MIC37301-2.5YME

MIC37300/01/02/03 3.0A, Low Voltage μCap LDO Regulator Features General Description • 3A Minimum Output Current • 500 mV Maximum Dropout Voltage over Temperature - Recommended for 3.0V to 2.5V Conversion - Recommended for 2.5V to 1.8V, 1.65V, or 1.5V Conversion • Stable with Ceramic or Tantalum Capacitors • Wide Input Voltage Range - VIN: 2.25V to 6.0V • +1.0% Initial Output Tolerance • Fixed and Adjustable Output Voltages: - MIC37300: 3-pin S-PAK Fixed Voltages - MIC37301: 5-pin S-PAK or 8-pin ePad SOIC Fixed Voltages with Flag - MIC37302: 5-pin Adjustable Voltage - MIC37303: 8-pin ePad SOIC, DFN Adjustable Voltage with Flag • Excellent Line and Load Regulation Specifications • Thermal Shutdown and Current Limit Protection • Reverse-Leakage Protection • Low Profile S-PAK Package The MIC37300/01/02/03 is a 3.0A low-dropout linear voltage regulator that provides a low voltage, high current output with a minimum number of external components. It offers high precision, ultra-low dropout (500 mV over temperature), and low ground current. The MIC37300/01/02/03 operates from an input of 2.25V to 6.0V. It is designed to drive digital circuits requiring low-voltage at high currents (i.e., PLDs, DSP, microcontroller, etc.). It is available in fixed and adjustable output voltages. Fixed voltages include 1.5V, 1.8V, 2.5V, and 3.3V. The adjustable version is capable of 1.24V to 5.5V. Features of the MIC37300/01/02/03 LDO include thermal and current limit protection, and reverse current protection. Logic enable and error flag pins are available on the 5-pin version. Junction temperature range of the MIC37300/01/02/03 is from –40°C to +125°C. For applications requiring input voltage greater than 6.0V, see the MIC3910x, MIC3915x, MIC3930x, and MIC3950x LDOs. Applications • • • • • • • • LDO Linear Regulator for Low Voltage Digital IC PC Add-In Cards PowerPC Power Supplies High Efficiency Linear Power Supplies SMPS Post Regulator Multimedia and PC Processor Supplies Battery Chargers Low Voltage Microcontrollers and Digital Logic  2019 Microchip Technology Inc. DS20006169A-page 1 MIC37300/01/02/03 Typical Application Circuits 2.5V Regulator DS20006169A-page 2 Adjustable Regulator  2019 Microchip Technology Inc. MIC37300/01/02/03 Package Types S-PAK-5 (R) (Top View) TO-263-5 (U) (Top View) S-PAK-3 (R) (Top View) ePad SOIC-8 (ME) (Top View) 3 mm x 3 mm (DFN) (Top View)  2019 Microchip Technology Inc. DS20006169A-page 3 MIC37300/01/02/03 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Voltage (VIN)................................................................................................................................................ +6.5V Enable Input Voltage (VEN) ..................................................................................................................................... +6.5V Power Dissipation (PD) (Note 1).............................................................................................................Internally Limited Junction Temperature (TJ)............................................................................................................... –40°C ≤ TJ ≤ +125°C Storage Temperature (TS) ............................................................................................................... –65°C ≤ TJ ≤ +150°C Lead Temperature (Soldering, 10s).........................................................................................................................260°C ESD Rating (Note 2)...................................................................................................................................................2 kV Operating Ratings ‡ Supply Voltage (VIN)................................................................................................................................+2.25V to +6.0V Enable Voltage (VEN) ..................................................................................................................................... 0V to +6.0V Junction Temperature (TJ)............................................................................................................... –40°C ≤ TJ ≤ +125°C Package Thermal Resistance S-PAK (θJA) ......................................................................................................................................................... 5.5°C/W TO-263-5 (θJC) .................................................................................................................................................... 6.3°C/W ePad SOIC-8 (θJC) ............................................................................................................................................... 16°C/W 3 mm x 3 mm DFN (θJC) ...................................................................................................................................... 29°C/W † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. Specifications are for packaged product only. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: PD(max) = (TJ(max) – TA) ÷ θJA, where θJA depends upon the printed circuit layout. See “Section 4.0 “Application Information” section. 2: Devices are ESD sensitive. Handling precautions are recommended. ELECTRICAL CHARACTERISTICS (Note 1) Electrical Characteristics: VIN = VOUT + 1V; VEN = VIN; IL = 10 mA; TA = 25°C, Bold values indicate –40°C < TJ < +125°C; unless otherwise specified. Parameter Output Voltage Accuracy Symbol VOUT Min. Typ. Max. Units Conditions –1 — +1 % IL = 10 mA –2 — +2 % 10 mA ≤ IOUT ≤ IL(MAX), VOUT + 1V ≤ VIN ≤ 6V Output Voltage Line Regulation ΔVOUT/ΔVIN — 0.02 0.5 % VIN = VOUT + 1.0V to 6.0V; IL = 10 mA Output Voltage Load Regulation ΔVOUT/VOUT — 0.2 1 % IL = 10 mA to 3A — VIN - VOUT Dropout Voltage (Note 2), (Note 5) VDO — — — Ground Pin Current (Note 3) 175 300 350 400 500 550 mV mV IL = 1.5A (For S-PAK-5, TO-263-5) IL = 1.5A (For e-Pad SOIC-8, DFN) IL = 3.0A (For S-PAK-5, TO-263-5) IL = 3.0A (For e-Pad SOIC-8, DFN) IGND — 27 40 50 IGND-SHDN — 1.0 5 Current Limit ILIM — 4.75 6.5 A VOUT = 0V Start-Up Time tSTART — 170 500 μs VEN = VIN, IOUT = 10 mA, COUT = 47 μF Ground Pin Current In Shutdown DS20006169A-page 4 mA IL = 3A μA VIL ≤ 0.5V, VIN = VOUT +1V  2019 Microchip Technology Inc. MIC37300/01/02/03 ELECTRICAL CHARACTERISTICS (Note 1) (CONTINUED) Electrical Characteristics: VIN = VOUT + 1V; VEN = VIN; IL = 10 mA; TA = 25°C, Bold values indicate –40°C < TJ < +125°C; unless otherwise specified. Parameter Symbol Min. Typ. Max. Units Conditions 2.25 — — — — 0.8 — — 2 4 μA VIL ≤ 0.8V (Regulator Shutdown) 1 15 30 75 μA VIH ≥ 2.25V (Regulator Enable) — — 1 — — 2 μA VOH = 6V — 210 400 500 mV VIN = 2.25V, IOL = 250 μA 93 — — — — 99.2 — 2 — Enable Input Enable Input Threshold VEN Enable Pin Input Current IEN V Regulator Enable Regulator Shutdown Flag Output Output Leakage Current IFLG(LEAK) Output Low Voltage (Note 4) VFLG(LO) Low Threshold High Threshold VFLG Hysteresis % of VOUT Below Nominal % % of VOUT Below Nominal — MIC37302 Only Reference Voltage VREF Adjust Pin Bias Current IADJ 1: 2: 3: 4: 5: 1.228 1.215 — 1.240 40 1.252 1.265 80 120 V — nA — Specification for packaged product only. VDO = VIN – VOUT when VOUT decreases to 98% of its nominal output voltage with VIN = VOUT + 1V. For output voltages below 1.75V, dropout voltage specification does not apply due to a minimum input operating voltage of 2.25V. IGND is the ground current. IIN = IGND + IOUT. For a 2.5V device, VIN = 2.250V (device is in dropout). Limits specified down to: VIN = 2.25V for 0°C ≤ TA ≤ +125°C VIN = 2.35V for 0°C > TA ≥ –40°C  2019 Microchip Technology Inc. DS20006169A-page 5 MIC37300/01/02/03 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions — — — 260 °C (soldering, 10 sec.) Junction Temperature TJ –40 — +125 °C — Storage Temperature Range TS –65 — +150 °C — Thermal Resistance SPAK-5 JC — 5.5 — °C/W — Thermal Resistance TO-263-5 JC — 6.3 — °C/W — Thermal Resistance ePad SOIC-8 JC — 16 — °C/W — Thermal Resistance 3 mm x 3 mm DFN JC — 29 — °C/W — Temperature Ranges Lead Temperature Package Thermal Resistances Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability. DS20006169A-page 6  2019 Microchip Technology Inc. MIC37300/01/02/03 2.0 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. FIGURE 2-1: Ratio. Power Supply Rejection FIGURE 2-4: Dropout vs. Temperature. FIGURE 2-2: Ratio. Power Supply Rejection FIGURE 2-5: (1.5V). Dropout Characteristics FIGURE 2-3: Dropout vs. Output Current. FIGURE 2-6: (2.5V). Dropout Characteristics  2019 Microchip Technology Inc. DS20006169A-page 7 MIC37300/01/02/03 FIGURE 2-7: (3.3V). Dropout Characteristics FIGURE 2-10: Voltage (1.5V). Ground Current vs. Supply FIGURE 2-8: Current. Ground Current vs. Output FIGURE 2-11: Voltage (2.5V). Ground Current vs. Supply FIGURE 2-9: Voltage (1.5V). Ground Current vs. Supply FIGURE 2-12: Voltage (2.5V). Ground Current vs. Supply DS20006169A-page 8  2019 Microchip Technology Inc. MIC37300/01/02/03 FIGURE 2-13: Voltage (3.3V). Ground Current vs. Supply FIGURE 2-16: Temperature. Ground Current vs. FIGURE 2-14: Voltage (3.3V). Ground Current vs. Supply FIGURE 2-17: Temperature. Ground Current vs. FIGURE 2-15: Temperature. Ground Current vs. FIGURE 2-18: Temperature. Output Voltage vs.  2019 Microchip Technology Inc. DS20006169A-page 9 MIC37300/01/02/03 FIGURE 2-19: Supply Voltage. Short-Circuit Current vs. FIGURE 2-22: Temperature. Flag Low-Voltage vs. FIGURE 2-20: Temperature. Short-Circuit Current vs. FIGURE 2-23: Error Flag Pull-Up Resistor. FIGURE 2-21: Current. Flag Voltage vs. Flag FIGURE 2-24: Temperature. Enable Current vs. DS20006169A-page 10  2019 Microchip Technology Inc. MIC37300/01/02/03 FIGURE 2-25: Load Transient Response. FIGURE 2-26: Line Transient Response. FIGURE 2-27: Enable Transient Response.  2019 Microchip Technology Inc. DS20006169A-page 11 MIC37300/01/02/03 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE S-PAK-5 TO-263-5 S-PAK-3 ePAD SOIC-8 DFN Pin Name Description 1 — 2 EN Enable (Input): CMOS compatible control input. Logic high = enable, Logic low = shutdown. Do not leave floating. 2 1 3, 4 VIN Input voltage that supplies current to the output power device. 3 2 1 GND Ground: TAB is connected to ground. VOUT Regulator output. 5, 6, 7 (Fixed) 4 3 5 (Fixed) — 8 FLG Flag (Output): Open collector output. Active LOW indicates an output fault condition. 5 (Adj) — 7 (Adj.) ADJ Adjustable regulator feedback input: Connect to resistor voltage driver. — — EP ePad Connect to GND for best thermal performance. DS20006169A-page 12 5, 6, (Adj.)  2019 Microchip Technology Inc. MIC37300/01/02/03 4.0 APPLICATION INFORMATION The MIC37300/01/02/03 is a high-performance low dropout voltage regulator suitable for moderate to high current regulator applications. The 500 mV dropout voltage at full load and over temperature makes it especially valuable in battery-powered systems and as high-efficiency noise filters in post regulator applications. Unlike older NPN-pass transistor designs, where the minimum dropout voltage is limited by the based-to-emitter voltage drop and collector-to-emitter saturation voltage, dropout performance of the PNP output of these devices is limited only by the low VCE saturation voltage. A trade-off for the low dropout voltage is a varying base drive requirement. Microchip’s Super βeta PNP process reduces this drive requirement to only 2% to 5% of the load current. The MIC37100/01/02 regulator is fully protected from damage due to fault conditions. Linear current limiting is provided. Output current during overload conditions is constant. Thermal shutdown disables the device when the die temperature exceeds the maximum safe operating temperature. The output structure of these regulators allows voltages in excess of the desired output voltage to be applied without reverse current flow. 4.1 Thermal Design Linear regulators are simple to use. The most complicated design parameters to consider are thermal characteristics. Thermal design requires the following application specific parameters: • • • • • Maximum ambient temperature (TA) Output current (IOUT) Output voltage (VOUT) Input voltage (VIN) Ground current (IGND) First, calculate the power dissipation of the regulator and the device parameters from Electrical Characteristics section or the Typical Performance Curves section. EQUATION 4-1: P D =  V IN – V OUT I OUT + V IN  I GND  2019 Microchip Technology Inc. Then the heat sink thermal resistance is determined with Equation 4-2: EQUATION 4-2:  SA =   T J  MAX  – T A /P D  –   JC +  CS  Where: TJ(MAX) =