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AD9484BCPZ-500

AD9484BCPZ-500

  • 厂商:

    AD(亚德诺)

  • 封装:

    VFQFN56

  • 描述:

    IC ADC 8BIT PIPELINED 56LFCSP

  • 数据手册
  • 价格&库存
AD9484BCPZ-500 数据手册
8-Bit, 500 MSPS, 1.8 V Analog-to-Digital Converter AD9484 FEATURES FUNCTIONAL BLOCK DIAGRAM VREF PWDN AGND AVDD AD9484 REFERENCE CML VIN+ VIN– DRVDD DRGND TRACK-AND-HOLD ADC CORE CLK+ CLK– 8 OUTPUT STAGING LVDS CLOCK MANAGEMENT 8 D7± TO D0± OR+ OR– SERIAL PORT DCO+ DCO– SCLK/DFS SDIO CSB 09615-001 SNR = 47 dBFS at fIN up to 250 MHz at 500 MSPS ENOB of 7.5 bits at fIN up to 250 MHz at 500 MSPS (−1.0 dBFS) SFDR = 79 dBc at fIN up to 250 MHz at 500 MSPS (−1.0 dBFS) Integrated input buffer Excellent linearity DNL = ±0.1 LSB typical INL = ±0.1 LSB typical LVDS at 500 MSPS (ANSI-644 levels) 1 GHz full power analog bandwidth On-chip reference, no external decoupling required Low power dissipation 670 mW at 500 MSPS—LVDS SDR output Programmable (nominal) input voltage range 1.18 V p-p to 1.6 V p-p, 1.5 V p-p nominal 1.8 V analog and digital supply operation Selectable output data format (offset binary, twos complement, Gray code) Clock duty cycle stabilizer Integrated data capture clock Figure 1. APPLICATIONS Wireless and wired broadband communications Cable reverse path Communications test equipment Low cost digital oscilloscopes Satellite subsystems Power amplifier linearization GENERAL DESCRIPTION The AD9484 is an 8-bit, monolithic, sampling analog-to-digital converter (ADC) optimized for high performance, low power, and ease of use. The part operates at up to a 500 MSPS conversion rate and is optimized for outstanding dynamic performance in wideband carrier and broadband systems. All necessary functions, including a sample-and-hold and voltage reference, are included on the chip to provide a complete signal conversion solution. The VREF pin can be used to monitor the internal reference or provide an external voltage reference (external reference mode must be enabled through the SPI port). The ADC requires a 1.8 V analog voltage supply and a differential clock for full performance operation. The digital outputs are LVDS (ANSI-644) compatible and support twos complement, offset binary format, or Gray code. A data clock output is available for proper output data timing. Fabricated on an advanced BiCMOS process, the AD9484 is available in a 56-lead LFCSP, and is specified over the industrial temperature range (−40°C to +85°C). This product is protected by a U.S. patent. PRODUCT HIGHLIGHTS 1. 2. 3. High Performance. Maintains 47 dBFS SNR at 500 MSPS with a 250 MHz input. Ease of Use. LVDS output data and output clock signal allow interface to current FPGA technology. The on-chip reference and sample-and-hold provide flexibility in system design. Use of a single 1.8 V supply simplifies system power supply design. Serial Port Control. Standard serial port interface supports various product functions, such as data formatting, power-down, gain adjust, and output test pattern generation. Rev. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved. AD9484 TABLE OF CONTENTS Features .............................................................................................. 1  Theory of Operation ...................................................................... 14  Applications ....................................................................................... 1  Analog Input and Voltage Reference ....................................... 14  Functional Block Diagram .............................................................. 1  Clock Input Considerations ...................................................... 15  General Description ......................................................................... 1  Power Dissipation and Power-Down Mode ........................... 16  Product Highlights ........................................................................... 1  Digital Outputs ........................................................................... 16  Revision History ............................................................................... 2  Timing ......................................................................................... 17  Specifications..................................................................................... 3  VREF ............................................................................................ 17  DC Specifications ......................................................................... 3  AD9484 Configuration Using the SPI ..................................... 18  AC Specifications.......................................................................... 4  Hardware Interface..................................................................... 18  Digital Specifications ................................................................... 5  Configuration Without the SPI ................................................ 18  Switching Specifications .............................................................. 6  Memory Map .................................................................................. 20  Absolute Maximum Ratings............................................................ 7  Reading the Memory Map Table .............................................. 20  Thermal Resistance ...................................................................... 7  Reserved Locations .................................................................... 20  ESD Caution .................................................................................. 7  Default Values ............................................................................. 20  Pin Configuration and Function Descriptions ............................. 8  Logic Levels ................................................................................. 20  Typical Performance Characteristics ........................................... 10  Outline Dimensions ....................................................................... 23  Equivalent Circuits ......................................................................... 13  Ordering Guide .......................................................................... 23  REVISION HISTORY 6/11—Rev. 0 to Rev. A Change to General Description Section ........................................ 1 Change to Aperture Time Parameter in Table 4 ........................... 6 Change to Figure 34 ....................................................................... 16 Changes to Register 17 and Register 18 in Table 12 .................. 20 3/11—Revision 0: Initial Version Rev. A | Page 2 of 24 AD9484 SPECIFICATIONS DC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted. Table 1. Parameter 1 RESOLUTION ACCURACY No Missing Codes Offset Error Gain Error Differential Nonlinearity (DNL) Integral Nonlinearity (INL) INTERNAL REFERENCE VREF TEMPERATURE DRIFT Offset Error Gain Error ANALOG INPUTS (VIN+, VIN−) Differential Input Voltage Range 2 Input Common-Mode Voltage Input Resistance (Differential) Input Capacitance (Differential) POWER SUPPLY AVDD DRVDD Supply Currents IAVDD 3 IDRVDD3/SDR Mode 4 Power Dissipation SDR Mode4 Standby Mode Power-Down Mode Temp Full 25°C Full 25°C Full 25°C Full 25°C Full Full Min Typ 8 Max Guaranteed 0 −3.0 +0.15 mV mV % FS % FS LSB LSB LSB LSB 0.78 V +3.0 1.0 −5.0 +7.0 ±0.13 −0.25 +0.25 ±0.1 −0.15 0.71 Full Full 0.75 Unit Bits 18 0.07 μV/°C %/°C Full Full Full Full 1.18 1.5 1.7 1 1.3 1.6 V p-p V kΩ pF Full Full 1.75 1.75 1.8 1.8 1.9 1.9 V V Full Full 283 89 300 100 mA mA Full Full Full 670 40 2.5 720 50 7 mW mW mW 1 See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed. The input range is programmable through the SPI, and the range specified reflects the nominal values of each setting. See the Memory Map section. IAVDD and IDRVDD are measured with a −1 dBFS, 10.3 MHz sine input at a rated sample rate. 4 Single data rate mode; this is the default mode of the AD9484. 2 3 Rev. A | Page 3 of 24 AD9484 AC SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted. Table 2. Parameter 1, 2 SNR fIN = 30.3 MHz fIN = 70.3 MHz fIN = 100.3 MHz Temp 25°C 25°C 25°C Full 25°C 25°C fIN = 250.3 MHz fIN = 450.3 MHz SINAD fIN = 30.3 MHz fIN = 70.3 MHz fIN = 100.3 MHz 25°C 25°C 25°C Full 25°C 25°C fIN = 250.3 MHz fIN = 450.3 MHz EFFECTIVE NUMBER OF BITS (ENOB) fIN = 30.3 MHz fIN = 70.3 MHz fIN = 100.3 MHz fIN = 250.3 MHz fIN = 450.3 MHz WORST HARMONIC (SECOND or THIRD) fIN = 30.3 MHz fIN = 70.3 MHz fIN = 100.3 MHz fIN = 250.3 MHz fIN = 450.3 MHz SFDR fIN = 30.3 MHz fIN = 70.3 MHz fIN = 100.3 MHz fIN = 250.3 MHz fIN = 450.3 MHz WORST OTHER HARMONIC (SFDR EXCLUDING SECOND and THIRD) fIN = 30.3 MHz fIN = 70.3 MHz fIN = 100.3 MHz fIN = 250.3 MHz fIN = 450.3 MHz TWO-TONE IMD fIN1 = 119.5 MHz, fIN2 = 122.5 MHz ANALOG INPUT BANDWIDTH Full Power 1 2 Min Typ Max 47.0 47.0 47.0 Unit dBFS dBFS dBFS dBFS dBFS dBFS 46.5 47.0 46.9 47.0 47.0 47.0 47.0 46.9 dBFS dBFS dBFS dBFS dBFS dBFS 25°C 25°C 25°C 25°C 25°C 7.5 7.5 7.5 7.5 7.5 Bits Bits Bits Bits Bits 25°C 25°C 25°C Full 25°C 25°C −87 −86 −87 dBc dBc dBc dBc dBc dBc 25°C 25°C 25°C Full 25°C 25°C 82 81 82 46.4 −75 83 70 dBc dBc dBc dBc dBc dBc 75 79 70 25°C 25°C 25°C Full 25°C 25°C −82 −81 −82 79 77 dBc dBc dBc dBc dBc dBc 25°C −77 dBc 25°C 1 GHz −75 All ac specifications tested by driving CLK+ and CLK− differentially. See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed. Rev. A | Page 4 of 24 AD9484 DIGITAL SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted. Table 3. Parameter 1 CLOCK INPUTS Logic Compliance Internal Common-Mode Bias Differential Input Voltage High Level Input (VIH) Low Level Input (VIL) High Level Input Current (IIH) Low Level Input Current (IIL) Input Resistance (Differential) Input Capacitance LOGIC INPUTS Logic 1 Voltage Logic 0 Voltage Logic 1 Input Current (SDIO, CSB) Logic 0 Input Current (SDIO, CSB) Logic 1 Input Current (SCLK, PDWN) Logic 0 Input Current (SCLK, PDWN) Input Capacitance LOGIC OUTPUTS 2 VOD Differential Output Voltage VOS Output Offset Voltage Output Coding 1 2 Temp Min Full Full Typ Max CMOS/LVDS/LVPECL 0.9 Full Full Full Full Full Full 0.2 −1.8 −10 −10 8 Full Full Full Full Full Full Full 0.8 × DRVDD Full Full 247 1.125 10 4 1.8 −0.2 +10 +10 12 0.2 × DRVDD 0 −60 50 0 4 454 1.375 Unit V V p-p V p-p μA μA kΩ pF V V μA μA μA μA pF mV V See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed. LVDS RTERMINATION = 100 Ω. Rev. A | Page 5 of 24 AD9484 SWITCHING SPECIFICATIONS AVDD = 1.8 V, DRVDD = 1.8 V, TMIN = −40°C, TMAX = +85°C, fIN = −1.0 dBFS, full scale = 1.5 V, unless otherwise noted. Table 4. Parameter Maximum Conversion Rate Minimum Conversion Rate CLK+ Pulse Width High (tCH) 1 CLK+ Pulse Width Low (tCL)1 Output (LVDS—SDR)1 Data Propagation Delay (tPD) Rise Time (tR) (20% to 80%) Fall Time (tF) (20% to 80%) DCO Propagation Delay (tCPD) Data to DCO Skew (tSKEW) Latency Aperture Time (tA) Aperture Uncertainty (Jitter, tJ) 1 Temp Full Full Full Full Min 500 Typ 50 11 11 0.9 0.9 Full 25°C 25°C Full Full Full 25°C 25°C Max 0.85 0.15 0.15 0.6 −0.07 +0.07 15 0.85 80 Unit MSPS MSPS ns ns ns ns ns ns ns Clock cycles ns fs rms See Figure 2. Timing Diagram N–1 tA N+4 N+5 N N+3 VIN+, VIN– N+1 tCH tCL N+2 1/fS CLK+ CLK– tCPD DCO+ DCO– tSKEW tPD N – 15 N – 14 Dx– Figure 2. Timing Diagram Rev. A | Page 6 of 24 N – 13 N – 12 N – 11 09615-002 Dx+ AD9484 ABSOLUTE MAXIMUM RATINGS Table 5. Parameter Electrical AVDD to AGND DRVDD to DRGND AGND to DRGND AVDD to DRVDD D0+/D0− through D7+/D7− to DRGND DCO+, DCO− to DRGND OR+, OR− to DRGND CLK+ to AGND CLK− to AGND VIN+ to AGND VIN− to AGND SDIO/DCS to DRGND PDWN to AGND CSB to AGND SCLK/DFS to AGND CML to AGND VREF to AGND Environmental Storage Temperature Range Operating Temperature Range Lead Temperature (Soldering, 10 sec) Junction Temperature Rating −0.3 V to +2.0 V −0.3 V to +2.0 V −0.3 V to +0.3 V −2.0 V to +2.0 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to DRVDD + 0.2 V −0.3 V to AVDD + 0.2 V −0.3 V to AVDD + 0.2 V −65°C to +125°C −40°C to +85°C 300°C Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational section of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. THERMAL RESISTANCE The exposed paddle must be soldered to the ground plane for the LFCSP package. Soldering the exposed paddle to the PCB increases the reliability of the solder joints, maximizing the thermal capability of the package. Table 6. Package Type 56-Lead LFCSP_VQ (CP-56-5) θJA 23.7 θJC 1.7 Unit °C/W Typical θJA and θJC are specified for a 4-layer board in still air. Airflow increases heat dissipation, effectively reducing θJA. In addition, metal in direct contact with the package leads from metal traces, through holes, ground, and power planes reduces the θJA. ESD CAUTION 150°C Rev. A | Page 7 of 24 AD9484 56 55 54 53 52 51 50 49 48 47 46 45 44 43 DNC DNC DNC DNC DNC DNC DCO+ DCO– DRGND DRVDD AVDD CLK– CLK+ AVDD PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 9 10 11 12 13 14 PIN 1 INDICATOR AD9484 TOP VIEW (Not to Scale) PIN 0 (EXPOSED PADDLE) = AGND 42 41 40 39 38 37 36 35 34 33 32 31 30 29 AVDD AVDD CML AVDD AVDD AVDD VIN– VIN+ AVDD AVDD AVDD VREF AVDD PWDN NOTES 1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THIS PIN. 2. AGND AND DRGND SHOULD BE TIED TO A COMMON QUIET GROUND PLANE. 3. THE EXPOSED PADDLE MUST BE SOLDERED TO A GROUND PLANE. 09615-003 D5– D5+ D6– D6+ D7– D7+ OR– OR+ DRGND DRVDD SDIO SCLK/DFS CSB DNC 15 16 17 18 19 20 21 22 23 24 25 26 27 28 DNC DNC D0– D0+ D1– D1+ DRVDD DRGND D2– D2+ D3– D3+ D4– D4+ Figure 3. Pin Configuration Table 7. Pin Function Descriptions Pin No. 0 30, 32 to 34, 37 to 39, 41 to 43, 46 7, 24, 47 8, 23, 48 35 36 40 Mnemonic AGND 1 AVDD Description Analog Ground. The exposed paddle must be soldered to a ground plane. 1.8 V Analog Supply. DRVDD DRGND1 VIN+ VIN− CML 44 45 31 1, 2, 28, 51 to 56 25 26 27 29 49 50 3 4 5 6 9 10 11 12 13 CLK+ CLK− VREF DNC SDIO SCLK/DFS CSB PWDN DCO− DCO+ D0− D0+ D1− D1+ D2− D2+ D3− D3+ D4− 1.8 V Digital Output Supply. Digital Output Ground. Analog Input—True. Analog Input—Complement. Common-Mode Output. Enabled through the SPI, this pin provides a reference for the optimized internal bias voltage for VIN+/VIN−. Clock Input—True. Clock Input—Complement. Voltage Reference Internal/Input/Output. Nominally 0.75 V. Do Not Connect. Do not connect to this pin. This pin should be left floating. Serial Port Interface (SPI) Data Input/Output. Serial Port Interface Clock (Serial Port Mode)/Data Format Select (External Pin Mode). Serial Port Chip Select (Active Low). Chip Power-Down. Data Clock Output—Complement. Data Clock Output—True. D0 Complement Output (LSB). D0 True Output (LSB). D1 Complement Output. D1 True Output. D2 Complement Output. D2 True Output. D3 Complement Output. D3 True Output. D4 Complement Output. Rev. A | Page 8 of 24 AD9484 Pin No. 14 15 16 17 18 19 20 21 22 1 Mnemonic D4+ D5− D5+ D6− D6+ D7− D7+ OR− OR+ Description D4 True Output. D5 Complement Output. D5 True Output. D6 Complement Output. D6 True Output. D7 Complement Output (MSB). D7 True Output (MSB). Overrange Complement Output. Overrange True Output. Tie AGND and DRGND to a common quiet ground plane. Rev. A | Page 9 of 24 AD9484 TYPICAL PERFORMANCE CHARACTERISTICS AVDD = 1.8 V, DRVDD = 1.8 V, rated sample rate, TA = 25°C, 1.5 V p-p differential input, AIN = −1 dBFS, unless otherwise noted. 0 0 –10 AMPLITUDE (dBFS) –40 –50 –60 –70 –40 –50 –60 –70 –80 –90 –90 0 20 40 60 80 100 120 140 160 180 200 220 240 FREQUENCY (MHz) –100 0 20 40 60 80 100 120 140 160 180 200 220 240 FREQUENCY (MHz) Figure 4. 64k Point Single-Tone FFT; 500 MSPS, 30.3 MHz Figure 7. 64k Point Single-Tone FFT; 500 MSPS, 270.3 MHz 0 0 500MSPS 100.3MHz AT –1.0dBFS SNR: 46.0dB ENOB: 7.5 BITS SFDR: 83dBc –10 –20 –20 AMPLITUDE (dBFS) –30 –40 –50 –60 –70 –30 –40 –50 –60 –70 –90 –100 0 20 40 60 80 100 120 140 160 180 200 220 240 FREQUENCY (MHz) 09615-107 –90 Figure 5. 64k Point Single-Tone FFT; 500 MSPS, 100.3 MHz 0 20 40 60 80 100 120 140 160 180 200 220 240 FREQUENCY (MHz) Figure 8. 64k Point Single-Tone FFT; 500 MSPS, 450.3 MHz 85 0 500MSPS 140.3MHz AT –1.0dBFS SNR: 46.0dB ENOB: 7.5 BITS SFDR: 82dBc –10 –20 SFDR (dBc), TA = +25°C 80 75 SFDR (dBc), TA = +85°C SNR/SFDR (dB) –30 09615-110 –80 –100 –40 –50 –60 –70 70 SFDR (dBc), TA = –40°C 65 60 55 SNR (dBFS), TA = –40°C SNR (dBFS), TA = +25°C SNR (dBFS), TA = +85°C 50 –80 20 40 60 80 100 120 140 160 180 200 220 240 FREQUENCY (MHz) Figure 6. 64k Point Single-Tone FFT; 500 MSPS, 140.3 MHz 40 09615-108 0 0 100 200 300 400 ANALOG INPUT FREQUECY (MHz) 500 09615-111 45 –90 –100 500MSPS 450.3MHz AT –1.0dBFS SNR: 45.9dB ENOB: 7.5 BITS SFDR: 70dBc –10 –80 AMPLITUDE (dBFS) –30 –80 –100 AMPLITUDE (dBFS) –20 –30 09615-106 AMPLITUDE (dBFS) –20 500MSPS 270.3MHz AT –1.0dBFS SNR: 46.0dB ENOB: 7.5 BITS SFDR: 79dBc –10 09615-109 500MSPS 30.3MHz AT –1.0dBFS SNR: 46.0dB ENOB: 7.5 BITS SFDR: 82dBc Figure 9. Single-Tone SNR/SFDR vs. Input Frequency (fIN) and Temperature; 500 MSPS Rev. A | Page 10 of 24 AD9484 85 0.10 SFDR (dBc), 30.3MHz 0.08 80 75 0.06 SFDR (dBc), 100.3MHz 0.04 DNL (LSB) 65 60 55 –0.06 45 –0.08 50 100 150 200 250 300 350 400 SAMPLE RATE (MSPS) 450 500 –0.10 09615-112 40 0 –0.02 –0.04 SNR (dBFS), 30.3MHz SNR (dBFS), 100.3MHz 50 0.02 550 0 64 Figure 10. SNR/SFDR vs. Sample Rate; 30.3 MHz, 100.3 MHz 128 OUTPUT CODE 192 09615-115 SNR/SFDR (dB) 70 256 Figure 13. DNL, 500 MSPS 4.0 100 0.29 LSB rms 90 SFDR (dBFS) 3.5 80 3.0 NUMBER OF HITS (M) SFDR (dBc) 60 SNR (dBFS) 50 40 30 2.0 1.5 1.0 SNR (dB) 20 2.5 –45 –40 –35 –30 –25 –20 –15 –10 –5 0 AMPLITUDE (dB) 0 09615-211 0 –50 N–3 –10 0.06 –20 0.04 –30 AMPLITUDE (dBFS) 0 0.08 0.02 0 –0.02 –0.04 256 N+3 Figure 12. INL, 500 MSPS 500MSPS 119.5MHz AT –7.0dBFS 122.5MHz AT –7.0dBFS SFDR: 77dBc –70 –90 192 N+2 –60 –80 128 OUTPUT CODE N+1 –50 –0.08 64 N BINS –40 –0.06 09615-114 INL (LSB) 0.10 0 N–1 Figure 14. Grounded Input Histogram, 500 MSPS Figure 11. SNR/SFDR vs. Input Amplitude; 500 MSPS,140.3 MHz –0.10 N–2 09615-116 0.5 10 –100 0 20 40 60 80 100 120 140 160 180 200 220 240 FREQUENCY (MHz) Figure 15. 64k Point, Two-Tone FFT; 500 MSPS, 119.2 MHz, 122.5 MHz Rev. A | Page 11 of 24 09615-215 SNR/SFDR (dB) 70 AD9484 80 100 IMD3 (dBFS) 90 75 70 80 SFDR (dBc) SFDR (dBFS) 65 SFDR (dB) 60 50 40 SFDR (dBc) 20 40 10 35 –70 –60 –50 –40 –30 –20 –10 0 30 500 09615-118 –80 SFDR (dBc) 80 SNR/SFDR (dB) 70 60 SNR (dBFS) 1.6 1.7 1.8 1.9 2.0 VCM (V) 09615-119 40 30 1.5 Figure 17. SNR/SFDR vs. Common-Mode Voltage; 500 MSPS, AIN = 140.3 MHz 350 700 IAVDD 500 200 400 300 150 POWER (mW) 600 200 100 0 SAMPLE RATE (MSPS) 09615-120 50 IDRVDD 50 75 100 125 150 175 200 225 250 275 300 325 350 375 400 425 450 475 500 525 550 CURRENT (mA) 800 TOTAL POWER 600 700 800 900 1000 Figure 19. SNR/SFDR at 500 MSPS; AIN Sweep at −1.0 dBFS 90 50 SNR (dBFS) FREQUENCY (MHz) Figure 16. Two-Tone SFDR vs. Input Amplitude; 500 MSPS, 119.5 MHz, 122.5 MHz 100 50 45 AMPLITUDE (dBFS) 250 55 30 0 –90 300 60 Figure 18. Current and Power vs. Sample Rate, AIN = 30.3 MHz Rev. A | Page 12 of 24 09615-121 SNR/SFDR (dB) 70 AD9484 EQUIVALENT CIRCUITS AVDD DRVDD AVDD AVDD 0.9V 15kΩ CLK+ DRVDD 15kΩ CLK– 30kΩ DRVDD 350Ω 09615-009 09615-006 CSB Figure 20. Clock Inputs Figure 24. Equivalent CSB Input Circuit VBOOST AVDD DRVDD CML V+ V– Dx– AVDD Dx+ V– V+ 09615-010 VIN+ AIN+ 500Ω AVDD SPI CONTROLLED DC Figure 25. LVDS Outputs (Dx+, Dx−, OR+, OR−, DCO+, DCO−) 500Ω AVDD VIN+ AIN– 20kΩ (00) 09615-007 (01) VREF (10) Figure 21. Analog Input DC Equivalent Circuit (VCML = ~1.7 V) NOT USED (11) DRVDD DRVDD SCLK/DFS 350Ω 09615-011 SPI CTRL VREF SELECT 00 = INTERNAL VREF 01 = IMPORT VREF 10 = EXPORT VREF 11 = NOT USED Figure 26. Equivalent VREF Input/Output Circuit 09615-008 30kΩ DRVDD DRVDD Figure 22. Equivalent SCLK/DFS, PDWN Input Circuit 30kΩ 350Ω VIN+ SDIO CTRL Figure 23. Analog Input AC EquivalentCircuit Figure 27. Equivalent SDIO Input Circuit Rev. A | Page 13 of 24 09615-012 VIN– 1kΩ 09615-025 1.3pF AD9484 THEORY OF OPERATION The input stage contains a differential SHA that can be ac- or dc-coupled in differential or single-ended mode. The output staging block aligns the data, carries out the error correction, and passes the data to the output buffers. The output buffers are powered from a separate supply, allowing adjustment of the output voltage swing. During power-down, the output buffers enter a high impedance state. ANALOG INPUT AND VOLTAGE REFERENCE The analog input to the AD9484 is a differential buffer. For best dynamic performance, match the source impedances driving VIN+ and VIN− such that common-mode settling errors are symmetrical. The analog input is optimized to provide superior wideband performance and requires that the analog inputs be driven differentially. SNR and SINAD performance degrades significantly if the analog input is driven with a single-ended signal. Optimum performance is achieved while driving the AD9484 in a differential input configuration. For baseband applications, the AD8138 differential driver provides excellent performance and a flexible interface to the ADC. The output common-mode voltage of the AD8138 is easily set to AVDD/2 + 0.5 V, and the driver can be configured in a Sallen-Key filter topology to provide band limiting of the input signal. 1V p-p 499Ω 523Ω AVDD VIN+ 33Ω 499Ω AD8138 20pF 0.1µF AD9484 VIN– 33Ω CML 499Ω Figure 28. Differential Input Configuration Using the AD8138 At input frequencies in the second Nyquist zone and above, the performance of most amplifiers may not be adequate to achieve the true performance of the AD9484. This is especially true in IF undersampling applications where frequencies in the 70 MHz to 100 MHz range are being sampled. For these applications, differential transformer coupling is the recommended input configuration. The signal characteristics must be considered when selecting a transformer. Most RF transformers saturate at frequencies below a few megahertz (MHz), and excessive signal power can cause core saturation, which leads to distortion. In any configuration, the value of the shunt capacitor, C (see Figure 30), is dependent on the input frequency and may need to be reduced or removed. A wideband transformer, such as Mini-Circuits® ADT1-1WT, can provide the differential analog inputs for applications that require a single-ended-to-differential conversion. Both analog inputs are self-biased by an on-chip reference to a nominal 1.7 V. An internal differential voltage reference creates positive and negative reference voltages that define the 1.5 V p-p fixed span of the ADC core. This internal voltage reference can be adjusted by means of SPI control. See the AD9484 Configuration Using the SPI section for more details. 49.9Ω 09615-013 Each stage of the pipeline, excluding the last, consists of a low resolution flash ADC connected to a switched capacitor DAC and interstage residue amplifier (MDAC). The residue amplifier magnifies the difference between the reconstructed DAC output and the flash input for the next stage in the pipeline. One bit of redundancy is used in each stage to facilitate digital correction of flash errors. The last stage simply consists of a flash ADC. Differential Input Configurations 15Ω 1.5V p-p 50Ω 2pF VIN+ AD9484 VIN– 15Ω 0.1µF 09615-014 The AD9484 architecture consists of a front-end sample-andhold amplifier (SHA) followed by a pipelined switched capacitor ADC. The quantized outputs from each stage are combined into a final 8-bit result in the digital correction logic. The pipelined architecture permits the first stage to operate on a new input sample, whereas the remaining stages operate on preceding samples. Sampling occurs on the rising edge of the clock. Figure 29. Differential Transformer—Coupled Configuration As an alternative to using a transformer-coupled input at frequencies in the second Nyquist zone, the AD8352 differential driver can be used (see Figure 30). Rev. A | Page 14 of 24 AD9484 VCC 0.1µF 0.1µF 0Ω 16 8, 13 1 ANALOG INPUT 11 0.1µF R 2 VIN+ 200Ω RD AD8352 RG 3 200Ω 0.1µF AD9484 C R VIN– CML 4 ANALOG INPUT 5 14 0.1µF 0Ω 10 0.1µF 0.1µF 09615-015 CD Figure 30. Differential Input Configuration Using the AD8352 AD9510/AD9511/ AD9512/AD9513/ AD9514/AD9515 CLOCK INPUT 50Ω1 0.1µF 0.1µF CLK+ CLK 0.1µF 100Ω PECL DRIVER 0.1µF CLK 240Ω 50Ω1 ADC AD9484 CLK– 240Ω 09615-017 CLOCK INPUT 150Ω RESISTORS ARE OPTIONAL. Figure 31. Differential PECL Sample Clock AD9510/AD9511/ AD9512/AD9513/ AD9514/AD9515 CLOCK INPUT 50Ω1 0.1µF 0.1µF CLK+ CLK 0.1µF 100Ω LVDS DRIVER 0.1µF CLK ADC AD9484 CLK– 50Ω1 09615-018 CLOCK INPUT 150Ω RESISTORS ARE OPTIONAL. Figure 32. Differential LVDS Sample Clock CLOCK INPUT CONSIDERATIONS Figure 33 shows one preferred method for clocking the AD9484. The low jitter clock source is converted from single-ended to differential using an RF transformer. The back-to-back Schottky diodes across the secondary transformer limit clock excursions into the AD9484 to approximately 0.8 V p-p differential. This helps prevent the large voltage swings of the clock from feeding through to other portions of the AD9484 and preserves the fast rise and fall times of the signal, which are critical to low jitter performance. 0.1µF CLOCK INPUT 50Ω MINI-CIRCUITS ADT1–1WT, 1:1Z 0.1µF XFMR CLK+ ADC 100Ω 0.1µF AD9484 CLK– 0.1µF SCHOTTKY DIODES: HSM2812 09615-016 For optimum performance, drive the AD9484 sample clock inputs (CLK+ and CLK−) with a differential signal. This signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer or capacitors. These pins are biased at ~0.9 V internally and require no additional bias. If the clock signal is dc-coupled, then the common-mode voltage should remain within a range of 0.9 V. Figure 33. Transformer-Coupled Differential Clock If a low jitter clock is available, another option is to ac couple a differential PECL signal to the sample clock input pins, as shown in Figure 31. The AD9510/AD9511/AD9512/AD9513/ AD9514/AD9515 family of clock drivers offers excellent jitter performance. In some applications, it may be acceptable to drive the sample clock inputs with a single-ended 1.8 V CMOS signal. In such applications, drive the CLK+ pin directly from a CMOS gate, and bypass the CLK− pin to ground with a 0.1 μF capacitor in parallel with a 39 kΩ resistor (see Figure 34). Rev. A | Page 15 of 24 AD9484 130 VCC CLOCK INPUT 50Ω1 1kΩ AD951x CMOS DRIVER OPTIONAL 0.1µF 100Ω 110 CLK+ ADC AD9484 1kΩ CLK– RESISTOR IS OPTIONAL. 09615-024 0.1µF 150Ω RMS CLOCK JITTER REQUIREMENT 120 SNR (dB) 0.1µF Figure 34. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz) 100 16 BITS 90 14 BITS 80 12 BITS 70 10 BITS 60 0.125ps 0.25ps 0.5ps 1.0ps 2.0ps 8 BITS 50 Typical high speed ADCs use both clock edges to generate a variety of internal timing signals. As a result, these ADCs may be sensitive to clock duty cycle. A 5% tolerance is commonly required on the clock duty cycle to maintain dynamic performance characteristics. The AD9484 contains a duty cycle stabilizer (DCS) that retimes the nonsampling edge, providing an internal clock signal with a nominal 50% duty cycle. This allows a wide range of clock input duty cycles without affecting the performance of the AD9484. When the DCS is on, noise and distortion performance are nearly flat for a wide range of duty cycles. 40 POWER DISSIPATION AND POWER-DOWN MODE The duty cycle stabilizer uses a delay-locked loop (DLL) to create the nonsampling edge. As a result, any changes to the sampling frequency require approximately 15 clock cycles to allow the DLL to acquire and lock to the new rate. By asserting PDWN (Pin 29) high, the AD9484 is placed in standby mode or full power-down mode, as determined by the contents of Serial Port Register 08. Reasserting the PDWN pin low returns the AD9484 to its normal operational mode. Clock Jitter Considerations An additional standby mode is supported by means of varying the clock input. When the clock rate falls below 50 MHz, the AD9484 assumes a standby state. In this case, the biasing network and internal reference remain on, but digital circuitry is powered down. Upon reactivating the clock, the AD9484 resumes normal operation after allowing for the pipeline latency. High speed, high resolution ADCs are sensitive to the quality of the clock input. The degradation in SNR at a given input frequency (fA) due only to aperture jitter (tJ) can be calculated by SNR Degradation = 20 × log10(1/2 × π × fA × tJ) In this equation, the rms aperture jitter represents the root mean square of all jitter sources, including the clock input, analog input signal, and ADC aperture jitter specifications. IF undersampling applications are particularly sensitive to jitter (see Figure 35). Treat the clock input as an analog signal in cases where aperture jitter may affect the dynamic range of the AD9484. Separate the power supplies for clock drivers from the ADC output driver supplies to avoid modulating the clock signal with digital noise. Low jitter, crystal-controlled oscillators make the best clock sources. If the clock is generated from another type of source (by gating, dividing, or other methods), it should be retimed by the original clock at the last step. Refer to the AN-501 Application Note and the AN-756 Application Note for more in-depth information about jitter performance as it relates to ADCs (visit www.analog.com). 30 1 10 100 ANALOG INPUT FREQUENCY (MHz) 1000 09615-019 Clock Duty Cycle Considerations Figure 35. Ideal SNR vs. Input Frequency and Jitter As shown in Figure 18, the power dissipated by the AD9484 is proportional to its sample rate. The digital power dissipation does not vary much because it is determined primarily by the DRVDD supply and bias current of the LVDS output drivers. DIGITAL OUTPUTS Digital Outputs and Timing The AD9484 differential outputs conform to the ANSI-644 LVDS standard on default power-up. This can be changed to a low power, reduced signal option similar to the IEEE 1596.3 standard using the SPI. This LVDS standard can further reduce the overall power dissipation of the device, which reduces the power by ~39 mW. See the Memory Map section for more information. The LVDS driver current is derived on chip and sets the output current at each output equal to a nominal 3.5 mA. A 100 Ω differential termination resistor placed at the LVDS receiver inputs results in a nominal 350 mV swing at the receiver. The AD9484 LVDS outputs facilitate interfacing with LVDS receivers in custom ASICs and FPGAs that have LVDS capability for superior switching performance in noisy environments. Single point-to-point net topologies are recommended with a 100 Ω termination resistor placed as close to the receiver as possible. No far-end receiver termination or poor differential trace routing may result in timing errors. It is recommended that the trace length be no longer than 24 inches and that the Rev. A | Page 16 of 24 AD9484 Output Data Rate and Pinout Configuration differential output traces be kept close together and at equal lengths. An example of the LVDS output using the ANSI standard (default) data eye and a time interval error (TIE) jitter histogram with trace lengths less than 24 inches on regular FR-4 material is shown in Figure 36. Figure 37 shows an example of when the trace lengths exceed 24 inches on regular FR-4 material. Notice that the TIE jitter histogram reflects the decrease of the data eye opening as the edge deviates from the ideal position. It is up to the user to determine if the waveforms meet the timing budget of the design when the trace lengths exceed 24 inches. 14 12 400 TIE JITTER HISTOGRAM (Hits) 300 200 100 0 –100 –200 –300 –400 10 8 Out-of-Range (OR) An out-of-range condition exists when the analog input voltage is beyond the input range of the ADC. OR+ and OR− (OR±) are digital outputs that are updated along with the data output corresponding to the particular sampled input voltage. Thus, OR± has the same pipeline latency as the digital data. OR± is low when the analog input voltage is within the analog input range and high when the analog input voltage exceeds the input range, as shown in Figure 38. OR± remains high until the analog input returns to within the input range and another conversion is completed. By logically AND’ing OR± with the MSB and its complement, overrange high or underrange low conditions can be detected. 6 OR± DATA OUTPUTS 1 1111 1111 0 1111 1111 0 1111 1110 4 –FS + 1/2 LSB 2 0 0 1 –2 –1 0 1 2 0 –40 3 –20 0 20 09615-020 –500 –3 40 TIME (ps) TIME (ns) 12 400 10 TIE JITTER HISTOGRAM (Hits) 200 0 –200 –2 –1 0 1 TIME (ns) 2 3 8 Minimize the length of the output data lines and loads placed on them to reduce transients within the AD9484. These transients can degrade the dynamic performance of the converter. The AD9484 also provides a data clock output (DCO) intended for capturing the data in an external register. The data outputs are valid on the rising edge of DCO. 6 4 0 –100 Figure 38. OR± Relation to Input Voltage and Output Data The AD9484 provides latched data outputs with a pipeline delay of 15 clock cycles. Data outputs are available one propagation delay (tPD) after the rising edge of the clock signal. 2 –400 +FS +FS – 1/2 LSB TIMING 0 TIME (ps) 100 09615-021 EYE DIAGRAM: VOLTAGE (mV) 600 0000 0001 0000 0000 0000 0000 –FS –FS – 1/2 LSB Figure 36. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths Less Than 24 Inches on Standard FR-4 –600 –3 +FS – 1 LSB OR± 09615-022 EYE DIAGRAM: VOLTAGE (mV) 500 The output data of the AD9484 can be configured to drive 12 pairs of LVDS outputs at the same rate as the input clock signal (SDR mode). Figure 37. Data Eye for LVDS Outputs in ANSI Mode with Trace Lengths Greater Than 24 Inches on Standard FR-4 The format of the output data is offset binary by default. An example of the output coding format can be found in Table 11. If it is desired to change the output data format to twos complement, see the AD9484 Configuration Using the SPI section. An output clock signal is provided to assist in capturing data from the AD9484. The DCO is used to clock the output data and is equal to the sampling clock (CLK) rate. In single data rate mode (SDR), data is clocked out of the AD9484 and must be captured on the rising edge of the DCO. See the timing diagram shown in Figure 2 for more information. The lowest conversion rate of the AD9484 is 50 MSPS. At clock rates below 1 MSPS, the AD9484 assumes the standby mode. VREF The AD9484 VREF pin (Pin 31) allows the user to monitor the on-board voltage reference, or provide an external reference (requires configuration through the SPI). The three optional settings are internal VREF (pin is connected to 20 kΩ to ground), export VREF, and import VREF. Do not attach a bypass capacitor to this pin. VREF is internally compensated and additional loading may impact performance. Rev. A | Page 17 of 24 AD9484 command. This allows the serial data input/output (SDIO) pin to change direction from an input to an output. AD9484 CONFIGURATION USING THE SPI The AD9484 SPI allows the user to configure the converter for specific functions or operations through a structured register space inside the ADC. This gives the user added flexibility to customize device operation depending on the application. Addresses are accessed (programmed or readback) serially in 1-byte words. Each byte can be further divided into fields, which are documented in the Memory Map section. Data can be sent in MSB or in LSB first mode. MSB first is default on power-up and can be changed by changing the configuration register. For more information about this feature and others, see the AN-877 Application Note, Interfacing to High Speed ADCs via SPI at www.analog.com. HARDWARE INTERFACE There are three pins that define the serial port interface (SPI) to this particular ADC. They are the SCLK/DFS, SDIO and CSB pins. The SCLK/DFS (serial clock) is used to synchronize the read and write data presented the ADC. The SDIO (serial data input/output) is a dual-purpose pin that allows data to be sent to and read from the internal ADC memory map registers. The CSB is an active low control that enables or disables the read and write cycles (see Table 8). The pins described in Table 8 comprise the physical interface between the programming device of the user and the serial port of the AD9484. The SCLK pin and the CSB pin function as inputs when using the SPI interface. The SDIO pin is bidirectional, functioning as an input during the write phase and as an output during readback. This interface is flexible enough to be controlled by either PROMs or PIC® microcontrollers as well. This provides the user with an alternate method to program the ADC other than a SPI controller. Table 8. Serial Port Pins Mnemonic SCLK SDIO CSB Function SCLK (serial clock) is the serial shift clock in. SCLK is used to synchronize serial interface reads and writes. SDIO (serial data input/output) is a dual-purpose pin. The typical role for this pin is an input and output depending on the instruction being sent and the relative position in the timing frame. CSB (chip select) is an active low control that gates the read and write cycles. If the user chooses not to use the SPI interface, some pins serve a dual function and are associated with a specific function when strapped externally to AVDD or ground during device poweron. The Configuration Without the SPI section describes the strappable functions supported on the AD9484. CONFIGURATION WITHOUT THE SPI In applications that do not interface to the SPI control registers, the SCLK/DFS pin can alternately serve as a standalone CMOScompatible control pin. Connect the CSB pin to AVDD, which disables the serial port interface. The falling edge of the CSB, in conjunction with the rising edge of the SCLK, determines the start of the framing. An example of the serial timing and its definitions can be found in Figure 39 and Table 10. Table 9. Mode Selection During an instruction phase, a 16-bit instruction is transmitted. Data then follows the instruction phase and is determined by the W0 and W1 bits, which is one or more bytes of data. All data is composed of 8-bit words. The first bit of each individual byte of serial data indicates whether this is a read or write tDS tS tHIGH Mnemonic SCLK/DFS External Voltage AVDD AGND Configuration Twos complement enabled Offset binary enabled tCLK tDH tH tLOW CSB SCLK DON’T CARE R/W W1 W0 A12 A11 A10 A9 A8 A7 D5 Figure 39. Serial Port Interface Timing Diagram Rev. A | Page 18 of 24 D4 D3 D2 D1 D0 DON’T CARE 09615-023 SDIO DON’T CARE DON’T CARE AD9484 Table 10. Serial Timing Definitions Parameter tDS tDH tCLK tS tH tHIGH tLOW tEN_SDIO Minimum (ns) 5 2 40 5 2 16 16 1 tDIS_SDIO 5 Description Setup time between the data and the rising edge of SCLK Hold time between the data and the rising edge of SCLK Period of the clock Setup time between CSB and SCLK Hold time between CSB and SCLK Minimum period that SCLK should be in a logic high state Minimum period that SCLK should be in a logic low state Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK falling edge (not shown in Figure 39) Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK rising edge (not shown in Figure 39) Table 11. Output Data Format Input (V) VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− VIN+ − VIN− Condition (V) < −0.75 − 0.5 LSB = −0.75 =0 = 0.75 > 0.75 + 0.5 LSB Offset Binary Output Mode, D7± to D0± 0000 0000 0000 0000 1000 0000 1111 1111 1111 1111 Rev. A | Page 19 of 24 Twos Complement Mode, D7± to D0± 1000 0000 1000 0000 0000 0000 0111 1111 0111 1111 OR± 1 0 0 0 1 AD9484 MEMORY MAP READING THE MEMORY MAP TABLE RESERVED LOCATIONS Each row in the memory map table (see Table 12) has eight address locations. The memory map is roughly divided into three sections: chip configuration register map (Address 0x00 to Address 0x02), transfer register map (Address 0xFF), and ADC functions register map (Address 0x08 to Address 0x2A). Undefined memory locations should not be written to other than with the default values suggested in this data sheet. Addresses that have values marked as 0 should be considered reserved and have a 0 written into their registers during power-up. The Addr. (Hex) column of the memory map indicates the register address in hexadecimal, and the Default Value (Hex) column shows the default hexadecimal value that is already written into the register. The Bit 7 (MSB) column is the start of the default hexadecimal value given. For example, Hexadecimal Address 0x2A, OVR_CONFIG, has a hexadecimal default value of 0x01. This means Bit 7 = 0, Bit 6 = 0, Bit 5 = 0, Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or 0000 0001 in binary. The default value enables the OR± output. Overwriting this default so that Bit 0 = 0 disables the OR± output. For more information on this and other functions, consult the AN-877 Application Note, Interfacing to High-Speed ADCs via SPI® user manual at www.analog.com. Coming out of reset, critical registers are preloaded with default values. These values are indicated in Table 12. Other registers do not have default values and retain the previous value when exiting reset. DEFAULT VALUES LOGIC LEVELS An explanation of various registers follows: “Bit is set” is synonymous with “bit is set to Logic 1” or “writing Logic 1 for the bit.” Similarly, “clear a bit” is synonymous with “bit is set to Logic 0” or “writing Logic 0 for the bit.” Table 12. Memory Map Register Addr. (Hex) Register Name Chip Configuration Registers 00 CHIP_PORT_CONFIG 01 CHIP_ID 02 CHIP_GRADE Bit 7 (MSB) 0 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB first Soft reset 1 1 Soft reset LSB first Bit 0 (LSB) Default Value (Hex) 0 0x18 8-bit chip ID, Bits[7:0] = 0x6C 0 0 0 Speed grade: 00 = 500 MSPS Transfer Register FF DEVICE_UPDATE 0 0 0 0 0 ADC Functions Registers 08 Modes 0 0 PDWN: 0 = full (default) 1= standby 0 0 Rev. A | Page 20 of 24 Read only Default Notes/ Comments The nibbles should be mirrored by the user so that LSB or MSB first mode registers correctly, regardless of shift mode. Default is a unique chip ID, different for each device. This is a readonly register. Child ID used to differentiate graded devices. X1 X1 X1 Read only 0 0 SW transfer 0x00 Synchronously transfers data from the master shift register to the slave. Internal power-down mode: 000 = normal (power-up, default) 001 = full power-down 010 = standby 011 = normal (power-up) Note that external PDWN pin overrides this setting 0x00 Determines various generic modes of chip operation. X AD9484 Addr. (Hex) 10 Register Name Offset 0D TEST_IO (For user-defined mode only, set Bits[3:0] = 1000) 00 = Pattern 1 only 01 = toggle P1/P2 10 = toggle P1/0000 11 = toggle P1/P2/ 0000 Reset PN23 gen: 1 = on 0 = off (default) Reset PN9 gen: 1 = on 0 = off (default) 0F AIN_CONFIG 0 0 0 0 14 OUTPUT_MODE 0 0 0 15 OUTPUT_ADJUST 0 0 0 Output enable: 0= enable (default) 1= disable 0 16 OUTPUT_PHASE 0 0 0 17 FLEX_OUTPUT_DELAY Output clock polarity 1= inverted 0= normal (default) 0 0 0 0 Bit 7 (MSB) Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 8-bit device offset adjustment [7:0] 0111 111 = +127 codes 0000 0000 = 0 codes 1000 0000 = −128 codes Bit 1 Bit 0 (LSB) Output test mode: 0000 = off (default) 0001 = midscale short 0010 = +FS short 0011 = −FS short 0100 = checker board output 0101 = PN23 sequence 0110 = PN9 0111 = one/zero word toggle 1000 = user defined 1001 = unused 1010 = unused 1011 = unused 1100 = unused (Format determined by OUTPUT_MODE) 0 0 0 Analog input disable: 1 = on 0 = off (default) Data format select: 0 Output 00 = offset binary invert: (default) 1 = on 01 = twos 0 = off complement (default) 10 = Gray code LVDS course adjust: 0= 3.5 mA (default) 1= 2.0 mA 0 Rev. A | Page 21 of 24 0 LVDS fine adjust: 001 = 3.50 mA 010 = 3.25 mA 011 = 3.00 mA 100 = 2.75 mA 101 = 2.50 mA 110 = 2.25 mA 111 = 2.00 mA 0 0 Output clock delay: 0000 = 0 0001 = −1/10 0010 = −2/10 0011 = −3/10 0100 = reserved 0101 = +5/10 0110 = +4/10 0111 = +3/10 1000 = +2/10 1001 = +1/10 Default Value (Hex) 0x00 0x00 Default Notes/ Comments Device offset trim: codes are relative to the output resolution. When set, the test data is placed on the output pins in place of normal data. Set pattern values: P1 = Reg 0x19, Reg 0x1A P2 = Reg 0x1B, Reg 0x1C 0x00 0x00 0 0x00 0 0x00 0x00 Shown as fractional value of sampling clock period that is subtracted or added to initial tSKEW, see Figure 2. AD9484 Addr. (Hex) 18 Register Name FLEX_VREF 19 USER_PATT1_LSB 1A USER_PATT1_MSB 1B USER_PATT2_LSB 1C USER_PATT2_MSB 2A 2C 1 Bit 7 (MSB) Bit 6 VREF select 00 = internal VREF (20 kΩ pull-down) 01 = import VREF (0.59 V to 0.8 V on VREF pin) 10 = export VREF (from internal reference) 11 = not used Bit 5 0 Bit 4 Bit 3 Bit 2 Bit 1 Input voltage range setting: 11100 = 1.60 11101 = 1.58 11110 = 1.55 11111 = 1.52 00000 = 1.50 00001 = 1.47 00010 = 1.44 00011 = 1.42 00100 = 1.39 00101 = 1.36 00110 = 1.34 00111 = 1.31 01000 = 1.28 01001 = 1.26 01010 = 1.23 01011= 1.20 01011= 1.18 Bit 0 (LSB) B7 B6 B5 B4 B3 B2 B1 B0 B7 B6 B5 B4 B3 B2 B1 B0 B7 B6 B5 B4 B3 B2 B1 B0 B7 B6 B5 B4 B3 B2 B1 B0 OVR_CONFIG 0 0 0 0 0 0 0 Input coupling 0 0 0 0 0 DC coupling enable 0 OR± enable: 1 = on (default) 0 = off 0 X = don’t care. Rev. A | Page 22 of 24 Default Value (Hex) 0x00 0x00 0x00 0x00 0x00 Default Notes/ Comments User-defined pattern, 1 LSB. User-defined pattern, 1 MSB. User-defined pattern, 2 LSBs. User-defined pattern, 2 MSBs. 0x01 0x00 Default is ac coupling. AD9484 OUTLINE DIMENSIONS 8.10 8.00 SQ 7.90 0.30 0.23 0.18 0.60 MAX 0.60 MAX 43 56 42 PIN 1 INDICATOR 7.85 7.75 SQ 7.65 PIN 1 INDICATOR 1 0.50 BSC EXPOSED PAD 5.25 5.10 SQ 4.95 14 29 1.00 0.85 0.80 12° MAX 0.80 MAX 0.65 TYP 28 15 BOTTOM VIEW 0.05 MAX 0.02 NOM COPLANARITY 0.20 REF 0.08 SEATING PLANE 0.25 MIN 6.50 REF FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-VLLD-2 081809-B TOP VIEW 0.50 0.40 0.30 Figure 40. 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 8 mm × 8 mm Body, Very Thin Quad (CP-56-5) Dimensions shown in millimeters ORDERING GUIDE Model 1 AD9484BCPZ-500 AD9484BCPZRL7-500 AD9484-500EBZ 1 Temperature Range −40°C to +85°C −40°C to +85°C Package Description 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 56-Lead Lead Frame Chip Scale Package [LFCSP_VQ] Evaluation Board Z = RoHS Compliant Part. Rev. A | Page 23 of 24 Package Option CP-56-5 CP-56-5 AD9484 NOTES ©2011 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D09615-0-6/11(A) Rev. A | Page 24 of 24
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