0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
TC4404CPA

TC4404CPA

  • 厂商:

    ACTEL(微芯科技)

  • 封装:

    DIP8

  • 描述:

    IC GATE DRVR LOW-SIDE 8DIP

  • 数据手册
  • 价格&库存
TC4404CPA 数据手册
TC4404/TC4405 1.5A Dual Open-Drain MOSFET Drivers Features General Description • • • • • • The TC4404/TC4405 are CMOS buffer-drivers constructed with complementary MOS outputs, where the drains of the totem-pole output have been left separated so that individual connections can be made to the pull-up and pull-down sections of the output. This allows the insertion of drain-current-limiting resistors in the pull-up and/or pull-down sections, allowing the user to define the rates of rise and fall for a capacitive load. It also enables a reduced output swing, if driving a resistive load, or limiting base current when driving a bipolar transistor. Minimum rise and fall times, with no resistors, will be less than 30 ns for a 1000 pF load. Independently Programmable Rise and Fall Times Low Output Impedance: 7 Typical High Speed tR, tF: 500 — mA Duty cycle2%, t 300 sec tR — 25 30 ns Figure 4-1, CL = 1000 pF Fall Time tF — 25 30 ns Figure 4-1, CL = 1000 pF Delay Time tD1 — 15 30 ns Figure 4-1, CL = 1000 pF Delay Time tD2 — 32 50 ns Figure 4-1, CL = 1000 pF IS — — — — 4.5 0.4 mA VIN = 3V (both inputs) VIN = 0V (both inputs) Switching Time (Note 1) Rise Time Power Supply Power Supply Current Note 1: Switching times ensured by design.  2002-2016 Microchip Technology Inc. DS20001418E-page 3 TC4404/TC4405 DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE) Electrical Characteristics: Unless otherwise indicated, operating temperature range with 4.5V VDD18V. Parameter Sym. Min. Typ. Max. Units Conditions Logic 1, High Input Voltage VIH 2.4 — — V Logic 0, Low Input Voltage VIL — — 0.8 V Input Current IIN –10 — 10 A High Output Voltage VOH VDD – 0.025 — — V Low Output Voltage VOL — — 0.025 V Output Resistance RO — 9 12  IOUT = 10 mA, VDD = 18V; any drain Duty cycle2%, t 300 sec 0VVINVDD Output Peak Output Current (Any Drain) IPK — 1.5 — A Continuous Output Current (Any Drain) IDC — — 100 mA Latch-Up Protection (Any Drain) Withstand Reverse Current IR — > 500 — mA Duty cycle2%, t 300 sec tR — — 40 ns Figure 4-1, CL = 1000 pF Fall Time tF — — 40 ns Figure 4-1, CL = 1000 pF Delay Time tD1 — — 40 ns Figure 4-1, CL = 1000 pF Delay Time tD2 — — 60 ns Figure 4-1, CL = 1000 pF IS — — — — 8 0.6 mA VIN = 3V (both inputs) VIN = 0V (both inputs) Switching Time (Note 1) Rise Time Power Supply Power Supply Current Note 1: Switching times ensured by design. TEMPERATURE SPECIFICATIONS Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V  VDD  18V. Parameters Sym. Min. Typ. Max. Units Operating Temperature Range, C Version TA 0 — +70 °C Operating Temperature Range, E Version TA -40 — +85 °C Storage Temperature Range TA -65 — +150 °C Thermal Resistance, 8-Lead PDIP JA — +94 — °C/W Thermal Resistance, 8-Lead PDIP JC — +45 — °C/W Thermal Resistance, 8-Lead SOIC JA — +163 — °C/W Thermal Resistance, 8-Lead SOIC JC — +42 — °C/W Conditions Temperature Ranges Package Thermal Resistances DS20001418E-page 4  2002-2016 Microchip Technology Inc. TC4404/TC4405 TYPICAL PERFORMANCE CURVES 100 1000 pF 40 470 pF 20 0 80 1500 pF 60 tRISE (ns) 60 100 2200 pF 80 The graphs and tables provided following this note are a statistical summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range. 2200 pF TA = +25°C 40 1 1 4 0 16 FIGURE 2-1: Voltage. 60 1000 pF 1000 pF 40 40 470 pF 20 100 pF 414 1500 pF 60 470 pF 20 100 pF 18 1 0 20 100 pF 41 VDD 614 816 118 tFALL (ns) 0 414 16 6 18 8 VDD = 5 VDD = 5V TA = +25°C 80 60 60 10V 10V 15V 15V 40 40 20 20 0 1 1 100 14 FIGURE 2-3: Load. 100 100 80 500 pF 1 100 pF Rise Time vs. Supply 2200 pF TA = +25°C T = +25°C A 470 pF 100 TA = +25°C 100 2200 pF T = +25°C A 80 80 1500 pF 2200 pF TA = +25°C 80 1500 pF 1000 pF 100 100 100 tRISE (ns) Note: TA = +25°C T = +25°C A 60 60 1000 pF 40 40 1000 18 16 0 100 CLOAD (pF) 10000 40 1 60 VDD = 5V TA = +25°C 60 1000 Rise Time vs. Capacitive VDD = 5V 80 80 1500 pF tFALL (ns) 2.0 10V 10V 15V 15V 50 CLOAD = 100 VDD = 17.5V 40 30 tFAL 470 pF 20 1 1 14 16 18 0 20 100 pF 4 FIGURE 2-2: Voltage. 6 8 1 1 VDD 14 16 Fall Time vs. Supply  2002-2016 Microchip Technology Inc. 18 0 100 20 20 0 100 1000 FIGURE 2-4: Load. 1000 10,000 10000 10 CLOAD (pF) Fall Time vs. Capacitive DS20001418E-page 5 -55 -35 -15 5 TC4404/TC4405 40 40 40 tD2 30 30 tFALL 20 20 tRISE 000 10000 10 Delay Time (ns) 50 tD1 20 20 10 48 108 6 FIGURE 2-6: Supply Voltage. tD1 tD1 60 CLOAD =1000pF VDD = 10V TA = +25°C Delay Time (ns) 50 40 tD2 30 30 2 4 6 8 10 DS20001418E-page 6 =0 0.1 4 6 8 10 Propagation Delay Time vs. BRWK IQSXWV = 1 1 0.1 4 6 8 Effect of Input Amplitude on 3.5 10 12 14 VDD 16 18 Quiescent Supply Current 25 10 TA = +25°C VDD = 18V BRWK IQSXWV =1 t D2 B I 20 =1 1 3.0 2.5 10 -55 -35 -15 5 VDRIVE (V) FIGURE 2-7: Delay Time. tD1 10 1 -55 1 -3514 18 45 65 85 105125 -15 16 5 25 4.0 VDD = 17.5V VLOAD = 1000pF 20 tD1 0 tD1 FIGURE 2-9: vs. Voltage. Propagation Delay vs. 40 10 I 30 VDD 60 20 B 1 BRWK IQSXWV = 0 10 -35 -15 1-55 1 14 516 2518 45 65 85 105 125 50 =1 tD2 tRISE 2 85 105 4 125 6 45 65 I TA = +25°C tD2 30 B 10 VDD ==17.5V CLOAD 1000 pF VLOAD = 1000pF +25°C TA = 40 30 tD2 40 FIGURE 2-8: Temperature. tD2 40 TA = +25°C Temperature Rise and Fall Times vs. 60 8 10 10 VDD == 1000 17.5VpF CLOAD =LOAD +25°C= 1000pF TA V 20 Temperature 60 CLOAD =1000pF VDD = 10V 50 TA = +25°C tD2 20 tD1 10 10 -55 -35 -15 5 250 45 65 2 85 105125 4 6 4 8 6 FIGURE 2-5: Temperature. F 30 50 Delay Time (ns) 15V Time (ns) 10V 50 60 60 CLOAD =1000pF VDD = 10V 50 TA = +25°C IQUIESCENT (mA) VDD = 5V 60 CLOAD = 1000 pF VDD = 17.5V 50 IQUIESCENT (mA) 60 tD1 W @ 15 10 B I T =0 2.0 5 0.1 25 -45 65 -15 85 105 4 856105125 8 10 4 12 6 14 8 16 118 55 -35 5 125 25 45 65 Temperature FIGURE 2-10: vs. Temperature. Quiescent Supply Current  2002-2016 Microchip Technology Inc. TC4404/TC4405 25 25 20 20 RDS(ON) () =1 WRUVW&DVH @ TJ = +150°C 15 15 10 25 45 65 85 105 125 W @ TJ = +150°C 5 10 T\S @ +25°C 4 6 8 FIGURE 2-11: 1 1 VDD 14 16 18 5 T 4 6 8 1 @ +25°C 1 14 16 18 Pull-Up Output Resistance. 25 WRUVW&DVH @ TJ = +150°C T 1 RDS(ON) () 20 W @ TJ = +150°C 10 @ +25°C 1 14 15 16 18 5 T\S @ +25°C 4 6 FIGURE 2-12: Resistance. 8 1 1 VDD 14 16 18 Pull-Down Output  2002-2016 Microchip Technology Inc. DS20001418E-page 7 TC4404/TC4405 3.0 PIN DESCRIPTIONS The descriptions of the pins are listed in Table 3-1. TABLE 3-1: PIN FUNCTION TABLE 8-Lead PDIP/SOIC Symbol Description 1 VDD Supply Input, 4.5V to 18V 2 IN A Control Input A, TTL/CMOS compatible input 3 IN B Control Input B, TTL/CMOS compatible input 4 GND Ground 5 B BOTTOM Output B, pull-down 6 B TOP 7 A BOTTOM Output A, pull-down 8 A TOP DS20001418E-page 8 Output B, pull-up Output A, pull-up  2002-2016 Microchip Technology Inc. TC4404/TC4405 4.0 APPLICATIONS INFORMATION 4.1 Circuit Layout Guidelines In addition, it is advisable that low ESR (Equivalent Series Resistance) bypass capacitors (4.7 µF or 10 µF tantalum) be placed as close to the driver as possible. In order to minimize the length of the output trace, the driver should be physically located as close as possible to the device it is driving. Long power supply and ground traces should be avoided as the added inductance causes unwanted voltage transients. Power and ground planes should be used wherever possible. +5V 90% Input VDD = 18V 0V 4.7 µF Input 0.1 µF tD2 tF tR 90% 90% Output 8.7 1 tD1 18V 1 2 10% Output 10% 10% 0V Inverting Driver CL = 1000 pF 2 +5V 90% Input 0V 4 10% 18V Input: 100 kHz, square wave, tRISE = tFALL  10 ns Output tD1 90% tR 10% 0V 90% tD2 tF 10% Noninverting Driver FIGURE 4-1: 4.2 Switching Time Test Circuit. Typical Applications VDD (4.5V - 18V) VDD (4.5V - 18V) From TTL TC4404 RT RT VOUT GND FIGURE 4-2: Zero Crossover Current Totem-Pole Switch.  2002-2016 Microchip Technology Inc. From TTL TC4405 RIB RIB GND FIGURE 4-3: Driving Bipolar Transistors. DS20001418E-page 9 TC4404/TC4405 +24V 47 k 47 k +12V 15V 0.1µF 15V 0.1µF Direction (TTL Level) RT Speed (PWM) Motor RT GND FIGURE 4-4: TC4469 TC4404 ISENSE Servo Motor Control. +12V +12V Switched +12V +5V +5V From TTL GND TC4404 GND Switched -12V -12V FIGURE 4-5: DS20001418E-page 10 -12V Reach-Up and Reach-Down Driving.  2002-2016 Microchip Technology Inc. TC4404/TC4405 5.0 PACKAGING INFORMATION 5.1 Package Marking Information 8-Lead PDIP (300 mil) XXXXXXXX XXXXXNNN YYWW 8-Lead SOIC (3.90 mm) NNN Legend: XX...X Y YY WW NNN e3 * Note: Example TC4404 EPA e3 256 1519 Example TC4404C OA e3 1519 256 Customer-specific information Year code (last digit of calendar year) Year code (last 2 digits of calendar year) Week code (week of January 1 is week ‘01’) Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) This package is Pb-free. The Pb-free JEDEC designator ( e3 ) can be found on the outer packaging for this package. In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information.  2002-2016 Microchip Technology Inc. DS20001418E-page 11 TC4404/TC4405 /HDG3ODVWLF'XDO,Q/LQH 3$ PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging D A N B E1 NOTE 1 1 2 TOP VIEW E C A2 A 3/$1( L c A1 e eB 8X b1 8X b .010 C SIDE VIEW END VIEW Microchip Technology Drawing No. C04-018D Sheet 1 of 2 DS20001418E-page 12  2002-2016 Microchip Technology Inc. TC4404/TC4405 /HDG3ODVWLF'XDO,Q/LQH 3$ PLO%RG\>3',3@ 1RWH For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging ALTERNATE LEAD DESIGN (VENDOR DEPENDENT) DATUM A DATUM A b b e 2 e 2 e Units Dimension Limits Number of Pins N e Pitch Top to Seating Plane A Molded Package Thickness A2 Base to Seating Plane A1 Shoulder to Shoulder Width E Molded Package Width E1 Overall Length D Tip to Seating Plane L c Lead Thickness Upper Lead Width b1 b Lower Lead Width Overall Row Spacing eB § e MIN .115 .015 .290 .240 .348 .115 .008 .040 .014 - INCHES NOM 8 .100 BSC .130 .310 .250 .365 .130 .010 .060 .018 - MAX .210 .195 .325 .280 .400 .150 .015 .070 .022 .430 Notes: 1. Pin 1 visual index feature may vary, but must be located within the hatched area. 2. § Significant Characteristic 3. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" per side. 4. Dimensioning and tolerancing per ASME Y14.5M BSC: Basic Dimension. Theoretically exact value shown without tolerances. Microchip Technology Drawing No. C04-018D Sheet 2 of 2  2002-2016 Microchip Technology Inc. DS20001418E-page 13 TC4404/TC4405 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging DS20001418E-page 14  2002-2016 Microchip Technology Inc. TC4404/TC4405 Note: For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging  2002-2016 Microchip Technology Inc. DS20001418E-page 15 TC4404/TC4405      !"#$%&  '   ! "#  $% &"' ""    ($ )  %  *++&&&!    !+ $ DS20001418E-page 16  2002-2016 Microchip Technology Inc. TC4404/TC4405 APPENDIX A: REVISION HISTORY Revision E (April 2016) The following is the list of modifications: 1. 2. 3. 4. Removed all information regarding the discontinued CERDIP package. Added Temperature Specifications Table. Added Section 5.0, Packaging Information. Added Product Identification System page. Revision D (December 2012) Added a note to each package outline drawing.  2002-2016 Microchip Technology Inc. DS20001418E-page 17 TC4404/TC4405 NOTES: DS20001418E-page 18  2002-2016 Microchip Technology Inc. TC4404/TC4405 PRODUCT IDENTIFICATION SYSTEM To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office. PART NO. X XX Device Temperature Range Package Device: TC4404: TC4405: Temperature Range: C E = 0C to +70C = -40C to +85C Package: OA = PA = OA713 = Dual Open-Drain MOSFET Driver Dual Open-Drain MOSFET Driver Plastic Small Outline (3.90 mm Body),8-Lead, SOIC Plastic Dual In-Line (300 mil Body), 8-Lead, PDIP Plastic Small Outline (3.90 mm Body),8-Lead, SOIC (Tape and Reel)  2002-2016 Microchip Technology Inc. Examples: a) TC4404COA: b) TC4404EOA: c) TC4404CPA: d) TC4405EPA: e) TC4404EOA713: 1.5A Dual Open-Drain Driver, 0°C to +70°C, 8LD SOIC Package 1.5A Dual Open-Drain Driver, -40°C to +85°C, 8LD SOIC Package 1.5A Dual Open-Drain Driver, 0°C to +70°C, 8LD PDIP Package 1.5A Dual Open-Drain Driver, -40°C to +85°C, 8LD PDIP Package 1.5A Dual Open-Drain Driver, -40°C to +85°C, 8LD SOIC Package, Tape and Reel MOSFET MOSFET MOSFET MOSFET MOSFET DS20001418E-page 19 TC4404/TC4405 NOTES: DS20001418E-page 20  2002-2016 Microchip Technology Inc. Note the following details of the code protection feature on Microchip devices: • Microchip products meet the specification contained in their particular Microchip Data Sheet. • Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions. • There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property. • Microchip is willing to work with the customer who is concerned about the integrity of their code. • Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified. QUALITY MANAGEMENT SYSTEM CERTIFIED BY DNV == ISO/TS 16949 ==  2002-2016 Microchip Technology Inc. Trademarks The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A. Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries. GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2002-2016, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-0445-3 DS20001418E-page 21 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: http://www.microchip.com/ support Web Address: www.microchip.com Asia Pacific Office Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon China - Xiamen Tel: 86-592-2388138 Fax: 86-592-2388130 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 China - Zhuhai Tel: 86-756-3210040 Fax: 86-756-3210049 Denmark - Copenhagen Tel: 45-4450-2828 Fax: 45-4485-2829 India - Bangalore Tel: 91-80-3090-4444 Fax: 91-80-3090-4123 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 India - New Delhi Tel: 91-11-4160-8631 Fax: 91-11-4160-8632 Germany - Dusseldorf Tel: 49-2129-3766400 Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Hong Kong Tel: 852-2943-5100 Fax: 852-2401-3431 Australia - Sydney Tel: 61-2-9868-6733 Fax: 61-2-9868-6755 China - Beijing Tel: 86-10-8569-7000 Fax: 86-10-8528-2104 Austin, TX Tel: 512-257-3370 China - Chengdu Tel: 86-28-8665-5511 Fax: 86-28-8665-7889 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 China - Chongqing Tel: 86-23-8980-9588 Fax: 86-23-8980-9500 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Cleveland Independence, OH Tel: 216-447-0464 Fax: 216-447-0643 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Canada - Toronto Tel: 905-673-0699 Fax: 905-673-6509 China - Dongguan Tel: 86-769-8702-9880 China - Hangzhou Tel: 86-571-8792-8115 Fax: 86-571-8792-8116 Germany - Karlsruhe Tel: 49-721-625370 India - Pune Tel: 91-20-3019-1500 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Japan - Osaka Tel: 81-6-6152-7160 Fax: 81-6-6152-9310 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Japan - Tokyo Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771 Italy - Venice Tel: 39-049-7625286 Korea - Daegu Tel: 82-53-744-4301 Fax: 82-53-744-4302 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 China - Hong Kong SAR Tel: 852-2943-5100 Fax: 852-2401-3431 Korea - Seoul Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934 China - Nanjing Tel: 86-25-8473-2460 Fax: 86-25-8473-2470 Malaysia - Kuala Lumpur Tel: 60-3-6201-9857 Fax: 60-3-6201-9859 China - Qingdao Tel: 86-532-8502-7355 Fax: 86-532-8502-7205 Malaysia - Penang Tel: 60-4-227-8870 Fax: 60-4-227-4068 China - Shanghai Tel: 86-21-5407-5533 Fax: 86-21-5407-5066 Philippines - Manila Tel: 63-2-634-9065 Fax: 63-2-634-9069 China - Shenyang Tel: 86-24-2334-2829 Fax: 86-24-2334-2393 Singapore Tel: 65-6334-8870 Fax: 65-6334-8850 China - Shenzhen Tel: 86-755-8864-2200 Fax: 86-755-8203-1760 Taiwan - Hsin Chu Tel: 886-3-5778-366 Fax: 886-3-5770-955 China - Wuhan Tel: 86-27-5980-5300 Fax: 86-27-5980-5118 Taiwan - Kaohsiung Tel: 886-7-213-7828 China - Xian Tel: 86-29-8833-7252 Fax: 86-29-8833-7256 Poland - Warsaw Tel: 48-22-3325737 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 Taiwan - Taipei Tel: 886-2-2508-8600 Fax: 886-2-2508-0102 Thailand - Bangkok Tel: 66-2-694-1351 Fax: 66-2-694-1350 07/14/15 DS20001418E-page 22  2002-2016 Microchip Technology Inc.
TC4404CPA 价格&库存

很抱歉,暂时无法提供与“TC4404CPA”相匹配的价格&库存,您可以联系我们找货

免费人工找货
TC4404CPA
  •  国内价格 香港价格
  • 60+16.8281660+2.04286
  • 180+16.74952180+2.03331
  • 240+16.74915240+2.03327
  • 600+16.74878600+2.03322
  • 900+16.74841900+2.03318

库存:0