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MIC5237-5.0BT

MIC5237-5.0BT

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    TO-220-3

  • 描述:

    IC REG LINEAR 5V 500MA TO220-3

  • 数据手册
  • 价格&库存
MIC5237-5.0BT 数据手册
MIC5237 500 mA Low Dropout Regulator Features General Description • Guaranteed 500 mA Output Over the Full Operating Temperature Range • Low 300 mV Typical Dropout Voltage at Full Load • Extremely Tight Load and Line Regulation • Current and Thermal Limiting • Reversed-Battery Protection • TO-220 and TO-263 Packages • Low Temperature Coefficient • No-Load Stability • Low Noise Output The MIC5237 is a general-purpose low-dropout regulator capable of 500 mA output current with better than 3% output voltage accuracy. Using Microchip’s proprietary Super ßeta PNP process with a PNP pass element, these regulators feature less than 300 mV dropout voltage and typically 8 mA ground current at full load. Designed for applications that require moderate current over a broad input voltage range, including hand-held and battery-powered devices, the MIC5237 is intended for applications that can tolerate moderate voltage drop at higher current. Applications • • • • • Key features include low ground current to help prolong battery life, reversed-battery protection, current limiting, overtemperature shutdown, and thermally efficient packaging. The MIC5237 is available in fixed output voltages only. Portable and Laptop Computers Desktop Computer Battery Chargers SMPS Post-Regulator and DC/DC Modules Consumer and Personal Electronics For space-critical applications and improved performance, see the MIC5209 and MIC5219. For output current requirements up to 750 mA, see the MIC2937. Package Types MIC5237 3-Lead TO-263 (U) 3 OUT 2 GND 1 IN  2018 - 2022 Microchip Technology Inc. and its subsidiaries TAB TAB MIC5237 3-Lead TO-220 (T) 3 OUT 2 GND 1 IN DS20006095B-page 1 MIC5237 Typical Application Circuit MIC5237 VIN •5.6V MIC5237-5.0 IN 1.0μF VOUT 5.0V ± 3% OUT GND 1.0μF Tantalum Functional Block Diagram VIN OUT IN VOUT COUT Bandgap Ref. Current Limit Thermal Shutdown MIC5237-x.x GND DS20006095B-page 2  2018 - 2022 Microchip Technology Inc. and its subsidiaries MIC5237 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited Operating Ratings ‡ Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +16V † Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability. ‡ Notice: The device is not guaranteed to function outside its operating ratings. Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD(max) = (TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. ELECTRICAL CHARACTERISTICS Electrical Characteristics: VIN = VOUT + 1.0V; COUT = 4.7 µF; IOUT = 100 µA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Parameter Min. Typ. Max. –3 — 3 –5 — 5 ∆VOUT/∆T — 40 — Line Regulation ∆VOUT/ VOUT — — 0.05 — 0.015 0.1 Load Regulation ∆VOUT/ VOUT — 0.05 0.5 — — 0.7 Output Voltage Accuracy Output Voltage Temperature Coefficient Dropout Voltage, Note 3 Ground Pin Current, Note 4 Ripple Rejection Symbol VOUT VIN – VOUT IGND PSRR Units % ppm/°C %/V % — 10 70 mV — — 90 mV — 115 190 mV — — 280 mV — 165 350 mV — — 450 mV — 300 600 mV — — 700 mV — 80 130 µA — — 170 µA — 350 650 µA — — 900 µA — 1.8 2.5 mA — — 3.0 mA — 8 15 mA — — 20 mA — 75 — dB  2018 - 2022 Microchip Technology Inc. and its subsidiaries Conditions Variation from nominal VOUT. Note 1 VIN = VOUT + 1V to 16V IOUT = 100 µA to 500 mA, Note 2 IOUT = 100 µA IOUT = 50 mA IOUT = 150 mA IOUT = 500 mA IOUT = 100 µA IOUT = 50 mA IOUT = 150 mA IOUT = 500 mA f = 120 Hz DS20006095B-page 3 MIC5237 ELECTRICAL CHARACTERISTICS (CONTINUED) Electrical Characteristics: VIN = VOUT + 1.0V; COUT = 4.7 µF; IOUT = 100 µA; TJ = +25°C, bold values indicate –40°C ≤ TJ ≤ +125°C; unless noted. Parameter Current Limit Thermal Regulation Output Noise Note 1: 2: 3: 4: 5: Symbol Min. Typ. — 700 900 — — 1000 ∆VOUT/ ∆PD — 0.05 — %/W eno — 500 — nV/√Hz ILIMIT Max. Units Conditions mA VOUT = 0V Note 5 VOUT = 5.0V, IOUT = 50 mA, COUT = 2.2 µF Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 100 µA to 500 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN = 16V for t = 10 ms. DS20006095B-page 4  2018 - 2022 Microchip Technology Inc. and its subsidiaries MIC5237 TEMPERATURE SPECIFICATIONS (Note 1) Parameters Sym. Min. Typ. Max. Units Conditions Junction Operating Temperature Range TJ –40 — +125 °C — Lead Temperature — — — +260 °C Soldering, 5s JC — 3 — °C/W JC — 3 — °C/W — JA — 55 — °C/W — Temperature Ranges Package Thermal Resistances Thermal Resistance TO-263 Thermal Resistance TO-220 Note 1: — The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation will cause the device operating junction temperature to exceed the maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.  2018 - 2022 Microchip Technology Inc. and its subsidiaries DS20006095B-page 5 MIC5237 Note: TYPICAL PERFORMANCE CURVES The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 0 -20 PSRR (dB) 60 VIN = 6V VOUT = 5V RIPPLE REJECTION (dB) 2.0 -40 -60 -80 IOUT = 100μA COUT = 1μF 50 30 Power Supply Rejection 0 0 -60 -80 IOUT = 1mA COUT = 1μF -100 1k 1E+4 1E+1 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-2: Ratio. Power Supply Rejection 0 0.1 0.2 0.3 VOLTAGE DROP (V) 0.4 FIGURE 2-4: Power Supply Ripple Rejection vs. Voltage Drop. 10 1 NOISE (μV/¥Hz) PSRR (dB) -40 IOUT = 100mA COUT = 1μF 10 VIN = 6V VOUT = 5V -20 10mA 20 -100 1k 1E+4 1E+1 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-1: Ratio. 1mA 40 100mA 10mA 0.1 0.01 0.001 VOUT = 5V COUT = 10μF electrolytic 1mA 0.0001 1k 1E+4 10 1E+2 1M 1E+7 10k 1E+5 100k 1E+6 10M 1E+1 100 1E+3 FREQUENCY (Hz) FIGURE 2-5: Noise Performance. 0 PSRR (dB) -20 VIN = 6V VOUT = 5V -40 -60 -80 IOUT = 100mA COUT = 1μF -100 1k 1E+4 1E+1 10k 1E+5 1M 1E+7 10M 10 1E+2 100k 1E+6 100 1E+3 FREQUENCY (Hz) FIGURE 2-3: Ratio. DS20006095B-page 6 Power Supply Rejection  2018 - 2022 Microchip Technology Inc. and its subsidiaries MIC5237 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE Pin Number Pin Name Description 1 IN 2, TAB GND Ground: TO-220 and TO-263 pin 2 and TAB are internally connected. 3 OUT Regulator output. Supply input.  2018 - 2022 Microchip Technology Inc. and its subsidiaries DS20006095B-page 7 MIC5237 4.0 APPLICATION INFORMATION The MIC5237 is intended for general purpose use and can be implemented in a wide variety of applications where 500 mA of output current is needed. It is available in several voltage options for ease-of-use. For voltage options that are not available on the MIC5237, consult the MIC5209 for a 500 mA adjustable LDO regulator, or the MIC5219 for applications that require only short-duration peak output current. 4.1 Input Capacitor A 1 µF capacitor should be placed from IN to GND if there is more than 10 inches of wire between the input and the ac filter capacitor or if a battery is used as the input. 4.2 The output capacitor should have an ESR (equivalent series resistance) of about 5Ω or less and a resonant frequency above 1 MHz. Ultra low-ESR capacitors can cause low-amplitude oscillations and/or under-damped transient response. Most tantalum or aluminum electrolytic capacitors are adequate; film types will work, but are more expensive. Because many aluminum electrolytics have electrolytes that freeze at about –30°C, solid tantalums are recommended for operation below –25°C. At lower values of output current, less output capacitance is needed for output stability. The capacitor can be reduced to 0.47 µF for current below 10 mA or 0.33 µF for currents below 1 mA. For 2.5V applications a 22 µF output capacitor is recommended to reduce startup voltage overshoot. No-Load Stability The MIC5237 will remain stable and in regulation with no load (other than the internal voltage divider) unlike many other voltage regulators. This is especially important in CMOS RAM keep-alive applications. 4.4 The regulator ground current, IGND, can be measured or read from the data sheet. Assuming the worst case scenario is good design procedure, and the corresponding ground current number can be obtained from the data sheet. First, calculate the power dissipation of the device. This example uses the MIC5237-5.0YT, a 13V input, and 500 mA output current, which results in 20 mA of ground current, worst case. The power dissipation is the sum of two power calculations: voltage drop × output current and input voltage × ground current. EQUATION 4-1: P D =   V IN – V OUT   I OUT  +  V IN  I GND  Output Capacitor An output capacitor is required between OUT and GND to prevent oscillation. 1 µF minimum is recommended for standard applications. Larger values improve the regulator’s transient response. The output capacitor value may be increased without limit. 4.3 • TA = Ambient Operating Temperature • IGND = Ground Current Thermal Considerations Proper thermal design can be accomplished with some basic design criteria and some simple equations. The following information is required to implement a regulator design. EQUATION 4-2: P D =   13V – 5V   500mA  +  13V  20mA  = 4.260W From this number, the heat sink thermal resistance is determined using the regulator’s maximum operating junction temperature (TJ(max)) and the ambient temperature (TA) along with the power dissipation number already calculated. • • • • • TJMAX = 125°C θJC = Junction-to-Case Thermal Resistance θCS = Case-to-Sink Thermal Resistance θJA = Junction-to-Ambient Thermal Resistance θSA = Sink-to-Ambient Thermal Resistance To determine the heat sink thermal resistance, the junction-to-case thermal resistance of the device must be used along with the case-to-heat sink thermal resistance. These numbers show the heat sink thermal resistance required at TA = 25°C that does not exceed the maximum operating junction temperature. EQUATION 4-3: T J  MAX  – T A  JA = ------------------------------PD • VIN = Input Voltage • VOUT = Output Voltage • IOUT = Output Current DS20006095B-page 8  2018 - 2022 Microchip Technology Inc. and its subsidiaries MIC5237 EQUATION 4-4:  SA =  JA –  JC θCS is approximately 1°C/W and θJC for the TO-220 is 3°C/W in this example. EQUATION 4-5: 125C – 25C  JA = ----------------------------------- = 23.5C/W 4.260W EQUATION 4-6:  SA = 23.5C/W –  3C/W + 1C/W  = 19.5C/W Therefore, a heat sink with a thermal resistance of 19.5°C/W will allow the part to operate safely and it will not exceed the maximum junction temperature of the device. The heat sink can be reduced by limiting power dissipation, by reducing the input voltage or output current. Either the TO-220 or TO-263 package can operate reliably at 2W of power dissipation without a heat sink. Above 2W, a heat sink is recommended.  2018 - 2022 Microchip Technology Inc. and its subsidiaries DS20006095B-page 9 MIC5237 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 3-Lead TO-220* XXXX -X.XXX WNNNP 3-Lead TO-263* XXXX -X.XXX WNNNP Legend: XX...X Y YY WW NNN e3 * Example 5237 -5.0YT 7V1WP Example 5237 -3.3YU 67BUP Product code or customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC® designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. ●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle mark). Note: In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. Package may or may not include the corporate logo. Underbar (_) and/or Overbar (‾) symbol may not be to scale. Note: If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are used based on the available marking space: 6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN; 2 Characters = NN; 1 Character = N DS20006095B-page 10  2018 - 2022 Microchip Technology Inc. and its subsidiaries MIC5237 3-Lead TO-220 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging.  2018 - 2022 Microchip Technology Inc. and its subsidiaries DS20006095B-page 11 MIC5237 3-Lead TO-263 Package Outline and Recommended Land Pattern Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging. DS20006095B-page 12  2018 - 2022 Microchip Technology Inc. and its subsidiaries MIC5237 APPENDIX A: REVISION HISTORY Revision A (October 2018) • Converted Micrel document MIC5237 to Microchip data sheet DS20006095A. • Minor text changes throughout. Revision B (February 2022) • Updated the Package Marking Information drawing with the most current marking information.  2018 - 2022 Microchip Technology Inc. and its subsidiaries DS20006095B-page 13 MIC5237 NOTES: DS20006095B-page 14  2018 - 2022 Microchip Technology Inc. and its subsidiaries MIC5237 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office. PART NO. Device –X.X X XX –XX Examples: a) MIC5237-2.5YU: 500 mA Low Dropout Regulator 2.5V, –40°C to +125°C, 3-Lead TO-263, 50/Tube b) MIC5237-2.5YU-TR: 500 mA Low Dropout Regulator 2.5V, –40°C to +125°C, 3-Lead TO-263, 750/Reel c) MIC5237-3.3YU: 500 mA Low Dropout Regulator 3.3V, –40°C to +125°C, 3-Lead TO-263, 50/Tube d) MIC5237-3.3YU-TR: 500 mA Low Dropout Regulator 3.3V, –40°C to +125°C, 3-Lead TO-263, 750/Reel e) MIC5237-5.0YU: 500 mA Low Dropout Regulator 5.0V, –40°C to +125°C, 3-Lead TO-263, 50/Tube f) MIC5237-5.0YU-TR: 500 mA Low Dropout Regulator 5.0V, –40°C to +125°C, 3-Lead TO-263, 750/Reel g) MIC5237-5.0YT: 500 mA Low Dropout Regulator 5.0V, –40°C to +125°C, 3-Lead TO-220, 50/Tube Voltage Temperature Package Media Type Device: MIC5237: Voltage: 2.5 3.3 5.0 = = = 2.5V (TO-263 Only) 3.3V (TO-263 Only) 5.0V (Both Packages) Temperature: Y = –40°C to +125°C Package: T U = = 3-Lead TO-220 3-Lead TO-263 Media Type: = 50/Tube (Both Packages) TR = 750/Reel (TO-263 Only) 500 mA Low Dropout Regulator Note 1:  2018 - 2022 Microchip Technology Inc. and its subsidiaries Tape and Reel identifier only appears in the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option. DS20006095B-page 15 MIC5237 NOTES: DS20006095B-page 16  2018 - 2022 Microchip Technology Inc. and its subsidiaries Note the following details of the code protection feature on Microchip products: • Microchip products meet the specifications contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and under normal conditions. • Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to continuously improving the code protection features of our products. This publication and the information herein may be used only with Microchip products, including to design, test, and integrate Microchip products with your application. Use of this information in any other manner violates these terms. Information regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. Contact your local Microchip sales office for additional support or, obtain additional support at https:// www.microchip.com/en-us/support/design-help/client-supportservices. THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NONINFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE, OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL, OR CONSEQUENTIAL LOSS, DAMAGE, COST, OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, CryptoMemory, CryptoRF, dsPIC, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, Flashtec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, QuietWire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, TrueTime, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, GridTime, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, Knob-on-Display, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, NVM Express, NVMe, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SmartHLS, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, Symmcom, and Trusted Time are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2018 - 2022, Microchip Technology Incorporated and its subsidiaries. All Rights Reserved. For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.  2018 - 2022 Microchip Technology Inc. and its subsidiaries ISBN: 978-1-5224-9779-0 DS20006095B-page 17 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Australia - Sydney Tel: 61-2-9868-6733 India - Bangalore Tel: 91-80-3090-4444 China - Beijing Tel: 86-10-8569-7000 India - New Delhi Tel: 91-11-4160-8631 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Chengdu Tel: 86-28-8665-5511 India - Pune Tel: 91-20-4121-0141 China - Chongqing Tel: 86-23-8980-9588 Japan - Osaka Tel: 81-6-6152-7160 China - Dongguan Tel: 86-769-8702-9880 Japan - Tokyo Tel: 81-3-6880- 3770 China - Guangzhou Tel: 86-20-8755-8029 Korea - Daegu Tel: 82-53-744-4301 China - Hangzhou Tel: 86-571-8792-8115 Korea - Seoul Tel: 82-2-554-7200 China - Hong Kong SAR Tel: 852-2943-5100 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 China - Nanjing Tel: 86-25-8473-2460 Malaysia - Penang Tel: 60-4-227-8870 China - Qingdao Tel: 86-532-8502-7355 Philippines - Manila Tel: 63-2-634-9065 China - Shanghai Tel: 86-21-3326-8000 Singapore Tel: 65-6334-8870 China - Shenyang Tel: 86-24-2334-2829 Taiwan - Hsin Chu Tel: 886-3-577-8366 China - Shenzhen Tel: 86-755-8864-2200 Taiwan - Kaohsiung Tel: 886-7-213-7830 China - Suzhou Tel: 86-186-6233-1526 Taiwan - Taipei Tel: 886-2-2508-8600 China - Wuhan Tel: 86-27-5980-5300 Thailand - Bangkok Tel: 66-2-694-1351 China - Xian Tel: 86-29-8833-7252 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 DS20006095B-page 18 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-7288-4388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820  2018 - 2022 Microchip Technology Inc. and its subsidiaries 09/14/21
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