ADSP-BF533WYBZ-4A

Blackfin® Embedded Processor ADSP-BF531/ADSP-BF532/ADSP-BF533 FEATURES Up to 600 MHz high performance Blackfin processor Two 16-bit MACs, two 40-bit ALUs, four 8-bit video ALUs, 40-bit shifter RISC-like register and instruction model for ease of pro­ gramming and compiler-friendly support Advanced debug, trace, and performance monitoring 0.85 V to 1.30 V core VDD with on-chip voltage regulation 1.8 V, 2.5 V, and 3.3 V compliant I/O 160-ball CSP_BGA, 169-ball PBGA, and 176-lead LQFP packages External memory controller with glueless support for SDRAM, SRAM, flash, and ROM Flexible memory booting options from SPI® and external memory PERIPHERALS Parallel peripheral interface PPI/GPIO, supporting ITU-R 656 video data formats Two dual-channel, full duplex synchronous serial ports, sup­ porting eight stereo I2S channels Four memory-to-memory DMAs Eight peripheral DMAs SPI-compatible port Three 32-bit timer/counters with PWM support Real-time clock and watchdog timer 32-bit core timer Up to 16 general-purpose I/O pins (GPIO) UART with support for IrDA® Event handler Debug/JTAG interface On-chip PLL capable of 0.5� to 64� frequency multiplication MEMORY Up to 148K bytes of on-chip memory: 16K bytes of instruction SRAM/Cache Up to 64K bytes of instruction SRAM Up to32K bytes of data SRAM/Cache Up to32K bytes of data SRAM 4K bytes of scratchpad SRAM Memory management unit providing memory protection VOLTAGE REGULATOR JTAG TEST AND EMULATION B L1 INSTRUCTION MEMORY L1 DATA MEMORY INTERRUPT CONTROLLER P ERIP HE R AL A CCE S S BU S WATCHDOG TIMER RTC PPI DMA CONTROLLER D MA ACC E S S BU S TIMER0-2 SPI UART SPORT0-1 DMA CORE BUS EXTERNAL ACCESS BUS DMA EXTERNAL BUS GPIO PORT F EXTERNAL PORT FLASH, SDRAM CONTROL 16 BOOT ROM Figure 1. Functional Block Diagram Blackfin and the Blackfin logo are registered trademarks of Analog Devices, Inc. Rev. E Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106 U.S.A. Tel: 781.329.4700 www.analog.com Fax: 781.461.3113 ©2007 Analog Devices, Inc. All rights reserved. ADSP-BF531/ADSP-BF532/ADSP-BF533 TABLE OF CONTENTS General Description . .... ..... ..... ..... ..... ..... ..... ...... ..... ... 3 Portable Low Power Architecture . .... ..... ..... ...... ..... ... 3 System Integration . ... ..... ..... ..... ..... ..... ..... ...... ..... ... 3 ADSP-BF531/ADSP-BF532/ADSP-BF533 Processor Peripherals . ..... ..... ..... ..... ..... ..... ..... ..... ...... ..... ... 3 Blackfin Processor Core . .. ..... ..... ..... ..... ..... ...... ..... ... 4 Memory Architecture . .... ..... ..... ..... ..... ..... ...... ..... ... 4 DMA Controllers . ..... ..... ..... ..... ..... ..... ..... ...... ..... ... 8 Real-Time Clock . . ..... ..... ..... ..... ..... ..... ..... ...... ..... ... 8 Watchdog Timer . ..... ..... ..... ..... ..... ..... ..... ...... ..... ... 9 Timers . ... ..... ..... ..... ..... ..... ..... ..... ..... ..... ...... ..... ... 9 Serial Ports (SPORTs) . .... ..... ..... ..... ..... ..... ...... ..... ... 9 Serial Peripheral Interface (SPI) Port . ..... ..... ...... ..... . 10 UART Port . ... ..... ..... ..... ..... ..... ..... ..... ..... ...... ..... . 10 General-Purpose I/O Port F . .. ..... ..... ..... ..... ...... ..... . 10 Parallel Peripheral Interface . .. ..... ..... ..... ..... ...... ..... . 11 Dynamic Power Management . .... ..... ..... ..... ...... ..... . 11 Voltage Regulation . ... ..... ..... ..... ..... ..... ..... ...... ..... . 13 Clock Signals . ..... ..... ..... ..... ..... ..... ..... ..... ...... ..... . 13 Booting Modes . ... ..... ..... ..... ..... ..... ..... ..... ...... ..... . 14 Instruction Set Description . .. ..... ..... ..... ..... ...... ..... . 15 Development Tools . .. ..... ..... ..... ..... ..... ..... ...... ..... . 15 Designing an Emulator-Compatible Processor Board . . 16 Related Documents . .. ..... ..... ..... ..... ..... ..... ...... ..... . 17 Pin Descriptions . .... ..... ..... ..... ..... ..... ..... ..... ...... ..... . 18 Specifications . ... ..... ..... ..... ..... ..... ..... ..... ..... ...... ..... . 21 Operating Conditions . .... ..... ..... ..... ..... ..... ...... ..... . 21 Electrical Characteristics . . ..... ..... ..... ..... ..... ...... ..... . 22 Absolute Maximum Ratings . . ..... ..... ..... ..... ...... ..... . 23 Package Information . ..... ..... ..... ..... ..... ..... ...... ..... . 23 ESD Sensitivity . ... ..... ..... ..... ..... ..... ..... ..... ...... ..... . 23 Timing Specifications . .... ..... ..... ..... ..... ..... ...... ..... . 24 Clock and Reset Timing . ... ..... ..... ..... ..... ...... ..... . 25 Asynchronous Memory Read Cycle Timing . .... ..... . 26 Asynchronous Memory Write Cycle Timing . ... ..... . 27 SDRAM Interface Timing . . ..... ..... ..... ..... ...... ..... . 28 External Port Bus Request and Grant Cycle Timing . . 29 Parallel Peripheral Interface Timing . ... ..... ...... ..... . 30 Serial Ports . ..... ..... ..... ..... ..... ..... ..... ..... ...... ..... . 34 Serial Peripheral Interface (SPI) Port —Master Timing . .... ..... ..... ..... ..... ..... ...... ..... . 37 Serial Peripheral Interface (SPI) Port —Slave Timing . ... ...... ..... ..... ..... ..... ..... ..... ..... 38 Universal Asynchronous Receiver-Transmitter (UART) Port—Receive and Transmit Timing . ..... 39 General-Purpose I/O Port F Pin Cycle Timing . ... ..... 40 Timer Cycle Timing . ...... ..... ..... ..... ..... ..... ..... ..... 41 JTAG Test and Emulation Port Timing . .. ..... ..... ..... 42 Output Drive Currents . ..... ..... ..... ..... ..... ..... ..... ..... 43 Power Dissipation . ..... ...... ..... ..... ..... ..... ..... ..... ..... 45 Test Conditions . ... ..... ...... ..... ..... ..... ..... ..... ..... ..... 45 Environmental Conditions . ..... ..... ..... ..... ..... ..... ..... 48 160-Ball BGA Ball Assignment . ... ..... ..... ..... ..... ..... ..... 49 169-Ball PBGA ball assignment . ... ..... ..... ..... ..... ..... ..... 52 176-Lead LQFP Pinout . . . ...... ..... ..... ..... ..... ..... ..... ..... 55 Outline Dimensions . . ..... ...... ..... ..... ..... ..... ..... ..... ..... 57 Surface Mount Design . ...... ..... ..... ..... ..... ..... ..... ..... 58 Ordering Guide . . ..... ..... ...... ..... ..... ..... ..... ..... ..... ..... 59 REVISION HISTORY 7/07—Revision E: Changed from Rev. D to Rev. E Combined ADSP-BF531/532 Rev D and ADSP-BF533 Rev D Data sheets into this Revision E . .. ..... ..... ..... ..... ..... ..... . 1 Changed Features . .... ..... ...... ..... ..... ..... ..... ..... ..... ..... . 1 Reformatted Processor Comparison . .. ..... ..... ..... ..... ..... . 3 Rewrote General-Purpose I/O Port F . . ..... ..... ..... ..... ..... 10 Rewrote Parallel Peripheral Interface . . ..... ..... ..... ..... ..... 11 Rewrote Dynamic Power Management . ... ..... ..... ..... ..... 11 Rewrote Voltage Regulation . .. ..... ..... ..... ..... ..... ..... ..... 13 Rewrote Clock Signals . ... ...... ..... ..... ..... ..... ..... ..... ..... 13 Rewrote Booting Modes . . ...... ..... ..... ..... ..... ..... ..... ..... 14 Rewrote EZ-KIT Lite Evaluation Board . ... ..... ..... ..... ..... 16 Reformatted Pin Descriptions . ..... ..... ..... ..... ..... ..... ..... 18 Changed Operating Conditions . .. ..... ..... ..... ..... ..... ..... 21 Changed Electrical Characteristics . .... ..... ..... ..... ..... ..... 22 Reformatted Timing Specifications . ... ..... ..... ..... ..... ..... 24 Added Figures to Parallel Peripheral Interface Timing . .... 30 Changed Serial Ports . ..... ...... ..... ..... ..... ..... ..... ..... ..... 34 Changed Ordering Guide . ..... ..... ..... ..... ..... ..... ..... ..... 59 8/06—Revision D: Changed from Rev. C to Rev. D Rev. E | Page 2 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 GENERAL DESCRIPTION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are members of the Blackfin family of products, incorporating the Analog Devices/Intel Micro Signal Architecture (MSA). Blackfin processors combine a dual-MAC state-of-the-art signal processing engine, the advantages of a clean, orthogonal RISClike microprocessor instruction set, and single instruction, mul­ tiple data (SIMD) multimedia capabilities into a single instruction set architecture. The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are completely code and pin-compatible, differing only with respect to their performance and on-chip memory. Specific perfor­ mance and memory configurations are shown in Table 1. Table 1. Processor Comparison ADSP-BF531 ADSP-BF532 ADSP-BF533 power consumption. Varying the voltage and frequency can result in a substantial reduction in power consumption, com­ pared with just varying the frequency of operation. This translates into longer battery life for portable appliances. SYSTEM INTEGRATION The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are highly integrated system-on-a-chip solutions for the next gener­ ation of digital communication and consumer multimedia applications. By combining industry-standard interfaces with a high performance signal processing core, users can develop cost-effective solutions quickly without the need for costly external components. The system peripherals include a UART port, an SPI port, two serial ports (SPORTs), four general-pur­ pose timers (three with PWM capability), a real-time clock, a watchdog timer, and a parallel peripheral interface. Features SPORTs UART SP I GP Timers Watchdog Timers RTC Parallel Peripheral Inter face GPIOs L1 Instruction SRAM/Cache L1 Instruction SRAM L1 Data SRAM/Cache L1 Data SRAM L1 Scratchpad L3 Boot ROM Memory Configuration Maximum Speed Grade Package Options: CSP_BGA Plastic BGA LQFP ADSP-BF531/ADSP-BF532/ADSP-BF533 PROCESSOR PERIPHERALS The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors con­ tain a rich set of peripherals connected to the core via several high bandwidth buses, providing flexibility in system configura­ tion as well as excellent overall system performance (see the functional block diagram in Figure 1 on Page 1). The generalpurpose peripherals include functions such as UART, timers with PWM (pulse-width modulation) and pulse measurement capability, general-purpose I/O pins, a real-time clock, and a watchdog timer. This set of functions satisfies a wide variety of typical system support needs and is augmented by the system expansion capabilities of the part. In addition to these generalpurpose peripherals, the ADSP-BF531/ADSP-BF532/ ADSP-BF533 processors contain high speed serial and parallel ports for interfacing to a variety of audio, video, and modem codec functions; an interrupt controller for flexible manage­ ment of interrupts from the on-chip peripherals or external sources; and power management control functions to tailor the performance and power characteristics of the processor and sys­ tem to many application scenarios. All of the peripherals, except for general-purpose I/O, real-time clock, and timers, are supported by a flexible DMA structure. There is also a separate memory DMA channel dedicated to data transfers between the processor’s various memory spaces, including external SDRAM and asynchronous memory. Multi­ ple on-chip buses running at up to 133 MHz provide enough bandwidth to keep the processor core running along with activ­ ity on all of the on-chip and external peripherals. The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors include an on-chip voltage regulator in support of the proces­ sor’s dynamic power management capability. The voltage regulator provides a range of core voltage levels from a single 2.25 V to 3.6 V input. The voltage regulator can be bypassed at the user’s discretion. 2 1 1 3 1 1 1 16 16K bytes 16K bytes 16K bytes 4K bytes 1K bytes 2 1 1 3 1 1 1 16 16K bytes 32K bytes 32K bytes 2 1 1 3 1 1 1 16 16K bytes 64K bytes 32K bytes 32K bytes 4K bytes 4K bytes 1K bytes 1K bytes 400 MHz 400 MHz 600 MHz 160-Ball 160-Ball 160-Ball 169-Ball 169-Ball 169-Ball 176-Lead 176-Lead 176-Lead By integrating a rich set of industry-leading system peripherals and memory, Blackfin processors are the platform of choice for next generation applications that require RISC-like program­ mability, multimedia support, and leading-edge signal processing in one integrated package. PORTABLE LOW POWER ARCHITECTURE Blackfin processors provide world-class power management and performance. Blackfin processors are designed in a low power and low voltage design methodology and feature dynamic power management—the ability to vary both the volt­ age and frequency of operation to significantly lower overall Rev. E | Page 3 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 BLACKFIN PROCESSOR CORE As shown in Figure 2 on Page 5, the Blackfin processor core contains two 16-bit multipliers, two 40-bit accumulators, two 40-bit ALUs, four video ALUs, and a 40-bit shifter. The compu­ tation units process 8-bit, 16-bit, or 32-bit data from the register file. The compute register file contains eight 32-bit registers. When performing compute operations on 16-bit operand data, the register file operates as 16 independent 16-bit registers. All operands for compute operations come from the multiported register file and instruction constant fields. Each MAC can perform a 16-bit by 16-bit multiply in each cycle, accumulating the results into the 40-bit accumulators. Signed and unsigned formats, rounding, and saturation are supported. The ALUs perform a traditional set of arithmetic and logical operations on 16-bit or 32-bit data. In addition, many special instructions are included to accelerate various signal processing tasks. These include bit operations such as field extract and population count, modulo 232 multiply, divide primitives, satu­ ration and rounding, and sign/exponent detection. The set of video instructions includes byte alignment and packing opera­ tions, 16-bit and 8-bit adds with clipping, 8-bit average operations, and 8-bit subtract/absolute value/accumulate (SAA) operations. Also provided are the compare/select and vector search instructions. For certain instructions, two 16-bit ALU operations can be per­ formed simultaneously on register pairs (a 16-bit high half and 16-bit low half of a compute register). Quad 16-bit operations are possible using the second ALU. The 40-bit shifter can perform shifts and rotates and is used to support normalization, field extract, and field deposit instructions. The program sequencer controls the flow of instruction execu­ tion, including instruction alignment and decoding. For program flow control, the sequencer supports PC relative and indirect conditional jumps (with static branch prediction), and subroutine calls. Hardware is provided to support zero-over­ head looping. The architecture is fully interlocked, meaning that the programmer need not manage the pipeline when executing instructions with data dependencies. The address arithmetic unit provides two addresses for simulta­ neous dual fetches from memory. It contains a multiported register file consisting of four sets of 32-bit index, modify, length, and base registers (for circular buffering), and eight additional 32-bit pointer registers (for C-style indexed stack manipulation). Blackfin processors support a modified Harvard architecture in combination with a hierarchical memory structure. Level 1 (L1) memories are those that typically operate at the full processor speed with little or no latency. At the L1 level, the instruction memory holds instructions only. The two data memories hold data, and a dedicated scratchpad data memory stores stack and local variable information. In addition, multiple L1 memory blocks are provided, offering a configurable mix of SRAM and cache. The memory manage­ ment unit (MMU) provides memory protection for individual tasks that may be operating on the core and can protect system registers from unintended access. The architecture provides three modes of operation: user mode, supervisor mode, and emulation mode. User mode has restricted access to certain system resources, thus providing a protected software environment, while supervisor mode has unrestricted access to the system and core resources. The Blackfin processor instruction set has been optimized so that 16-bit opcodes represent the most frequently used instruc­ tions, resulting in excellent compiled code density. Complex DSP instructions are encoded into 32-bit opcodes, representing fully featured multifunction instructions. Blackfin processors support a limited multi-issue capability, where a 32-bit instruc­ tion can be issued in parallel with two 16-bit instructions, allowing the programmer to use many of the core resources in a single instruction cycle. The Blackfin processor assembly language uses an algebraic syn­ tax for ease of coding and readability. The architecture has been optimized for use in conjunction with the C/C++ compiler, resulting in fast and efficient software implementations. MEMORY ARCHITECTURE The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors view memory as a single unified 4G byte address space, using 32-bit addresses. All resources, including internal memory, external memory, and I/O control registers, occupy separate sections of this common address space. The memory portions of this address space are arranged in a hierarchical structure to provide a good cost/performance balance of some very fast, low latency on-chip memory as cache or SRAM, and larger, lower cost and performance off-chip memory systems. See Figure 4 on Page 6, Figure 5 on Page 6, and Figure 3 on Page 6. The L1 memory system is the primary highest performance memory available to the Blackfin processor. The off-chip mem­ ory system, accessed through the external bus interface unit (EBIU), provides expansion with SDRAM, flash memory, and SRAM, optionally accessing up to 132M bytes of physical memory. The memory DMA controller provides high bandwidth datamovement capability. It can perform block transfers of code or data between the internal memory and the external memory spaces. Internal (On-Chip) Memory The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has three blocks of on-chip memory providing high bandwidth access to the core. The first is the L1 instruction memory, consisting of up to 80K bytes SRAM, of which 16K bytes can be configured as a four way set-associative cache. This memory is accessed at full processor speed. Rev. E | Page 4 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 ADDRESS ARITHMETIC UNIT I3 I2 I1 I0 DA1 DA0 TO MEMORY 32 32 L3 L2 L1 L0 B3 B2 B1 B0 M3 M2 M1 M0 DAG1 DAG0 SP FP P5 P4 P3 P2 P1 P0 32 RAB 32 PREG SD LD1 LD0 32 32 32 32 32 ASTAT SEQUENCER R7.H R6.H R5.H R4.H R3.H R2.H R1.H R0.H R7.L R6.L R5.L R4.L R3.L R2.L R1.L R0.L BARREL SHIFTER 16 8 8 8 16 8 DECODE ALIGN 40 40 40 40 LOOP BUFFER A0 A1 CONTROL UNIT 32 32 DATA ARITHMETIC UNIT Figure 2. Blackfin Processor Core The second on-chip memory block is the L1 data memory, con­ sisting of one or two banks of up to 32K bytes. The memory banks are configurable, offering both cache and SRAM func­ tionality. This memory block is accessed at full processor speed. The third memory block is a 4K byte scratchpad SRAM which runs at the same speed as the L1 memories, but is only accessible as data SRAM and cannot be configured as cache memory. 1M byte segment regardless of the size of the devices used, so that these banks will only be contiguous if each is fully popu­ lated with 1M byte of memory. I/O Memory Space Blackfin processors do not define a separate I/O space. All resources are mapped through the flat 32-bit address space. On-chip I/O devices have their control registers mapped into memory mapped registers (MMRs) at addresses near the top of the 4G byte address space. These are separated into two smaller blocks, one containing the control MMRs for all core functions, and the other containing the registers needed for setup and con­ trol of the on-chip peripherals outside of the core. The MMRs are accessible only in supervisor mode and appear as reserved space to on-chip peripherals. External (Off-Chip) Memory External memory is accessed via the external bus interface unit (EBIU). This 16-bit interface provides a glueless connection to a bank of synchronous DRAM (SDRAM) as well as up to four banks of asynchronous memory devices including flash, EPROM, ROM, SRAM, and memory mapped I/O devices. The PC133-compliant SDRAM controller can be programmed to interface to up to 128M bytes of SDRAM. The SDRAM con­ troller allows one row to be open for each internal SDRAM bank, for up to four internal SDRAM banks, improving overall system performance. The asynchronous memory controller can be programmed to control up to four banks of devices with very flexible timing parameters for a wide variety of devices. Each bank occupies a Booting The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor con­ tains a small boot kernel, which configures the appropriate peripheral for booting. If the ADSP-BF531/ADSP-BF532/ ADSP-BF533 processor is configured to boot from boot ROM memory space, the processor starts executing from the on-chip boot ROM. For more information, see Booting Modes on Page 14. Rev. E | Page 5 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 0xFFF F FFFF C ORE MMR REGISTERS (2M BYTE) 0xFFE0 0000 SYSTEM MMR REGISTERS (2M BYTE) 0xFFC0 0000 RESERVED 0xFFB0 1000 SCRATCHPAD SRAM (4K BYTE) 0xFFB0 0000 RESERVED INTERNAL MEMORY MAP 0xFFF F FFF F CORE MMR REGIST ERS (2M BYTE) 0xFFE0 0000 SYSTEM MMR REGISTERS (2M BYT E) 0xFFC0 0000 RESERVED 0xFFB0 1000 SC RATCHPAD SRAM (4K B YTE) RESERVED 0xFFA1 4000 INST RUCTION SRAM/CACHE (16K BYTE) 0xFFA1 0000 INST RUCTION SRAM (64K BYTE) 0xFFA0 0000 RESERVED 0xFF90 8000 DATA BANK B SRAM/CACHE (16K BYT E) 0xFF90 4000 DATA BANK B SRAM (16K BYTE) 0xFF90 0000 RESERVED 0xFF80 8000 RESERVED DATA BANK A SRAM/CACHE (16K BYT E) 0xFF80 4000 D ATA BANK A SRAM/CACHE (16K BYTE) DATA BANK A SRAM (16K BYTE) 0xFF80 0000 RESERVED RESERVED 0xEF00 0000 EXT ERNAL MEMORY MAP INTERNAL MEMORY MAP EXTERNAL MEMORY MAP 0xFFB0 0000 0xFFA1 4000 INSTRU CTION SRAM/CACHE (16K BYT E) 0xFFA1 0000 RESERVED 0xFFA0 C000 INSTRU CTION SRAM (16K BYTE) 0xFFA0 8000 RESERVED 0xFFA0 0000 RESERVED 0xFF90 8000 RESERVED 0xFF90 4000 0xFF80 8000 0xFF80 4000 0xEF00 0000 RESERVED 0x2040 0000 ASYNC MEMORY BA NK 3 (1M BYTE) 0x2030 0000 ASYNC MEMORY BA NK 2 (1M BYTE) 0x2020 0000 ASYNC MEMORY BA NK 1 (1M BYTE) 0x2010 0000 ASYNC MEMORY BA NK 0 (1M BYTE) 0x2000 0000 RESERVED 0x0800 0000 SDRAM MEMORY (16M B YTE TO 128M BYTE) 0x0000 0000 RESERVED 0x2040 0000 ASYNC MEMORY BANK 3 (1M BYTE) 0x2030 0000 ASYNC MEMORY BANK 2 (1M BYTE) 0x2020 0000 ASYNC MEMORY BANK 1 (1M BYTE) 0x2010 0000 ASYNC MEMORY BANK 0 (1M BYTE) 0x2000 0000 RESERVED 0x0800 0000 SDRAM MEMORY (16M BYTE TO 128M BYTE) 0x0000 0000 Figure 3. ADSP-BF531 Internal/External Memory Map 0xFFFF FFFF CORE MMR REGISTERS (2M BYTE) 0xFFE0 0000 SYSTEM MMR REGISTERS (2M BYTE) 0xFFC0 0000 RESERVED 0xFFB0 1000 SCRATCHPAD SRAM (4K BYTE) RESERVED 0xFFA1 4000 INSTRUCTION SRAM/CACHE (16K BYTE) 0xFFA1 0000 INSTRUCTION SRAM (32K BYTE) 0xFFA0 8000 RESERVED 0xFFA0 0000 RESERVED 0xFF90 8000 DATA BANK B SRAM/CACHE (16K BYTE) 0xFF90 4000 RESERVED 0xFF80 8000 DATA BANK A SRAM/CACHE (16K BYTE) 0xFF80 4000 RESERVED 0xEF00 0000 0x2040 0000 ASYNC MEMORY BANK 3 (1M BYTE) 0x2030 0000 ASYNC MEMORY BANK 2 (1M BYTE) 0x2020 0000 ASYNC MEMORY BANK 1 (1M BYTE) 0x2010 0000 ASYNC MEMORY BANK 0 (1M BYTE) 0x2000 0000 RESERVED 0x0800 0000 SDRAM MEMORY (16M BYTE TO 128M BYTE) 0x0000 0000 EXTER NAL MEMORY MAP INTERNAL MEMORY MAP Figure 5. ADSP-BF533 Internal/External Memory Map Event Handling The event controller on the ADSP-BF531/ADSP-BF532/ ADSP-BF533 processor handles all asynchronous and synchro­ nous events to the processor. The ADSP-BF531/ADSP-BF532/ ADSP-BF533 processor provides event handling that supports both nesting and prioritization. Nesting allows multiple event service routines to be active simultaneously. Prioritization ensures that servicing of a higher priority event takes prece­ dence over servicing of a lower priority event. The controller provides support for five different types of events: • Emulation – An emulation event causes the processor to enter emulation mode, allowing command and control of the processor via the JTAG interface. • Reset – This event resets the processor. • Nonmaskable Interrupt (NMI) – The NMI event can be generated by the software watchdog timer or by the NMI input signal to the processor. The NMI event is frequently used as a power-down indicator to initiate an orderly shut­ down of the system. • Exceptions – Events that occur synchronously to program flow (i.e., the exception will be taken before the instruction is allowed to complete). Conditions such as data alignment violations and undefined instructions cause exceptions. • Interrupts – Events that occur asynchronously to program flow. They are caused by input pins, timers, and other peripherals, as well as by an explicit software instruction. 0xFFB0 0000 RESERVED Figure 4. ADSP-BF532 Internal/External Memory Map Rev. E | Page 6 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Each event type has an associated register to hold the return address and an associated return-from-event instruction. When an event is triggered, the state of the processor is saved on the supervisor stack. The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor event controller consists of two stages, the core event controller (CEC) and the system interrupt controller (SIC). The core event con­ troller works with the system interrupt controller to prioritize and control all system events. Conceptually, interrupts from the peripherals enter into the SIC, and are then routed directly into the general-purpose interrupts of the CEC. Table 3. System Interrupt Controller (SIC) Peripheral Interrupt Event PLL Wakeup DMA Error PPI Error SPORT 0 Error SPORT 1 Error SPI Error UART Error Real-Time Clock DMA Channel 0 (PPI) DMA Channel 1 (SPORT 0 Receive) DMA Channel 2 (SPORT 0 Transmit) DMA Channel 3 (SPORT 1 Receive) DMA Channel 4 (SPORT 1 Transmit) DMA Channel 5 (SPI) DMA Channel 6 (UART Receive) DMA Channel 7 (UART Transmit) Timer 0 Timer 1 Timer 2 Port F GPIO Interrupt A Port F GPIO Interrupt B Memory DMA Stream 0 Memory DMA Stream 1 Software Watchdog Timer Default Mapping I VG 7 I VG 7 I VG 7 IVG7 IVG7 IVG7 I VG 7 IVG8 IVG8 IVG9 IVG9 IVG9 IVG9 IVG10 IVG10 IVG10 IVG11 IVG11 IVG11 IVG12 IVG12 IVG13 IVG13 IVG13 Core Event Controller (CEC) The CEC supports nine general-purpose interrupts (IVG15 – 7), in addition to the dedicated interrupt and exception events. Of these general-purpose interrupts, the two lowest priority inter­ rupts (IVG15 – 14) are recommended to be reserved for software interrupt handlers, leaving seven prioritized interrupt inputs to support the peripherals of the processor. Table 2 describes the inputs to the CEC, identifies their names in the event vector table (EVT), and lists their priorities. Table 2. Core Event Controller (CEC) Priority (0 is Highest) 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Event Class Emulation/Test Control Reset Nonmaskable Interrupt Exception Reser ved Hardware Error Core Timer General Interrupt 7 General Interrupt 8 General Interrupt 9 General Interrupt 10 General Interrupt 11 General Interrupt 12 General Interrupt 13 General Interrupt 14 General Interrupt 15 EVT Entry EM U RS T NMI E VX IVHW IV TMR IVG7 IVG8 IVG9 IVG10 IVG11 IVG12 IVG13 IVG14 IVG15 Event Control The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pro­ vides the user with a very flexible mechanism to control the processing of events. In the CEC, three registers are used to coordinate and control events. Each register is 32 bits wide: • CEC interrupt latch register (ILAT) – The ILAT register indicates when events have been latched. The appropriate bit is set when the processor has latched the event and cleared when the event has been accepted into the system. This register is updated automatically by the controller, but it may also be written to clear (cancel) latched events. This register may be read while in supervisor mode and may only be written while in supervisor mode when the corre­ sponding IMASK bit is cleared. • CEC interrupt mask register (IMASK) – The IMASK regis­ ter controls the masking and unmasking of individual events. When a bit is set in the IMASK register, that event is unmasked and will be processed by the CEC when asserted. A cleared bit in the IMASK register masks the event, preventing the processor from servicing the event even though the event may be latched in the ILAT register. This register may be read or written while in supervisor mode. System Interrupt Controller (SIC) The system interrupt controller provides the mapping and rout­ ing of events from the many peripheral interrupt sources to the prioritized general-purpose interrupt inputs of the CEC. Although the ADSP-BF531/ADSP-BF532/ADSP-BF533 proces­ sor provides a default mapping, the user can alter the mappings and priorities of interrupt events by writing the appropriate val­ ues into the interrupt assignment registers (SIC_IARx). Table 3 describes the inputs into the SIC and the default mappings into the CEC. Rev. E | Page 7 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Note that general-purpose interrupts can be globally enabled and disabled with the STI and CLI instructions, respectively. • CEC interrupt pending register (IPEND) – The IPEND register keeps track of all nested events. A set bit in the IPEND register indicates the event is currently active or nested at some level. This register is updated automatically by the controller but may be read while in supervisor mode. The SIC allows further control of event processing by providing three 32-bit interrupt control and status registers. Each register contains a bit corresponding to each of the peripheral interrupt events shown in Table 3. • SIC interrupt mask register (SIC_IMASK) – This register controls the masking and unmasking of each peripheral interrupt event. When a bit is set in this register, that peripheral event is unmasked and will be processed by the system when asserted. A cleared bit in this register masks the peripheral event, preventing the processor from servic­ ing the event. • SIC interrupt status register (SIC_ISR) – As multiple peripherals can be mapped to a single event, this register allows the software to determine which peripheral event source triggered the interrupt. A set bit indicates the peripheral is asserting the interrupt, and a cleared bit indi­ cates the peripheral is not asserting the event. • SIC interrupt wakeup enable register (SIC_IWR) – By enabling the corresponding bit in this register, a peripheral can be configured to wake up the processor, should the core be idled when the event is generated. See Dynamic Power Management on Page 11. Because multiple interrupt sources can map to a single generalpurpose interrupt, multiple pulse assertions can occur simulta­ neously, before or during interrupt processing for an interrupt event already detected on this interrupt input. The IPEND reg­ ister contents are monitored by the SIC as the interrupt acknowledgement. The appropriate ILAT register bit is set when an interrupt rising edge is detected (detection requires two core clock cycles). The bit is cleared when the respective IPEND register bit is set. The IPEND bit indicates that the event has entered into the proces­ sor pipeline. At this point the CEC will recognize and queue the next rising edge event on the corresponding event input. The minimum latency from the rising edge transition of the generalpurpose interrupt to the IPEND output asserted is three core clock cycles; however, the latency can be much higher, depend­ ing on the activity within and the state of the processor. and the asynchronous memory controller. DMA-capable peripherals include the SPORTs, SPI port, UART, and PPI. Each individual DMA-capable peripheral has at least one dedicated DMA channel. The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor DMA controller supports both 1-dimensional (1-D) and 2-dimen­ sional (2-D) DMA transfers. DMA transfer initialization can be implemented from registers or from sets of parameters called descriptor blocks. The 2-D DMA capability supports arbitrary row and column sizes up to 64K elements by 64K elements, and arbitrary row and column step sizes up to ±32K elements. Furthermore, the column step size can be less than the row step size, allowing implementation of interleaved data streams. This feature is especially useful in video applications where data can be de-interleaved on the fly. Examples of DMA types supported by the ADSP-BF531/ ADSP-BF532/ADSP-BF533 processor DMA controller include: • A single, linear buffer that stops upon completion • A circular, autorefreshing buffer that interrupts on each full or fractionally full buffer • 1-D or 2-D DMA using a linked list of descriptors • 2-D DMA using an array of descriptors, specifying only the base DMA address within a common page In addition to the dedicated peripheral DMA channels, there are two pairs of memory DMA channels provided for transfers between the various memories of the ADSP-BF531/ ADSP-BF532/ADSP-BF533 processor system. This enables transfers of blocks of data between any of the memories— including external SDRAM, ROM, SRAM, and flash memory— with minimal processor intervention. Memory DMA transfers can be controlled by a very flexible descriptor-based methodol­ ogy or by a standard register-based autobuffer mechanism. REAL-TIME CLOCK The processor real-time clock (RTC) provides a robust set of digital watch features, including current time, stopwatch, and alarm. The RTC is clocked by a 32.768 kHz crystal external to the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor. The RTC peripheral has dedicated power supply pins so that it can remain powered up and clocked even when the rest of the pro­ cessor is in a low power state. The RTC provides several programmable interrupt options, including interrupt per sec­ ond, minute, hour, or day clock ticks, interrupt on programmable stopwatch countdown, or interrupt at a pro­ grammed alarm time. The 32.768 kHz input clock frequency is divided down to a 1 Hz signal by a prescaler. The counter function of the timer consists of four counters: a 60 second counter, a 60 minute counter, a 24 hour counter, and a 32,768 day counter. When enabled, the alarm function generates an interrupt when the output of the timer matches the programmed value in the alarm control register. There are two alarms: The first alarm is for a time of day. The second alarm is for a day and time of that day. July 2007 DMA CONTROLLERS The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has multiple, independent DMA channels that support automated data transfers with minimal overhead for the processor core. DMA transfers can occur between the processor’s internal memories and any of its DMA-capable peripherals. Addition­ ally, DMA transfers can be accomplished between any of the DMA-capable peripherals and external devices connected to the external memory interfaces, including the SDRAM controller Rev. E | Page 8 of 60 | ADSP-BF531/ADSP-BF532/ADSP-BF533 The stopwatch function counts down from a programmed value, with one second resolution. When the stopwatch is enabled and the counter underflows, an interrupt is generated. Like other peripherals, the RTC can wake up the processor from sleep mode upon generation of any RTC wakeup event. Additionally, an RTC wakeup event can wake up the processor from deep sleep mode, and wake up the on-chip internal voltage regulator from a powered-down state. Connect RTC pins RTXI and RTXO with external components as shown in Figure 6. R TXI R1 RTXO clock the timer, or as a mechanism for measuring pulse widths and periods of external events. These timers can be synchro­ nized to an external clock input to the PF1 pin (TACLK), an external clock input to the PPI_CLK pin (TMRCLK), or to the internal SCLK. The timer units can be used in conjunction with the UART to measure the width of the pulses in the data stream to provide an autobaud detect function for a serial channel. The timers can generate interrupts to the processor core provid­ ing periodic events for synchronization, either to the system clock or to a count of external signals. In addition to the three general-purpose programmable timers, a fourth timer is also provided. This extra timer is clocked by the internal processor clock and is typically used as a system tick clock for generation of operating system periodic interrupts. X1 C1 C2 SERIAL PORTS (SPORTs) The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor incor­ porates two dual-channel synchronous serial ports (SPORT0 and SPORT1) for serial and multiprocessor communications. The SPORTs support the following features: • I2S capable operation. • Bidirectional operation – Each SPORT has two sets of inde­ pendent transmit and receive pins, enabling eight channels of I2S stereo audio. • Buffered (8-deep) transmit and receive ports – Each port has a data register for transferring data words to and from other processor components and shift registers for shifting data in and out of the data registers. • Clocking – Each transmit and receive port can either use an external serial clock or generate its own, in frequencies ranging from (fSCLK/131,070) Hz to (fSCLK/2) Hz. • Word length – Each SPORT supports serial data words from 3 bits to 32 bits in length, transferred most-signifi­ cant-bit first or least-significant-bit first. • Framing – Each transmit and receive port can run with or without frame sync signals for each data word. Frame sync signals can be generated internally or externally, active high or low, and with either of two pulse widths and early or late frame sync. • Companding in hardware – Each SPORT can perform A-law or μ-law companding according to ITU recommen­ dation G.711. Companding can be selected on the transmit and/or receive channel of the SPORT without additional latencies. • DMA operations with single-cycle overhead – Each SPORT can automatically receive and transmit multiple buffers of memory data. The processor can link or chain sequences of DMA transfers between a SPORT and memory. SU GGES TED C OM PON EN TS: X1 = ECL IPTEK E C38J ( THROUGH- HOLE P ACK AGE) OR E PSO N MC4 05 12 pF LOAD (S URFA CE- MO UNT P ACK AGE) C1 = 22 pF C2 = 22 pF R1 = 10 M Ω NOTE : C1 A N D C2 A R E S PEC IFIC TO CR Y STA L SPE CI FIED FOR X 1. CONTACT C RY STA L M AN UFAC TU RER FOR D ETA ILS. C 1 AN D C 2 SPE CI FI CATIO NS A SSU M E B OA R D TRACE CA P ACITANC E OF 3 pF. Figure 6. External Components for RTC WATCHDOG TIMER The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor includes a 32-bit timer that can be used to implement a software watchdog function. A software watchdog can improve system availability by forcing the processor to a known state through generation of a hardware reset, nonmaskable interrupt (NMI), or general-purpose interrupt, if the timer expires before being reset by software. The programmer initializes the count value of the timer, enables the appropriate interrupt, then enables the timer. Thereafter, the software must reload the counter before it counts to zero from the programmed value. This protects the system from remaining in an unknown state where software, which would normally reset the timer, has stopped running due to an external noise condition or software error. If configured to generate a hardware reset, the watchdog timer resets both the core and the processor peripherals. After a reset, software can determine if the watchdog was the source of the hardware reset by interrogating a status bit in the watchdog timer control register. The timer is clocked by the system clock (SCLK), at a maximum frequency of fSCLK. TIMERS There are four general-purpose programmable timer units in the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor. Three timers have an external pin that can be configured either as a pulse-width modulator (PWM) or timer output, as an input to Rev. E | Page 9 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 • Interrupts – Each transmit and receive port generates an interrupt upon completing the transfer of a data-word or after transferring an entire data buffer or buffers through DMA. • Multichannel capability – Each SPORT supports 128 chan­ nels out of a 1,024-channel window and is compatible with the H.100, H.110, MVIP-90, and HMVIP standards. An additional 250 mV of SPORT input hysteresis can be enabled by setting Bit 15 of the PLL_CTL register. When this bit is set, all SPORT input pins have the increased hysteresis. data to and from memory. The UART has two dedicated DMA channels, one for transmit and one for receive. These DMA channels have lower default priority than most DMA channels because of their relatively low service rates. The baud rate, serial data format, error code generation and sta­ tus, and interrupts for the UART port are programmable. The UART programmable features include: • Supporting bit rates ranging from (fSCLK/1,048,576) bits per second to (fSCLK/16) bits per second. • Supporting data formats from seven bits to 12 bits per frame. • Both transmit and receive operations can be configured to generate maskable interrupts to the processor. The UART port’s clock rate is calculated as: f SCL K UAR T Clock Rate = ---------------------------------------------16 × UART_Divisor Where the 16-bit UART_Divisor comes from the UART_DLH register (most significant 8 bits) and UART_DLL register (least significant 8 bits). In conjunction with the general-purpose timer functions, autobaud detection is supported. The capabilities of the UART are further extended with support for the Infrared Data Association (IrDA) serial infrared physical layer link specification (SIR) protocol. SERIAL PERIPHERAL INTERFACE (SPI) PORT The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has an SPI-compatible port that enables the processor to communicate with multiple SPI-compatible devices. The SPI interface uses three pins for transferring data: two data pins (master output-slave input, MOSI, and master input-slave output, MISO) and a clock pin (serial clock, SCK). An SPI chip select input pin (SPISS) lets other SPI devices select the proces­ sor, and seven SPI chip select output pins (SPISEL7–1) let the processor select other SPI devices. The SPI select pins are reconfigured general-purpose I/O pins. Using these pins, the SPI port provides a full-duplex, synchronous serial interface which sup­ ports both master/slave modes and multimaster environments. The baud rate and clock phase/polarities for the SPI port are programmable, and it has an integrated DMA controller, con­ figurable to support transmit or receive data streams. The SPI DMA controller can only service unidirectional accesses at any given time. The SPI port clock rate is calculated as: f SC LK SPI Clock Rate = ----------------------------------2 × SPI_BAUD Where the 16-bit SPI_BAUD register contains a value of 2 to 65,535. During transfers, the SPI port simultaneously transmits and receives by serially shifting data in and out on its two serial data lines. The serial clock line synchronizes the shifting and sam­ pling of data on the two serial data lines. GENERAL-PURPOSE I/O PORT F The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has 16 bidirectional, general-purpose I/O pins on Port F (PF15– 0). Each general-purpose I/O pin can be individually controlled by manipulation of the GPIO control, status and interrupt registers: • GPIO direction control register – Specifies the direction of each individual PFx pin as input or output. • GPIO control and status registers – The ADSP-BF531/ ADSP-BF532/ADSP-BF533 processor employs a “write one to modify” mechanism that allows any combination of individual GPIO pins to be modified in a single instruction, without affecting the level of any other GPIO pins. Four control registers are provided. One register is written in order to set GPIO pin values, one register is written in order to clear GPIO pin values, one register is written in order to toggle GPIO pin values, and one register is written in order to specify GPIO pin values. Reading the GPIO sta­ tus register allows software to interrogate the sense of the GPIO pin. • GPIO interrupt mask registers – The two GPIO interrupt mask registers allow each individual PFx pin to function as an interrupt to the processor. Similar to the two GPIO con­ trol registers that are used to set and clear individual GPIO pin values, one GPIO interrupt mask register sets bits to enable interrupt function, and the other GPIO interrupt mask register clears bits to disable interrupt function. PFx UART PORT The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pro­ vides a full-duplex universal asynchronous receiver/transmitter (UART) port, which is fully compatible with PC-standard UARTs. The UART port provides a simplified UART interface to other peripherals or hosts, supporting full-duplex, DMA-sup­ ported, asynchronous transfers of serial data. The UART port includes support for 5 data bits to 8 data bits, 1 stop bit or 2 stop bits, and none, even, or odd parity. The UART port supports two modes of operation: • PIO (programmed I/O) – The processor sends or receives data by writing or reading I/O-mapped UART registers. The data is double-buffered on both transmit and receive. • DMA (direct memory access) – The DMA controller trans­ fers both transmit and receive data. This reduces the number and frequency of interrupts required to transfer Rev. E | Page 10 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 pins defined as inputs can be configured to generate hard­ ware interrupts, while output PFx pins can be triggered by software interrupts. • GPIO interrupt sensitivity registers – The two GPIO inter­ rupt sensitivity registers specify whether individual PFx pins are level- or edge-sensitive and specify—if edge-sensi­ tive—whether just the rising edge or both the rising and falling edges of the signal are significant. One register selects the type of sensitivity, and one register selects which edges are significant for edge-sensitivity. Frame Capture Mode Frame capture mode allows the video source(s) to act as a slave (e.g., for frame capture). The ADSP-BF531/ADSP-BF532/ ADSP-BF533 processors control when to read from the video source(s). PPI_FS1 is an HSYNC output and PPI_FS2 is a VSYNC output. Output Mode Output mode is used for transmitting video or other data with up to three output frame syncs. Typically, a single frame sync is appropriate for data converter applications, whereas two or three frame syncs could be used for sending video with hard­ ware signaling. PARALLEL PERIPHERAL INTERFACE The processor provides a parallel peripheral interface (PPI) that can connect directly to parallel A/D and D/A converters, video encoders and decoders, and other general-purpose peripherals. The PPI consists of a dedicated input clock pin, up to three frame synchronization pins, and up to 16 data pins. The input clock supports parallel data rates up to half the system clock rate and the synchronization signals can be configured as either inputs or outputs. The PPI supports a variety of general-purpose and ITU-R 656 modes of operation. In general-purpose mode, the PPI provides half-duplex, bi-directional data transfer with up to 16 bits of data. Up to three frame synchronization signals are also pro­ vided. In ITU-R 656 mode, the PPI provides half-duplex bi­ directional transfer of 8- or 10-bit video data. Additionally, onchip decode of embedded start-of-line (SOL) and start-of-field (SOF) preamble packets is supported. ITU-R 656 Mode Descriptions The ITU-R 656 modes of the PPI are intended to suit a wide variety of video capture, processing, and transmission applica­ tions. Three distinct submodes are supported: • Active video only mode • Vertical blanking only mode • Entire field mode Active Video Only Mode Active video only mode is used when only the active video por­ tion of a field is of interest and not any of the blanking intervals. The PPI does not read in any data between the end of active video (EAV) and start of active video (SAV) preamble symbols, or any data present during the vertical blanking intervals. In this mode, the control byte sequences are not stored to memory; they are filtered by the PPI. After synchronizing to the start of Field 1, the PPI ignores incoming samples until it sees an SAV code. The user specifies the number of active video lines per frame (in PPI_COUNT register). General-Purpose Mode Descriptions The general-purpose modes of the PPI are intended to suit a wide variety of data capture and transmission applications. Three distinct submodes are supported: • Input mode – Frame syncs and data are inputs into the PPI. • Frame capture mode – Frame syncs are outputs from the PPI, but data are inputs. • Output mode – Frame syncs and data are outputs from the PPI. Vertical Blanking Interval Mode In this mode, the PPI only transfers vertical blanking interval (VBI) data. Entire Field Mode In this mode, the entire incoming bit stream is read in through the PPI. This includes active video, control preamble sequences, and ancillary data that may be embedded in horizontal and ver­ tical blanking intervals. Data transfer starts immediately after synchronization to Field 1. Data is transferred to or from the synchronous channels through eight DMA engines that work autonomously from the processor core. Input Mode Input mode is intended for ADC applications, as well as video communication with hardware signaling. In its simplest form, PPI_FS1 is an external frame sync input that controls when to read data. The PPI_DELAY MMR allows for a delay (in PPI_CLK cycles) between reception of this frame sync and the initiation of data reads. The number of input data samples is user programmable and defined by the contents of the PPI_COUNT register. The PPI supports 8-bit and 10-bit through 16-bit data, programmable in the PPI_CONTROL register. DYNAMIC POWER MANAGEMENT The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pro­ vides four operating modes, each with a different performance/ power profile. In addition, dynamic power management pro­ vides the control functions to dynamically alter the processor core supply voltage, further reducing power dissipation. Control of clocking to each of the processor peripherals also reduces power consumption. See Table 4 for a summary of the power settings for each mode. Rev. E | Page 11 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Full-On Operating Mode—Maximum Performance In the full-on mode, the PLL is enabled and is not bypassed, providing capability for maximum operational frequency. This is the power-up default execution state in which maximum per­ formance can be achieved. The processor core and all enabled peripherals run at full speed. interrupt causes the processor to transition to the active mode. Assertion of RESET while in deep sleep mode causes the proces­ sor to transition to the full-on mode. Hibernate State—Maximum Static Power Savings The hibernate state maximizes static power savings by disabling the voltage and clocks to the processor core (CCLK) and to all the synchronous peripherals (SCLK). The internal voltage regu­ lator for the processor can be shut off by writing b#00 to the FREQ bits of the VR_CTL register. In addition to disabling the clocks, this sets the internal power supply voltage (VDDINT) to 0 V to provide the lowest static power dissipation. Any critical information stored internally (memory contents, register con­ tents, etc.) must be written to a nonvolatile storage device prior to removing power if the processor state is to be preserved. Since VDDEXT is still supplied in this mode, all of the external pins three-state, unless otherwise specified. This allows other devices that may be connected to the processor to still have power applied without drawing unwanted current. The internal supply regulator can be woken up either by a real-time clock wakeup or by asserting the RESET pin. Active Operating Mode—Moderate Power Savings In the active mode, the PLL is enabled but bypassed. Because the PLL is bypassed, the processor’s core clock (CCLK) and system clock (SCLK) run at the input clock (CLKIN) frequency. In this mode, the CLKIN to CCLK multiplier ratio can be changed, although the changes are not realized until the full-on mode is entered. DMA access is available to appropriately configured L1 memories. In the active mode, it is possible to disable the PLL through the PLL control register (PLL_CTL). If disabled, the PLL must be re-enabled before transitioning to the full-on or sleep modes. Table 4. Power Settings PLL Mode PLL Bypassed Full-On Enabled No Active Enabled/ Yes Disabled Sleep Enabled Deep Sleep Disabled Hibernate Disabled Core Clock (CCLK) Enabled Enabled System Clock Core (SCLK) Power Enabled On Enabled On Power Savings As shown in Table 5, the ADSP-BF531/ADSP-BF532/ ADSP-BF533 processor supports three different power domains. The use of multiple power domains maximizes flexi­ bility, while maintaining compliance with industry standards and conventions. By isolating the internal logic of the processor into its own power domain, separate from the RTC and other I/O, the processor can take advantage of dynamic power man­ agement without affecting the RTC or other I/O devices. There are no sequencing requirements for the various power domains. Table 5. Power Domains Power Domain All internal logic, except RTC RTC internal logic and crystal I/O All other I/O VDD Range VDDINT VDDRTC VDDEXT Disabled Enabled On Disabled Disabled On Disabled Disabled Off Sleep Operating Mode—High Dynamic Power Savings The sleep mode reduces dynamic power dissipation by disabling the clock to the processor core (CCLK). The PLL and system clock (SCLK), however, continue to operate in this mode. Typi­ cally an external event or RTC activity will wake up the processor. When in the sleep mode, assertion of wakeup will cause the processor to sense the value of the BYPASS bit in the PLL control register (PLL_CTL). If BYPASS is disabled, the pro­ cessor will transition to the full-on mode. If BYPASS is enabled, the processor will transition to the active mode. When in the sleep mode, system DMA access to L1 memory is not supported. Deep Sleep Operating Mode—Maximum Dynamic Power Savings The deep sleep mode maximizes dynamic power savings by dis­ abling the clocks to the processor core (CCLK) and to all synchronous peripherals (SCLK). Asynchronous peripherals, such as the RTC, may still be running but will not be able to access internal resources or external memory. This powereddown mode can only be exited by assertion of the reset interrupt (RESET) or by an asynchronous interrupt generated by the RTC. When in deep sleep mode, an RTC asynchronous The power dissipated by a processor is largely a function of the clock frequency of the processor and the square of the operating voltage. For example, reducing the clock frequency by 25% results in a 25% reduction in dynamic power dissipation, while reducing the voltage by 25% reduces dynamic power dissipation by more than 40%. Further, these power savings are additive, in that if the clock frequency and supply voltage are both reduced, the power savings can be dramatic. The dynamic power management feature of the ADSP-BF531/ ADSP-BF532/ADSP-BF533 processor allows both the proces­ sor’s input voltage (VDDINT) and clock frequency (fCCLK) to be dynamically controlled. The savings in power dissipation can be modeled using the power savings factor and % power savings calculations. Rev. E | Page 12 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 The power savings factor is calculated as: power savings factor f CCLKRE D V DD INTR E D 2 t RE -= -------------------- × ⎛ ------------------------- ⎞ × ⎛ --------D ⎞ f CC L K N O M ⎝ V DD INTNO M⎠ ⎝ t NOM ⎠ where the variables in the equation are: fCCLKNOM is the nominal core clock frequency fCCLKRED is the reduced core clock frequency VDDINTNOM is the nominal internal supply voltage VDDINTRED is the reduced internal supply voltage tNOM is the duration running at fCCLKNOM tRED is the duration running at fCCLKRED The percent power savings is calculated as: % power savings = ( 1 – power savings factor ) × 100% Voltage Regulator Layout Guidelines Regulator external component placement, board routing, and bypass capacitors all have a significant effect on noise injected into the other analog circuits on-chip. The VROUT1-0 traces and voltage regulator external components should be consid­ ered as noise sources when doing board layout and should not be routed or placed near sensitive circuits or components on the board. All internal and I/O power supplies should be well bypassed with bypass capacitors placed as close to the ADSP-BF531/ADSP-BF532/ADSP-BF533 processors as possible. For further details on the on-chip voltage regulator and related board design guidelines, see the Switching Regulator Design Considerations for ADSP-BF533 Blackfin Processors (EE-228) applications note on the Analog Devices web site (www.ana­ log.com)—use site search on “EE-228”. VOLTAGE REGULATION The Blackfin processor provides an on-chip voltage regulator that can generate appropriate VDDINT voltage levels from the VDDEXT supply. See Operating Conditions on Page 21 for regula­ tor tolerances and acceptable VDDEXT ranges for specific models. Figure 7 shows the typical external components required to complete the power management system. The regulator con­ trols the internal logic voltage levels and is programmable with the voltage regulator control register (VR_CTL) in increments of 50 mV. To reduce standby power consumption, the internal voltage regulator can be programmed to remove power to the processor core while keeping I/O power (VDDEXT) supplied. While in the hibernate state, I/O power is still being applied, eliminat­ ing the need for external buffers. The voltage regulator can be activated from this power-down state either through an RTC wakeup or by asserting RESET, both of which will then initiate a boot sequence. The regulator can also be disabled and bypassed at the user’s discretion. CLOCK SIGNALS The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor can be clocked by an external crystal, a sine wave input, or a buffered, shaped clock derived from an external clock oscillator. If an external clock is used, it should be a TTL compatible signal and must not be halted, changed, or operated below the speci­ fied frequency during normal operation. This signal is connected to the processor’s CLKIN pin. When an external clock is used, the XTAL pin must be left unconnected. Alternatively, because the ADSP-BF531/ADSP-BF532/ ADSP-BF533 processor includes an on-chip oscillator circuit, an external crystal may be used. For fundamental frequency operation, use the circuit shown in Figure 8. Blackfin CLKOUT TO PLL CIRCU ITRY EN 2.25V TO 3.6V INPUT VOLTAGE RANGE VDDE XT (LOW-IN DUCTANCE) SET OF DECOUPLING CAPACITORS + 100µF 100nF + 100µ F FDS9431A 10µ F LOW ESR 100µF ZHCS1000 10µ H + VDDEXT CLKIN XTAL FOR OVERTONE OPERATION ONLY: VDDINT 18pF * 18pF * NOTE: VALUES MAR KED WITH * MUST BE CUSTOMIZ ED DEPENDING ON THE CRYSTAL AND LAYOUT. PLEASE ANALYZE CAREFULLY. VROU T Figure 8. External Crystal Connections SHORT AND LOWINDUCTANCE WIRE N OTE: DESIGNER SHOULD MINIMIZE TRACE LEN GTH TO FDS9431A. VROU T G ND Figure 7. Voltage Regulator Circuit A parallel-resonant, fundamental frequency, microprocessorgrade crystal is connected across the CLKIN and XTAL pins. The on-chip resistance between CLKIN and the XTAL pin is in the 500 kΩ range. Further parallel resistors are typically not rec­ ommended. The two capacitors and the series resistor shown in Figure 8 fine tune the phase and amplitude of the sine Rev. E | Page 13 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 frequency. The capacitor and resistor values shown in Figure 8 are typical values only. The capacitor values are dependent upon the crystal manufacturer's load capacitance recommendations and the physical PCB layout. The resistor value depends on the drive level specified by the crystal manufacturer. System designs should verify the customized values based on careful investiga­ tion on multiple devices over the allowed temperature range. A third-overtone crystal can be used at frequencies above 25 MHz. The circuit is then modified to ensure crystal operation only at the third overtone, by adding a tuned inductor circuit as shown in Figure 8. As shown in Figure 9, the core clock (CCLK) and system peripheral clock (SCLK) are derived from the input clock (CLKIN) signal. An on-chip PLL is capable of multiplying the CLKIN signal by a user programmable 0.5× to 64× multiplica­ tion factor (bounded by specified minimum and maximum VCO frequencies). The default multiplier is 10×, but it can be modified by a software instruction sequence. On-the-fly frequency changes can be effected by simply writing to the PLL_DIV register. “FI NE ” A DJ USTM ENT R E QUI RE S PLL SEQ U ENC IN G “C O AR SE ” AD JU STM ENT ON - THE -FLY to the PLL divisor register (PLL_DIV). When the SSEL value is changed, it will affect all the peripherals that derive their clock signals from the SCLK signal. The core clock (CCLK) frequency can also be dynamically changed by means of the CSEL1–0 bits of the PLL_DIV register. Supported CCLK divider ratios are 1, 2, 4, and 8, as shown in Table 7. This programmable core clock capability is useful for fast core frequency modifications. Table 7. Core Clock Ratios Example Frequency Ratios (MHz) VCO CCLK 300 30 0 300 15 0 400 10 0 200 25 Signal Name CSEL1–0 00 01 10 11 Divider Ratio VCO/CCLK 1: 1 2: 1 4: 1 8: 1 BOOTING MODES The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor has two mechanisms (listed in Table 8) for automatically loading internal L1 instruction memory after a reset. A third mode is provided to execute from external memory, bypassing the boot sequence. Table 8. Booting Modes ÷ 1 , 2, 4, 8 C LKI N P LL 0 .5 × t o 64 × CCLK VC O ÷ 1 to 15 SCLK BMODE1 – 0 00 01 10 11 SCLK ≤ C CLK SCLK ≤ 133 M Hz Figure 9. Frequency Modification Methods All on-chip peripherals are clocked by the system clock (SCLK). The system clock frequency is programmable by means of the SSEL3–0 bits of the PLL_DIV register. The values programmed into the SSEL fields define a divide ratio between the PLL output (VCO) and the system clock. SCLK divider values are 1 through 15. Table 6 illustrates typical system clock ratios. Table 6. Example System Clock Ratios Example Frequency Ratios Divider Ratio (MHz) VCO/SCLK VCO S C LK 1: 1 100 1 00 3: 1 400 1 33 10:1 500 50 Description Execute from 16-bit external memor y (bypass boot ROM) Boot from 8-bit or 16-bit FLASH Boot from serial master connected to SPI Boot from serial slave EEPROM /flash (8-,16-, or 24-bit address range, or Atmel AT45DB041, AT45DB081, or AT45DB161serial flash) The BMODE pins of the reset configuration register, sampled during power-on resets and software-initiated resets, imple­ ment the following modes: • Execute from 16-bit external memory – Execution starts from address 0x2000 0000 with 16-bit packing. The boot ROM is bypassed in this mode. All configuration settings are set for the slowest device possible (3-cycle hold time; 15-cycle R/W access times; 4-cycle setup). • Boot from 8-bit or 16-bit external flash memory – The flash boot routine located in boot ROM memory space is set up using asynchronous Memory Bank 0. All configuration set­ tings are set for the slowest device possible (3-cycle hold time; 15-cycle R/W access times; 4-cycle setup). • Boot from SPI serial EEPROM/flash (8-, 16-, or 24-bit addressable, or Atmel AT45DB041, AT45DB081, or AT45DB161) – The SPI uses the PF2 output pin to select a single SPI EEPROM/flash device, submits a read command and successive address bytes (0x00) until a valid 8-, 16-, or S i g na l N a m e SSEL3–0 0001 0011 1010 The maximum frequency of the system clock is fSCLK. The divisor ratio must be chosen to limit the system clock frequency to its maximum of fSCLK. The SSEL value can be changed dynamically without any PLL lock latencies by writing the appropriate values Rev. E | Page 14 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 24-bit addressable EEPROM/flash device is detected, and begins clocking data into the processor at the beginning of L1 instruction memory. • Boot from SPI serial master – The Blackfin processor oper­ ates in SPI slave mode and is configured to receive the bytes of the LDR file from an SPI host (master) agent. To hold off the host device from transmitting while the boot ROM is busy, the Blackfin processor asserts a GPIO pin, called host wait (HWAIT), to signal the host device not to send any more bytes until the flag is deasserted. The GPIO pin is chosen by the user and this information is transferred to the Blackfin processor via bits[10:5] of the FLAG header in the LDR image. For each of the boot modes, a 10-byte header is first read from an external memory device. The header specifies the number of bytes to be transferred and the memory destination address. Multiple memory blocks may be loaded by any boot sequence. Once all blocks are loaded, program execution commences from the start of L1 instruction SRAM. In addition, Bit 4 of the reset configuration register can be set by application code to bypass the normal boot sequence during a software reset. For this case, the processor jumps directly to the beginning of L1 instruction memory. • Microcontroller features, such as arbitrary bit and bit-field manipulation, insertion, and extraction; integer operations on 8-, 16-, and 32-bit data types; and separate user and supervisor stack pointers. • Code density enhancements, which include intermixing of 16-bit and 32-bit instructions (no mode switching, no code segregation). Frequently used instructions are encoded in 16 bits. DEVELOPMENT TOOLS The ADSP-BF531/ADSP-BF532/ADSP-BF533 processor is sup­ ported by a complete set of CROSSCORE®† software and hardware development tools, including Analog Devices emula­ tors and VisualDSP++®‡ development environment. The same emulator hardware that supports other Blackfin processors also fully emulates the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor. The VisualDSP++ project management environment lets pro­ grammers develop and debug an application. This environment includes an easy to use assembler (which is based on an alge­ braic syntax), an archiver (librarian/library builder), a linker, a loader, a cycle-accurate instruction level simulator, a C/C++ compiler, and a C/C++ runtime library that includes DSP and mathematical functions. A key point for these tools is C/C++ code efficiency. The compiler has been developed for efficient translation of C/C++ code to processor assembly. The processor has architectural features that improve the efficiency of com­ piled C/C++ code. The VisualDSP++ debugger has a number of important fea­ tures. Data visualization is enhanced by a plotting package that offers a significant level of flexibility. This graphical representa­ tion of user data enables the programmer to quickly determine the performance of an algorithm. As algorithms grow in com­ plexity, this capability can have increasing significance on the designer’s development schedule, increasing productivity. Statistical profiling enables the programmer to nonintrusively poll the processor as it is running the program. This feature, unique to VisualDSP++, enables the software developer to pas­ sively gather important code execution metrics without interrupting the real-time characteristics of the program. Essen­ tially, the developer can identify bottlenecks in software quickly and efficiently. By using the profiler, the programmer can focus on those areas in the program that impact performance and take corrective action. Debugging both C/C++ and assembly programs with the VisualDSP++ debugger, programmers can: • View mixed C/C++ and assembly code (interleaved source and object information). • Insert breakpoints. • Set conditional breakpoints on registers, memory, and stacks. INSTRUCTION SET DESCRIPTION The Blackfin processor family assembly language instruction set employs an algebraic syntax designed for ease of coding and readability. The instructions have been specifically tuned to pro­ vide a flexible, densely encoded instruction set that compiles to a very small final memory size. The instruction set also provides fully featured multifunction instructions that allow the pro­ grammer to use many of the processor core resources in a single instruction. Coupled with many features more often seen on microcontrollers, this instruction set is very efficient when com­ piling C and C++ source code. In addition, the architecture supports both user (algorithm/application code) and supervisor (O/S kernel, device drivers, debuggers, ISRs) modes of opera­ tion, allowing multiple levels of access to core processor resources. The assembly language, which takes advantage of the proces­ sor’s unique architecture, offers the following advantages: • Seamlessly integrated DSP/CPU features are optimized for both 8-bit and 16-bit operations. • A multi-issue load/store modified Harvard architecture, which supports two 16-bit MAC or four 8-bit ALU + two load/store + two pointer updates per cycle. • All registers, I/O, and memory are mapped into a unified 4G byte memory space, providing a simplified program­ ming model. † ‡ CROSSCORE is a registered trademark of Analog Devices, Inc. VisualDSP++ is a registered trademark of Analog Devices, Inc. Rev. E | Page 15 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 • Trace instruction execution. • Perform linear or statistical profiling of program execution. • Fill, dump, and graphically plot the contents of memory. • Perform source level debugging. • Create custom debugger windows. The VisualDSP++ IDDE lets programmers define and manage software development. Its dialog boxes and property pages let programmers configure and manage all of the Blackfin develop­ ment tools, including the color syntax highlighting in the VisualDSP++ editor. This capability permits programmers to: • Control how the development tools process inputs and generate outputs • Maintain a one-to-one correspondence with the tool’s command line switches The VisualDSP++ Kernel (VDK) incorporates scheduling and resource management tailored specifically to address the mem­ ory and timing constraints of DSP programming. These capabilities enable engineers to develop code more effectively, eliminating the need to start from the very beginning, when developing new application code. The VDK features include threads, critical and unscheduled regions, semaphores, events, and device flags. The VDK also supports priority-based, pre­ emptive, cooperative, and time-sliced scheduling approaches. In addition, the VDK was designed to be scalable. If the application does not use a specific feature, the support code for that feature is excluded from the target system. Because the VDK is a library, a developer can decide whether to use it or not. The VDK is integrated into the VisualDSP++ development environment, but can also be used via standard command line tools. When the VDK is used, the development environment assists the developer with many error prone tasks and assists in managing system resources, automating the gen­ eration of various VDK-based objects, and visualizing the system state, when debugging an application that uses the VDK. Use the expert linker to visually manipulate the placement of code and data on the embedded system. View memory utiliza­ tion in a color coded graphical form, easily move code and data to different areas of the processor or external memory with the drag of the mouse, and examine runtime stack and heap usage. The expert linker is fully compatible with existing linker defini­ tion file (LDF), allowing the developer to move between the graphical and textual environments. Analog Devices emulators use the IEEE 1149.1 JTAG test access port of the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor to monitor and control the target board processor during emu­ lation. The emulator provides full speed emulation, allowing inspection and modification of memory, registers, and proces­ sor stacks. Nonintrusive in-circuit emulation is assured by the use of the processor’s JTAG interface—the emulator does not affect target system loading or timing. In addition to the software and hardware development tools available from Analog Devices, third parties provide a wide range of tools supporting the Blackfin processor family. Hardware tools include Blackfin processor PC plug-in cards. Third party software tools include DSP libraries, real-time oper­ ating systems, and block diagram design tools. EZ-KIT Lite Evaluation Board Analog Devices offers a range of EZ-KIT Lite® evaluation plat­ forms to use as a cost effective method to learn more about developing or prototyping applications with Analog Devices processors, platforms, and software tools. Each EZ-KIT Lite includes an evaluation board along with an evaluation suite of the VisualDSP++ development and debugging environment with the C/C++ compiler, assembler, and linker. Also included are sample application programs, power supply, and a USB cable. All evaluation versions of the software tools are limited for use only with the EZ-KIT Lite product. The USB controller on the EZ-KIT Lite board connects the board to the USB port of the user’s PC, enabling the Visu­ alDSP++ evaluation suite to emulate the on-board processor incircuit. This permits the customer to download, execute, and debug programs for the EZ-KIT Lite system. It also allows incircuit programming of the on-board flash device to store userspecific boot code, enabling the board to run as a standalone unit without being connected to the PC. With a full version of VisualDSP++ installed (sold separately), engineers can develop software for the EZ-KIT Lite or any cus­ tom defined system. Connecting one of Analog Devices JTAG emulators to the EZ-KIT Lite board enables high speed, nonintrusive emulation. For evaluation of ADSP-BF531/ADSP-BF532/ADSP-BF533 processors, use the EZ-KIT Lite board available from Analog Devices. Order part number ADDS-BF533-EZLITE. The board comes with on-chip emulation capabilities and is equipped to enable software development. Multiple daughter cards are available. DESIGNING AN EMULATOR-COMPATIBLE PROCESSOR BOARD The Analog Devices family of emulators are tools that every sys­ tem developer needs to test and debug hardware and software systems. Analog Devices has supplied an IEEE 1149.1 JTAG test access port (TAP) on each JTAG processor. The emulator uses the TAP to access the internal features of the processor, allow­ ing the developer to load code, set breakpoints, observe variables, observe memory, and examine registers. The proces­ sor must be halted to send data and commands, but once an operation has been completed by the emulator, the processor system is set running at full speed with no impact on system timing. To use these emulators, the target board must include a header that connects the processor’s JTAG port to the emulator. Rev. E | Page 16 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 For details on target board design issues including mechanical layout, single processor connections, multiprocessor scan chains, signal buffering, signal termination, and emulator pod logic, see the Analog Devices JTAG Emulation Technical Refer­ ence (EE-68) on the Analog Devices website (www.analog.com)—use site search on “EE-68.” This document is updated regularly to keep pace with improvements to emula­ tor support. RELATED DOCUMENTS The following publications that describe the ADSP-BF531/ ADSP-BF532/ADSP-BF533 processors (and related processors) can be ordered from any Analog Devices sales office or accessed electronically on our website: • Getting Started With Blackfin Processors • ADSP-BF533 Blackfin Processor Hardware Reference • ADSP-BF53x/BF56x Blackfin Processor Programming Reference • ADSP-BF531 Blackfin Processor Anomaly List • ADSP-BF532 Blackfin Processor Anomaly List • ADSP-BF533 Blackfin Processor Anomaly List Rev. E | Page 17 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 PIN DESCRIPTIONS ADSP-BF531/ADSP-BF532/ADSP-BF533 processor pin defini­ tions are listed in Table 9. All pins are three-stated during and immediately after reset, except the memory interface, asynchronous memory control, and synchronous memory control pins, which are driven high. If BR is active, then the memory pins are also three-stated. All unused I/O pins have their input buffers disabled with the exception of the pins that need pull-ups or pull-downs as noted in the table footnotes. In order to maintain maximum functionality and reduce pack­ age size and pin count, some pins have dual, multiplexed functionality. In cases where pin functionality is reconfigurable, the default state is shown in plain text, while alternate function­ ality is shown in italics. Table 9. Pin Descriptions Pin Name Memory Interface ADDR19–1 DATA15–0 ABE1–0/SDQM1–0 BR BG BGH Asynchronous Memory Control AMS3–0 ARDY AOE A RE AWE Synchronous Memory Control SRAS SCAS SWE SCKE CLKOUT SA10 SMS Timers T M R0 TMR1/PPI_FS1 TMR2/PPI_FS2 PPI Port PPI3–0 PPI_CLK/TMRCLK I/O I P P I 3– 0 PPI Clock/External Timer Reference C I /O I/O I/O Timer 0 Timer 1/PPI Frame Sync1 Timer 2/PPI Frame Sync2 C C C O O O O O O O Row Address Strobe Column Address Strobe Write Enable Clock Enable Clock Output A10 Pin Bank Select A A A A B A A O I O O O Bank Select Hardware Ready Control ( This pin should be pulled HIGH if not used.) Output Enable R e a d En a b l e Write Enable A A A A O I /O O I O O Address Bus for Async/Sync Access Data Bus for Async/Sync Access Byte Enables/Data Masks for Async/Sync Access Bus Request ( This pin should be pulled HIGH if not used.) Bus Grant Bus Grant Hang A A A A A Type Function Driver Type1 Rev. E | Page 18 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Table 9. Pin Descriptions (Continued) Pin Name Port F: GPIO/Parallel Peripheral Interface Port/SPI/Timers PF0/SPISS PF1/SPISEL1/TACLK PF2/SPISEL2 PF3/SPISEL3/PPI_FS3 PF4/SPISEL4/PPI15 PF5/SPISEL5/PPI14 PF6/SPISEL6/PPI13 PF7/SPISEL7/PPI12 PF8/PPI11 PF9/PPI10 PF10/PPI9 PF11/PPI8 PF12/PPI7 PF13/PPI6 PF14/PPI5 PF15/PPI4 JTAG Port TCK T DO T DI TMS TRST EMU SPI Por t MOSI MISO SC K Serial Ports RSCLK0 RFS0 DR0PRI DR0SEC TSCLK0 TFS0 DT0PRI DT0SEC RSCLK1 I/O I/O I I I/O I/O O O I/O SPORT0 Receive Serial Clock SPORT0 Receive Frame Sync SPORT0 Receive Data Primary SPORT0 Receive Data Secondar y SPORT0 Transmit Serial Clock SPORT0 Transmit Frame Sync SPORT0 Transmit Data Primar y SPORT0 Transmit Data Secondary SPORT1 Receive Serial Clock D C C C D D C I /O I/O I/O Master Out Slave In C Master In Slave Out ( This pin should be pulled HIGH through a 4.7 kΩ resistor if booting via the C SPI port.) SPI Clock D I O I I I O JTAG Clock JTAG Serial Data Out JTAG Serial Data In JTAG Mode Select JTAG Reset ( This pin should be pulled LOW if JTAG is not used.) Emulation Output C C I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O GPIO/SPI Slave Select Input GPIO/SPI Slave Select Enable 1/Timer Alternate Clock Input GPIO/SPI Slave Select Enable 2 GPIO/SPI Slave Select Enable 3/PPI Frame Sync 3 GPIO/SPI Slave Select Enable 4/PPI 15 GPIO/SPI Slave Select Enable 5/PPI 14 GPIO/SPI Slave Select Enable 6/PPI 13 GPIO/SPI Slave Select Enable 7/PPI 12 GPIO/PPI 11 GPIO/PPI 10 GPIO/PPI 9 GPIO/PPI 8 GPIO/PPI 7 GPIO/PPI 6 GPIO/PPI 5 GPIO/PPI 4 C C C C C C C C C C C C C C C C Type Function Driver Type1 Rev. E | Page 19 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Table 9. Pin Descriptions (Continued) Pin Name RFS1 DR1PRI DR1SEC TSCLK1 TFS1 DT1PRI DT1SEC UART Por t RX TX Real-Time Clock RTXI RTXO Clock CLKIN XTAL Mode Controls RESET NMI BMODE1–0 Voltage Regulator VROUT1–0 Supplies VDDEXT VDDINT VDDRTC G ND 1 Type Function I/O I I I/O I/O O O I O I O I O I I I O P P P G SPORT1 Receive Frame Sync SPORT1 Receive Data Primary SPORT1 Receive Data Secondar y SPORT1 Transmit Serial Clock SPORT1 Transmit Frame Sync SPORT1 Transmit Data Primar y SPORT1 Transmit Data Secondary UART Receive UART Transmit RTC Crystal Input ( This pin should be pulled LOW when not used.) RTC Crystal Output Clock/Cr ystal Input ( This pin needs to be at a level or clocking.) Cr ystal Output Reset ( This pin is always active during core power-on.) Nonmaskable Interrupt ( This pin should be pulled LOW when not used.) Boot Mode Strap ( These pins must be pulled to the state required for the desired boot mode.) External FET Drive I/O Power Supply Core Power Supply Real-Time Clock Power Supply External Ground Driver Type1 C D C C C C Refer to Figure 30 on Page 43 to Figure 41 on Page 45. Rev. E | Page 20 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 SPECIFICATIONS Component specifications are subject to change without notice. OPERATING CONDITIONS Parameter VDDINT Internal Supply Voltage VDDINT Internal Supply Voltage VDDINT Internal Supply Voltage 1 1 1 Conditions Nonautomotive 400 MHz and 500 MHz speed grade models Nonautomotive 533 MHz speed grade models 600 MHz speed grade models Automotive grade models2 Nonautomotive grade models2 Automotive grade models 2 2 2 2 2 Min Nominal 0.8 1.2 0.8 1.25 0.8 1.30 0.95 1.2 2.7 3.3 Max Unit 1.32 1.45 1.32 3.6 V V V V V V V V V V 1.375 V VDDINT Internal Supply Voltage1 VDDEXT External Supply Voltage VDDEXT External Supply Voltage VDDRTC Real-Time Clock Power Supply Voltage VDDRTC Real-Time Clock Power Supply Voltage VIH VIH VIL VIL TJ TJ TJ TJ TJ TJ 1 2 1.75 1.8/2.5/3.3 3.6 1.75 1.8/2.5/3.3 3.6 2.7 3.3 1.3 2.0 2.2 –0.3 –0.3 0 –40 –40 –40 –40 3.6 3.6 3.6 3.6 Nonautomotive grade models Automotive grade models2 VDDEXT = 1.85 V VDDEXT = Maximum VDDEXT = Maximum VDDEXT = 1.75 V VDDEXT = 2.25 V High Level Input Voltage3, 4 High Level Input Voltage3, 4 5 VIHCLKIN High Level Input Voltage Low Level Input Voltage Low Level Input Voltage Junction Temperature Junction Temperature Junction Temperature Junction Temperature Junction Temperature Junction Temperature 3, 6 3, 6 +0.3 V +0.6 V +95 °C +105 °C +125 °C +125 °C +105 °C +100 °C 160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = 0°C to + 70°C 160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = –40°C to + 85°C 169-Ball Plastic Ball Grid Array (PBGA) @ TAMBIENT = –40°C to + 105°C 169-Ball Plastic Ball Grid Array (PBGA) @ TAMBIENT = –40°C to + 85°C 176-Lead Quad Flatpack (LQFP) @ TAMBIENT = –40°C to + 85°C 160-Ball Chip Scale Ball Grid Array (CSP_BGA) @ TAMBIENT = –40°C to + 105°C –40 The regulator can generate VDDINT at levels of 0.85 V to 1.2 V with –5% to +10% tolerance, 1.25 V with–4% to +10% tolerance, and 1.3 V with –0% to +10% tolerance. See Ordering Guide on Page 59. 3 Applies to all input and bidirectional pins except CLKIN. 4 The ADSP-BF531/ADSP-BF532/ADSP-BF533 processors are 3.3 V tolerant (always accepts up to 3.6 V maximum VIH), but voltage compliance (on outputs, VOH) depends on the input VDDEXT, because VOH (maximum) approximately equals VDDEXT (maximum). This 3.3 V tolerance applies to bidirectional pins (DATA15–0, TMR2–0, PF15–0, PPI3–0, RSCLK1–0, TSCLK1–0, RFS1–0, TFS1–0, MOSI, MISO, SCK) and input only pins (BR, ARDY, PPI_CLK, DR0PRI, DR0SEC, DR1PRI, DR1SEC, RX, RTXI, TCK, TDI, TMS, TRST, CLKIN, RESET, NMI, and BMODE1–0). 5 Applies to CLKIN pin only. 6 Applies to all input and bidirectional pins. Rev. E | Page 21 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 ELECTRICAL CHARACTERISTICS Low Power1 Parameter VOH VOH VOH VOL VOL IIH IIHP IIL 6 High Speed2 1.5 1.9 2.4 0.2 0.4 10.0 50.0 10.0 10.0 10.0 0.2 0.4 V V V V V Test Conditions High Level Output Voltage3 High Level Output Voltage High Level Output Voltage Low Level Output Voltage Low Level Output Voltage High Level Input Current4 High Level Input Current JTAG5 Low Level Input Current 4 7 3 3 Min Typical Max Min Typical Max Unit 1.5 1.9 2.4 @ VDDEXT = 1.75 V, IOH = –0.5 mA @ VDDEXT = 2.25 V, IOH = –0.5 mA @ VDDEXT = 3.0 V, IOH = –0.5 mA @ VDDEXT = 1.75 V, IOL = 2.0 mA @ VDDEXT = 2.25 V/3.0 V, IOL = 2.0 mA @ VDDEXT = Maximum, VIN = VDD Maximum @ VDDEXT = Maximum, VIN = VDD Maximum @ VDDEXT = Maximum, VIN = 0 V @ VDDEXT = Maximum, VIN = VDD Maximum @ VDDEXT = Maximum, VIN = 0 V fIN = 1 MHz, TAMBIENT = 25°C, VIN = 2.5 V VDDEXT = 3.65 V with voltage regulator off ( VDDINT = 0 V ) VDDRTC = 3.3 V, TJUNCTION = 25°C VDDINT = 0.8 V, TJUNCTION = 25°C, SCLK = 25 MHz 3 3 1 0. 0 μA 5 0. 0 μA 10.0 μA 1 0. 0 μA 10.0 μA 4 50 20 35 37.5 47 1 98 2 40 2 50 3 08 89 pF μA μA mA mA mA mA mA mA mA IOZH IOZL6 CIN IDDHIBERNATE IDDRTC IDDDEEPSLEEP IDDSLEEP IDD_TYP10, 11 IDD_TYP IDD_TYP IDD_TYP 1 2 Three -State Leakage Current Input Capacitance8 Three -State Leakage Current7 VDDINT Current in Hibernate State VDDRTC Current 10 4 50 20 7.5 10 20 1 32 89 VDDINT Current in Deep Sleep Mode VDDINT = 0.8 V, TJUNCTION = 25°C VDDINT Current in Sleep Mode VDDINT Current Dissipation ( Typical) VDDINT = 0.8 V, fCCLK = 50 MHz, TJUNCTION = 25°C VDDINT Current Dissipation ( Typical) VDDINT = 1.14 V, fCCLK = 400 MHz, TJUNCTION = 25°C VDDINT Current Dissipation ( Typical) VDDINT = 1.2 V, fCCLK = 500 MHz, TJUNCTION = 25°C VDDINT Current Dissipation ( Typical) VDDINT = 1.2 V, fCCLK = 533 MHz, TJUNCTION = 25°C VDDINT Current Dissipation ( Typical) VDDINT = 1.3 V, fCCLK = 600 MHz, TJUNCTION = 25°C 10, 11 10, 11 10, 11 IDD_TYP10, 11 Applies to all 400 MHz speed grade models. See Ordering Guide on Page 59. Applies to all 500 MHz, 533 MHz, and 600 MHz speed grade models. See Ordering Guide on Page 59. 3 Applies to output and bidirectional pins. 4 Applies to input pins except JTAG inputs. 5 Applies to JTAG input pins (TCK, TDI, TMS, TRST). 6 Absolute value. 7 Applies to three-statable pins. 8 Applies to all signal pins. 9 Guaranteed, but not tested. 10 See Estimating Power for ADSP-BF531/BF532/BF533 Blackfin Processors (EE-229) on the Analog Devices website (www.analog.com)—use site search on “EE-229.” 11 Processor executing 75% dual MAC, 25% ADD with moderate data bus activity. Rev. E | Page 22 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 ABSOLUTE MAXIMUM RATINGS Stresses greater than those listed in the table may cause perma­ nent damage to the device. These are stress ratings only. Functional operation of the device at these or any other condi­ tions greater than those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameter Internal (Core) Supply Voltage ( VDDINT) External (I/O) Supply Voltage ( VDDEXT) Input Voltage1 Output Voltage Swing Load Capacitance2 Storage Temperature Range Junction Temperature Under Bias 1 PACKAGE INFORMATION The information presented in Figure 10 and Table 11 provides details about the package branding for the Blackfin processors. For a complete listing of product availability, see the Ordering Guide on Page 59. Rating – 0.3 V to + 1.4 V – 0 . 5 V t o + 3. 8 V – 0.5 V to +3.8 V – 0.5 V to VDDEXT + 0.5 V 200 pF – 65 C to + 150°C 12 5° C a ADSP-BF53x tppZ-cc vvvvvv.x n.n yyww country_of_o rigin B Figure 10. Product Information on Package Table 11. Package Brand Information Brand Key Field Description Applies to 100% transient duty cycle. For other duty cycles see Table 10. 2 For proper SDRAM controller operation, the maximum load capacitance is 50 pF (at 3.3 V) or 30 pF (at 2.5 V) for ADDR19–1, DATA15–0, ABE1–0/SDQM1–0, CLKOUT, SCKE, SA10, SRAS, SCAS, SWE, and SMS. ADSP-BF53x Either ADSP-BF531, ADSP-BF532, or ADSP-BF533 t pp Z cc vvvvvv.x n.n yyww Temperature Range Package Type RoHS Compliant Part See Ordering Guide Assembly Lot Code Silicon Revision Date Code Table 10. Maximum Duty Cycle for Input Transient Voltage1 VIN Min ( V ) –0.50 – 0. 7 0 – 0. 8 0 – 0. 9 0 – 1. 0 0 1 2 VIN Max (V )2 +3.80 +4.00 +4.10 +4.20 +4.30 Maximum Duty Cycle 100% 40 % 25 % 15 % 10 % Applies to all signal pins with the exception of CLKIN, XTAL, VROUT1–0. Only one of the listed options can apply to a particular design. ESD SENSITIVITY E SD (e lec trostat ic discharg e) se nsitive device. Charged devices and circuit boards can discharge without detec tion. Although this product features patented or proprietar y circuitr y, damage may occur on devices subjected to high energy ESD. Therefore, p rop er ESD p re c autions s h oul d b e t a ke t o avo i d per formance degradation or loss of functionality. Rev. E | Page 23 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 TIMING SPECIFICATIONS Table 12 through Table 15 describe the timing requirements for the ADSP-BF531/ADSP-BF532/ADSP-BF533 processor clocks. Take care in selecting MSEL, SSEL, and CSEL ratios so as not to exceed the maximum core clock and system clock as described Table 12. Core Clock (CCLK) Requirements—400 MHz Models1 TJUNCTION = 125°C Max 400 333 295 All2 Other TJUNCTION Max 4 00 3 64 3 33 280 250 in Absolute Maximum Ratings on Page 23, and the voltage con­ trolled oscillator (VCO) operating frequencies described in Table 14. Table 14 describes phase-locked loop operating conditions. Parameter fCCLK CCLK Frequency ( VDDINT = 1.14 V Minimum) fCCLK CCLK Frequency ( VDDINT = 1.045 V Minimum) fCCLK CCLK Frequency ( VDDINT = 0.95 V Minimum) fCCLK CCLK Frequency ( VDDINT = 0.85 V Minimum) fCCLK CCLK Frequency ( VDDINT = 0.8 V Minimum ) 1 2 Internal Regulator Setting 1.20 V 1.10 V 1.00 V 0.90 V 0.85 V Unit MH z MH z MH z MH z MH z See Ordering Guide on Page 59. See Operating Conditions on Page 21. Table 13. Core Clock (CCLK) Requirements—500 MHz, 533 MHz, and 600 MHz Models Parameter fCCLK CCLK Frequency ( VDDINT = 1.3 V Minimum)1 fCCLK CCLK Frequency ( VDDINT = 1.2 V Minimum)2 CCLK Frequency ( VDDINT = 1.14 V Minimum)3 fCCLK fCCLK CCLK Frequency ( VDDINT = 1.045 V Minimum) fCCLK CCLK Frequency ( VDDINT = 0.95 V Minimum) fCCLK CCLK Frequency ( VDDINT = 0.85 V Minimum) fCCLK CCLK Frequency ( VDDINT = 0.8 V Minimum ) 1 2 Internal Regulator Setting 1.30 V 1.25 V 1.20 V 1.10 V 1.00 V 0.90 V 0.85 V Max 6 00 5 33 5 00 4 44 4 00 3 33 2 50 Unit MH z MH z MH z MH z MH z MH z MH z Applies to 600 MHz models only. See Ordering Guide on Page 59. Applies to 533 MHz and 600 MHz models only. See Ordering Guide on Page 59. 533 MHz models cannot support internal regulator levels above 1.25 V. 3 Applies to 500 MHz, 533 MHz, and 600 MHz models. See Ordering Guide on Page 59. 500 MHz models cannot support internal regulator levels above 1.20 V. Table 14. Phase-Locked Loop Operating Conditions Parameter fVCO Voltage Controlled Oscillator ( VCO) Frequency Min 50 Max Maximum fCCLK Unit MH z Table 15. System Clock (SCLK) Requirements Parameter1 MBGA/PBGA fSCLK fSCLK LQFP fSCLK fSCLK 1 VDDEXT = 1.8 V Max CLKOUT/SCLK Frequency ( VDDINT ≥ 1.14 V ) CLKOUT/SCLK Frequency ( VDDINT < 1.14 V ) CLKOUT/SCLK Frequency ( VDDINT ≥ 1.14 V ) CLKOUT/SCLK Frequency ( VDDINT < 1.14 V ) 10 0 10 0 10 0 83 VDDEXT = 2.5 V/3.3 V Max 133 100 133 83 Unit MH z MH z MH z MH z tSCLK (= 1/fSCLK) must be greater than or equal to tCCLK. Rev. E | Page 24 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Clock and Reset Timing Table 16 and Figure 11 describe clock and reset operations. Per Absolute Maximum Ratings on Page 23, combinations of CLKIN and clock multipliers/divisors must not result in core/ Table 16. Clock and Reset Timing Parameter Timing Requirements tCKIN CLKIN Period1, 2, 3, 4 tCKINL CLKIN Low Pulse tCKINH CLKIN High Pulse tWRST RESET Asserted Pulse Width Low5 1 2 system clocks exceeding the maximum limits allowed for the processor, including system clock restrictions related to supply voltage. Min 25.0 10.0 10.0 11 tCKIN Max 100.0 Unit ns ns ns ns Applies to PLL bypass mode and PLL nonbypass mode. CLKIN frequency must not change on the fly. 3 Combinations of the CLKIN frequency and the PLL clock multiplier must not exceed the allowed fVCO, fCCLK, and fSCLK settings discussed in Table 12 on Page 24 through Table 15 on Page 24. Since the default behavior of the PLL is to multiply the CLKIN frequency by 10, the 400 MHz speed grade parts cannot use the full CLKIN period range. 4 If the DF bit in the PLL_CTL register is set, then the maximum tCKIN period is 50 ns. 5 Applies after power-up sequence is complete. At power-up, the processor’s internal phase-locked loop requires no more than 2,000 CLKIN cycles, while RESET is asserted, assuming stable power supplies and CLKIN (not incl uding start-up time of external clock oscillator). tCK IN C LK I N tCKINL RESET tCKINH tWR S T Figure 11. Clock and Reset Timing Rev. E | Page 25 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Asynchronous Memory Read Cycle Timing Table 17. Asynchronous Memory Read Cycle Timing VDDEXT = 1.8 V Min Max 2. 1 1. 0 4. 0 1. 0 6.0 1. 0 0. 8 VDDEXT = 2.5 V/3.3 V Min Max Unit 2. 1 0.8 4.0 0.0 6.0 ns ns ns ns ns ns Parameter Timing Requirements tSDAT DATA15 – 0 Setup Before CLKOUT tHDAT DATA15 – 0 Hold After CLKOUT tSARDY ARDY Setup Before CLKOUT tHARDY ARDY Hold After CLKOUT Switching Characteristics tDO Output Delay After CLKOUT1 tHO Output Hold After CLKOUT 1 1 Output pins include AMS3 – 0, ABE1– 0, ADDR19 –1, DATA15 – 0, AOE, ARE. HO LD 1 C YC L E SE TU P 2 C Y CLE S P R OG RAMM ED RE A D ACCE SS 4 C Y C LE S ACCE SS E X TENDED 3 CYC L ES C LK OUT t DO A M Sx t HO A BE1–0 A DDR19–1 AB E, A DDRE S S A OE t DO A RE tHO t SAR D Y A RDY t HA RDY tHARDY t SARD Y t SDAT tHDAT D ATA15–0 R EA D Figure 12. Asynchronous Memory Read Cycle Timing Rev. E | Page 26 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Asynchronous Memory Write Cycle Timing Table 18. Asynchronous Memory Write Cycle Timing VDDEXT = 1.8 V Min Max 4. 0 1. 0 6.0 1. 0 6.0 1. 0 0. 8 1.0 6.0 VDDEXT = 2.5 V/3.3 V Min Max Unit 4.0 0.0 6.0 ns ns ns ns ns ns Parameter Timing Requirements tSARDY ARDY Setup Before CLKOUT tHARDY ARDY Hold After CLKOUT Switching Characteristics tDDAT DATA15 – 0 Disable After CLKOUT tENDAT DATA15 – 0 Enable After CLKOUT Output Delay After CLKOUT1 tDO tHO Output Hold After CLKOUT 1 1 Output pins include AMS3 – 0, ABE1 – 0, ADDR19 – 1, DATA15 – 0, AOE, AWE. ACCE SS EXT ENDE D 1 CY CLE S ETUP 2 C Y CLE S P ROG RAM MED W RITE ACCES S 2 CYCL ES H OLD 1 CY CLE CLKO UT t DO AMS x t HO ABE 1–0 ADDR19–1 ABE , ADDRESS tDO A WE tHO t SARDY ARDY t HARDY t EN D A T DAT A15–0 W RITE DATA tSARDY t DD AT Figure 13. Asynchronous Memory Write Cycle Timing Rev. E | Page 27 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 SDRAM Interface Timing Table 19. SDRAM Interface Timing1 VDDEXT = 1.8 V Min Max 2.1 0.8 10.0 2.5 2.5 6.0 1.0 6.0 1.0 1.0 1.0 4.0 VDDEXT = 2.5 V/3.3 V Min Max Unit 1.5 0.8 7.5 2.5 2.5 4.0 ns ns ns ns ns ns ns ns ns Parameter Timing Requirements tSSDAT DATA Setup Before CLKOUT tHSDAT DATA Hold After CLKOUT Switching Characteristics tSCLK CLKOUT Period2 tSCLKH CLKOUT Width High CLKOUT Width Low tSCLKL tDCAD Command, ADDR, Data Delay After CLKOUT3 tHCAD Command, ADDR, Data Hold After CLKOUT1 tDSDAT Data Disable After CLKOUT tENSDAT Data Enable After CLKOUT 1 2 SDRAM timing for TJUNCTION = 125°C is limited to 100 MHz. Refer to Table 15 on Page 24 for maximum fSCLK at various VDDINT. 3 Command pins include: SRAS, SCAS, SWE, SDQM, SMS, SA10, SCKE. tSC L K CLKO UT tSC L K H tSS D A T tH SD A T DATA(IN) tSC LK L tDC AD tEN SDA T DATA( OUT ) tDS DAT tHCA D tDC AD CMN D ADDR (O UT) tHC AD NOT E: COM M AND = S RAS, SC AS, SWE , S DQM , S MS, SA10, S CKE . Figure 14. SDRAM Interface Timing Rev. E | Page 28 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 External Port Bus Request and Grant Cycle Timing Table 20 and Figure 15 describe external port bus request and bus grant operations. Table 20. External Port Bus Request and Grant Cycle Timing VDDEXT = 1.8 V VDDEXT = 1.8 V VDDEXT = 2.5 V/3.3 V LQFP/PBGA Packages MBGA Package All Packages Min Max Min Max Min Max U ni t 4.6 1.0 4.5 4.5 6.0 6.0 6.0 6.0 4. 6 1.0 4.5 4.5 4.6 4.6 4.6 4.6 4.6 0.0 4.5 4.5 3.6 3.6 3.6 3.6 ns ns ns ns ns ns ns ns Parameter Timing Requirements tBS BR Asserted to CLKOUT High Setup tBH CLKOUT High to BR Deasser ted Hold Time Switching Characteristics tSD CLKOUT Low to AMSx, Address, and ARE/AWE Disable tSE CLKOUT Low to AMSx, Address, and ARE/AWE Enable tDBG CLKOUT High to BG High Setup tEBG CLKOUT High to BG Deasser ted Hold Time tDBH CLKOUT High to BGH High Setup tEBH CLKOUT High to BGH Deasserted Hold Time CLKOUT tBS BR tBH tSD AMSx tSE tSD tSE ADDR19-1 A BE1-0 tSD tSE AWE ARE tDBG BG tEBG tDBH BGH tEBH Figure 15. External Port Bus Request and Grant Cycle Timing Rev. E | Page 29 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Parallel Peripheral Interface Timing Table 21 and Figure 16 through Figure 21 on Page 33 describe parallel peripheral interface operations. Table 21. Parallel Peripheral Interface Timing VDDEXT = 1.8 V LQFP/PBGA Packages Min Max 8.0 20.0 6.0 1 . 02 2.03 3.5 1.5 11.0 1.7 11.0 1.8 9.0 1.8 VDDEXT = 1.8 V MBGA Package Min Max 8.0 20.0 6.0 1.02 2.03 3.5 1.5 8.0 1.7 9.0 VDDEXT = 2.5 V/3.3 V All Packages Min Max U ni t 6.0 1 5. 0 4.02 6.03 1.02 2.03 3.5 1.5 8. 0 ns ns ns ns ns ns ns ns ns ns ns Parameter Timing Requirements tPCLKW PPI_CLK Width tPCLK PPI_CLK Period1 tSFSPE External Frame Sync Setup Before PPI_CLK Edge (Nonsampling Edge for Rx, Sampling Edge for Tx) tHFSPE External Frame Sync Hold After PPI_CLK tSDRPE Receive Data Setup Before PPI_CLK tHDRPE Receive Data Hold After PPI_CLK Switching Characteristics—GP Output and Frame Capture Modes tDFSPE Internal Frame Sync Delay After PPI_CLK tHOFSPE Internal Frame Sync Hold After PPI_CLK 1.7 tDDTPE Transmit Data Delay After PPI_CLK tHDTPE Transmit Data Hold After PPI_CLK 1.8 1 PPI_CLK frequency cannot exceed fSCLK/2 2 Applies when PPI_CONTROL Bit 8 is cleared. See Figure 17 on Page 31 and Figure 20 on Page 32. 3 Applies when PPI_CONTROL Bit 8 is set. See Figure 18 on Page 31 and Figure 21 on Page 33. FRAME SYNC IS DRIVEN OUT POLC = 0 PPI_CLK DATA0 IS SAMPLED PPI_CLK POLC = 1 tDFSPE t POLS = 1 PPI_FS1 POLS = 0 HOFSPE POLS = 1 PPI_FS2 POLS = 0 tSDRPE tHDRPE PPI_DATA Figure 16. PPI GP Rx Mode with Internal Frame Sync Timing Rev. E | Page 30 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 FRAME SYNC IS SAMPLED FOR DATA0 DATA0 IS SAMPLED PPI_CLK POLC = 0 PPI_CLK POLC = 1 DATA1 IS SAMPLED t tSFSPE POLS = 1 PPI_FS1 POLS = 0 HFSPE POLS = 1 PPI_FS2 POLS = 0 t SDRPE t HDRPE PPI_DATA Figure 17. PPI GP Rx Mode with External Frame Sync Timing DATA SAMPLING/ FRAME SYNC SAMPLING EDGE PPI_CLK POLC = 0 PPI_CLK POLC = 1 DATA SAMPLING/ FRAME SYNC SAMPLING EDGE t POLS = 1 PPI_FS1 POLS = 0 SFSPE t HFSPE POLS = 1 PPI_FS2 POLS = 0 t PPI_DATA SDRPE t HDRPE Figure 18. PPI GP Rx Mode with External Frame Sync Timing (Bit 8 of PPI_CONTROL Set) Rev. E | Page 31 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 FRAME SYNC IS DRIVEN OUT DATA0 IS DRIVEN OUT PPI_CLK POLC = 0 PPI_CLK POLC = 1 t tHOFSPE POLS = 1 PPI_FS1 POLS = 0 DFSPE POLS = 1 PPI_FS2 POLS = 0 t t DDTPE HDTPE PPI_DATA DATA0 Figure 19. PPI GP Tx Mode with Internal Frame Sync Timing FRAME SYNC IS SAMPLED PPI_CLK POLC = 0 PPI_CLK POLC = 1 tHFSPE tSFSPE POLS = 1 PPI_FS1 POLS = 0 DATA0 IS DRIVEN OUT POLS = 1 PPI_FS2 POLS = 0 tHDTPE PPI_DATA DATA0 t DDTPE Figure 20. PPI GP Tx Mode with External Frame Sync Timing Rev. E | Page 32 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 DATA DRIVING/ FRAME SYNC SAMPLING EDGE PPI_CLK POLC = 0 PPI_CLK POLC = 1 t t POLS = 1 PPI_FS1 POLS = 0 SFSPE HFSPE DATA DRIVING/ FRAME SYNC SAMPLING EDGE POLS = 1 PPI_FS2 POLS = 0 tDDTPE t PPI_DATA HDTPE Figure 21. PPI GP Tx Mode with External Frame Sync Timing (Bit 8 of PPI_CONTROL Set) Rev. E | Page 33 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Serial Ports Table 22 through Table 25 on Page 35 and Figure 22 on Page 35 through Figure 23 on Page 36 describe Serial Port operations. Table 22. Serial Ports—External Clock VDDEXT = 1.8 V Min M ax 3.0 3.0 3.0 3.0 8.0 20.0 10.0 0.0 10.0 0.0 0.0 0.0 10.0 VDDEXT = 2.5 V/3.3 V Min M ax Un it 3.0 3.0 3.0 3.0 4.5 15.02 10.0 ns ns ns ns ns ns ns ns ns ns Parameter Timing Requirements tSFSE TFSx/RFSx Setup Before TSCLKx/RSCLKx1 tHFSE TFSx/RFSx Hold After TSCLKx/RSCLKx1 tSDRE Receive Data Setup Before RSCLKx1 tHDRE Receive Data Hold After RSCLKx1 tSCLKEW TSCLKx/RSCLKx Width tSCLKE TSCLKx/RSCLKx Period Switching Characteristics tDFSE TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)3 tHOFSE TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)1 tDDTE Transmit Data Delay After TSCLKx1 tHDTE Transmit Data Hold After TSCLKx1 1 2 Referenced to sample edge. For receive mode with external RSCLKx and external RFSx only, the maximum specification is 11.11 ns (90 MHz). 3 Referenced to drive edge. Table 23. Serial Ports—Internal Clock VDDEXT = 1.8 V VDDEXT = 1.8 V VDDEXT = 2.5 V/3.3 V LQFP/PBGA MBGA Package All Packages Packages Min Max Min Max Min Max U ni t 11 . 0 −2.0 9. 0 0. 0 4. 5 15.0 3.0 −1.0 3.0 −2.0 6. 0 3.0 −2.0 4.5 3.0 −1.0 3.0 9. 0 −2.0 9. 0 0. 0 4.5 15.0 3.0 ns ns ns ns ns ns ns ns ns ns ns Parameter Timing Requirements tSFSI TFSx/RFSx Setup Before TSCLKx/RSCLKx1 11 . 0 tHFSI TFSx/RFSx Hold After TSCLKx/RSCLKx1 −2.0 9. 5 tSDRI Receive Data Setup Before RSCLKx1 1 tHDRI Receive Data Hold After RSCLKx 0. 0 tSCLKEW TSCLKx/RSCLKx Width 4.5 tSCLKE TSCLKx/RSCLKx Period 20.0 Switching Characteristics tDFSI TFSx/RFSx Delay After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)2 tHOFSI TFSx/RFSx Hold After TSCLKx/RSCLKx (Internally Generated TFSx/RFSx)1 −1.0 tDDTI Transmit Data Delay After TSCLKx1 tHDTI Transmit Data Hold After TSCLKx1 −2.5 tSCLKIW TSCLKx/RSCLKx Width 6.0 1 2 Referenced to sample edge. Referenced to drive edge. Rev. E | Page 34 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 DATA RECEIVE—INTERNAL CL OCK D RIVE EDGE SAMPLE EDGE DATA RECEIVE—EXTERNAL CL OCK DRIVE EDGE SAMPLE EDGE tSCLKIW RSCLKx RSCLKx tSCLKEW tDFSI tHO FSI RF Sx tDFSE tSFSI tHFSI RFSx tHOFSE tSFSE tHFSE tSDRI DRx tHDRI DRx tSDRE tHDR E NOT E: EIT HER T HE RISING EDGE OR FALLING EDGE OF RSCLKx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE. DATA TRANSMIT—INTERNAL CL OCK DRIVE EDGE SAMPLE EDGE DATA T RANSMIT—EXTERNAL CLOCK DRIVE EDGE SAMPLE EDGE tSCLKIW T SCL Kx T SCL Kx tSCLKEW tDFSI tHOFSI TFSx tDFSE tSFSI tHFSI TFSx tHOFSE tSFSE tHFSE tDDTI tHDTI DT x DTx tDDTE tHDTE NOTE: EIT HER T HE RISING EDGE OR FALL ING EDGE OF RSCL Kx OR TSCLKx CAN BE USED AS THE ACTIVE SAMPLING EDGE. Figure 22. Serial Ports Table 24. Serial Ports—Enable and Three-State VDDEXT = 1.8 V Max VDDEXT = 2.5 V/3.3 V Min Ma x Unit 0 10.0 −2.0 3.0 −2.0 3.0 10.0 ns ns ns ns Parameter Switching Characteristics tDTENE Data Enable Delay from External TSCLKx1 tDDTTE Data Disable Delay from External TSCLKx1 tDTENI Data Enable Delay from Internal TSCLKx1 tDDTTI Data Disable Delay from Internal TSCLKx1 1 Min 0 Referenced to drive edge. Table 25. External Late Frame Sync VDDEXT = 1.8 V VDDEXT = 1.8 V LQFP/PBGA Packages MBGA Package Min Max Min Max 10.5 0 10.0 0 VDDEXT = 2.5 V/3.3 V All Packages Min Max 10.0 Parameter Switching Characteristics tDDTLFSE Data Delay from Late External TFSx or External RFSx with MCE = 1, MFD = 01, 2 tDTENLFS Data Enable from Late FS or MCE = 1, MFD = 01, 2 0 1 U ni t ns ns MCE = 1, TFSx enable and TFSx valid follow tDTENLFS and tDDTLFSE. 2 If external RFSx/TFSx setup to RSCLKx/TSCLK x> tSCLKE/2, then tDDTTE/I and tDTENE/I apply; otherwise tDDTLFSE and tDTENLFS apply. Rev. E | Page 35 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 EXTERNAL RFSx WITH MCE = 1, MFD = 0 DRIVE RSCLKx SAMPLE DRIVE tSFSE/I tHOFSE/I RFSx tDTENLFS tDDTTE/I tDTENE/I 1ST BIT 2ND BIT DTx tDDTLFSE LATE EXTERNAL TFSx DRIVE TSCLKx SAMPLE DRIVE tSFSE/I tHOFSE/I TFSx tDTENLFS DTx tDDTTE/I tDTENE/I 1ST BIT 2ND BIT tDDTLFSE Figure 23. External Late Frame Sync Rev. E | Page 36 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Serial Peripheral Interface (SPI) Port —Master Timing Table 26 and Figure 24 describe SPI port master operations. Table 26. Serial Peripheral Interface (SPI) Port—Master Timing VDDEXT = 1.8 V VDDEXT = 1.8 V LQFP/PBGA Packages MBGA Package Min Max Min Max 8.5 –1.5 2tSCLK –1.5 2tSCLK – 1.5 2tSCLK – 1.5 4tSCLK – 1.5 2tSCLK – 1.5 2tSCLK – 1.5 0 –1.0 VDDEXT = 2.5 V/3.3 V All Packages Min Max 7.5 – 1. 5 2tSCLK –1.5 2tSCLK – 1.5 2tSCLK – 1.5 4tSCLK – 1.5 2tSCLK – 1.5 2tSCLK – 1.5 0 – 1. 0 Parameter Timing Requirements tSSPIDM Data Input Valid to SCK Edge (Data Input Setup) 10.5 tHSPIDM SCK Sampling Edge to Data Input Invalid –1.5 Switching Characteristics tSDSCIM SPISELx Low to First SCK Edge 2tSCLK –1.5 tSPICHM Serial Clock High Period 2tSCLK – 1.5 tSPICLM Serial Clock Low Period 2tSCLK – 1.5 tSPICLK Serial Clock Period 4tSCLK – 1.5 tHDSM Last SCK Edge to SPISELx High 2tSCLK – 1.5 tSPITDM Sequential Transfer Delay 2tSCLK – 1.5 0 tDDSPIDM SCK Edge to Data Out Valid (Data Out Delay) tHDSPIDM SCK Edge to Data Out Invalid (Data Out Hold) –1.0 SPISELx (OUTPUT) Unit ns ns ns ns ns ns ns ns ns ns 6 +4.0 6 + 4. 0 6 +4.0 tSDSCIM SCK (CPOL = 0) (OUTPUT) tSPICHM tSPICLM tSPICLK tHDSM tSPITDM tSPICLM SCK (CPOL = 1) (OUTPUT) tSPICHM tDDSPIDM MOSI (OUTPUT) CPHA = 1 MISO (INPUT) MSB tHDSPIDM LSB tSSPIDM MSB VALID tHSPIDM tSSPIDM LSB VALID tHSPIDM tDDSPIDM MOSI (OUTPUT) CPHA = 0 MSB tHDSPIDM LSB tSSPIDM MISO (INPUT) MSB VALID tHSPIDM LSB VALID Figure 24. Serial Peripheral Interface (SPI) Port—Master Timing Rev. E | Page 37 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Serial Peripheral Interface (SPI) Port —Slave Timing Table 27 and Figure 25 describe SPI port slave operations. Table 27. Serial Peripheral Interface (SPI) Port—Slave Timing VDDEXT = 1.8 V VDDEXT = 1.8 V LQFP/PBGA Packages MBGA Package Min Max Min Max 2tSCLK – 1.5 2tSCLK – 1.5 4tSCLK – 1.5 2tSCLK – 1.5 2tSCLK – 1.5 2tSCLK – 1.5 1.6 1.6 10 10 10 10 0 0 0 0 9 9 10 10 VDDEXT = 2.5 V/3.3 V All Packages Min Max 2tSCLK – 1.5 2tSCLK – 1.5 4tSCLK – 1.5 2tSCLK – 1.5 2tSCLK – 1.5 2tSCLK – 1.5 1.6 1. 6 0 0 0 0 8 8 10 10 Parameter Timing Requirements tSPICHS Serial Clock High Period 2tSCLK – 1.5 tSPICLS Serial Clock Low Period 2tSCLK – 1.5 tSPICLK Serial Clock Period 4tSCLK – 1.5 2tSCLK – 1.5 tHDS Last SCK Edge to SPISS Not Asserted tSPITDS Sequential Transfer Delay 2tSCLK – 1.5 tSDSCI SPISS Assertion to First SCK Edge 2tSCLK – 1.5 tSSPID Data Input Valid to SCK Edge (Data Input Setup) 1.6 tHSPID SCK Sampling Edge to Data Input Invalid 1. 6 Switching Characteristics tDSOE SPISS Assertion to Data Out Active 0 tDSDHI SPISS Deasser tion to Data High Impedance 0 tDDSPID SCK Edge to Data Out Valid (Data Out Delay) 0 tHDSPID SCK Edge to Data Out Invalid (Data Out Hold) 0 U ni t ns ns ns ns ns ns ns ns ns ns ns ns SPISS (INPUT) tSPICHS SCK (CPOL = 0) (INPUT) tSPICLS tSPICLK tHDS tSPITDS tSDSCI SCK (C POL = 1) (INPUT) tSPICLS tSPICHS tDSOE tDDSPID tHDSPID tDDSPID tDSDHI LSB MISO (OUTPUT) CPHA = 1 MOSI (INPUT) MSB tSSPID MSB VALID tHSPID tSSPID tHSPID LSB VALID tDSOE MISO (OUTPUT) CPHA = 0 MOSI (INPUT) tDDSPID MSB LSB tDSDHI tHSPID tSSPID MSB VALID LSB VALID Figure 25. Serial Peripheral Interface (SPI) Port—Slave Timing Rev. E | Page 38 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Universal Asynchronous Receiver-Transmitter (UART) Port—Receive and Transmit Timing Figure 26 describes UART port receive and transmit operations. The maximum baud rate is SCLK/16. As shown in Figure 26 there is some latency between the generation internal UART interrupts and the external data operations. These latencies are negligible at the data transmission rates for the UART. CLKOUT (SAMPLE CLOCK) Rx DATA[8:5] STOP RECEIVE INTERNAL UART RECEIVE INTERRUPT UART RECEIVE BIT SET BY DATA STOP; CLEARED BY FIFO READ START Tx DATA[8:5] STOP[2:1] TRANSMIT INTERNAL UART TRANSMIT INTERRUPT UART TRANSMIT BIT SET BY PROGRAM; CLEARED BY WRITE TO TRANSMIT Figure 26. UART Port—Receive and Transmit Timing Rev. E | Page 39 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 General-Purpose I/O Port F Pin Cycle Timing Table 28 and Figure 27 describe GPIO pin operations. Table 28. General-Purpose I/O Port F Pin Cycle Timing VDDEXT = 1.8 V Min Max tSCLK + 1 6 VDDEXT = 2.5 V/3.3 V Min Max U ni t tSCLK + 1 6 ns ns Parameter Timing Requirement tWFI GPIO Input Pulse Width Switching Characteristic tDFO GPIO Output Delay from CLKOUT Low CLKOU T tDFO PFx (OUTPUT) GPIO OUTPUT tWFI PF x (INPUT) GPIO INPUT Figure 27. GPIO Cycle Timing Rev. E | Page 40 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Timer Cycle Timing Table 29 and Figure 28 describe timer expired operations. The input signal is asynchronous in width capture mode and exter­ nal clock mode and has an absolute maximum input frequency of fSCLK/2 MHz. Table 29. Timer Cycle Timing VDDEXT = 1.8 V Max VDDEXT = 2.5 V/3.3 V Min Max 1 1 (232–1) 1 (232–1) Parameter Timing Characteristics tWL Timer Pulse Width Input Low1 (Measured in SCLK Cycles) tWH Timer Pulse Width Input High1 (Measured in SCLK Cycles) Switching Characteristic tHTO Timer Pulse Width Output2 (Measured in SCLK Cycles) 1 Min 1 1 1 Unit SCLK SCLK SCLK The minimum pulse widths apply for TMRx input pins in width capture and external clock modes. They also apply to the PF1 or PPI_CLK input pins in PWM output mode. 2 The minimum time for tHTO is one cycle, and the maximum time for tHTO equals (232–1) cycles. CLKOUT tHTO TMRx (PWM OUTPUT MODE) TMRx (WIDTH CAPTURE AND EXTERNAL CLOCK MODES) tWL tWH Figure 28. Timer PWM_OUT Cycle Timing Rev. E | Page 41 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 JTAG Test and Emulation Port Timing Table 30 and Figure 29 describe JTAG port operations. Table 30. JTAG Port Timing VDDEXT = 1.8 V Max VDDEXT = 2.5 V/3.3 V Min Ma x 20 4 4 4 5 4 10 12 10 12 Parameter Timing Requirements tTCK TCK Period TDI, TMS Setup Before TCK High tSTAP tHTAP TDI, TMS Hold After TCK High tSSYS System Inputs Setup Before TCK High1 tHSYS System Inputs Hold After TCK High1 tTRSTW TRST Pulse Width2 (Measured in TCK Cycles) Switching Characteristics tDTDO TDO Delay from TCK Low tDSYS System Outputs Delay After TCK Low3 1 Min 20 4 4 4 5 4 Unit ns ns ns ns ns TCK ns ns 0 0 System Inputs = DATA15–0, ARDY, TMR2–0, PF15–0, PPI_CLK, RSCLK0–1, RFS0–1, DR0PRI, DR0SEC, TSCLK0–1, TFS0–1, DR1PRI, DR1SEC, MOSI, MISO, SCK, RX, RESET, NMI, BMODE1–0, BR, PP3–0. 50 MHz maximum 3 System Outputs = DATA15–0, ADDR19–1, ABE1–0, AOE, ARE, AWE, AMS3–0, SRAS, SCAS, SWE, SCKE, CLKOUT, SA10, SMS, TMR2–0, PF15–0, RSCLK0–1, RFS0–1, TSCLK0–1, TFS0–1, DT0PRI, DT0SEC, DT1PRI, DT1SEC, MOSI, MISO, SCK, TX, BG, BGH, PPI3–0. 2 tTCK TCK tSTAP T MS TDI tHTAP tDTDO TDO tSSYS SYST EM INPU TS tHSYS tDSYS SYSTEM OUTPUT Figure 29. JTAG Port Timing Rev. E | Page 42 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 OUTPUT DRIVE CURRENTS Figure 30 through Figure 41 show typical current-voltage char­ acteristics for the output drivers of the ADSP-BF531/ ADSP-BF532/ADSP-BF533 processor. The curves represent the current drive capability of the output drivers as a function of output voltage. 150 VDDEXT = 2.75V VDDEXT = 2.50V VDDEXT = 2.25V 150 VDDEXT = 3.65V VDDEXT = 3.30V VDDEXT = 2.95V 100 SOURCE CURRENT (mA) 50 0 VOH –50 100 SOURCE CURRENT (mA) –100 VOL 50 –150 0 0 VOH 0.5 1.0 1.5 2.0 2.5 3.0 3.5 SOURCE VOLTAGE (V) –50 VOL Figure 32. Drive Current A (VDDEXT = 3.3 V) 150 VDDEXT = 2.75V VDDEXT = 2.50V VDDEXT = 2.25V –100 –150 100 0 0.5 1.0 1.5 2.0 2.5 3.0 SOURCE CURRENT (mA) 50 SOURCE VOLTAGE (V) Figure 30. Drive Current A (VDDEXT = 2.5 V) 80 60 SOURCE CURRENT (mA) 0 VOH VDDEXT = 1.9V VDDEXT = 1.8V VDDEXT = 1.7V –50 40 20 0 –20 –40 –60 –80 0 –100 VOL –150 0 0.5 1.0 1.5 2.0 2.5 3.0 SOURCE VOLTAGE (V) Figure 33. Drive Current B (VDDEXT = 2.5 V) 80 60 0.5 1.0 SOURCE VOLTAGE (V) 1.5 2.0 SOURCE CURRENT (mA) VDDEXT = 1.9V VDDEXT = 1.8V VDDEXT = 1.7V 40 20 0 –20 –40 –60 –80 0 Figure 31. Drive Current A (VDDEXT = 1.8 V) 0.5 1.0 SOURCE VOLTAGE (V) 1.5 2.0 Figure 34. Drive Current B (VDDEXT = 1.8 V) Rev. E | Page 43 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 100 150 VDDEXT = 3.65V VDDEXT = 3.30V VDDEXT = 2.95V SOURCE CURRENT (mA) 80 60 40 20 0 VOH –20 –40 –60 VOL –150 0 0.5 1.0 1.5 2.0 SOURCE VOLTAGE (V) 2.5 3.0 3.5 –80 –100 0 VOL VDDEXT = 3.65V VDDEXT = 3.30V VDDEXT = 2.95V 100 SOURCE CURRENT (mA) 50 0 VOH –50 –100 0.5 1.0 1.5 2.0 2.5 3.0 3.5 SOURCE VOLTAGE (V) Figure 35. Drive Current B (VDDEXT = 3.3 V) 60 VDDEXT = 2.75V VDDEXT = 2.50V VDDEXT = 2.25V SOURCE CURRENT (mA) 100 80 60 20 SOURCE CURRENT (mA) 40 20 0 –20 –40 –60 –80 0 0.5 1.0 1.5 2.0 2.5 3.0 SOURCE VOLTAGE (V) –100 0 Figure 38. Drive Current C (VDDEXT = 3.3 V) VDDEXT = 2.75V VDDEXT = 2.50V VDDEXT = 2.25V 40 0 VOH VOH –20 –40 VOL –60 VOL 0.5 1.0 1.5 2.0 2.5 3.0 Figure 36. Drive Current C (VDDEXT = 2.5 V) 30 20 SOURCE CURRENT (mA) SOURCE VOLTAGE (V) Figure 39. Drive Current D (VDDEXT = 2.5 V) VDDEXT = 1.9V VDDEXT = 1.8V VDDEXT = 1.7V 40 SOURCE CURRENT (mA) 60 VDDEXT = 1.9V VDDEXT = 1.8V VDDEXT = 1.7V 20 10 0 –10 –20 –30 0 –20 –40 –40 0 0.5 1.0 SOURCE VOLTAGE (V) 1.5 2.0 –60 0 0.5 1.0 SOURCE VOLTAGE (V) 1.5 2.0 Figure 37. Drive Current C (VDDEXT = 1.8 V) Figure 40. Drive Current D (VDDEXT = 1.8 V) Rev. E | Page 44 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 150 VDDEXT = 3.65V VDDEXT = 3.30V VDDEXT = 2.95V 100 SOURCE CURRENT (mA) VTRIP (high) is 2.0 V and VTRIP (low) is 1.0 V . Time tTRIP is the interval from when the output starts driving to when the output reaches the VTRIP (high) or VTRIP (low) trip voltage. Time tENA is calculated as shown in the equation: t EN A = t ENA_MEASURED – t TRIP If multiple pins (such as the data bus) are enabled, the measure­ ment value is that of the first pin to start driving. 50 0 VOH –50 VOL –100 Output Disable Time Measurement Output pins are considered to be disabled when they stop driv­ ing, go into a high impedance state, and start to decay from their output high or low voltage. The output disable time tDIS is the difference between tDIS_MEASURED and tDECAY as shown on the left side of Figure 42. t DI S = t DIS_MEASURED – t DE C A Y The time for the voltage on the bus to decay by ΔV is dependent on the capacitive load CL and the load current II. This decay time can be approximated by the equation: t DE CAY = ( C L ΔV ) ⁄ I L The time tDECAY is calculated with test loads CL and IL, and with ΔV equal to 0.1 V for VDDEXT (nominal) = 1.8 V or 0.5 V for VDDEXT (nominal) = 2.5 V/3.3 V. The time tDIS_MEASURED is the interval from when the reference signal switches, to when the output voltage decays ΔV from the measured output high or output low voltage. –150 0 0.5 1.0 1.5 2.0 SOURCE VOLTAGE (V) 2.5 3.0 3.5 Figure 41. Drive Current D (VDDEXT = 3.3 V) POWER DISSIPATION Many operating conditions can affect power dissipation. System designers should refer to Estimating Power for ADSP-BF531/ BF532/BF533 Blackfin Processors (EE-229) on the Analog Devices website (www.analog.com)—use site search on “EE-229.” This document provides detailed information for optimizing your design for lowest power. See the ADSP-BF533 Blackfin Processor Hardware Reference Manual for definitions of the various operating modes and for instructions on how to minimize system power. TEST CONDITIONS All timing parameters appearing in this data sheet were mea­ sured under the conditions described in this section. Figure 42 shows the measurement point for ac measurements (except out­ put enable/disable). The measurement point VMEAS is 0.95 V for VDDEXT (nominal) = 1.8 V or 1.5 V for VDDEXT (nominal) = 2.5 V/ 3.3 V. INPUT OR OUTPUT REFERENCE SIGNAL tDIS_MEASURED tDIS VOH (MEASURED) VOL (MEASURED) tENA_MEASURED tENA VOH (MEASURED) � �V VOL (MEASURED) + �V VOH(MEASURED) VTRIP(HIGH) VTRIP(LOW) VOL(MEASURED) VMEAS VMEAS tDECAY tTRIP Figure 42. Voltage Reference Levels for AC Measurements (Except Output Enable/Disable) OUTPUT STOPS DRIVING OUTPUT STARTS DRIVING HIGH IMPEDANCE STATE Output Enable Time Measurement Output pins are considered to be enabled when they have made a transition from a high impedance state to the point when they start driving. The output enable time tENA is the interval from the point when a reference signal reaches a high or low voltage level to the point when the output starts driving as shown on the right side of Figure 43. The time tENA_MEASURED is the interval, from when the reference signal switches, to when the output voltage reaches VTRIP(high) or VTRIP (low). For VDDEXT (nominal) = 1.8 V—VTRIP (high) is 1.3 V and VTRIP (low) is 0.7 V. For VDDEXT (nominal) = 2.5 V/3.3 V— Rev. E | Figure 43. Output Enable/Disable Example System Hold Time Calculation To determine the data output hold time in a particular system, first calculate tDECAY using the equation given above. Choose ΔV to be the difference between the ADSP-BF531/ADSP-BF532/ ADSP-BF533 processor’s output voltage and the input threshold for the device requiring the hold time. CLis the total bus capacitance (per data line), and IL is the total leakage or three-state current (per data line). The hold time will be tDECAY Page 45 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 RISE AND FALL TIME ns (10% to 90%) plus the various output disable times as specified in the Timing Specifications on Page 24 (for example tDSDAT for an SDRAM write cycle as shown in SDRAM Interface Timing on Page 28). 14 12 RISE TIME 10 8 FALL TIME Capacitive Loading Output delays and holds are based on standard capacitive loads: 30 pF on all pins (see Figure 44). VLOAD is 0.95 V for VDDEXT (nominal) = 1.8 V or 1.5 V for VDDEXT (nominal) = 2.5 V/3.3 V. Figure 45 through Figure 56 on Page 48 show how output rise time varies with capacitance. The delay and hold specifications given should be derated by a factor derived from these figures. The graphs in these figures may not be linear out­ side the ranges shown. TO OUTPUT PIN 30pF 50 � VLOAD 6 4 2 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 Figure 46. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver A at VDDEXT = 2.25 V 12 RISE AND FALL TIME ns (10% to 90%) Figure 44. Equivalent Device Loading for AC Measurements (Includes All Fixtures) 16 14 RISE AND FALL TIME ns (10% to 90%) RISE TIME 12 10 FALL TIME 8 6 4 2 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 10 RISE TIME 8 FALL TIME 6 4 2 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 Figure 47. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver A at VDDEXT = 3.65 V 14 Figure 45. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver A at VDDEXT = 1.75 V RISE AND FALL TIME ns (10% to 90%) 12 RISE TIME 10 8 FALL TIME 6 4 2 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 Figure 48. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver B at VDDEXT = 1.75 V Rev. E | Page 46 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 12 RISE AND FALL TIME ns (10% to 90%) RISE AND FALL TIME ns (10% to 90%) 30 10 RISE TIME 8 FALL TIME 25 RISE TIME 20 6 15 FALL TIME 10 4 2 5 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 Figure 49. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver B at VDDEXT = 2.25 V 10 RISE AND FALL TIME ns (10% to 90%) 9 8 RISE TIME 7 6 FALL TIME 5 4 3 2 Figure 52. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver C at VDDEXT = 2.25 V 20 RISE AND FALL TIME ns (10% to 90%) 18 16 RISE TIME 14 12 FALL TIME 10 8 6 4 2 1 0 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 Figure 50. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver B at VDDEXT = 3.65 V 30 Figure 53. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver C at VDDEXT = 3.65 V 18 RISE AND FALL TIME ns (10% to 90%) 16 RISE TIME 14 12 10 8 6 4 2 FALL TIME RISE AND FALL TIME ns (10% to 90%) 25 RISE TIME 20 FALL TIME 15 10 5 0 0 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 0 50 100 150 200 250 LOAD CAPACITANCE (pF) Figure 51. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver C at VDDEXT = 1.75 V Figure 54. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver D at VDDEXT = 1.75 V Rev. E | Page 47 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 18 RISE AND FALL TIME ns (10% to 90%) 16 14 RISE TIME 12 10 FALL TIME 8 6 4 2 0 where: TA = ambient temperature (�C). In Table 31 through Table 33, airflow measurements comply with JEDEC standards JESD51–2 and JESD51–6, and the junc­ tion-to-board measurement complies with JESD51–8. The junction-to-case measurement complies with MIL-STD-883 (Method 1012.1). All measurements use a 2S2P JEDEC test board. Thermal resistance θJA in Table 31 through Table 33 is the figure of merit relating to performance of the package and board in a convective environment. θJMA represents the thermal resistance under two conditions of airflow. ΨJT represents the correlation between TJ and TCASE. 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 Table 31. Thermal Characteristics for BC-160 Package Parameter θJA θJMA θJMA θJC Condition 0 Linear m/s Air flow 1 Linear m/s Air flow 2 Linear m/s Air flow Not Applicable 0 Linear m/s Air flow 1 Linear m/s Air flow 2 Linear m/s Air flow Typical 27.1 23.85 22.7 7.26 0.14 0.26 0.35 Unit �C/W �C/W �C/W �C/W �C/W �C/W �C/W Figure 55. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver D at VDDEXT = 2.25 V 14 RISE AND FALL TIME ns (10% to 90%) 12 10 RISE TIME ΨJT ΨJT FALL TIME 8 ΨJT 6 4 2 Table 32. Thermal Characteristics for ST-176-1 Package Parameter θJA 0 50 100 150 LOAD CAPACITANCE (pF) 200 250 Condition 0 Linear m/s Air flow 1 Linear m/s Air flow 2 Linear m/s Air flow 0 Linear m/s Air flow 1 Linear m/s Air flow 2 Linear m/s Air flow Typical 34.9 33.0 32.0 0.50 0.75 1.00 Unit �C/W �C/W �C/W �C/W �C/W �C/W 0 θJMA θJMA ΨJT ΨJT ΨJT Figure 56. Typical Rise and Fall Times (10% to 90%) versus Load Capacitance for Driver D at VDDEXT = 3.65 V ENVIRONMENTAL CONDITIONS To determine the junction temperature on the application printed circuit board use: T J = T CA SE + ( Ψ JT × P D ) where: TJ = junction temperature (�C). TCASE = case temperature (�C) measured by customer at top center of package. ΨJT = from Table 31 through Table 33. PD = power dissipation (see Power Dissipation on Page 45 for the method to calculate PD). Values of θJA are provided for package comparison and printed circuit board design considerations. θJA can be used for a first order approximation of TJ by the equation: T J = T A + ( θ JA × P D ) Table 33. Thermal Characteristics for B-169 Package Parameter θJA θJMA θJMA θJC ΨJT ΨJT ΨJT Condition 0 Linear m/s Air flow 1 Linear m/s Air flow 2 Linear m/s Air flow Not Applicable 0 Linear m/s Air flow 1 Linear m/s Air flow 2 Linear m/s Air flow Typical 22.8 20.3 19.3 10.39 0.59 0.88 1.37 Unit �C/W �C/W �C/W �C/W �C/W �C/W �C/W Rev. E | Page 48 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 160-BALL BGA BALL ASSIGNMENT Table 34 lists the BGA ball assignment by signal. Table 35 on Page 50 lists the BGA ball assignment by ball number. Table 34. 160-Ball CSP_BGA Ball Assignment (Alphabetically by Signal) Signal ABE0 ABE1 ADDR1 ADDR2 ADDR3 ADDR4 A DD R 5 ADDR6 ADDR7 ADDR8 A DD R 9 ADDR10 ADDR11 ADDR12 ADDR13 ADDR14 ADDR15 ADDR16 ADDR17 ADDR18 ADDR19 AMS0 AMS1 AMS2 AMS3 AOE ARDY A RE AWE BG BGH BMODE0 BMODE1 BR CLKIN CLKOUT DATA0 DATA1 DATA2 DATA3 Ball No. H1 3 H1 2 J 14 K14 L14 J 13 K13 L13 K12 L12 M12 M 13 M 14 N 14 N 13 N 12 M 11 N 11 P1 3 P1 2 P1 1 E1 4 F1 4 F1 3 G1 2 G1 3 E1 3 G1 4 H1 4 P1 0 N10 N4 P3 D1 4 A12 B14 M9 N9 P9 M8 Signal DATA4 DATA5 DATA6 DATA7 DATA8 DATA9 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 DR0PRI DR0SEC DR1PRI DR1SEC DT0PRI DT0SEC DT1PRI DT1SEC EMU GN D GN D GN D GN D GND GND GN D GN D GN D GN D GN D GN D GND GN D GN D GN D GND GND GN D Ball No. N8 P8 M7 N7 P7 M6 N6 P6 M5 N5 P5 P4 K1 J2 G3 F3 H1 H2 F2 E3 M2 A1 0 A1 4 B11 C4 C5 C11 D4 D7 D8 D10 D11 F4 F11 G11 H4 H1 1 K4 K11 L5 Signal G ND G ND G ND G ND G ND G ND MISO MOSI NMI PF 0 PF 1 PF2 PF3 PF4 PF5 PF6 PF7 PF8 PF9 PF10 PF 1 1 PF12 PF 1 3 PF 1 4 PF 1 5 PPI_CLK PPI0 PPI1 PPI2 PPI3 R E SE T RFS0 RFS1 RSCLK0 RSCLK1 RTXI RTXO RX SA10 SCAS Ball No. L6 L8 L 10 M4 M 10 P 14 E2 D3 B10 D2 C1 C2 C3 B1 B2 B3 B4 A2 A3 A4 A5 B5 B6 A6 C6 C9 C8 B8 A7 B7 C10 J3 G2 L1 G1 A9 A8 L3 E12 C14 Signal SC K SC K E SMS SRAS SWE TCK TDI T DO TFS0 TFS1 TMR0 T M R1 T M R2 TMS TRST TSCLK0 TSCLK1 TX VDDEXT VDDEXT VDDEXT V D DE X T V D DE X T V D DE X T VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDINT VDDINT V D DI N T VDDINT VDDINT VDDINT VDDRTC VROUT0 VROUT1 XTAL Ball No. D1 B13 C13 D1 3 D1 2 P2 M3 N3 H3 E1 L2 M1 K2 N2 N1 J1 F1 K3 A1 C7 C1 2 D5 D9 F12 G4 J4 J12 L7 L1 1 P1 D6 E4 E1 1 J11 L4 L9 B9 A1 3 B12 A11 Rev. E | Page 49 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Table 35. 160-Ball CSP_BGA Ball Assignment (Numerically by Ball Number) Ball No. A1 A2 A3 A4 A5 A6 A7 A8 A9 A 10 A 11 A 12 A 13 A 14 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B1 2 B13 B14 C1 C2 C3 C4 C5 C6 C7 C8 C9 C 10 C 11 C 12 Signal V D DE X T PF 8 PF9 P F 10 PF11 PF14 PPI2 RTXO RTXI GND XTAL CLKIN VROUT0 GND PF 4 PF5 PF6 PF7 PF12 PF13 PPI3 PPI1 VDDRTC NMI GND VROUT1 SCKE CLKOUT PF1 PF2 PF3 GN D GND PF15 VDDEXT PPI0 PPI_CLK R ES E T GND VDDEXT Ball No. C13 C14 D1 D2 D3 D4 D5 D6 D7 D8 D9 D1 0 D11 D1 2 D13 D14 E1 E2 E3 E4 E1 1 E1 2 E1 3 E14 F1 F2 F3 F4 F11 F12 F13 F14 G1 G2 G3 G4 G1 1 G1 2 G1 3 G14 Signal S MS SCAS SCK PF0 MOSI G ND VDDEXT VDDINT G ND G ND VDDEXT G ND G ND SWE SRAS BR TFS1 MISO DT1SEC VDDINT V D DI N T SA10 ARDY AMS0 TSCLK1 DT1PRI DR1SEC GND G ND VDDEXT AMS2 AMS1 RSCLK1 RFS1 DR1PRI VDDEXT G ND AMS3 AOE ARE Ball No. H1 H2 H3 H4 H1 1 H1 2 H1 3 H1 4 J1 J2 J3 J4 J11 J12 J13 J14 K1 K2 K3 K4 K11 K12 K13 K 14 L1 L2 L3 L4 L5 L6 L7 L8 L9 L1 0 L1 1 L1 2 L1 3 L1 4 M1 M2 Signal DT0PRI DT0SEC TFS0 GN D GND ABE1 ABE0 AWE TSCLK0 DR0SEC RFS0 VDDEXT VDDINT VDDEXT ADDR4 ADDR1 DR0PRI TMR2 TX GND GND ADDR7 ADDR5 A DD R 2 RSCLK0 TMR0 RX VDDINT GND GND VDDEXT GND VDDINT GND VDDEXT ADDR8 ADDR6 ADDR3 TMR1 EMU Ball No. M3 M4 M5 M6 M7 M8 M9 M 10 M11 M12 M 13 M 14 N1 N2 N3 N4 N5 N6 N7 N8 N9 N10 N11 N 12 N13 N14 P1 P2 P3 P4 P5 P6 P7 P8 P9 P 10 P11 P 12 P 13 P 14 Signal TD I GND DATA12 DATA9 DATA6 DATA3 DATA0 GND ADDR15 ADDR9 A D D R 10 ADDR11 TRST TMS TDO BMODE0 DATA13 DATA10 DATA7 DATA4 DATA1 BGH ADDR16 ADDR14 ADDR13 ADDR12 VDDEXT TCK BMODE1 DATA15 DATA14 DATA11 DATA8 DATA5 DATA2 BG ADDR19 A D D R 18 ADDR17 GND Rev. E | Page 50 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Figure 57 lists the top view of the BGA ball configuration. Figure 58 lists the bottom view of the BGA ball configuration. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A B C D E F G H J K L M N P KEY: VDDINT VDDEXT GND I/O VDDRTC VROUT Figure 57. 160-Ball CSP_BGA Ground Configuration (Top View) 14 13 12 11 10 9 8 7 6 5 4 3 2 1 A B C D E F G H J K L M N P KEY: VDDINT VDDEXT GND I/O VDDRTC VROUT Figure 58. 160-Ball CSP_BGA Ground Configuration (Bottom View) Rev. E | Page 51 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 169-BALL PBGA BALL ASSIGNMENT Table 36 lists the PBGA ball assignment by signal. Table 37 on Page 53 lists the PBGA ball assignment by ball number. Table 36. 169-Ball PBGA Ball Assignment (Alphabetically by Signal) Signal ABE0 ABE1 ADDR1 ADDR2 ADDR3 ADDR4 A DD R 5 ADDR6 ADDR7 ADDR8 ADDR9 ADDR10 ADDR11 ADDR12 ADDR13 ADDR14 ADDR15 ADDR16 ADDR17 ADDR18 ADDR19 AMS0 AMS1 AMS2 AMS3 AOE ARDY A RE AWE BG BGH BMODE0 BMODE1 BR CLKIN CLKOUT DATA0 DATA1 DATA2 DATA3 Ball No. H 16 H 17 J16 J17 K16 K17 L16 L 17 M16 M17 N 17 N 16 P 17 P 16 R 17 R 16 T17 U15 T15 U16 T14 D17 E 16 E 17 F16 F17 C 16 G 16 G 17 T13 U17 U5 T5 C 17 A 14 D 16 U14 T12 U13 T11 Signal DATA4 DATA5 DATA6 DATA7 DATA8 DATA9 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 D R 0 PR I D R 0 SE C D R 1 PR I DR1SEC DT0PRI DT0SEC DT1PRI DT1SEC E MU GND G ND G ND G ND G ND G ND G ND G ND G ND G ND G ND GND G ND GND G ND GND GND G ND GND Ball No. U1 2 U11 T 10 U10 T9 U9 T8 U8 U7 T7 U6 T6 M2 M1 H1 H2 K2 K1 F1 F2 U1 B16 F11 G7 G8 G9 G 10 G 11 H7 H8 H9 H 10 H11 J7 J8 J9 J10 J11 K7 K8 Signal GND G ND G ND G ND G ND G ND G ND G ND GND GND MISO MOSI N MI PF0 PF1 PF2 PF3 PF4 PF5 PF6 PF7 PF8 PF9 PF10 PF11 PF12 PF13 PF14 PF15 PPI_CLK PPI0 PPI1 PPI2 PPI3 R ES E T RFS0 RFS1 RSCLK0 RSCLK1 RTCVDD Ball No. K9 K1 0 K11 L7 L8 L9 L10 L11 M9 T 16 E2 E1 B11 D2 C1 B1 C2 A1 A2 B3 A3 B4 A4 B5 A5 A6 B6 A7 B7 B10 B9 A9 B8 A8 A 12 N1 J1 N2 J2 F10 Signal RTXI RTXO RX SA10 SCAS SC K SCKE SM S SRAS SW E TCK T DI T DO TFS0 TFS1 TMR0 TMR1 TMR2 TMS TRST TSCLK0 TSCLK1 TX V DD V DD V DD V DD V DD V DD V DD V DD V DD VDDEXT VDDEXT V DD E X T VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT Ball No. A1 0 A1 1 T1 B 15 A1 6 D1 B14 A1 7 A1 5 B17 U4 U3 T4 L1 G2 R1 P2 P1 T3 U2 L2 G1 R2 F12 G12 H12 J 12 K 12 L12 M 10 M 11 M 12 B2 F6 F7 F8 F9 G6 H6 J6 Signal VDDEXT V DD E X T VDDEXT VDDEXT VDDEXT V DD E X T VROUT0 VROUT1 XTAL Ball No. K6 L6 M6 M7 M8 T2 B12 B13 A1 3 Rev. E | Page 52 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Table 37. 169-Ball PBGA Ball Assignment (Numerically by Ball Number) Ball No. A1 A2 A3 A4 A5 A6 A7 A8 A9 A 10 A 11 A 12 A 13 A 14 A 15 A 16 A 17 B1 B2 B3 B4 B5 B6 B7 B8 B9 B1 0 B11 B12 B13 B14 B1 5 B16 B17 C1 C2 C16 C 17 D1 D2 Signal PF4 PF5 PF7 PF9 PF11 PF12 PF14 PPI3 PPI1 R T XI RTXO RESET XTAL CLKIN SRAS SCAS S MS PF2 VDDEXT PF6 PF8 PF10 PF13 PF15 PPI2 PPI0 PPI_CLK NMI VROUT0 VROUT1 SCKE SA10 GND SWE PF1 PF3 ARDY BR S CK PF0 Ball No. D 16 D 17 E1 E2 E 16 E 17 F1 F2 F6 F7 F8 F9 F10 F11 F 12 F 16 F 17 G1 G2 G6 G7 G8 G9 G 10 G 11 G 12 G 16 G17 H1 H2 H6 H7 H8 H9 H10 H11 H12 H16 H17 J1 Signal CLKOUT AMS0 MOSI M I SO AM S 1 AM S 2 DT1PRI DT1SEC VDDEXT VDDEXT VDDEXT VDDEXT RTCVDD GND VDD AMS3 AOE TSCLK1 TFS1 VDDEXT GND G ND G ND GND G ND VDD ARE AWE DR1PRI DR1SEC VDDEXT GND G ND G ND G ND G ND VD D ABE0 ABE1 RFS1 Ball No. J2 J6 J7 J8 J9 J10 J11 J12 J16 J17 K1 K2 K6 K7 K8 K9 K10 K11 K12 K16 K17 L1 L2 L6 L7 L8 L9 L1 0 L11 L12 L16 L1 7 M1 M2 M6 M7 M8 M9 M10 M11 Signal RSCLK1 VDDEXT G ND GND GND GND GND VDD ADDR1 A D DR 2 DT0SEC DT0PRI VDDEXT G ND G ND GND GND GND VDD A D DR 3 ADDR4 TFS0 TSCLK0 VDDEXT G ND G ND G ND GND GND VD D A D DR 5 A D DR 6 DR0SEC DR0PRI VDDEXT VDDEXT V D DE X T GND VDD VD D Ball No. M1 2 M16 M1 7 N1 N2 N16 N17 P1 P2 P16 P17 R1 R2 R1 6 R17 T1 T2 T3 T4 T5 T6 T7 T8 T9 T10 T11 T1 2 T1 3 T14 T15 T16 T1 7 U1 U2 U3 U4 U5 U6 U7 U8 Signal VDD ADDR7 ADDR8 RFS0 RSCLK0 A D D R 10 A D DR 9 TMR2 TMR1 A D D R 12 A D D R 11 TMR0 TX ADDR14 A D D R 13 RX VDDEXT TMS TDO BMODE1 DATA15 DATA13 DATA10 DATA8 DATA6 DATA3 DATA1 BG A D D R 19 ADDR17 GND A D D R 15 EM U T R ST TDI TCK BMODE0 DATA14 DATA12 DATA11 Ball No. U9 U10 U11 U12 U13 U14 U15 U16 U17 Signal DATA9 DATA7 DATA5 DATA4 DATA2 DATA0 ADDR16 ADDR18 B GH Rev. E | Page 53 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 A1 BALL PAD CORNER A B C D E F G H J K L M N P R T U KEY V DDINT V DDEXT GND NC I/O V ROUT 2 1 3 4 5 6 7 8 9 TOP VIEW 10 11 12 13 14 15 16 17 Figure 59. 169-Ball PBGA Ground Configuration (Top View) A1 BALL PAD CORNER A B C D E F G H J K L M N P R T U V DDEXT I/O V ROUT V DDINT GND NC KEY: 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 BOTTOM VIEW Figure 60. 169-Ball PBGA Ground Configuration (Bottom View) Rev. E | Page 54 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 176-LEAD LQFP PINOUT Table 38 lists the LQFP pinout by signal. Table 39 on Page 56 lists the LQFP pinout by lead number. Table 38. 176-Lead LQFP Pin Assignment (Alphabetically by Signal) Signal ABE0 ABE1 A D DR 1 A D DR 2 A D DR 3 A D DR 4 A D DR 5 ADDR6 A D DR 7 A D DR 8 ADDR9 ADDR10 ADDR11 ADDR12 ADDR13 A D D R 14 ADDR15 ADDR16 ADDR17 ADDR18 ADDR19 AMS0 AMS1 AMS2 AMS3 AOE ARDY AR E AWE BG BGH BMODE0 BMODE1 BR CLKIN CLKOUT DATA0 DATA1 DATA10 Lead No. 15 1 15 0 149 148 147 146 142 14 1 140 139 13 8 13 7 13 6 13 5 12 7 12 6 12 5 12 4 12 3 12 2 12 1 16 1 16 0 15 9 15 8 15 4 16 2 15 3 15 2 11 9 12 0 96 95 16 3 10 16 9 11 6 11 5 10 3 Signal DATA3 DATA4 DATA5 DATA6 DATA7 DATA8 DATA9 DATA10 DATA11 DATA12 DATA13 DATA14 DATA15 D R 0P R I D R 0S E C DR1PRI D R 1S E C DT0PRI DT0SEC DT1PRI DT1SEC EMU GN D GN D GN D GND GND GND GN D GN D GN D GND GN D GN D GND GND GN D GN D GND Lead No. 11 3 11 2 110 109 108 105 104 10 3 10 2 10 1 10 0 99 98 74 73 63 62 68 67 59 58 83 1 2 3 7 8 9 15 19 30 39 40 41 42 43 44 56 70 Signal GN D GND GN D GN D GN D GN D GN D GN D GND GND GN D GN D GN D GN D GN D GND GN D GN D GN D GN D M I SO MOSI NMI PF 0 PF 1 PF2 PF3 PF4 PF 5 PF 6 PF 7 PF8 PF9 PF 1 0 PF11 PF12 PF 1 3 PF 1 4 PF15 Lead No. 88 89 90 91 92 97 1 06 1 17 1 28 1 29 1 30 1 31 1 32 1 33 1 44 1 55 1 70 1 74 1 75 1 76 54 55 14 51 50 49 48 47 46 38 37 36 35 34 33 32 29 28 27 Signal PPI_CLK P P I0 PPI1 PPI2 PPI3 RESET RFS0 RF S 1 RSCLK0 RSCLK1 R T XI RTXO RX SA10 S C AS S CK SCKE SMS S R AS SWE TCK TDI TD O TFS0 TFS1 TMR0 TMR1 TMR2 TMS T R ST TSCLK0 TSCLK1 TX VDDEXT VDDEXT VDDEXT V D DE X T V D DE X T VDDEXT Lead No. 21 22 23 24 26 13 75 64 76 65 17 16 82 164 1 66 53 173 1 72 1 67 1 65 94 86 87 69 60 79 78 77 85 84 72 61 81 6 12 20 31 45 57 Signal V D DE X T VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT VDDEXT V D DE X T VDDINT VDDINT V D DI N T V D DI N T V D DI N T VDDINT VDDINT VDDINT VDDRTC VROUT0 VROUT1 XTAL Lead No. 71 93 1 07 1 18 1 34 1 45 1 56 171 25 52 66 80 111 1 43 1 57 1 68 18 5 4 11 Rev. E | Page 55 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Table 39. 176-Lead LQFP Pin Assignment (Numerically by Lead Number) Lead No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 Signal GN D GN D GN D VROUT1 VROUT0 V D DE X T GND GND GND CLKIN XTAL VDDEXT RESET NMI GN D RTXO RTXI VDDRTC GN D VDDEXT PPI_CLK PPI0 PPI1 PP I2 VDDINT PPI3 PF 1 5 PF 1 4 PF 1 3 GN D VDDEXT PF12 PF 1 1 PF 1 0 PF 9 PF 8 PF 7 PF 6 GN D GN D Lead No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 Signal GN D GN D GN D GND VDDEXT PF 5 PF 4 PF 3 PF 2 PF 1 PF 0 VDDINT SC K M I SO MOSI GN D VDDEXT DT1SEC DT1PRI TFS1 TSCLK1 DR1SEC DR1PRI RFS1 RSCLK1 VDDINT DT0SEC DT0PRI TFS0 GND VDDEXT TSCLK0 DR0SEC DR0PRI RF S 0 RSCLK0 TMR2 TMR1 TMR0 V D DI N T Lead No. 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 1 00 101 1 02 1 03 1 04 105 1 06 1 07 1 08 1 09 1 10 1 11 1 12 1 13 1 14 115 116 117 118 119 120 Signal TX RX EM U TRST TMS TD I TDO GND GND GN D GN D GN D V D DE X T TCK BMODE1 BMODE0 GN D DATA15 DATA14 DATA13 DATA12 DATA11 DATA10 DATA9 DATA8 GN D V D DE X T DATA7 DATA6 DATA5 V D DI N T DATA4 DATA3 DATA2 DATA1 DATA0 GN D VDDEXT BG BGH Lead No. 121 122 1 23 1 24 1 25 126 1 27 1 28 1 29 130 1 31 132 133 1 34 135 136 137 1 38 1 39 140 1 41 142 143 1 44 145 1 46 147 1 48 1 49 1 50 151 1 52 1 53 1 54 155 156 157 1 58 1 59 1 60 Signal ADDR19 ADDR18 ADDR17 ADDR16 ADDR15 ADDR14 ADDR13 G ND G ND G ND GND G ND G ND V D DE X T ADDR12 ADDR11 ADDR10 A D DR 9 A D DR 8 ADDR7 A D DR 6 ADDR5 VDDINT GND V D DE X T A D DR 4 ADDR3 A D DR 2 A D DR 1 ABE1 ABE0 AWE AR E AOE G ND VDDEXT VDDINT AMS3 AMS2 AMS1 Lead No. 1 61 1 62 1 63 1 64 1 65 1 66 1 67 1 68 1 69 170 1 71 172 173 174 1 75 1 76 Signal AMS0 ARDY BR SA10 S WE S C AS SRAS VDDINT CLKOUT G ND V D DE X T S MS SCKE G ND GND GND Rev. E | Page 56 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 OUTLINE DIMENSIONS Dimensions in the outline dimension figures are shown in millimeters. 0.75 0.60 0.45 176 1 0.27 0.22 0.17 PIN 1 26.00 BSC SQ 24.00 BSC SQ 133 132 SEATING PLANE 0.08 MAX LEAD COPLANARITY 0.15 0.05 1.45 1.40 1.35 1.60 MAX DETAIL A 44 45 DETAIL A 0.50 BSC LEAD PITCH TOP VIEW (PINS DOWN) 89 88 NOTES 1. DIMENSIONS IN MILLIMETERS 2. ACTUAL POSITION OF EACH LEAD IS WITHIN 0.08 OF ITS IDEAL POSITION, WHEN MEASURED IN THE LATERAL DIRECTION. 3. CENTER DIMENSIONS ARE NOMINAL Figure 61. 176-Lead Low Profile Quad Flat Package (LQFP) ST-176-1 12.00 BSC SQ 14 12 10 8 64 2 13 11 9 7 5 31 A1 CORNER INDEX AREA A B C D E F G H J K L M N P BA LL A1 INDICATOR 10.40 BSC SQ TOP VIEW 0.80 BSC BALL PITCH 1.31 1.21 1.11 BOTTOM VIEW 1.70 MAX DETAIL A SEATING PLA NE 0.40 NOM (NOTE 3) NOT ES 1. DIMENSIONS ARE IN MILL IMETERS. 2. COMPL IES WIT H JEDEC REGISTERED OUTL INE MO-205, VARIAT ION AE WITH EXCEPT ION OF T HE BALL DIAMETER . 3. MINIMUM BALL HEIGHT 0.25. 0.12 0.50 MAX 0.45 COPL ANARITY 0.40 B ALL DIAMETER DETAIL A Figure 62. 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2 Rev. E | Page 57 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 A1 BALL PAD CORNER 19.00 BSC SQ 16.00 BSC SQ 1.00 BSC BALL PITCH A B C D E F G H J K L M N P R T U 16 14 12 10 8 6 4 2 17 15 13 11 9 7 5 3 1 TOP VIEW BOTTOM VIEW 0.40 MIN 2.50 2.23 1.97 SIDE VIEW DETAIL A 0.20 MAX COPLANARITY NOTES 1. DIMENSIONS ARE IN MILLIMETERS. 2. COMPLIES WITH JEDEC REGISTERED OUTLINE MS-034, VARIATION AAG-2 . 3. MINIMUM BALL HEIGHT 0.40 0.70 BALL DIAMETER 0.60 0.50 SEATING PLANE DETAIL A Figure 63. 169-Ball Plastic Ball Grid Array (B-169) SURFACE MOUNT DESIGN Table 40 is provided as an aid to PCB design. For industrystandard design recommendations, refer to IPC-7351, Generic Requirements for Surface Mount Design and Land Pat­ tern Standard. Table 40. BGA Data for Use with Surface Mount Design Package Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2 Plastic Ball Grid Array (PBGA) B-169 Ball Attach Type Solder Mask Defined Solder Mask Defined Solder Mask Opening 0.40 mm diameter 0.43 mm diameter Ball Pad Size 0.55 mm diameter 0.56 mm diameter Rev. E | Page 58 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 ORDERING GUIDE Temperature Speed Grade Operating Voltage Range1 (Max) (Nom) Package Description –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 400 MHz 1.2 V internal, 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.2 V internal, 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) –40°C to + 85°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) –40°C to + 105°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40°C to + 105°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 400 MHz 1.2 V internal, 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.2 V internal, 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) –40°C to + 85°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) –40°C to + 105°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40°C to + 105°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) Package Option B-169 B-169 BC-160-2 BC-160-2 ST-176-1 ST-176-1 BC-160-2 B-169 ST-176-1 BC-160-2 B-169 B-169 B-169 BC-160-2 BC-160-2 ST-176-1 ST-176-1 BC-160-2 B-169 ST-176-1 BC-160-2 B-169 Model ADSP-BF531SBB400 ADSP-BF531SBBZ400 ADSP-BF531SBBC400 ADSP-BF531SBBCZ4002 ADSP-BF531SBST400 ADSP-BF531SBSTZ4002 ADSP-BF531WBBCZ-4A2,3 ADSP-BF531WBBZ-4A2,3 ADSP-BF531WBSTZ-4A2,3 ADSP-BF531WYBCZ-4A2,3 ADSP-BF531WYBZ-4A2,3 ADSP-BF532SBB400 ADSP-BF532SBBZ4002 ADSP-BF532SBBC400 ADSP-BF532SBBCZ4002 ADSP-BF532SBST400 ADSP-BF532SBSTZ400 ADSP-BF532WBBCZ-4A2 ADSP-BF532WBBZ-4A2,3 ADSP-BF532WBSTZ-4A2,3 ADSP-BF532WYBCZ-4A2,3 ADSP-BF532WYBZ-4A2,3 Rev. E | Page 59 of 60 | July 2007 ADSP-BF531/ADSP-BF532/ADSP-BF533 Model ADSP-BF533SBB500 ADSP-BF533SBBZ5002 ADSP-BF533SBBC500 ADSP-BF533SBBCZ5002 ADSP-BF533SBBC-5V ADSP-BF533SBBCZ-5V2 ADSP-BF533SBBCZ4002 ADSP-BF533SBST400 ADSP-BF533SBSTZ4002 ADSP-BF533SKBC-6V ADSP-BF533SKBCZ-6V2 ADSP-BF533WBBCZ-5A2,3 ADSP-BF533WBBZ-5A2,3 ADSP-BF533WYBCZ-4A2,3 ADSP-BF533WYBZ-4A2,3 1 2 Temperature Speed Grade Operating Voltage Range1 (Max) (Nom) Package Description –40°C to + 85°C 500 MHz 1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 500 MHz 1.2 V Internal, 1.8 V or 2.5 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 85°C 500 MHz 1.2 V Internal 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 500 MHz 1.2 V Internal 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 533 MHz 1.25 V Internal 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 533 MHz 1.2 V Internal 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.25 V internal, 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) –40°C to + 85°C 400 MHz 1.2 V internal, 1.8 V or 2.5 V or 3.3 V I/O 176-Lead Quad Flatpack (LQFP) 0°C to + 70°C 600 MHz 1.3 V Internal 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) 0°C to + 70°C 600 MHz 1.3 V Internal 160-Ball Chip Scale Package 1.8 V, 2.5 V or 3.3 V I/O Ball Grid Array (CSP_BGA) –40°C to + 85°C 500 MHz 1.2 V Internal, 3.0 V or 3.3 V I/O 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40°C to + 85°C 500 MHz 1.2 V Internal, 3.0 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) –40°C to + 105°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 160-Ball Chip Scale Package Ball Grid Array (CSP_BGA) –40°C to + 105°C 400 MHz 1.2 V internal, 3.0 V or 3.3 V I/O 169-Ball Plastic Ball Grid Array (PBGA) Package Option B-169 B-169 BC-160-2 BC-160-2 BC-160-2 BC-160-2 BC-160-2 ST-176-1 ST-176-1 BC-160-2 BC-160-2 BC-160-2 B-169 BC-160-2 B-169 Referenced temperature is ambient temperature. Z = RoHS Compliant Part. 3 Automotive grade part. ©2007 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D03728-0-7/07(E) Rev. E | Page 60 of 60 | July 2007