Ripple in HyperLight Load® Mode
- 7 mV Output Voltage Ripple in Full PWM
Mode
0.01 µA Shutdown Current
Thermal Shutdown and Current Limit Protection
14-lead 3.0 x 3.5 x 1.1 mm TDFN Package
–40°C to +125°C Junction Temperature Range
An additional benefit of this proprietary architecture is
very low output ripple voltage throughout the entire
load range with the use of small output capacitors.
The MIC33153 is designed so that only two external
capacitors as small as 2.2 µF are needed for stability.
This gives the MIC33153 the ease of use of an LDO
with the efficiency of a HyperLight Load® DC converter.
The MIC33153 achieves efficiency in HyperLight
Load® mode as high as 85% at 1 mA, with a very low
quiescent current of 22 µA. At higher loads, the
MIC33153 provides a constant switching frequency up
to 4 MHz.
The MIC33153 is available in 14-lead 3.0 mm x 3.5 mm
TDFN package with an operating junction temperature
range from –40°C to +125°C.
Applications
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Solid State Drives (SSD)
Mobile Handsets
Portable Media/MP3 Players
Portable Navigation Devices (GPS)
WiFi/WiMax/WiBro Modules
Wireless LAN Cards
Portable Applications
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 1
MIC33153
Package Types
14-Lead 3.0 mm x 3.5 mm TDFN
14-Lead 3.0 mm x 3.5 mm TDFN
Fixed (Top View)
Adjustable (Top View)
Typical Application Circuits
Fixed Output MIC33153
J
Adjustable Output MIC33153
J
DS20006223B-page 2
2019 - 2022 Microchip Technology Inc.
MIC33153
Functional Block Diagrams
Simplified MIC33153 Fixed Output Functional Block
Simplified MIC33153 Adjustable Output Functional Block
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 3
MIC33153
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Voltage (VIN)........................................................................................................................................–0.3 to +6V
Sense Voltage (VSNS) ......................................................................................................................................–0.3 to VIN
Output Switch Voltage (VSW) ...........................................................................................................................–0.3 to VIN
Enable Input Voltage (VEN) ..............................................................................................................................–0.3 to VIN
Power Good (PG) Voltage (VPG)......................................................................................................................–0.3 to VIN
ESD Rating (Note 1)................................................................................................................................... ESD Sensitive
Operating Ratings ‡
Supply Voltage (VIN).................................................................................................................................. +2.7V to +5.5V
Enable Input Voltage (VEN) ................................................................................................................................ 0V to VIN
Sense Voltage (VSNS) ................................................................................................................................. 0.62V to 3.6V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability. Specifications are for packaged product only.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: Devices are ESD sensitive. Handling precautions are recommended. Human body model, 1. kΩ in series
with 100 pF.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; COUT = 4.7 µF; unless otherwise specified. Bold values
indicate –40°C ≤ TJ ≤ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
Supply Voltage Range
VIN
2.7
—
5.5
V
—
Undervoltage Lockout
Threshold
VUVTHR
2.45
2.55
2.65
V
Turn-On
Undervoltage Lockout
Hysteresis
VUVHYS
—
75
—
mV
—
Quiescent Current
IQ
—
22
45
µA
Shutdown Current
ISD
—
0.01
5
IOUT = 0 mA, VSNS > 1.2 * VOUT(NOM)
µA
VEN = 0V; VIN = 5.5V
VIN = 3.6V if VOUT(NOM) < 2.5V,
ILOAD = 20 mA
ΔVOUT
–2.5
—
+2.5
%
Feedback Regulation
Voltage
VFB
0.6045
0.62
0.6355
V
ILOAD = 20 mA
Current Limit
ILIM
2.2
3.3
—
A
VSNS = 0.9*VOUT(NOM)
Output Voltage Accuracy
Output Voltage Line
Regulation
Output Voltage Load
Regulation
DS20006223B-page 4
—
ΔVO_LINE
ΔVO_LOAD
—
0.3
%/V
VIN = 4.5V to 5.5V if VOUT(NOM) ≥
2.5V, ILOAD = 20 mA
VIN = 3.6V to 5.5V if VOUT(NOM) <
2.5V, ILOAD = 20 mA
—
VIN = 4.5V to 5.5V if VOUT(NOM) ≥
2.5V, ILOAD = 20 mA
1 mA < ILOAD < 1A, VIN = 3.6V if
VOUT(NOM) < 2.5V
—
0.8
—
—
0.85
—
%/A
1 mA < ILOAD < 1A, VIN = 5.0V if
VOUT(NOM) ≥ 2.5V
2019 - 2022 Microchip Technology Inc.
MIC33153
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: TA = 25°C, VIN = VEN = 3.6V; COUT = 4.7 µF; unless otherwise specified. Bold values
indicate –40°C ≤ TJ ≤ +125°C.
Parameter
PWM Switch On-Resistance
Maximum Switching
Frequency
Symbol
Min.
RDSON(HS)
—
0.2
—
RDSON(LS)
—
0.19
—
fSW(MAX)
—
4
—
MHz
tSS
—
320
—
µs
VOUT = 90%, CSS = 470 pF
µA
VSS = 0V
Soft-Start Time
Typ.
Max.
Units
Ω
Conditions
ISW = 100 mA PMOS
ISW = –100 mA NMOS
IOUT = 300 mA
ISS
—
2.7
—
PG Threshold (Rising)
VPGTHR
86
92
96
%VOUT —
PG Threshold Hysteresis
%VOUT —
Soft-Start Current
VPGHYS
—
7
—
PG Delay Time
tD_PG
—
68
—
Enable Threshold
µs
Rising
VENTH
0.5
0.9
1.2
V
Turn-On
Enable Input Current
IEN
—
0.1
2
µA
—
Overtemperature Shutdown
TSD
—
160
—
°C
—
Overtemperature Shutdown
Hysteresis
TSDHYS
—
20
—
°C
—
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Symbol
Min.
Typ.
Max.
Units
Conditions
Temperature Ranges
Operating Junction Temperature Range
TJ
–40
—
+125
°C
—
Storage Temperature Range
TS
–65
—
+150
°C
—
Lead Temperature
—
—
—
260
°C
Soldering, 10 sec.
JA
—
55
—
°C/W
Package Thermal Resistances
Thermal Resistance 14-Lead TDFN
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 5
MIC33153
2.0
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
FIGURE 2-1:
Efficiency (VOUT = 3.3V).
FIGURE 2-4:
Efficiency (VOUT = 1.5V).
FIGURE 2-2:
Efficiency (VOUT = 2.5V).
FIGURE 2-5:
Efficiency (VOUT = 1.2V).
FIGURE 2-3:
Efficiency (VOUT = 1.8V)
FIGURE 2-6:
Efficiency (VOUT = 1.0V).
DS20006223B-page 6
2019 - 2022 Microchip Technology Inc.
MIC33153
FIGURE 2-7:
Voltage.
Current-Limit vs. Output
FIGURE 2-10:
Load).
Line Regulation (Light
QUIESCENT CURRENT (μA)
40
35
T = 20°C
T = 125°C
30
25
20
15
No Switching
SNS > 1.2 * VOUTNOM
10
5
T = - 45°C
COUT = 4.7μF
0
2.7
3.2
3.7
4.2
4.7
5.2
5.7
INPUT VOLTAGE (V)
FIGURE 2-8:
Voltage.
Quiescent Current vs. Input
FIGURE 2-11:
Load).
Line Regulation (Heavy
FIGURE 2-9:
Voltage.
Shutdown Current vs. Input
FIGURE 2-12:
Load Regulation.
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 7
MIC33153
FIGURE 2-13:
Temperature.
Feedback Voltage vs.
FIGURE 2-16:
Voltage.
Enable Voltage vs. Input
FIGURE 2-14:
Temperature.
UVLO Threshold vs.
FIGURE 2-17:
VOUT Rise Time vs. CSS.
FIGURE 2-15:
Temperature.
Enable Threshold vs.
FIGURE 2-18:
Temperature.
SW Frequency vs.
DS20006223B-page 8
2019 - 2022 Microchip Technology Inc.
MIC33153
FIGURE 2-19:
Output Current.
Switching Frequency vs.
FIGURE 2-22:
Switching Waveform
Discontinuous Mode (Load = 150 mA).
FIGURE 2-20:
Switching Waveform
Discontinuous Mode (Load = 1 mA).
FIGURE 2-23:
Switching Waveform
Continuous Mode (Load = 300 mA).
FIGURE 2-21:
Switching Waveform
Discontinuous Mode (Load = 50 mA).
FIGURE 2-24:
Switching Waveform
Continuous Mode (Load = 800 mA).
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 9
MIC33153
FIGURE 2-25:
Switching Waveform
Continuous Mode (Load = 1.2A).
FIGURE 2-28:
1.2A).
Load Transient (10 mA to
FIGURE 2-26:
200 mA).
Load Transient (10 mA to
FIGURE 2-29:
1.2A).
Load Transient (300 mA to
FIGURE 2-27:
500 mA).
Load Transient (10 mA to
FIGURE 2-30:
Load Transient (10 mA to
1.2A) with PGOOD.
DS20006223B-page 10
2019 - 2022 Microchip Technology Inc.
MIC33153
FIGURE 2-31:
at 1.2A.
Line Transient (3.6V to 5.5V)
FIGURE 2-32:
at 20 mA.
Line Transient (3.6V to 5.5V)
FIGURE 2-33:
(CSS = 470 pF).
Start-Up with PGOOD
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 11
MIC33153
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
(Fixed)
Pin Number
(Adjustable)
Pin
Name
1
1
SS
2
2
AGND
3
3
VIN
4
4
PGND
Description
Soft-Start: Place a capacitor from this pin to ground to program the
soft start time. Do not leave floating, 100 pF minimum CSS is
required.
Analog Ground: Connect to central ground point where all high
current paths meet (CIN, COUT, PGND) for best operation.
Input Voltage: Connect a capacitor to ground to decouple the noise.
Power Ground.
5, 6, 7
5, 6, 7
OUT
Output Voltage: The output of the regulator. Connect to SNS pin. For
adjustable option, connect to feedback resistor network.
8, 9, 10
8, 9, 10
SW
Switch: Internal power MOSFET output switches before inductor.
11
11
EN
Enable: Logic high enables operation of the regulator. Logic low will
shut down the device. Do not leave floating.
12
12
SNS
Sense: Connect to VOUT as close to output capacitor as possible to
sense output voltage.
13
13
PG
Power Good: Open-drain output for the Power Good (PG) indicator.
Use a pull-up resistor from this pin to a voltage source to detect a
power good condition.
14
—
NC
Not internally connected.
FB
Feedback: Connect a resistor divider from the output to ground to set
the output voltage.
—
DS20006223B-page 12
14
2019 - 2022 Microchip Technology Inc.
MIC33153
4.0
FUNCTIONAL DESCRIPTION
4.1
VIN
The input supply (VIN) provides power to the internal
MOSFETs for the switch mode regulator along with the
internal control circuitry. The VIN operating range is
2.7V to 5.5V so an input capacitor, with a minimum
voltage rating of 6.3V, is recommended. Due to the high
switching speed, a minimum 2.2 µF bypass capacitor
placed close to VIN and the power ground (PGND) pin
is required.
4.2
SW
The switch (SW) connects directly to one end of the
inductor and provides the current path during switching
cycles. The other end of the inductor is connected to
the load, SNS pin and output capacitor. Due to the high
speed switching on this pin, the switch node should be
routed away from sensitive nodes whenever possible.
4.4
SNS
The sense (SNS) pin is connected to the output of the
device to provide feedback to the control circuitry. The
SNS connection should be placed close to the output
capacitor.
4.5
PGND
Soft-Start
The soft-start (SS) pin is used to control the output
voltage ramp up time. The approximate equation for
the ramp time in milliseconds is:
EQUATION 4-1:
3
t SS = 270 10 ln 10 C SS
Where:
tSS =
Soft-start ramp up time of VOUT
CSS =
External soft-start capacitance (in Farads)
For example, for a CSS = 470 pF, TRISE ~ 0.3 ms or
300 µs. See Section 2.0, Typical Performance Curves
for a graphical guide. The minimum recommended
value for CSS is 100 pF.
4.9
FB
The feedback (FB) pin is provided for the adjustable
voltage option (no internal connection for fixed
options). This is the control input for programming the
output voltage. A resistor divider network is connected
to this pin from the output and is compared to the
internal 0.62V reference within the regulation loop.
The output voltage can be programmed between 0.65V
and 3.6V using the following equation:
EQUATION 4-2:
V OUT = V REF 1 + R1
-------
R2
AGND
The analog ground (AGND) is the ground path for the
biasing and control circuitry. The current loop for the
signal ground should be separate from the power
ground (PGND) loop.
4.6
4.8
EN
A logic high signal on the enable pin activates the
output voltage of the device. A logic low signal on the
enable pin deactivates the output and reduces supply
current to 0.01 µA. MIC33153 features external
soft-start circuitry via the soft-start (SS) pin that
reduces in rush current and prevents the output voltage
from overshooting at start up. Do not leave the EN pin
floating.
4.3
voltage is below 86%, the PG pin indicates logic low. A
pull up resistor of more than 10 kΩ should be
connected from PG to VOUT.
Where:
R1 =
Top resistor
R2 =
Bottom resistor
VREF =
0.62V
The power ground pin is the ground path for the high
current in PWM mode. The current loop for the power
ground should be as small as possible and separate
from the analog ground (AGND) loop as applicable.
4.7
Power Good (PG)
The Power Good (PG) pin is an open-drain output that
indicates logic high when the output voltage is typically
above 92% of its steady state voltage. When the output
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 13
MIC33153
5.0
APPLICATIONS INFORMATION
The MIC33153 is a high performance DC-to-DC step
down regulator offering a small solution size. With the
HyperLight Load® switching scheme, the MIC33153 is
able to maintain high efficiency throughout the entire
load range while providing ultra-fast load transient
response. The following sections provide additional
device application information.
5.1
Input Capacitor
A 2.2µF ceramic capacitor or greater should be placed
close to the VIN pin and PGND pin for bypassing. A
Murata GRM188R60J475ME84D, size 0603, 4.7 µF
ceramic capacitor is recommended based upon
performance, size, and cost. A X5R or X7R
temperature rating is recommended for the input
capacitor. Y5V temperature rating capacitors, aside
from losing most of their capacitance over temperature,
can also become resistive at high frequencies. This
reduces their ability to filter out high frequency noise.
5.2
Output Capacitor
The MIC33153 is designed for use with a 2.2 µF or
greater ceramic output capacitor. Increasing the output
capacitance will lower output ripple and improve load
transient response but could also increase solution size
or cost. A low equivalent series resistance (ESR)
ceramic output capacitor such as the Murata
GRM188R60J475ME84D, size 0603, 4.7 µF ceramic
capacitor is recommended based upon performance,
size, and cost. Both the X7R or X5R temperature rating
capacitors are recommended. The Y5V and Z5U
temperature rating capacitors are not recommended
due to their wide variation in capacitance over
temperature and increased resistance at high
frequencies.
5.3
Duty Cycle
The typical maximum duty cycle of the MIC33153 is
80%.
5.5
V OUT I OUT
= -------------------------------- 100
V IN I IN
Maintaining high efficiency serves two purposes. It
reduces power dissipation in the power supply,
reducing the need for heat sinks and thermal design
considerations and it reduces consumption of current
for battery powered applications. Reduced current
draw from a battery increases the devices operating
time which is critical in hand held devices.
There are two types of losses in switching converters:
DC losses and switching losses. DC losses are simply
the power dissipation of I2R. Power is dissipated in the
high-side switch during the on cycle. Power loss is
equal to the high-side MOSFET RDS(ON) multiplied by
the switch current squared. During the off cycle, the
low-side N-channel MOSFET conducts, also
dissipating power. Device operating current also
reduces efficiency. The product of the quiescent
(operating) current and the supply voltage represents
another DC loss. The current required driving the gates
on and off at a constant 4 MHz frequency and the
switching transitions make up the switching losses.
Compensation
The MIC33153 is designed to be stable with a 4.7 µF
ceramic (X5R) output capacitor.
5.4
EQUATION 5-1:
Efficiency Considerations
Efficiency is defined as the amount of useful output
power, divided by the amount of power supplied.
DS20006223B-page 14
FIGURE 5-1:
Efficiency under Load.
Figure 5-1 shows an efficiency curve. From no load to
100 mA, efficiency losses are dominated by quiescent
current losses, gate drive and transition losses. By
using the HyperLight Load® mode, the MIC33153 is
able to maintain high efficiency at low output currents.
Over 100 mA, efficiency loss is dominated by MOSFET
RDS(ON) and inductor losses. Higher input supply
voltages will increase the gate to source threshold on
the internal MOSFETs, thereby reducing the internal
RDS(ON). This improves efficiency by reducing DC
losses in the device. All but the inductor losses are
inherent to the device. In which case, inductor selection
becomes increasingly critical in efficiency calculations.
As the inductors are reduced in size, the DC resistance
(DCR) can become quite significant.
2019 - 2022 Microchip Technology Inc.
MIC33153
The DCR losses can be calculated by using
Equation 5-2:
EQUATION 5-2:
2
P DCR = I OUT DCR
From that, the loss in efficiency due to inductor
resistance can be calculated by using Equation 5-3:
EQUATION 5-3:
V OUT I OUT
EfficiencyLoss = 1 – ---------------------------------------------------- 100
V OUT I OUT + P DCR
Efficiency loss due to DCR is minimal at light loads and
gains significance as the load is increased. Inductor
selection becomes a trade-off between efficiency and
size in this case.
The effect of MOSFET voltage drops and DCR losses
in conjunction with the maximum duty cycle combine to
limit maximum output voltage for a given input voltage.
The following graph shows this relationship based on
the typical resistive losses in the MIC33153:
5.6
HyperLight Load® Mode
The MIC33153 uses a minimum on and off time
proprietary control loop. When the output voltage falls
below the regulation threshold, the error comparator
begins a switching cycle that turns the PMOS on and
keeps it on for the duration of the minimum on-time.
When the output voltage is over the regulation
threshold, the error comparator turns the PMOS off for
a minimum off-time. The NMOS acts as an ideal
rectifier that conducts when the PMOS is off. Using a
NMOS switch instead of a diode allows for lower
voltage drop across the switching device when it is on.
The asynchronous switching combination between the
PMOS and the NMOS allows the control loop to work
in discontinuous mode for light load operations. In
discontinuous mode, MIC33153 works in pulse
frequency modulation (PFM) to regulate the output. As
the output current increases, the switching frequency
increases. This improves the efficiency of the
MIC33153 during light load currents. As the load
current increases, the MIC33153 goes into continuous
conduction mode (CCM) at a constant frequency of
4 MHz. The equation to calculate the load when the
MIC33153 goes into continuous conduction mode may
be approximated by the following Equation 5-4:
EQUATION 5-4:
V IN – V OUT D
I LOAD = --------------------------------------------
2L f
5
100mA
OUTPUT VOLTAGE (V)
4.5
4
400mA
3.5
3
1.2A
2.5
2
800mA
1.5
1
0.5
0
2.5
3
3.5
4
4.5
5
5.5
INPUT VOLTAGE (V)
FIGURE 5-2:
VOUT(MAX) vs. VIN.
2019 - 2022 Microchip Technology Inc.
As shown in the above equation, the load at which
MIC33153 transitions from HyperLight Load® mode to
PWM mode is a function of the input voltage (VIN),
output voltage (VOUT), duty cycle (D), inductance (L)
and frequency (f). For example, if VIN = 3.6V,
VOUT = 1.8V, D = 0.5, f = 4 MHz and the internal
inductance of MIC33153 is 0.47 µH, then the device
will enter HyperLight Load® mode or PWM mode at
approximately 200 mA.
5.7
Power Dissipation Considerations
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
package and the PCB it is mounted on. There is a
simple Ohm’s law type relationship between thermal
resistance, power dissipation, and temperature which
is analogous to an electrical circuit:
DS20006223B-page 15
MIC33153
EQUATION 5-6:
Rxy
Vx
Ryz
Vy
Vz
T J = P DISS R JC + R CA + T AMB
+
Vz
Isource
As can be seen in Figure 5-4, total thermal resistance
RθJA = RθJC + RθCA. This can also be calculated using
Equation 5-6:
FIGURE 5-3:
Electrical Circuit Analogous
to the Thermal Relief.
EQUATION 5-7:
From this simple circuit Vx can be calculated if ISOURCE,
Vz and the resistor values, Rxy and Ryz are known,
using the Equation 5-5:
T J = P DISS R JA + T AMB
EQUATION 5-5:
Because effectively all of the power loss in the
converter is dissipated within the MIC33153 package,
PDISS can be calculated by using Equation 5-8:
V X = I SOURCE R XY + R YZ + V Z
EQUATION 5-8:
Thermal circuits can be considered using these same
rules and can be drawn similarly replacing current
sources with power dissipation (in Watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C):
RTJC
Tj
Tamb
η=
Efficiency taken from Efficiency Curves
EXAMPLE:
+
Tamb
Pdiss
FIGURE 5-4:
Where:
RθJC and RθJA are found in the Section “Operating
Ratings ‡” of the data sheet.
RTCA
Tc
1
P DISS = P OUT --- – 1
Thermal Relief Circuit.
Now replacing the variables in the equation for Vx, we
can find the junction temperature (TJ) from power
dissipation, ambient temperature and the known
thermal resistance of the PCB (RθCA) and the package
(RθJC):
A MIC33153 is intended to drive a 1A load at 1.8V and
is placed on a printed circuit board which has a ground
plane area of at least 25 mm square. The voltage
source is a Li-ion battery with a lower operating
threshold of 3V and the ambient temperature of the
assembly can be up to 50°C.
Summary of variables:
•
•
•
•
•
IOUT = 1A
VOUT = 1.8V
VIN = 3V to 4.2V
TAMB = 50°C
RθJA = 55°C/W
η @ 1A = 80% (worst case with VIN = 4.2V) See
Section 2.0, Typical Performance Curves.
DS20006223B-page 16
2019 - 2022 Microchip Technology Inc.
MIC33153
EQUATION 5-9:
1
P DISS = 1.8 1 --------- – 1 = 0.45W
0.80
The worst case switch and inductor resistance will
increase at higher temperatures, so a margin of 20%
can be added to account for this:
EQUATION 5-10:
P DISS = 0.45 1.2 = 0.54W
Therefore:
TJ =
0.54W x (55°C/W) + 50°C
TJ =
79.7°C
This is well below the maximum 125°C.
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 17
MIC33153
6.0
PACKAGING INFORMATION
6.1
Package Marking Information
14-Lead TDFN
(Fixed Output)*
-X
XXXXX
NNNY
14-Lead TDFN
(Adjustable Output)*
XXX
XXXXX
NNNY
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
-4
33153
415Y
Example
MIC
33153
415Y
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note 1: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space: 6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N
DS20006223B-page 18
2019 - 2022 Microchip Technology Inc.
MIC33153
14-Lead TDFN 3.0 mm x 3.5 mm Recommended Land Pattern
14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN]
With 1.33x1.80 Exposed Pad and Fused Terminals
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
A
14X
A
D
0.08 C
0.10 C
A
B
N
(DATUM A)
(DATUM B)
E
NOTE 1
2X
0.05 C
1
2
2X
A1
TOP VIEW
0.05 C
(A3)
A
SEATING
C
PLANE
K1
(L1)
(D3)
D2
1
VIEW A-A
2
NOTE 1
(E3)
E2
(E4)
K
L
N
14X b
e
0.08
0.05
C A B
C
BOTTOM VIEW
Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2
© 2018 Microchip Technology Inc.
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 19
MIC33153
14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN]
With 1.33x1.80 Exposed Pad and Fused Terminals
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
N
Number of Terminals
e
Pitch
A
Overall Height
Standoff
A1
A3
Terminal Thickness
Overall Length
D
Exposed Pad Length
D2
Exposed Pad Length
D3
E
Overall Width
Exposed Pad Width
E2
E3
Exposed Pad Width
Exposed Pad Width
E4
b
Terminal Width
L
Terminal Length
Terminal Length
L1
Terminal-to-Exposed-Pad
K
Package Center to Exposed-Pad
K1
MIN
1.05
0.00
1.28
1.75
0.20
0.35
0.20
0.12
MILLIMETERS
NOM
14
0.50 BSC
1.10
0.02
0.203 REF
3.50 BSC
1.33
1.20 REF
3.00 BSC
1.80
0.83 REF
1.42 REF
0.25
0.40
0.25 REF
0.17
MAX
1.15
0.05
1.38
1.85
0.30
0.45
0.22
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2
© 2018 Microchip Technology Inc.
DS20006223B-page 20
2019 - 2022 Microchip Technology Inc.
MIC33153
14-Lead Thin Plastic Dual Flat, No Lead Package (HAA) - 3.5x3 mm Body [TDFN]
With 1.33x1.80 Exposed Pad and Fused Terminals
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
G4
X3
G3
G1
X2
G2
Y4
C
Y2
EV
ØV
Y3
G2
G2
Y1
SILK SCREEN
E
X1
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Exposed Pad Width
X2
X3
Exposed Pad Width
Exposed Pad Length
Y2
Exposed Pad Length
Y3
Exposed Pad Length
Y4
Contact Pad Spacing
C
Contact Pad Width (Xnn)
X1
Contact Pad Length (Xnn)
Y1
Contact Pad to Contact Pad
G1
Contact Pad to Exposed Pad
G2
Package Center to Exposed Pad
G3
Package Center to Exposed Pad
G4
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
0.50 BSC
MAX
1.33
1.25
1.80
0.22
0.82
2.80
0.25
0.55
0.25
0.23
0.17
0.38
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-1062 Rev A Sheet 1 of 2
© 2018 Microchip Technology Inc.
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 21
MIC33153
NOTES:
DS20006223B-page 22
2019 - 2022 Microchip Technology Inc.
MIC33153
APPENDIX A:
REVISION HISTORY
Revision A (June 2019)
• Converted Micrel document MIC33153 to Microchip data sheet DS20006223B.
• Minor text changes throughout.
Revision B (April 2022)
• Added new required note below the legend (for
APID and some other former Micrel BUs) in
Section 6.1 “Package Marking Information” to
help clarify the marking codes.
• Updated package type references and package
outline images.
• Minor formatting and text corrections throughout.
2019 - 2022 Microchip Technology Inc.
DS20006223B-page 23
MIC33153
NOTES:
DS20006223B-page 24
2019 - 2022 Microchip Technology Inc.
MIC33153
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
-X
PART NO.
Device
X
Output
Junction
Voltage Temperature
Range
XX
–XX
Package
Option
Media Type
Device:
MIC33153: 4 MHz PWM 1.2A Internal Inductor Buck
Regulator with HyperLight Load® and
Power Good
Output Voltage:
4 = 1.2V
S = 3.3V
Blank = Adjustable
Junction
Temperature Range:
Y
=
–40°C to +125°C
Package:
HJ
=
14-Lead 3.0 mm x 3.5 mm x 1.1 mm TDFN
Media Type:
TR
Examples:
a) MIC33153-4YHJ-TR:
4 MHz PWM 1.2A Internal Inductor
Buck Regulator with HyperLight
Load® and Power Good, 1.2V
Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 14-Lead TDFN
Package, 5000/Reel
b) MIC33153-SYHJ-TR:
4 MHz PWM 1.2A Internal Inductor
Buck Regulator with HyperLight
Load® and Power Good, 3.3V
Fixed Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 14-Lead TDFN
Package, 5000/Reel
c) MIC33153YHJ-TR:
4 MHz PWM 1.2A Internal Inductor
Buck Regulator with HyperLight
Load® and Power Good,
Adjustable Output Voltage,
–40°C to +125°C Junction
Temperature Range, Pb-Free,
RoHS Compliant, 14-Lead TDFN
Package, 5000/Reel
= 5000/Reel
Note: Other output voltage options are available. Contact Factory for
details.
Note 1:
2019 - 2022 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006223B-page 25
MIC33153
NOTES:
DS20006223B-page 26
2019 - 2022 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS".
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION INCLUDING BUT NOT
LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A
PARTICULAR PURPOSE, OR WARRANTIES RELATED TO
ITS CONDITION, QUALITY, OR PERFORMANCE.
IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY
KIND WHATSOEVER RELATED TO THE INFORMATION OR
ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS
BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES
ARE FORESEEABLE. TO THE FULLEST EXTENT
ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON
ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION
OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF
ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP
FOR THE INFORMATION.
Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to
defend, indemnify and hold harmless Microchip from any and
all damages, claims, suits, or expenses resulting from such
use. No licenses are conveyed, implicitly or otherwise, under
any Microchip intellectual property rights unless otherwise
stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud,
CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO,
JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus,
maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo,
MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower,
PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch,
SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash,
Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O,
Vectron, and XMEGA are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AgileSwitch, APT, ClockWorks, The Embedded Control Solutions
Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight
Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3,
Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, TrueTime, WinPath, and ZL are
registered trademarks of Microchip Technology Incorporated in the
U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky,
BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, Espresso T1S,
EtherGREEN, GridTime, IdealBridge, In-Circuit Serial
Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip
Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView,
memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP,
SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI,
SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total
Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY,
ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, Symmcom, and Trusted Time are registered
trademarks of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2019 - 2022, Microchip Technology Incorporated and its subsidiaries.
All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2019 - 2022 Microchip Technology Inc. and its subsidiaries.
ISBN: 978-1-6683-0264-4
DS20006223B-page 27
Worldwide Sales and Service
AMERICAS
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Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 905-695-1980
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DS20006223B-page 28
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Tel: 86-592-2388138
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2019 - 2022 Microchip Technology Inc. and its subsidiaries.
09/14/21
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