MTD6508
3-Phase Sinusoidal Sensorless Brushless DC Fan Motor Driver
Features
Description
• 180° Sinusoidal Drive for High Efficiency and Low
Acoustic Noise
• Position Sensorless BLDC Drivers
(no Hall Effect Sensor required)
• Integrated Power Transistors
• Supports 2V to 5.5V Power Supplies
• Variable Programming Resistor (RPROG) Setting
to fit Motor Constant (KM) Range from 3.25 mV/
Hz to 52 mV/Hz
• Speed Control through Power Supply Modulation
(PSM) and/or Pulse-Width Modulation (PWM)
• Built-in Frequency Generator: FG, FG/3 Output
Signal (FG/2 and FG/6 Option are available upon
request)
• Output PWM Slew Rate Control Programmable
with an External Resistor for Start-up
(Adjustable version)
• Phase Target Selection for Regulation
(Adjustable Version)
• Start-up Strength Selection (Adjustable Version)
• Start-up Output Current Controlled by PWM
• Output Current Soft Start
• Built-in Lock-up Protection and Automatic
Recovery Circuit
• Built-in Overcurrent Limitation
• Built-in Thermal Shutdown Protection
• Built-in Overvoltage Protection
• Low Minimal Start-up Speed for Low-Speed
Operation
• Packages:
- 10-Lead 3 mm x 3 mm x 0.5 mm UDFN
- 16-Lead 4 mm x 4 mm x 0.5 mm UQFN
(Adjustable version)
The MTD6508 device is a 3-phase, full-wave
sensorless driver for brushless DC (BLDC) motors. It
features a 180° sinusoidal drive, high torque output and
silent drive. With adaptive features, parameters and a
wide range of power supplies (2V to 5.5V), the
MTD6508 is intended to cover a broad range of motor
characteristics while requiring minimum external
components. Speed control can be achieved through
either power supply modulation (PSM) or pulse-width
modulation (PWM).
Compact packaging and a minimal bill of materials
make the MTD6508 device extremely cost-efficient in
fan applications. For example, the CPU cooling fans in
notebook computers require designs that provide low
acoustic noise, low mechanical vibration and are highly
efficient. The frequency generator (FG) output enables
precision speed control in closed-loop applications.
The MTD6508 device includes Lock-up Protection
mode to turn off the output current when the motor is in
a lock condition, with an automatic recovery feature to
restart the fan when the lock condition is removed.
Motor overcurrent limitation and thermal shutdown
protection are included for safety-enhanced operations.
The MTD6508 is available in compact, thermallyenhanced, 10-Lead 3 mm x 3 mm x 0.5 mm UDFN
packages and 16-Lead 4 mm x 4 mm x 0.5 mm
UQFN packages.
Applications
• Notebook CPU Cooling Fans
• 5V 3-Phase BLDC Motors
2015 Microchip Technology Inc.
DS20005359A-page 1
MTD6508
Package Types
RPROG 2
8 VDD
OUT2 5
6 GND
VBIAS 3
SS
10 FG3_SEL
9 VDD
OUT2 4
5
6
7
8
OUT3
7 OUT3
GND
OUT1 4
11 PWM
EP
17
OUT1
VBIAS 3
12 RT
FG 1
9 FG3_SEL
EP
11
SR2
DIR
RPROG 2
16 15 14 13
10 PWM
GND
FG 1
SR1
MTD6508
4x4 UQFN-16*
MTD6508
3x3 UDFN-10*
Note: The DIR, SS and RT pins that are not available on UDFN-10 Package are internally pulled down. SR1 and
SR2 are connected by a fixed internal resistor (25 kΩ).
*Includes Exposed Thermal Pad (EP); see Table 3-1.
Functional Block Diagram
VBIAS
RT
SS
DIR
FG
PWM
CPU + Peripherals
Output Drive Circuit
VDD
OUT3
OUT2
OUT1
FG3_SEL
GND
Motor Phase
Detection Circuit
Nonvolatile
Memory
RPROG
DS20005359A-page 2
RPROG Sense
Adju stable K M
Thermal
Protection
Slew Rate
Control
Overcurrent
Protection
Short-Circuit
Protection
SR1
SR2
2015 Microchip Technology Inc.
MTD6508
Typical Application
VLOGIC
RSR
VLOGIC
VLOGIC
SS
16
15
14
13
FG
RT
12
1
RPROG
VBIAS
OUT2
2
11
EP
17
3
10
4
9
5
6
7
8
GND
OUT1
GND
OUT3
C2
PWM input
(1-100 kHz)
VLOGIC
PWM
RPWM
SR2
VLOGIC
SR1
VBIAS
RPROG
VBIAS
KM3
DIR
KM1, 2
RFG
KM0
VBIAS
FG3_SEL
VDD
VDD
C1
Legend
VLOGIC = VBIAS or VDD
= Optional
Recommended External Components for Typical Application
Element
Type/Value
Comment
C1
1 µF
Connect as close as possible to IC input pin
C2
1 µF
Connect as close as possible to IC input pin
RFG
10 kΩ
Connect to Vlogic on microcontroller side (FG Pull-Up)
RPWM
100 kΩ
Connect to Vlogic on microcontroller side (PWM Pull-Up)
RPROG
3.9 kΩ or 24 kΩ
RSR
4.7 kΩ-47 kΩ
2015 Microchip Technology Inc.
Select appropriate programming resistor value, see Table 4-1
Select appropriate output PWM slew rate, see Table 4-2
DS20005359A-page 3
MTD6508
NOTES:
DS20005359A-page 4
2015 Microchip Technology Inc.
MTD6508
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Power Supply Voltage (VDD_MAX) ...................... -0.7 to +7.0V
Maximum Output Voltage (VOUT_MAX) ............... -0.7 to +7.0V
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only, and functional operation of
the device at those or any other conditions above those
indicated in the operational listings of this specification
is not implied. Exposure to maximum rating conditions
for extended periods may affect device reliability.
Maximum Output Current (IOUT_MAX)(1) ....................1000 mA
Note 1: IOUT is also internally limited, according
to the limits defined in the Electrical
Characteristics table.
FG Maximum Output Voltage (VFG_MAX) ........... -0.7 to +7.0V
FG Maximum Output Current (IFG_MAX) ......................5.0 mA
VBIAS Maximum Voltage (VBIAS_MAX) ................ -0.7 to +4.0V
2: Reference Printed Circuit Board (PCB)
according to JEDEC standard EIA/JESD
51-9.
PWM Maximum Voltage (VPWM_MAX) ................ -0.7 to +7.0V
Allowable Power Dissipation (PD_MAX)
(2)
........................1.5W
Maximum Junction Temperature (TJ) .......................... +150°C
ESD protection on all pins 2 kV
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 2.0V to 5.5V, TA = +25°C
Parameters
Sym.
Min.
Typ.
Max.
Units
Power Supply Voltage
VDD
2
—
5.5
V
Power Supply Current
IVDD
—
5
10
mA
VDD = 5V
IVDD_STB
—
15
25
µA
PWM = 0V, VDD = 5V
(Standby mode)
OUTX High Resistance
RON(H)
—
0.75
—
Ω
IOUT = 0.5A, VDD = 5V
OUTX Low Resistance
RON(L)
—
0.75
—
Ω
IOUT = 0.5A, VDD = 5V
OUTX Total Resistance
RON(H+L)
—
1.5
—
Ω
IOUT = 0.5A, VDD = 5V
VBIAS Internal
Supply Voltage
VBIAS
—
3
—
V
VDD = 3.2V to 5.5V
—
VDD – 0.2
—
V
VDD < 3.2V
PWM Input Frequency
fPWM
1
—
100
kHz
PWM Input H Level
VPWM_H
0.55 VDD
—
VDD
V
VDD 4.5V
PWM Input L Level
VPWM_L
0
—
0.2 VDD
V
VDD 4.5V
Standby Current
Conditions
FG3_SEL Input H Level
VFG3_SEL_H VBIAS – 0.5
—
VBIAS
V
VDD 4.5V
FG3_SEL Input L Level
VFG3_SEL_L
0
—
0.2 VDD
V
VDD 4.5V
FG Output Pin Low-Level
Voltage
VOL_FG
—
—
0.25
V
IFG = -1 mA
FG Output Pin Leakage
Current
ILH_FG
-10
—
10
µA
VFG = 5.5V
Lock Protection
Operating Time
TRUN
—
0.5
1
s
Lock Protection Waiting Time
TWAIT
5
5.5
6
s
Note 1
IOC_MOT
—
750
—
mA
Note 2
Overcurrent Protection
Note 1:
2:
Related to the internal oscillator frequency (see Figure 2-1)
750 mA is the standard option for MTD6508. Additional overcurrent protection levels are available upon
request. Please contact factory for different overcurrent protection values.
2015 Microchip Technology Inc.
DS20005359A-page 5
MTD6508
ELECTRICAL CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 2.0V to 5.5V, TA = +25°C
Parameters
Sym.
Min.
Typ.
Max.
Units
VOV
—
7.2
—
V
Short Protection on High Side
IOC_SW_H
—
2.57
—
A
Short Protection on Low Side
IOC_SW_L
—
-2.83
—
A
TSD
—
170
—
°C
TSD_HYS
—
25
—
°C
Overvoltage Protection
Thermal Shutdown
Thermal Shutdown Hysteresis
Note 1:
2:
Conditions
Related to the internal oscillator frequency (see Figure 2-1)
750 mA is the standard option for MTD6508. Additional overcurrent protection levels are available upon
request. Please contact factory for different overcurrent protection values.
TEMPERATURE SPECIFICATIONS
Electrical Specifications: Unless otherwise specified, all limits are established for VDD = 2.0V to 5.5V, TA = +25°C.
Parameters
Sym.
Min.
Typ.
Max.
Units
Operating Temperature
TOPR
-40
—
+125
°C
Storage Temperature Range
TSTG
-55
—
+150
°C
JA
—
68
—
°C/W
JC
—
11
—
°C/W
JA
—
31.8
—
°C/W
JC
—
10
—
°C/W
Conditions
Temperature Ranges
Thermal Package Resistances
Thermal Resistance, 10L-UDFN, 3x3
Thermal Resistance, 16L-UQFN, 4x4
DS20005359A-page 6
2015 Microchip Technology Inc.
MTD6508
2.0
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
1
0.5
0
-0.5
-1
-1.5
-2
-2.5
-3
-3.5
-4
-4.5
2.5
VDD = 5.5V
VDD
V
5.5
DD ==5.5V
2
VDD = 2V
1.5
PWM V IL (V)
Oscillator Frequeny Deviation
(%)
Note: Unless indicated, TA = +25°C, VDD = 2.0V to 5.5V, OUT1, 2, 3 and PWM open.
1
VDD = 2V
0.5
0
-40 -25 -10 5
-40 -25 -10
20 35 50 65 80 95 110 125
5
20
35
50
65
80
95 110 125
Temperature (°C)
Temperature (°C)
FIGURE 2-4:
Temperature.
FIGURE 2-1:
Oscillator Frequency
Deviation vs. Temperature.
3.08
Inputs (PWM) VIL vs.
3
VDD = 5.5V
2.5
VDD = 5.5V
3.04
2
PWM VIH (V)
VBIAS (V)
3.06
1.5
1
3.02
VDD = 2V
0.5
0
3
-40 -25 -10 5
-40 -25 -10
20 35 50 65 80 95 110 125
20
35
50
65
80
95 110 125
Temperature (°C)
Temperature (°C)
FIGURE 2-2:
Internal Regulated Voltage
(VBIAS) vs Temperature.
FIGURE 2-5:
Temperature.
3.5
Inputs (PWM) VIH vs.
1
0.9
3
0.8
RON High Side (ȍ)
2.5
VBIAS (V)
5
2
1.5
1
0.7
0.6
VDD = 5.5V
0.5
0.4
0.3
0.2
0.5
0.1
0
0
2.0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VDD(V)
FIGURE 2-3:
Internal Regulated Voltage
(VBIAS) vs Supply Voltage (VDD).
2015 Microchip Technology Inc.
-40
-25
-10
5
20
35
50
65
80
95
110 125
Temperature (°C)
FIGURE 2-6:
Outputs RON High-Side
Resistance vs. Temperature.
DS20005359A-page 7
MTD6508
Note: Unless indicated, TA = +25°C, VDD = 2.0V to 5.5V, OUT1, 2, 3 and PWM open.
DIR, SS and RT Pins VIL (V)
RON Low Side (ȍ)
2.5
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VDD = 5.5V
2
VDD = 5.5V
1.5
1
VDD = 2V
0.5
0
-40
-25
-10
5
20
35
50
65
80
95
110 125
-40 -25 -10 5
20 35 50 65 80 95 110 125
Temperature (°C)
Temperature (°C)
FIGURE 2-7:
Outputs RON Low-Side
Resistance vs. Temperature.
FIGURE 2-10:
vs. Temperature.
DIR, SS and RT Pins VIL (V)
2.5
DIR, SS and RT Pins VIH (V)
7
IVDD Current (mA)
6
VDD = 5.5V
5
4
VDD = 2V
3
2
1
0
-40 -25 -10
5
20
35
50
65
80
95 110 125
2
1.5
VDD = 5.5V
1
0.5
VDD = 2V
0
-40 -25 -10 5
Temperature (°C)
FIGURE 2-8:
Temperature.
Supply Current vs.
20 35 50 65 80 95 110 125
Temperature (°C)
FIGURE 2-11:
vs. Temperature.
DIR, SS and RT Pins VIH (V)
FIGURE 2-12:
Loop.
Typical Outputs on Closed
IVDD_STB Current (μA)
40
30
20
VDD = 5.5V
10
0
-40 -25 -10 5
20 35 50 65 80 95 110 125
Temperature (°C)
FIGURE 2-9:
Temperature.
DS20005359A-page 8
Standby Current vs.
2015 Microchip Technology Inc.
MTD6508
FIGURE 2-13:
Start-up.
Typical Output Current on
FIGURE 2-14:
Typical Outputs on Locked
Motor While Running.
2015 Microchip Technology Inc.
DS20005359A-page 9
MTD6508
3.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1:
PIN FUNCTION TABLE
MTD6508
3x3
UDFN
4x4
UQFN
Name
Type
Function
1
1
FG
O
Motor Speed Indication Output Pin
2
2
RPROG
I
KM Parameter Setting with External Resistors Pin (do not leave floating)
3
3
VBIAS
O
3V Internal Regulator Output Pin (for decoupling only)
5
4
OUT2
O
Single-Phase Coil Output Pin
6
5
GND
P
Negative Voltage Supply Pin (ground)
4
6
OUT1
O
Single-Phase Coil Output Pin
6
7
GND
P
Negative Voltage Supply Pin (ground)
7
8
OUT3
O
Single-Phase Coil Output Pin
8
9
VDD
P
Positive Voltage Supply for Motor Driver Pin
9
10
FG3_SEL
I
FG Frequency Divider Selection Pin:
- FG signal divided by three: connect this pin to VBIAS
- FG normal signal: connect this pin to GND or leave floating
10
11
PWM
I
PWM Input Signal for Close-Loop Speed Control Pin (do not leave floating)
—
12
RT
I
Regulation Target Pin – phase target selection for regulation:
- Normal regulation: connect this pin to GND or leave floating
- Low load regulation: connect this pin to VBIAS or VDD
- Pin not available on UDFN-10 option; selection fixed to normal
regulation
—
13
SS
I
Strong Start Pin – start-up strength selection:
- Soft open-loop start-up (reduced current) – during the start-up openloop, the output amplitude is defined by the input PWM duty cycle:
connect this pin to GND or leave floating
- Strong open-loop start-up – during the start-up open-loop, the output
amplitude is fixed to 100%: connect this pin to VBIAS or VDD
- Pin not available on UDFN-10 option; selection fixed to soft
open-loop start-up
—
14
SR2
O
Start-up Output PWM Slew Rate Control Pin 2 (High side)
- Pin not available on UDFN-10 option; selection fixed to 250 ns (25 kΩ)
—
15
SR1
I
Start-up Output PWM Slew Rate Control Pin 1 (Low side)
- Pin not available on UDFN-10 option; selection fixed to 250 ns (25 kΩ)
—
16
DIR
I
Motor Rotation Direction Pin (DIR function):
- Forward direction: connect this pin to GND or leave floating
- Reverse direction: connect this pin to VBIAS or VDD
- Pin not available on UDFN-10 option; selection fixed to forward
direction
11
17
EP
N/A
Note:
Exposed Pad Pin; connect to ground plane on the PCB for enhanced thermal
performance
I = Input, O = Output, P = Power
DS20005359A-page 10
2015 Microchip Technology Inc.
MTD6508
4.0
FUNCTIONAL DESCRIPTION
The MTD6508 generates a full-wave signal to drive a
3-phase BLDC motor. High efficiency and low power
consumption are achieved due to CMOS transistors
and a synchronous rectification drive type.
4.1
Speed Control
The rotational speed of the motor can be controlled
either through the PWM digital input signal or by acting
directly on the power supply (VDD). When the PWM
signal is High, the motor rotates at full speed. When the
PWM signal is low, the IC outputs are set to highimpedance and the motor is stopped.
By changing the PWM duty cycle, the speed can be
adjusted. Thus, the user has maximum freedom to
choose the PWM system frequency within a wide range
(from 1 kHz to 100 kHz).
The PWM pin should not be floating. It can be connected
to an external pull-up resistor connected to VDD.
When the PWM duty cycle is below 5%, MTD6508
directly stops the drive (output High Z) and will restart
only if the PWM duty cycle is above 5%. If MTD6508 is
not in standby mode (PWM duty cycle = 0%), it will not
restart unless a “waiting time” (TWAIT) has been spent
in order to allow the fan to break enough before the
next start-up. TWAIT begins as soon as the PWM duty
cycle falls below 5%.
The output transistor activation always occurs at a fixed
rate of 30 kHz, which is outside the range of audible
frequencies.
Note 1: The PWM frequency has no direct effect
on the motor speed, and is asynchronous
with the activation of the output transistors.
4.2
Frequency Generator Function
The Frequency Generator output (FG) is a Hall effect
sensor equivalent digital output, giving information to
an external controller about the speed and phase of the
motor. The FG pin is an open-drain output connecting
to a logical voltage level through an external pull-up
resistor. When a lock or an out-of-sync situation is
detected by the driver, this output is set to highimpedance until the motor is restarted. The pin should
be left open when it is not used.
EQUATION 4-1:
FG 720
----------------------- = Rotor speed RPM
P S
Where:
P
= Total number of poles in the motor
S
= Total number of slots in the motor
2015 Microchip Technology Inc.
If the FG3_SEL pin is enabled, the rotor speed rotation
per minute (RPM) has to be multiplied by three, because
the FG signal frequency will be divided by three.
OUT1
FG
FG/3
FIGURE 4-1:
4.3
FG and FG/3 Waveform.
Lock-Up Protection and Automatic
Restart
If the motor is blocked and cannot rotate freely, a lockup protection circuit detects it and disables the driver by
setting its outputs to high-impedance to prevent the
motor coil from burnout. After a “waiting time” (TWAIT),
the lock-up protection is released and normal operation
resumes for a given time (TRUN). If the motor is still
blocked, a new period of waiting time is started. TWAIT
and TRUN timings are fixed internally so that no external
capacitor is required.
4.4
Overcurrent Protection
The motor peak current is limited by the driver to
750 mA (standard value), thus limiting the maximum
power dissipation in the coils.
4.5
Thermal Shutdown
The MTD6508 has a thermal protection function which
detects when the die temperature exceeds
TJ = +170°C. When this temperature is reached, the
circuit enters the Thermal Shutdown mode and the
outputs OUT1, OUT2 and OUT3 are disabled (highimpedance): avoiding the IC destruction and allowing
the circuit to cool down. When the junction temperature
(TJ) drops below +145°C, normal operation resumes.
The thermal detection circuit has +25°C hysteresis.
Thermal shutdown
Normal
operation
+170°
+145°
FIGURE 4-2:
Thermal Protection
Hysteresis.
TJ
DS20005359A-page 11
MTD6508
4.6
Overvoltage Shutdown
4.9
The MTD6508 has an overvoltage protection function
which detects when the VDD voltage exceeds
VOV = +7.2V. In Overvoltage condition, outputs OUT1,
OUT2 and OUT3 are disabled (high impedance).
4.7
Internal Voltage Regulator
VBIAS voltage is generated internally and is used to
supply internal logical blocks. The VBIAS pin is used to
connect an external decoupling capacitor (1 µF or
higher). Notice that this pin is for IC internal use, and is
not designed to supply DC current to external blocks.
4.8
Back Electromotive Force (BEMF)
Coefficient Setting
KM is the electromechanical coupling coefficient of the
motor (also referred to as “motor constant” or “BEMF
constant”). Depending on the conventions in use, the
exact definition of KM and its measurement criteria can
vary among motor manufacturers. To accommodate
various motor applications, the MTD6508 provides
options to facilitate various BEMF coefficients.
The MTD6508 defines the BEMF coefficient (KM) as
the peak value of the phase-to-phase BEMF voltage,
normalized to the electrical speed of the motor. The
following table offers methods to set the KM value for
the MTD6508 device.
TABLE 4-1:
KM
Option
KM SETTINGS
KM (mV/Hz) Range
Phase-to-Phase
RPROG
Min.
Max.
KM0
3.25
6.5
GND
KM1
6.5
13
24 kΩ
KM2
13
26
3.9 kΩ
KM3
26
52
VBIAS
RPROG sensing is actually a sequence that is controlled
by the firmware. For any given RPROG, the internal
control block will output the corresponding KM range.
Start-up Output PWM Slew Rate
Control
In order to reduce vibration, the output PWM slew rate
can be adjusted with RSR during start-up. Refer to
Table 4-2 when choosing the RSR value. A rate that is
too slow can decrease the efficiency of the IC. The
recommended RSR range is from 4.7 kΩ to 47 kΩ. The
RSR will be connected between pins SR1 and SR2.
Once the start-up open loop is finished, the MTD6508
will automatically switch to a fixed slew rate,
corresponding to 10 kΩ or 100 ns (typical).
TABLE 4-2:
SLEW RATE SETTINGS
Output PWM
Transition Time
for 10 to 90%
RSR.
Value
Comment
Rising/Falling edge
x kΩ
x 10.64 ns
Transition rate
equation
4.7 kΩ
50 ns
Fast transition
10 kΩ
100 ns
Typical transition
47 kΩ
500 ns
Slow transition
Note:
4.10
Slew rate adjustment on start-up can only
be done in the adjustable version of the
MTD6508.
Motor Rotation Direction Pin (DIR)*
The current-carrying order of the outputs depends on
the DIR pin state “Rotation Direction”, and is described
in Table 4-3. The DIR pin level is latched after poweron or after exiting standby mode. The DIR pin is not
designed for dynamic direction change during
operation. The pin is internally connected to GND on
the non-adjustable version.
TABLE 4-3:
DIR Pin State
MOTOR ROTATION
DIRECTION OPTIONS
Rotation
Direction
Connected to
Forward
GND or Floating
Outputs Activation
Sequence
OUT1 -> OUT2 -> OUT3
Connected to
Reverse OUT3 -> OUT2 -> OUT1
VBIAS or VDD
*On adjustable version only
DS20005359A-page 12
2015 Microchip Technology Inc.
MTD6508
4.11
Strong Start Pin (SS)*
The sinusoidal start-up open-loop phase current
amplitude can be defined by the PWM input duty cycle
or fixed at 100%. Table 4-4 describes both start-up
options. This pin is internally connected to GND on the
non-adjustable version.
TABLE 4-4:
START-UP OPEN-LOOP CURRENT AMPLITUDE OPTIONS
SS Pin State
Start-up Open-Loop Current Amplitude
Connected to GND or Floating
Soft open-loop start-up (reduced current) – during the start-up open loop, the output
amplitude is defined by the input PWM duty cycle (start-up without speed overshoot,
with respect to the target speed set by PWM).
Connected to VBIAS or VDD
Strong open-loop start-up – during the start-up open loop, the output amplitude is
fixed at 100% (start-up with maximal torque.
*On adjustable version only
4.12
Regulation Target Pin (RT)*
The RT pin adjusts the phase regulation parameters
to allow more stability in applications using 3-Phase
BLDC motors attached to a light load. The low-load
phase regulation option reduces the speed correction
gain by 75% in order to produce smoother behavior.
Table 4-5 describes the phase regulation options.
The RT pin is internally connected to GND on the
non-adjustable version.
TABLE 4-5:
PHASE REGULATION
OPTIONS
RT Pin State
Phase Regulation
Target Options
Connected to GND or Floating Optimized for typical
load (Fan, Pump)
Connected to VBIAS or VDD
Optimized for low
load (Motor with light
rotor and low air
resistance while
operating)
*On adjustable version only
2015 Microchip Technology Inc.
DS20005359A-page 13
MTD6508
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
10-Lead UDFN (3x3x0.5 mm)
Example
XXXX
YYWW
NNN
AAAL
1441
256
PIN 1
PIN 1
16-Lead UQFN (4x4x0.5 mm)
PIN 1
Example
PIN 1
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
DS20005359A-page 14
MTD
6508
e3
I/JQ^^
441256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2015 Microchip Technology Inc.
MTD6508
2015 Microchip Technology Inc.
DS20005359A-page 15
MTD6508
DS20005359A-page 16
2015 Microchip Technology Inc.
MTD6508
2015 Microchip Technology Inc.
DS20005359A-page 17
MTD6508
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
A
B
N
NOTE 1
1
2
E
(DATUM B)
(DATUM A)
2X
0.20 C
2X
TOP VIEW
0.20 C
SEATING
PLANE
A1
0.10 C
C
A
16X
(A3)
0.08 C
SIDE VIEW
0.10
C A B
D2
0.10
C A B
E2
2
e
2
1
NOTE 1
K
N
16X b
0.10
L
e
C A B
BOTTOM VIEW
Microchip Technology Drawing C04-257A Sheet 1 of 2
DS20005359A-page 18
2015 Microchip Technology Inc.
MTD6508
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body [UQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Notes:
Units
Dimension Limits
Number of Pins
N
e
Pitch
A
Overall Height
Standoff
A1
A3
Terminal Thickness
Overall Width
E
E2
Exposed Pad Width
D
Overall Length
D2
Exposed Pad Length
b
Terminal Width
Terminal Length
L
K
Terminal-to-Exposed-Pad
MIN
0.45
0.00
2.50
2.50
0.25
0.30
0.20
MILLIMETERS
NOM
16
0.65 BSC
0.50
0.02
0.127 REF
4.00 BSC
2.60
4.00 BSC
2.60
0.30
0.40
-
MAX
0.55
0.05
2.70
2.70
0.35
0.50
-
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-257A Sheet 2 of 2
2015 Microchip Technology Inc.
DS20005359A-page 19
MTD6508
16-Lead Ultra Thin Plastic Quad Flat, No Lead Package (JQ) - 4x4x0.5 mm Body
[UQFN]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
C1
X2
16
1
C2 Y2
2
Y1
X1
E
SILK SCREEN
RECOMMENDED LAND PATTERN
Units
Dimension Limits
E
Contact Pitch
Optional Center Pad Width
X2
Optional Center Pad Length
Y2
Contact Pad Spacing
C1
Contact Pad Spacing
C2
Contact Pad Width (X16)
X1
Contact Pad Length (X16)
Y1
MIN
MILLIMETERS
NOM
0.65 BSC
MAX
2.70
2.70
4.00
4.00
0.35
0.80
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Microchip Technology Drawing C04-2257A
DS20005359A-page 20
2015 Microchip Technology Inc.
MTD6508
APPENDIX A:
REVISION HISTORY
Revision A (April 2015)
• Original release of this document.
2015 Microchip Technology Inc.
DS20005359A-page 21
MTD6508
NOTES:
DS20005359A-page 22
2015 Microchip Technology Inc.
MTD6508
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO.
T(1)
-X
Device Tape & Reel
Temperature
/XX
Examples:
Package
a)
b)
Device:
MTD6508: 3-Phase Brushless DC, Sinusoidal Sensorless
Fan Motor Driver
Temperature
Range:
E
Package:
JQ
=
Ultra Thin Plastic Quad Flat, No-Lead
Package (JQ) – 4x4x0.5 mm Body, 16-Lead UQFN
NA
=
Ultra-thin Dual Flatpack, No-Lead Package
(NA[Y]) – 3x3x0.5 mm Body, 10-Lead UDFN
=
MTD6508-ADJE/JQ Extended Temperature
16LD 4x4 UQFN package
MTD6508T-E/NA Tape and Reel,
Extended Temperature
10LD 3x3 UDFN package
-40°C to +125°C (Extended)
Note 1:
2015 Microchip Technology Inc.
Tape and Reel identifier only appears in the
catalog part number description. This identifier is used for ordering purposes and is nto
printed on the device package. Check with
your Microchip Sales Office for package
availability with the Tape and Reel option.
DS20005359A-page 23
MTD6508
NOTES:
DS20005359A-page 24
2015 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
•
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, KEELOQ, KEELOQ logo, Kleer,
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC,
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-347-0
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
DS20005359A-page 25
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
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Tel: 86-592-2388138
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Tel: 86-756-3210040
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Tel: 45-4450-2828
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Tel: 91-80-3090-4444
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01/27/15
DS20005359A-page 26
2015 Microchip Technology Inc.
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