MIC5237
500 mA Low Dropout Regulator
Features
General Description
• Guaranteed 500 mA Output Over the Full
Operating Temperature Range
• Low 300 mV Typical Dropout Voltage at Full Load
• Extremely Tight Load and Line Regulation
• Current and Thermal Limiting
• Reversed-Battery Protection
• TO-220 and TO-263 Packages
• Low Temperature Coefficient
• No-Load Stability
• Low Noise Output
The MIC5237 is a general-purpose low-dropout
regulator capable of 500 mA output current with better
than 3% output voltage accuracy. Using Microchip’s
proprietary Super ßeta PNP process with a PNP pass
element, these regulators feature less than 300 mV
dropout voltage and typically 8 mA ground current at
full load.
Designed for applications that require moderate
current over a broad input voltage range, including
hand-held and battery-powered devices, the MIC5237
is intended for applications that can tolerate moderate
voltage drop at higher current.
Applications
•
•
•
•
•
Key features include low ground current to help prolong
battery life, reversed-battery protection, current
limiting, overtemperature shutdown, and thermally
efficient packaging. The MIC5237 is available in fixed
output voltages only.
Portable and Laptop Computers
Desktop Computer
Battery Chargers
SMPS Post-Regulator and DC/DC Modules
Consumer and Personal Electronics
For space-critical applications and improved
performance, see the MIC5209 and MIC5219. For
output current requirements up to 750 mA, see the
MIC2937.
Package Types
MIC5237
3-Lead TO-263 (U)
3
OUT
2
GND
1
IN
2018 - 2022 Microchip Technology Inc. and its subsidiaries
TAB
TAB
MIC5237
3-Lead TO-220 (T)
3
OUT
2
GND
1
IN
DS20006095B-page 1
MIC5237
Typical Application Circuit
MIC5237
VIN
5.6V
MIC5237-5.0
IN
1.0μF
VOUT
5.0V ± 3%
OUT
GND
1.0μF
Tantalum
Functional Block Diagram
VIN
OUT
IN
VOUT
COUT
Bandgap
Ref.
Current Limit
Thermal Shutdown
MIC5237-x.x
GND
DS20006095B-page 2
2018 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5237
1.0
ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings †
Supply Input Voltage (VIN) .......................................................................................................................... –20V to +20V
Power Dissipation (PD) (Note 1) ............................................................................................................ Internally Limited
Operating Ratings ‡
Supply Input Voltage (VIN) ......................................................................................................................... +2.5V to +16V
† Notice: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of the device at those or any other conditions above those indicated
in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended
periods may affect device reliability.
‡ Notice: The device is not guaranteed to function outside its operating ratings.
Note 1: The maximum allowable power dissipation at any TA (ambient temperature) is calculated using: PD(max) =
(TJ(max) – TA) ÷ θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown.
ELECTRICAL CHARACTERISTICS
Electrical Characteristics: VIN = VOUT + 1.0V; COUT = 4.7 µF; IOUT = 100 µA; TJ = +25°C, bold values indicate
–40°C ≤ TJ ≤ +125°C; unless noted.
Parameter
Min.
Typ.
Max.
–3
—
3
–5
—
5
∆VOUT/∆T
—
40
—
Line Regulation
∆VOUT/
VOUT
—
—
0.05
—
0.015
0.1
Load Regulation
∆VOUT/
VOUT
—
0.05
0.5
—
—
0.7
Output Voltage Accuracy
Output Voltage Temperature
Coefficient
Dropout Voltage, Note 3
Ground Pin Current, Note 4
Ripple Rejection
Symbol
VOUT
VIN –
VOUT
IGND
PSRR
Units
%
ppm/°C
%/V
%
—
10
70
mV
—
—
90
mV
—
115
190
mV
—
—
280
mV
—
165
350
mV
—
—
450
mV
—
300
600
mV
—
—
700
mV
—
80
130
µA
—
—
170
µA
—
350
650
µA
—
—
900
µA
—
1.8
2.5
mA
—
—
3.0
mA
—
8
15
mA
—
—
20
mA
—
75
—
dB
2018 - 2022 Microchip Technology Inc. and its subsidiaries
Conditions
Variation from nominal VOUT.
Note 1
VIN = VOUT + 1V to 16V
IOUT = 100 µA to 500 mA, Note 2
IOUT = 100 µA
IOUT = 50 mA
IOUT = 150 mA
IOUT = 500 mA
IOUT = 100 µA
IOUT = 50 mA
IOUT = 150 mA
IOUT = 500 mA
f = 120 Hz
DS20006095B-page 3
MIC5237
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Characteristics: VIN = VOUT + 1.0V; COUT = 4.7 µF; IOUT = 100 µA; TJ = +25°C, bold values indicate
–40°C ≤ TJ ≤ +125°C; unless noted.
Parameter
Current Limit
Thermal Regulation
Output Noise
Note 1:
2:
3:
4:
5:
Symbol
Min.
Typ.
—
700
900
—
—
1000
∆VOUT/
∆PD
—
0.05
—
%/W
eno
—
500
—
nV/√Hz
ILIMIT
Max.
Units
Conditions
mA
VOUT = 0V
Note 5
VOUT = 5.0V, IOUT = 50 mA,
COUT = 2.2 µF
Output voltage temperature coefficient is defined as the worst case voltage change divided by the total
temperature range.
Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are
tested for load regulation in the load range from 100 µA to 500 mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its
nominal value measured at 1V differential.
Ground pin current is the regulator quiescent current plus pass transistor base current. The total current
drawn from the supply is the sum of the load current plus the ground pin current.
Thermal regulation is defined as the change in output voltage at a time “t” after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a 500 mA load pulse at VIN =
16V for t = 10 ms.
DS20006095B-page 4
2018 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5237
TEMPERATURE SPECIFICATIONS (Note 1)
Parameters
Sym.
Min.
Typ.
Max.
Units
Conditions
Junction Operating Temperature
Range
TJ
–40
—
+125
°C
—
Lead Temperature
—
—
—
+260
°C
Soldering, 5s
JC
—
3
—
°C/W
JC
—
3
—
°C/W
—
JA
—
55
—
°C/W
—
Temperature Ranges
Package Thermal Resistances
Thermal Resistance TO-263
Thermal Resistance TO-220
Note 1:
—
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +125°C rating. Sustained junction temperatures above +125°C can impact the device reliability.
2018 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006095B-page 5
MIC5237
Note:
TYPICAL PERFORMANCE CURVES
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0
-20
PSRR (dB)
60
VIN = 6V
VOUT = 5V
RIPPLE REJECTION (dB)
2.0
-40
-60
-80
IOUT = 100μA
COUT = 1μF
50
30
Power Supply Rejection
0
0
-60
-80
IOUT = 1mA
COUT = 1μF
-100
1k 1E+4
1E+1
10k 1E+5
1M 1E+7
10M
10 1E+2
100k 1E+6
100 1E+3
FREQUENCY (Hz)
FIGURE 2-2:
Ratio.
Power Supply Rejection
0
0.1
0.2
0.3
VOLTAGE DROP (V)
0.4
FIGURE 2-4:
Power Supply Ripple
Rejection vs. Voltage Drop.
10
1
NOISE (μV/¥Hz)
PSRR (dB)
-40
IOUT = 100mA
COUT = 1μF
10
VIN = 6V
VOUT = 5V
-20
10mA
20
-100
1k 1E+4
1E+1
10k 1E+5
1M 1E+7
10M
10 1E+2
100k 1E+6
100 1E+3
FREQUENCY (Hz)
FIGURE 2-1:
Ratio.
1mA
40
100mA
10mA
0.1
0.01
0.001
VOUT = 5V
COUT = 10μF
electrolytic
1mA
0.0001
1k 1E+4
10 1E+2
1M 1E+7
10k 1E+5
100k 1E+6
10M
1E+1
100 1E+3
FREQUENCY (Hz)
FIGURE 2-5:
Noise Performance.
0
PSRR (dB)
-20
VIN = 6V
VOUT = 5V
-40
-60
-80
IOUT = 100mA
COUT = 1μF
-100
1k 1E+4
1E+1
10k 1E+5
1M 1E+7
10M
10 1E+2
100k 1E+6
100 1E+3
FREQUENCY (Hz)
FIGURE 2-3:
Ratio.
DS20006095B-page 6
Power Supply Rejection
2018 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5237
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
Pin Number
Pin Name
Description
1
IN
2, TAB
GND
Ground: TO-220 and TO-263 pin 2 and TAB are internally connected.
3
OUT
Regulator output.
Supply input.
2018 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006095B-page 7
MIC5237
4.0
APPLICATION INFORMATION
The MIC5237 is intended for general purpose use and
can be implemented in a wide variety of applications
where 500 mA of output current is needed. It is
available in several voltage options for ease-of-use.
For voltage options that are not available on the
MIC5237, consult the MIC5209 for a 500 mA
adjustable LDO regulator, or the MIC5219 for
applications that require only short-duration peak
output current.
4.1
Input Capacitor
A 1 µF capacitor should be placed from IN to GND if
there is more than 10 inches of wire between the input
and the ac filter capacitor or if a battery is used as the
input.
4.2
The output capacitor should have an ESR (equivalent
series resistance) of about 5Ω or less and a resonant
frequency above 1 MHz. Ultra low-ESR capacitors can
cause low-amplitude oscillations and/or under-damped
transient response. Most tantalum or aluminum
electrolytic capacitors are adequate; film types will
work, but are more expensive. Because many
aluminum electrolytics have electrolytes that freeze at
about –30°C, solid tantalums are recommended for
operation below –25°C.
At lower values of output current, less output
capacitance is needed for output stability. The
capacitor can be reduced to 0.47 µF for current below
10 mA or 0.33 µF for currents below 1 mA.
For 2.5V applications a 22 µF output capacitor is
recommended to reduce startup voltage overshoot.
No-Load Stability
The MIC5237 will remain stable and in regulation with
no load (other than the internal voltage divider) unlike
many other voltage regulators. This is especially
important in CMOS RAM keep-alive applications.
4.4
The regulator ground current, IGND, can be measured
or read from the data sheet. Assuming the worst case
scenario is good design procedure, and the
corresponding ground current number can be obtained
from the data sheet. First, calculate the power
dissipation of the device. This example uses the
MIC5237-5.0YT, a 13V input, and 500 mA output
current, which results in 20 mA of ground current, worst
case. The power dissipation is the sum of two power
calculations: voltage drop × output current and input
voltage × ground current.
EQUATION 4-1:
P D = V IN – V OUT I OUT + V IN I GND
Output Capacitor
An output capacitor is required between OUT and GND
to prevent oscillation. 1 µF minimum is recommended
for standard applications. Larger values improve the
regulator’s transient response. The output capacitor
value may be increased without limit.
4.3
• TA = Ambient Operating Temperature
• IGND = Ground Current
Thermal Considerations
Proper thermal design can be accomplished with some
basic design criteria and some simple equations. The
following information is required to implement a
regulator design.
EQUATION 4-2:
P D = 13V – 5V 500mA + 13V 20mA
= 4.260W
From this number, the heat sink thermal resistance is
determined using the regulator’s maximum operating
junction temperature (TJ(max)) and the ambient
temperature (TA) along with the power dissipation
number already calculated.
•
•
•
•
•
TJMAX = 125°C
θJC = Junction-to-Case Thermal Resistance
θCS = Case-to-Sink Thermal Resistance
θJA = Junction-to-Ambient Thermal Resistance
θSA = Sink-to-Ambient Thermal Resistance
To determine the heat sink thermal resistance, the
junction-to-case thermal resistance of the device must
be used along with the case-to-heat sink thermal
resistance. These numbers show the heat sink thermal
resistance required at TA = 25°C that does not exceed
the maximum operating junction temperature.
EQUATION 4-3:
T J MAX – T A
JA = ------------------------------PD
• VIN = Input Voltage
• VOUT = Output Voltage
• IOUT = Output Current
DS20006095B-page 8
2018 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5237
EQUATION 4-4:
SA = JA – JC
θCS is approximately 1°C/W and θJC for the TO-220 is
3°C/W in this example.
EQUATION 4-5:
125C – 25C
JA = ----------------------------------- = 23.5C/W
4.260W
EQUATION 4-6:
SA = 23.5C/W – 3C/W + 1C/W = 19.5C/W
Therefore, a heat sink with a thermal resistance of
19.5°C/W will allow the part to operate safely and it will
not exceed the maximum junction temperature of the
device. The heat sink can be reduced by limiting power
dissipation, by reducing the input voltage or output
current. Either the TO-220 or TO-263 package can
operate reliably at 2W of power dissipation without a
heat sink. Above 2W, a heat sink is recommended.
2018 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006095B-page 9
MIC5237
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
3-Lead TO-220*
XXXX
-X.XXX
WNNNP
3-Lead TO-263*
XXXX
-X.XXX
WNNNP
Legend: XX...X
Y
YY
WW
NNN
e3
*
Example
5237
-5.0YT
7V1WP
Example
5237
-3.3YU
67BUP
Product code or customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up, or delta down (triangle
mark).
Note:
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
Note:
If the full seven-character YYWWNNN code cannot fit on the package, the following truncated codes are
used based on the available marking space:
6 Characters = YWWNNN; 5 Characters = WWNNN; 4 Characters = WNNN; 3 Characters = NNN;
2 Characters = NN; 1 Character = N
DS20006095B-page 10
2018 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5237
3-Lead TO-220 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
2018 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006095B-page 11
MIC5237
3-Lead TO-263 Package Outline and Recommended Land Pattern
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
DS20006095B-page 12
2018 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5237
APPENDIX A:
REVISION HISTORY
Revision A (October 2018)
• Converted Micrel document MIC5237 to Microchip data sheet DS20006095A.
• Minor text changes throughout.
Revision B (February 2022)
• Updated the Package Marking Information drawing with the most current marking information.
2018 - 2022 Microchip Technology Inc. and its subsidiaries
DS20006095B-page 13
MIC5237
NOTES:
DS20006095B-page 14
2018 - 2022 Microchip Technology Inc. and its subsidiaries
MIC5237
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
PART NO.
Device
–X.X
X
XX
–XX
Examples:
a) MIC5237-2.5YU:
500 mA Low Dropout Regulator
2.5V, –40°C to +125°C,
3-Lead TO-263, 50/Tube
b) MIC5237-2.5YU-TR:
500 mA Low Dropout Regulator
2.5V, –40°C to +125°C,
3-Lead TO-263, 750/Reel
c) MIC5237-3.3YU:
500 mA Low Dropout Regulator
3.3V, –40°C to +125°C,
3-Lead TO-263, 50/Tube
d) MIC5237-3.3YU-TR:
500 mA Low Dropout Regulator
3.3V, –40°C to +125°C,
3-Lead TO-263, 750/Reel
e) MIC5237-5.0YU:
500 mA Low Dropout Regulator
5.0V, –40°C to +125°C,
3-Lead TO-263, 50/Tube
f) MIC5237-5.0YU-TR:
500 mA Low Dropout Regulator
5.0V, –40°C to +125°C,
3-Lead TO-263, 750/Reel
g) MIC5237-5.0YT:
500 mA Low Dropout Regulator
5.0V, –40°C to +125°C,
3-Lead TO-220, 50/Tube
Voltage Temperature Package Media Type
Device:
MIC5237:
Voltage:
2.5
3.3
5.0
=
=
=
2.5V (TO-263 Only)
3.3V (TO-263 Only)
5.0V (Both Packages)
Temperature:
Y
=
–40°C to +125°C
Package:
T
U
=
=
3-Lead TO-220
3-Lead TO-263
Media Type:
= 50/Tube (Both Packages)
TR =
750/Reel (TO-263 Only)
500 mA Low Dropout Regulator
Note 1:
2018 - 2022 Microchip Technology Inc. and its subsidiaries
Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
DS20006095B-page 15
MIC5237
NOTES:
DS20006095B-page 16
2018 - 2022 Microchip Technology Inc. and its subsidiaries
Note the following details of the code protection feature on Microchip products:
•
Microchip products meet the specifications contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is secure when used in the intended manner, within operating specifications, and
under normal conditions.
•
Microchip values and aggressively protects its intellectual property rights. Attempts to breach the code protection features of
Microchip product is strictly prohibited and may violate the Digital Millennium Copyright Act.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not
mean that we are guaranteeing the product is “unbreakable”. Code protection is constantly evolving. Microchip is committed to
continuously improving the code protection features of our products.
This publication and the information herein may be used only
with Microchip products, including to design, test, and integrate
Microchip products with your application. Use of this information in any other manner violates these terms. Information
regarding device applications is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your
specifications. Contact your local Microchip sales office for
additional support or, obtain additional support at https://
www.microchip.com/en-us/support/design-help/client-supportservices.
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RELATED TO THE INFORMATION INCLUDING BUT NOT
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ISBN: 978-1-5224-9779-0
DS20006095B-page 17
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Fax: 43-7242-2244-393
China - Chengdu
Tel: 86-28-8665-5511
India - Pune
Tel: 91-20-4121-0141
China - Chongqing
Tel: 86-23-8980-9588
Japan - Osaka
Tel: 81-6-6152-7160
China - Dongguan
Tel: 86-769-8702-9880
Japan - Tokyo
Tel: 81-3-6880- 3770
China - Guangzhou
Tel: 86-20-8755-8029
Korea - Daegu
Tel: 82-53-744-4301
China - Hangzhou
Tel: 86-571-8792-8115
Korea - Seoul
Tel: 82-2-554-7200
China - Hong Kong SAR
Tel: 852-2943-5100
Malaysia - Kuala Lumpur
Tel: 60-3-7651-7906
China - Nanjing
Tel: 86-25-8473-2460
Malaysia - Penang
Tel: 60-4-227-8870
China - Qingdao
Tel: 86-532-8502-7355
Philippines - Manila
Tel: 63-2-634-9065
China - Shanghai
Tel: 86-21-3326-8000
Singapore
Tel: 65-6334-8870
China - Shenyang
Tel: 86-24-2334-2829
Taiwan - Hsin Chu
Tel: 886-3-577-8366
China - Shenzhen
Tel: 86-755-8864-2200
Taiwan - Kaohsiung
Tel: 886-7-213-7830
China - Suzhou
Tel: 86-186-6233-1526
Taiwan - Taipei
Tel: 886-2-2508-8600
China - Wuhan
Tel: 86-27-5980-5300
Thailand - Bangkok
Tel: 66-2-694-1351
China - Xian
Tel: 86-29-8833-7252
Vietnam - Ho Chi Minh
Tel: 84-28-5448-2100
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800
Raleigh, NC
Tel: 919-844-7510
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Tel: 408-436-4270
Canada - Toronto
Tel: 905-695-1980
Fax: 905-695-2078
DS20006095B-page 18
China - Xiamen
Tel: 86-592-2388138
China - Zhuhai
Tel: 86-756-3210040
Denmark - Copenhagen
Tel: 45-4485-5910
Fax: 45-4485-2829
Finland - Espoo
Tel: 358-9-4520-820
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Garching
Tel: 49-8931-9700
Germany - Haan
Tel: 49-2129-3766400
Germany - Heilbronn
Tel: 49-7131-72400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Norway - Trondheim
Tel: 47-7288-4388
Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
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09/14/21