11-/14-Bit, 5.7 GSPS,
RF Digital-to-Analog Converter
AD9119/AD9129
Data Sheet
FEATURES
FUNCTIONAL BLOCK DIAGRAM
RESET
I250U VREF
IRQ
AD9129
1.2V
SPI
DCO_x
Tx DAC
CORE
IOUTP
IOUTN
2×
PLL
CLOCK
DISTRIBUTION
DCR
DACCLK_x
11149-001
DCI_x
BASEBAND
MODE
DATA
LATCH
DLL
DATA ASSEMBLER
P0_D[13:0]P,
P0_D[13:0]N
P1_D[13:0]P,
P1_D[13:0]N
MIXNORMAL MODE
LVDS DDR
RECEIVER
FRM_x
(FRAME/
PARITY)
4× FIFO
SDIO
SDO
CS
SCLK
LVDS DDR
RECEIVER
DAC update rate: up to 5.7 GSPS
Direct RF synthesis at 2.85 GSPS data rate
DC to 1.425 GHz in baseband mode
DC to 1.0 GHz in 2× interpolation mode
1.425 GHz to 4.2 GHz in Mix-Mode
Bypassable 2× interpolation
Excellent dynamic performance
Supports DOCSIS 3.0 wideband ACLR/harmonic performance
8 QAM carriers: ACLR > 65 dBc
Industry-leading single/multicarrier IF or RF synthesis
4-carrier W-CDMA ACLR at 2457.6 MSPS
fOUT = 900 MHz, ACLR = 71 dBc (baseband mode)
fOUT = 2100 MHz, ACLR = 68 dBc (Mix-Mode)
fOUT = 2700 MHz, ACLR = 67 dBc (Mix-Mode)
Dual-port LVDS and DHSTL data interface
Up to 1.425 GSPS operation
Source synchronous DDR clocking with parity bit
Low power: 1.0 W at 2.85 GSPS (1.3 W at 5.7 GSPS)
Figure 1.
APPLICATIONS
Broadband communications systems
CMTS/VOD
Wireless infrastructure: W-CDMA, LTE, point-to-point
Instrumentation, automatic test equipment (ATE)
Radar, jammers
GENERAL DESCRIPTION
The AD9119/AD9129 are high performance, 11-/14-bit RF digitalto-analog converters (DACs) supporting data rates up to 2.85
GSPS. The DAC core is based on a quad-switch architecture that
enables dual-edge clocking operation, effectively increasing the
DAC update rate to 5.7 GSPS when configured for Mix-Mode™
or 2× interpolation. The high dynamic range and bandwidth
enable multicarrier generation up to 4.2 GHz.
In baseband mode, wide bandwidth capability combines with high
dynamic range to support from 1 to 158 contiguous carriers for
CATV infrastructure applications. A choice of two optional 2×
interpolation filters is available to simplify the postreconstruction
filter by effectively increasing the DAC update rate by a factor of 2.
In Mix-Mode operation, the AD9119/AD9129 can reconstruct
RF carriers in the second and third Nyquist zone while still
maintaining exceptional dynamic range up to 4.2 GHz. The
high performance NMOS DAC core features a quad-switch
architecture that enables industry-leading direct RF synthesis
performance with minimal loss in output power. The output
current can be programmed over a range of 9.5 mA to 34.4 mA.
Rev. B
The AD9119/AD9129 include several features that may further
simplify system integration. A dual-port, source synchronous
LVDS interface simplifies the data interface to a host FPGA/ASIC.
A differential frame/parity bit is also included to monitor the
integrity of the interface. On-chip delay locked loops (DLLs)
optimize timing between different clock domains.
A serial peripheral interface (SPI) configures the AD9119/
AD9129 and monitors the status of readback registers. The
AD9119/AD9129 are manufactured on a 0.18 µm CMOS
process and operates from +1.8 V and −1.5 V supplies. It is
supplied in a 160-ball chip scale package ball grid array.
PRODUCT HIGHLIGHTS
1.
2.
3.
High dynamic range and signal reconstruction bandwidth
support RF signal synthesis of up to 4.2 GHz.
Dual-port interface with double data rate (DDR) LVDS
data receivers supports 2850 MSPS maximum conversion rate.
Manufactured on a CMOS process; a proprietary switching
technique enhances dynamic performance.
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©2013-2017 Analog Devices, Inc. All rights reserved.
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AD9119/AD9129
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Serial Peripheral Interface Pin Descriptions .......................... 36
Applications ....................................................................................... 1
MSB/LSB Transfers .................................................................... 37
Functional Block Diagram .............................................................. 1
Serial Port Configuration .......................................................... 37
General Description ......................................................................... 1
Theory of Operation ...................................................................... 38
Product Highlights ........................................................................... 1
LVDS Data Port Interface .......................................................... 39
Revision History ............................................................................... 2
Digital Datapath Description ................................................... 42
Specifications..................................................................................... 3
Reset ............................................................................................. 47
DC Specifications ......................................................................... 3
Interrupt Requests ...................................................................... 47
LVDS Digital Specifications ........................................................ 4
Interface Timing Validation .......................................................... 48
HSTL Digital Specifications ........................................................ 4
Sample Error Detection (SED) Operation .............................. 48
Serial Port and CMOS Pin Specifications ................................. 5
SED Example............................................................................... 48
AC Specifications.......................................................................... 6
Analog Interface Considerations.................................................. 49
Absolute Maximum Ratings ............................................................ 7
Analog Modes of Operation ..................................................... 49
Thermal Resistance ...................................................................... 7
Clock Input.................................................................................. 50
ESD Caution .................................................................................. 7
PLL ............................................................................................... 50
Pin Configurations and Function Descriptions ........................... 8
Voltage Reference ....................................................................... 51
Typical Performance Characteristics ........................................... 12
Analog Outputs .......................................................................... 51
AD9119 ........................................................................................ 12
Start-Up Sequence ...................................................................... 54
AD9129 ........................................................................................ 22
Device Configuration Registers.................................................... 55
Terminology .................................................................................... 35
Device Configuration Register Map ........................................ 55
Serial Communications Port Overview....................................... 36
Device Configuration Register Descriptions .......................... 56
Serial Peripheral Interface (SPI) ............................................... 36
Outline Dimensions ....................................................................... 66
General Operation of the SPI.................................................... 36
Ordering Guide .......................................................................... 66
Instruction Mode (8-Bit Instruction) ...................................... 36
REVISION HISTORY
6/2017—Rev. A to Rev. B
Changes to Table 8 ............................................................................ 9
Changes to Table 9 .......................................................................... 11
Changes to Figure 87 ...................................................................... 27
Added Reset Section....................................................................... 47
Changes to Figure 149 .................................................................... 51
Changes to Figure 156 .................................................................... 53
Changes to Bits[2:1] Description, Table 29 ................................. 59
Change to Bit 5 Access, Table 37 .................................................. 61
9/2013—Rev. 0 to Rev. A
Changes to Product Title ............................................................................ 1
Changes to Features Section and General Description Section....... 1
Changes to Table 1 ........................................................................... 3
Changes to Table 2 and Table 3 ....................................................... 4
Changes to Dynamic Performance Parameter, Table 5 ............... 6
Changes to Figure 10 and Figure 13............................................. 13
Changes to Figure 21and Figure 23 .............................................. 15
Changes to Figure 24 and Figure 27............................................. 16
Changes to Figure 35 and Figure 37............................................. 18
Changes to Figure 62, Figure 65, and Figure 67 ......................... 23
Changes to Figure 76 and Figure 79 ............................................ 25
Changes to Figure 84, Figure 85, and Figure 87 ......................... 27
Changes to Figure 90 and Figure 92 ............................................ 28
Changes to Figure 95 and Figure 97 ............................................ 29
Changes to Figure 118 ................................................................... 33
Change to Serial Communications Port Overview Section .......... 36
Changes to Theory of Operation Section.................................... 38
Changes to LVDS Data Port Interface Section ........................... 39
Changes to Multiple DAC Synchronization Section ................. 44
Change to PLL Section .................................................................. 50
Change to Voltage Reference Section .......................................... 51
Change to Register 0x01, Table 16 ............................................... 54
Changes to Table 17 ....................................................................... 55
Changes to Bit 6, Table 37 ............................................................. 61
Changes to Table 49, Table 50, Table 51, and Table 52 .............. 63
Changes to Table 53, Table 54, Table 55, Table 56, and Table 57 ... 64
1/2013—Revision 0: Initial Version
Rev. B | Page 2 of 66
Data Sheet
AD9119/AD9129
SPECIFICATIONS
DC SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C.
Table 1.
Parameter
RESOLUTION
ACCURACY
Integral Nonlinearity (INL)
Differential Nonlinearity (DNL)
ANALOG OUTPUTS
Gain Error (with Internal Reference)
Full-Scale Output Current Maximum
Full-Scale Output Current Minimum
Output Compliance Range
Output Impedance 1
DAC CLOCK INPUT (DACCLK_P, DACCLK_N)
Differential Peak-to-Peak Voltage
Common-Mode Voltage
TEMPERATURE DRIFT
Gain
Reference Voltage
REFERENCE
Internal Reference Voltage
Output Resistance
ANALOG SUPPLY VOLTAGES
VDDA
FIR40 Enabled, DACCLK > 2600 MSPS
VSSA
DIGITAL SUPPLY VOLTAGES
VDD
FIR40 Enabled, DACCLK > 2600 MSPS
SUPPLY CURRENTS AND POWER DISSIPATION, 2.3 GSPS
(NORMAL MODE)
IVDDA
IVSSA
IDVDD
Power Dissipation
Normal Mode
FIR25 Enabled
FIR40 Enabled
Reduced Power Mode, Power-Down Enabled
(Register 0x01 = 0xEF)
IVDDA
IVSSA
IVDD
SUPPLY CURRENTS AND POWER DISSIPATION, 2.8 GSPS
(NORMAL MODE)
IVDDA
IVSSA
IDVDD
Power Dissipation (Normal Mode)
1
Min
AD9119
Typ
11
Max
Min
0.2
0.15
33.4
9.1
1.5
0.4
+2.5
34.2
9.4
1
1.2
AD9129
Typ
14
Max
1.4
1.1
34.9
9.6
2.5
33.4
9.1
1.5
2
0.4
+2.5
34.2
9.4
1
1.2
Unit
Bits
LSB
LSB
34.9
9.6
2.5
2
%
mA
mA
V
V
V
60
20
60
20
ppm/°C
ppm/°C
1.0
5
1.0
5
V
kΩ
1.70
1.8
−1.4
1.80
1.9
−1.5
1.90
2.0
−1.6
1.70
1.8
−1.4
1.80
1.9
−1.5
1.90
2.0
−1.6
V
V
V
1.70
1.8
1.8
1.9
1.90
2.0
1.70
1.8
1.8
1.9
1.90
2.0
V
V
202
53
307
209
54
327
202
53
307
209
54
327
mA
mA
mA
1.0
1.17
1.3
1.05
1.24
1.4
1.0
1.17
1.3
1.05
1.24
1.4
W
W
W
7.6
6
0.4
7.6
6
0.4
mA
µA
mA
230
53
336
1.1
230
53
336
1.1
mA
mA
mA
W
For more information about output impedance, see the Output Stage Configuration section.
Rev. B | Page 3 of 66
AD9119/AD9129
Data Sheet
LVDS DIGITAL SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C. LVDS drivers and receivers are compatible with the IEEE
Standard 1596.3-1996, unless otherwise noted.
Table 2.
Parameter
LVDS DATA INPUTS (P1_D[13:0]P, P1_D[13:0]N,
P0_D[13:0]P, P0_D[13:0]N, FRM_P, FRM_N)
Input Voltage Range
Input Differential Threshold
Input Differential Hysteresis
Receiver Differential Input Impedance
LVDS Input Rate
Input Capacitance
LVDS CLOCK INPUTS (DCI_P, DCI_N)
Input Voltage Range
Input Differential Threshold
Input Differential Hysteresis
Receiver Differential Input Impedance
Maximum Clock Rate
LVDS CLOCK OUTPUTS (DCO_P, DCO_N)
Symbol
Test Conditions/Comments
Px_DxP = VIA, Px_DxN = VIB
Min
VIA, VIB
VIDTH
VIDTHH − VIDTHL
RIN
Typ
825
−100
Max
Unit
1575
+100
mV
mV
mV
Ω
MSPS
pF
20
80
1425
120
1.2
DCI_P = VIA, DCI_N = VIB
VIA, VIB
VIDTH
VIDTHH − VIDTHL
RIN
825
−225
1575
+225
20
80
712.5
120
mV
mV
mV
Ω
MHz
DCO_P = VOA, DCO_N = VOB,
100 Ω termination
Output Voltage High
Output Voltage Low
Output Differential Voltage
Output Offset Voltage
Output Impedance, Single-Ended
RO Mismatch Between A and B
Change in |VOD| Between Setting 0 and Setting 1
Change in VOS Between Setting 0 and Setting 1
Output Current
Driver Shorted to Ground
Drivers Shorted Together
Power-Off Output Leakage
Maximum Clock Rate
VOA, VOB
VOA, VOB
|VOA|, |VOB|
VOS
RO
∆RO
|∆VOD|
∆VOS
1375
Register 0x7C[7:6] = 01b (default)
1025
200
1150
80
225
100
ISA, ISB
ISAB
|IXA|, |IXB|
250
1250
120
10
25
25
20
4
10
712.5
mV
mV
mV
mV
Ω
%
mV
mV
mA
mA
µA
MHz
HSTL DIGITAL SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C. HSTL receiver levels are compatible with the EIA/JEDEC
JESD8-6 standard, unless otherwise noted.
Table 3.
Parameter
HSTL DATA INPUTS (P1_D[13:0]P, P1_D[13:0]N,
P0_D[13:0]P, P0_D[13:0]N, FRM_P, FRM_N)
Common-Mode Input Voltage Range
Differential Input Voltage
Receiver Differential Input Impedance
HSTL Input Rate
Input Capacitance
HSTL CLOCK INPUT (DCI_P, DCI_N)
Common-Mode Input Voltage Range
Differential Input Voltage
Receiver Differential Input Impedance
Maximum Clock Rate
Symbol
Test Comments/Conditions
Px_DxP = VIA, Px_DxN = VIB
VIA, VIB
Min
Typ
0.68
200
80
1425
RIN
Max
Unit
0.9
V
mV
Ω
MSPS
pF
120
1.2
DCI_P = VIA, DCI_N = VIB
VIA, VIB
0.68
450
80
712.5
RIN
Rev. B | Page 4 of 66
0.9
120
mV
mV
Ω
MHz
Data Sheet
AD9119/AD9129
SERIAL PORT AND CMOS PIN SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C.
Table 4.
Parameter
WRITE OPERATION
SCLK Clock Rate
SCLK Clock High
SCLK Clock Low
SDIO to SCLK Setup Time
SCLK to SDIO Hold Time
CS to SCLK Setup Time
SCLK to CS Hold Time
READ OPERATION
SCLK Clock Rate
SCLK Clock High
SCLK Clock Low
SDIO to SCLK Setup Time
SCLK to SDIO Hold Time
CS to SCLK Setup Time
SCLK to SDIO (or SDO) Data Valid Time
CS to SDIO (or SDO) Output Valid to High-Z
INPUTS (SDI, SDIO, SCLK, CS)
Voltage In High
Voltage In Low
Current In High
Current In Low
OUTPUTS (SDIO, SYNC)
Voltage Out High
Voltage Out Low
Current Out High
Current Out Low
Symbol
Test Comments/Conditions
See Figure 126
fSCLK, 1/tSCLK
tHIGH
tLOW
tDS
tDH
tS
tH
Min
Typ
Max
Unit
20
MHz
ns
ns
ns
ns
ns
ns
20
MHz
ns
ns
ns
ns
ns
ns
20
20
10
5
10
5
See Figure 127
fSCLK, 1/tSCLK
tHIGH
tLOW
tDS
tDH
tS
tDV
tEZ
20
20
10
5
10
10
2
VIH
VIL
IIH
IIL
1.2
1.8
0
0.4
+75
−150
VOH
VOL
IOH
IOL
1.3
0
2.0
0.3
4
4
Rev. B | Page 5 of 66
V
V
µA
µA
V
V
mA
mA
AD9119/AD9129
Data Sheet
AC SPECIFICATIONS
VDDA = VDD = 1.8 V, VSSA = −1.5 V, IOUTFS = 33 mA, TA = −40°C to +85°C, unless otherwise noted.
Table 5.
Parameter
DYNAMIC PERFORMANCE
DAC Update Rate (DACCLK_x Inputs)
Normal Mode, FIR25 Enabled, or FIR40 Enabled with VDD = 1.9 V
FIR40 Filter Enabled, VDD = 1.8 V
Adjusted DAC Update Rate 1
Output Settling Time to 0.1%
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fDAC = 2600 MSPS
fOUT = 100 MHz
fOUT = 350 MHz
fOUT = 550 MHz
fOUT = 950 MHz
TWO-TONE INTERMODULATION DISTORTION (IMD)
fDAC = 2600 MSPS, fOUT2 = fOUT1 + 1.4 MHz
fOUT = 100 MHz
fOUT = 350 MHz
fOUT = 550 MHz
fOUT = 950 MHz
NOISE SPECTRAL DENSITY (NSD)
Single Tone, fDAC = 2800 MSPS
fOUT = 100 MHz
fOUT = 350MHz
fOUT = 550 MHz
fOUT = 850 MHz
DOCSIS ACLR PERFORMANCE (50 MHz to 1000 MHz) at ≥6 MHz OFFSET
fDAC = 2782 MSPS
8 Contiguous Carriers
16 Contiguous Carriers
32 Contiguous Carriers
W-CDMA ACLR (SINGLE CARRIER)
Adjacent Channel
fDAC = 2605.056 MSPS, fOUT = 750 MHz
fDAC= 2605.056 MSPS, fOUT = 950 MHz
fDAC = 2605.056 MSPS, fOUT = 1700 MHz (Mix-Mode)
fDAC = 2605.056 MSPS, fOUT = 2100 MHz (Mix-Mode)
Alternate Adjacent Channel
fDAC = 2605.056 MSPS, fOUT = 750 MHz
fDAC = 2605.056 MSPS, fOUT = 950 MHz
fDAC = 2605.056 MSPS, fOUT = 1700 MHz (Mix-Mode)
fDAC = 2605.056 MSPS, fOUT = 2100 MHz (Mix-Mode)
1
Min
AD9119
Typ
1400
1400
1400
Max
Min
2850
2600
2850
1400
1400
1400
AD9129
Typ
Max
2850
2600
2850
Unit
13
13
MSPS
MSPS
MSPS
ns
−76
−65
−63
−55
−76
−65
−64
−55
dBc
dBc
dBc
dBc
−82
−78
−73
−67
−86
−85
−83
−76
dBc
dBc
dBc
dBc
−157
−157
−155
−154
−166
−162
−158
−157
dBm/Hz
dBm/Hz
dBm/Hz
dBm/Hz
64
62
60
64
63
61
dBc
dBc
dBc
75
74
73.5
69
75
74
73.5
69
dBc
dBc
dBc
dBc
80
78
74
72
80
78
74
72
dBc
dBc
dBc
dBc
Adjusted DAC update rate is calculated as fDAC divided by the minimum required interpolation factor. For the AD9119/AD9129, the minimum interpolation factor is 1.
Thus, with fDAC = 2850 MSPS, fDAC adjusted = 2850 MSPS.
Rev. B | Page 6 of 66
Data Sheet
AD9119/AD9129
ABSOLUTE MAXIMUM RATINGS
THERMAL RESISTANCE
Table 6.
Parameter
DCI, DCO to VSS
LVDS Data Inputs to VSS
IOUTP, IOUTN to VSSA
I250U, VREF to VSSA
IRQ, CS, SCLK, SDO, SDIO, RESET,
SYNC to VSS
Junction Temperature
Operating Temperature Range
Storage Temperature Range
Rating
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
VSSA − 0.3V to +2.5V
VSSA − 0.3 V to VDDA + 0.3 V
−0.3 V to VDD + 0.3 V
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 7. Thermal Resistance
Package Type
160-Ball CSP_BGA
1
150°C
−40°C to +85°C
−65°C to +150°C
With no airflow movement.
ESD CAUTION
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. B | Page 7 of 66
θJA
31.2
θJC
7.0
Unit
°C/W1
AD9119/AD9129
Data Sheet
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
A
I250U
VREF
VSSA
VSSA
VDDA SH
IOUTP
IOUTN
VDDA SH
VDDA
VDDA
VDDA
VSSC
VSSC
VSSC
B
VDDA
VDDA
VSSA
VSSA
VSSA
VDDA SH
VDDA SH
VDDA
VDDA
VDDA
VDDA
VSSC
VSSC
SYNC
C
DACCLK_N
VDDA
VDDA
VSSA
VSSA
VSSA
VDDA
VDDA
VDDA
VDDA
VSSC
VSSC
VSS
VSS
D
DACCLK_P
VDDA
VDDA
VDDA
VSSC
VSSC
VDDA
VSSC
VSSC
VSSC
VSSC
VSS
VSS
VSS
E
VDDA
VDDA
VSSC
VSSC
VSS
VSS
VSS
VSS
F
VSSC
VSSC
VSSC
VSSC
VSS
VSS
VSS
VSS
G
VSS
VSS
VSS
VSSC
VSS
VDD
VDD
VDD
AD9119
RESET
IRQ
VSS
VSS
VDD
VDD
VDD
VDD
J
SDIO
SDO
VDD
VDD
VDD
VDD
VDD
VDD
K
SCLK
CS
DCI_P
DCI_N
DCO_P
DCO_N
FRM_P
FRM_N
L
NC
NC
NC
P1_D0P
P1_D1P
P1_D2P
P1_D3P
P1_D4P
P1_D5P
P1_D6P
P1_D7P
P1_D8P
P1_D9P
P1_D10P
M
NC
NC
NC
P1_D0N
P1_D1N
P1_D2N
P1_D3N
P1_D4N
P1_D5N
P1_D6N
P1_D7N
P1_D8N
P1_D9N
P1_D10N
N
NC
NC
NC
P0_D0P
P0_D1P
P0_D2P
P0_D3P
P0_D4P
P0_D5P
P0_D6P
P0_D7P
P0_D8P
P0_D9P
P0_D10P
P
NC
NC
NC
P0_D0N
P0_D1N
P0_D2N
P0_D3N
P0_D4N
P0_D5N
P0_D6N
P0_D7N
P0_D8N
P0_D9N
P0_D10N
11149-002
H
NOTES
1. NC = NO CONNECT. DO NOT CONNECT TO THIS PIN.
Figure 2. AD9119 Pin Configuration
Table 8. AD9119 Pin Function Descriptions
Pin No.
A1
Mnemonic
I250U
A2
A3, A4, B3, B4, B5, C4, C5, C6
A5, A8, B6, B7
A9, A10, A11, B1, B2, B8, B9, B10,
B11, C2, C3, C7, C8, C9, C10, D2,
D3, D4, D7, E1, E2
VREF
VSSA
VDDA SH
VDDA
Description
Nominal 1.0 V Reference. Tie this pin to VSSA via a 4.0 kΩ resistor to generate
a 250 µA reference current.
Voltage Reference Input/Output. Decouple to VSSA with a 1 nF capacitor.
−1.5 V Analog Supply Voltage Input.
+1.8 V Analog Supply Shield. Tie these pins to VDDA at the DAC.
+1.8 V Analog Supply Voltage Input.
Rev. B | Page 8 of 66
Data Sheet
Pin No.
G12, G13, G14, H11, H12, H13,
H14, J3, J4, J11, J12, J13, J14
C13, C14, D12, D13, D14, E11,
E12, E13, E14, F11, F12, F13, F14,
G1, G2, G3, G11, H3, H4
A12, A13, A14, B12, B13, C11,
C12, D5, D6, D8, D9, D10, D11,
E3, E4, F1, F2, F3, F4, G4
A6
A7
B14
C1, D1
H1
H2
J1
J2
K1
K2
K3, K4
K11, K12
K13, K14
L1, M1
L2, M2
L3, M3
L4, M4
L5, M5
L6, M6
L7, M7
L8, M8
L9, M9
L10, M10
L11, M11
L12,M12
L13, M13
L14, M14
N1, P1
N2, P2
N3, P3
N4, P4
N5, P5
N6, P6
N7, P7
N8, P8
N9, P9
N10, P10
N11, P11
N12, P12
N13, P13
N14, P14
AD9119/AD9129
Mnemonic
VDD
Description
+1.8 V Digital Supply Voltage Input.
VSS
+1.8 V Digital Supply Return.
VSSC
Analog Supply Return.
IOUTP
IOUTN
SYNC
DACCLK_N, DACCLK_P
RESET
IRQ
DAC Positive Current Output Source.
DAC Negative Current Output Source.
Synchronization Signal Output.
Negative/Positive DAC Clock Input.
Reset Input. Active high. If unused, tie this pin to VSS.
Interrupt Request Open Drain Output. Active high. Pull up this pin to VDD
with a 1 kΩ resistor.
Serial Port Data Input/Output.
Serial Port Data Output.
Serial Port Clock Input.
Serial Port Enable Input.
Positive, Negative Data Clock Input (DCI).
Positive, Negative Data Clock Output (DCO).
Positive, Negative Data Frame/Parity Signal (FRAME/PARITY).
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
Data Port 1 Positive/Negative Data Input Bit 0. LSB.
Data Port 1 Positive/Negative Data Input Bit 1.
Data Port 1 Positive/Negative Data Input Bit 2.
Data Port 1 Positive/Negative Data Input Bit 3.
Data Port 1 Positive/Negative Data Input Bit 4.
Data Port 1 Positive/Negative Data Input Bit 5.
Data Port 1 Positive/Negative Data Input Bit 6.
Data Port 1 Positive/Negative Data Input Bit 7.
Data Port 1 Positive/Negative Data Input Bit 8.
Data Port 1 Positive/Negative Data Input Bit 9.
Data Port 1 Positive/Negative Data Input Bit 10. MSB.
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
No Connect. Do not connect to this pin.
Data Port 0 Positive/Negative Data Input Bit 0. LSB.
Data Port 0 Positive/Negative Data Input Bit 1.
Data Port 0 Positive/Negative Data Input Bit 2.
Data Port 0 Positive/Negative Data Input Bit 3.
Data Port 0 Positive/Negative Data Input Bit 4.
Data Port 0 Positive/Negative Data Input Bit 5.
Data Port 0 Positive/Negative Data Input Bit 6.
Data Port 0 Positive/Negative Data Input Bit 7.
Data Port 0 Positive/Negative Data Input Bit 8.
Data Port 0 Positive/Negative Data Input Bit 9.
Data Port 0 Positive/Negative Data Input Bit 10. MSB.
SDIO
SDO
SCLK
CS
DCI_P, DCI_N
DCO_P, DCO_N
FRM_P, FRM_N
NC, NC
NC, NC
NC, NC
P1_D0P, P1_D0N
P1_D1P, P1_D1N
P1_D2P, P1_D2N
P1_D3P, P1_D3N
P1_D4P, P1_D4N
P1_D5P, P1_D5N
P1_D6P, P1_D6N
P1_D7P, P1_D7N
P1_D8P, P1_D8N
P1_D9P, P1_D9N
P1_D10P, P1_D10N
NC, NC
NC, NC
NC, NC
P0_D0P, P0_D0N
P0_D1P, P0_D1N
P0_D2P, P0_D2N
P0_D3P, P0_D3N
P0_D4P, P0_D4N
P0_D5P, P0_D5N
P0_D6P, P0_D6N
P0_D7P, P0_D7N
P0_D8P, P0_D8N
P0_D9P, P0_D9N
P0_D10P, P0_D10N
Rev. B | Page 9 of 66
AD9119/AD9129
1
Data Sheet
2
3
4
5
6
7
8
9
10
11
12
13
14
A
I250U
VREF
VSSA
VSSA
VDDA SH
IOUTP
IOUTN
VDDA SH
VDDA
VDDA
VDDA
VSSC
VSSC
VSSC
B
VDDA
VDDA
VSSA
VSSA
VSSA
VDDA SH
VDDA SH
VDDA
VDDA
VDDA
VDDA
VSSC
VSSC
SYNC
C
DACCLK_N
VDDA
VDDA
VSSA
VSSA
VSSA
VDDA
VDDA
VDDA
VDDA
VSSC
VSSC
VSS
VSS
D
DACCLK_P
VDDA
VDDA
VDDA
VSSC
VSSC
VDDA
VSSC
VSSC
VSSC
VSSC
VSS
VSS
VSS
E
VDDA
VDDA
VSSC
VSSC
VSS
VSS
VSS
VSS
F
VSSC
VSSC
VSSC
VSSC
VSS
VSS
VSS
VSS
G
VSS
VSS
VSS
VSSC
VSS
VDD
VDD
VDD
AD9129
RESET
IRQ
VSS
VSS
VDD
VDD
VDD
VDD
J
SDIO
SDO
VDD
VDD
VDD
VDD
VDD
VDD
K
SCLK
CS
DCI_P
DCI_N
DCO_P
DCO_N
FRM_P
FRM_N
L
P1_D0P
P1_D1P
P1_D2P
P1_D3P
P1_D4P
P1_D5P
P1_D6P
P1_D7P
P1_D8P
P1_D9P
P1_D10P
P1_D11P
P1_D12P
P1_D13P
M
P1_D0N
P1_D1N
P1_D2N
P1_D3N
P1_D4N
P1_D5N
P1_D6N
P1_D7N
P1_D8N
P1_D9N
P1_D10N
P1_D11N
P1_D12N
P1_D13N
N
P0_D0P
P0_D1P
P0_D2P
P0_D3P
P0_D4P
P0_D5P
P0_D6P
P0_D7P
P0_D8P
P0_D9P
P0_D10P
P0_D11P
P0_D12P
P0_D13P
P
P0_D0N
P0_D1N
P0_D2N
P0_D3N
P0_D4N
P0_D5N
P0_D6N
P0_D7N
P0_D8N
P0_D9N
P0_D10N
P0_D11N
P0_D12N
P0_D13N
11149-003
H
Figure 3. AD9129 Pin Configuration
Table 9. AD9129 Pin Function Descriptions
Pin No.
A1
Mnemonic
I250U
A2
A3, A4, B3, B4, B5, C4, C5, C6
A5, A8, B6, B7
A9, A10, A11, B1, B2, B8, B9, B10,
B11, C2, C3, C7, C8, C9, C10, D2,
D3, D4, D7, E1, E2
G12, G13, G14, H11, H12, H13,
H14, J3, J4, J11, J12, J13, J14
C13, C14, D12, D13, D14, E11,
E12, E13, E14, F11, F12, F13, F14,
G1, G2, G3, G11, H3, H4
VREF
VSSA
VDDA SH
VDDA
Description
Nominal 1.0 V Reference. Tie this pin to VSSA via a 4.0 kΩ resistor to generate
a 250 µA reference current.
Voltage Reference Input/Output. Decouple to VSSA with a 1 nF capacitor.
−1.5 V Analog Supply Voltage Input.
+1.8 V Analog Supply Shield. Tie these pins to VDDA at the DAC.
+1.8 V Analog Supply Voltage Input.
VDD
+1.8 V Digital Supply Voltage Input.
VSS
+1.8 V Digital Supply Return.
Rev. B | Page 10 of 66
Data Sheet
AD9119/AD9129
Pin No.
A12, A13, A14, B12, B13, C11,
C12, D5, D6, D8, D9, D10, D11,
E3, E4, F1, F2, F3, F4, G4
A6
A7
B14
C1, D1
H1
H2
Mnemonic
VSSC
Description
Analog Supply Return.
IOUTP
IOUTN
SYNC
DACCLK_N, DACCLK_P
RESET
IRQ
J1
J2
K1
K2
K3, K4
K11, K12
K13, K14
L1, M1
L2, M2
L3, M3
L4, M4
L5, M5
L6, M6
L7, M7
L8, M8
L9, M9
L10, M10
L11, M11
L12,M12
L13, M13
L14, M14
N1, P1
N2, P2
N3, P3
N4, P4
N5, P5
N6, P6
N7, P7
N8, P8
N9, P9
N10, P10
N11, P11
N12, P12
N13, P13
N14, P14
SDIO
SDO
SCLK
CS
DCI_P, DCI_N
DCO_P, DCO_N
FRM_P, FRM_N
P1_D0P, P1_D0N
P1_D1P, P1_D1N
P1_D2P, P1_D2N
P1_D3P, P1_D3N
P1_D4P, P1_D4N
P1_D5P, P1_D5N
P1_D6P, P1_D6N
P1_D7P, P1_D7N
P1_D8P, P1_D8N
P1_D9P, P1_D9N
P1_D10P, P1_D10N
P1_D11P, P1_D11N
P1_D12P, P1_D12N
P1_D13P, P1_D13N
P0_D0P, P0_D0N
P0_D1P, P0_D1N
P0_D2P, P0_D2N
P0_D3P, P0_D3N
P0_D4P, P0_D4N
P0_D5P, P0_D5N
P0_D6P, P0_D6N
P0_D7P, P0_D7N
P0_D8P, P0_D8N
P0_D9P, P0_D9N
P0_D10P, P0_D10N
P0_D11P, P0_D11N
P0_D12P, P0_D12N
P0_D13P, P0_D13N
DAC Positive Current Output Source.
DAC Negative Current Output Source.
Synchronization Signal Output.
Negative/Positive DAC Clock Input.
Reset Input. Active high. If unused, tie this pin to VSS.
Interrupt Request Open-Drain Output. Active high. Pull up this pin to VDD
with a 1 kΩ resistor.
Serial Port Data Input/Output.
Serial Port Data Output.
Serial Port Clock Input.
Serial Port Enable Input.
Positive, Negative Data Clock Input (DCI).
Positive, Negative Data Clock Output (DCO).
Positive, Negative Data Frame/Parity Signal (FRAME/PARITY).
Data Port 1 Positive/Negative Data Input Bit 0. LSB.
Data Port 1 Positive/Negative Data Input Bit 1.
Data Port 1 Positive/Negative Data Input Bit 2.
Data Port 1 Positive/Negative Data Input Bit 3.
Data Port 1 Positive/Negative Data Input Bit 4.
Data Port 1 Positive/Negative Data Input Bit 5.
Data Port 1 Positive/Negative Data Input Bit 6.
Data Port 1 Positive/Negative Data Input Bit 7.
Data Port 1 Positive/Negative Data Input Bit 8.
Data Port 1 Positive/Negative Data Input Bit 9.
Data Port 1 Positive/Negative Data Input Bit 10.
Data Port 1 Positive/Negative Data Input Bit 11.
Data Port 1 Positive/Negative Data Input Bit 12.
Data Port 1 Positive/Negative Data Input Bit 13. MSB.
Data Port 0 Positive/Negative Data Input Bit 0. LSB.
Data Port 0 Positive/Negative Data Input Bit 1.
Data Port 0 Positive/Negative Data Input Bit 2.
Data Port 0 Positive/Negative Data Input Bit 3.
Data Port 0 Positive/Negative Data Input Bit 4.
Data Port 0 Positive/Negative Data Input Bit 5.
Data Port 0 Positive/Negative Data Input Bit 6.
Data Port 0 Positive/Negative Data Input Bit 7.
Data Port 0 Positive/Negative Data Input Bit 8.
Data Port 0 Positive/Negative Data Input Bit 9.
Data Port 0 Positive/Negative Data Input Bit 10.
Data Port 0 Positive/Negative Data Input Bit 11.
Data Port 0 Positive/Negative Data Input Bit 12.
Data Port 0 Positive/Negative Data Input Bit 13. MSB.
Rev. B | Page 11 of 66
AD9119/AD9129
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
AD9119
Static Linearity
IOUTFS = 28 mA, nominal supplies, TA = 25°C, unless otherwise noted.
0.3
0.10
0.08
0.2
0.06
0.1
DNL (LSB)
INL (LSB)
0.04
0
0.02
0
–0.02
–0.04
–0.06
–0.1
0
200
400
600
800
1000 1200 1400 1600 1800 2000
CODE
–0.10
11149-004
–0.2
0
200
400
600
800
1000 1200 1400 1600 1800 2000
CODE
Figure 4. Typical INL, 11 mA at 25°C
11149-007
–0.08
Figure 7. Typical DNL, 11 mA at 25°C
0.10
0.3
0.08
0.06
0.2
0.1
DNL (LSB)
INL (LSB)
0.04
0
0.02
0
–0.02
–0.04
–0.06
–0.1
200
400
600
800
1000 1200 1400 1600 1800 2000
CODE
–0.10
11149-005
0
0
200
400
600
800
1000 1200 1400 1600 1800 2000
CODE
11149-008
–0.08
–0.2
Figure 8. Typical DNL, 22 mA at 25°C
Figure 5. Typical INL, 22 mA at 25°C
0.10
0.3
0.08
0.06
0.2
DNL (LSB)
0.1
0
0.02
0
–0.02
–0.04
–0.06
–0.1
–0.2
–0.10
0
200
400
600
800
1000 1200 1400 1600 1800 2000
CODE
0
200
400
600
800
1000 1200 1400 1600 1800 2000
CODE
Figure 9. Typical DNL, 33 mA at 25°C
Figure 6. Typical INL, 33 mA at 25°C
Rev. B | Page 12 of 66
11149-009
–0.08
11149-006
INL (LSB)
0.04
Data Sheet
AD9119/AD9129
AC (Normal Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 5dBm ATTEN: 24dB
REF 5dBm ATTEN: 20dB
5
–5
–5
–15
–15
–25
–25
–35
–35
10dB/DIV
–45
–55
–45
–55
–65
–65
–75
–75
–85
START 20MHz
RES BW 20kHz
VBW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
11149-011
–85
–95
–95
START 20MHz
RES BW 20kHz
Figure 10. Single-Tone Spectrum at fOUT = 70 MHz
VBW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
11149-012
10dB/DIV
5
Figure 13. Single-Tone Spectrum at fOUT = 1000 MHz
–55
0
1400MSPS
1600MSPS
2200MSPS
2600MSPS
2800MSPS
–10
–20
1600MSPS
2200MSPS
2600MSPS
2800MSPS
–60
–65
IMD (dBc)
SFDR (dBc)
–30
–40
–50
–70
–75
–60
–80
–70
–90
–90
200
400
600
800
1000
1200
1400
fOUT (MHz)
0
11149-013
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
Figure 11. SFDR vs. fOUT over fDAC
11149-014
–85
–80
Figure 14. IMD vs. fOUT over fDAC
–145
–150
1600MSPS
2200MSPS
2800MSPS
1600MSPS
2200MSPS
2800MSPS
–150
NSD (dBm/Hz)
–155
–160
–160
–165
–165
–170
200
400
600
800
1000
fOUT (MHz)
1200
1400
Figure 12. Single-Tone NSD vs. fOUT
0
200
400
600
800
fOUT (MHz)
Figure 15. W-CDMA NSD vs. fOUT
Rev. B | Page 13 of 66
1000
1200
11149-016
–170
0
11149-015
NSD (dBm/Hz)
–155
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–30
–45
–16dBFS
–12dBFS
–6dBFS
0dBFS
–50
11mA
22mA
33mA
–40
–55
SFDR (dBc)
SFDR (dBc)
–50
–60
–65
–60
–70
–70
–80
–75
400
600
800
1000
1200
1400
fOUT (MHz)
0
600
800
1000
1200
1400
1400
Figure 18. SFDR vs. fOUT over DAC IOUTFS
–55
–16dBFS
–12dBFS
–6dBFS
0dBFS
–50
400
fOUT (MHz)
Figure 16. SFDR vs. fOUT over Digital Full Scale
–40
200
11149-021
200
11149-017
0
11149-022
–90
–80
11mA
22mA
33mA
–60
–65
IMD (dBc)
–70
–70
–75
–80
–80
–90
–85
–100
0
200
400
600
800
1000
1200
fOUT (MHz)
1400
11149-020
IMD (dBc)
–60
Figure 17. IMD vs. fOUT over Digital Full Scale
–90
0
200
400
600
800
1000
fOUT (MHz)
Figure 19. IMD vs. fOUT over DAC IOUTFS
Rev. B | Page 14 of 66
1200
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–150
–145
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
–150
NSD (dBm/Hz)
NSD (dBm/Hz)
–155
–155
–160
–160
–165
–165
400
600
800
1000
1200
1400
fOUT (MHz)
0
–40
–40
–50
–50
–60
–60
10dB/DIV
–30
–70
–80
1000
1200
–80
–90
–90
–100
–110
–110
–120
SPAN 53.84MHz
SWEEP 1.485s
TOTAL CARRIER POWER –10.705dBm/3.84MHz
LOWER
UPPER
OFFSET FREQ INTEG BW
dBc
dBm
dBc
dBm
5MHz
3.84MHz
–74.97 –85.68 –75.24 –85.95
10MHz
3.84MHz
–77.99 –88.69 –78.44 –89.14
15MHz
3.84MHz
–78.68 –89.38 –78.94 –89.65
20MHz
3.84MHz
–78.79 –89.50 –78.58 –89.29
25MHz
3.84MHz
–76.81 –87.52 –77.20 –87.91
800
–70
–100
CENTER 877.5MHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
TOTAL CARRIER POWER –10.646dBm/7.68MHz
FILTER
OFF
OFF
OFF
OFF
OFF
11149-027
10dB/DIV
–20
–30
VBW 3kHz
600
Figure 22. W-CDMA NSD vs. fOUT over Temperature
–20
CENTER 877.5MHz
400
fOUT (MHz)
Figure 20. Single-Tone NSD vs. fOUT over Temperature
–120
200
OFFSET FREQ
5MHz
10MHz
15MHz
20MHz
25MHz
INTEG BW
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
LOWER
dBc
dBm
–71.62 –85.23
–74.36 –87.96
–74.35 –87.95
–72.89 –86.50
–67.34 –80.95
UPPER
dBc
dBm
–71.61 –85.22
–74.94 –88.55
–74.91 –88.52
–74.53 –88.14
–73.68 –87.29
FILTER
OFF
OFF
OFF
OFF
OFF
Figure 23. Two-Carrier W-CDMA at 877.5 MHz
Figure 21. Single-Carrier W-CDMA at 877.5 MHz
Rev. B | Page 15 of 66
11149-028
200
11149-025
0
11149-026
–170
–170
AD9119/AD9129
Data Sheet
AC (Mix-Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 0dBm ATTEN: 20dB
5
–10
–5
–20
–15
–30
–25
10dB/DIV
–40
–50
REF 5dBm ATTEN: 20dB
–35
–45
–60
–55
–70
–65
–80
–75
–85
START 20MHz
RES BW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
VBW 20kHz
11149-029
–90
–100
–95
START 20MHz
RES BW 20kHz
Figure 24. Single Tone Spectrum at fOUT = 2350 MHz
–40
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
VBW 20kHz
11149-030
10dB/DIV
0
Figure 27. Single-Tone Spectrum at fOUT = 1600 MHz
–50
1600MSPS
2200MSPS
2800MSPS
1600MSPS
2200MSPS
2800MSPS
–55
–50
–60
IMD (dBc)
SFDR (dBc)
–60
–70
–65
–70
–75
–80
1500
2000
2500
3000
fOUT (MHz)
–85
500
2000
2500
3000
3500
4000
Figure 28. IMD vs. fOUT over fDAC
–145
–150
–150
NSD (dBm/Hz)
–145
–155
–160
–155
–160
–165
–165
1500
2000
2500
3500
3500
fOUT (MHz)
4000
4500
11149-033
NSD (dBm/Hz)
1500
fOUT (MHz)
Figure 25. SFDR vs. fOUT over fDAC
–170
1000
1000
11149-032
1000
11149-031
–90
500
11149-034
–80
–170
1500
2000
2500
3000
fOUT (MHz)
Figure 29. W-CDMA NSD vs. fOUT
Figure 26. Single-Tone NSD vs. fOUT
Rev. B | Page 16 of 66
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–25
–35
–40
–45
–50
–50
–55
–60
–60
–65
–65
–70
1000
1500
2000
2500
3000
3500
4000
fOUT (MHz)
–70
1000
2500
4000
4000
–55
–65
–60
–65
–70
–70
–75
–75
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
1500
3500
–50
–16dBFS
–12dBFS
–6dBFS
0dBFS
–60
–80
1000
3500
–45
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
2000
2500
3000
3500
fOUT (MHz)
4000
11149-036
IMD (dBc)
–55
2000
Figure 32. SFDR vs. fOUT over DAC IOUTFS
IMD (dBc)
–50
1500
fOUT (MHz)
Figure 30. SFDR vs. fOUT over Digital Full Scale
–45
11mA
22mA
33mA
–45
–55
11149-035
SFDR (dBc)
–40
–16dBFS
–12dBFS
–6dBFS
0dBFS
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
11149-039
–35
–30
SFDR (dBc)
–30
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
11149-040
–25
Figure 31. IMD vs. fOUT over Digital Full Scale
–80
1000
1500
2000
11mA
22mA
33mA
2500
3000
3500
fOUT (MHz)
Figure 33. IMD vs. fOUT over DAC IOUTFS
Rev. B | Page 17 of 66
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–145
–145
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
–150
NSD (dBm/Hz)
NSD (dBm/Hz)
–150
–155
–160
–155
–160
–165
1500
2000
2500
3500
3500
4000
fOUT (MHz)
1500
11149-043
–170
1000
2500
3000
3500
3500
fOUT (MHz)
Figure 36. W-CDMA NSD vs. fOUT over Temperature
Figure 34. Single-Tone NSD vs. fOUT over Temperature
–20
–30
–30
–40
–40
–50
–50
–60
–60
10dB/DIV
–20
–70
–70
–80
–80
–90
–90
–100
–100
–110
–110
–120
–120
VBW 3kHz
SPAN 53.84MHz
SWEEP 1.485s
CENTER 1.98GHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
TOTAL CARRIER POWER –10.251dBm/15.36MHz
FILTER
OFF
OFF
OFF
OFF
OFF
Figure 35. Single-Carrier W-CDMA at 1887.5 MHz
OFFSET FREQ
5MHz
10MHz
15MHz
20MHz
INTEG BW
3.84MHz
3.84MHz
3.84MHz
3.84MHz
LOWER
dBc
dBm
–65.84 –82.06
–67.02 –83.23
–68.05 –84.27
–69.07 –85.29
UPPER
dBc
dBm
–65.79 –82.01
–66.75 –82.97
–67.99 –84.21
–69.03 –85.25
FILTER
OFF
OFF
OFF
OFF
Figure 37. Four-Carrier W-CDMA at 1980 MHz
Rev. B | Page 18 of 66
11149-046
CENTER 1.888GHz
TOTAL CARRIER POWER –10.125dBm/3.84MHz
LOWER
UPPER
OFFSET FREQ INTEG BW
dBc
dBm
dBc
dBm
5MHz
3.84MHz
–70.25 –80.37 –70.38 –80.50
10MHz
3.84MHz
–74.47 –84.60 –74.54 –84.66
15MHz
3.84MHz
–75.55 –85.68 –75.72 –85.85
20MHz
3.84MHz
–76.03 –86.15 –76.25 –86.37
25MHz
3.84MHz
–76.62 –86.75 –76.70 –86.83
11149-045
10dB/DIV
2000
11149-044
–165
Data Sheet
AD9119/AD9129
DOCSIS Performance (Normal Mode)
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF –20dBm
–20
REF –20dBm
1
–30
–30
–40
–40
–50
–50
–60
–60
10dB/DIV
10dB/DIV
1
–70
–80
–90
–70
–80
–90
–100
–100
–110
–110
–120
–120
TRC
1
1
1
SCL
f
f
f
X
70MHz
(Δ) 70MHz
(Δ) 140MHz
VBW 2kHz
Y
–3.819dBm
(Δ) –74.107dB
(Δ) –74.148dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–3.819dBm
(Δ) –74.24dB
(Δ) –74.17dB
START 0Hz
RES BW 20kHz
11149-049
START 0Hz
RES BW 20kHz
MODE
N
Δ1
Δ1
MODE
N
Δ1
Δ1
TRC
1
1
1
REF –20dBm
–20
X
950MHz
(Δ) –68MHz
(Δ) –882MHz
Y
–6.351dBm
(Δ) –66.696dB
(Δ) –70.598dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–6.349dBm
(Δ) –66.696dB
(Δ) –70.598dB
REF –20dBm
–30
1
1
–40
–40
–50
–50
–60
–60
10dB/DIV
10dB/DIV
–30
SCL
f
f
f
VBW 2kHz
Figure 41. Single Carrier at 950 MHz Output
Figure 38. Single Carrier at 70 MHz Output
–20
2Δ1
3Δ1
2Δ1 3Δ1
11149-052
–20
–70
–80
–70
–80
–90
–90
2Δ1
2Δ1
–100
–100
3Δ1
–110
–110
–120
TRC
1
1
1
SCL
f
f
f
X
79MHz
(Δ) 61MHz
(Δ) 131MHz
VBW 2kHz
Y
–12.143dBm
(Δ) –70.38dB
(Δ) –67.78dB
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–12.142dBm
(Δ) –70.351dB
(Δ) –67.775dB
11149-050
START 0Hz
RES BW 20kHz
MODE
N
Δ1
Δ1
TRC
1
1
1
Figure 39. Four Carrier at 70 MHz Output
–20
SCL
X
f
959MHz
f
(Δ) –77MHz
f
(Δ) –891MHz
VBW 2kHz
Y
–14.282dBm
(Δ) –64.535dB
(Δ) –68.529dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–14.264dBm
(Δ) –64.535dB
(Δ) –68.597dB
11149-053
–120
MODE
N
Δ1
Δ1
3Δ1
Figure 42. Four Carrier at 950 MHz Output
REF –20dBm
–20
REF –20dBm
1
–30
–30
–40
–40
–50
–50
–60
–60
10dB/DIV
–70
–80
–90
–70
–80
–90
3Δ1
–100
–110
–110
–120
–120
START 0Hz
RES BW 20kHz
MODE
N
Δ1
Δ1
TRC
1
1
1
SCL
X
f
91MHz
f
(Δ) 49MHz
f
(Δ) 117.9MHz
VBW 20kHz
Y
–15.295dBm
(Δ) –66.768dB
(Δ) –66.821dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
FUNCTION
WIDTH
BAND POWER
6MHz
BAND POWER
6MHz
BAND POWER
6MHz
FUNCTION
VALUE
–15.294dBm
(Δ) –66.669dB
(Δ) –66.833dB
2Δ1
3Δ1
START 0Hz
RES BW 20kHz
MODE
N
Δ1
Δ1
Figure 40. Eight Carrier at 70 MHz Output
TRC
1
1
1
SCL
f
f
f
X
971MHz
(Δ) –89MHz
(Δ) –903MHz
VBW 2kHz
Y
–14.632dBm
(Δ) –62.657dB
(Δ) –66.131dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–18.397dBm
(Δ) –62.657dB
(Δ) –66.195dB
Figure 43. Eight Carrier at 950 MHz Output
Rev. B | Page 19 of 66
11149-054
2Δ1
–100
11149-051
10dB/DIV
1
AD9119/AD9129
Data Sheet
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–40
IN-BAND THIRD HARMONIC (dBc)
–60
–70
–80
–90
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
Figure 44. Second Harmonic vs. fOUT Performance for One DOCSIS Carrier
–80
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
Figure 47. Third Harmonic vs. fOUT Performance for One DOCSIS Carrier
–40
IN-BAND THIRD HARMONIC (dBc)
–50
–60
–70
–80
–90
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
Figure 45. Second Harmonic vs. fOUT Performance for Four DOCSIS Carriers
–60
–70
–80
–90
11149-056
0
–50
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
11149-059
IN-BAND SECOND HARMONIC (dBc)
–70
0
–40
Figure 48. Third Harmonic vs. fOUT Performance for Four DOCSIS Carriers
–40
IN-BAND THIRD HARMONIC (dBc)
–40
IN-BAND SECOND HARMONIC (dBc)
–60
–90
11149-055
0
–50
11149-058
–50
–50
–60
–70
–80
–50
–60
–70
–80
–90
–90
0.2
0.4
0.6
fOUT (GHz)
0.8
1.0
0
11149-057
0
Figure 46. Second Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
0.2
0.4
0.6
fOUT (GHz)
0.8
1.0
11149-060
IN-BAND SECOND HARMONIC (dBc)
–40
Figure 49. Third Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
Rev. B | Page 20 of 66
Data Sheet
AD9119/AD9129
–50
–50
–55
–55
–60
–60
–65
–65
ACPR (dBc)
–70
–75
ACP1
ACP2
ACP3
ACP4
ACP5
–70
–75
–80
–80
ACP1
ACP2
ACP3
ACP4
ACP5
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
–90
0
0.2
–65
–65
ACPR (dBc)
ACPR (dBc)
–55
–60
–70
–75
–70
–75
–80
–80
–85
–85
–90
0.1
0.4
0.6
0.8
1.0
fOUT (GHz)
11149-168
–90
0.2
–20
0.3
0.4
0.5
0.6
0.7
0.8
0.9
REF –20dBm
–30
–40
–60
–50
10dB/DIV
–65
–70
–75
–60
–70
–80
–90
–80
–100
–85
–110
–90
0
0.2
0.4
0.6
0.8
fOUT (GHz)
1.0
11149-169
ACPR (dBc)
0.2
Figure 54. 32-Carrier ACPR vs. fOUT
ACP1
ACP2
ACP3
ACP4
ACP5
–55
ACP1
ACP2
ACP3
ACP4
ACP5
fOUT (MHz)
Figure 51. Four-Carrier ACPR vs. fOUT
–50
1.0
–50
–60
0
0.8
Figure 53. 16-Carrier ACPR vs. fOUT
ACP1
ACP2
ACP3
ACP4
ACP5
–55
0.6
fOUT (GHz)
Figure 50. Single-Carrier ACPR vs. fOUT
–50
0.4
11149-170
0
11149-171
–90
–85
11149-167
–85
Figure 52. Eight-Carrier ACPR vs. fOUT
–120
CENTER 77MHz
RES BW 10kHz
VBW 1kHz
SPAN 60MHz
SWEEP 6.08s (1001 pts)
Figure 55. Gap Channel ACPR at 77 MHz
Rev. B | Page 21 of 66
11149-172
ACPR (dBc)
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
AD9119/AD9129
Data Sheet
AD9129
Static Linearity
IOUTFS = 28 mA, nominal supplies, TA = 25°C, unless otherwise noted.
1.0
2.0
1.5
0.5
DNL (LSB)
INL (LSB)
1.0
0.5
0
0
–0.5
–0.5
–1.0
0
2000
4000
6000
8000 10000 12000 14000 16000
CODE
–1.5
11149-065
–1.5
0
2000
4000
6000
8000
10000 12000 14000 16000
CODE
Figure 56. Typical INL, 11 mA at 25°C
11149-068
–1.0
Figure 59. Typical DNL, 11 mA at 25°C
1.0
2.0
1.5
0.5
DNL (LSB)
INL (LSB)
1.0
0.5
0
0
–0.5
–0.5
–1.0
0
2000
4000
6000
8000 10000 12000 14000 16000
CODE
–1.5
11149-066
–1.5
0
2000
4000
6000
8000
10000 12000 14000 16000
CODE
Figure 57. Typical INL, 22 mA at 25°C
11149-069
–1.0
Figure 60. Typical DNL, 22 mA at 25°C
2.0
1.0
1.5
0.5
DNL (LSB)
0.5
0
0
–0.5
–0.5
–1.0
–1.5
0
2000
4000
6000
8000
10000 12000 14000 16000
CODE
–1.5
0
2000
4000
6000
8000
10000 12000 14000 16000
CODE
Figure 58. Typical INL, 33 mA at 25°C
Figure 61. Typical DNL, 33 mA at 25°C
Rev. B | Page 22 of 66
11149-070
–1.0
11149-067
INL (LSB)
1.0
Data Sheet
AD9119/AD9129
AC (Normal Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 5dBm
ATTEN: 24dB
5
–5
–5
–15
–15
–25
–25
–35
–35
10dB/DIV
–45
–55
ATTEN: 24dB
–45
–55
–65
–65
–75
–75
–85
START 20MHz
RES BW 20kHz
VBW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
11149-071
–85
–95
–95
START 20MHz
RES BW 20kHz
Figure 62. Single-Tone Spectrum at fOUT = 70 MHz
VBW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
Figure 65. Single-Tone Spectrum at fOUT = 1000 MHz
–40
0
1400MSPS
1600MSPS
2200MSPS
2600MSPS
2800MSPS
–10
–20
1600MSPS
2200MSPS
2600MSPS
2800MSPS
–50
–60
IMD (dBc)
–30
SFDR (dBc)
REF 5dBm
11149-072
10dB/DIV
5
–40
–50
–70
–80
–60
–70
–90
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
–100
11149-073
–90
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
Figure 63. SFDR vs. fOUT over fDAC
11149-074
–80
Figure 66. IMD vs. fOUT over fDAC
–150
–145
1600MSPS
2200MSPS
2800MSPS
1600MSPS
2200MSPS
2800MSPS
–150
NSD (dBm/Hz)
–155
–160
–160
–165
–170
0
200
400
600
800
1000
fOUT (MHz)
1200
1400
Figure 64. Single-Tone NSD vs. fOUT
–170
0
200
400
600
800
fOUT (MHz)
Figure 67. W-CDMA NSD vs. fOUT
Rev. B | Page 23 of 66
1000
1200
11149-076
–165
11149-075
NSD (dBm/Hz)
–155
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–40
–45
–16dBFS
–12dBFS
–6dBFS
0dBFS
–50
–16dBFS
–12dBFS
–6dBFS
0dBFS
–50
–55
IMD (dBc)
SFDR (dBc)
–60
–60
–65
–70
–80
–70
–90
–100
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
11149-077
0
800
1000
1200
–16dBFS
–12dBFS
–6dBFS
0dBFS
–50
1400
Figure 71. IMD vs. fOUT over Digital Full Scale
11mA
22mA
33mA
–40
–50
–70
–60
–80
–70
–90
–80
–90
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
0
200
400
600
800
1000
1200
1400
11149-081
SFDR (dBc)
–60
11149-078
IN-BAND SECOND HARMONIC (dBc)
600
–30
–40
1400
fOUT (MHz)
Figure 72. SFDR vs. fOUT over DAC IOUTFS
Figure 69. SFDR for Second Harmonic vs. fOUT over Digital Full Scale
–55
–40
–16dBFS
–12dBFS
–6dBFS
0dBFS
–50
11mA
22mA
33mA
–60
–65
IMD (dBc)
–60
–70
–80
–70
–75
–80
–90
–85
–90
–100
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
11149-079
IN-BAND THIRD HARMONIC (dBc)
400
fOUT (MHz)
Figure 68. SFDR vs. fOUT over Digital Full Scale
–100
200
11149-082
–80
11149-080
–75
0
200
400
600
800
1000
fOUT (MHz)
Figure 73. IMD vs. fOUT over DAC IOUTFS
Figure 70. SFDR for Third Harmonic vs. fOUT over Digital Full Scale
Rev. B | Page 24 of 66
1200
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–50
–150
–40°C
+25°C
+85°C
–55
–40°C
+25°C
+85°C
–155
NSD (dBm/Hz)
SFDR (dBc)
–60
–65
–160
–70
–165
0
200
400
600
800
1000
1200
1400
fOUT (MHz)
–170
11149-083
0
1000
1200
–40°C
+25°C
+85°C
–150
NSD (dBm/Hz)
–70
–75
–155
–160
–165
200
400
600
800
1000
1200
1400
fOUT (MHz)
–170
11149-084
0
0
–30
–30
–40
–40
–50
–50
–60
–60
10dB/DIV
–20
–70
–80
–100
–100
–110
–110
–120
SPAN 53.84MHz
SWEEP 1.485s
dBm
–87.08
–91.39
–92.16
–92.56
–90.08
dBc
–75.85
–79.88
–81.09
–81.89
–80.89
dBm
–86.64
–90.68
–91.89
–92.68
–91.69
FILTER
OFF
OFF
OFF
OFF
OFF
11149-087
dBc
–76.29
–80.60
–81.37
–81.76
–79.29
1200
1400
CENTER 877.5MHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
TOTAL CARRIER POWER –10.599dBm/7.68MHz
TOTAL CARRIER POWER –10.794dBm/3.84MHz
INTEG BW
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
1000
–80
–90
OFFSET FREQ
5MHz
10MHz
15MHz
20MHz
25MHz
800
–70
–90
VBW 3kHz
600
Figure 78. Single-Tone NSD vs. fOUT over Temperature
–20
CENTER 877.5MHz
400
fOUT (MHz)
Figure 75. IMD vs. fOUT over Temperature
–120
200
11149-085
IMD (dBc)
800
–145
–40°C
+25°C
+85°C
–80
10dB/DIV
600
Figure 77. W-CDMA NSD vs. fOUT over Temperature
–65
–85
400
fOUT (MHz)
Figure 74. SFDR vs. fOUT over Temperature
–60
200
Figure 76. Single-Carrier W-CDMA at 877.5 MHz
OFFSET FREQ
5MHz
10MHz
15MHz
20MHz
25MHz
INTEG BW
3.84MHz
3.84MHz
3.84MHz
3.84MHz
3.84MHz
dBc
–72.33
–75.18
–74.76
–72.69
–65.42
dBm
–85.89
–88.74
–88.32
–86.25
–78.99
dBc
–72.37
–75.19
–74.92
–74.60
–73.53
dBm
–85.93
–88.75
–88.48
–88.16
–87.09
FILTER
OFF
OFF
OFF
OFF
OFF
Figure 79. Two-Carrier W-CDMA at 875 MHz
Rev. B | Page 25 of 66
11149-088
–80
11149-086
–75
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–60
–65
–70
–70
ACLR (dBc)
–65
–80
–80
–85
–85
–90
700
750
800
850
900
950
1000
fOUT (MHz)
Figure 80. Single-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
–90
700
–60
–65
–70
–70
ACLR (dBc)
–65
–80
–85
–85
800
850
fOUT (MHz)
900
950
1000
–90
700
11149-090
750
Figure 81. Single-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
850
900
950
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
FIFTH ACLR (dBc)
–75
–80
–90
700
800
Figure 82. Two-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
FIFTH ACLR (dBc)
–75
750
fOUT (MHz)
–60
ACLR (dBc)
–75
750
800
850
fOUT (MHz)
900
950
11149-092
–75
FIRST ACLR (dBc)
SECOND ACLR (dBc)
11149-091
FIRST ACLR (dBc)
SECOND ACLR (dBc)
11149-089
ACLR (dBc)
–60
Figure 83. Two-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
Rev. B | Page 26 of 66
Data Sheet
AD9119/AD9129
AC (Mix-Mode)
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF 0dBm ATTEN: 20dB
–5
–20
–15
–30
–25
–40
–35
–50
–60
–45
–55
–70
–65
–80
–75
–90
–85
–100
VBW 20kHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
ATTEN: 20dB
–95
START 20MHz
RES BW 20kHz
Figure 84. Single-Tone Spectrum at fOUT = 2350 MHz
STOP 2.6GHz
SWEEP 7.78s (1001 pts)
VBW 20kHz
11149-094
10dB/DIV
–10
START 20MHz
RES BW 20kHz
REF 5dBm
5
11149-093
10dB/DIV
0
Figure 87. Single-Tone Spectrum at fOUT = 1600 MHz
–50
–40
–55
–50
–60
IMD (dBc)
SFDR (dBc)
–60
–70
–65
–70
–75
–80
1000
1500
2000
fOUT (MHz)
2500
3000
–85
500
11149-095
2000
2500
3000
3500
4000
Figure 88. IMD vs. fOUT over fDAC
–145
–145
–150
–150
NSD (dBm/Hz)
–155
–160
–165
–155
–160
–165
1500
2000
2500
3000
3500
fOUT (MHz)
4000
4500
11149-097
NSD (dBm/Hz)
1500
fOUT (MHz)
Figure 85. SFDR vs. fOUT over fDAC
–170
1000
1000
Figure 86. Single-Tone NSD vs. fOUT
–170
1500
2000
2500
3000
fOUT (MHz)
Figure 89. W-CDMA NSD vs. fOUT
Rev. B | Page 27 of 66
11149-098
–90
500
1600MSPS
2200MSPS
2800MSPS
11149-096
–80
1600MSPS
2200MSPS
2800MSPS
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–25
–20
–45
–50
–40
–50
–55
–60
–60
–70
–65
–80
–70
1000
1500
2000
2500
3000
3500
4000
fOUT (MHz)
–90
1000
2500
3000
3500
4000
–30
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
–40
–16dBFS
–12dBFS
–6dBFS
0dBFS
11mA
22mA
33mA
–50
IMD (dBc)
–60
–65
–60
–70
–70
–80
1000
1500
2000
2500
3000
3500
fOUT (MHz)
4000
–90
1000
1500
2000
2500
3000
3500
fOUT (MHz)
Figure 93. IMD vs. fOUT over DAC IOUTFS
Figure 91. IMD vs. fOUT over Digital Full Scale
Rev. B | Page 28 of 66
4000
11149-193
–80
–75
11149-100
IMD (dBc)
2000
Figure 92. SFDR vs. fOUT over DAC IOUTFS
–45
–55
1500
fOUT (MHz)
Figure 90. SFDR vs. fOUT over Digital Full Scale
–50
11mA
22mA
33mA
–30
11149-099
SFDR (dBc)
–40
–16dBFS
–12dBFS
–6dBFS
0dBFS
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
11149-101
–35
–10
SFDR (dBc)
–30
0
SECOND NYQUIST ZONE
THIRD NYQUIST ZONE
Data Sheet
AD9119/AD9129
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–145
–145
–40°C
+25°C
+85°C
–40°C
+25°C
+85°C
–150
NSD (dBm/Hz)
NSD (dBm/Hz)
–150
–155
–155
–160
–160
2000
2500
3000
3500
4000
fOUT (MHz)
–165
1500
–40
–50
–50
–60
–60
10dB/DIV
–30
–40
–70
–80
–80
–90
–100
–100
–110
–110
–120
SPAN 53.84MHz
SWEEP 1.485s
TOTAL CARRIER POWER –9.445dBm/3.84MHz
LOWER
UPPER
OFFSET FREQ INTEG BW
dBc
dBm
dBc
dBm
5MHz
3.84MHz
–73.71 –83.15 –74.00 –83.45
10MHz
3.84MHz
–77.40 –86.84 –77.31 –86.75
15MHz
3.84MHz
–78.04 –87.48 –77.85 –87.30
20MHz
3.84MHz
–78.13 –87.57 –78.51 –87.96
25MHz
3.84MHz
–78.01 –87.46 –78.43 –87.87
3500
–70
–90
CENTER 1.98GHz
VBW 3kHz
SPAN 58.84MHz
SWEEP 1.623s
TOTAL CARRIER POWER –10.211dBm/15.36MHz
FILTER
OFF
OFF
OFF
OFF
OFF
OFFSET FREQ
5MHz
10MHz
15MHz
20MHz
11149-107
10dB/DIV
–20
–30
VBW 3kHz
3000
Figure 96. W-CDMA NSD vs. fOUT over Temperature
–20
CENTER 1.888GHz
2500
fOUT (MHz)
Figure 94. Single-Tone NSD vs. fOUT over Temperature
–120
2000
11149-106
1500
Figure 95. Single-Carrier W-CDMA at 1887.5 MHz
INTEG BW
3.84MHz
3.84MHz
3.84MHz
3.84MHz
LOWER
dBc
dBm
–69.05 –85.24
–69.86 –86.05
–70.81 –87.00
–71.03 –87.22
UPPER
dBc
dBm
–69.03 –85.22
–69.71 –85.90
–70.52 –86.71
–70.91 –87.10
FILTER
OFF
OFF
OFF
OFF
Figure 97. Four-Carrier W-CDMA at 1980 MHz
Rev. B | Page 29 of 66
11149-108
–170
1000
11149-105
–165
AD9119/AD9129
Data Sheet
IOUTFS = 28 mA, fDAC = 2.6 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–50
FIRST ACLR (dBc)
SECOND ACLR (dBc)
–55
–60
–60
–65
–65
–70
–75
–75
–80
–85
–85
1.8
2.0
2.2
2.4
2.6
Figure 98. Single-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
–50
–55
–90
1.4
2.2
2.4
2.6
–50
–55
–65
–65
ACLR (dBc)
–60
–70
–75
–75
–80
–85
–85
fOUT (GHz)
2.2
2.4
2.6
–90
1.4
11149-110
2.0
Figure 99. Single-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
FIFTH ACLR (dBc)
–70
–80
1.8
2.0
Figure 100. Four-Carrier W-CDMA ACLR vs. fOUT (First ACLR, Second ACLR)
THIRD ACLR (dBc)
FOURTH ACLR (dBc)
FIFTH ACLR (dBc)
1.6
1.8
fOUT (GHz)
–60
–90
1.4
1.6
1.6
1.8
2.0
fOUT (GHz)
2.2
2.4
2.6
11149-112
1.6
fOUT (GHz)
ACLR (dBc)
–70
–80
–90
1.4
FIRST ACLR (dBc)
SECOND ACLR (dBc)
11149-111
ACLR (dBc)
–55
11149-109
ACLR (dBc)
–50
Figure 101. Four-Carrier W-CDMA ACLR vs. fOUT (Third ACLR, Fourth ACLR,
Fifth ACLR)
Rev. B | Page 30 of 66
Data Sheet
AD9119/AD9129
DOCSIS Performance (Normal Mode)
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
REF –20dBm
–20
1
–30
–40
–40
–50
–50
–60
–60
–70
–80
–70
–80
–90
–90
2Δ1
2Δ1
3Δ1
3Δ1
–100
–100
–110
–110
–120
TRC
1
1
1
SCL
f
f (Δ)
f (Δ)
X
70MHz
(Δ) 70MHz
(Δ) 140MHz
VBW 20kHz
Y
–3.611dBm
(Δ) –72.929dB
(Δ) –74.629dB
START 0Hz
RES BW 20kHz
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–3.612dBm
(Δ) –72.903dB
(Δ) –74.583dB
MODE
N
Δ1
Δ1
11149-113
START 0Hz
RES BW 20kHz
TRC
1
1
1
Y
–6.221dBm
(Δ) –68.115dB
(Δ) –71.783dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–6.223dBm
(Δ) –68.115dB
(Δ) –71.783dB
Figure 105. Single Carrier at 950 MHz Output
Figure 102. Single Carrier at 70 MHz Output
REF –20dBm
–20
–30
REF –20dBm
–30
1
–40
–50
–50
–60
–60
10dB/DIV
10dB/DIV
1
–40
–70
–80
–90
3Δ1
2Δ1
–100
–110
3Δ1
–110
START 0Hz
RES BW 20kHz
TRC
1
1
1
SCL
f
f (Δ)
f (Δ)
X
79MHz
(Δ) 61MHz
(Δ) 131MHz
VBW 20kHz
Y
–11.506dBm
(Δ) –71.473dB
(Δ) –69.109dB
–120
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
FUNCTION
WIDTH
BAND POWER
6MHz
BAND POWER
6MHz
BAND POWER
6MHz
FUNCTION
VALUE
–11.506dBm
(Δ) –71.606dB
(Δ) –69.155dB
11149-114
MODE
N
Δ1
Δ1
–80
–90
2Δ1
–100
–120
–70
MODE
N
Δ1
Δ1
START 0Hz
RES BW 20kHz
TRC
1
1
1
Figure 103. Four Carrier at 70 MHz Output
–20
Y
–14.583dBm
(Δ) –65.064dB
(Δ) –71.759dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–14.584dBm
(Δ) –65.064dB
(Δ) –71.759dB
Figure 106. Four Carrier at 950 MHz Output
REF –20dBm
–30
SCL
X
f
959MHz
f
(Δ) –77MHz
f
(Δ) –891MHz
VBW 2kHz
11149-117
–20
SCL
X
f
950MHz
f
(Δ) –68MHz
f
(Δ) –882MHz
VBW 2kHz
11149-211
–120
MODE
N
Δ1
Δ1
REF –20dBm
1
–30
10dB/DIV
10dB/DIV
–20
–20
REF –20dBm
–30
1
–50
–50
–60
–60
10dB/DIV
–40
–70
–80
–90
–70
–80
–90
2Δ1
–100
3Δ1
2Δ1
–100
3Δ1
–110
–120
–120
START 0Hz
RES BW 20kHz
MODE
N
Δ1
Δ1
TRC
1
1
1
SCL
X
f
91MHz
f (Δ)
(Δ) 49MHz
f (Δ) (Δ) 117.9MHz
VBW 20kHz
Y
–15.917dBm
(Δ) –66.430dB
(Δ) –67.401dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–15.919dBm
(Δ) –66.658dB
(Δ) –67.436dB
START 0Hz
RES BW 20kHz
MODE
N
Δ1
Δ1
Figure 104. Eight Carrier at 70 MHz Output
TRC
1
1
1
SCL
X
f
971MHz
f
(Δ) –89MHz
f
(Δ) –903.0MHz
VBW 2kHz
Y
–18.364dBm
(Δ) –63.858dB
(Δ) –70.065dB
STOP 1.1GHz
SWEEP 27.9s (1001 pts)
FUNCTION
BAND POWER
BAND POWER
BAND POWER
FUNCTION
WIDTH
6MHz
6MHz
6MHz
FUNCTION
VALUE
–18.364dBm
(Δ) –63.858dB
(Δ) –70.065dB
Figure 107. Eight Carrier at 950 MHz Output
Rev. B | Page 31 of 66
11149-118
–110
11149-115
10dB/DIV
1
–40
AD9119/AD9129
Data Sheet
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–40
IN-BAND THIRD HARMONIC (dBc)
–50
–60
–70
–80
–70
–80
0.4
0.6
0.8
1.0
fOUT (GHz)
0
Figure 108. Second Harmonic vs. fOUT Performance for One DOCSIS Carrier
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
11149-122
0.2
11149-119
0
Figure 111. Third Harmonic vs. fOUT Performance for One DOCSIS Carrier
–40
–40
IN-BAND THIRD HARMONIC (dBc)
–50
–60
–70
–80
–90
–50
–60
–70
–80
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
11149-120
–90
0
Figure 109. Second Harmonic vs. fOUT Performance for Four DOCSIS Carriers
0
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
11149-123
IN-BAND SECOND HARMONIC (dBc)
–60
–90
–90
Figure 112. Third Harmonic vs. fOUT Performance for Four DOCSIS Carriers
–40
–40
IN-BAND THIRD HARMONIC (dBc)
IN-BAND SECOND HARMONIC (dBc)
–50
–50
–60
–70
–80
–90
–50
–60
–70
–80
0.2
0.4
0.6
fOUT (GHz)
0.8
1.0
11149-121
–90
0
Figure 110. Second Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
0
0.2
0.4
0.6
fOUT (GHz)
0.8
1.0
11149-124
IN-BAND SECOND HARMONIC (dBc)
–40
Figure 113. Third Harmonic vs. fOUT Performance for Eight DOCSIS Carriers
Rev. B | Page 32 of 66
Data Sheet
AD9119/AD9129
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–55
–60
–65
–65
ACPR (dBc)
–60
–70
–75
–70
–75
–80
–80
–85
–85
ACP1
ACP2
ACP3
ACP4
ACP5
–90
–90
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
0
11149-219
0
0.2
–55
–60
–65
–65
ACPR (dBc)
ACPR (dBc)
–50
–60
–70
–75
–75
–80
–85
–85
0.2
0.4
0.6
0.8
1.0
fOUT (GHz)
11149-220
–90
Figure 115. Four-Carrier ACPR vs. fOUT
–55
–60
–65
–70
–75
–80
–90
0
0.2
0.4
0.6
0.8
fOUT (GHz)
1.0
11149-221
ACP1
ACP2
ACP3
ACP4
ACP5
–85
–90
0.1
ACP1
ACP2
ACP3
ACP4
ACP5
0.2
0.3
0.4
0.5
0.6
0.7
fOUT (GHz)
Figure 118. 32-Carrier ACPR vs. fOUT
–50
ACPR (dBc)
–70
–80
0
1.0
Figure 117. 16-Carrier ACPR vs. fOUT
ACP1
ACP2
ACP3
ACP4
ACP5
–55
0.8
fOUT (GHz)
Figure 114. Single-Carrier ACPR vs. fOUT
–50
0.6
0.4
11149-222
–55
ACPR (dBc)
–50
ACP1
ACP2
ACP3
ACP4
ACP5
Figure 116. Eight-Carrier ACPR vs. fOUT
Rev. B | Page 33 of 66
0.8
0.9
11149-223
–50
AD9119/AD9129
Data Sheet
IOUTFS = 33 mA, fDAC = 2.782 GSPS, nominal supplies, TA = 25°C, unless otherwise noted.
–20
–40
REF –20dBm
ACLR IN GAP CHANNEL (dBc)
–30
–40
–60
–70
–80
–90
–100
–60
–70
–80
–110
CENTER 77MHz
RES BW 10kHz
VBW 1kHz
SPAN 60MHz
SWEEP 6.08s (1001 pts)
–90
0
0.2
0.4
0.6
0.8
fOUT (GHz)
Figure 119. Gap Channel ACLR at 77 MHz
Figure 120. Gap Channel ACLR vs. fOUT
Rev. B | Page 34 of 66
1.0
11149-225
–120
11149-125
10dB/DIV
–50
–50
Data Sheet
AD9119/AD9129
TERMINOLOGY
Linearity Error (Integral Nonlinearity or INL)
The maximum deviation of the actual analog output from the
ideal output, determined by a straight line drawn from zero to
full scale.
Spurious-Free Dynamic Range
The difference, in decibels (dB), between the rms amplitude of
the output signal and the peak spurious signal over the specified
bandwidth.
Differential Nonlinearity (DNL)
The measure of the variation in analog value, normalized to full
scale, associated with a 1 LSB change in digital input code.
Total Harmonic Distortion (THD)
The ratio of the rms sum of the first six harmonic components
to the rms value of the measured input signal. It is expressed as
a percentage or in decibels (dB).
Monotonicity
A DAC is monotonic if the output either increases or remains
constant as the digital input increases.
Offset Error
The deviation of the output current from the ideal of zero.
For IOUTP, 0 mA output is expected when the inputs are all 0s.
For IOUTN, 0 mA output is expected when all inputs are set to 1.
Gain Error
The difference between the actual and ideal output span. The
actual span is determined by the output when all inputs are set
to 1 minus the output when all inputs are set to 0.
Output Compliance Range
The range of allowable voltage at the output of a current output
DAC. Operation beyond the maximum compliance limits may
cause either output stage saturation or breakdown, resulting in
nonlinear performance.
Temperature Drift
Specified as the maximum change from the ambient (25°C) value
to the value at either TMIN or TMAX. For offset and gain drift, the
drift is reported in ppm of full-scale range (FSR) per degree
Celsius (°C). For reference drift, the drift is reported in ppm per °C.
Power Supply Rejection
The maximum change in the full-scale output as the supplies
are varied from nominal to minimum and maximum specified
voltages.
Noise Spectral Density (NSD)
The converter noise power per unit of bandwidth. This is
usually specified in dBm/Hz in the presence of a 0 dBm fullscale signal.
Adjacent Channel Leakage Ratio (ACLR)
The ratio, in dBc, between the measured power within a channel
relative to its adjacent channels.
Adjacent Channel Power Ratio (ACPR)
The ratio, in dBc, between the total power of an adjacent channel
(intermodulation signal) to the main channel's power (useful
signal).
Modulation Error Ratio (MER)
A measure of the discrepancy between the average output
symbol magnitude and the rms error magnitude of the individual
symbol. Modulated signals create a discrete set of output values
referred to as a constellation, and each symbol creates an output
signal corresponding to one point on the constellation.
Intermodulation Distortion (IMD)
The result of two or more signals at different frequencies mixing
together. Many products are created according to the formula
aF1 ± bF2, where a and b are integer values.
Rev. B | Page 35 of 66
AD9119/AD9129
Data Sheet
SERIAL COMMUNICATIONS PORT OVERVIEW
The AD9119/AD9129 are 11-bit/14-bit DACs that operate at an
update rate of up to 2.85 GSPS. Due to internal timing
requirements, the minimum allowable sample rate is 1400
MSPS. Input data is sampled through two 11-/14-bit LVDS
ports that are internally multiplexed. Each port has its own data
inputs, but both ports share a common data clock input (DCI).
The LVDS inputs meet the IEEE-1596 specification with the
exception of input hysteresis, which is not guaranteed over all
process corners. Each DCI input runs at one-quarter the input
data rate in a double data rate (DDR) format. Each edge of the
DCI is used to transfer data into the AD9119/AD9129.
AD9129 and the system controller. Phase 2 of the communication
cycle is a transfer of one byte only. Single-byte data transfers are
useful to reduce CPU overhead when register access requires
one byte only. Registers change immediately upon writing to the
last bit of each transfer byte. CS (chip select) can be raised after
each sequence of eight bits (except the last byte) to stall the bus.
The serial transfer resumes when CS is lowered. Stalling on
nonbyte boundaries resets the SPI.
The DACCLK_N and DACCLK_P inputs directly drive the
DAC core to minimize clock jitter. The DACCLK signal is
divided by 4 and then output as the DCO for each port. The
DCO signal can be used to clock the data source. The DAC
expects DDR LVDS data (P0_D[13:0]x, P1_D[13:0]x), with
each channel aligned with the single DDR DCI signal.
MSB
I7
R/W
Control of the AD9119/AD9129 functions is via a SPI.
SERIAL PERIPHERAL INTERFACE (SPI)
The AD9119/AD9129 SPI is a flexible, synchronous serial
communications port, allowing easy interface to many
industry-standard microcontrollers and microprocessors. The
serial I/O is compatible with most synchronous transfer formats,
including the Motorola® SPI and the Intel® SSR protocols. The
interface allows read/write access to all registers that configure
the AD9119/AD9129. Most significant bit first (MSB-first) or
least significant bit first (LSB-first) transfer formats are supported.
The AD9119/AD9129 serial interface port can be configured as
a single I/O pin (SDIO) or two unidirectional pins for input/
output (SDIO and SDO).
SPI PORT
CS (PIN K2)
11149-126
SDIO (PIN J1)
SCLK (PIN K1)
The instruction byte is shown in the following table.
I6
A6
I5
A5
I4
A4
I3
A3
I2
A2
I1
A1
LSB
I0
A0
R/W, Bit 7 of the instruction byte, determines whether a read or
a write data transfer occurs after the instruction byte write.
Logic 1 indicates a read operation. Logic 0 indicates a write
operation, the data transfer cycle. A6 to A0 (Bit 6 through Bit 0
of the instruction byte) determine which register is accessed
during the data transfer portion of the communications cycle.
SERIAL PERIPHERAL INTERFACE PIN
DESCRIPTIONS
SCLK—Serial Clock
The serial clock pin is used to synchronize data to and from the
AD9119/AD9129 and to run the internal state machines. The
maximum frequency of SCLK is 20 MHz. All data input to the
AD9119/AD9129 is registered on the rising edge of SCLK. All
data is driven out of the AD9119/AD9129 on the rising edge
of SCLK.
CS—Chip Select
Active low input starts and gates a communication cycle. It allows
more than one device to be used on the same serial communications lines. The SDO and SDIO pins go to a high impedance
state when this input is high. Chip select should stay low during
the entire communication cycle.
SDO (PIN J2)
AD9119/
AD9129
INSTRUCTION MODE (8-BIT INSTRUCTION)
Figure 121. AD9119/AD9129 SPI Port
SDIO—Serial Data I/O
GENERAL OPERATION OF THE SPI
There are two phases to a communication cycle with the AD9119/
AD9129. Phase 1 is the instruction cycle, which is the writing of
an instruction byte into the AD9119/AD9129, coincident with
the first eight SCLK rising edges. The instruction byte provides
the AD9119/AD9129 serial port controller with information
about the data transfer cycle, which is Phase 2 of the communication cycle. The Phase 1 instruction byte defines whether the
upcoming data transfer is read or write and the starting register
address for the first byte of the data transfer. The first eight SCLK
rising edges of each communication cycle are used to write the
instruction byte into the AD9119/AD9129.
Data is always written into the AD9119/AD9129 on this pin.
However, this pin can be used as a bidirectional data line. The
configuration of this pin is controlled by Register 0x00, Bit 7
(SDIO_DIR). The default is Logic 1, which configures the SDIO
pin as bidirectional.
SDO—Serial Data Out
Data is read from this pin for protocols that use separate lines
for transmitting and receiving data. When the AD9119/AD9129
are operating in a single bidirectional I/O mode, this pin does
not output data and is set to a high impedance state.
The remaining SCLK edges are for Phase 2 of the communication
cycle. Phase 2 is the actual data transfer between the AD9119/
Rev. B | Page 36 of 66
Data Sheet
AD9119/AD9129
MSB/LSB TRANSFERS
INSTRUCTION CYCLE
When LSB/MSB = 1 (LSB first), the instruction and data bytes
must be written from the least significant bit to the most
significant bit.
SDIO
R/W A0
A1 A2
A3
D40 D5N D6N D7N
A5 A6 D00 D10 D20
A4
Figure 124. Serial Register Interface Timing, LSB-First Write
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
CS
SERIAL PORT CONFIGURATION
SCLK
In the event of unexpected programming sequences, the
AD9119/AD9129 SPI can become inaccessible. For example,
if user code inadvertently changes the LSB/MSB bit, the bits that
follow experience unexpected results. The SPI can be returned
to a known state by writing an incomplete byte (1 to 7 bits) of
all 0s, followed by three bytes of 0x00. This returns to the MSBfirst instructions (Register 0x00 = 0x00) so that the device can
be reinitialized.
SDIO
R/W A0
A1
A2
A3
A4
A5
A6
D10 D20
D40 D5N D6N D7N
D10 D20
D40 D5N D6N D7N
SDO
D0
11149-130
D0
Figure 125. Serial Register Interface Timing, LSB-First Read
tDS
tSCLK
CS
SCLK
tDS
SDIO
tDH
INSTRUCTION BIT 7
11149-131
The AD9119/AD9129 serial port configuration is controlled
by Register 0x00, Bits[7:5]. Note that the configuration changes
immediately upon writing to the last bit of the register. When
setting the software reset bit (SoftReset in Register 0x00, Bit 5),
all registers are set to their default values except Register 0x00,
which remains unchanged.
INSTRUCTION CYCLE
SCLK
11149-129
The AD9119/AD9129 serial port can support both MSB-first
and LSB-first data formats. This functionality is controlled by
the LSB/MSB bit, Bit 6 in Register 0x00. The default is MSB first
(LSB/MSB = 0). When the MSB-first data format is selected, the
instruction and data bytes must be written from the most
significant bit to the least significant bit.
DATA TRANSFER CYCLE
CS
INSTRUCTION BIT 6
Figure 126. Timing Diagram for an SPI Register Write
DATA TRANSFER CYCLE
CS
CS
R/W A6 A5 A4 A3
A2 A1 A0 D7N D6N D5N
D30 D20 D10 D00
SCLK
tDNV
Figure 122. Serial Register Interface Timing, MSB-First Write
SDIO I1
INSTRUCTION CYCLE
DATA TRANSFER CYCLE
SCLK
R/W A6 A5
A4
A3
A2 A1 A0
D6N D5N
D30 D20 D10 D00
D6N D5N
D30 D20 D10 D00
D7
Figure 123. Serial Register Interface Timing, MSB-First Read
11149-128
D7
SDO
D7
D6
D5
Figure 127. Timing Diagram for an SPI Register Read
CS
SDIO
I0
tDV
11149-132
SDIO
11149-127
SCLK
After the last instruction bit is written to the SDIO pin, the
driving signal must be set to a high impedance in time for the
bus to turn around. The serial output data from the AD9119/
AD9129 is enabled by the falling edge of SCLK. This causes the
first output data bit to be shorter than the remaining data bits,
as shown in Figure 127. To assure proper reading of data, read
the SDIO pin or the SDO pin before changing SCLK from low
to high. Due to the more complex multibyte protocol, multiple
AD9119/ AD9129 devices cannot be daisy-chained on the SPI bus.
Control multiple DACs by using independent CS signals.
Rev. B | Page 37 of 66
AD9119/AD9129
Data Sheet
THEORY OF OPERATION
The AD9119/AD9129 are 11-bit/14-bit DACs that are capable of
reconstructing signal bandwidths up to 1.425 GHz while
operating with an input data rate up to 2.85 GSPS. Figure 128
shows a top level functional diagram of the AD9119/AD9129.
A high perfor-mance NMOS DAC delivers a signal dependent,
differential current to a balanced external load referenced a
nominal 1.8 V analog supply. The current source array of the
DAC is referenced to an external −1.5 V supply, and its full-scale
current, IOUTFS, can be adjusted over a 9.5 mA to 34.4 mA span.
RESET
I250U VREF
IRQ
AD9129
1.2V
SPI
Tx DAC
CORE
IOUTP
IOUTN
2×
PLL
CLOCK
DISTRIBUTION
DCR
DACCLK_x
11149-133
DCO_x
LVDS DDR
RECEIVER
DCI_x
BASEBAND
MODE
DATA
LATCH
DLL
DATA ASSEMBLER
P0_D[13:0]P,
P0_D[13:0]N
P1_D[13:0]P,
P1_D[13:0]N
MIXNORMAL MODE
LVDS DDR
RECEIVER
FRM_x
(FRAME/
PARITY)
4× FIFO
SDIO
SDO
CS
SCLK
Figure 128. Functional Block Diagram of the AD9119/AD9129
A low jitter differential clock receiver is used to square up the
signal appearing at the DACCLK_x input that sets the update
rate of the DAC. The differential clock receiver can accept
sinusoidal signals with negligible noise spectral density degradation if the input signal level is maintained above 0 dBm.
A +1 dB degradation occurs at a −5 dBm input, and degradation
increases as the signal approaches −10 dBm and its associated
+2 dB additional degradation. A duty cycle restorer (DCR),
following the clock receiver, ensures near 50% duty-cycle to the
subsequent circuitry. The output of the DCR serves as the
master clock and is routed directly to the DAC, as well as to a
clock distribution block that generates all critical internal and
external clocks. The clock source quality, as defined by its phase
noise characteristics, jitter, and drive capability, is an important
consideration in maintaining optimum ac performance.
The AD9119/AD9129 supports a source synchronous, LVDS
double data-rate (DDR) data interface to the host processor.
Two 11-bit/14-bit LVDS data ports (P0_DxP, P0_DxN and
P1_DxP, P1_DxN) are used to sample de-interleaved data from
the host on the rising and falling edge of the host DCI clock.
This effectively reduces the bus interface speed to ½ the data
rate (for example, fDATA/2) with the DCI clock operating at fDATA/4.
An optional parity bit can also be sent along with the data to
enhance the robustness of the interface. In this case, a counter
is available to count parity errors and generate an interrupt
request (IRQ) when a programmable threshold is exceeded.
The AD9119/AD9129 provide the host with a DCO clock that is
equal to the DCI clock frequency to establish synchronous operation. A delay locked loop (DLL) with programmable phase offset
is used to generate an internal sampling clock with optimum edge
placement for the input data latches of the LVDS DDR receivers.
When data is latched into the AD9119/AD9129, an eight-sampledeep FIFO is used to hand off the data between the host and the
AD9119/AD9129 clock domains. The FIFO can be reset with an
external synchronization signal, fSYNC, to ensure consistent pipeline
latency. The pipeline delay, from a sample being latched into the
data port to when it appears at the DAC output, varies depending
on the chosen configuration (see the Pipeline Delay (Latency)
section).
The de-interleaved data is reassembled into its original data stream
after passing into the internal clock domain of the AD9119/
AD9129. Because the quad-switch architecture of the DAC
updates its output on both the rising and falling edge (for example,
dual edge clocking) of the DACCLK signal, the following two
additional modes of operation are available:
•
•
A 2× interpolation filter can be selected to increase the
effective DAC update rate (fDAC) to be 2× the input data
rate, hence simplifying the analog postfiltering requirements and reducing the effects of alias harmonics in the
desired baseband region.
A Mix-Mode option essentially generates the complement
sample on the falling edge such that the original Nyquist
spectrum is shifted to fDACCLK, with the sinc null of the DAC
falling at 2 × fDACCLK.
The digital handoff between the digital domain and mixed signal
domain of a high speed DAC is critical in preserving its output
dynamic range. A phase locked loop (PLL) with programmable
phase offset is used to optimize the timing handoff between these
two clock domains. State machines are used to initialize both the
DLL and the PLL during the initial boot sequence after receiving
a stable DACCLK signal. Following initialization of the two loops,
they maintain optimum timing alignment over temperature, time,
and power supply variation. The AD9119/AD9129 also provide
IRQ capability to monitor the DLL, the PLL, and other internal
circuitry.
Rev. B | Page 38 of 66
Data Sheet
AD9119/AD9129
LVDS DATA PORT INTERFACE
The data timing requirements are defined by a minimum data
valid margin that is dependent on the data clock input skew,
input data jitter, and the variations of the DLL delay line across
delay settings. This margin is defined by subtracting from the
data period any data skew, data jitter, and the keep-out window
(KOW) that is defined by the sum of the set and hold times, as
follows:
The AD9119/AD9129 can operate with input data rates of up to
2.85 GSPS. A source synchronous LVDS interface is used
between the host and the AD9119/AD9129 to achieve these high
data rates, while simplifying the interface. As shown in Figure
129, the host feeds the AD9119/AD9129 with de-interleaved
input data into two 11-bit/14-bit LVDS data ports (P0_DxP,
P0_DxN and P1_DxP, P1_DxN) at ½ the DAC clock rate (that
is, fDACCLK/2). Along with the input data, the host provides an
embedded DDR data clock input (DCI_x) at fDACCLK/4.
tDATA VALID MARGIN = tDATA PERIOD − tDATA SKEW − tDATA JITTER − (tH + tS)
The keep-out window, which is the sum of the set and hold times,
is the area where data transitions should not occur. The timing
margin allows tuning of the DLL delay setting, either automatically
or in manual mode (see Figure 130).
A DLL circuit that is designed to operate with DCI clock rates
of between 350 MHz and 712.5 MHz is used to generate a phase
shifted version of DCI, called the data sampling clock (DSC),
to register the input data on both the rising and falling edges.
Figure 130 shows that the ideal location for the DSC signal is 90°
out of phase from the DCI input. However, due to skew of the DCI
relative to the data, it may be necessary to change the DSC phase
offset to sample the data at the center of its eye diagram. The
sampling instance can be varied in discrete increments by offsetting
the nominal DLL phase shift value of 90° via Register 0x0A,
Bits[3:0]. The following equation defines the phase offset
relationship:
As shown in Figure 130, the DCI clock edges must be coincident
with the data bit transitions with minimum skew and jitter. The
nominal sampling point of the input data occurs in the middle
of the DCI clock edges because this point corresponds to the
center of the data eye. This is also equivalent to a nominal phase
shift of 90°of the DCI clock.
Phase Offset = 90° ± n × 11.25°, |n| < 8
AD9129
LVDS DDR
RECEIVER
DELAY
LOCK
LOOP
fDATA = fDACCLK /2
1×2
fDCI = fDACCLK /4
DCI
1×2
DCO
fDCO = fDACCLK /4
CLOCK
DISTRIBUTION
fDACCLK
11149-134
ODD DATA
SAMPLES
14 × 2
LVDS DDR
RECEIVER
LVDS DDR DRIVER
DATA DE-INTERLEAVER
EVEN DATA
SAMPLES
14 × 2
P0_D[13:0]x
OPTIONAL PARITY
P1_D[13:0]x
HOST
PROCESSOR
COMBINED
ODD/EVEN
PARITY BIT
Figure 129. Recommended Digital Interface Between the AD9119/AD9129 and the Host Processor
tDATA SKEW
INPUT DATA[13:0]
DLL PHASE
DELAY
tDSC SETUP AND HOLD
tDATA JITTER
DATA EYE
tDATA PERIOD
11149-135
DCI
DATA SAMPLE CLOCK
Figure 130. LVDS Data Port Timing Requirements
Rev. B | Page 39 of 66
AD9119/AD9129
Data Sheet
Figure 131 shows the DSC set and hold times with respect to
the DCI signal and data signals.
DATA
DCI
Table 10 lists the values that are guaranteed over the operating
conditions. These values were taken with 50% duty cycle and
DCI swing of 450 mV p-p. For best performance, the duty cycle
variation should be kept below ±5%, and the DCI input should
be as high as possible, up to 800 mV p-p.
Table 10. Data Port Set and Hold Time Window (Guaranteed)
11149-238
DSC
tS
tH
Figure 131. LVDS Data Port Set and Hold Times
Table 11 shows the typical times for various DAC clock frequencies
that are required to calculate the data valid margin. The amount
of margin that is available for tuning of the DSC sampling point
can be determined using Table 11.
Frequency,
fDAC (MHz)
1600
2300
2800
Time (ps)
tS
tH
tS
tH
tS
tH
Data Port Set and Hold Times (ps)
at DLL Phase
−3
0
+3
−272
−489
−683
682
911
1120
−168
−292
−420
564
705
839
−88
−185
−285
457
559
652
Table 11. Data Port Set and Hold Time Window (Typical)
Frequency,
fDAC 1 (MHz)
1400
1500
1600
1700
1800
1900
2000
2100
2200
2300
2400
2500
2600
2700
2800
1
Time
(ps)
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
tS
tH
−6
−106
426
−124
427
−120
421
−111
382
−93
400
−90
398
−82
389
−87
370
−94
415
−93
390
−130
426
−73
370
−43
338
−54
316
−36
335
−5
−205
499
−197
490
−191
485
−184
429
−133
442
−139
443
−122
423
−133
409
−143
453
−131
422
−156
459
−106
407
−76
369
−77
340
−72
355
−4
−274
571
−291
556
−252
550
−226
489
−209
492
−182
488
−170
468
−161
451
−182
487
−182
456
−196
494
−142
433
−115
396
−108
372
−101
379
−3
−353
651
−351
637
−335
619
−301
549
−265
555
−254
535
−220
522
−206
491
−245
523
−227
500
−244
529
−177
467
−145
430
−144
406
−143
404
Data Port Set and Hold Times (ps) at DLL Phase
−2
−1
0
+1
+2
+3
−436 −523 −604 −680 −798
−906
730
813
900
977
1069
1152
−453 −524 −600 −670 −732
−815
713
795
870
942
1025
1100
−402 −495 −552 −626 −704
−776
689
760
836
910
989
1049
−370 −442 −528 −580 −641
−719
619
700
762
825
907
970
−326 −401 −475 −524 −596
−646
617
677
754
816
883
950
−298 −359 −430 −496 −547
−593
593
664
717
778
849
900
−272 −346 −399 −452 −517
−565
571
625
683
733
789
854
−274 −331 −384 −443 −488
−540
536
592
636
696
751
794
−283 −334 −378 −427 −487
−521
571
622
673
722
778
818
−270 −312 −357 −388 −439
−485
542
595
644
686
731
778
−277 −313 −366 −404 −457
−496
567
607
653
698
731
769
−216 −258 −308 −348 −394
−430
502
546
582
619
662
702
−184 −228 −275 −306 −351
−375
466
503
535
567
614
652
−179 −228 −277 −305 −336
−354
441
475
499
539
580
622
−175 −208 −243 −287 −320
−347
442
480
511
545
575
607
+4
−993
1235
−908
1181
−847
1128
−784
1032
−709
1003
−663
963
−607
908
−586
855
−565
859
−531
821
−534
815
−458
740
−402
690
−400
654
−382
638
+5
−1064
1303
−982
1241
−902
1195
−822
1095
−765
1061
−700
1021
−660
958
−623
911
−604
908
−570
858
−560
862
−486
780
−443
725
−424
685
−408
676
Table 11 shows characterization data for selected fDAC frequencies. Other frequencies are possible, and Table 11 can be used to estimate performance.
Rev. B | Page 40 of 66
+6
−1131
1387
−1071
1320
−978
1250
−895
1151
−823
1122
−765
1070
−713
1015
−675
954
−659
956
−623
902
−615
911
−535
828
−491
766
−471
729
−463
717
Data Sheet
AD9119/AD9129
Before losing lock, the DLL controller issues a DLL warning by
setting Register 0x0E, Bit 6, to 1b and setting either Bit 5 or Bit 4
to 1b. This setting indicates that the DLL is near to losing lock. If
the DLL is going to reach the beginning of the delay line soon,
the controller issues a start warning by setting Register 0x0E, Bit 5
and Bit 6 to 1b. This setting indicates that the DLL is at the start
of the delay line, and losing lock is imminent.
USER DCI
For synchronous operation between the host and the AD9119/
AD9129, the AD9119/AD9129 provide a data clock output, DCO,
to the host at the same rate as DCI (that is, fDACCLK/4). Note that
the DCI signal can have arbitrary phase alignment with respect to
the DCO because the DLL of the AD9119/AD9129 ensures proper
data hand-off between the two clock domains (that is, the host
processors and the internal digital core of the AD9119/AD9129).
The default reset state of the AD9119/AD9129 is to have the
DCO signal disabled. To enable it, write a 1b to Register 0x0C,
Bit 6. The DCO output level is controlled in Register 0x7C,
Bits[7:6]. The default setting is 01b, or 2.8 mA, but it can be
increased to as high as 4 mA (11b) if higher swing is necessary.
The DCI signal is ac-coupled internally; therefore, a possibility
exists that removing the DCI signal can cause DAC output chatter
due to randomness on the DCI input. To avoid this chatter, it is
recommended that the DAC output be disabled when the DCI
signal is not present. To do this, program the DAC output current
power-down bit in Register 0x01, Bit 6, to 1b. When the DCI signal
is again present, the DAC output can be enabled by programming
Register 0x01, Bit 6, to 0b. The DAC output powers up in ~2 µs.
The status of the DLL can be polled by reading the data status
register at Address 0x0E. Bit 0 indicates that the DLL is running
and attempting lock, and Bit 7 is set to 1b when the DLL is locked.
Bit 2 is set to 1b when a valid data clock is detected. The warning
bits in Address 0x0E, Bits[6:4] can be used as indicators that the
DAC may be operating in a nonideal location in the delay line.
Note that these bits are read at the SPI port speed, which is much
slower than the actual speed of the DLL. This means that these
bits can show only a snapshot of what is happening, rather than
giving real-time feedback.
Temperature Effects
The length of the delay line varies slightly across the operating
temperature range, as the amount of delay through a delay cell
expands or contracts slightly due to the temperature change.
This can introduce a situation where the DLL may lock at one
temperature extreme and then approach an unlocked state as
the temperature changes (see Figure 132).
In the example shown in Figure 132, the DLL can lock at Phase
Setting 0 at 90° in a cold temperature. As the temperature gets
hotter, the delay line changes length, and the controller adjusts
the DLL control voltage to keep the 90° offset. In this case, a voltage
beyond the acceptable control voltage range is required to hold
the 90° phase offset.
D0
USER DATA
D1
DATA
SAMPLE CLK
90°
DELAY LINE – COLD
DELAY LINE – HOT
11149-236
Maximizing the opening of the eye in both the DCI and data
signals improves reliability of the data port interface. Use differential controlled impedance traces of equal length (that is, delay)
between the host processor and the AD9119/AD9129 input. To
ensure coincident transitions with the data bits, implement the
DCI as an additional data line with an alternating (010101…)
bit sequence from the same output drivers that are used for
the data.
Figure 132. Example of DLL Length Variation Across Temperature
A similar situation can happen at the end of the delay line, in
which case a DLL warning and a DLL end is issued. DLL end is
indicated when Register 0x0E, Bit 4 and Bit 6 are set to 1b.
In case of a DLL warning, action must be taken to prevent loss
of lock. On a start warning, reduce the minimum delay of the
delay line by removing one or several of the delay cells. This
can be accomplished by setting the bits in Registers 0x70 and
Register 0x71 to 0b. Begin by setting Bit 0 of Register 0x70 to 0b,
then Bit 1, and so on. In some cases, up to three delay cells may
need to be disabled. It is possible to disable up to six delay cells.
However, in most cases, none of the cells need to be disabled.
The situation varies, depending on the temperature range needed,
as well as the DACCLK signal rate used. The end warning case
is a theoretical possibility, but practical conditions normally
dictate that it is not reachable. If the end warning is reached, the
DLL must be relocked immediately. When doing initial lock (or
relock) of the DLL, all delay cells must be active, with all delay cell
bits in Register 0x70 and Register 0x71 set to 1b.
Parity
The data interface can be continuously monitored by enabling
the parity bit feature in Register 0x5C, Bit 7, and configuring
the FRM_P, FRM_N pins (Pin K13 and Pin K14) as parity pins
by setting Register 0x07, Bits[1:0] = 1 dec. When this pin configuration is used, the host sends a parity bit along with each data
sample. This bit is set according to the following formulas,
where n is the data sample that is being checked.
For even parity on the AD9129,
XOR[FRM(n), P0_D0(n), P0_D1(n), P0_D2(n), ..., P0_D13(n),
P1_D0(n), P1_D1(n), P1_D2(n), …, P1_D13(n)] = 0.
For odd parity on the AD9129,
XOR[FRM(n), P0_D0(n), P0_D1(n), P0_D2(n), ..., P0_D13(n),
P1_D0(n), P1_D1(n), P1_D2(n), …, P1_D13(n)] = 1.
Rev. B | Page 41 of 66
AD9119/AD9129
Data Sheet
pin and more than one IRQ is enabled, check Register 0x06,
Bits[3:2] when an IRQ event occurs to determine whether the
IRQ was caused by a parity error. The IRQ can also be cleared
by writing 1b to Register 0x06, Bit 2 or Register 0x06, Bit 3.
For the AD9119, the data port is 11-bit instead of 14-bit, so
P0_D11, P0_D12, P0_D13, P1_D11, P1_D12, and P1_D13 are
not used in the calculation of the parity bit. Thus, the parity bit
is calculated over 29 bits (including the frame/parity bit) for the
AD9129 and over 23 bits for the AD9119.
The parity bit feature can also be used to validate the interface
timing. As described previously, the host provides a parity bit
with the data samples and configures the AD9119/AD9129 to
generate an IRQ. The user can then sweep the sampling instance
of the AD9119/AD9129 input registers to determine at what
point a sampling error occurs.
If a parity error occurs, the parity error counter (Register 0x5D
or Register 0x5E) is incremented. Parity errors on the bits that
are sampled by the rising edge of DCI increment the parity
rising edge error counter (Register 0x5D) and set the parity
error rising edge bit (Register 0x5C, Bit 0). Parity errors on the
bits that are sampled by the falling edge of DCI increment the
parity falling edge error counter (Register 0x5E) and set the
parity error falling edge bit (Register 0x5C, Bit 1). The parity
counter continues to accumulate until it is cleared, or until it
reaches a maximum value of 255. The count can be cleared by
writing 1b to Register 0x5C, Bit 5.
DIGITAL DATAPATH DESCRIPTION
Figure 133 provides a more detailed diagram of the AD9119/
AD9129 digital datapath. The 22-bit/28-bit datapath with
internal DDR clocking interfaces with the dual 11-bit/14-bit
input data ports. Because two 11-bit/14-bit samples are captured
on each clock edge of DCI, four consecutive samples are captured
per DCI clock cycle. Samples captured on the rising edge of DCI
propagate through the upper section at a rate of DACCLK/2
(DDR), and those captured on the falling edge propagate through
the lower section.
An IRQ can be enabled to trigger when a parity error occurs by
writing 1b to Register 0x04, Bit 2 for rising edge-based parity
detection or to Register 0x04, Bit 3 for falling edge-based parity.
The status of IRQ can be measured via Register 0x06, Bit 2 or
Register 0x06, Bit 3 or by using the IRQ pin. When using the IRQ
14 BITS
FIFO PH0
REG 0
FIFO PH1
FRAME
FRAME/ 1
PARITY
REG 1
14
14
REG 2
TO DAC
DECODE
REG 3
REG 4
28
PARITY/
SED LOGIC
14
28
REG 5
14
FIFO PH2
FIFO PH3
14
DATA ASSEMBLER
RD PTR
RESET
DLL
DACCLK/4
REG 0
14
REG 1
REG 2
INPUT
LATCH
PARITY/
SED LOGIC
28
14
14
REG 3
REG 4
REG 5
REG 6
FRAME
SPI FIFO ALIGN REQUEST
REG 0x11[7]
RD PTR
RESET
REG 7
WR PTR
RESET
1
WR PTR
RESET
REG 7
DCI
MIX-MODE
2×
REG 6
RESET
LOGIC
DACCLK/4 DIST.
SPI FIFO ALIGN ACKNOWLEDGE
REG 0x11[6]
FIFO WRITE POINTER OFFSET
REG 0x12[2:0]
Figure 133. Digital Datapath of the AD9119/AD9129
Rev. B | Page 42 of 66
DACCLK/4
11149-136
DATA
INPUT
LATCH
Data Sheet
AD9119/AD9129
FIFO Description
The next functional block in the datapath is a set of four FIFOs
that are eight registers deep. The dual port data is clocked into
the FIFOs on both the rising and the falling edge of the DCI signal.
The FIFO acts as a buffer that absorbs timing variations between
the data source and DAC, such as the clock-to-data variation of
an FPGA or ASIC. For the greatest timing margin, maintain the
FIFO level near half full (that is, a difference of four between the
write and read pointers). The value of the write pointer determines
the FIFO register into which the input data is written, and the
value of the read pointer determines the register from which data
is read and fed into the data assembler. The write and read pointers
are updated every time new data is loaded and removed,
respectively, from the FIFO.
Valid data is transmitted through the FIFO as long as the FIFO
does not overflow or become empty. Note that an overflow or
empty condition of the FIFO is the same as the write pointer and
read pointer being equal. When both pointers are equal, an
attempt is made to simultaneously read and write a single FIFO
register. This simultaneous register access leads to unreliable
data transfer through the FIFO and must be avoided by ensuring
that data is written to the FIFO at the same rate that data is read
from the FIFO, keeping the data level in the FIFO constant.
This condition must be met by ensuring that DCI is equal to
DACCLK/4 (or equivalently, DCO).
Resetting the FIFO Data Level
FIFO initialization is required to ensure a four-sample spacing
and a deterministic pipeline latency. If the clocks are running
at power-up, the FIFO initializes to 50% full. The AD9119/
AD9129 has an internal delay that effectively offsets the FIFO
pointers by 2, such that the optimal FIFO data level of 4 (center)
reads back as 2 (0000011b) from Register 0x13 to Register 0x16.
To achieve this level, set Register 0x12 to 0x20 (hexadecimal) before
resetting the FIFO. This sets the read pointer to Level 2 and the
write pointer to Level 0.
To maximize the timing margin between the DCI input and the
internal DAC data rate clock, initialize the FIFO data level before
beginning data transmission. The value of the FIFO data level
can be initialized in three ways: by resetting the device, by strobing
the FRM_x input, and via a write sequence to the serial port.
The two preferred methods are use of the FRAME signal and
via a write sequence to the serial port. Before initializing the
FIFO data level, the LVDS DLL and the DAC clock PLL must be
locked.
The FRM_x input can be used to initialize the FIFO data level
value. First, set up the FRM_N and FRM_P pins for frame mode
(Register 0x07, Bits[1:0] = 2). Next, assert the FRAME signal
high for at least one DCI clock cycle. When the FRAME signal is
asserted in this manner, the write pointer is set to 4 (by default
or to the FIFO start level (Register 0x12, Bits[2:0])) the next
time the read pointer becomes 0 (see Figure 134).
READ
POINTER
0
1
2
3
5
6
7
0
1
2
3
4
5
6
7
FIFO WRITE RESETS
FRAME
WRITE
POINTER
4
3
4
5
6
7
0
1
2
11149-137
After the input data has been captured, the data is passed through a
logic block that monitors and/or determines the signal integrity
of the high speed digital data interface. The optional parity check
is used to continuously monitor the digital interface on a sampleper-sample basis, and the sample error detection (SED) can be
used to validate the input data interface for system debug/test
purposes. Note that the FRAME and PARITY signals share the
same pin assignment because the FRAME signal is typically
used during system initialization (for FIFO synchronization
purposes), and parity is used in normal operation.
Figure 134. Timing of the Frame Input vs. Write Pointer Value
To initialize the FIFO data level through the serial port, toggle
Bit 7 of Register 0x11 from 0b to 1b. When the write to the
register is complete, the FIFO data level is initialized.
The recommended procedure for a serial port FIFO data level
initialization is as follows:
1.
2.
3.
4.
Request FIFO level reset by setting Register 0x11, Bit 7,
to 1b.
Verify that the part acknowledges the request by ensuring
that Register 0x11, Bit 6, is set to 1b.
Remove the request by setting Register 0x11, Bit 7, to 0b.
Verify that the part drops the acknowledge signal by
ensuring that Register 0x11, Bit 6, is set to 0b.
Monitoring the FIFO Status
The relative FIFO data levels can be read from Register 0x13
through Register 0x16 at any time. The FIFO data level reported
by the serial port is denoted as a 7-bit thermometer code of the
write counter state, relative to the absolute read counter being at 0.
For example, the FIFO data level of 2 is reported as a value of
0000011b in the status register. Adding the internal delay of 2 to
this value makes the reported FIFO level equal to 4. It should be
noted that, depending on the timing relationship between DCI
and the main DACCLK signal, the FIFO level value can be off by
a count of ±1. Therefore, it is important that the difference
between the read and write pointers be maintained at ≥2.
Multiple DAC Synchronization
Synchronization of multiple AD9119/AD9129s implies that all
of the DAC outputs are time aligned to the same phase when all
devices are fed with the same data pattern (along with DCI) at
the same instance of time. FIFO initialization ensures that the
initial pipeline latency in the FIFO is set to four samples and
remains at this level, assuming that no process, voltage, or temperature variations occur between the host and the AD9119/
AD9129 clock domains.
Rev. B | Page 43 of 66
AD9119/AD9129
Data Sheet
Figure 136 shows an example of two AD9119/AD9129 devices
that are synchronized to the same host (that is, FPGA or ASIC).
Note that, when the same resources are used to generate these output signals, synchronization to a single host IC ensures minimum
data and DCI time skew between devices.
Synchronization within a data sample requires insight into the
difference between the read pointers of the master and slave
devices, as well as the ability to vary the delay of the slave device(s)
within the host to compensate for initial offsets between devices.
It is possible to calculate how many data samples the slave device(s)
is offset from the master device for the following reasons:
•
•
•
•
The pipeline delay of each device is the same after FIFO
initialization (FIFO reset).
The read counter of each device is derived from the same
phase aligned DACCLK source.
The state of the read counters of each device is sampled at
the same instance in time via the FRAME signal.
The readback value (Register 0x12[6:4]) is normalized to
a data sample (that is, a DACCLK period).
By calculating the difference between the read pointer settings
of the master and slave devices, the user can advance or delay
the data stream of the slave device within the FPGA. Because
this difference can be up to ±4 data samples, the FPGA must
provide this adjustment range for DAC synchronization alone.
Note that additional range must be added to compensate for any
other system delay variation.
In addition to synchronizing to the data sample level, the AD9119/
AD9129 can enable synchronization to the DACCLK level (see
Figure 135). A 1.8 V CMOS output pin, SYNC, can be used to
provide a DACCLK/8 signal. Using the SYNC output from each
DAC, enabled by Register 0x1A, Bit 4 = 1, the user can create
a simple phase detector with an external XOR gate.
DAC 1
XOR
The FIFO set or reset level is always a whole number (the
recommended value is 2). Because of this, there is a possibility
that the FIFO can be reset on the border of a rollover from a
fractional level to a whole level (as in 1.75 to 2.0). In this case,
an effect can occur that causes the FIFO Read level to increment
before the final read, thereby shifting the level from 1.75 to 2.75
and thus effectively setting the level to 3 instead of 2. This can
be noticed by a seeming 4 DAC sample offset in the output.
To avoid this issue (setting the FIFO before emptying its last
read), the FIFO must be reset and then read back to understand
its level. If it is a whole number, it is recommended that the DCI
is advanced or delayed by 1 DACCLK cycle relative to the FIFO.
This must be done in the FPGA if DCO is used as the timing
reference for DCI. If this is not possible in the FPGA, then it is
recommended that the DCO NOT be used to generate DCI, in
order to decouple the two clocks and enable this necessary phase
shift. If the DCI is generated independently from the DCO,
then the 1 DACCLK delay or advance can be accomplished by
incrementing or decrementing by 1 the SYNC output of both
DACs in the same direction.
The DCO signal is derived from the SYNC signal such that if
the SYNC signal is adjusted by a DACCLK cycle, the DCO
signal will also be adjusted by the same amount.
11149-139
DAC 2
This calibration must be performed at each power-up because
the FIFOs can be reset to any of four levels based on the divideby-4 output of the clock distribution block (see Figure 133). For
example, a FIFO reset to Level 2 could have an actual FIFO level
of 1.5, 1.75, 2, or 2.25, based on the location of the div-by-4 clock
edge. Adjusting the SYNC signals to align with each other
eliminates this ambiguity. As with the Sync register (0x1A
Bits[2:0]), the FIFO levels on each DAC do not have to match
(i.e., can be different) when the DACs are synchronized.
When the two DACs are aligned, the drift over temperature and
supply voltage of the SYNC signal of one DAC, relative to
another DAC, is expected to be no more than 450 ps.
SYNC
SYNC
phase detector, low-pass filter, and delay differences are taken
into account. The existing phase position can be read from
Register 0x1A, Bits[2:0]. The value of each DAC in Register 0x1A
Bits[2:0] can be different when the DACs are synchronized. Align
the SYNC outputs first, then reset the FIFOs on each DAC to
ensure that proper sync is achieved.
Figure 135. Example of Synchronization of Two DACs to
±1 DACCLK Accuracy
By adjusting the internal delay (incrementing or decrementing
by one DACCLK cycle with each write to Register 0x1A, Bit 7 or
Bit 6, respectively), the user can align the DACCLKs inside the two
DACs to within ±1 DACCLK cycle, when errors from the external
When all adjustments of the SYNC signal are complete, it is
recommended to disable the SYNC output by programming
Register 0x1A, Bit 4 = 0, to eliminate a possible source of clock
spurious signals.
Rev. B | Page 44 of 66
Data Sheet
AD9119/AD9129
MATCHED
DELAYS
COMMON
CLOCK
SOURCE
1.4GHz
TO
2.8GHz
0+ dBm
ADCLK925
DCI
DCO_x DACCLK
AD9129
MASTER
DCI_x
FRM_x
0+ dBm
FPGA
DCI_x DACCLK
FRM_x
AD9129
11149-138
SLAVE
DCO_x
Figure 136. Example of Synchronization of Two DACs to One FPGA
2× Digital Filter
The AD9119/AD9129 include a bypassable 2× half-band
interpolation filter to help simplify the analog reconstruction
filter. The filter has the potential benefit of minimizing the
impact of folded back harmonics in the desired baseband
region. The filter operates in a dual-edge clocking mode, where
it generates a new interpolated sample value for every alternate
DACCLK edge. This effectively increases the DAC update rate
to 2 × fDACCLK with the DAC’s sinc response null moving from
fDACCLK to 2 × fDACCLK.
There are two different filters, FIR25 and FIR40, that can be
chosen using Register 0x18, Bit 5, when the 2× interpolator is
enabled with Register 0x18, Bit 7.
Table 12. Features of the Two 2× Interpolation Filters
Filter
FIR25
FIR40
Ripple (dB)
±0.5
±0.1
Attenuation (dB)
25
40
Power (mW)
150
450
A duty cycle restore circuit follows the DACCLK clock receiver
to minimize impact of duty cycle errors on image rejection.
5
0
–5
–10
–15
–20
–25
–30
–35
–40
–45
–50
0
500
1000
1500
FREQUENCY (MHz)
2000
2500
11149-140
The data assembler reconstructs the original sample sequence.
It consists of a 4:1 multiplexer operating at fDACCLK. Each of the
four FIFOs provides a sample that is now referenced to the
internal clock domain of the AD9119/AD9129, fDACCLK. The
reconstructed sample sequence can be directed to the DAC
decode logic or undergo additional signal processing. In 2×
interpolation mode, a FIR filter is used to generate a new data
sample that is inserted between each sample, such that it can
update the DAC decode logic on the falling edge of DACCLK.
In Mix-Mode, the complement of each data sample is generated
and inserted after it, such that it also updates the DAC in a similar
manner. The 2× interpolator can be used with Mix-Mode enabled.
As a result, the frequency response has a flatter in-band response
and a sharper transition region, and the trade-off is a higher phase
count, leading to higher pipeline delay and higher power
consumption. The two filters are compared in Table 12.
MAGNITUDE (Normalized to 0dB)
Data Assembler and Signal Processing Modes
Figure 137. FIR25 2× Interpolation Filter Plot, Complete Frequency Response;
fDAC = 2.5 GHz
The FIR25 half-band filter provides 25 dB of stop-band rejection.
Its response is shown in Figure 137. Coefficients were optimized
for practical implementation purposes with the notion that the
±0.5 dB pass-band ripple effects on a multicarrier application
(for example, DOCSIS) can be compensated by the digital host
adjusting individual channel powers. Note that the worst-case
tilt across any 6 MHz channel is less than −0.05 dB.
The FIR40 half-band filter provides 40 dB of stop-band rejection,
and its response is shown in Figure 139. Coefficients were
chosen to reduce pass-band ripple and increase out-of-band
rejection for multicarrier applications (for example, DOCSIS).
Rev. B | Page 45 of 66
AD9119/AD9129
Data Sheet
The values listed in Table 13 can be used, depending on the
mode of operation that is selected.
1.0
MAGNITUDE (Normalized to 0dB)
0.5
Table 13. Pipeline Delay Values for Each Block
0
Mode
No 2× filter
With FIR25
With FIR40
–0.5
–1.0
200
400
600
800
1000
1200
FREQUENCY (MHz)
11149-141
•
0
•
Figure 138. FIR25 2× Interpolation Filter Plot, Pass-Band Ripple; fDAC = 2.5 GHz
•
5
0
–5
•
MAGNITUDE (dB)
–10
–15
–20
•
–25
–30
–35
–40
–45
–50
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
NORMALIZED FREQUENCY (×π RAD/Sample)
11149-142
–55
–60
Figure 139. FIR40 2× Interpolation Filter Plot, Complete Frequency Response
0.5
0
MAGNITUDE (dB)
Total
Pipeline
(fDAC cycles)
74
117
141
Total
Delay
(fDAC cycles)
74
119
150
Pipeline delay is the time from DAC code latched until the
DAC output begins to move.
Group delay is the time for the maximum amplitude pulse
to reach the DAC output, as compared to the first time the
output moves.
No 2× filter is the base pipeline delay, including data
interface, analog circuitry (six cycles), and data FIFO at
half-full/Position 3.
FIR25 is the 2× interpolator with 25 dB of out-of-band
rejection.
FIR40 is the 2× interpolator with 40 dB of out-of-band
rejection.
Note that the values for pipeline delay apply in both normal
mode and Mix-Mode. After the total delay through the digital
blocks is calculated, add the FIFO level to that delay to find the
total pipeline delay. Note that the pipeline delay can be considered
fixed, with the only ambiguity being the FIFO state. The FIFO
state can be initialized as part of the startup sequence to ensure
a four sample spacing and, therefore, a fixed pipeline delay, or
deterministic latency (see the Resetting the FIFO Data Level
section for more information).
To ensure repeatable pipeline delay over multiple power-up cycles,
the SYNC output of the DAC must be aligned with a known system
sync reference. Follow a calibration process that is similar to the
multiple DAC sync process (see the Multiple DAC Synchronization
section for more information) after each power-up event to align
the DAC to the system sync reference.
1.0
–0.5
–1.0
Power-Up Time
–1.5
The AD9119/AD9129 have a power-down register (Register 0x01)
that enables the user to power down various portions of the DAC.
The power-up time for several usage cases is shown in Table 14.
–2.0
0
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
NORMALIZED FREQUENCY (×π RAD/Sample)
11149-143
–2.5
–3.0
Group
Delay
(fDAC cycles)
N/A
2
9
The terms used in Table 13 are defined as follows:
–1.5
–2.0
Pipeline
Delay
(fDAC cycles)
74
43
67
Figure 140. FIR40 2× Interpolation Filter Plot, Pass-Band Ripple
Pipeline Delay (Latency)
The pipeline delay, or latency, of the AD9129 varies, based on
the configuration that is chosen and can be calculated using the
following formula:
Pipeline_Total = Pipeline_Delay + 2×_Delay
+ Group_Delay + FIFO_Level
The recommended way to power up the AD9119/AD9129 is
to power up all parts of the circuit with IREF disabled (by setting
Register 0x01, Bit 6 = 1b), and then enable IREF by programming
Register 0x01, Bit 6 = 0b.
Table 14. Power-Up Times for Several Usage Cases
State
Power-Up
Clock Path Up
Wake-Up
Rev. B | Page 46 of 66
Register State
From 0x01 = 0xEF to 0x01 = 0x08
From 0x01 = 0x0C to 0x01 = 0x08
From 0x01 = 0x48 to 0x01 = 0x08
Time (µs)
250
220
2
Data Sheet
AD9119/AD9129
RESET
The AD9119/AD9129 can provide the host processor with an
interrupt request output signal (IRQ), indicating that one or
more of the following events has occurred:
generate an interrupt. When an interrupt bit is enabled, it captures
a rising edge of the interrupt source and holds it, even if the source
subsequently returns to its zero state. It is possible, for example, for
the retimer lost interrupt enable and retimer lock interrupt enable
status bits (Register 0x03[1:0], respectively) to be set when a
controller temporarily loses lock but then reestablishes lock before
the IRQ is serviced by the host. In such a case, the host should
validate the present status of the suspect block by reading back its
current status bits. Based on the status of these bits, the host can
take appropriate action, if required.
•
•
•
•
The IRQ pin responds only to those interrupts that are enabled. To
clear an IRQ, it is necessary to write a 1b to the bit in Register 0x05
or Register 0x06 that caused the interrupt. See Figure 141 for
a detailed diagram of the interrupt circuitry.
The hardware reset pin (Pin H1) is active high and resets all
registers on the device. The software reset bit in Register 0x00
(Bit 5) performs the same reset function, except that it preserves
the current contents of Register 0x00.
INTERRUPT REQUESTS
One of the clock controllers has established or lost lock.
A parity error has occurred.
A sample error detection status or result is ready.
The FIFO is nearing an overwrite status.
The IRQ can also be used during the AD9119/AD9129
initialization phase after power-up to determine when the
retimer PLL and data receiver controllers achieve lock. For
example, before enabling the retimer PLL, the retimer lock
interrupt enable bit (Register 0x03[0]) can be set, and the IRQ
output signal can be monitored to determine when lock is
established, before continuing in a similar manner with the data
receiver controller. Clear the relevant lock bit, after locking, before
continuing to the next controller. When all of the controllers are
locked, set the appropriate lost lock enable bits in Register 0x03
to continuously monitor the controllers for loss of lock.
The IRQ output signal is an active low output signal that is available
on the IRQ pin (Pin H2). If used, connect the output to VDD via
a 10 kΩ pull-up resistor.
Each IRQ is enabled by setting the enable bits in Register 0x03 and
Register 0x04 that have the same bit mapping as the IRQ status bits
in Registers 0x05 and Register 0x06. If an interrupt bit is not
enabled, a read request of that bit shows a direct readback of the
current state of the source. Thus, a read request of either register
shows the current state of all eight interrupts in that register,
regardless of whether each individual bit is actually enabled to
WRITE 1b TO
REQUEST BIT
SINGLE IRQ BIT
R
SOURCE
IRQ ENABLE
IRQ PIN
Q
IRQ REQUEST
IRQ ENABLE
11149-144
D
OTHER IRQ
BITS
IRQ ENABLE
Figure 141. Interrupt Request Circuitry
Table 15. Interrupt Request Registers
Addr (Hex)
0x05
0x06
Bit
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Bit Name
FIFO_Warn2 interrupt status
FIFO_Warn1 interrupt status
SPIFrmAck interrupt status
Reserved
DLL warn interrupt status
DLL lock interrupt status
Retimer lost interrupt status
Retimer lock interrupt status
Reserved
AED pass interrupt status
AED fail interrupt status
SED fail interrupt status
Parity error falling edge status
Parity error rising edge status
Reserved
Reserved
Description
Indicates that the FIFO is within two slots of overwrite
Indicates that the FIFO is within one slot of overwrite
Indicates acknowledgement that the SFrmReq bit has changed from 0b to 1b
Reserved
Indicates that the DLL is close to coming unlocked and action is needed
Indicates that the DLL is now locked
Indicates that the retimer PLL is no longer locked
Indicates that the retimer PLL is now locked
Reserved
Indicates that the AED logic has captured eight valid samples
Indicates that the AED logic has detected a miscompare
Indicates that the SED logic has detected a miscompare
Indicates a parity fault due to data captured on the falling edge
Indicates a parity fault due to data captured on the rising edge
Reserved
Reserved
Rev. B | Page 47 of 66
AD9119/AD9129
Data Sheet
INTERFACE TIMING VALIDATION
The AD9119/AD9129 provide on-chip sample error detection
(SED) circuitry that simplifies verification of the input data
interface. The SED compares the input data samples captured
at the digital input pins with a set of comparison values. The
comparison values are loaded into registers through the SPI port.
Differences between the captured values and the comparison
values are detected and stored.
The compare pass bit is set if the last comparison indicates that
the sample is error free. The compare fail bit is set if an error is
detected. The compare fail bit is automatically cleared by the
reception of eight consecutive error-free comparisons. When
autoclear mode is enabled, Register 0x51 through Register 0x58
accumulate errors as previously described but reset to all 0s after
eight consecutive error-free sample comparisons are made.
SAMPLE ERROR DETECTION (SED) OPERATION
The sample error, compare pass, and compare fail flags can be
configured to trigger an IRQ when active, if desired. This is
accomplished by enabling the appropriate bits in the event flag
register (Register 0x06, Bit 4, Bit 5, and Bit 6).
The SED circuitry operates on a data set made up of eight
11-bit/14-bit input words, denoted as R0L, R1L, R0H, R1H,
F0L, F1L, F0H, and F1H. These represent the rising edge and
falling edge data of Data Port 0 and Data Port 1. (The AD9119/
AD9129 use both edges of the DCI clock to sample data on each
input port.) To properly align the input samples, the rising edge
data-words of the data ports (that is, RxL and RxH) are indicated
by asserting the FRAME signal for a minimum of two complete
input samples.
Figure 142 shows the input timing of the interface in word mode.
The FRAME signal can be issued once at the start of the data
transmission, or it can be asserted repeatedly at intervals coinciding
with the RxL and RxH data-words.
SED EXAMPLE
Normal Operation
The following example illustrates the SED configuration for
continuously monitoring the input data and assertion of an IRQ
when a single error is detected.
1.
DCI
P0[7:0]
R0L
F0L
P0[13:8]
R0H
F0H
P1[7:0]
R1L
F1L
P1[13:8]
R1H
F1H
11149-249
FRAME
2.
Figure 142. Timing Diagram of FRAME Signal Required to Align Input Data
for SED
The SED has three flag bits (Register 0x50, Bit 0, Bit 1, and Bit 2)
that indicate the results of the input sample comparisons. The
SED fail bit (Register 0x50, Bit 0) is set when an error is detected
and remains set until cleared. The SED also provides registers that
indicate which input data bits experienced errors (Register 0x51
through Register 0x58). These bits are latched and indicate the
accumulated errors detected until cleared. To clear the SED
registers, write 1b to Register 0x50, Bit 6.
The autosample error detection (AED) mode is an autoclear
mode that has the following two effects:
•
•
3.
4.
Write to the following registers to load the comparison values:
a) Register 0x51: SED Patt/Err R0L, Bits[7:0].
b) Register 0x52: SED Patt/Err R0H, Bits[13:8].
c) Register 0x53: SED Patt/Err R1L, Bits[7:0].
d) Register 0x54: SED Patt/Err R1H, Bits[13:8].
e) Register 0x55: SED Patt/Err F0L, Bits[7:0].
f) Register 0x56: SED Patt/Err F0H, Bits[13:8].
g) Register 0x57: SED Patt/Err F1L, Bits[7:0].
h) Register 0x58: SED Patt/Err F1H, Bits[13:8].
i) Comparison values can be chosen arbitrarily;
however, choosing values that require frequent
bit toggling provides the most robust test.
Enable the SED error detect flag to assert the IRQ pin.
a) Register 0x04: set to 0x10.
Begin transmitting the input data pattern.
Write three times to Register 0x50 to enable the SED.
a) Register 0x50: set to 0x80.
b) Register 0x50: set to 0xC0.
c) Register 0x50: set to 0x80.
If IRQ is asserted, read Register 0x50 and Register 0x51 through
Register 0x58 to verify that a SED error is detected and determine
which input bits are in error. The bits in Register 0x51 through
Register 0x58 are latched. This means that the bits indicate any
errors that occur on those bits throughout the test and not just
the errors that caused the error detected flag to be set.
AED mode activates the AED fail bit and the AED pass bit
(Register 0x50, Bit 1 and Bit 2).
AED mode changes the behavior of Register 0x51 through
Register 0x58.
Rev. B | Page 48 of 66
Data Sheet
AD9119/AD9129
ANALOG INTERFACE CONSIDERATIONS
The AD9119/AD9129 use the quad-switch architecture shown in
Figure 143. Only one pair of switches is enabled during a half-clock
cycle, thus requiring each pair to be clocked on alternative clock
edges. A key benefit of the quad-switch architecture is that it masks
the code-dependent glitches that occur in the conventional twoswitch DAC architecture.
When Mix-Mode is used, the output is effectively chopped at
the DAC sample rate. This has the effect of reducing the power
of the fundamental signal while increasing the power of the
images centered around the DAC sample rate, thus improving
the dynamic range of these images.
INPUT
DATA
D1
D2
D3
D4
D5
D6
D7
D8
–D8
D3
IOUTP
V G1
IOUTN
D2
LATCHES V 3
G
Px_D[13:0]x
–D7
D4
D1
VG2
VG1
VG2 VG3
FOUR-SWITCH
DAC OUTPUT
(fS MIX-MODE)
VG4
D10
DACCLK_x
DACCLK_x
CLK
D9
D5
–D9
–D10
–D6
t
–D5 D6
–D1
–D2
V G4
D10
D9
D7
–D4
11149-148
ANALOG MODES OF OPERATION
D8
–D3
11149-146
Figure 145. Mix-Mode Waveform
VSSA
Figure 143. Quad-Switch Architecture
In two-switch architecture, when a switch transition occurs and
D1 and D2 are in different states, a glitch occurs. But, if D1 and
D2 happen to be at the same state, the switch transitions, and no
glitches occur. This code-dependent glitching causes an increased
amount of distortion in the DAC. In quad-switch architecture
(no matter what the codes are), there are always two switches
that are transitioning at each half-clock cycle, thus eliminating
the code-dependent glitches but, in the process, creating a constant
glitch at 2 × DACCLK. For this reason, a significant clock spur
at 2 × fDACCLK is evident in the DAC output spectrum.
INPUT
DATA
D1
D2
D3
D4
D5
D6
D7
D8
D9
This ability to change modes provides the user the flexibility to
place a carrier anywhere in the first three Nyquist zones, depending
on the operating mode selected. Switching between baseband
and Mix-Mode reshapes the sinc roll-off inherent at the DAC
output. In baseband mode, the sinc null appears at fDACCLK
because the same sample latched on the rising clock edge is also
latched again on the falling clock edge, thus resulting in the
same ubiquitous sinc response of a traditional DAC. In MixMode, the complement sample of the rising edge is latched on
the falling edge, therefore pushing the sinc null to 2 × fDACCLK.
Figure 146 shows the ideal frequency response of both modes
with the sinc roll-off included.
FIRST
NYQUIST ZONE
D10
SECOND
NYQUIST ZONE
0
THIRD
NYQUIST ZONE
MIX-MODE
DACCLK_x
–5
D1
D2
D3
D4
D5
–10
t
D6
D7
D8
D9
D10
dBFS
TWO-SWITCH
DAC OUTPUT
–15
BASEBAND
MODE
–20
D6
D2
D3
D4
D7
D8
D9
D10
t
D5
–25
11149-147
FOUR-SWITCH
DAC OUTPUT
(NORMAL MODE) D1
–30
Figure 144. Two-Switch and Quad-Switch DAC Waveforms
–35
0
0.25
0.50
0.75
1.00
1.25
NORMALIZED FREQUENCY RELATIVE TO fDACCLK (Hz)
1.50
11149-149
As a consequence of the quad-switch architecture enabling
updates on each half-clock cycle, it is possible to operate that
DAC core at 2× the DACCLK rate if new data samples are latched
into the DAC core on both the rising and falling edge of the
DACCLK. This notion serves as the basis when operating the
AD9119/AD9129 in either Mix-Mode or with the 2× interpolation filter enabled. In each case, the DAC core is presented
with new data samples on each clock edge, albeit in Mix-Mode;
the falling edge sample is simply the complement of the rising
edge sample value.
Figure 146. Sinc Roll-Off for Baseband Mode and Mix-Mode Operation
The quad-switch can be configured via SPI (Register 0x19, Bit 0)
to operate in either baseband mode (0b) or Mix-Mode (1b).
Rev. B | Page 49 of 66
AD9119/AD9129
Data Sheet
CLOCK INPUT
The AD9119/AD9129 contain a low jitter, differential clock
receiver that is capable of interfacing directly to a differential
or single-ended clock source. Because the input is self-biased to
a nominal midsupply voltage of 1.25 V with a nominal impedance
of 10 kΩ//2 pF, it is recommended that the clock source be
ac-coupled to the DACCLK_x input pins with an external
differential load of 100 Ω. When the nominal differential input
span is 1 V p-p, the clock receiver can operate with a span that
ranges from 250 mV p-p to 2.0 V p-p.
TO DAC
AND DLL
DACCLK_P
DUTY CYCLE
RESTORER
DACCLK_N
5kΩ
1.25V
11149-150
25µA
50kΩ
Figure 147. Clock Input
The quality of the clock source, as well as its interface to the
AD9119/AD9129 clock input, directly impacts ac performance.
Select the phase noise and spur characteristics of the clock source
to meet the target application requirements. Phase noise and
spurs at a given frequency offset on the clock source are directly
translated to the output signal. It can be shown that the phase noise
characteristics of a reconstructed output sine wave are related to
the clock source by 20 × log10 (fOUT/fCLK) when the DAC clock
path contribution is negligible. (The wideband noise is not
dominated by the thermal and quantization noise of the DAC.)
Figure 148 shows a clock source based on the ADF4350 low phase
noise/jitter PLL. The ADF4350 can provide output frequencies
from 140 MHz up to 4.4 GHz with jitter as low as 0.5 ps rms. Its
squared-up output level can be varied from −4 dBm to +5 dBm,
allowing further optimization of the clock drive level.
PLL
The DACCLK_x input goes to a high frequency PLL to ensure
robust locking of the DAC sample clock to the input clock. The
PLL is enabled by default such that the PLL locks upon power-up.
The PLL (or DAC clock retimer) control registers are located at
Register 0x33 and Register 0x34. Register 0x33 enables the user
to set the phase detector phase offset level (Bits[7:4]), clear the PLL
lost lock status bit (Bit 3), choose the PLL divider for optimum performance (Bit 2), and choose the phase detector mode (Bits[1:0]).
These settings are determined during product characterization
and are given in the recommended start-up sequence (see the
Start-Up Sequence section). It is not normally necessary to change
these values, nor is the product characterization data valid on
any settings other than the recommended ones. Register 0x34 is
used to reset the PLL, should that become necessary.
At DACCLK = 2.85 GSPS, the lock time is about 10 µs. In most
situations, no action is required with the PLL. If the DACCLK
is changed and, especially, if it is changed multiple times, as in
a frequency hopping application, a phase slip or glitch may be
caused by the change in frequency, and it may become necessary
to reset the PLL. This can be checked by reading the PLL retimer
lost lock bit (Register 0x35, Bit 6). If that is the case, toggle the
PLL reset bit by programming Register 0x34, Bit 3, high and then
low. In addition, clear the PLL retimer lost lock bit by writing 0b
to Register 0x35, Bit 6. PLL lock can be verified by reading the
PLL lock bit at Register 0x35, Bit 7. It is possible to use the IRQ
registers to set an interrupt for these events. See the Interrupt
Requests section for more details.
AD9129
ADF4350
2.4nF
DACCLK_P
PLL
fREF
VCO
DIV-BY-2N
2.4nF
N=0–4
100Ω
DACCLK_N
0.8GHz TO 2.8GHz
1V p-p
Figure 148. Possible Signal Chain for DACCLK_x Input
Rev. B | Page 50 of 66
11149-151
5kΩ
A clock control register exists at Address 0x30. This register can
be used to enable automatic duty cycle correction (Bit 1), enable
zero-crossing control (Bit 6), and set the zero-crossing point
(Bits[5:2]). Recommended settings for this register are listed in
the recommended start-up sequence section (see the Start-Up
Sequence section).
Data Sheet
AD9119/AD9129
VOLTAGE REFERENCE
IOUTFS = 9.5mA – 34mA
The AD9119/AD9129 output current is set by a combination of
digital control bits and the I250U reference current, as shown in
Figure 149.
(9/17) × IOUTFS
IPEAK =
(8/17) × IOUTFS
AC
AD9129
FSC[9:0]
–
+
4kΩ
CURRENT
SCALING
Figure 150. Equivalent DAC Output Circuit
IFULLSCALE
I250
–1.5V
Figure 149. Voltage Reference Circuit
The reference current is obtained by forcing the band gap
voltage across an external 4.0 kΩ resistor from I250U (Pin A1)
to VSSA. The 1.0 V nominal band gap voltage (VREF) generates a
250 µA reference current in the 4.0 kΩ resistor. Note the
following constraints when configuring the voltage reference
circuit:
•
•
•
•
•
Both the 4.0 kΩ resistor and 1 nF bypass capacitor are
required for proper operation.
Adjusting the DAC output full-scale current, IOUTFS, from
its default setting of 20 mA should be performed digitally.
The AD9119/AD9129 are not multiplying DACs. Modulation of the reference current, I250U, with an ac signal is not
supported.
The band gap voltage appearing at the VREF pin must be
buffered for use with an external circuitry because its output
impedance is approximately 7.5 kΩ.
An external reference can be used to overdrive the internal
reference by connecting it to the VREF pin.
As mentioned, the IOUTFS can be adjusted digitally over a 9.4 mA
to 34.2 mA range by the FSC_x[9:0] bits (Register 0x20, Bits[7:0]
and Register 0x21, Bits[1:0]). The following equation relates
IOUTFS to the FSC_x[9:0] bits, which can be set from 0 to 1023.
IOUTFS = 24.21875 mA × FSC_x[9:0]/1000 + 9.4 mA
The example shown in Figure 150 can be modeled as a pair of
dc current sources that source a current of 9/17 × IOUTFS to each
output. A differential ac current source, IPEAK, is used to model
the signal (that is, a digital code) dependent nature of the DAC
output. The polarity and signal dependency of this ac current
source is related to the digital code (F) by the following equation:
ANALOG OUTPUTS
Equivalent DAC Output and Transfer Function
The AD9119/AD9129 provide complementary current outputs,
IOUTP and IOUTN, that sink current from an external load
that is referenced to the 1.8 V VDDA supply. Figure 150 shows
an equivalent output circuit for the DAC. Compared to most
current output DACs of this type, the outputs of the AD9119/
AD9129 exhibit a slight offset current (that is, IOUTFS/17), and the
peak differential ac current is slightly below IOUTFS/2 (that is,
8/17 × IOUTFS).
(2)
−1 < F (code) < +1
(3)
Because IPEAK can swing ±(8/17) × IOUTFS, the output currents
that are measured at IOUTP and IOUTN can span from
IOUTFS/17 to IOUTFS. However, because the ac signal-dependent
current component is complementary, the sum of the two
outputs is always constant (that is, IOUTP + IOUTN =
(18/17) × IOUTFS).
The code-dependent current that is measured at the IOUTP
(and IOUTN) output is as follows:
IOUTP = (9/17) × IOUTFS (mA) + (8/17) × IOUTFS (mA)
× F (code)
(4)
IOUTN = (9/17) × IOUTFS (mA) − (8/17) × IOUTFS (mA)
× F (code)
Figure 151 shows the IOUTP vs. DACCODE transfer function
when IOUTFS is set to 19.65 mA.
20
18
(1)
Note that the default value of 0x200 generates 21.937 mA full scale,
but most of the characterization presented in this datasheet uses
33 mA, unless noted otherwise.
F (code) = (DACCODE − 8192)/8192
where DACCODE = 0 to 16,383 (decimal).
16
OUTPUT CURRENT (mA)
I250U
11149-153
1nF
(9/17) × IOUTFS
11149-154
VREF
DAC
Rev. B | Page 51 of 66
14
12
10
8
6
4
2
0
0
4096
8192
DAC CODE
12,288
16,384
11149-155
VBG
1.0V
Figure 151. Gain Curve for FSC_x[9:0] = 512, DAC Offset = 1.228 mA
AD9119/AD9129
Data Sheet
The maximum peak power capability of a differential current
output DAC is dependent on its peak differential ac current,
IPEAK, and the equivalent load resistance it sees. In the case of a
1:1 balun with 50 Ω source termination, the equivalent load that
is seen by the DAC ac current source is 25 Ω. If the AD9119/
AD9129 is programmed for an IOUTFS = 20 mA, its peak ac current
is 9.375 mA and its peak power, delivered to the equivalent
load, is 2.2 mW (that is, P = I2R). Because the source and load
resistance seen by the 1:1 balun are equal, this power is shared
equally. Hence, the output load receives 1.1 mW, or 0.4 dBm
peak power.
Figure 152 shows the AD9119/AD9129 interfacing to the JTX-210T transformer. This transformer provides excellent amplitude/
phase balance (that is, 100 MHz
1: DLL is locked on negative half of DCI.
0: DLL is locked on positive half of DCI
1: closed loop DLL attempting to lock
0: delay fixed at middle of delay line
Rev. B | Page 59 of 66
AD9119/AD9129
Data Sheet
FIFO Control Register
Address: 0x11, Reset: 0x00, Name: FIFO Ctrl
Table 31. Bit Descriptions for FIFO Ctrl
Bits
7
6
5
[4:1]
0
Bit Name
SPIFrmReq
SPIFrmAck
Enable pin framing
Reserved
Phase report enable
Description
Requests a SPI-based FIFO alignment (FIFO reset)
Acknowledges SPIFrmReq change (tracks SPIFrmReq setting)
1: enables hardware pin-based FIFO framing
Reserved
1: enables FIFO phase reporting
Reset
0
0
0
0x0
0
Access
R/W
R/W
R/W
R
R/W
Reset
0
0x0
0
0x4
Access
R
R/W
R
R/W
Reset
0
0x00
Access
R
R
Reset
0
0x00
Access
R
R
Reset
0
0x00
Access
R
R
Reset
0
0x00
Access
R
R
FIFO Offset Register
Address: 0x12, Reset: 0x04, Name: FIFO Offset
Table 32. Bit Descriptions for FIFO Offset
Bits
7
[6:4]
3
[2:0]
Bit Name
Reserved
RdPtrOff[2:0]
Reserved
WtPtrOff[2:0]
Description
Reserved
FIFO read pointer offset
Reserved
FIFO write pointer offset
FIFO Thermometer for Phase 0 Status Register
Address: 0x13, Reset: 0x00, Name: FIFO PH0 THRM
Table 33. Bit Descriptions for FIFO PH0 THRM
Bits
7
[6:0]
Bit Name
Reserved
Phz0Thrm
Description
Reserved
Phase 0-based FIFO thermometer status. Phase 0 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
FIFO Thermometer for Phase 1 Status Register
Address: 0x14, Reset: 0x00, Name: FIFO PH1 THRM
Table 34. Bit Descriptions for FIFO PH1 THRM
Bits
7
[6:0]
Bit Name
Reserved
Phz1Thrm
Description
Reserved
Phase 1-based FIFO thermometer status. Phase 1 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
FIFO Thermometer for Phase 2 Status Register
Address: 0x15, Reset: 0x00, Name: FIFO PH2 THRM
Table 35. Bit Descriptions for FIFO PH2 THRM
Bits
7
[6:0]
Bit Name
Reserved
Phz2Thrm
Description
Reserved
Phase 2-based FIFO thermometer status. Phase 2 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
FIFO Thermometer for Phase 3 Status Register
Address: 0x16, Reset: 0x00, Name: FIFO PH3 THRM
Table 36. Bit Descriptions for FIFO PH3 THRM
Bits
7
[6:0]
Bit Name
Reserved
Phz3Thrm
Description
Reserved
Phase 3-based FIFO thermometer status. Phase 3 relative FIFO phasing, as 0000000b
to 1111111b, where 0000011b is considered the middle of the FIFO storage space.
Rev. B | Page 60 of 66
Data Sheet
AD9119/AD9129
Data Mode Control Register
Address: 0x18, Reset: 0x00, Name: Data Mode Ctrl
Table 37. Bit Descriptions for Data Mode Ctrl
Bits
7
Bit Name
Filter enable
6
Binary select
5
FILT_SEL
[4:0]
Reserved
Description
1: enables 2× interpolation filter
0: bypasses 2× interpolation filter
Selects input data format
1: unsigned
0: signed (Twos complement)
2× interpolator filter select
1: 40 dB OOB rejection
0: 25 dB out-of-band (OOB) rejection
Reserved
Reset
0
Access
R/W
0
R/W
0
R/W
0
R
Reset
0x00
0
Access
R
R/W
Reset
0
0
0
0
Access
R/W
R/W
R
R/W
0
0
R
R
Reset
0x00
Access
R/W
Reset
0
0
0x02
Access
R/W
R
R/W
Decoder Control (Program Thermometer Type) Register
Address: 0x19, Reset: 0x00, Name: Decode Ctrl
Table 38. Bit Descriptions for Decode Ctrl
Bits
[7:1]
0
Bit Name
Reserved
Mix-Mode enable
Description
Reserved
1: Mix-Mode
0: normal
Sync Control Register
Address: 0x1A, Reset: 0x00, Name: Sync
Table 39. Bit Descriptions for Sync
Bits
7
6
5
4
Bit Name
Inc latency
Dec latency
Reserved
Sync enable
3
[2:0]
Sync done
Phase readback
Description
Increment delay by 1
Decrement delay by 1
Reserved
1: multi-DAC sync output pin enabled
0: multi-DAC sync output pin disabled
1: last increment or decrement request is complete
Readback of existing SYNC phase delay value
Full-Scale Current Adjust (Lower) Register
Address: 0x20, Reset: 0x00, Name: FSC_1
Table 40. Bit Descriptions for FSC_1
Bits
[7:0]
Bit Name
Full-scale current, Bits[7:0]
Description
DAC gain adjust; DAC full-scale current (LSB)
Full-Scale Current Adjust (Upper) Register
Address: 0x21 Reset: 0x02, Name: FSC_2
Table 41. Bit Descriptions for FSC_2
Bits
7
[6:2]
[1:0]
Bit Name
Reserved
Reserved
Full-scale current, Bits[9:8]
Description
Reserved
Reserved
DAC gain adjust; DAC full-scale current (MSB)
Rev. B | Page 61 of 66
AD9119/AD9129
Data Sheet
Analog Control 1 Register
Address: 0x22, Reset: 0x00, Name: ANA_CNT1
Table 42. Bit Descriptions for ANA_CNT1
Bits
[7:0]
Bit Name
Reserved
Description
Reserved
Reset
0x0
Access
R/W
Reset
0x0C
Access
R/W
Reset
0
0
0
0
0
Access
R/W
R/W
R/W
R/W
R/W
Reset
0x3
0
0
Access
R/W
Analog Control 2 Register
Address: 0x23, Reset: 0x0C, Name: ANA_CNT2
Table 43. Bit Descriptions for ANA_CNT2
Bits
[7:0]
Bit Name
Reserved
Description
Reserved
Clock Control 1 Register
Address: 0x30, Reset: 0x00, Name: CLK REG1
Table 44. Bit Descriptions for CLK REG1
Bits
7
6
[5:2]
1
0
Bit Name
Reserved
Cross enable
Cross location
Duty enable
Select internal
Description
Must be set to 0; reserved
Enables zero-crossing control
Adjusts zero-crossing control location (signed magnitude)
Enables duty cycle correction
Must be set to 0
Retimer Control 0 Register
Address: 0x33, Reset: 0x30, Name: Retimer Ctrl 0
Table 45. Bit Descriptions for Retime Ctrl 0
Bits
[7:4]
3
2
Bit Name
Phase step
Clear lost
PLL divider
[1:0]
Retimer mode
Description
4-bit signed magnitude; PFD phase step = n × 30°
Clear lost status bit
1: divide-by-4
0: divide-by-8
0: enable PFD, normal mode
1: reserved
2: reserved
3: reserved
0x0
Retimer Control 1 Register
Address: 0x34, Reset: 0x55, Name: Retimer Ctrl 1
Table 46. Bit Descriptions for Retimer Ctrl 1
Bits
[7:4]
3
Bit Name
Reserved
PLL reset_Z
[2:0]
Reserved
Description
Reserved
1: normal operation for DAC clock PLL
0: resets the DAC clock PLL
Reserved
Reset
0x5
0
Access
R/W
R/W
0x5
R/W
Reset
0
0
0x0
0x0
Access
R
R
R
R
Retimer Status 0 Register
Address: 0x35, Reset: 0x00, Name: Retimer Stat 0
Table 47. Bit Descriptions for Retimer Stat 0
Bits
7
6
[5:4]
[3:0]
Bit Name
PLL lock
PLL lost
Reserved
Reserved
Description
1: retimer PLL locked
1: retimer PLL lost (can be sticky)
Reserved
Reserved
Rev. B | Page 62 of 66
Data Sheet
AD9119/AD9129
Sample Error Detection (SED) Control Register
Address: 0x50, Reset: 0x00, Name: SED Control
Table 48. Bit Descriptions for SED Control
Bits
7
6
5
4
3
2
1
0
Bit Name
SED enable
SED error clear
AED enable
Reserved
Reserved
AED pass
AED fail
SED fail
Description
1: setting this bit to 1 enables the SED compare logic
1: clears all SED reported error bits below
1: enables the AED function (SED with autoclear after eight passing sets)
Must be set to 0; reserved
Must be set to 0; reserved
1: signals eight true compare cycles
1: signals a miscompare
1: signals an SED miscompare (with SED or AED enabled)
Reset
0
0
0
0
0
0
0
0
Access
R/W
R/W
R/W
R
R
R/W
R
R
Reset
0x00
Access
R/W
Reset
0x0
0x00
Access
R
R/W
Reset
0x00
Access
R/W
Reset
0x0
0x00
Access
R
R/W
Sample Error Detection (SED) Data Port 0 Rising Edge Status Low Register
Address: 0x51, Reset: 0x00, Name: SED Patt/Err R0L
Table 49. Bit Descriptions for SED Patt/Err R0L
Bits
[7:0]
Bit Name
SED Data Port 0 rising edge low part error bits
Description
SED Data Port 0 rising edge error, Bits[7:0]
Sample Error Detection (SED) Data Port 0 Rising Edge Status High Register
Address: 0x52, Reset: 0x000, Name: SED Patt/Err R0H
Table 50. Bit Descriptions for SED Patt/Err R0H
Bits
[7:6]
[5:0]
Bit Name
Reserved
SED Data Port 0 rising edge high part error bits
Description
Reserved
SED Data Port 0 rising edge error, Bits[13:8]
Sample Error Detection (SED) Data Port 1 Rising Edge Status Low Register
Address: 0x53, Reset: 0x00, Name: SED Patt/Err R1L
Table 51. Bit Descriptions for SED Patt/Err R1L
Bits
[7:0]
Bit Name
SED Data Port 1 rising edge low part error bits
Description
SED Data Port 1 rising edge error, Bits[7:0]
Sample Error Detection (SED) Data Port 1 Rising Edge Status High Register
Address: 0x54, Reset: 0x00, Name: SED Patt/Err R1H
Table 52. Bit Descriptions for SED Patt/Err R1H
Bits
[7:6]
[5:0]
Bit Name
Reserved
SED Data Port 1 rising edge high part error bits
Description
Reserved
SED Data Port 1 rising edge error, Bits[13:8]
Rev. B | Page 63 of 66
AD9119/AD9129
Data Sheet
Sample Error Detection (SED) Data Port 0 Falling Edge Status Low Register
Address: 0x55, Reset: 0x00, Name: SED Patt/Err F0L
Table 53. Bit Descriptions for SED Patt/Err F0L
Bits
[7:0]
Bit Name
SED Data Port 0 falling edge low part error bits
Description
SED Data Port 0 falling edge error, Bits[7:0]
Reset
0x00
Access
R/W
Reset
0x0
0x00
Access
R
R/W
Reset
0x00
Access
R/W
Description
Reserved
SED Data Port 1 falling edge error, Bits[13:8]
Reset
0x0
0x00
Access
R
R/W
Description
1: enables parity
1: even parity. Even parity is defined as XOR[FRM(n), P0_D0(n),
P0_D1(n), P0_D2(n), ..., P0_D13(n), P1_D0(n), P1_D1(n),
P1_D2(n), …, P1_D13(n)] = 0.
0: odd parity. Odd parity is defined as XOR[FRM(n), P0_D0(n),
P0_D1(n), P0_D2(n), ..., P0_D13(n), P1_D0(n), P1_D1(n),
P1_D2(n), …, P1_D13(n)] = 1
Note that the parity bit must be enabled in Register 0x07.
1: clears parity error counters
Reserved
1: signals detection of a falling edge parity error
1: signals detection of a rising edge parity error
Reset
0x00
0
Access
R/W
R/W
0
0x0
0
0
R/W
R
R
R
Description
Number of rising edge-based errors detected, clipped to 256
Reset
0x00
Access
R
Sample Error Detection (SED) Data Port 0 Falling Edge Status High Register
Address: 0x56, Reset: 0x000, Name: SED Patt/Err F0H
Table 54. Bit Descriptions for SED Patt/Err F0H
Bits
[7:6]
[5:0]
Bit Name
Reserved
SED Data Port 0 falling edge high part error bits
Description
Reserved
SED Data Port 0 falling edge error, Bits[13:8]
Sample Error Detection (SED) Data Port 1 Falling Edge Status Low Register
Address: 0x57, Reset: 0x00, Name: SED Patt/Err F1L
Table 55. Bit Descriptions for SED Patt/Err F1L
Bits
[7:0]
Bit Name
SED Data Port 1 falling edge low part error bits
Description
SED Data Port 1 falling edge error, Bits[7:0]
Sample Error Detection (SED) Data Port 1 Falling Edge Status High Register
Address: 0x58, Reset: 0x00, Name: SED Patt/Err F1H
Table 56. Bit Descriptions for SED Patt/Err F1H
Bits
[7:6]
[5:0]
Bit Name
Reserved
SED Data Port 1 falling edge high part error bits
Parity Control Register
Address: 0x5C, Reset: 0x00, Name: Parity Control
Table 57. Bit Descriptions for Parity Control
Bits
7
6
Bit Name
Parity enable
Parity even
5
[4:2]
1
0
Parity error clear
Reserved
Parity error falling edge
Parity error rising edge
Parity Rising Edge Count Register
Address: 0x5D, Reset: 0x00, Name: Parity Err Rising
Table 58. Bit Descriptions for Parity Err Rising
Bits
[7:0]
Bit Name
Parity rising edge error count
Parity Falling Edge Count Register
Address: 0x5E, Reset: 0x00, Name: Parity Err Falling
Rev. B | Page 64 of 66
Data Sheet
AD9119/AD9129
Table 59. Bit Descriptions for Parity Err Falling
Bits
[7:0]
Bit Name
Parity falling edge error count
Description
Number of falling edge-based errors detected, clipped to 256
Reset
0x00
Access
R
Description
Sets each bit to enable or disable the delay cell, Bits[7:0]; delay cell number corresponds to bit
number
1: enables delay cell (default)
0: disables delay cell
Reset
0xFF
Access
R/W
Reset
0x60
0x7
Access
R/W
R/W
Reset
0x1
Access
R/W
0x3C
R/W
Reset
0x07
or
0x87
Access
R
Delay Control Register 0
Address: 0x70, Reset: 0xFF, Name: Delay Ctrl 0
Table 60. Bit Descriptions for Delay Ctrl 0
Bits
[7:0]
Bit Name
Enable delay cell
Delay Control Register 1
Address: 0x71, Reset: 0x67, Name: Delay Ctrl 1
Table 61. Bit Descriptions for Delay Ctrl 1
Bits
[7:3]
[2:0]
Bit Name
Reserved
Enable delay cell
Description
Reserved
Sets each bit to enable or disable the delay cell, Bits[10:8]; delay cell numbers are 10, 9,
and 8, which correspond to Bit 2, Bit 1, and Bit 0, respectively
1: enables delay cell (default)
0: disables delay cell
Drive Strength Register
Address: 0x7C, Reset: 0x7C, Name: Drive Strength
Table 62. Bit Descriptions for Drive Strength
Bits
[7:6]
Bit Name
DCO drive strength
[5:0]
Reserved
Description
Sets DCO drive strength
00: 2 mA
01: 2.8 mA (default)
10: 3.4 mA
11: 4 mA
Reserved
Part ID Register
Address: 0x7F, Reset: 0x03 or 0x83, Name: Part ID
Table 63. Bit Descriptions for Part ID
Bits
[7:0]
Bit Name
Part ID
Description
Version information
0x07 = the AD9129 (14-bit version)
0x87 = the AD9119 (11-bit version)
Rev. B | Page 65 of 66
AD9119/AD9129
Data Sheet
OUTLINE DIMENSIONS
12.10
12.00 SQ
11.90
14
13
12
11
10
9
8
7
6
5
4
3
2
A
B
C
D
E
F
G
H
J
K
L
M
N
P
10.40
BSC SQ
0.80
BSC
BOTTOM VIEW
TOP VIEW
DETAIL A
DETAIL A
0.43 MAX
0.25 MIN
1.40 MAX
A1 BALL
CORNER
1
SEATING
PLANE
1.00 MAX
0.85 MIN
0.55
0.50
0.45
BALL DIAMETER
COPLANARITY
0.12
COMPLIANT WITH JEDEC STANDARDS MO-275-GGAA-1.
11-18-2011-A
A1 BALL
CORNER
Figure 157. 160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-160-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD9119BBCZ
AD9119BBCZRL
AD9119-EBZ
AD9119-MIX-EBZ
AD9119-CBLTX-EBZ
AD9129BBCZ
AD9129BBCZRL
AD9129BBC
AD9129BBCRL
AD9129-EBZ
AD9129-MIX-EBZ
AD9129-CBLTX-EBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board for Normal Mode Evaluation
Evaluation Board for Mix-Mode Evaluation
Evaluation Board for Cable Transmitter Evaluation
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
160-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
Evaluation Board for Normal Mode Evaluation
Evaluation Board for Mix-Mode Evaluation
Evaluation Board for Cable Transmitter Evaluation
Z = RoHS Compliant Part.
©2013-2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D11149-0-6/17(B)
Rev. B | Page 66 of 66
Package Option
BC-160-1
BC-160-1
BC-160-1
BC-160-1
BC-160-1
BC-160-1
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