Continuous Rate 12.3 Mb/s to 2.7 Gb/s Clock and
Data Recovery IC with Integrated Limiting Amp
ADN2812
Data Sheet
FEATURES
GENERAL DESCRIPTION
Serial data input: 12.3 Mb/s to 2.7 Gb/s
Exceeds SONET requirements for jitter transfer/
generation/tolerance
Quantizer sensitivity: 6 mV typical
Adjustable slice level: ±100 mV
Patented clock recovery architecture
Loss of signal (LOS) detect range: 3 mV to 15 mV
Independent slice level adjust and LOS detector
No reference clock required
Loss of lock indicator
I2C interface to access optional features
Single-supply operation: 3.3 V
Low power: 750 mW typical
5 mm × 5 mm 32-lead LFCSP
The ADN2812 provides the receiver functions of quantization,
signal level detect, and clock and data recovery for continuous
data rates from 12.3 Mb/s to 2.7 Gb/s. The ADN2812 automatically locks to all data rates without the need for an external
reference clock or programming. All SONET jitter requirements
are met, including jitter transfer, jitter generation, and jitter
tolerance. All specifications are quoted for −40°C to +85°C
ambient temperature, unless otherwise noted.
This device, together with a PIN diode and a TIA preamplifier,
can implement a highly integrated, low cost, low power fiber
optic receiver.
The receiver front end, loss of signal (LOS) detector circuit
indicates when the input signal level has fallen below a useradjustable threshold. The LOS detect circuit has hysteresis to
prevent chatter at the output.
APPLICATIONS
SONET OC-1/OC-3/OC-12/OC-48 and all associated FEC rates
Fibre Channel, 2× Fibre Channel, GbE, HDTV
WDM transponders
Regenerators/repeaters
Test equipment
Broadband cross-connects and routers
The ADN2812 is available in a compact 5 mm × 5 mm 32-lead
lead frame chip scale package (LFCSP).
FUNCTIONAL BLOCK DIAGRAM
REFCLKP/N
(OPTIONAL)
LOL
2
SLICEP/N
CF1
CF2
FREQUENCY
DETECT
LOOP
FILTER
PHASE
DETECT
LOOP
FILTER
VCC
VEE
PIN
NIN
QUANTIZER
PHASE
SHIFTER
VCO
VREF
DATA
RE-TIMING
2
2
THRADJ
LOS
DATAOUTP/N
04228-001
LOS
DETECT
CLKOUTP/N
Figure 1.
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2004–2012 Analog Devices, Inc. All rights reserved.
ADN2812
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Jitter Generation ......................................................................... 13
Applications ....................................................................................... 1
Jitter Transfer .............................................................................. 13
General Description ......................................................................... 1
Jitter Tolerance ............................................................................ 13
Functional Block Diagram .............................................................. 1
Theory of Operation ...................................................................... 14
Revision History ............................................................................... 2
Functional Description .................................................................. 16
Specifications..................................................................................... 3
Frequency Acquisition ............................................................... 16
Jitter Specifications ....................................................................... 4
Limiting Amplifier ..................................................................... 16
Output and Timing Specifications ............................................. 5
Slice Adjust .................................................................................. 16
Absolute Maximum Ratings ............................................................ 6
LOS Detector .............................................................................. 16
Thermal Characteristics .............................................................. 6
Lock Detector Operation .......................................................... 16
ESD Caution .................................................................................. 6
Harmonic Detector .................................................................... 17
Timing Characteristics ..................................................................... 7
Squelch Mode ............................................................................. 17
Pin Configuration and Function Descriptions ............................. 8
I2C Interface ................................................................................ 18
Typical Performance Characteristics ............................................. 9
Reference Clock (Optional) ...................................................... 18
I C Interface Timing and Internal Register Description ........... 10
Applications Information .............................................................. 21
Terminology .................................................................................... 12
PCB Design Guidelines ............................................................. 21
Input Sensitivity and Input Overdrive ..................................... 12
DC-Coupled Application .......................................................... 23
Single-Ended vs. Differential .................................................... 12
Coarse Data Rate Readback Look-Up Table ............................... 24
LOS Response Time ................................................................... 12
Outline Dimensions ....................................................................... 26
Jitter Specifications ......................................................................... 13
Ordering Guide .......................................................................... 26
2
REVISION HISTORY
3/12—Rev. D to Rev. E
Updated Outline Dimensions ....................................................... 26
Changes to Ordering Guide .......................................................... 26
5/10—Rev. C to Rev. D
Changes to Figure 4, Table 5 ........................................................... 8
Changes to Figure 24 ...................................................................... 21
2/09—Rev. B to Rev. C
Updated Outline Dimensions ....................................................... 26
Changes to Ordering Guide .......................................................... 26
Changes to LTR Mode Description ............................................. 19
Changes to Ordering Guide .......................................................... 26
11/04—Rev. 0 to Rev. A
Change to Specification ....................................................................3
Updated Outline Dimensions ....................................................... 26
Changes to Using the Reference Clock to Lock onto Data
Section .............................................................................................. 19
3/04—Revision 0: Initial Version
6/07—Rev. A to Rev. B
Changes to Table 1 ............................................................................ 3
Changes to Table 6 .......................................................................... 11
Rev. E | Page 2 of 28
Data Sheet
ADN2812
SPECIFICATIONS
TA = TMIN to TMAX, VCC = VMIN to VMAX, VEE = 0 V, CF = 0.47 µF, SLICEP = SLICEN = VEE, input data pattern: PRBS 223 − 1,
unless otherwise noted.
Table 1.
Parameter
QUANTIZER—DC CHARACTERISTICS
Input Voltage Range
Peak-to-Peak Differential Input
Input Common-Mode Level
Differential Input Sensitivity
Input Overdrive
Input Offset
Input RMS Noise
QUANTIZER—AC CHARACTERISTICS
Data Rate
S11
Input Resistance
Input Capacitance
QUANTIZER—SLICE ADJUSTMENT
Gain
Differential Control Voltage Input
Control Voltage Range
Slice Threshold Offset
LOSS OF SIGNAL DETECT (LOS)
Loss of Signal Detect Range
Hysteresis (Electrical)
LOS Assert Time
LOS Deassert Time
LOSS OF LOCK DETECT (LOL)
VCO Frequency Error for LOL Assert
VCO Frequency Error for LOL Deassert
LOL Response Time
ACQUISITION TIME
Lock to Data Mode
Conditions
Min
@ PIN or NIN, dc-coupled
PIN – NIN
DC-coupled (see Figure 28, Figure 29,
and Figure 30)
223 − 1 PRBS, ac-coupled, 1 BER = 1 × 10–10
(see Figure 12)
1.8
Typ
2.3
2.5
10
5
6
3
500
290
BER = 1 x 10–10
12.3
@ 2.5 GHz
Differential
Max
Unit
2.8
2.0
2.8
V
V
mV p-p
mV p-p
µV
µV rms
2700
Mb/s
dB
Ω
pF
0.125
+0.95
0.95
V/V
V
V
mV
−15
100
0.65
SLICEP – SLICEN = ±0.5 V
SLICEP – SLICEN
DC level @ SLICEP or SLICEN
0.08
−0.95
VEE
0.1
1
RThresh = 0 Ω (see Figure 5)
RThresh = 100 kΩ
OC-48
RThresh = 0 Ω
RThresh = 100 kΩ
OC-1
RThresh = 0 Ω
RThresh = 10 kΩ
DC-coupled 2
DC-coupled2
V
11
1.5
13
3
17
4.0
mV
mV
5.6
3.7
6
6
7.2
8.4
dB
dB
5.6
2.0
6
4
500
450
7.2
6.7
dB
dB
ns
ns
With respect to nominal
With respect to nominal
12.3 Mb/s
OC-12
OC-48
1000
250
4
1.0
1.0
ppm
ppm
ms
µs
µs
OC-48
OC-12
OC-3
OC-1
12.3 Mb/s
1.3
2.0
3.4
9.8
40.0
10.0
ms
ms
ms
ms
ms
ms
Optional Lock to REFCLK Mode
Rev. E | Page 3 of 28
ADN2812
Parameter
DATA RATE READBACK ACCURACY
Coarse Readback
Fine Readback
Data Sheet
Conditions
Min
See Table 14
In addition to REFCLK accuracy
Data rate ≤ 20 Mb/s
Data rate > 20 Mb/s
POWER SUPPLY VOLTAGE
POWER SUPPLY CURRENT
OPERATING TEMPERATURE RANGE
1
2
Typ
Max
10
3.0
3.3
235
–40
Unit
%
200
100
3.6
259
+85
ppm
ppm
V
mA
°C
PIN and NIN should be differentially driven and ac-coupled for optimum sensitivity.
When ac-coupled, the LOS assert and deassert time is dominated by the RC time constant of the ac coupling capacitor and the 50 Ω input termination of the
ADN2812 input stage.
JITTER SPECIFICATIONS
TA = TMIN to TMAX, VCC = VMIN to VMAX, VEE = 0 V, CF = 0.47 µF, SLICEP = SLICEN = VEE, input data pattern: PRBS 223 − 1,
unless otherwise noted.
Table 2.
Parameter
PHASE-LOCKED LOOP CHARACTERISTICS
Jitter Transfer BW
Jitter Peaking
Jitter Generation
Conditions
Min
OC-48
OC-12
OC-3
OC-48
OC-12
OC-3
OC-48, 12 kHz to 20 MHz
OC-12, 12 kHz to 5 MHz
OC-3, 12 kHz to 1.3 MHz
Jitter Tolerance
1
OC-48, 223 − 1 PRBS
600 Hz
6 kHz
100 kHz
1 MHz
20 MHz
OC-12, 223 − 1 PRBS
30 Hz 1
300 Hz1
25 kHz
250 kHz1
OC-3, 223 − 1 PRBS
30 Hz1
300 Hz1
6500 Hz
65 kHz
70
19
3.8
0.75
0.4
Max
Unit
490
71
23
0
0
0
0.001
0.02
0.001
0.01
0.001
0.01
670
108
35
0.03
0.03
0.03
0.002
0.037
0.002
0.019
0.002
0.011
kHz
kHz
kHz
dB
dB
dB
UI rms
UI p-p
UI rms
UI p-p
UI rms
UI p-p
92
45
5
1
0.6
UI p-p
UI p-p
UI p-p
UI p-p
UI p-p
100
44
2.5
1.0
UI p-p
UI p-p
UI p-p
UI p-p
50
24
3.5
1.0
UI p-p
UI p-p
UI p-p
UI p-p
Jitter tolerance of the ADN2812 at these jitter frequencies is better than what the test equipment is able to measure.
Rev. E | Page 4 of 28
Typ
Data Sheet
ADN2812
OUTPUT AND TIMING SPECIFICATIONS
Table 3.
Parameter
CML OUPUT CHARACTERISTICS
(CLKOUTP/CLKOUTN, DATAOUTP/DATAOUTN)
Single-Ended Output Swing
Differential Output Swing
Output High Voltage
Output Low Voltage
CML Outputs Timing
Rise Time
Fall Time
Setup Time
Hold Time
2
I C® INTERFACE DC CHARACTERISTICS
Input High Voltage
Input Low Voltage
Input Current
Output Low Voltage
I2C INTERFACE TIMING
SCK Clock Frequency
SCK Pulse Width High
SCK Pulse Width Low
Start Condition Hold Time
Start Condition Setup Time
Data Setup Time
Data Hold Time
SCK/SDA Rise/Fall Time
Stop Condition Setup Time
Bus Free Time Between a Stop and a Start
REFCLK CHARACTERISTICS
Input Voltage Range
Minimum Differential Input Drive
Reference Frequency
Required Accuracy
LVTTL DC INPUT CHARACTERISTICS
Input High Voltage
Input Low Voltage
Input High Current
Input Low Current
LVTTL DC OUTPUT CHARACTERISTICS
Output High Voltage
Output Low Voltage
1
Conditions
Min
Typ
Max
Unit
VSE (see Figure 3)
VDIFF (see Figure 3)
VOH
VOL
300
600
350
700
VCC − 0.6
VCC − 0.35
600
1200
VCC
VCC − 0.3
mV
mV
V
V
150
150
95
95
200
200
112
123
250
250
ps
ps
ps
ps
0.3 VCC
+10.0
0.4
V
V
µA
V
20% to 80%
80% to 20%
tS (see Figure 2), OC-48
tH (see Figure 2), OC-48
LVCMOS
VIH
VIL
VIN = 0.1 VCC or VIN = 0.9 VCC
VOL, IOL = 3.0 mA
See Figure 11
0.7 VCC
−10.0
400
tHIGH
tLOW
tHD;STA
tSU;STA
tSU;DAT
tHD;DAT
tR/tF
tSU;STO
tBUF
Optional lock to REFCLK mode
@ REFCLKP or REFCLKN
VIL
VIH
600
1300
600
600
100
300
20 + 0.1 Cb 1
600
1300
300
0
VCC
100
12.3
200
100
VIH
VIL
IIH, VIN = 2.4 V
IIL, VIN = 0.4 V
VOH, IOH = −2.0 mA
VOL, IOL = +2.0 mA
2.0
0.8
5
−5
2.4
Cb = total capacitance of one bus line in pF. If mixed with HS mode devices, faster fall-times are allowed (see Table 6).
Rev. E | Page 5 of 28
0.4
kHz
ns
ns
ns
ns
ns
ns
ns
ns
ns
V
V
mV p-p
MHz
ppm
V
V
µA
µA
V
V
ADN2812
Data Sheet
ABSOLUTE MAXIMUM RATINGS
TA = TMIN to TMAX, VCC = VMIN to VMAX, VEE = 0 V, CF = 0.47 µF,
SLICEP = SLICEN = VEE, unless otherwise noted.
Table 4.
Parameter
Supply Voltage (VCC)
Minimum Input Voltage (All Inputs)
Maximum Input Voltage (All Inputs)
Maximum Junction Temperature
Storage Temperature
Lead Temperature (Soldering 10 s)
Rating
4.2 V
VEE − 0.4 V
VCC + 0.4 V
125°C
−65°C to +150°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
Thermal Resistance
32-LFCSP, 4-layer board with exposed paddle soldered to VEE
θJA = 28°C/W.
ESD CAUTION
Rev. E | Page 6 of 28
Data Sheet
ADN2812
TIMING CHARACTERISTICS
CLKOUTP
TH
04228-002
TS
DATAOUTP/N
Figure 2. Output Timing
OUTP
VCML
VSE
OUTN
OUTP – OUTN
VDIFF
04228-003
VSE
0V
Figure 3. Single-Ended vs. Differential Output Specifications
Rev. E | Page 7 of 28
ADN2812
Data Sheet
32 VCC
31 VCC
30 VEE
29 DATAOUTP
28 DATAOUTN
27 SQUELCH
26 CLKOUTP
25 CLKOUTN
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
ADN2812*
TOP VIEW
(Not to Scale)
24 VCC
23 VEE
22 LOS
21 SDA
20 SCK
19 SADDR5
18 VCC
17 VEE
04228-004
PIN 1
INDIC ATOR
THRADJ 9
REFCLKP 10
REFCLKN 11
VCC 12
VEE 13
CF2 14
CF1 15
LOL 16
VCC 1
VCC 2
VREF 3
NIN 4
PIN 5
SLICEP 6
SLICEN 7
VEE 8
* THERE IS AN EXPOSED PAD ON THE BOTTOM OF
THE PACKAGE THAT MUST BE CONNECTED TO GND.
Figure 4. Pin Configuration
Table 5. Pin Function Descriptions
Pin No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
Exposed Pad
1
Mnemonic
VCC
VCC
VREF
NIN
PIN
SLICEP
SLICEN
VEE
THRADJ
REFCLKP
REFCLKN
VCC
VEE
CF2
CF1
LOL
VEE
VCC
SADDR5
SCK
SDA
LOS
VEE
VCC
CLKOUTN
CLKOUTP
SQUELCH
DATAOUTN
DATAOUTP
VEE
VCC
VCC
Pad
Type 1
AI
P
AO
AI
AI
AI
AI
P
AI
DI
DI
P
P
AO
AO
DO
P
P
DI
DI
DI
DO
P
P
DO
DO
DI
DO
DO
P
P
AI
P
Description
Connect to VCC.
Power for Limamp, LOS.
Internal VREF Voltage. Decouple to GND with a 0.1 µF capacitor.
Differential Data Input. CML.
Differential Data Input. CML.
Differential Slice Level Adjust Input.
Differential Slice Level Adjust Input.
GND for Limamp, LOS.
LOS Threshold Setting Resistor.
Differential REFCLK Input. 12.3 MHz to 200 MHz.
Differential REFCLK Input. 12.3 MHz to 200 MHz.
VCO Power.
VCO GND.
Frequency Loop Capacitor.
Frequency Loop Capacitor.
Loss of Lock Indicator. LVTTL active high.
FLL Detector GND.
FLL Detector Power.
Slave Address Bit 5.
I2C Clock Input.
I2C Data Input.
Loss of Signal Detect Output. Active high. LVTTL.
Output Buffer, I2C GND.
Output Buffer, I2C Power.
Differential Recovered Clock Output. CML.
Differential Recovered Clock Output. CML.
Disable Clock and Data Outputs. Active high. LVTLL.
Differential Recovered Data Output. CML.
Differential Recovered Data Output. CML.
Phase Detector, Phase Shifter GND.
Phase Detector, Phase Shifter Power.
Connect to VCC.
Connect to GND. Works as a heat sink.
P = power, AI = analog input, AO = analog output, DI = digital input, DO = digital output.
Rev. E | Page 8 of 28
Data Sheet
ADN2812
TYPICAL PERFORMANCE CHARACTERISTICS
16
1000
ADN2812 TOLERANCE
SONET REQUIREMENT MASK
SONET OBJECTIVE MASK
EQUIPMENT LIMIT
10
8
6
4
2
1
10
1k
100
RThresh (Ω)
10k
100
10
1
04228-006
JITTER AMPLITUDE (UI)
12
04228-005
TRIP POINT (mV p-p)
14
0.1
100k
1
Figure 5. LOS Comparator Trip Point Programming
10
100
1k
10k
100k
1M
JITTER FREQUENCY (Hz)
10M
Figure 6. Typical Measured Jitter Tolerance OC-48
Rev. E | Page 9 of 28
100M
ADN2812
Data Sheet
I2C INTERFACE TIMING AND INTERNAL REGISTER DESCRIPTION
1
A5
MSB = 1
SET BY
PIN 19
0
0
0
0
0
X
0 = WR
1 = RD
04228-007
R/W
CTRL.
SLAVE ADDRESS [6:0]
S
SLAVE ADDR, LSB = 0 (WR)
DATA A(S)
A(S) SUB ADDR A(S) DATA A(S)
P
04228-008
Figure 7. Slave Address Configuration
2
Figure 8. I C Write Data Transfer
SLAVE ADDR, LSB = 0 (WR) A(S) SUB ADDR
A(S) S SLAVE ADDR, LSB = 1 (RD) A(S) DATA
DATA A(M)
A(M)
P
P = STOP BIT
A(M) = LACK OF ACKNOWLEDGE BY MASTER
A(M) = ACKNOWLEDGE BY MASTER
04228-009
S
S = START BIT
A(S) = ACKNOWLEDGE BY SLAVE
Figure 9. I2C Read Data Transfer
SDA
SLAVE ADDRESS
A6
SUB ADDRESS
A5
STOP BIT
DATA
A7
A0
D7
D0
SCK
S
WR
ACK
ACK
SLADDR[4...0]
ACK
SUB ADDR[6:1]
DATA[6:1]
Figure 10. I2C Data Transfer Timing
tF
tSU;DAT
tHD;STA
tBUF
SDA
tR
tR
tSU;STO
tF
tLOW
tHIGH
tHD;STA
S
tSU;STA
S
tHD;DAT
2
Figure 11. I C Port Timing Diagram
Rev. E | Page 10 of 28
P
S
04228-011
SCK
P
04228-010
START BIT
Data Sheet
ADN2812
Table 6. Internal Register Map1
Reg. Name
FREQ0
FREQ1
FREQ2
RATE
MISC
R/W
R
R
R
R
R
Address
0x00
0x01
0x02
0x03
0x04
CTRLA
W
0x08
CTRLA_RD
CTRLB
R
W
0x05
0x09
CTRLB_RD
CTRLC
R
W
0x06
0x11
1
D7
D6
MSB
MSB
0
MSB
COARSE_RD[8] MSB
x
x
D5
D4
LOS
status
FREF range
Config
LOL
Reset
MISC[4]
System
reset
0
0
0
D3
D2
D1
Coarse data rate readback
Static
LOL
Data rate
measure
LOL
status
complete
Data rate/DIV_FREF ratio
Readback CTRLA contents
0
Reset
0
MISC[2]
Readback CTRLBcontents
0
0
Config LOS
D0
LSB
LSB
LSB
COARSE_RD[1]
COARSE_
RD[0] LSB
x
Measure
data rate
Lock to
reference
0
0
Squelch
mode
0
All writeable registers default to 0x00.
Table 7. Miscellaneous Register, MISC
D7
x
D6
x
LOS Status
D5
0 = No loss of signal
1 = Loss of signal
Static LOL
D4
0 = Waiting for next LOL
1 = Static LOL until reset
LOL Status
D3
0 = Locked
1 = Acquiring
Data Rate Measurement
Complete
D2
0 = Measuring data rate
1 = Measurement complete
D1
x
Coarse Rate
Readback LSB
D0
COARSE_RD[0]
Table 8. Control Register, CTRLA1
FREF Range
D7 D6
0
0
0
1
1
0
1
1
1
12.3 MHz to 25 MHz
25 MHz to 50 MHz
50 MHz to 100 MHz
100 MHz to 200 MHz
Data Rate/DIV_FREF Ratio
D5 D4 D3 D2
0
0
0
0
1
0
0
0
1
2
0
0
1
0
4
n
2n
1
0
0
0
256
Measure Data Rate
D1
Set to 1 to measure data rate
Lock to Reference
D0
0 = Lock to input data
1 = Lock to reference clock
Where DIV_FREF is the divided down reference referred to the 12.3 MHz to 25 MHz band (see the Reference Clock (Optional) section).
Table 9. Control Register, CTRLB
Config LOL
D7
0 = LOL pin normal operation
1 = LOL pin is static LOL
Reset MISC[4]
D6
Write a 1 followed by
0 to reset MISC[4]
System Reset
D5
Write a 1 followed by
0 to reset ADN2812
D4
Set
to 0
Reset MISC[2]
D3
Write a 1 followed by
0 to reset MISC[2]
D2
Set
to 0
D1
Set
to 0
D0
Set
to 0
Table 10. Control Register, CTRLC
D7
Set to 0
D6
Set to 0
D5
Set to 0
D4
Set to 0
D3
Set to 0
Config LOS
D2
0 = Active high LOS
1 = Active low LOS
Rev. E | Page 11 of 28
Squelch Mode
D1
0 = Squelch CLK and DATA
1 = Squelch CLK or DATA
D0
Set to 0
ADN2812
Data Sheet
TERMINOLOGY
10mV p-p
INPUT SENSITIVITY AND INPUT OVERDRIVE
VREF
OUTPUT
NOISE
1
SCOPE
PROBE
ADN2812
PIN
+
QUANTIZER
–
50Ω
50Ω
VREF
2.5V
3kΩ
04228-013
Sensitivity and overdrive specifications for the quantizer involve
offset voltage, gain, and noise. The relationship between the
logic output of the quantizer and the analog voltage input is
shown in Figure 12. For sufficiently large positive input voltage,
the output is always at Logic Level 1 and, similarly for negative
inputs, the output is always at Logic Level 0. However, the
output transitions between Logic Level 1 and Logic Level 0
are not at precisely defined input voltage levels but occur over
a range of input voltages. Within this range of input voltages,
the output might be either 1 or 0, or it might even fail to attain
a valid logic state. The width of this zone is determined by the
input voltage noise of the quantizer. The center of the zone is
the quantizer input offset voltage. Input overdrive is the magnitude of signal required to guarantee the correct logic level with
1 × 10−10 confidence level.
Figure 13. Single-Ended Sensitivity Measurement
While driving the ADN2812 differentially (see Figure 14), sensitivity seems to improve from observing the quantizer input
with an oscilloscope probe. This is an illusion caused by the use
of a single-ended probe. A 5 mV p-p signal appears to drive the
ADN2812 quantizer. However, the single-ended probe measures
only half the signal. The true quantizer input signal is twice
this value because the other quantizer input is a complementary
signal to the signal being observed.
5mV p-p
SCOPE
PROBE
VREF
0
PIN
INPUT (V p-p)
+
OVERDRIVE
NIN
04228-012
SENSITIVITY
(2⋅ OVERDRIVE)
QUANTIZER
–
Figure 12. Input Sensitivity and Input Overdrive
50Ω
VREF
SINGLE-ENDED VS. DIFFERENTIAL
VREF
3kΩ
5mV p-p
AC coupling is typically used to drive the inputs to the quantizer. The inputs are internally dc biased to a common-mode
potential of ~2.5 V. Driving the ADN2812 single-ended and
observing the quantizer input with an oscilloscope probe at the
point indicated in Figure 13 show a binary signal with an average
value equal to the common-mode potential and instantaneous
values both above and below the average value. It is convenient
to measure the peak-to-peak amplitude of this signal and call
the minimum required value the quantizer sensitivity. Referring
to Figure 13, because both positive and negative offsets need to
be accommodated, the sensitivity is twice the overdrive. The
ADN2812 quantizer typically has 6 mV p-p sensitivity.
50Ω
2.5V
04228-014
OFFSET
Figure 14. Differential Sensitivity Measurement
LOS RESPONSE TIME
Loss of signal (LOS) response time is the delay between
removal of the input signal and indication of LOS at the LOS
output, Pin 22. When the inputs are dc-coupled, the LOS assert
time of the AD2812 is 500 ns typically and the deassert time is
400 ns typically. In practice, the time constant produced by the
ac coupling at the quantizer input and the 50 Ω on-chip input
termination determines the LOS response time.
Rev. E | Page 12 of 28
Data Sheet
ADN2812
JITTER SPECIFICATIONS
The following sections briefly summarize the specifications
of jitter generation, jitter transfer, and jitter tolerance in
accordance with the GR-253-CORE from Telcordia for the
optical interface at the equipment level and the ADN2812
performance with respect to those specifications.
SLOPE = –20dB/DECADE
ACCEPTABLE
RANGE
fC
04228-015
Jitter is the dynamic displacement of digital signal edges from
their long-term average positions, measured in unit intervals
(UI), where 1 UI = 1 bit period. Jitter on the input data can
cause dynamic phase errors on the recovered clock sampling
edge. Jitter on the recovered clock causes jitter on the
retimed data.
0.1
JITTER GAIN (dB)
The ADN2812 CDR is designed to achieve the best bit-errorrate (BER) performance and exceeds the jitter transfer, generation,
and tolerance specifications proposed for SONET/SDH equipment defined in the Telcordia Technologies GR-253-CORE
document.
JITTER FREQUENCY (kHz)
Figure 15. Jitter Transfer Curve
JITTER TOLERANCE
JITTER TRANSFER
The jitter transfer function is the ratio of the jitter on the output
signal to the jitter applied on the input signal vs. the frequency.
This parameter measures the limited amount of the jitter on an
input signal that can be transferred to the output signal (see
Figure 15).
15.00
Rev. E | Page 13 of 28
SLOPE = –20dB/DECADE
1.50
0.15
f0
f1
f2
f3
JITTER FREQUENCY (kHz)
Figure 16. SONET Jitter Tolerance Mask
f4
04228-016
The jitter generation specification limits the amount of jitter
that can be generated by the device with no jitter and wander
applied at the input. For OC-48 devices, the band-pass filter
has a 12 kHz high-pass cutoff frequency with a roll-off of
20 dB/decade and a low-pass cutoff frequency of at least 20 MHz.
The jitter generated must be less than 0.01 UI rms and must be
less than 0.1 UI p-p.
INPUT JITTER AMPLITUDE (UI p-p)
JITTER GENERATION
The jitter tolerance is defined as the peak-to-peak amplitude of
the sinusoidal jitter applied on the input signal, which causes a
1 dB power penalty. This is a stress test to ensure that no additional penalty is incurred under the operating conditions (see
Figure 16).
ADN2812
Data Sheet
THEORY OF OPERATION
Another view of the circuit is that the phase shifter implements
the zero required for frequency compensation of a second-order,
phase-locked loop. This zero is placed in the feedback path and,
thus, does not appear in the closed-loop transfer function. Jitter
peaking in a conventional second-order phase-locked loop is
caused by the presence of this zero in the closed-loop transfer
function. Because this circuit has no zero in the closed-loop
transfer, jitter peaking is minimized.
The delay- and phase-loops together simultaneously provide
wide-band jitter accommodation and narrow-band jitter filtering. The linearized block diagram in Figure 17 shows that the
jitter transfer function, Z(s)/X(s), is a second-order low-pass
providing excellent filtering. Note that the jitter transfer has no
zero, unlike an ordinary second-order phase-locked loop. This
means that the main PLL loop has virtually zero jitter peaking
(see Figure 18), making this circuit ideal for signal regenerator
applications, where jitter peaking in a cascade of regenerators
can contribute to hazardous jitter accumulation.
The error transfer, e(s)/X(s), has the same high-pass form as an
ordinary phase-locked loop. This transfer function is free to be
optimized to give excellent wide-band jitter accommodation
because the jitter transfer function, Z(s)/X(s), provides the
narrow-band jitter filtering.
INPUT
DATA
X(s)
e(s)
d/sc
o/s
1/n
Z(s)
RECOVERED
CLOCK
JITTER TRANSFER FUNCTION
d = PHASE DETECTOR GAIN
o = VCO GAIN
c = LOOP INTEGRATOR
psh = PHASE SHIFTER GAIN
n = DIVIDE RATIO
Z(s)
1
=
cn
n psh
X(s)
s2
+1
+s
do
o
TRACKING ERROR TRANSFER FUNCTION
04228-017
e(s)
s2
=
d psh do
X(s)
+
s2 + s
cn
c
Figure 17. PLL/DLL Architecture
JITTER PEAKING
IN ORDINARY PLL
ADN2812
Z(s)
X(s)
o
n psh
d psh
c
04228-018
The delay- and phase-loops together track the phase of the
input data signal. For example, when the clock lags input data,
the phase detector drives the VCO to a higher frequency and
also increases the delay through the phase shifter; both these
actions serve to reduce the phase error between the clock and
data. The faster clock picks up phase, while the delayed data
loses phase. Because the loop filter is an integrator, the static
phase error is driven to zero.
psh
JITTER GAIN (dB)
The ADN2812 is a delay- and phase-locked loop circuit for
clock recovery and data retiming from an NRZ encoded data
stream. The phase of the input data signal is tracked by two
separate feedback loops that share a common control voltage.
A high speed delay-locked loop path uses a voltage controlled
phase shifter to track the high frequency components of input
jitter. A separate phase control loop, comprised of the VCO,
tracks the low frequency components of input jitter. The initial
frequency of the VCO is set by yet a third loop, which compares
the VCO frequency with the input data frequency and sets the
coarse tuning voltage. The jitter tracking phase-locked loop
controls the VCO by the fine-tuning control.
FREQUENCY (kHz)
Figure 18. Jitter Response vs. Conventional PLL
The delay- and phase-loops contribute to overall jitter accommodation. At low frequencies of input jitter on the data signal,
the integrator in the loop filter provides high gain to track large
jitter amplitudes with small phase error. In this case, the VCO
is frequency modulated and jitter is tracked as in an ordinary
phase-locked loop. The amount of low frequency jitter that
can be tracked is a function of the VCO tuning range. A wider
tuning range gives larger accommodation of low frequency
jitter. The internal loop control voltage remains small for small
phase errors, so the phase shifter remains close to the center of
its range and thus contributes little to the low frequency jitter
accommodation.
Rev. E | Page 14 of 28
Data Sheet
ADN2812
At medium jitter frequencies, the gain and tuning range of the
VCO are not large enough to track input jitter. In this case, the
VCO control voltage becomes large and saturates, and the VCO
frequency dwells at one extreme of its tuning range or the other.
The size of the VCO tuning range, therefore, has only a small
effect on the jitter accommodation. The delay-locked loop
control voltage is now larger, so the phase shifter takes on the
burden of tracking the input jitter. The phase shifter range, in
UI, can be seen as a broad plateau on the jitter tolerance curve.
The phase shifter has a minimum range of 2 UI at all data rates.
The gain of the loop integrator is small for high jitter frequencies
so that larger phase differences are needed to make the loop
control voltage big enough to tune the range of the phase
shifter. Large phase errors at high jitter frequencies cannot be
tolerated. In this region, the gain of the integrator determines
the jitter accommodation. Because the gain of the loop integrator declines linearly with frequency, jitter accommodation is
lower with higher jitter frequency. At the highest frequencies,
the loop gain is very small, and little tuning of the phase shifter
can be expected. In this case, jitter accommodation is determined
by the eye opening of the input data, the static phase error, and
the residual loop jitter generation. The jitter accommodation is
roughly 0.5 UI in this region. The corner frequency between the
declining slope and the flat region is the closed loop bandwidth
of the delay-locked loop, which is roughly 3 MHz at OC-48.
Rev. E | Page 15 of 28
ADN2812
Data Sheet
FUNCTIONAL DESCRIPTION
Once LOL is deasserted, the frequency-locked loop is turned
off. The PLL/DLL pulls in the VCO frequency the rest of the
way until the VCO frequency equals the data frequency.
The frequency loop requires a single external capacitor between
CF2 and CF1 (Pin 14 and Pin 15). A 0.47 µF ± 20%, X7R ceramic
chip capacitor with 300MΩ
INSULATION RESISTANCE
NC = NO CONNECT
0.1µF
1nF
04228-024
50Ω
SLICEN
CIN
THRADJ
TIA
LOL
PIN
SLICEP
CF1
0.1µF
CF2
NIN
VCC
VEE
VREF
1nF
VCC
0.1µF
32 31 30 29 28 27 26 25
VCC
VCC
24
1nF
0.1µF
VEE
2
23
LOS
µC
22
3
EXPOSED PAD
SDA
21
4
TIED OFF TO
I 2C
SCK
VEE PLANE
CONTROLLER
20
5
WITH VIAS
SADDR5
19
6
VCC
18
7
VEE
17
8
VCC
9 10 11 12 13 14 15 16
1nF
0.1µF
1
REFCLKN
VCC
REFCLKP
VCC
VCC
VCC
CLKOUTN
Figure 24. Typical Applications Circuit
Rev. E | Page 21 of 28
ADN2812
Data Sheet
Transmission Lines
Use of 50 Ω transmission lines is required for all high frequency
input and output signals to minimize reflections: PIN, NIN,
CLKOUTP, CLKOUTN, DATAOUTP, DATAOUTN (also
REFCLKP, REFCLKN, if a high frequency reference clock is
used, such as 155 MHz). It is also necessary for the PIN/NIN
input traces to be matched in length and the CLKOUTP/
CLKOUTN and DATAOUTP/DATAOUTN output traces to
be matched in length to avoid skew between the differential
traces. All high speed CML outputs, CLKOUTP/CLKOUTN
and DATAOUTP/DATAOUTN, also require 100 Ω back
termination chip resistors connected between the output pin
and VCC. These resistors should be placed as close as possible
to the output pins. These 100 Ω resistors are in parallel with
on-chip 100 Ω termination resistors to create a 50 Ω back
termination (see Figure 25).
The high speed inputs, PIN and NIN, are internally terminated
with 50 Ω to an internal reference voltage (see Figure 26). A 0.1 µF
is recommended between VREF (Pin 3) and GND to provide an
ac ground for the inputs.
As with any high speed mixed-signal design, take care to keep
all high speed digital traces away from sensitive analog nodes.
VCC
VCC
100Ω
100Ω
100Ω
0.1µF
50Ω
0.1µF
50Ω
AC coupling capacitors at the inputs (PIN, NIN) and outputs
(DATAOUTP, DATAOUTN) of the ADN2812 must be chosen
such that the device works properly over the full range of data
rates used in the application. When choosing the capacitors, the
time constant formed with the two 50 Ω resistors in the signal
path must be considered. When a large number of consecutive
identical digits (CIDs) are applied, the capacitor voltage can
droop due to baseline wander (see Figure 27), causing patterndependent jitter (PDJ).
The user must determine how much droop is tolerable and
choose an ac coupling capacitor based on that amount of
droop. The amount of PDJ can then be approximated based
on the capacitor selection. The actual capacitor value selection
may require some trade-offs between droop and PDJ.
For example, assuming that 2% droop can be tolerated, then the
maximum differential droop is 4%. Normalizing to Vpp
where:
τ is the RC time constant (C is the ac coupling capacitor,
R = 100 Ω seen by C).
t is the total discharge time, which is equal to nΤ.
n is the number of CIDs.
T is the bit period.
50Ω
ADN2812
Choosing AC Coupling Capacitors
Droop = ∆ V = 0.04 V = 0.5 Vpp (1 − e–t/τ); therefore, τ = 12t
50Ω
04228-025
100Ω
VTERM
that the solder joint size is maximized. The bottom of the chip
scale package has a central exposed pad. The pad on the printed
circuit board should be at least as large as this exposed pad. The
user must connect the exposed pad to VEE using plugged vias
so that solder does not leak through the vias during reflow. This
ensures a solid connection from the exposed pad to VEE.
VTERM
The capacitor value can then be calculated by combining the
equations for τ and t
Figure 25. Typical ADN2812 Applications Circuit
VCC
C = 12nT/R
ADN2812
CIN
PIN
50Ω
CIN
NIN
50Ω
0.1µF
VREF
Once the capacitor value is selected, the PDJ can be
approximated as
(
)
PDJ pspp = 0.5t r 1 / e ( /nT/RC ) / 0.6
50Ω
3kΩ
2.5V
04228-026
TIA
50Ω
Figure 26. ADN2812 AC-Coupled Input Configuration
Soldering Guidelines for Chip Scale Package
The leads on the 32-lead LFCSP are rectangular. The printed
circuit board pad for these should be 0.1 mm longer than the
package lead length and 0.05 mm wider than the package lead
width. The lead should be centered on the pad. This ensures
where:
PDJpspp is the amount of pattern-dependent jitter allowed;
< 0.01 UI p-p typical.
tr is the rise time, which is equal to 0.22/BW, where BW is ~ 0.7
(bit rate). This expression for tr is accurate only for the inputs.
The output rise time for the ADN2812 is ~100 ps regardless of
data rate.
Rev. E | Page 22 of 28
Data Sheet
ADN2812
VCC
V1
CIN
ADN2812
V2
PIN
TIA
V1b
50Ω
CIN V2b
COUT
+
50Ω
DATAOUTP
CDR
VREF LIMAMP
DATAOUTN
COUT
–
NIN
V1
2
1
3
4
V1b
V2
VREF
V2b
VTH
VDIFF
VDIFF = V2–V2b
VTH = ADN2812 QUANTIZER THRESHOLD
04228-027
NOTES:
1. DURING DATA PATTERNS WITH HIGH TRANSITION DENSITY, DIFFERENTIAL DC VOLTAGE AT V1 AND V2 IS ZERO.
2. WHEN THE OUTPUT OF THE TIA GOES TO CID, V1 AND V1b ARE DRIVEN TO DIFFERENT DC LEVELS. V2 AND V2b DISCHARGE TO THE
VREF LEVEL, WHICH EFFECTIVELY INTRODUCES A DIFFERENTIAL DC OFFSET ACROSS THE AC COUPLING CAPACITORS.
3. WHEN THE BURST OF DATA STARTS AGAIN, THE DIFFERENTIAL DC OFFSET ACROSS THE AC COUPLING CAPACITORS IS APPLIED TO
THE INPUT LEVELS CAUSING A DC SHIFT IN THE DIFFERENTIAL INPUT. THIS SHIFT IS LARGE ENOUGH SUCH THAT ONE OF THE STATES,
EITHER HIGH OR LOW DEPENDING ON THE LEVELS OF V1AND V1b WHEN THE TIA WENT TO CID, IS CANCELED OUT. THE QUANTIZER
DOES NOT RECOGNIZE THIS AS A VALID STATE.
4. THE DC OFFSET SLOWLY DISCHARGES UNTIL THE DIFFERENTIAL INPUT VOLTAGE EXCEEDS THE SENSITIVITY OF THE ADN2812. THE
QUANTIZER CAN RECOGNIZE BOTH HIGH AND LOW STATES AT THIS POINT.
Figure 27. Example of Baseline Wander
VPP = PIN – NIN = 2 × VSE = 10mV AT SENSITIVITY
VSE = 5mV MIN
NIN
VCM = 2.3V MIN
(DC-COUPLED)
Figure 29. Minimum Allowed DC-Coupled Input Levels
VCC
50Ω
PIN
04228-029
The inputs to the ADN2812 can be dc-coupled. This might be
necessary in burst mode applications, where there are long periods
of CIDs, and baseline wander cannot be tolerated. If the inputs
to the ADN2812 are dc-coupled, care must be taken not to
violate the input range and common-mode level requirements
of the ADN2812 (see Figure 28 through Figure 30). If dc coupling
is required, and the output levels of the TIA do not adhere to
the levels shown in Figure 29, level shifting and/or an attenuator
must be between the TIA outputs and the ADN2812 inputs.
INPUT (V)
DC-COUPLED APPLICATION
ADN2812
PIN
VPP = PIN – NIN = 2 × VSE = 2.0V MAX
PIN
NIN
50Ω
0.1µF
VREF
VSE = 1.0V MAX
50Ω
3kΩ
2.5V
INPUT (V)
50Ω
04228-028
VCM = 2.3V
(DC-COUPLED)
NIN
Figure 28. DC-Coupled Application
04228-030
TIA
Figure 30. Maximum Allowed DC-Coupled Input Levels
Rev. E | Page 23 of 28
ADN2812
Data Sheet
COARSE DATA RATE READBACK LOOK-UP TABLE
Code is the 9-bit value read back from COARSE_RD[8:0].
Table 14.
Code
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
FMID
5.1934e+06
5.1930e+06
5.2930e+06
5.3989e+06
5.5124e+06
5.6325e+06
5.7612e+06
5.8995e+06
6.0473e+06
6.2097e+06
6.3819e+06
6.5675e+06
6.7688e+06
6.9874e+06
7.2262e+06
7.4863e+06
7.4139e+06
7.4135e+06
7.5606e+06
7.7173e+06
7.8852e+06
8.0633e+06
8.2548e+06
8.4586e+06
8.6784e+06
8.9180e+06
9.1736e+06
9.4481e+06
9.7464e+06
1.0068e+07
1.0417e+07
1.0791e+07
1.0387e+07
1.0386e+07
1.0586e+07
1.0798e+07
1.1025e+07
1.1265e+07
1.1522e+07
1.1799e+07
1.2095e+07
1.2419e+07
1.2764e+07
1.3135e+07
1.3538e+07
1.3975e+07
1.4452e+07
1.4973e+07
Code
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
FMID
1.4828e+07
1.4827e+07
1.5121e+07
1.5435e+07
1.5770e+07
1.6127e+07
1.6510e+07
1.6917e+07
1.7357e+07
1.7836e+07
1.8347e+07
1.8896e+07
1.9493e+07
2.0136e+07
2.0833e+07
2.1582e+07
2.0774e+07
2.0772e+07
2.1172e+07
2.1596e+07
2.2049e+07
2.2530e+07
2.3045e+07
2.3598e+07
2.4189e+07
2.4839e+07
2.5527e+07
2.6270e+07
2.7075e+07
2.7950e+07
2.8905e+07
2.9945e+07
2.9655e+07
2.9654e+07
3.0242e+07
3.0869e+07
3.1541e+07
3.2253e+07
3.3019e+07
3.3834e+07
3.4714e+07
3.5672e+07
3.6694e+07
3.7792e+07
3.8985e+07
4.0273e+07
4.1666e+07
4.3164e+07
Code
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
Rev. E | Page 24 of 28
FMID
4.1547e+07
4.1544e+07
4.2344e+07
4.3191e+07
4.4099e+07
4.5060e+07
4.6090e+07
4.7196e+07
4.8378e+07
4.9678e+07
5.1055e+07
5.2540e+07
5.4150e+07
5.5899e+07
5.7810e+07
5.9890e+07
5.9311e+07
5.9308e+07
6.0485e+07
6.1739e+07
6.3081e+07
6.4506e+07
6.6038e+07
6.7669e+07
6.9427e+07
7.1344e+07
7.3388e+07
7.5585e+07
7.7971e+07
8.0546e+07
8.3333e+07
8.6328e+07
8.3095e+07
8.3087e+07
8.4689e+07
8.6383e+07
8.8198e+07
9.0120e+07
9.2179e+07
9.4392e+07
9.6757e+07
9.9356e+07
1.0211e+08
1.0508e+08
1.0830e+08
1.1180e+08
1.1562e+08
1.1978e+08
Code
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
FMID
1.1862e+08
1.1862e+08
1.2097e+08
1.2348e+08
1.2616e+08
1.2901e+08
1.3208e+08
1.3534e+08
1.3885e+08
1.4269e+08
1.4678e+08
1.5117e+08
1.5594e+08
1.6109e+08
1.6667e+08
1.7266e+08
1.6619e+08
1.6617e+08
1.6938e+08
1.7277e+08
1.7640e+08
1.8024e+08
1.8436e+08
1.8878e+08
1.9351e+08
1.9871e+08
2.0422e+08
2.1016e+08
2.1660e+08
2.2360e+08
2.3124e+08
2.3956e+08
2.3724e+08
2.3723e+08
2.4194e+08
2.4695e+08
2.5233e+08
2.5802e+08
2.6415e+08
2.7067e+08
2.7771e+08
2.8538e+08
2.9355e+08
3.0234e+08
3.1188e+08
3.2218e+08
3.3333e+08
3.4531e+08
Data Sheet
Code
192
193
194
195
196
197
198
199
200
201
202
203
204
205
206
207
208
209
210
211
212
213
214
215
FMID
3.3238e+08
3.3235e+08
3.3876e+08
3.4553e+08
3.5279e+08
3.6048e+08
3.6872e+08
3.7757e+08
3.8703e+08
3.9742e+08
4.0844e+08
4.2032e+08
4.3320e+08
4.4719e+08
4.6248e+08
4.7912e+08
4.7449e+08
4.7447e+08
4.8388e+08
4.9391e+08
5.0465e+08
5.1605e+08
5.2831e+08
5.4135e+08
ADN2812
Code
216
217
218
219
220
221
222
223
224
225
226
227
228
229
230
231
232
233
234
235
236
237
238
239
FMID
5.5542e+08
5.7075e+08
5.8711e+08
6.0468e+08
6.2377e+08
6.4437e+08
6.6666e+08
6.9062e+08
6.6476e+08
6.6470e+08
6.7751e+08
6.9106e+08
7.0558e+08
7.2096e+08
7.3743e+08
7.5514e+08
7.7405e+08
7.9485e+08
8.1688e+08
8.4064e+08
8.6640e+08
8.9438e+08
9.2496e+08
9.5825e+08
Code
240
241
242
243
244
245
246
247
248
249
250
251
252
253
254
255
256
257
258
259
260
261
262
263
Rev. E | Page 25 of 28
FMID
9.4898e+08
9.4893e+08
9.6776e+08
9.8782e+08
1.0093e+09
1.0321e+09
1.0566e+09
1.0827e+09
1.1108e+09
1.1415e+09
1.1742e+09
1.2094e+09
1.2475e+09
1.2887e+09
1.3333e+09
1.3812e+09
1.3295e+09
1.3294e+09
1.3550e+09
1.3821e+09
1.4112e+09
1.4419e+09
1.4749e+09
1.5103e+09
Code
264
265
266
267
268
269
270
271
272
273
274
275
276
277
278
279
280
281
282
283
284
285
286
287
FMID
1.5481e+09
1.5897e+09
1.6338e+09
1.6813e+09
1.7328e+09
1.7888e+09
1.8499e+09
1.9165e+09
1.8980e+09
1.8979e+09
1.9355e+09
1.9756e+09
2.0186e+09
2.0642e+09
2.1132e+09
2.1654e+09
2.2217e+09
2.2830e+09
2.3484e+09
2.4187e+09
2.4951e+09
2.5775e+09
2.6666e+09
2.7625e+09
ADN2812
Data Sheet
OUTLINE DIMENSIONS
0.30
0.25
0.18
32
25
0.50
BSC
TOP VIEW
0.80
0.75
0.70
8
16
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
SEATING
PLANE
3.25
3.10 SQ
2.95
EXPOSED
PAD
17
0.50
0.40
0.30
PIN 1
INDICATOR
1
24
9
BOTTOM VIEW
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD.
112408-A
PIN 1
INDICATOR
5.10
5.00 SQ
4.90
Figure 31. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-7)
Dimensions shown in millimeters
ORDERING GUIDE
Model 1
ADN2812ACPZ
ADN2812ACPZ-RL
ADN2812ACPZ-RL7
EVAL-ADN2812EBZ
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Description
32-Lead LFCSP_WQ
32-Lead LFCSP_WQ, 13” Tape-Reel, 5000 pcs
32-Lead LFCSP_WQ, 7” Tape-Reel, 1500 pcs
Evaluation Board
Z = RoHS Compliant Part.
Rev. E | Page 26 of 28
Package Option
CP-32-7
CP-32-7
CP-32-7
Data Sheet
ADN2812
NOTES
Rev. E | Page 27 of 28
ADN2812
Data Sheet
NOTES
I2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).
©2004–2012 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D04228-0-3/12(E)
Rev. E | Page 28 of 28
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