TC1108-2.5VDBTR

TC1108 300mA CMOS LDO Features General Description • • • • • • The TC1108 is a fixed output, high accuracy (typically ±0.5%) CMOS low dropout regulator. Total supply current is typically 50A at full load (20 to 60 times lower than in bipolar regulators). Extremely Low Supply Current (50A, Typ.) Very Low Dropout Voltage 300mA Output Current High Output Voltage Accuracy Standard or Custom Output Voltages Over Current and Over Temperature Protection Applications • • • • • • • TC1108 key features include ultra low noise operation, very low dropout voltage (typically 240mV at full load), and fast response to step changes in load. The TC1108 incorporates both over temperature and over current protection. The TC1108 is stable with an output capacitor of only 1F and has a maximum output current of 300mA. It is available in a SOT-223 package. Battery Operated Systems Portable Computers Medical Instruments Instrumentation Cellular/GSM/PHS Phones Linear Post-Regulators for SMPS Pagers Typical Application VIN 1 Device Selection Table VIN VOUT TC1108 Part Number Package Junction Temp. Range TC1108-xxVDB 3-Pin SOT-223 -40°C to +125°C 2 3 VOUT + C1 1μF GND NOTE: xx indicates output voltages Available Output Voltages: 2.5, 2.8, 3.0, 3.3, 5.0. Other output voltages are available. Please contact Microchip Technology Inc. for details. Package Type SOT-223 TC1108VDB 1 2 3 VIN GND VOUT  2002-2012 Microchip Technology Inc. DS21357C-page 1 TC1108 1.0 ELECTRICAL CHARACTERISTICS Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Absolute Maximum Ratings* Input Voltage .........................................................6.5V Output Voltage.................. (VSS – 0.3V) to (VIN + 0.3V) Power Dissipation................Internally Limited (Note 6) Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V Operating Temperature Range...... -40°C < TJ < 125°C Storage Temperature..........................-65°C to +150°C TC1108 ELECTRICAL SPECIFICATIONS Electrical Characteristics: VIN = VOUT + 1V, IL = 100A, CL = 3.3F, TA = 25°C, unless otherwise noted. Boldface type specifications apply for junction temperatures of -40°C to +125°C. Symbol Parameter Min Typ Max Units Test Conditions VIN Input Operating Voltage 2.7 — 6.0 V IOUTMAX Maximum Output Current 300 — — mA VOUT Output Voltage — VR – 2.5% VR ±0.5% — — VR + 2.5% V VOUT/T VOUT Temperature Coefficient — 40 — VOUT/VIN Line Regulation — 0.05 0.35 % (VR + 1V) VIN6V VOUT/VOUT Load Regulation — 0.5 2.0 % IL = 0.1mA to IOUTMAX (Note 3) VIN-VOUT Dropout Voltage — — — 20 80 240 30 160 480 mV IDD Supply Current — 50 90 A Note 7 Note 1 ppm/°C Note 2 IL = 0.1mA IL = 100mA IL = 300mA (Note 4) FRE 1kHz PSRR Power Supply Rejection Ratio — 60 — dB IOUTSC Output Short Circuit Current — 550 650 mA VOUT = 0V VOUT/PD Thermal Regulation — 0.04 — V/W Note 5 eN Output Noise — 260 — Note 1: 2: 3: 4: 5: 6: 7: nV/Hz F = 10kHz, COUT = 1F, RLOAD = 50 VR is the regulator output voltage setting. TC VOUT = (VOUTMAX – VOUTMIN) x 106 VOUT x T Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differential. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate thermal shutdown. Please see Section 4.0 Thermal Considerations for more details. The minimum VIN has to justify the conditions: VIN  VR + VDROPOUT and VIN  2.7V for IL = 0.1mA to IOUTMAX. DS21357C-page 2  2002-2012 Microchip Technology Inc. TC1108 2.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 2-1. TABLE 2-1: PIN FUNCTION TABLE Pin No. (3-Pin SOT-223) 3.0 Symbol Description 1 VIN 2 GND Ground terminal. 3 VOUT Regulated voltage output. Unregulated supply input. DETAILED DESCRIPTION 3.1 The TC1108 is a precision, fixed output LDO. Unlike bipolar regulators, the TC1108’s supply current does not increase with load current. In addition, VOUT remains stable and within regulation over the entire 0mA to IOUTMAX operating load current range, (an important consideration in RTC and CMOS RAM battery back-up applications). Figure 3-1 shows a typical application circuit. FIGURE 3-1: TYPICAL APPLICATION CIRCUIT 1 + + Battery C1 1μF VOUT TC1108 2 – VIN 3 + VOUT C2 1μF Output Capacitor A 1F (min) capacitor from VOUT to ground is required. The output capacitor should have an effective series resistance greater than 0.1 and less than 5.0. A 1F capacitor should be connected from VIN to GND if there is more than 10 inches of wire between the regulator and the AC filter capacitor, or if a battery is used as the power source. Aluminum electrolytic or tantalum capacitor types can be used. (Since many aluminum electrolytic capacitors freeze at approximately -30°C, solid tantalums are recommended for applications operating below -25°C.) When operating from sources other than batteries, supply-noise rejection and transient response can be improved by increasing the value of the input and output capacitors and employing passive filtering techniques. GND  2002-2012 Microchip Technology Inc. DS21357C-page 3 TC1108 4.0 THERMAL CONSIDERATIONS 4.1 Thermal Shutdown Integrated thermal protection circuitry shuts the regulator off when die temperature exceeds 150°C. The regulator remains off until the die temperature drops to approximately 140°C. 4.2 Power Dissipation The amount of power the regulator dissipates is primarily a function of input and output voltage, and output current. The following equation is used to calculate worst case actual power dissipation: Equation 4-1 can be used in conjunction with Equation 4-2 to ensure regulator thermal operation is within limits. For example: Given: VINMAX = 3.3V + 10% VOUTMIN = 2.7V – 0.5% ILOADMAX = 275mA TJMAX = 125°C TAMAX = 95°C JA = 59°C/W Find: 1. Actual power dissipation 2. Maximum allowable dissipation Actual power dissipation: EQUATION 4-1: PD  (VINMAX – VOUTMIN)ILOADMAX Where: PD  (VINMAX – VOUTMIN)ILOADMAX = [(3.3 x 1.1) – (2.7 x .995)]275 x 10–3 = 260mW PD = Worst case actual power dissipation VINMAX = Maximum voltage on VIN VOUTMIN = Minimum regulator output voltage ILOADMAX = Maximum output (load) current The maximum allowable power dissipation (Equation 4-2) is a function of the maximum ambient temperature (TAMAX), the maximum allowable die temperature (TJMAX) and the thermal resistance from junction-to-air (JA). EQUATION 4-2: PDMAX = (TJMAX – TAMAX) JA Where all terms are previously defined. Maximum allowable power dissipation: PDMAX = (TJMAX – TAMAX) JA = (125 – 95) 59 = 508mW In this example, the TC1108 dissipates a maximum of 260mW; below the allowable limit of 508mW. In a similar manner, Equation 4-1 and Equation 4-2 can be used to calculate maximum current and/or input voltage limits. For example, the maximum allowable VIN, is found by sustituting the maximum allowable power dissipation of 508mW into Equation 4-1, from which VINMAX = 4.6V. Table 4-1 shows various values of JA for the TC1108 versus board copper area. TABLE 4-1: Copper Area (Topside)* THERMAL RESISTANCE GUIDELINES FOR TC1108 Copper Area (Backside) Board Area Thermal Resistance (JA) 2500 sq mm 2500 sq mm 2500 sq mm 45°C/W 1000 sq mm 2500 sq mm 2500 sq mm 45°C/W 225 sq mm 2500 sq mm 2500 sq mm 53°C/W 100 sq mm 2500 sq mm 2500 sq mm 59°C/W 1000 sq mm 1000 sq mm 1000 sq mm 52°C/W 1000 sq mm 55°C/W 0 sq mm 1000 sq mm NOTE: *Tab of device attached to topside copper DS21357C-page 4  2002-2012 Microchip Technology Inc. TC1108 5.0 TYPICAL CHARACTERISTICS Note: The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2.00 10.0 RLOAD = 50Ω COUT = 1μF 1.80 LOAD REGULATION (%) 0.010 0.008 NOISE (μV/√HZ) LINE REGULATION (%) Load Regulation Output Noise Line Regulation 0.012 0.006 0.004 0.002 1.0 0.1 0.000 -0.002 1.60 1.40 1.20 1.00 0.80 0.60 1 to 100mA 0.40 1 to 50mA 0.20 0.0 0.01 -0.004 -40° -20° 0° 20° 40° 60° 80° 100° 120° 0.01 TEMPERATURE (°C) 10 1 100 0.00 -40° -20° 0° 20° 40° 60° 80° 100° 120° 1000 TEMPERATURE (°C) FREQUENCY (kHz) Supply Current VOUT vs. Temperature 0.40 0.35 DROPOUT VOLTAGE (V) 90.0 80.0 70.0 60.0 50.0 3.075 125°C 85°C C 0.30 70°C 0.25 VIN = 4V ILOAD = 100μA CLOAD = 3.3μF 3.025 VOUT (V) 100.0 SUPPLY CURRENT (μA) 1 to 300mA 25°C 0.20 0°C C 0.15 2.975 0.10 -40°C 0.05 40.0 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C)  2002-2012 Microchip Technology Inc. 0.00 0 50 100 150 200 LOAD CURRENT (mA) 250 300 2.925 -40° -20° 0° 20° 40° 60° 80° 100° 120° TEMPERATURE (°C) DS21357C-page 5 TC1108 6.0 PACKAGING INFORMATION 6.1 Package Marking Information “1” = part number code “2” = represents temperature + date code + lot identity + subcontractor identity TC1108 (V) 6.2 Code TC1108-2.5VDB 110825 TC1108-2.8VDB 110828 TC1108-3.0VDB 110830 TC1108-3.3VDB 110833 TC1108-5.0VDB 110850 Taping Form Component Taping Orientation for 3-Pin SOT-223 Devices User Direction of Feed Device Marking W PIN 1 P Standard Reel Component Orientation for TR Suffix Device (Mark Right Side Up) Carrier Tape, Number of Components Per Reel and Reel Size Package 3-Pin SOT-223 DS21357C-page 6 Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size 12 mm 8 mm 4000 13 in  2002-2012 Microchip Technology Inc. TC1108 6.3 Package Dimensions Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging 3-Pin SOT-223 .264 (6.70) .248 (6.30) .122 (3.10) .114 (2.90) .287 (7.30) .146 (3.70) .264 (6.70) .130 (3.30) .041 (1.04) .033 (0.84) PIN 1 .091 (2.30) TYP. .031 (0.80) .024 (0.60) .071 (1.80) MAX. .013 (0.33) .009 (0.24) 10° MAX. .004 (0.10) .001 (0.02) .181 (4.60) TYP. .036 (0.91) MIN. Dimensions: inches (mm)  2002-2012 Microchip Technology Inc. DS21357C-page 7 TC1108 REVISION HISTORY Revision C (November 2012) Added a note to the package outline drawing. DS21357C-page 8  2002-2012 Microchip Technology Inc. TC1108 SALES AND SUPPORT Data Sheets Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following: 1. 2. Your local Microchip sales office The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using. New Customer Notification System Register on our web site (www.microchip.com/cn) to receive the most current information on our products.  2002-2012 Microchip Technology Inc. DS21357C-page9 TC1108 NOTES: DS21357C-page10  2002-2012 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights. Trademarks The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART, PIC32 logo, rfPIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. & KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2012, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. Printed on recycled paper. ISBN: 9781620767351 QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2002-2012 Microchip Technology Inc. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. 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