19 VCC
20 VCC
21 VCC
VCC
VCC
HMC911
GND 2
16 QP
AMP
BUF
INN 4
15 QN
TEMPERATURE
COMPENSATION
AND BIAS
14 GND
9
VDCP
VEE 11
8
VEE
13 VEE
PACKAGE
BASE
GND
14816-001
VCC
BUF
VAC 12
VCC
7
EN 6
18 NC
17 GND
INP 3
GND 5
Synchronization of clock and data
Transponder design
Serial data transmissions up to 32 Gbps
Broadband test and measurement
RF ATE applications
22 VCC
NC 1
VDCN 10
APPLICATIONS
23 VCC
FUNCTIONAL BLOCK DIAGRAM
Very wide bandwidth to 24 GHz
Time delay range: 70 ps typical
Single-ended or differential operation
Adjustable differential output amplitude with 780 mV p-p typical
at 10 GHz
Delay control modulation bandwidth: 1.6 GHz typical
Single supply: 3.3 V
24-terminal ceramic, leadless chip carrier (LCC)
24 VCC
FEATURES
VEE
Data Sheet
Broadband Analog Time Delay to 24 GHz
HMC911
Figure 1.
GENERAL DESCRIPTION
The HMC911 is a broadband time delay with 62 ps to 75 ps
continuously adjustable delay range to 24 GHz. The delay control
is linearly monotonic with respect to the differential delay control
voltage (VDCP and VDCN), and the control input has a modulation
bandwidth of 1.6 Hz. The HMC911 provides a differential
output voltage with constant amplitude for single-ended or
differential input voltages above the input sensitivity level, and
the output voltage swing can be adjusted using the VAC control pin.
Rev. B
The HMC911 features internal temperature compensation and
bias circuitry to minimize delay variations with temperature. All
RF inputs and outputs of the HMC911 are internally terminated
with 50 Ω to VCC and can be ac-coupled or dc-coupled. Output
pins connect directly to a 50 Ω to VCC terminated system.
However, use dc blocking capacitors if the terminated system
input is 50 Ω to a dc voltage other than VCC.
The HMC911 is available in a RoHS-compliant, 24-terminal,
ceramic, leadless chip carrier.
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HMC911
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Pin Configuration and Function Descriptions..............................5
Applications ....................................................................................... 1
Interface Schematics .....................................................................6
Functional Block Diagram .............................................................. 1
Typical Performance Characteristics ..............................................7
General Description ......................................................................... 1
Applications Information .............................................................. 11
Revision History ............................................................................... 2
Evaluation Printed Circuit Board (PCB)................................. 11
Specifications..................................................................................... 3
Typical Application Circuit ........................................................... 12
Absolute Maximum Ratings ............................................................ 4
Outline Dimensions ....................................................................... 13
ESD Caution .................................................................................. 4
Ordering Guide .......................................................................... 13
REVISION HISTORY
10/2016—Rev. v02.0614 to Rev. B
Updated Format .................................................................. Universal
Changes to Product Title, Features Section, and General
Description Section .......................................................................... 1
Changes to Table 1 ............................................................................ 3
Changes to Table 2 ............................................................................ 4
Changes to Table 3 ............................................................................ 5
Changes to Figure 4 and Figure 6 ................................................... 6
Changes to Figure 13 Caption .........................................................7
Changes to Figure 17 Caption and Figure 20 Caption .................8
Changes to Figure 31 Caption ...................................................... 10
Changes to Table 4.......................................................................... 11
Changes to Typical Application Circuit Section ........................ 12
Updated Outline Dimensions ....................................................... 13
Changes to Ordering Guide .......................................................... 13
Rev. B | Page 2 of 13
Data Sheet
HMC911
SPECIFICATIONS
TA = 25°C, VCC = 3.3 V, VAC = 2.6 V, VEE = GND = 0 V, unless otherwise noted.
Table 1.
Parameter
POWER SUPPLY
Voltage
Current
TIME DELAY RANGE
10 GHz
18 GHz
22 GHz
TIME DELAY SENSITIVITY
Voltage
Temperature
PHASE SHIFT RANGE
10 GHz
18 GHz
22 GHz
MAXIMUM DATA RATE
MAXIMUM CLOCK FREQUENCY
DELAY CONTROL
Modulation Bandwidth
Voltage (VDCP and VDCN)
INPUT VOLTAGE
Low (VIL)
High (VIH)
INPUT AMPLITUDE, PEAK TO PEAK
Single Ended
Differential
OUTPUT AMPLITUDE
10 GHz
18 GHz
22 GHz
CONTROL VOLTAGE (VAC)
HARMONIC SUPPRESSION (fIN − 2fIN) 1, 2
10 GHz
20 GHz
RETURN LOSS
Input
Output
RMS JITTER
TIME 3
Rise (tR)
Fall (tF)
PROPAGATION DELAY
Min
Typ
Max
Unit
Test Conditions/Comments
3.13
460
3.3
3.47
530
V
mA
±5% tolerance
62
64
66
70
70
70
71
73
75
ps
ps
ps
VDCP = 3.9 V, VDCN = 3.3 V
116
0.04
ps/V
ps/°C
210
400
515
32
24
250
475
595
1.6
VCC − 0.6
VCC − 500
VCC + 25
VCC − 200
VCC + 200
50
100
370
740
350
700
340
680
1.7
390
780
375
750
350
700
2.6
VDCP = VDCN = 3.3 V at 18 GHz
VDCP = 3.9 V, VDCN = 3.3 V
Degrees
Degrees
Degrees
Gbps
GHz
VCC + 0.6
GHz
V
VCC − 25
VCC + 500
mV
mV
1000
2000
mV p-p
mV p-p
640
1280
640
1280
640
1280
2.7
mV p-p
mV p-p
mV p-p
mV p-p
mV p-p
mV p-p
V
32
30
dBc
dBc
VAC = 2.6 V
Single-ended
Differential
Single-ended
Differential
Single-ended
Differential
VDCP = VDCN = 3.3 V
21
19
Frequency < 24 GHz
9
10
0.3
dB
dB
ps, p-p
32 Gbps, 10101 … data
15
14
480
ps
ps
ps
VDCP = 2.7 V, VDCN = 3.3 V (relative to zero time delay)
Harmonic suppression measurements were taken for single-ended inputs and outputs.
fIN is the fundamental frequency.
3
VINPUT = differential 400 mV p-p, and fDATA = 22.5 Gbps, and pseudorandom bit sequences (PRBS) 233 − 1
1
2
Rev. B | Page 3 of 13
HMC911
Data Sheet
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Power Supply Voltage (VCC)
Input Voltage (VIN)
Output Voltage (VOUT)
Delay Control Voltage (VDCP, VDCN)
Power-Down (Enable) Pin (EN)
Amplitude Control (VAC)
Continuous Power Dissipation, PDISS (TA =
85°C, Derate 54.96 mW/°C above 85°C)
Thermal Resistance (Junction to Ground
Paddle)
Channel Temperature (TC)
Maximum Peak Reflow Temperature (MSL3)1
Storage Temperature Range
Operating Temperature Range
Electrostatic Discharge (ESD)
Human Body Model (HBM)
1
Rating
−0.5 V to +3.75 V
VCC – 1.2 V to
VCC + 0.6 V
VCC – 1.2 V to
VCC + 0.6 V
0 V to VCC + 0.6 V
0 V to VCC + 0.6 V
0 V to VCC + 0.6 V
2.2 W
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
ESD CAUTION
18.2°C/W
125°C
260°C
−65°C to +125°C
−40°C to +85°C
Class 1B
See the Ordering Guide section.
Rev. B | Page 4 of 13
Data Sheet
HMC911
19 VCC
20 VCC
21 VCC
22 VCC
23 VCC
24 VCC
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
NC 1
18 NC
GND 2
17 GND
HMC911
INP 3
16 QP
TOP VIEW
(Not to Scale)
INN 4
15 QN
GND 5
14 GND
PACKAGE
BASE
NOTES
1. NC = NO CONNECT.
2. EXPOSED PAD. CONNECT THE EXPOSED
PAD TO RF/DC GROUND
GND
14816-002
VAC 12
9
VDCP
VEE 11
8
VEE
VDCN 10
7
13 VEE
VEE
EN 6
Figure 2. Pin Configuration
Table 3. Pin Function Descriptions
Pin No.
1, 18
Mnemonic
NC
2, 5, 14, 17
3
4
6
GND
INP
INN
EN
7, 8, 11, 13
9
10
12
15
16
19 to 24
VEE
VDCP
VDCN
VAC
QN
QP
VCC
EPAD
Description
No Connect. These pins are not connected internally; however, all data shown herein was measured with these
pins connected to RF/dc ground externally.
Ground Pin. Connect these signal grounds to 0 V. See Figure 3 for the interface schematic.
Positive Differential RF Input Pin. See Figure 4 for the interface schematic.
Negative Differential RF Input Pin. See Figure 4 for the interface schematic.
Enable Pin for the Time Delay. For normal operation, leave this pin open or apply 3.3 V. To disable the HMC911,
apply 0 V. When disabled, the total current consumption drops to 15 mA. See Figure 5 for the interface schematic.
Supply Grounds. Connect these pins to 0 V. See Figure 6 for the interface schematic.
Positive Differential Time Delay Control Pin. See Figure 7 for the interface schematic.
Negative Differential Time Delay Control Pin. See Figure 7 for the interface schematic.
Output Amplitude Control Pin. See Figure 8 for the interface schematic.
Negative Differential RF Output Pin. See Figure 9 for the interface schematic.
Positive Differential RF Output Pin. See Figure 9 for the interface schematic.
Positive Supply Pins. See Figure 10 for the interface schematic.
Exposed Pad. Connect the exposed pad to RF/dc ground.
Rev. B | Page 5 of 13
HMC911
Data Sheet
INTERFACE SCHEMATICS
VCC
50Ω
14816-003
GND
14816-007
VDCP ,
VDCN
VEE
Figure 7. VDCP and VDCN Interface Schematic
Figure 3. GND Interface Schematic
VCC
VCC
50Ω
INP,
INN
14816-008
VEE
14816-004
VAC
VEE
Figure 4. INP and INN Interface Schematic
Figure 8. VAC Interface Schematic
VCC
VCC
50Ω
20kΩ
QP,
QN
VEE
14816-005
VEE
Figure 5. EN Interface Schematic
Figure 9. QN and QP Interface Schematic
VCC
GND
14816-006
VEE
GND
14816-010
EN
14816-009
250Ω
Figure 10. VCC Interface Schematic
Figure 6. VEE Interface Schematic
Rev. B | Page 6 of 13
Data Sheet
HMC911
TYPICAL PERFORMANCE CHARACTERISTICS
60
50
40
30
20
10GHz
16GHz
20GHz
22GHz
24GHz
–0.4
–0.2
0
0.2
0.4
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 11. Normalized Time Delay vs. Differential Delay Control Voltage,
Differential Delay Control Voltage Represents VDCP − VDCN Voltage on the X-Axis
30
20
3.13V
3.30V
3.47V
–0.4
–0.2
0
0.2
0.4
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 14. Normalized Time Delay vs. Differential Delay Control Voltage at
22 GHz for Various Voltages, Differential Delay Control Voltage Represents
VDCP − VDCN Voltage on the X-Axis
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
70
60
TIME DELAY (ps)
60
50
40
30
50
40
30
20
20
+85°C
+25°C
–40°C
–0.4
–0.2
0
0.2
0.4
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
Figure 12. Normalized Time Delay vs. Differential Delay Control Voltage at
22 GHz for Various Temperatures, Differential Delay Control Voltage
Represents VDCP − VDCN Voltage on the X-Axis
45
0
TIME DELAY ERROR (ps)
20
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
10
5
9
= –0.6V
= –0.4V
= –0.2V
= 0V
= +0.2V
= +0.4V
= +0.6V
12
14
16
18
10 11 12 13 14 15 16 17 18 19 20
FREQUENCY (GHz)
Figure 13. fIN Power – 2fIN Power vs. Frequency
20
22
24
4
= –0.6V (REFERENCE)
= –0.4V
= –0.2V
= 0V
= +0.2V
= +0.4V
= +0.6V
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
2
0
–2
–4
–6
–8
14816-013
15
8
10
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
VDCP – VDCN
6
25
7
8
8
30
6
6
Figure 15. Time Delay vs. Frequency at VDCP = 2.7 V to 3.9 V with 0.1 V Step
35
5
4
FREQUENCY (GHz)
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
40
2
14816-015
0
–0.6
10
2
4
6
8
10
12
14
FREQUENCY (GHz)
16
18
20
22
14816-016
10
14816-012
NORMALIZED TIME DELAY (ps)
40
0
–0.6
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
70
fIN POWER – 2fIN POWER (dBc)
50
80
80
0
60
10
14816-011
10
0
–0.6
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
70
NORMALIZED TIME DELAY (ps)
70
NORMALIZED TIME DELAY (ps)
80
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
14816-014
80
Figure 16. Time Delay Error vs. Frequency at Mean Frequency (fMEAN) = 18 GHz
Rev. B | Page 7 of 13
HMC911
75
TIME DELAY (ps)
70
65
60
55
4
6
8
10
12
14
16
18
20
22
24
FREQUENCY (GHz)
60
50
375
550
350
500
DC CURRENT (mA)
600
300
275
250
4
6
8
10
12
14
16
18
20
22
24
450
400
350
300
VAC = 2.6V
VDCP = VDCN = 3.3V
fIN = 18GHz
+85°C
+25°C
–40°C
200
3.13
3.30
250
3.47
SUPPLY VOLTAGE (V)
400
3.30
3.47
SUPPLY VOLTAGE (V)
Figure 21. DC Current vs. Supply Voltage for Various Temperatures
600
VDCP = VDCN = 3.3V
VCC = 3.3V
fIN = 10GHz
550
350
500
DC CURRENT (mA)
300
250
200
150
450
400
350
300
100
+85°C
+25°C
–40°C
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
AMPLITUDE CONTROL VOLTAGE (V)
2.6
250
2.7
14816-019
50
0
1.7
+85°C
+25°C
–40°C
200
3.13
Figure 18. Single-Ended Output Voltage Swing vs. Supply Voltage for Various
Temperatures
450
VAC = 2.6V
VDCP = VDCN = 3.3V
fIN = 18GHz
14816-021
225
2
Figure 20. Programmable Maximum Time Delay vs. Frequency for Various
Voltages
400
325
3.13V
3.30V
3.47V
FREQUENCY (GHz)
14816-018
OUTPUT VOLTAGE SWING (mV p-p)
Figure 17. Programmable Maximum Time Delay vs. Frequency for Various
Temperatures
OUTPUT VOLTAGE SWING (mV p-p)
65
55
+85°C
+25°C
–40°C
2
70
Figure 19. Single-Ended Output Voltage Swing vs. Amplitude Control Voltage
(VAC) for Various Temperatures
Rev. B | Page 8 of 13
+85°C
+25°C
–40°C
VDCP = VDCN = 3.3V
VCC = 3.3V
fIN = 10GHz
200
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
AMPLITUDE CONTROL VOLTAGE (V)
2.6
2.7
14816-022
50
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
VDCP = 3.9V
75
14816-017
TIME DELAY (ps)
80
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
VDCP = 3.9V
14816-020
80
Data Sheet
Figure 22. DC Current vs. Amplitude Control Voltage (VAC) for Various
Temperatures
Data Sheet
HMC911
500
400
350
300
250
2
4
6
8
10
12
14
16
18
20
22
24
FREQUENCY (GHz)
Figure 23. Single-Ended Output Voltage Swing vs. Frequency for Various
Temperatures
0.35
5GHz
14GHz
22GHz
–0.4
–0.2
0
0.2
0.4
0.6
Figure 26. Single-Ended Output Voltage Swing vs. Differential Delay Control
Voltage, Differential Control Voltage Represents VDCP − VDCN Voltage on the
X-Axis
0.40
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
0.35
0.30
RMS JITTER (ps)
RMS JITTER (ps)
250
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
0.25
0.20
0.15
0.10
0.25
0.20
0.15
0.10
+85°C
+25°C
–40°C
0
–0.6
–0.4
–0.2
0
0.2
0.4
3.13V
3.30V
3.47V
0.05
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
0
–0.6
14816-024
0.05
Figure 24. RMS Jitter vs. Differential Delay Control Voltage at 18 GHz for
Various Temperatures, Differential Control Voltage Represents VDCP − VDCN
Voltage on the X-Axis
–0.4
–0.2
0
0.2
0.4
Figure 27. RMS Jitter vs. Differential Delay Control Voltage at 18 GHz for
Various Voltages, Differential Control Voltage Represents VDCP − VDCN Voltage
on the X-Axis
18
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
FALL TIME (ps)
16
14
12
10
14
12
10
+85°C
+25°C
–40°C
–0.4
–0.2
0
0.2
0.4
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
+85°C
+25°C
–40°C
0.6
8
–0.6
14816-025
8
–0.6
0.6
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
16
RISE TIME (ps)
300
200
–0.6
0.30
18
350
14816-027
0.40
400
Figure 25. Rise Time vs. Differential Delay Control Voltage, Differential Control
Voltage Represents VDCP − VDCN Voltage on the X-Axis, Input Data Rate =
22.5 Gbps, PRBS 233 − 1
–0.4
–0.2
0
0.2
0.4
DIFFERENTIAL DELAY CONTROL VOLTAGE (V)
0.6
14816-028
200
+85°C
+25°C
–40°C
450
VAC = 2.6V
VDCP = VDCN = 3.3V
VCC = 3.3V
14816-026
450
OUTPUT VOLTAGE SWING (mV p-p)
VAC = 2.6V
VDCP = VDCN = 3.3V
VCC = 3.3V
14816-023
OUTPUT VOLTAGE SWING (mV p-p)
500
Figure 28. Fall Time vs. Differential Delay Control Voltage, Differential Control
Voltage Represents VDCP − VDCN Voltage on the X-Axis, Input Data Rate =
22.5 Gbps, PRBS 233 − 1
Rev. B | Page 9 of 13
HMC911
0
Data Sheet
0
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
–5
INN
INP
–25
–30
–15
–20
–25
–30
–35
–35
–40
–40
–45
2
4
6
8
10
12
14
16
18
20
22
24
–50
0
2
4
6
8
10
12
14
16
18
20
VCC = 3.3V
VAC = 2.6V
VDCP IS VARIED FROM 2.7V TO 3.3V
(50% OF THE WHOLE DELAY RANGE)
INPUT DATA = SINGLE-ENDED 400mV p-p 16GHz CLOCK SIGNAL
VDCP = 1200mV p-p AT 1800MHz,
VDCN = 50Ω TERMINATED,
INPUT DATA = DIFFERENTIAL 400mV p-p, 10Gbps NRZ,
PRBS 223 – 1 PATTERN
TIME DELAY = 37ps
14816-030
VCC = 3.3V
VAC = 2.6V
20ps/DIV
96.4mV/DIV
Figure 30. Output Eye Diagram Continuous Snapshot for 16 GHz Input
+85°C
+25°C
–40°C
60
50
40
30
20
VAC = 2.6V
VCC = 3.3V
0
100M
1G
MODULATION FREQUENCY (Hz)
10G
14816-031
10
20ps/DIV
TIME DELAY = 45.2ps
Figure 33. Output Eye Diagram Continuous Snapshot for 10 Gbps Input
80
70
24
Figure 32. Output Return Loss vs. Frequency,
Figure 29. Input Return Loss vs. Frequency,
99.1mV/DIV
22
FREQUENCY (GHz)
14816-033
0
14816-032
RETURN LOSS (dB)
–20
14816-029
RETURN LOSS (dB)
–15
FREQUENCY (GHz)
MAXIMUM TIME DELAY (ps)
QN
QP
–10
–10
–45
VAC = 2.6V
VDCN = 3.3V
VCC = 3.3V
–5
Figure 31. Maximum Time Delay vs. Modulation Frequency,
Input Data Rate = 22.5 Gbps, PRBS 233 – 1, 6 dBm Input Power Applied to
VDCP and VDCN Terminated to 50 Ω
Rev. B | Page 10 of 13
Data Sheet
HMC911
APPLICATIONS INFORMATION
EVALUATION PRINTED CIRCUIT BOARD (PCB)
14816-035
Generate the evaluation PCB used in this application with
proper RF circuit design techniques. Signal lines at the RF port
must have 50 Ω impedance, and the package ground leads and
exposed paddle must be connected directly to the ground plane
similar to what is shown in Figure 34. Use a sufficient number
of via holes to connect the top and bottom ground planes.
Mount the evaluation board to an appropriate heat sink. The
evaluation PCB shown is available from Analog Devices, Inc.,
upon request.
Figure 34. 600-00070-00-1 (EVAL01-HMC911LC4B) Evaluation Board
Bill of Materials
Table 4.
Component
J1 to J4
J5, J6
J7, J8
TP1 to TP6
C1, C3 to C6
C2, C7 to C10
C9
C11 to C14
U1
PCB
1
Description
K connectors
SMA connectors
SMA connectors for through calibration
DC test points
1 nF capacitors, 0402 package
0.1 μF capacitors, 0402 package
100 nF capacitor, 0402 package
4.7 μF tantalum capacitors
HMC911 analog phase shifter
600-00070-00-1 (EVAL01-HMC911LC4B1) evaluation PCB, circuit board material: Rogers 4350 or Arlon 25 FR
Reference this number when ordering the completed evaluation PCB.
Rev. B | Page 11 of 13
HMC911
Data Sheet
TYPICAL APPLICATION CIRCUIT
Figure 35 shows the typical application circuit. Note that TP2 goes to ground and is not shown in Figure 35.
19
20
21
C1
1nF
1
VCC
VCC
HMC911
2
3
INN
J2
4
AMP
VCC
VEE
TP3
11
10
C10
0.1µF
6
9
C14
4.7µF
QP
J3
15
QN
J4
14
VCC
BUF
8
C6
1nF
7
C9
100nF
16
BUF
TEMPERATURE
COMPENSATION
AND BIAS
5
EN
TP1
17
13
12
INP
J1
18
C5
1nF
VDCP
J5
VDCN
J6
Figure 35. Typical Application Circuit
Rev. B | Page 12 of 13
C3
1nF
C8
0.1µF
C12
4.7µF
C4
1nF
C7
0.1µF
C13
4.7µF
VAC
TP5
VEE
TP4
14816-034
22
C2
0.1µF
23
C11
4.7µF
24
VCC
TP6
Data Sheet
HMC911
OUTLINE DIMENSIONS
PIN 1
INDICATOR
4.13
4.00 SQ
3.87
0.36
0.30
0.24
PIN 1
(0.32 × 0.32)
19
24
1
18
0.50
BSC
EXPOSED
PAD
2.50 SQ
13
6
7
12
TOP VIEW
BOTTOM VIEW
SIDE VIEW
3.10 BSC
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
PKG-000000
SEATING
PLANE
04-03-2015-A
2.50 REF
1.02 MAX
Figure 36. 24-Terminal Ceramic Leadless Chip [LCC]
(E-24-1)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
HMC911LC4B
HMC911LC4BTR
HMC911LC4BTR-R5
EVAL01-HMC911LC4B
1
2
Temperature
Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
Package Body Material
Alumina, White
Alumina, White
Alumina, White
Lead Finish
Gold over Nickel
Gold over Nickel
Gold over Nickel
The HMC911LC4B, HMC911LC4BTR, and HMC911LC4BTR-R5 are RoHS Compliant Parts.
See the Absolute Maximum Ratings section for additional information.
©2014–2016 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D14816-0-10/16(B)
Rev. B | Page 13 of 13
MSL Rating2
MSL3
MSL3
MSL3
Package Description
24-Terminal LCC
24-Terminal LCC
24-Terminal LCC
Evaluation Board
Package
Option
E-24-1
E-24-1
E-24-1