10138654-G03-03LF

MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES PRODUCTS FOR SOLDER-TOBOARD APPLICATIONS Minitek® is FCI’s brand for board-to-board and wire/cable-to-board connectors in 2.00mm pitch. The Minitek® product range includes PCB Card Connectors, Shrouded and Unshrouded headers and IDC/CTW receptacles. FCI is adding five new series of Minitek® Headers to its product range, dedicated to Pin-in-Paste soldering processes. This brochure gives additional information for the correct use of Minitek® PiP connectors in the application process. www.amphenol-icc.com TARGET MARKETS Amphenol Information Communications and Commercial Products MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES PIN-IN-PASTE Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing processes. The connectors are automatically or manually placed on the board, then soldered in the same operationas the SMT components. Despite this, the mechanical strenght of the TMT soldering is maintained – still an important requirement for connectors nowadays in many industrial or automotive applications. CONNECTOR DESIGN In order to achieve optimum soldering results, FCI launches dedicated Pin-in-Paste connectors in the basics+ product range. These connectors are fully adapted to Pin-in-Paste processing in all aspects, including plastic material, housing design, pin length, and packaging. PLASTIC MATERIAL HOUSING DESIGN Minitek PiP headers are moulded in high temperature thermoplastic and are able to withstand exposure to 260°C peak temperature for 30 seconds maximum in a convection, infra-red or vapour phase reflow oven. Standoffs raise the housing body slightly above the PCB surface and thus allow the molten solder paste to flow freely from its printed position into the board hole and around the pin. The standoffs are correctly positioned for a good solder paste deposit around the pin. Please respect the stencil design guidelines below in order to avoid paste deposit around the standoffs. PIN LENGTH The connector lead length beyond the bottom of the PCB is shorter than for traditional TMT products. Thus, the risk of pushing out the solder paste when inserting the pin into the PCB hole is very much limited. The solder paste will not stick on the pin tip or even fall off completely, but stays around the pin for free flow during soldering. FCI uses a solder tail length of 2 ± 0.2mm for Minitek Headers for a standard PCB of 1.6mm thickness. www.amphenol-icc.com PACKAGING For combining SMT and TMT components not only in the soldering process, but also in the assembly process, FCI proposes a choice of pick-and-place packaging for PiP connectors. The most common part numbers are available in tape-on-reel packaging, all others in tube. Disclaimer Please note that the above information is subject to change without notice. MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES TECHNICAL INFORMATION UNSHROUDED/STACKING MATERIALS § Housing: High temperature thermoplastic APPROVALS AND CERTIFICATIONS § Colour: Black This product is RoHS compatible according to the European Union Directive 2002/95/IEC § Flammability Rating: UL94V-O SPECIFICATIONS § Pin: Phosphor bronze § File Number: E66906 § Plating: Gold and tin over 1.27µm nickel § File Number: LR46923 ELECTRICAL PERFORMANCE § Product Drawing: By 8-digit base part number § Current Rating: 1A continuous § Product Specification: DPS-12-011 and GS-12-163 § Insulation Resistance: 1000ΩM min. § Application Specification: TA-895 § Dielectric Withstanding Voltage: 650V § Reflow Profile: TA-842 MECHANICAL PERFORMANCE PROCESSING INFORMATION § Pin Retention: 7 N min. § Compatible with IR reflow soldering processes ENVIRONMENTAL § Operating Temperature Range: -55°C to +125°C SHROUDED MATERIALS § Housing: High temperature thermoplastic APPROVALS AND CERTIFICATIONS § Colour: Black This product is RoHS compatible according to the European Union Directive 2002/95/IEC § Flammability Rating: UL94V-O SPECIFICATIONS § Pin: Phosphor bronze § File Number: E66906 § Plating: Gold and tin over 1.27µm nickel § File Number: LR46923 ELECTRICAL PERFORMANCE § Product Drawing: By 8-digit base part number § Current Rating: 2A continuous § Product Specification: DPS-12-011 and GS-12-163 § Insulation Resistance: 1000ΩM min. § Application Specification: TA-896 § Dielectric Withstanding Voltage: 650V § Reflow Profile: TA-842 MECHANICAL PERFORMANCE PROCESSING INFORMATION § Pin Retention: 7 N min. § Compatible with IR reflow soldering processes ENVIRONMENTAL § Operating Temperature Range: -40°C to +125°C www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice. MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES APPLICATION DESIGN GUIDELINES For application in a Pin-in-Paste process, FCI recommends the application design guidelines below. STENCIL DESIGN PASTE APPLICATION The stencil design is crucial for a good solder joint. It determines the quantity of paste and the position of the paste print on the board. Each PCB hole has its own stencil aperture with enough spacing in between in order to have separate solder deposits. The quantity of paste for each hole depends on the soldering process parameters and the degree of hole filling. For the squeegee, FCI recommends a 45° angle. You can use a smaller angle for an even greater degree of hole filling. The squeegee moves in parallel with with the shorter sides of the stencil apertures. This prevents solder robbing from one hole to another and guarantees the correct quantity of solder paste for each hole. The print position is slightly asymmetrical so as to optimise the flow of molten solder paste. www.amphenol-icc.com PASTE APPLICATION Please use a hole of 0.8mm (right angle headers) or 0.85mm (vertical headers) ± 0.05mm for an optimum paste deposit. For automatic pick-and-place, lean towards the upper end of the tolerance. Refer also to TA-895 (for Headers right angle Shrouded and Unshrouded) et TA-896 (for Headers vertical Shrouded and Unshrouded). Disclaimer Please note that the above information is subject to change without notice. MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES PARTNUMBER SELECTOR - UNSHROUDED HEADERS 8 - DIGIT BASE PART NUMBER PLATING PIN STYLE NO. OF POSITIONS PER ROW Vertical 10072353 Right Angle 0.76µm (30µin.) Gold on contact area, 2-6µm (50-150µin.) Tin on solder side G Gold flash on mating area, 2-6µm (50-150µin.) Tin on solder side F 3 - DIGIT BASE PART NUMBER PLATING U Tube without cap from 04 to 25 pos A Tape availability on request Pin Style Mating Side mm Solder Side mm 01 4.00 2.00 PIN STYLE NO. OF POSITIONS PER ROW 02 to 25 Minitek® Unshrouded Header 59362 LF 02 to 25 Minitek® Unshrouded Header 10075024 PACKAGING PACKAGING STACK HEIGHT LF XXX = mm Specify mm (i.e., 037=03.7) in 0.1 mm increments Vertical 0.76µm (30µin.) Gold on contact area, 2-6µm (50-150µin.) Tin on solder side G Gold flash on mating area, 2-6µm (50-150µin.) Tin on solder side F U Tube without cap from 04 to 25 pos A Tape availability on request Pin Style Oal Solder Side mm 22 08.2 2.00 24 09.6 2.00 26 10.2 2.00 28 11.8 2.00 30 13.5 2.00 32 14.1 2.00 34 15.6 2.00 36 17.1 2.00 38 19.1 2.00 40 21.1 2.00 www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice. MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES 3 - DIGIT BASE PART NUMBER PLATING PIN STYLE NO. OF POSITIONS PER ROW LF 02 to 25 Minitek® Unshrouded Header 10138654 PACKAGING Vertical Single Row Standard packaging in polybags 0.76µm (30µin.) Gold on contact area, 0.76µm (30µin.) Gold on tail G Gold flash on mating area, 2-6µm (0.100µin.) Tin on soldier side T Pin Style Oal Solder Side mm 03 8.00 3.30 04 9.70 2.70 PARTNUMBER SELECTOR - SHROUDED HEADER 8 - DIGIT BASE PART NUMBER PLATING PIN STYLE Vertical 10072354 Right Angle PACKAGING LF 04 to 50 Minitek® Shrouded Header 10075025 NO. OF POSITIONS PER ROW G Gold flash on mating area, 2-6µm (0.100µin.) Tin on soldier side T ube without cap from 08 to 50 pos A Tape availability on request Pin Style Mating Side mm Solder Side mm 01 4.00 2.00 BWBMNTHPIP0621EA4 0.76µm (30µin.) Gold on contact area, 2-6µm (50-150µin.) Tin on solder side U www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice.