TC2117
800 mA Fixed Low Dropout Positive Regulator
Features:
General Description:
•
•
•
•
•
•
•
The TC2117 is a fixed, high-accuracy (typically ±0.5%)
CMOS low dropout regulator. Designed specifically for
battery operated systems, the TC2117’s CMOS
construction eliminates wasted ground current,
significantly extending battery life. Total supply current
is typically 80 µA at full load (20 to 60 times lower than
in bipolar regulators).
Fixed Output Voltages: 1.8V, 2.5V, 3.0V, 3.3V
Very Low Dropout Voltage
Rated 800 mA Output Current
High Output Voltage Accuracy
Standard or Custom Output Voltages
Overcurrent and Overtemperature Protection
Space Saving SOT-223 Package
Applications:
5V to 3.3V Linear Regulator
Portable Computers
Instrumentation
Battery Operated Systems
Linear Post-Regulator for SMPS
Core Voltage Supply for FPGAs, PLDs, CPUs and
DSPs
Package Types
3-Pin SOT-223
Front View
Typical Application
2010 Microchip Technology Inc.
GND
1
2
3
VIN
TC2117
VOUT
TC2117
GND
GND
2
TC2117
Battery
C2
1µF
VIN
1
VOUT
VOUT
Tab is VOUT
3
Tab is VOUT
VIN
C1
1µF
3-Pin DDPAK
Front View
VOUT
•
•
•
•
•
•
TC2117 key features include ultra low noise, very low
dropout voltage (typically 450 mV at full load), and fast
response to step changes in load. The TC2117
incorporates both overtemperature and overcurrent
protection. The TC2117 is stable with an output
capacitor of only 1 µF and has a maximum output
current of 800 mA. This device is available in 3-Pin
SOT-223 and 3-Pin DDPAK packages.
DS21665D-page 1
TC2117
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings†
Input Voltage .........................................................6.5V
Output Voltage.................... (VSS – 0.3) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 7)
Maximum Voltage on Any Pin .........VIN +0.3V to -0.3V
Operating Temperature ............... -40°C < TJ < +125°C
Storage temperature ..........................-65°C to +150°C
† Notice: Stresses above those listed under "Absolute
Maximum Ratings" may cause permanent damage to the
device. These are stress ratings only and functional operation
of the device at these or any other conditions above those
indicated in the operation sections of the specifications is not
implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, (Note 1), IL = 100 µA, CL = 3.3 µF, TA = +25°C.
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Parameters
Input Operating Voltage
Maximum Output Current
Output Voltage
Sym
Min
Typ
Max
Units
VIN
2.7
—
6.0
V
—
—
mA
IOUTMAX
800
VOUT
VR – 2.5%
VR – 2%
VR ± 0.5% VR + 2.5%
VR ± 0.5%
Conditions
Note 2
VR 2.5V
V
VR + 3%
VR = 1.8V
VOUT/T
—
40
—
ppm/°C
Line Regulation
VOUT/VIN
—
0.007
0.35
%
Load Regulation (Note 4)
VOUT/VOUT
-0.01
0.002
0
%/mA
IL = 0.1 mA to IOUTMAX
Dropout Voltage (Note 5)
VIN–VOUT
—
20
30
mV
VR 2.5V, IL = 100 µA
VOUT Temperature Coefficient
Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
Output Noise
Note 1:
2:
3:
4:
5:
6:
7:
Note 3
(VR + 1V) VIN6V
—
50
160
VR 2.5V, IL = 100 mA
—
150
480
VR 2.5V, IL = 300 mA
—
260
800
VR 2.5V, IL = 500 mA
—
450
1300
VR 2.5V, IL = 800 mA
VR = 1.8V, IL = 500 mA
—
1000
1200
—
1200
1400
IL = 800 mA
IDD
—
80
130
µA
SHDN = VIH, IL = 0
PSRR
—
55
—
db
F 1 kHz
IOUTSC
—
1200
—
mA
VOUT = 0V
VOUT/PD
—
0.04
—
V/W
Note 6
eN
—
300
—
nV/Hz
IL = 100 mA, F = 10 kHZ
VR is the regulator output voltage setting.
The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1 mA to IOUTMAX.
6
V OUTMAX – V OUTMIN – 10
TCV OUT = ------------------------------------------------------------------------V OUT T
Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested
over a load range from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating
effects are covered by the thermal regulation specification.
Dropout voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal
value measured at a 1.5V differential.
Thermal regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied,
excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 ms.
The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power
dissipation causes the device to initiate thermal shutdown. Please see Section 4.2 “Thermal Considerations” for
more details.
DS21665D-page 2
2010 Microchip Technology Inc.
TC2117
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise indicated, VIN = VR + 1.5V, IL = 100 µA, CL = 3.3 µF, SHDN > VIH, TA = +25°C.
Parameters
Sym
Min
Typ
Max
Units
Specified Temperature Range
TA
-40
—
+125
°C
Operating Temperature Range
TJ
-40
—
+125
°C
Storage Temperature Range
TA
-65
—
+150
°C
Thermal Resistance, 3L-SOT-223
JA
—
59
—
°C/W
Thermal Resistance, 3L-DDPAK
JA
—
71
—
°C/W
Conditions
Temperature Ranges
(Note 1)
Thermal Package Resistances
Note 1:
Operation in this range must not cause TJ to exceed Maximum Junction Temperature (+125°C).
2010 Microchip Technology Inc.
DS21665D-page 3
TC2117
TYPICAL PERFORMANCE CURVES
Note:
The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
0.020
LINE REGULATION (%)
0.018
0.016
150
VIN = 3.5V to 6.0V
VOUT = 2.5V
IOUT = 0.1mA
VIN = VOUT +1V
IOUT = 0.1mA
135
120
0.014
105
0.012
I DD(A)
2.0
0.010
0.008
0.006
VOUT = 5V
90
75
VOUT = 2.5V
60
45
0.004
30
0.002
15
0.000
-40°C 0°C
25°C
70°C
85°C
0
125°C
Line Regulation vs.
NOISE (μV/√Hz)
10.0
CIN = 1 μF
C OUT = 1 μF
V IN = 6.0V
VOUT = 5V
I OUT = 100 mA
1.0
85°C
70°C
125°C
TEMPERATURE (°C)
0.1
FIGURE 2-4:
DROPOUT VOLTAGE (V)
FIGURE 2-1:
Temperature.
25°C
-40°C 0°C
TEMPERATURE (°C)
0.600
0.550
0.500
0.450
0.400
0.350
0.300
IDD vs. Temperature.
125°C
85°C
70°C
25°C
VOUT = 3V
0°C
0.250
0.200
0.150
0.100
-40°C
0.050
0.0
0.01
0.01
1
10
100
0.000
1000
0 100 200 300 400 500 600 700 800
I LOAD (mA)
FREQUENCY (kHz)
FIGURE 2-2:
Output Noise vs. Frequency.
FIGURE 2-5:
3.030
3.020
0.0090
0.0070
0.0060
0.0050
1 mA to 800 mA
VOUT = 3V
0.0040
2.980
2.960
2.950
2.940
0.0010
2.930
0°C
25°C
70°C
85°C
125°C
2.920
-40°C 0°C
DS21665D-page 4
ILOAD = 800 mA
25°C
70°C
85°C
125°C
TEMPERATURE (°C)
TEMPERATURE (°C)
Load Regulation vs.
ILOAD = 500 mA
2.970
0.0020
0.0100
-40°C
ILOAD = 300 mA
2.990
0.0030
FIGURE 2-3:
Temperature.
ILOAD = 0.1 mA
3.010
3.000
0.0080
VOUT (V)
LOAD REGULATION %/mA
0.0100
Dropout Voltage vs. ILOAD.
FIGURE 2-6:
3.0V VOUT vs.Temperature.
2010 Microchip Technology Inc.
TC2117
-10
IOUT=300 mA
VIN=4.0V to 5.0V
PSRR (dB)
-20
COUT=10 µF Tantalum (0.25 ESR)
CIN=NA
-30
-40
-50
VOUT
-60
-70
50 mV/DIV
10
100
1k
10k
100k
1M
f (Hz)
FIGURE 2-7:
Ratio.
Power Supply Rejection
FIGURE 2-9:
Line Step Response
VIN=4.0V
VOUT=3.0V
CIN=1 µF Ceramic
COUT=10 µF Ta
50 mV/DIV
600 mA/DIV
FIGURE 2-8:
Load Step Response.
2010 Microchip Technology Inc.
DS21665D-page 5
TC2117
3.0
PIN DESCRIPTIONS
The descriptions for the pins are listed in Table 3-1.
TABLE 3-1:
Pin No.
(3-Pin SOT-223)
(3-Pin DDPAK)
3.1
PIN FUNCTION TABLE
Symbol
Description
1
GND
Ground Terminal.
2
VOUT
Regulated output voltage.
3
VIN
Unregulated Supply input.
Ground (GND)
Ground terminal.
3.2
Regulated Output Voltage (VOUT)
Regulated voltage output.
3.3
Unregulated Supply (VIN)
Unregulated supply input.
DS21665D-page 6
2010 Microchip Technology Inc.
TC2117
4.0
DETAILED DESCRIPTION
4.2.2
The TC2117 is a precision, positive output LDO. Unlike
bipolar regulators, the TC2117 supply current does not
increase proportionally with load current. In addition,
VOUT remains stable and within regulation over the
entire 0 mA to 800 mA operating load range.
POWER DISSIPATION
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate the worst-case actual power dissipation:
EQUATION 4-1:
P D = V INMAX – VOUTMIN ILOADMAX
VIN
C1
1µF
VOUT
VOUT
TC2117
Battery
C2
1µF
GND
FIGURE 4-1:
4.1
Typical Application Circuit.
Output Capacitor
A 1 µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance of 0.2 to 10. A 1 µF capacitor should be
connected from VIN to GND if there is more than 10
inches of wire between the regulator and the AC filter
capacitor, or if a battery is used as the power source.
Aluminum electrolytic or tantalum capacitor types can
be used. (Since many aluminum electrolytic capacitors
freeze at approximately -30°C, solid tantalums are
recommended for applications operating below -25°C.)
When operating from sources other than batteries,
supply noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
4.2
4.2.1
Thermal Considerations
THERMAL SHUTDOWN
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
Where:
PD = Worst-case actual power dissipation
VINMAX = Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
The
maximum
allowable
power
dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (TAMAX), the maximum allowable die
temperature (+125°C) and the thermal resistance from
junction-to-air (JA).
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX)
JA
Where all terms are previously defined.
Table 4-2 shows various values of JA for the TC2117
mounted on a 1/16 inch, 2-layer PCB with 1 oz. copper
foil.
TABLE 4-2:
THERMAL RESISTANCE
GUIDELINES FOR TC2117 IN
3-PIN SOT-223 PACKAGE
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board Area
Thermal
Resistance
2500 sq mm
2500 sq mm
2500 sq mm
45°C/W
1000 sq mm
2500 sq mm
2500 sq mm
45°C/W
225 sq mm
2500 sq mm
2500 sq mm
53°C/W
100 sq mm
2500 sq mm
2500 sq mm
59°C/W
1000 sq mm
1000 sq mm
1000 sq mm
52°C/W
1000 sq mm
0 sq mm
1000 sq mm
55°C/W
* Tab of device attached to topside copper.
2010 Microchip Technology Inc.
DS21665D-page 7
TC2117
TABLE 4-3:
THERMAL RESISTANCE
GUIDELINES FOR TC2117 IN
3-PIN DDPAK PACKAGE
Copper
Area
(Topside)*
Copper
Area
(Backside)
Board Area
Thermal
Resistance
(JA)
2500 sq mm
2500 sq mm
2500 sq mm
25°C/W
1000 sq mm
2500 sq mm
2500 sq mm
27°C/W
125 sq mm
2500 sq mm
2500 sq mm
35°C/W
*Tab of device attached to topside copper.
Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:
Given:
VINMAX = 5.0V ± 5%
VOUTMIN = 3.3V ± 0.5%
ILOADMAX = 400 mA
TJMAX = 125°C
TAMAX = 55°C
JA = 59°C/W (SOT-223)
Find:
1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
PD (VINMAX – VOUTMIN)ILOADMAX
= [(5.0 x 1.05) – (3.3 x .995)] 400 x 10-3
= 786 mW
Maximum allowable power dissipation:
PDMAX
=
(TJMAX – TAMAX)
JA
=
(125 – 55)
59
=
1.186W
In this example, the TC2117 dissipates a maximum of
only 786 mW, which is below the allowable limit of
1.186W. In a similar manner, Equation 4-1 and
Equation 4-2 can be used to calculate the maximum
current and/or input voltage limits.
DS21665D-page 8
2010 Microchip Technology Inc.
TC2117
5.0
PACKAGING INFORMATION
5.1
Package Marking Information
3-Lead DDPAK
Example
XXXXXXXXX
XXXXXXXXX
YYWWNNN
3-Lead SOT-223
XXXXXXX
XXXYYWW
NNN
Legend: XX...X
Y
YY
WW
NNN
e3
*
Note:
TC2117
e3
1.8VEB^^
1034256
Example
2117-25
VDB1034
256
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( e3 )
can be found on the outer packaging for this package.
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
2010 Microchip Technology Inc.
DS21665D-page 9
TC2117
/HDG3ODVWLF(%>''3$.@
1RWH
)RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
E
E1
L1
D1
D
H
1
N
b
BOTTOM VIEW
e
TOP VIEW
b1
CHAMFER
OPTIONAL
C2
A
φ
c
A1
L
8QLWV
'LPHQVLRQ/LPLWV
1XPEHURI3LQV
,1&+(6
0,1
1
120
0$;
3LWFK
H
2YHUDOO+HLJKW
$
%6&
±
6WDQGRII
$
±
2YHUDOO:LGWK
(
±
([SRVHG3DG:LGWK
(
±
±
0ROGHG3DFNDJH/HQJWK
'
±
2YHUDOO/HQJWK
+
±
([SRVHG3DG/HQJWK
'
±
±
/HDG7KLFNQHVV
F
±
3DG7KLFNQHVV
&
±
/RZHU/HDG:LGWK
E
±
8SSHU/HDG:LGWK
E
±
)RRW/HQJWK
/
±
3DG/HQJWK
/
±
±
)RRW$QJOH
±
1RWHV
6LJQLILFDQW&KDUDFWHULVWLF
'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGSHUVLGH
'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(