MIC33M356
3A, Power Module Buck Converter
with HyperLight Load® Mode and I2C Interface
Features
General Description
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The Microchip MIC33M356 is a I2C programmable,
high-efficiency, low-voltage input, 3A current, synchronous step-down regulator power module with
integrated inductor. The Constant On-Time (COT)
control architecture with HyperLight Load® mode
provides very high efficiency at light loads, while still
having ultra-fast transient response.
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Input Voltage Range: 2.4V to 5.5V
3A Output Current
Multiple Faults Indication through I2C
I2C Programmable:
- Output voltage:
0.6V to 1.28V at 5 mV resolution or
0.6V to 3.84V, 10 and 20 mV resolution
- Slew rate: 0.2 ms/V to 3.2 ms/V
- On-time (switching frequency)
- High-side current limit: 3.5A or 5A
- Enable delay: 0.2 ms-3 ms
- Output discharge when disabled (EN = GND)
High Efficiency (up to 95%)
Ultra-Fast Transient Response
±1.5% Output Voltage Accuracy Over
Line/Load/Temperature Range
Safe Start-up with Pre-Biased Output
Typical 1.5 µA Shutdown Supply Current
Low Dropout (100% Duty Cycle) Operation
I2C Speed Up to 3.4 MHz
Latch-Off Thermal Shutdown Protection
Latch-Off Current Limit Protection
Power Good (PG) Open-Drain Output
Meets the CISPR32 Class B Emissions
Applications
• Solid-State Drives (SSD)
• Tablets, Notebooks and Ultrabooks
• FPGAs, DSP and Low-Voltage ASIC Power
The I2C interface allows programming the output voltage between 0.6V and 1.28V, with 5 mV resolution or
between 0.6V and 3.84V, with 10 mV and 20 mV resolution. Two different default voltage options (0.9V and
1.0V) are provided so that the application can be
started with a safe voltage level and then moved to
high-performance modes under I2C control.
An open-drain Power Good output facilitates output
voltage monitoring and sequencing. If set in shutdown
(EN = GND), the MIC33M356 typically draws 1.5 µA of
current, while the output is discharged through a 10
pull-down resistor (if the output discharge feature is
enabled).
The MIC33M356 pinout is compatible with the
Microchip MIC33M350, so that applications can be
easily converted.
The 2.4V to 5.5V input voltage range, low shutdown and
quiescent currents make the MIC33M356 ideal for
single-cell Li-Ion battery-powered applications. The 100%
duty cycle capability provides low dropout operation,
extending operating range in portable systems.
The MIC33M356 is available in a thermally-efficient,
24-lead, 3.0 mm × 4.5 mm × 1.8 mm QFN package,
with an operating junction temperature range of -40°C
to +125°C.
FIGURE 1:
Radiated Emissions,
CISPR32, Class B (VIN = 5V, VOUT = 1V,
IOUT = 3A).
2020 Microchip Technology Inc.
DS20006349A-page 1
MIC33M356
Typical Application
MIC33M356
SVIN
SW
1 µF
VIN
2.4V to 5.5V
VOUT
1.0V/3A
OUT
PVIN
47 µF
22 µF
0.1 µF
PGND
EN
EN
24Nȍ
VIN
VIN
24Nȍ
VIN
AGND
100k
VOUT
SDA
SDA
SCL
SCL
PG
Power Good
Package Type
3*1'
3*1'
3*1'
6:
6:
6:
6:
6:
MIC33M356 Top View
24-Pin QFN 3 mm × 4.5 mm
(3B6:
$*1'
(3B3*1'
6:
3*1'
(3B3*1'
9287
3*1'
3*
287
(1
6'$
6&/
69,1
39,1
287
287
287
287
(3B287
*Includes Exposed Thermal Pads (EP); see Table 3-1.
Ordering Information
Default Status at Power-up
Part Number
High-Side
Output
Current Limit
Voltage
(typical)
TON[1:0]
(ns)
Soft Start Overtemp
Speed
Latch-Off
Output
Pull-Down
when Disabled
Output Voltage
Range/Step
MIC33M356-HAYMP
1.0V
5A
[10] = 130 ns 800 µs/V
Latch-Off
after 4 OT
Cycles
Yes
0.600V-1.280V/5 mV
MIC33M356-FAYMP
0.9V
5A
[10] = 130 ns 800 µs/V
Latch-Off
after 4 OT
Cycles
Yes
0.600V-1.280V/5 mV
MIC33M356-SAYMP
1.0V
5A
[10] = 130 ns 800 µs/V
Latch-Off
after 4 OT
Cycles
Yes
0.600V-1.280V/10 mV
1.280V-3.840V/20 mV
DS20006349A-page 2
2020 Microchip Technology Inc.
MIC33M356
Functional Block Diagram
MIC33M356
SVIN
1 µF
TON
ADJUST
10ȍ
PVIN
MINIMUM
TOFF
UVLO
VIN
2.4V to 5.5V
22 µF
HSD
2.225V/
2.072V
Control
Logic
EN
OT
SW
L1
0.47 µH
165°C/143°C
PD
OUT
47 µF 0.1µF
ZC
VOUT
0.6V-3.84V
/3A
PVIN
RIPPLE
INJECTION
LSD
PGND
COMP
EA
I2C
CONTROL
AND
REGISTERS
SDA
SCL
8-Bit
DAC
VREF
PD
VIN
100k
PG
AGND
PG
VREF -9%
DELAY
2020 Microchip Technology Inc.
DS20006349A-page 3
MIC33M356
NOTES:
DS20006349A-page 4
2020 Microchip Technology Inc.
MIC33M356
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
SVIN, PVIN to AGND ...................................................................................................................................... -0.3V to +6V
VSW to AGND ................................................................................................................................................ -0.3V to +6V
VEN to AGND ................................................................................................................................................ -0.3V to PVIN
VPG to AGND ................................................................................................................................................ -0.3V to PVIN
VSDA, VSCLto AGND ..................................................................................................................................... -0.3V to PVIN
PVIN to SVIN .............................................................................................................................................. -0.3V to +0.3V
AGND to PGND ........................................................................................................................................... -0.3V to +0.3V
Junction Temperature........................................................................................................................................... +150°C
Storage Temperature (TS)...................................................................................................................... -65°C to +150°C
Lead Temperature (soldering, 10s) ...................................................................................................................... +260°C
ESD Rating (Note 1)
HBM ....................................................................................................................................................................... 2000V
CDM ....................................................................................................................................................................... 1500V
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Note 1: Devices are ESD-sensitive. Handling precautions recommended. Human body model, 1.5 k in series with
100 pF.
Operating Ratings(1)
Supply Voltage (PVIN) .................................................................................................................................. 2.4V to 5.5V
Enable Voltage (VEN) ...................................................................................................................................... 0V to PVIN
Power Good (PG) Pull-up Voltage (VPU_PG)................................................................................................... 0V to 5.5V
Maximum Output Current............................................................................................................................................. 3A
Junction Temperature (TJ)...................................................................................................................... -40°C to +125°C
Note 1: The device is not ensured to function outside the operating range.
2020 Microchip Technology Inc.
DS20006349A-page 5
MIC33M356
ELECTRICAL CHARACTERISTICS(1,2)
Electrical Specifications: Unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
VIN Supply
Input Range
PVIN
2.4
—
5.5
V
Undervoltage Lockout
Threshold
UVLO
2.15
2.225
2.35
V
SVIN rising
Undervoltage Lockout
Hysteresis
UVLO_H
—
153
—
V
SVIN falling
IIN0
—
60
100
µA
VFB = 1.2V, non-switching
ISHDN
—
1.5
10
µA
VEN = 0V, PVIN = SVIN = 5.5V,
VSW = VSDA = VSCL = 0V,
-40°C TJ +105°C
20
µA
VEN = 0V, PVIN = SVIN = 5.5V,
VSW = VSDA= VSCL = 0V,
-40°C TJ +125°C
VOUT of 0.6V to 1.28V (includes
line and load regulation)
Operating Supply Current
Shutdown Current
Output Voltage
Output Accuracy
VOUT_ACC
-1.5
—
1.5
%
Output Voltage Step
(options HAYMP, FAYMP)
VOUT_STEP
—
5
—
mV
VOUT from 0.6V to 1.28V
Output Voltage Step
(option SAYMP)
VOUT_STEP
—
10
—
mV
VOUT of 0.6V to 1.28V
VOUT of 1.28V to 3.84V
—
20
—
Line Regulation
—
0.06
—
%
VOUT = 1.0V, VIN = 2.5 to 5.5V,
IOUT = 300 mA
Load Regulation
—
0.2
—
%
VOUT = 1.0V, IOUT = 0A to 3A
Enable Control
EN Logic Level High
VEN_H
1.2
—
—
V
VEN rising, regulator enabled
EN Logic Level Low
VEN_L
—
—
0.4
V
VEN falling, regulator shutdown
EN Low Input Current
IEN_L
—
0.01
500
nA
VEN = 0V
EN High Input Current
IEN_H
—
0.01
500
nA
VEN = 5.5V
0.15
0.25
0.4
ms
EN_DELAY[1:0] = 00; default
0.85
1
1.20
ms
EN_DELAY[1:0] = 01
1.70
2
2.35
ms
EN_DELAY[1:0] = 10
2.55
3
3.5
ms
EN_DELAY[1:0] = 11
Enable Delay (Two Bits)
Enable Lockout Delay
Note 1:
2:
3:
Specification for packaged product only.
Characterized in open loop.
Tested in open loop. The closed-loop current limit is affected by inductance value, input voltage and
temperature.
DS20006349A-page 6
2020 Microchip Technology Inc.
MIC33M356
ELECTRICAL CHARACTERISTICS(1,2) (CONTINUED)
Electrical Specifications: Unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
100
200
300
µs/V
SLEW_RATE[3:0] = 0000
250
400
550
µs/V
SLEW_RATE[3:0] = 0001
400
600
800
µs/V
SLEW_RATE[3:0] = 0010
600
800
1000
µs/V
SLEW_RATE[3:0] = 0011; default
750
1000
1250
µs/V
SLEW_RATE[3:0] = 0100
950
1200
1450
µs/V
SLEW_RATE[3:0] = 0101
Internal DAC Slew Rate (Four Bits)
Slew Rate Time (Time to 1V)
TRISE
1100
1400
1700
µs/V
SLEW_RATE[3:0] = 0110
1300
1600
1900
µs/V
SLEW_RATE[3:0] = 0111
1450
1800
2150
µs/V
SLEW_RATE[3:0] = 1000
1650
2000
2350
µs/V
SLEW_RATE[3:0] = 1001
1800
2200
2600
µs/V
SLEW_RATE[3:0] = 1010
2000
2400
2800
µs/V
SLEW_RATE[3:0] = 1011
2180
2600
3020
µs/V
SLEW_RATE[3:0] = 1100
2350
2800
3250
µs/V
SLEW_RATE[3:0] = 1101
2520
3000
3480
µs/V
SLEW_RATE[3:0] = 1110
2690
3200
3710
µs/V
SLEW_RATE[3:0] = 1111
—
260
—
ns
VOUT = 1V, TON[1:0] = 00
—
180
—
VOUT = 1V, TON[1:0] = 01
—
130
—
VOUT = 1V, TON[1:0] = 10
—
105
—
—
1.7
—
MHz
VOUT = 1V, TON[1:0] = 10,
IOUT = 3A
—
2.2
—
MHz
VOUT = 3.3V, TON[1:0] = 10,
IOUT = 3A
DCMAX
—
100
—
%
High-Side MOSFET Forward
Current Limit (Note 3)
ILIM_HS
2.1
3.5
4.9
A
4.0
5.0
6.5
Low-Side MOSFET Forward
Current Limit (Note 3)
ILIM_LS
—
3.0
—
—
4.2
—
Low-Side MOSFET Negative
Current Limit
ILIM_NEG
-2
-3
-4
A
IZC_TH
—
0.9
—
A
HICCUP
—
8
—
Cycles
—
—
1
—
ms
TON Control/Switching Frequency (Two Bits)
Switching On Time
Switching Frequency
Maximum Duty Cycle
TON
FREQ
VOUT = 1V, TON[1:0] = 11
Short-Circuit Protection
N-Channel Zero-Crossing
Threshold
Current Limit Pulses before
Hiccup
Hiccup Period before Restart
Note 1:
2:
3:
ILIM = 0
ILIM = 1
A
ILIM = 0
ILIM = 1
Specification for packaged product only.
Characterized in open loop.
Tested in open loop. The closed-loop current limit is affected by inductance value, input voltage and
temperature.
2020 Microchip Technology Inc.
DS20006349A-page 7
MIC33M356
ELECTRICAL CHARACTERISTICS(1,2) (CONTINUED)
Electrical Specifications: Unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameter
Symbol
Min.
Typ.
Max.
Units
Conditions
High Side On Resistance
RDS-ON-HS
—
30
60
mΩ
ISW = 1A
Low Side On Resistance
RDS-ON-LS
—
16
40
mΩ
ISW = -1A
RDS-ON-DSC
—
10
50
Ω
VEN = 0V, VSW = 5.5V, from VOUT
to PGND
ILEAK_SW
—
1
10
µA
PVIN = 5.5V, VSW = 0V, VEN = 0V,
flowing out of SW pin
PG Threshold
PG_TH
87
91
95
%VOUT VOUT rising (good)
PG Hysteresis
PG_HYS
—
4
—
%VOUT VOUT falling
Internal MOSFETs
Output Discharge Resistance
SW Leakage Current
Power Good (PG)
PG Blanking time
PG_BLANK
—
65
—
µs
PG Output Leakage Current
PG_LEAK
—
30
300
nA
VOUT = VOUT(NOM), VPG = 5.5V
PG Sink Low Voltage
PG_SINKV
—
—
200
mV
VOUT = 0V, IPG= 10 mA
I2C Interface (SCL, SDA)
Low-Level Input Voltage
VIL
0
—
0.4
V
SVIN = 5.5V
High-Level Input Voltage
VIH
1.2
—
5.5
V
SVIN = 5.5V
High-Level Input Current
II2C_H
-1
0.01
1
µA
Low-Level Input Current
II2C_L
-1
0.01
1
µA
Logic 0 Output Voltage
VOL
—
—
0.4
V
ISDA = 3 mA, ISCL = 3 mA
SCL, SDA Pin Capacitance
I2C_CAP
—
0.7
—
pF
SDA Pull-Down Resistance
SDA_PD
—
80
—
Ω
SCL_CLOCK
—
100
—
kHz
Standard mode
—
400
—
kHz
Fast mode
—
3.4
—
MHz
High-Speed mode
TSHDN
—
+165
—
°C
I2C
Interface Timing
Maximum SCL Clock
Frequency
Thermal Shutdown
Thermal Shutdown
Thermal Shutdown Hysteresis
TJ rising
TSHDN_HYST
—
+22
—
°C
TJ falling
Thermal Warning Threshold
TThWrn
—
+118
—
°C
TJ rising
Thermal Latch-Off Soft Start
Cycles
TH_LATCH
—
4
—
—
Note 1:
2:
3:
Specification for packaged product only.
Characterized in open loop.
Tested in open loop. The closed-loop current limit is affected by inductance value, input voltage and
temperature.
DS20006349A-page 8
2020 Microchip Technology Inc.
MIC33M356
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, PVIN = 5V; VOUT = 1.0V, COUT = 47 µF, TA = +25°C.
Boldface values indicate -40°C TJ +125°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Junction Temperature
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
JA
—
+36
—
°C/W
Conditions
Temperature Ranges
Package Thermal Resistances
Thermal Resistance,
24-Lead 3 mm × 4.5 mm QFN
2020 Microchip Technology Inc.
DS20006349A-page 9
MIC33M356
NOTES:
DS20006349A-page 10
2020 Microchip Technology Inc.
MIC33M356
2.0
TYPICAL CHARACTERISTIC CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
Operating Supply Current (μA)
Operating Supply Current (μA)
61
VOUT = 1.0V
IOUT = 0 mA
HLL mode
60
59
58
57
56
55
54
75
70
65
60
55
50
-40 -25 -10
3
3.5
VIN (V)
4
4.5
5
FIGURE 2-1:
Operating Supply Current
vs. Input Voltage, Switching.
35
RDS-ON (mΩ)
ILIM = 3.5A
VIN = 5.0V
VOUT = 1V
2
65
80
95 110 125
High Side ON-Resistance
25
20
15
Low Side ON-Resistance
10
5
0
1
-40
-25
-10
5
20
35
50
65
80
95
110
125
-40 -25 -10
Ambient Temperature (°C)
5
20
35
50
65
80
95 110 125
Ambient Temperature (°C)
FIGURE 2-2:
High-Side Current Limits vs.
Temperature (VOUT = 1.0V), Closed Loop.
RDS(on) vs. Temperature.
FIGURE 2-5:
9
100
8
90
7
Efficiency (%)
High Side Current Limit (A)
50
30
ILIM = 5A
3
ILIM = 5A
5
4
35
40
5
6
20
FIGURE 2-4:
No Load Operating Supply
Current vs. Temperature, Switching.
7
4
5
Ambient Temperature (°C)
8
6
VOUT = 1.0V
45
53
2.5
High Side Current Limit (A)
80
ILIM = 3.5A
3
VIN = 5.0V
VOUT = 3.3V
2
1
-40 -25 -10
5
20
35
50
65
80
95 110 125
80
VIN = 2.5V
70
60
50
40
VIN = 5.0V
30
20
VIN = 3.3V
0
0.001
2020 Microchip Technology Inc.
0.01
0.1
1
IOUT (A)
Ambient Temperature (°C)
FIGURE 2-3:
High-Side Current Limits vs.
Temperature (VOUT = 3.3V), Closed Loop.
VOUT = 0.6V
HLL
FPWM
10
FIGURE 2-6:
(VOUT = 0.6V).
Efficiency vs. Load Current
DS20006349A-page 11
MIC33M356
Note: Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
VOUT = 1V
2
Efficiency (%)
90
80
70
60
VIN = 5.0V
50
40
30
VIN = 3.3V
VIN = 2.5V
20
VOUT = 1V
HLL
FPWM
10
0
0.001
0.01
0.1
Output Current (A)
100
1.5
1
TON[1:0] = 11
TON[1:0] = 10
TON[1:0] = 01
0.5
1
TON[1:0] = 00
0
IOUT (A)
2.5
3.5
5.5
4.5
VIN (V)
FIGURE 2-7:
(VOUT = 1.0V).
Efficiency vs. Load Current
FIGURE 2-10:
vs. VIN.
0.08
Efficiency (%)
90
80
70
VIN = 5.0V
60
VIN = 3.3V
40
30
20
VOUT = 2.5V
HLL
FPWM
10
0
0.001
0.01
0.1
Output Voltage Variation (%)
100
50
DCM/FPWM IOUT Threshold
FPWM mode
IOUT = 300 mA
0.06
VOUT = 0.6V
VOUT = 1.0V
VOUT = 1.28V
0.04
0.02
0
2.4
1
2.9
3.4
FIGURE 2-8:
(VOUT = 2.5V).
3.9
4.4
4.9
VIN (V)
IOUT (A)
Efficiency vs. Load Current
FIGURE 2-11:
Line Regulation: Output
Voltage Variation vs. Input Voltage.
Efficiency (%)
90
80
70
60
VIN = 5.0V
50
40
30
20
VOUT = 3.3V
HLL
FPWM
10
0
0.001
0.01
0.1
1
IOUT (A)
FIGURE 2-9:
(VOUT = 3.3V).
DS20006349A-page 12
Efficiency vs. Load Current
Output Voltage Variation(%)
100
0.14
FPWM mode
VIN = 5V
0.12
0.1
VOUT = 0.6V
VOUT = 1.0V
VOUT = 1.28V
0.08
0.06
0.04
0.02
0
0
1
2
3
IOUT (A)
FIGURE 2-12:
Load Regulation: Output
Voltage Variation vs. IOUT.
2020 Microchip Technology Inc.
MIC33M356
Note: Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
3.0
VOUT = 0.6V
VIN = 5.0V
TON[1:0]= 11
1.9
Switching Frequency (MHz)
Switching Frequency (MHz)
2.2
TON[1:0] = 10
TON[1:0] = 01
1.6
TON[1:0] = 00
1.3
1
0.7
0
1
2
VOUT = 0.6V
IOUT = 1A
2.5
TON[1:0] = 10
TON[1:0] = 11
TON[1:0] = 00
TON[1:0] = 01
2.0
1.5
1.0
0.5
2.5
3
3.5
FIGURE 2-13:
Switching Frequency vs.
IOUT (VOUT = 0.6V).
3.5
Switching Frequency (MHz)
Switching Frequency (MHz)
VOUT = 1V
VIN = 5.0V
TON[1:0] = 11
TON[1:0] = 10
1.5
1.2
TON[1:0] = 01
0.9
TON[1:0] = 00
0.6
0
1
5.5
FIGURE 2-16:
Switching Frequency vs.
VIN (VOUT = 0.6V).
2.1
1.8
4.5
VIN (V)
IOUT (A)
2
3.0
VOUT = 1.0V
IOUT = 1A
TON[1:0] = 10
2.5
TON[1:0] = 11
2.0
1.5
TON[1:0] = 00 TON[1:0] = 01
1.0
0.5
2.5
3
3.5
IOUT (A)
4.5
5.5
VIN (V)
FIGURE 2-14:
Switching Frequency vs.
IOUT (VOUT = 1.0V).
FIGURE 2-17:
Switching Frequency vs.
VIN (VOUT = 1.0V).
Switching Frequency (MHz)
Switching Frequency (MHz)
4.0
VOUT = 1.28V
VIN = 5.0V
2.3
TON[1:0] = 11
1.7
TON[1:0] = 10
TON[1:0] = 01
1.1
TON[1:0] = 00
0.5
0
1
2
IOUT (A)
FIGURE 2-15:
Switching Frequency vs.
IOUT (VOUT = 1.28V).
2020 Microchip Technology Inc.
3
3.5
VOUT = 3.3V
IOUT = 1A
TON[1:0] = 11
TON[1:0] = 10
3.0
2.5
2.0
1.5
TON[1:0] = 00 TON[1:0] = 01
1.0
0.5
4.0
4.5
5.0
5.5
VIN (V)
FIGURE 2-18:
Switching Frequency vs.
VIN (VOUT = 3.3V).
DS20006349A-page 13
MIC33M356
Note: Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
VIN
5V/div
EN
5V/div
VOUT
500 mV/div
VOUT
500 mV/div
SW
5V/div
PG
5V/div
PG
5V/div
IO
2A/div
80 µs/div
2 ms/div
FIGURE 2-19:
VIN Turn-On (EN = PVIN).
VIN
5V/div
FIGURE 2-22:
EN Turn-Off, RLOAD = 0.3.
EN
5V/div
VOUT
500 mV/div
VOUT
500 mV/div
PG
5V/div
PG
5V/div
SW
5V/div
SW
5V/div
400 µs/div
FIGURE 2-20:
RLOAD = 0.3.
VIN Turn-Off (EN = PVIN),
EN
2V/div
1 ms/div
FIGURE 2-23:
EN Turn-On into Pre-Biased
Output (Vpre-bias = 0.8V).
EN
5V/div
VOUT
500 mV/div
VOUT
500 mV/div
PG
5V/div
PG
5V/div
IO
2A/div
SW
5V/div
2 ms/div
2 ms/div
FIGURE 2-21:
DS20006349A-page 14
EN Turn-On, RLOAD = 0.3.
FIGURE 2-24:
Power-up into Short Circuit.
2020 Microchip Technology Inc.
MIC33M356
Note: Unless otherwise indicated, PVIN = 5V, VOUT = 1V, COUT = 47 µF, TA = +25°C.
VOUT
1V/div
VIN
5V/div
VOUT
50 mV/div
IOUT
5A/div
PG
5V/div
SW
5V/div
SW
5V/div
IO
5A/div
1 µs/div
2 ms/div
FIGURE 2-25:
Threshold.
Output Current Limit
FIGURE 2-28:
IOUT = 3A.
Switching Waveforms –
Step from 0.5A to 3A
PG
5V/div
VOUT
1V/div
VOUT
100 mV/div
AC coupled
IO
5A/div
SW
5V/div
SW
5V/div
IOUT
5A/div
PG
5V/div
1 ms/div
80 µs/div
FIGURE 2-26:
Hiccup Mode Short-Circuit
Current Limit Response.
VIN
5V/div
VOUT
50 mV/div
SW
5V/div
FIGURE 2-29:
Load Transient Response.
Step from 4.5V to 5.5V
PG
5V/div
VIN
2V/div
VOUT
10 mV/div
IO
2A/div
IO
50 mA/div
1 ms/div
1 µs/div
FIGURE 2-27:
Switching Waveforms –
IOUT = 50 mA, HLL.
2020 Microchip Technology Inc.
FIGURE 2-30:
Line Transient Response.
DS20006349A-page 15
MIC33M356
NOTES:
DS20006349A-page 16
2020 Microchip Technology Inc.
MIC33M356
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Symbol
Description
1, 2, 3, 10, 11
PGND
4, 5, 6, 7, 8, 9
SW
Switch Node pins. SW connects to the internal MOSFETs and inductor. Do
not connect any external load to this point.
17
PVIN
Power Supply Voltage pin.
18
SVIN
Analog Voltage Input pin. The power to the internal reference and control
sections of the MIC33M356. A 1.0 μF ceramic capacitor from SVIN to GND
must be used. Internally connected to PVIN through a 10 resistor.
19
SCL
I2C Clock (Input) pin. I2C Serial bus clock open-drain input.
20
SDA
I2C Data (Input/Output) pin. I2C serial bus data bidirectional pin.
21
EN
Enable (Input) pin. Logic high enables operation of the regulator. The EN
pin should not be left open.
22
PG
Power Good (Output) pin. This is an open-drain output that indicates when
the output voltage is lower than the 91% limit.
23
VOUT
Output Voltage Sense (Input) pin. This pin is used to remotely sense the
output voltage. Connect VOUT as close to the output capacitor as possible
to sense output voltage. Also provides the path to discharge the output
through an internal 10 resistor when disabled.
12, 13, 14, 15, 16
OUT
Power Output Side Connection pins.
24
AGND
Analog Ground pin. Internal signal ground for all low-power circuits.
Power Ground pins. PGND is the ground path for the MIC33M356 power
module.
25
EP1_PGND
Exposed Thermal Pad pin. Internally connected to PGND.
26
EP2_PGND
Exposed Thermal Pad pin. Internally connected to PGND.
27
EP_SW
Exposed Thermal Pad pin. Internally connected to SW Node.
28
EP_OUT
Exposed Thermal Pad pin. Internally connected to output side.
2020 Microchip Technology Inc.
DS20006349A-page 17
MIC33M356
3.1
Switch Node Pin (SW)
Switching node output pin which connects to the internal
MOSFETs and inductor. This is a high-frequency
connection. Traces should be kept as short and as wide
as practical.
3.2
Power Ground Pin (PGND)
PGND is the ground path for the MIC33M356 buck
converter power stage. The PGND pin connects to the
sources of the low-side N-channel MOSFET, the negative terminals of input capacitors and the negative
terminals of output capacitors. The loop for the Power
Ground should be as small as possible and separate
from the Analog Ground (AGND) loop.
3.3
Input Voltage Pin (PVIN)
Input supply to the source of the internal high-side
P-channel MOSFET. The PVIN operating voltage range
is 2.4V to 5.5V. An input capacitor between PVIN and
the Power Ground (PGND) pin is required and placed as
close as possible to the IC.
3.4
I2C Clock Input Pin (SCL)
Power Good Pin (PG)
This is an open-drain output that indicates when the
rising output voltage is higher than the 91% threshold.
There is a 4% hysteresis, therefore PG will return low
when the falling output voltage falls below 87% of the
target regulation voltage.
3.9
Output Voltage Sense Pin (VOUT)
This pin is used to remotely sense the output voltage.
Connect to VOUT as close to the output capacitor as
possible to sense the output voltage. Also provides the
path to discharge the output through an internal 10
resistor when the device is disabled.
3.10
Analog Ground Pin (AGND)
Internal signal ground for all low-power circuits.
Connect to ground plane. For best load regulation, the
connection path from AGND to the output capacitor
ground terminal should be free from parasitic voltage
drops.
3.11
Analog Voltage Input Pin (SVIN)
The power to the internal reference and control
sections of the MIC33M356. A 1.0 µF ceramic
capacitor from SVIN to ground must be used. Internally
connected to PVIN through a 10 resistor.
3.5
3.8
PGND Exposed Pads (EP1_PGND,
EP2_PGND)
Electrically connected to PGND pins. Connect with
thermal vias to the ground plane to ensure adequate heat
sinking.
3.12
SW Exposed Pad (EP_SW)
Electrically connected to the SW Node.
The SCL pin is the serial interface Serial Clock pin. This
pin is connected to the host controller SCL pin.
3.13
The MIC33M356 is a slave device, so its SCL pin is
only an input.
Electrically connected to the OUT pins. Must be
externally connected to the output power connection.
3.6
OUT Exposed Pad (EP_OUT)
I2C Data Input/Output Pin (SDA)
The SDA pin is the serial interface Serial Data pin. This
pin is connected to the host controller SDA pin. The
SDA pin has an open-drain N-channel driver.
3.7
Enable Pin (EN)
Logic high enables operation of the regulator. Logic low
will shut down the device. In the OFF state, supply
current of the device is greatly reduced (typically
1.5 µA). The EN pin should not be left open.
DS20006349A-page 18
2020 Microchip Technology Inc.
MIC33M356
4.0
FUNCTIONAL DESCRIPTION
4.1
Device Overview
The Microchip MIC33M356 is a I2C programmable,
high-efficiency, low-voltage input, 3A current synchronous step-down regulator power module with
integrated inductor. The Constant On-Time (COT)
control architecture with automatic HyperLight Load
mode provides very high efficiency at light loads and
ultra-fast transient response.
The MIC33M356 output voltage is programmed
through the I2C interface in the range of 0.6V to 1.28V
with 5 mV resolution (options HAYMP and FAYMP), or
between 0.6V and 3.84V (option SAYMP). The SAYMP
variant has a 10 mV resolution from 0.6V, up to 1.28V
and 20 mV resolution, from 1.28V to and 3.84V.
The 2.4V to 5.5V input voltage operating range makes
the device ideal for single-cell Li-ion battery-powered
applications. Automatic HyperLight Load mode
provides very high efficiency at light loads.
This device focuses on high output voltage accuracy.
Total output error is less than 1.5% over line, load and
temperature.
The MIC33M356 buck regulator uses an adaptive
Constant On-Time control method. The adaptive
on-time control scheme is employed to obtain a nearly
constant switching frequency in Continuous Conduction mode. Overcurrent protection is implemented by
sensing the current on both the low-side and high-side
internal power MOSFETs. The device includes an internal soft start function, which reduces the power supply
input surge current at start-up by controlling the output
voltage rise time.
4.2
HyperLight Load® Mode (HLL)
HLL mode is a power-saving switching mode. In HLL
mode, the switching frequency is not constant over the
operation current range. At light loads, the fixed
on-time operation, coupled with low-side MOSFET
diode emulation, causes the switching frequency to
decrease. This reduces switching and drive losses, and
increases efficiency. The HLL Switching mode can be
disabled for reduced output ripple and low noise by
setting the FPWM bit in the CTRL2 register.
4.3
Enable (EN pin)
When the EN pin is pulled low, the IC is in a Shutdown
state with all internal circuits disabled and with the
Power Good output (PG) low. During shutdown, the
part typically consumes 1.5 µA. When the EN pin is
pulled high, the start-up sequence is initiated. There is
a programmable enable delay that is used to delay the
start of the output ramp. The enable delay timer can be
programmed to one of four time intervals of 0.25 ms,
1 ms, 2 ms or 3 ms in the CTRL1 register. Note that if
the 0 ms delay setting is chosen, there is an internal
delay of 250 µs before the part will start to switch in
order to bias up internal circuitry.
4.4
I2C Programming
The MIC33M356 behaves as an I2C slave, accessible
at 0x5B (7-bit addressing).
The I2C interface remains active and the MIC33M356
can be programmed whether the Enable pin is high or
low, as long as the input voltage is above the UVLO
threshold. This feature is useful in applications where a
housekeeping MCU preconfigures the MIC33M356
before enabling power delivery. The registers do not
get reset when the Enable pin is low. The output voltage can be programmed to a new value with I2C,
regardless of the EN pin status. If the EN pin is high, the
output voltage will move to the newly programmed
value on the fly with the programmed slew rate.
4.5
Power Good (PG)
The Power Good output is generally used for power
sequencing where the Power Good output is tied to the
enable output of another regulator. This technique
avoids all the regulators powering up at the same time,
causing large inrush current.
The Power Good output is an open-drain output.
During start-up, when the output voltage is rising, the
Power Good output goes high by means of an external
pull-up resistor when the output voltage reaches 91%
of its set value. The Power Good threshold has 4%
hysteresis, so the Power Good output stays high until
the output voltage falls below 87% of the set value. A
built-in 65 µs blanking time is incorporated to prevent
nuisance tripping.
The pull-up resistor from the PG pin can be connected
to VIN, VOUT or an external source that is less than or
equal to VIN. The PG pin can be connected to another
regulator’s Enable pin for sequencing of the outputs.
The PG output is deasserted as soon as the Enable pin
is pulled low or an input undervoltage condition, or any
other Fault is detected.
2020 Microchip Technology Inc.
DS20006349A-page 19
MIC33M356
4.6
Output Soft Discharge Option
To ensure a known output condition when the device is
turned off and back on again, the output is actively
discharged to ground by means of an internal 10
resistor. The active discharge resistor can be enabled
or disabled through I2C in the CTRL2 register.
4.7
Output Voltage Setting
The MIC33M356 output voltage has an 8-bit control
DAC that can be programmed from 0.6V to 1.28V in
5 mV increments for part options: -HAYMP, -FAYMP.
Option -SAYMP can be programmed from 0.6V, up to
1.28V with 10 mV resolution and from 1.28V, up to
3.84V with 20 mV resolution. This can be programmed
in the MIC33M356 Output Voltage Control register.
The output voltage sensing pin, VOUT, should be
connected exactly to the desired Point-of-Load (POL)
regulation, avoiding parasitic resistive drops.
4.8
Converter Stability, Output
Capacitor
The MIC33M356 utilizes an internal compensation
network and it is designed to provide stable operation
with output capacitors from 47 µF to 1000 µF. This
greatly simplifies the design where supplementary output capacitance can be added without having to worry
about stability.
4.9
Soft Start
Excess bulk capacitance on the output can cause
excessive input inrush current. The MIC33M356
internal soft start feature forces the output voltage to
rise gradually, keeping the inrush current at reasonable
levels. This is particularly important in battery-powered
applications. The ramp rate can be set in the CTRL2
register by means of the SLEW_RATE[3:0] bits.
When the Enable pin goes high, the output voltage
starts to rise. Once the soft start period has finished,
the Power Good comparator is enabled, and if the
output voltage is above 91% of the nominal regulation
voltage, then the Power Good output goes high.
The output voltage soft start time is determined by the
soft start equation below. The Soft Start Time (tSS) can
be calculated using Equation 4-1.
4.10
The MIC33M356 can deliver 100% duty cycle. To
achieve 100% duty cycle, the high-side switch is
latched on when the duty cycle reaches around 92%
and stays latched until the output voltage falls 4%
below its regulated value. This feature is especially
useful in battery-operated applications. It is recommended that this feature is enabled, together with the
highest TON setting, corresponding to the lowest
switching frequency (TON[1:0] = 00 in the CTRL1
register). The high-side latch circuitry can be disabled
by setting the DIS_100PCT bit in the CTRL2 register
to ‘1’.
4.11
Switching Frequency
The switching frequency of the MIC33M356 is indirectly
set by programming the TON value. Equation 4-2
provides an estimation for the resulting switching
frequency:
EQUATION 4-2:
VOUT
1
fSW = --------------- ---------VIN
T ON
Equation 4-2 is only valid in Continuous Conduction
mode and for a lossless converter. In practice, losses
will cause an increase of the switching frequency with
respect to the ideal case. As the load current increases,
losses will increase too and so will the switching
frequency.
The on-time calculation is adaptive, in that the TON
value is modulated based on the input voltage and on
the target output voltage to stabilize the switching
frequency against their variations. Losses are not
accounted for.
The table below highlights the resulting On-Time (TON)
for typical output voltages:
TON[1:0] Setting
VIN (V) VOUT (V)
5
EQUATION 4-1:
tSS = V OUT tRAMP
tSS = 1.0V 800 s V
100% Duty Cycle Operation
3.3
00
01
10
11
0.6
140
110
100
80
1
260
180
130
105
1.8
520
340
200
150
2.5
740
490
260
190
3.3
930
610
310
220
1
380
270
170
130
tSS = 800 s = 0.8 ms
Where:
VOUT = 1.0V
tRAMP = 800 µs/V
DS20006349A-page 20
2020 Microchip Technology Inc.
MIC33M356
4.12
Undervoltage Protection (UVLO)
Undervoltage protection ensures that the IC has
enough voltage to bias the internal circuitry properly
and provide sufficient gate drive for the power
MOSFETs. When the input voltage starts to rise, both
power MOSFETs are off and the Power Good output is
pulled low. The IC starts at approximately 2.225V typical and has a nominal 153 mV of hysteresis to prevent
chattering between the UVLO High and Low states.
4.13
Overtemperature Fault
The MIC33M356 monitors the die junction temperature
to keep the IC operating properly. If the IC junction
temperature exceeds +118°C, the warning flag,
“OT_WARN”, is set, but does not affect the operation
mode. It automatically resets if the junction temperature
drops below the temperature threshold. If the IC junction
temperature exceeds +165°C, both power MOSFETs
are immediately turned off. The IC is allowed to start
when the die temperature falls below +143°C.
During the Fault condition, several changes will occur
in the STATUS register. The OT bit will go high,
indicating that the junction temperature has reached
+165°C, while the OT_WARN flag automatically resets.
If the controller is enabled to restart after the first
thermal shutdown event (OT_LATCH bit in register
CTRL2 is set), the SSD bit will go low and the hiccup bit
will go high. Finally, the PG bit in the FAULT register
(address 0x03) will go low, and the PG pin will be pulled
low until the output voltage has restarted and is once
again in regulation. The I2C interface remains active
and all register values are maintained. When the die
temperature decreases below the lower thermal
shutdown threshold, and the MIC33M356 resumes
switching with the output voltage going back in
regulation, the global Power Good output is pulled high,
but the Overtemperature Fault bit, OT, is still set to ‘1’.
To clear the Fault, either recycle input power or write a
logic ‘0’ to the Overtemperature Fault bit, OT, in the
FAULT register.
During recovery from a thermal shutdown event, if the
regulator hits another thermal shutdown event before
Power Good can be achieved, the controller will reset
again. If this happens four times in a row, the part will
be in a Latch-Off state and the MOSFETs are
permanently latched off. The LATCH_OFF bit in the
STATUS register will be set to ‘1’, which will latch off the
MIC33M356. The device can be restarted by toggling
the enable input, by recycling the input power or by
software enable control (EN_CON). This latch-off
feature eliminates the thermal stress on the
MIC33M356 during a Fault event. The OT_LATCH bit
in register CTRL 2 can be set to ‘0’, which will cause
this latch-off to happen after the first overtemperature
event, instead of waiting for four consecutive
overtemperature events. This is a more conservative
approach to protect the part and is available to the user.
2020 Microchip Technology Inc.
4.14
Safe Start-up into a Pre-Biased
Output
The MIC33M356 is designed for safe start-up into a
pre-biased output in forced PWM. This feature
prevents high negative inductor current flow in a
pre-bias condition, which can damage the IC. This is
achieved by not allowing forced PWM until the control
loop commands eight switching cycles. After eight
cycles, the low-side negative current limit is switched
from 0A to -3A. The cycle counter is reset to zero if the
Enable pin is pulled low or an input undervoltage
condition, or any other Fault is detected.
4.15
Current Limiting
The MIC33M356 regulator uses both high-side and
low-side current sense for current limiting. When the
high-side current sense threshold is reached, the
high-side MOSFET is turned off and the low-side
MOSFET is turned on. The low-side MOSFET stays on
until the current falls to 80% of the high-side current
threshold value, then the high-side can be turned on
again. If the overload condition lasts for more than
seven cycles, the MIC33M356 enters hiccup current
limiting and both MOSFETs are turned off. There is a
1 ms cool-off period before the MOSFETs are allowed
to be turned back on. If the regulator has another
hiccup event before it reaches the Power Good
threshold on restart, it will again turn off both MOSFETs
and wait for 1 ms. If this happens more than three times
in a row, then the part will enter the Latch-Off state
which will permanently turn off both MOSFETs until the
part is reset by toggling the EN pin, by cycling the input
power or via an I2C command.
During a hiccup event, the HICCUP bit in the STATUS
register will go high and the SSD bit will go low until the
output has recovered. The Power Good FAULT register
bit, PG, will also go low and the PG pin will be pulled
low.
In latch-off, the LATCH_OFF status bit is set to ‘1’.
The high-side current limit can be programmed by
setting the ILIM bit in the CTRL1 register. For maximum
efficiency and current limit precision, it is recommended
that the highest current limit is programmed together
with a higher TON setting (corresponding to a lower
frequency).
4.16
Thermal Considerations
Although the MIC33M356 is capable of delivering up to
3A of current under load, the package thermal resistance and the device internal power dissipation may
limit the continuous output current.
If operated above the rated junction temperature,
electrical parameters may drift beyond characterized
specifications. The MIC33M356 is protected under all
circumstances by thermal shutdown.
DS20006349A-page 21
MIC33M356
NOTES:
DS20006349A-page 22
2020 Microchip Technology Inc.
MIC33M356
5.0
APPLICATION INFORMATION
5.1
Power-up State
the control loop from a stability point of view. The
maximum value of ESR is calculated using
Equation 5-1.
When power is first applied to the MIC33M356 and the
Enable pin is high, all I2C registers are loaded with their
default values and the device starts delivering power to
the output based on those default values. After the soft
start ramp has finished, these registers can be
reconfigured. These new settings are saved, even if the
Enable pin is pulled low. When the Enable pin is pulled
high again, the MIC33M356 is configured to the new
register settings, not the original default settings. To set
the I2C registers to their original settings, the input
power has to be recycled.
EQUATION 5-1:
When power is first applied to the MIC33M356 and the
Enable pin is low, all I2C registers can be configured.
When the Enable pin is pulled high, the regulator will
power up with the new I2C register settings. Again,
these register settings will not be lost when the Enable
pin is pulled low. If power is recycled, the register
settings are lost and they will have to be
reprogrammed.
The peak-to-peak inductor current ripple can be
calculated by using the formula in Equation 5-2.
5.2
Output Voltage Sensing
To achieve accurate output voltage regulation, the
VOUT pin (internal feedback divider top terminal) should
be Kelvin-connected as close as possible to the
point-of-regulation top terminal. Since both the internal
reference and the internal feedback divider’s bottom
terminal refer to AGND, it is important to minimize
voltage drops between the AGND and the
point-of-regulation return terminal (typically, the ground
terminal of the output capacitor which is closest to the
load).
5.3
Digital Voltage Control (DVC)
When the buck is programmed to a lower voltage, the
regulator is placed into forced PWM mode and the
Power Good monitor is blanked during the transition
time.
5.4
Output Capacitor Selection
The MIC33M356 utilizes an internal compensation
network and is designed to provide stable operation
with output capacitors of 47 μF to 1000 μF. This greatly
simplifies the design, where supplementary output
capacitance can be added without having to worry
about stability.
ESR
C OUT
V OUT PP
--------------------------------I L PP
Where:
ΔVOUT(PP) = Peak-to-Peak Output Voltage
Ripple
ΔIL(PP) = Peak-to-Peak Inductor Current
Ripple
EQUATION 5-2:
V OUT V IN(MAX) – V OUT
I L(PP) = ---------------------------------------------------------------V IN(MAX) f SW L
Where:
L = 0.47 µH
The total output ripple is a combination of the ESR and
output capacitance. The total ripple is calculated using
Equation 5-3.
EQUATION 5-3:
V OUT PP =
I L PP
2
2
------------------------------------------- + I L PP ESR C
C
f
8
OUT SW
OUT
Where:
COUT = Output Capacitance Value
fSW = Switching Frequency
The output capacitor RMS current is calculated using
Equation 5-4.
EQUATION 5-4:
IC
I L PP
= ---------------------12
OUT RMS
The power dissipated in the output capacitor is:
EQUATION 5-5:
2
P DISS COUT = I COUT RMS ESR COUT
The type of output capacitor is usually determined by its
Equivalent Series Resistance (ESR). Voltage and RMS
current capability are two other important factors for
selecting the output capacitor. Recommended
capacitor types are ceramic, OS-CON and POSCAP.
The output capacitor ESR is usually the main cause of
the output ripple. The output capacitor ESR also affects
2020 Microchip Technology Inc.
DS20006349A-page 23
MIC33M356
5.5
Input Capacitor Selection
I2C Bus Pull-ups Selection
5.6
The input capacitor for the power stage input VIN
should be selected for ripple current rating and voltage
rating. Due to the pulsed waveform of the buck stage
input current, ceramic input capacitors with good
high-frequency characteristics are mandatory and
should be placed as close to the device as possible.
Additional polarized capacitors can be used in parallel
to the ceramic input capacitors. Tantalum input capacitors may fail when subjected to high inrush currents,
caused by turning on the input supply. A tantalum input
capacitor voltage rating should be at least two times the
maximum input voltage to maximize reliability. Aluminum electrolytic, OS-CON, and multilayer polymer film
capacitors can handle the higher inrush currents
without voltage derating. The input voltage ripple will
primarily depend on the input capacitor ESR. The peak
input current is equal to the peak inductor current, as
shown in Equation 5-6.
The optimal pull-up resistors must be strong enough
that the RC constant of the bus is not too large (causing
the line not to rise to a logical high before being pulled
low), but weak enough for the IC to drive the line low.
EQUATION 5-6:
EQUATION 5-9:
TABLE 5-1:
Standard
Mode
Bit Rate
(kbits/s)
Fast
Mode
0 to 100 0 to 400
High-Speed
Mode
0 to
1700
0 to
3400
Max Cap Load
(pF)
400
400
400
100
Rise Time
(ns)
1000
300
160
80
Spike
Filtered (ns)
N/A
50
V IN = I L PK ESR CIN
The input capacitor must be rated for the input current
ripple. The RMS value of input capacitor current is
determined at the maximum output current. Assuming
the peak-to-peak inductor current ripple is low,
Equation 5-7 shows how to determine the RMS value
of the input capacitor current.
I2C BUS CONSTRAINTS
10
V CC – V OL max
Rp min = ---------------------------------------------I OL
Where:
VCC = Pull-up Reference Voltage (i.e., VIN)
VOL(max) = 0.4V
IOL = 3 mA
EQUATION 5-7:
I CIN RMS I OUT MAX D 1 – D
Where:
D = VOUT/VIN
The power dissipated in the input capacitor is calculated
using Equation 5-8.
EQUATION 5-8:
2
P DISS CIN = I CIN RMS ESR CIN
DS20006349A-page 24
2020 Microchip Technology Inc.
MIC33M356
6.0
I2C INTERFACE DESCRIPTION
The I2C bus is for 2-way, 2-line communication
between different ICs or modules. The two lines are: a
Serial Data (SDA) line and a Serial Clock (SCL) line.
Both lines must be connected to a positive supply via a
pull-up resistor. Data transfer may be initiated only
when the bus is not busy. The MIC33M356 is a slave
only device (i.e., it cannot generate a SCL signal and
does not have SCL clock stretching capability). Every
data transfer to and from the MIC33M356 must be
initiated by a master device which drives the SCL line.
SDA
SCL
Data line stable;
data valid
FIGURE 6-1:
6.1
Change of data
allowed
Bit Transfer.
Bit Transfer
One data bit is transferred during each clock pulse. The
data on the SDA line must remain stable during the
high period of the clock pulse, as changes in the data
line at this time, will be interpreted as control signals.
6.2
Start and Stop Conditions
Start (Sr) condition. A low-to-high transition of the data
line while the clock is high is defined as the Stop
condition (P). Start and Stop conditions are always
generated by the master. The bus is considered to be
busy after the Start condition. The bus is considered to
be free again a certain time after the Stop condition.
The bus stays busy if a Repeated Start (Sr) is
generated instead of a Stop condition.
Both data and clock lines remain high when the bus is
not busy. A high-to-low transition of the data line while
the clock is high is defined as the Start (S) or Repeated
SDA
SCL
SDA
S
START condition
FIGURE 6-2:
P
SCL
STOP condition
Start and Stop Conditions.
2020 Microchip Technology Inc.
DS20006349A-page 25
MIC33M356
6.3
Device Address
The MIC33M356 device uses a fixed 7-bit address,
which is set in hardware. This address is “0x5B”.
6.4
Acknowledge
The number of data bytes transferred between the Start
and the Stop conditions, from transmitter to receiver, is
not limited. Each byte of eight bits is followed by one
Acknowledge bit. The Acknowledge bit is a high level
put on the bus by the transmitter, whereas the master
generates an extra Acknowledge related clock pulse.
The device that Acknowledges has to pull down the
SDA line during the Acknowledge clock pulse, so that
the SDA line is stable low during the high period of the
Acknowledge related clock pulse; setup and hold times
must be taken into account.
A ‘0’ in the least significant position of the first byte
means that the master will write information to a
selected slave. A ‘1’ in this position means that the
master will read information from the slave. When an
address is sent, each device in a system compares the
first seven bits after the Start condition with its address.
If they match, the device considers itself addressed by
the master as a slave-receiver or slave-transmitter,
depending on the R/W bit.
The command byte is a data byte which selects a
register on the device. The Least Significant six bits of
the command byte determine the address of the
register that needs to be written.
The data to port are the 8-bit data that need to be
written to the selected register. This is followed by the
Acknowledge from the slave and then the Stop
condition.
A slave receiver, which is addressed, must generate an
Acknowledge after the reception of each byte.
The write command is as follows and it is illustrated in
the timing diagram below:
Also, a master receiver must generate an Acknowledge
after the reception of each byte that has been clocked
out of the slave transmitter, except on the last received
byte. A master receiver must signal an end of data to
the transmitter by not generating an Acknowledge on
the last byte that has been clocked out of the slave
transmitter. In this event, the transmitter must leave the
data line high to enable the master to generate a Stop
condition.
1.
2.
3.
6.5
Bus Transactions
6.5.1
SINGLE WRITE
The first seven bits of the first byte make up the slave
address. The eighth bit is the LSB (Least Significant
bit). It determines the direction of the message (R/W).
SCL
1
2
3
4
5
6
7
8
S
8.
9.
A
0
0
R/W ACK from
Slave
Note:
A
ACK from
Slave
DATA 1
A
P
ACK from
Slave
DATA 1 VALID
Data out from port
FIGURE 6-3:
Data to port
Command byte
0
START condition
6.
7.
9
Slave address
SDA
4.
5.
Send Start sequence.
Send 7-bit slave address.
Send the R/W bit – ‘0’ to indicate a write
operation.
Wait for Acknowledge from the slave.
Send the command byte – address that needs to
be written.
Wait for Acknowledge from the slave.
Receive the 8-bit data from the master and write
them to the slave register indicated in Step 5,
starting from the MSB.
Acknowledge from the slave.
Send Stop sequence.
Single Write Timing Diagram.
Writing to a non-existing register location will have no effect.
DS20006349A-page 26
2020 Microchip Technology Inc.
MIC33M356
6.5.2
SINGLE READ
7.
This reads a single byte from a device, from a
designated register. The register is specified through
the command byte.
The read command is as follows and it is illustrated in
the timing diagram of Figure 6-4 below.
1.
2.
3.
4.
5.
6.
Send Start sequence.
Send 7-bit slave address.
Send the R/W bit – ‘0’ to indicate a write
operation.
Wait for Acknowledge from the slave.
Send the register address that needs to be read.
Wait for Acknowledge from the slave.
12.
13.
Slave address
SDA
8.
9.
10.
11.
Send Start sequence again (Repeated Start
condition).
Send the 7-bit slave address.
Send R/W bit – ‘1’ to indicate a read operation.
Wait for Acknowledge from the slave.
Receive the 8-bit data from the slave, starting
from MSB.
Acknowledge from the master. On the received
byte, the master receiver issues a NACK in
place of ACK to signal the end of the data
transfer.
Send Stop sequence.
Command byte
S
0
A
START
condition
R/W
A
(cont.)
***
ACK from
Slave
ACK from Slave
Slave address
(cont.)
***
Data from register
Sr
1
(repeated)
START condition
R/W
A
ACK from Slave
FIGURE 6-4:
Note:
DATA (first byte)
A
P
STOP
condition
At this moment master-transmitter becomes master-receiver
and slave-receiver becomes slave-transmitter
Single Read Timing Diagram.
Attempts to read from a non-existing register location will return all zeros.
2020 Microchip Technology Inc.
DS20006349A-page 27
MIC33M356
NOTES:
DS20006349A-page 28
2020 Microchip Technology Inc.
MIC33M356
REGISTER MAP AND I2C
PROGRAMMABILITY
7.0
The MIC33M356 internal registers are summarized in
Table 7-1, below.
TABLE 7-1:
MIC33M356 REGISTER MAP
Address
Register Name
0x00
Control Register (CTRL1)
TON[1:0]
Reserved
0x01
ILIM
EN_DELAY[1:0]
EN_INT
EN_CON
Output Control Register (CTRL2)
DIS_100PCT
FPWM
OT_LATCH
0x02
PULL_DN
SLEW_RATE[3:0]
Output Voltage Register (VOUT)
VO[7:0]
0x03
Status and Fault Register (FAULT)
OT_WARN
REGISTER 7-1:
R/W-V
EN_STAT
BOOT_ERR
SSD
HICCUP
OT
LATCH_OFF
PG
CTRL1: OUTPUT CONTROL REGISTER 1 (ADDRESS 0X00)
R/W-V
TON[1:0]
Reserved
R/W-V
—
ILIM
R/W-0
R/W-0
EN_DELAY[1:0]
R/W-0
R/W-0
EN_INT
EN_CON
bit 7
bit 0
Legend:
RC = Read then Clear bit
V = Factory programmed POR value
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-6
TON[1:0]: On Time
00 = Low frequency
01 = Medium frequency
10 = High frequency
11 = Very high frequency
bit 5
Reserved
bit 4
ILIM: High-Side Peak Current Limit
0 = 3.5A
1 = 5A
bit 3-2
EN_DELAY[1:0]: Enable Delay
00 = 250 µs
01 = 1 ms
10 = 2 ms
11 = 3 ms
bit 1
EN_INT: Enable Bit Register Control
0 = Register controlled
1 = Enable pin controlled
bit 0
EN_CON: Enable Control
0 = Off
1 = On
2020 Microchip Technology Inc.
x = Bit is unknown
DS20006349A-page 29
MIC33M356
REGISTER 7-2:
CTRL2: OUTPUT CONTROL REGISTER 2 (ADDRESS 0X01)
R/W-0
R/W-0
R/W-V
R/W-V
DIS_100PCT
FPWM
OT_LATCH
PULLDN
R/W-V
R/W-V
R/W-V
R/W-V
SLEW_RATE[3:0]
bit 7
bit 0
Legend:
RC = Read then Clear bit
V = Factory programmed POR value
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
DIS_100PCT: Disable 100% Duty Cycle
0 = 100% DC
1 = Disable 100% DC
bit 6
FPWM: Force PWM
0 = HLL
1 = FPWM
bit 5
OT_LATCH: Overtemperature Latch
0 = Latch off immediately
1 = Latch off after four OT cycles
bit 4
PULLDN: Enable/Disable Regulator Pull-Down when Power-Down
0 = No pull-down
1 = Pull-down
bit 3-0
SLEW_RATE[3:0]: Step Slew-Rate Time in µs/V
0000 = 200
0001 = 400
0010 = 600
0011 = 800
0100 = 1000
0101 = 1200
0110 = 1400
0111 = 1600
1000 = 1800
1001 = 2000
1010 = 2200
1011 = 2400
1100 = 2600
1101 = 2800
1110 = 3000
1111 = 3200
DS20006349A-page 30
x = Bit is unknown
2020 Microchip Technology Inc.
MIC33M356
REGISTER 7-3:
R/W-V
OUTPUT VOLTAGE CONTROL REGISTER (ADDRESS 0X02)
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
R/W-V
VO[7:0]
bit 7
bit 0
Legend:
RC = Read then Clear bit
V = Factory programmed POR value
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7-0
x = Bit is unknown
VO[7:0]: Output Voltage Control: Options HAYMP, FAYMP
For codes 0x00 to 0x76: 0.6V.
0x80 = 0.645
0xA0 = 0.805V
0xC0 = 0.965
0xE0 = 1.125V
0x81 = 0.65V
0xA1 = 0.81V
0xC1 = 0.97V
0xE1 = 1.13V
0x82 = 0.655V
0xA2 = 0.815V
0xC2 = 0.975V
0xE2 = 1.135V
0x83 = 0.66V
0xA3 = 0.82V
0xC3 = 0.98V
0xE3 = 1.14V
0x84 = 0.665V
0xA4 = 0.825V
0xC4 = 0.985V
0xE4 = 1.145V
0x85 = 0.67V
0xA5 = 0.83V
0xC5 = 0.99V
0xE5 = 1.15V
0x86 = 0.675V
0xA6 = 0.835V
0xC6 = 0.995V
0xE6 = 1.155V
0x87 = 0.68V
0xA7 = 0.84V
0xC7 = 1V
0xE7 = 1.16V
0x88 = 0.685V
0xA8 = 0.845V
0xC8 = 1.005V
0xE8 = 1.165V
0x89 = 0.69V
0xA9 = 0.85V
0xC9 = 1.01V
0xE9 = 1.17V
0x8A = 0.695V
0xAA = 0.855V
0xCA = 1.015V
0xEA = 1.175V
0x8B = 0.7V
0xAB = 0.86V
0xCB = 1.02V
0xEB = 1.18V
0x8C = 0.705V
0xAC = 0.865V
0xCC = 1.025V
0xEC = 1.185V
0x8D = 0.71V
0xAD = 0.87V
0xCD = 1.03V
0xED = 1.19V
0x8E = 0.715V
0xAE = 0.875V
0xCE = 1.035V
0xEE = 1.195V
0x8F = 0.72V
0xAF = 0.88V
0xCF = 1.04V
0xEF = 1.2V
0x90 = 0.725V
0xB0 = 0.885V
0xD0 = 1.045V
0xF0 = 1.205V
0x91 = 0.73V
0xB1 = 0.89V
0xD1 = 1.05V
0xF1 = 1.21V
0x92 = 0.735V
0xB2 = 0.895V
0xD2 = 1.055V
0xF2 = 1.215V
0x93 = 0.74V
0xB3 = 0.9V
0xD3 = 1.06V
0xF3 = 1.22V
0x94 = 0.745V
0xB4 = 0.905V
0xD4 = 1.065V
0xF4 = 1.225V
0x95 = 0.75V
0xB5 = 0.91V
0xD5 = 1.07V
0xF5 = 1.23V
0x96 = 0.755V
0xB6 = 0.915V
0xD6 = 1.075V
0xF6 = 1.235V
0x77 = 0.6V
0x97 = 0.76V
0xB7 = 0.92V
0xD7 = 1.08V
0xF7 = 1.24V
0x78 = 0.605V
0x98 = 0.765V
0xB8 = 0.925V
0xD8 = 1.085V
0xF8 = 1.245V
0x79 = 0.61V
0x99 = 0.77V
0xB9 = 0.93V
0xD9 = 1.09V
0xF9 = 1.25V
0x7A = 0.615V
0x9A = 0.775V
0xBA = 0.935V
0xDA = 1.095V
0xFA = 1.255V
0x7B = 0.62V
0x9B = 0.78V
0xBB = 0.94V
0xDB = 1.1V
0xFB = 1.26V
0x7C = 0.625V
0x9C = 0.785V
0xBC = 0.945V
0xDC = 1.105V
0xFC = 1.265V
0x7D = 0.63V
0x9D = 0.79V
0xBD = 0.95V
0xDD = 1.11V
0xFD = 1.27V
0x7E = 0.635V
0x9E = 0.795V
0xBE = 0.955V
0xDE = 1.115V
0xFE = 1.275V
0x7F = 0.64V
0x9F = 0.8V
0xBF = 0.96V
0xDF = 1.12V
0xFF = 1.28V
2020 Microchip Technology Inc.
DS20006349A-page 31
MIC33M356
REGISTER 7-3:
bit 7-0
OUTPUT VOLTAGE CONTROL REGISTER (ADDRESS 0X02) (CONTINUED)
VO[7:0]: Output Voltage Control: Option SAYMP
For codes 0x00 to 0x3B: 0.6V.
0x80 = 1.3V
0xA0 = 1.94V 0xC0 = 2.58V 0xE0 = 3.22V
0x40 = 0.65V
0x60 = 0.97V
0x41 = 0.66V
0x61 = 0.98V 0x81 = 1.32V 0xA1 = 1.96V 0xC1 = 2.6V
0x42 = 0.67V
0x62 = 0.99V 0x82 = 1.34V 0xA2 = 1.98V 0xC2 = 2.62V 0xE2 = 3.26V
0x43 = 0.68V
0x63 = 1V
0x44 = 0.69V
0x64 = 1.01V 0x84 = 1.38V 0xA4 = 2.02V 0xC4 = 2.66V 0xE4 = 3.3V
0x45 = 0.7V
0x65 = 1.02V 0x85 = 1.4V
0x46 = 0.71V
0x66 = 1.03V 0x86 = 1.42V 0xA6 = 2.06V 0xC6 = 2.7V
0x47 = 0.72V
0x67 = 1.04V 0x87 = 1.44V 0xA7 = 2.08V 0xC7 = 2.72V 0xE7 = 3.36V
0x48 = 0.73V
0x68 = 1.05V 0x88 = 1.46V 0xA8 = 2.1V
0x49 = 0.74V
0x69 = 1.06V 0x89 = 1.48V 0xA9 = 2.12V 0xC9 = 2.76V 0xE9 = 3.4V
0x4A = 0.75V
0x6A = 1.07V 0x8A = 1.5V
0x4B = 0.76V
0x6B = 1.08V 0x8B = 1.52V 0xAB = 2.16V 0xCB = 2.8V
0x4C = 0.77V
0x6C = 1.09V 0x8C = 1.54V 0xAC = 2.18V 0xCC = 2.82V 0xEC = 3.46V
0x4D = 0.78V
0x6D = 1.1V
0x4E = 0.79V
0x6E = 1.11V 0x8E = 1.58V 0xAE = 2.22V 0xCE = 2.86V 0xEE = 3.5V
0x4F = 0.8V
0x6F = 1.12V 0x8F = 1.6V
0x50 = 0.81V
0x70 = 1.13V 0x90 = 1.62V 0xB0 = 2.26V 0xD0 = 2.9V
0x51 = 0.82V
0x71 = 1.14V 0x91 = 1.64V 0xB1 = 2.28V 0xD1 = 2.92V 0xF1 = 3.56V
0x52 = 0.83V
0x72 = 1.15V 0x92 = 1.66V 0xB2 = 2.3V
0x53 = 0.84V
0x73 = 1.16V 0x93 = 1.68V 0xB3 = 2.32V 0xD3 = 2.96V 0xF3 = 3.6V
0x54 = 0.85V
0x74 = 1.17V 0x94 = 1.7V
0x55 = 0.86V
0x75 = 1.18V 0x95 = 1.72V 0xB5 = 2.36V 0xD5 = 3V
0x56 = 0.87V
0x76 = 1.19V 0x96 = 1.74V 0xB6 = 2.38V 0xD6 = 3.02V 0xF6 = 3.66V
0x57 = 0.88V
0x77 = 1.2V
0x58 = 0.89V
0x78 = 1.21V 0x98 = 1.78V 0xB8 = 2.42V 0xD8 = 3.06V 0xF8 = 3.7V
0x59 = 0.9V
0x79 = 1.22V 0x99 = 1.8V
0x5A = 0.91V
0x7A = 1.23V 0x9A = 1.82V 0xBA = 2.46V 0xDA = 3.1V
0x3B = 0.6V
0x5B = 0.92V
0x7B = 1.24V 0x9B = 1.84V 0xBB = 2.48V 0xDB = 3.12V 0xFB = 3.76V
0x3C = 0.61V
0x5C = 0.93V
0x7C = 1.25V 0x9C = 1.86V 0xBC = 2.5V
0x3D = 0.62V
0x5D = 0.94V
0x7D = 1.26V 0x9D = 1.88V 0xBD = 2.52V 0xDD = 3.16V 0xFD = 3.8V
0x3E = 0.63V
0x5E = 0.95V
0x7E = 1.27V 0x9E = 1.9V
0x3F = 0.64V
0x5F = 0.96V
0x7F = 1.28V 0x9F = 1.92V 0xBF = 2.56V 0xDF = 3.2V
DS20006349A-page 32
0x83 = 1.36V 0xA3 = 2V
0xE1 = 3.24V
0xC3 = 2.64V 0xE3 = 3.28V
0xA5 = 2.04V 0xC5 = 2.68V 0xE5 = 3.32V
0xE6 = 3.34V
0xC8 = 2.74V 0xE8 = 3.38V
0xAA = 2.14V 0xCA = 2.78V 0xEA = 3.42V
0x8D = 1.56V 0xAD = 2.2V
0xEB = 3.44V
0xCD = 2.84V 0xED = 3.48V
0xAF = 2.24V 0xCF = 2.88V 0xEF = 3.52V
0xF0 = 3.54V
0xD2 = 2.94V 0xF2 = 3.58V
0xB4 = 2.34V 0xD4 = 2.98V 0xF4 = 3.62V
0x97 = 1.76V 0xB7 = 2.4V
0xF5 = 3.64V
0xD7 = 3.04V 0xF7 = 3.68V
0xB9 = 2.44V 0xD9 = 3.08V 0xF9 = 3.72V
0xFA = 3.74V
0xDC = 3.14V 0xFC = 3.78V
0xBE = 2.54V 0xDE = 3.18V 0xFE = 3.82V
0xFF = 3.84V
2020 Microchip Technology Inc.
MIC33M356
REGISTER 7-4:
STATUS AND FAULT REGISTER (ADDRESS 0X03)
R-0
R-0
R-0
R-0
R-0
R-0
R-0
R-0
OT_WARN
EN_STAT
BOOT_ERR
SSD
HICCUP
OT
LATCH_OFF
PG
bit 7
bit 0
Legend:
RC = Read then Clear bit
R = Readable bit
W = Writable bit
U = Unimplemented bit, read as ‘0’
-n = Value at POR
‘1’ = Bit is set
‘0’ = Bit is cleared
bit 7
OT_WARN: Overtemperature Warning
0 = No Fault
1 = Fault
bit 6
EN_STAT: Buck On/Off Control
0 = Off
1 = On
bit 5
BOOT_ERR: Boot-up Error
0 = No Fault
1 = Fault
bit 4
SSD: Soft Start Done
0 = Ramp not done
1 = Ramp done
bit 3
HICCUP: Current Limit Hiccup
0 = Not in hiccup
1 = In hiccup
bit 2
OT: Overtemperature
0 = No Fault
1 = Fault
bit 1
LATCH_OFF: Overcurrent or Overtemperature Fault Latch-Off
0 = No Fault
1 = Fault (device is latched off)
bit 0
PG: Power Good
0 = Power not good
1 = Power Good
2020 Microchip Technology Inc.
x = Bit is unknown
DS20006349A-page 33
MIC33M356
NOTES:
DS20006349A-page 34
2020 Microchip Technology Inc.
MIC33M356
8.0
PACKAGING INFORMATION
8.1
Package Marking Information
24-Lead, 3 mm × 4.5 mm QFN
Example
Part Number
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
Code
MIC33M356-FAYMP
356F
MIC33M356-HAYMP
356H
MIC33M356-SAYMP
356S
356F
1934
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2020 Microchip Technology Inc.
DS20006349A-page 35
MIC33M356
24-Lead Plastic Quad Flat, No Lead Package (N6A) - 3x4.5 mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
24X
0.05 C
0.08 C
NOTE 1
A1
D
A
B
N
E
4
1
2
E
(DATUM B)
(DATUM A)
2X
0.05 C
2X
(A3)
TOP VIEW
0.05 C
A
C
D2
2X b2
SEATING
PLANE
SIDE VIEW
6X L2
K2 0.20
24X b
0.10
0.05
E2
C A B
C
2
1
E3
e
N
11X L
D3
NOTE 1
K1 0.20
BOTTOM VIEW
Microchip Technology Drawing C04-1220A Sheet 1 of 2
DS20006349A-page 36
2020 Microchip Technology Inc.
MIC33M356
24-Lead Plastic Quad Flat, No Lead Package (N6A) - 3x4.5 mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Units
Dimension Limits
Number of Terminals
N
e
Pitch
Overall Height
A
A1
Standoff
A3
Terminal Thickness
Overall Length
D
Exposed Pad Length
D2
Exposed Pad Length
D3
Overall Width
E
Exposed Pad Width
E2
E3
Exposed Pad Width
b
Terminal Width
Terminal Width
b2
Terminal Length
L
Terminal Length
L2
Terminal to Exposed Pad
K1
Terminal to Exposed Pad
K2
MILLIMETERS
MAX
NOM
24
0.50 BSC
1.80
1.90
1.85
0.05
0.00
0.02
0.203 REF
3.00 BSC
0.338
0.388
0.438
1.344
1.394
1.444
4.50 BSC
2.35
2.45
2.40
0.326
0.376
0.426
0.20
0.30
0.25
0.08
0.13
0.18
0.35
0.40
0.45
0.20
0.25
0.30
0.20
0.20
MIN
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-1220A Sheet 2 of 2
2020 Microchip Technology Inc.
DS20006349A-page 37
MIC33M356
24-Lead Plastic Quad Flat, No Lead Package (N6A) - 3x4.5 mm Body [QFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
X4
C1
X6
X1
EV
24
Y6
Y1
Y4
1
2
C2
Y5
EV
EV
EV
Y7
8X ØV
X5
Y2
SILK SCREEN
X3
E
Outer Features
Inner Features
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X24)
X1
Contact Pad Length (X24)
Y1
Contact Pad Length (X7)
Y2
Contact Pad Width
X3
Exposed Pad Length
X4
Exposed Pad Width
Y4
X5
Exposed Pad Width
Y5
Exposed Pad Length
Terminal to Exposed Pad
X6
Y6
Terminal to Exposed Pad
Terminal to Exposed Pad
Y7
Thermal Via Diameter
V
Thermal Via Pitch
EV
MIN
MILLIMETERS
NOM
0.50 BSC
MAX
3.00
4.50
0.30
0.80
0.65
0.20
1.41
0.40
0.43
2.40
0.20
0.50
0.20
0.30
1.00
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
2. For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
Microchip Technology Drawing C04-3220 Rev A
DS20006349A-page 38
2020 Microchip Technology Inc.
MIC33M356
APPENDIX A:
REVISION HISTORY
Revision A (May 2020)
• Initial release of this Data Sheet.
2020 Microchip Technology Inc.
DS20006349A-page 39
MIC33M356
NOTES:
DS20006349A-page 40
2020 Microchip Technology Inc.
MIC33M356
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Device
X
XX
PART NO.
XX
XX(1)
Output Voltage Temperature Package Tape and Reel
Range
Option
Option
Device:
MIC33M356: 3A, Power Module Buck Converter with
Hyper-Light Load® Mode and I2C
Interface
Output Voltage
Option:
FA
HA
SA
= 0.9V
= 1.0V
= 1.0V with 10 mV or 20 mV resolution
Junction Temperature
Range:
Y
= -40°C to +125°C
Package:
MP
= 24 Lead 3.0 mm x 4.5 mm x 1.8mm
Tape and Reel Option:
Blank = Standard Packaging (Tube or Tray)
TR
= Tape and Reel(1)
2020 Microchip Technology Inc.
Examples:
a) MIC33M356-FAYMP-TR: 0.9V Output, -40C to +125C
Junction Temperature Range,
24-Lead QFN, Tape and Reel
b) MIC33M356-HAYMP-TR: 1.0V Output, -40C to +125C
Junction Temperature Range,
24-Lead QFN, Tape and Reel
c) MIC33M356-SAYMP-TR: 1.0V Output with 10 mV or 20 mV
Resolution, -40°C to +125°C
Junction Temperature Range,
24-Lead QFN, Tape and Reel
Note 1:
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is nto printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006349A-page 41
MIC33M356
NOTES:
DS20006349A-page 42
2020 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, Adaptec,
AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT,
chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex,
flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck,
LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi,
Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer,
PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire,
Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST,
SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon,
TempTrackr, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA
are registered trademarks of Microchip Technology Incorporated in
the U.S.A. and other countries.
APT, ClockWorks, The Embedded Control Solutions Company,
EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load,
IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision
Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire,
SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub,
TimePictra, TimeProvider, Vite, WinPath, and ZL are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BlueSky, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker,
KleerNet, KleerNet logo, memBrain, Mindi, MiWi, MPASM, MPF,
MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple
Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI,
SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC,
USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and
ZENA are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
The Adaptec logo, Frequency on Demand, Silicon Storage
Technology, and Symmcom are registered trademarks of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany
II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in
other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2020, Microchip Technology Incorporated, All Rights Reserved.
For information regarding Microchip’s Quality Management Systems,
please visit www.microchip.com/quality.
2020 Microchip Technology Inc.
ISBN: 978-1-5224-6155-5
DS20006349A-page 43
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DS20006349A-page 44
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2020 Microchip Technology Inc.
02/28/20
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