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BLM7G1822S-40ABY

BLM7G1822S-40ABY

  • 厂商:

    AMPHENOL(安费诺)

  • 封装:

    SOT-1211-2

  • 描述:

    RF FET LDMOS 65V 31.5DB SOT12112

  • 数据手册
  • 价格&库存
BLM7G1822S-40ABY 数据手册
BLM7G1822S-20PB; BLM7G1822S-20PBG LDMOS 2-stage power MMIC Rev. 6 — 28 September 2018 Product data sheet 1. Product profile 1.1 General description The BLM7G1822S-20PB(G) is a dual section, 2-stage power MMIC using Ampleon’s state of the art GEN7 LDMOS technology. This multiband device is perfectly suited as general purpose driver or small cell final in the frequency range from 1805 MHz to 2170 MHz. Available in gull wing or straight lead outline. Table 1. Performance Typical RF performance at Tcase = 25 °C; IDq1 = 27 mA; IDq2 = 76 mA. Test signal: 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF; per section unless otherwise specified in a class-AB production circuit. Test signal single carrier W-CDMA f VDS PL(AV) Gp ηD ACPR5M (MHz) (V) (W) (dB) (%) (dBc) 2167.5 28 2 32.3 23 41 1.2 Features and benefits          Designed for broadband operation (frequency 1805 MHz to 2170 MHz) High section-to-section isolation enabling multiple combinations Integrated temperature compensated bias Biasing of individual stages is externally accessible Integrated ESD protection Excellent thermal stability High power gain On-chip matching for ease of use For RoHS compliance see the product details on the Ampleon website 1.3 Applications  RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA and LTE base stations in the 1805 MHz to 2170 MHz frequency range. Possible circuit topologies are the following as also depicted in Section 8.1:  Dual section or single ended  Doherty  Quadrature combined  Push-pull BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 2. Pinning information 2.1 Pinning pin 1 index VDS(A1) VGS(A2) VGS(A1) RF_IN_A n.c. n.c. n.c. n.c. n.c. n.c. RF_IN_B VGS(B1) VGS(B2) VDS(B1) 1 2 3 4 5 6 7 16 RF_OUT_ VDS(A2) 8 9 10 11 12 13 14 15 RF_OUT_ VDS(B2) amp00601 Transparent top view The exposed backside of the package is the ground terminal of the device. Fig 1. Pin configuration 2.2 Pin description Table 2. Pin description Symbol Pin Description VDS(A1) 1 drain-source voltage of driver stage A1 VGS(A2) 2 gate-source voltage of final stage A2 VGS(A1) 3 gate-source voltage of driver stage A1 RF_IN_A 4 RF input section A n.c. 5 not connected n.c. 6 not connected n.c. 7 not connected n.c. 8 not connected n.c. 9 not connected n.c. 10 not connected RF_IN_B 11 RF input section B VGS(B1) 12 gate-source voltage of driver stage B1 VGS(B2) 13 gate-source voltage of final stage B2 VDS(B1) 14 drain-source voltage of driver stage B1 BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 2 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC Table 2. Pin description …continued Symbol Pin Description RF_OUT_B/VDS(B2) 15 RF output section B / drain-source voltage of final stage B2 RF_OUT_A/VDS(A2) 16 RF output section A / drain-source voltage of final stage A2 GND flange RF ground 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BLM7G1822S-20PB - plastic, heatsink small outline package; 16 leads (flat) SOT1211-3 BLM7G1822S-20PBG - plastic, heatsink small outline package; 16 leads SOT1212-3 4. Block diagram VDS(A1) RF_IN_A RF_OUT_A / VDS(A2) VGS(A1) VGS(A2) TEMPERATURE COMPENSATED BIAS VGS(B1) VGS(B2) TEMPERATURE COMPENSATED BIAS RF_IN_B RF_OUT_B / VDS(B2) VDS(B1) aaa-009323 Fig 2. Block diagram 5. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Min Max Unit VDS drain-source voltage - 65 V VGS gate-source voltage 0.5 +13 V Tstg storage temperature 65 +150 C - 225 C - 150 C Tj junction temperature Tcase case temperature [1] Conditions [1] Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF calculator. BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 3 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 6. Thermal characteristics Table 5. Thermal characteristics Measured for total device. Symbol Rth(j-c) [1] Parameter Conditions Value Unit final stage; Tcase = 90 C; PL = 3.56 W [1] thermal resistance from junction to case 1.9 K/W driver stage; Tcase = 90 C; PL = 3.56 W [1] 6.2 K/W When operated with a CW signal. 7. Characteristics Table 6. DC characteristics Tcase = 25 °C; per section unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 150.8 A 65 - - V VGSq gate-source quiescent voltage VDS = 28 V; ID = 76 mA Final stage 1.5 2 2.5 V VDS = 28 V; ID = 76 mA [1] 1.7 2.65 3.6 V [1] - 1 - % IDq/T quiescent drain current variation with temperature 40 C  Tcase  +85 C IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 1.4 A IDSX drain cut-off current VGS = 5.55 V; VDS = 10 V - 2.8 - A IGSS gate leakage current VGS = 1.0 V; VDS = 0 V - - 140 nA Driver stage V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 30.16 A 65 - - V VGSq gate-source quiescent voltage VDS = 28 V; ID = 27 mA 1.6 2.1 2.6 V VDS = 28 V; ID = 27 mA [2] 1.9 2.85 3.8 V [2] - 1 - % IDq/T quiescent drain current variation with temperature 40 C  Tcase  +85 C IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 1.4 A IDSX drain cut-off current VGS = 5.55 V; VDS = 10 V - 0.55 - A IGSS gate leakage current VGS = 1.0 V; VDS = 0 V - - 140 nA [1] In production circuit with 1105  gate feed resistor. [2] In production circuit with 765  gate feed resistor. BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 4 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC Table 7. RF Characteristics Typical RF performance at Tcase = 25 °C; VDS = 28 V; IDq1 = 27 mA; IDq2 = 76 mA; PL(AV) = 2 W. Per section unless otherwise specified, measured in an Ampleon wideband f = 1807.5 MHz to 2167.5 MHz straight lead production circuit. Symbol Parameter Conditions Min Typ Max Unit f = 1807.5 MHz - 34 - dB f = 2167.5 MHz 30.8 32.3 33.8 dB f = 1807.5 MHz - 22 - % f = 2167.5 MHz 20 23 - % Test signal: single carrier W-CDMA [1] Gp power gain D drain efficiency RLin input return loss f = 2167.5 MHz - 19 10 dB ACPR5M adjacent channel power ratio (5 MHz) f = 1807.5 MHz - 41 - dBc f = 2167.5 MHz - 41 37 dBc PARO output peak-to-average ratio f = 1807.5 MHz - 8.4 - dB f = 2167.5 MHz 7.2 8.4 - dB final stage IDq; gate feed resistor = 1105  - 1 - % driver stage IDq; gate feed resistor = 765  - 1 - % IDq/T quiescent drain current variation with temperature T = 40 C to +85 C Test signal: CW [2] s21 phase response difference between sections 10 - +10 deg s212 insertion power gain difference between sections 0.5 - +0.5 dB [1] 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF. [2] f = 2170 MHz. 8. Application information Table 8. Typical performance Test signal: 1-tone CW; RF performance at Tcase = 25 °C; VDS = 28 V; IDq1 = 45 mA (both sections); IDq2 = 140 mA (both sections) unless otherwise specified, measured in an Ampleon f = 2110 MHz to 2170 MHz straight lead class AB application circuit (see Figure 3 for the component layout and Figure 4 for the electrical schematic). Symbol Parameter Conditions Min Typ Max Unit PL(1dB) output power at 1 dB gain compression f = 2140 MHz - 43.5 - dBm PL(3dB) output power at 3 dB gain compression f = 2140 MHz - 44.1 - dBm D drain efficiency at PL(1dB); f = 2140 MHz - 47.6 - % Gp power gain PL(AV) = 1.585 W; f = 2140 MHz - 31.5 - dB Bvideo video bandwidth 2-tone CW; PL(AV) = 1.585 W; f = 2140 MHz - 170 - MHz Gflat gain flatness over a frequency range of 60 MHz; PL(AV) = 1.585 W - 0.4 - dB G/T gain variation with temperature f = 2140 MHz - 0.03 - dB/C s122 isolation between sections A and B; PL(AV) = 1.585 W; f = 2140 MHz - 28.5 - dB K Rollett stability factor T = 40 C; f = 0.1 GHz to 3 GHz - >1 [1] [1] - Measured on dual section evaluation board IDq1 = 40 mA (both sections); IDq2 = 150 mA (both sections). BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 5 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 1.0 kΩ 22 kΩ 1.3 kΩ 2.2 kΩ 1.1 kΩ 1 μF 10 uF LM7341 5Ω 750 Ω 10 uF 50 Ω 15 Ω 10 uF -3 dB 2x 10 uF 750 Ω LM7341 1.1 kΩ 1μF 2.2 kΩ VGGB 15 Ω 2x 10 uF 6.8 pF BLM7G1822S-20PB BLM7G1822S-20PB, 2.14GHz VGGA 5Ω 10 uF 1.3 kΩ 22 kΩ 6.2 pF 2x 0.2 pF -3 dB 6.2 pF 50 Ω 6.8 pF 2 x 10 uF 1.0 kΩ amp00624 Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm. Fig 3. Component layout BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 6 of 20 xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxx x x x xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xx xx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxx xxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxx x x xxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxx xxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxx xxxxxxxxxxxxxxxxxxxxxxxxx xxxxxxxxxxxxxxxxxxxx xxx BLM7G1822S-20PB_S-20PBG Product data sheet VDS 28 V 1.3 k 10 F 50 V VDS 28 V Section A BLM7G1822S-20PB VDS(A1) 1 1 F 50 V VGS(A2) 2 22 k DAC drive LM7341 1.1 k 10 F 6.3 V 5 750 15 VGS(A1) 3 ~2.5 V ~2.5 V n.c. 10 F 6.3 V n.m. n.c. Driver clamped RF sense FET 10 F 50 V Final clamped RF sense FET 5 6 16 RF_OUT_A/VDS(A2) 6.2 pF ATC600F RF in n.c. 2.2 k 10 F 50 V 7 Driver RFpower FET Final RFpower FET 0.2 pF ATC600F X3C21P1-03S X3C21P1-03S n.c. 1 F 50 V 22 k n.c. 50 DAC drive LM7341 750 10 F 6.3 V 15 n.c. Driver RF power FET 1.1 k 5 Final RF power FET 8 15 RF_OUT_B/VDS(B2) 10 RF_IN_B 11 Driver clamped RF sense FET Final clamped RF sense FET 6.8 pF ATC600F VGS(B2) 13 10 F 50 V 10 F 50 V VDS 28 V VDS(B1) 14 Section B 2.2 k VDS 28 V Fig 4. Electrical schematic 10 F 50 V BLM7G1822S-20PB aaa-013370 LDMOS 2-stage power MMIC 7 of 20 © Ampleon Netherlands B.V. 2018. All rights reserved. nm Quad AB out VGS(B1) 12 ~2.5 V 10 F 6.3 V 6.2 pF ATC600F 9 ~2.5 V 1k 0.2 pF ATC600F BLM7G1822S-20PB(G) Rev. 6 — 28 September 2018 All information provided in this document is subject to legal disclaimers. RF_IN_A 4 1k VDS 28 V 6.8 pF ATC600F BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 8.1 Possible circuit topologies -3 dB / Φ-0° In A Out A In Out -3 dB / Φ-0° In B Out B amp00514 Fig 5. Dual section or single ended Splitter In Combiner -3 dB / Φ-0° λ/4 λ/4 -3 dB / Φ-90° Out amp00603 Fig 6. Doherty 3 dB Coupler 3 dB Coupler In -3 dB / Φ-0° -3 dB / Φ-90° Out amp00515 Fig 7. Quadrature combined BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 8 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC Splitter In Combiner -3 dB / Φ-0° λ/2 λ/2 -3 dB / Φ-180° Out amp00516 Fig 8. Push-pull 8.2 Ruggedness in class-AB operation The BLM7G1822S-20PB and BLM7G1822S-20PBG are capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 32 V; IDq1 = 20 mA (per section); IDq2 = 75 mA (per section); Pi = 16 dBm (CW and corresponding to PL(3dB) under ZS = 50  load); f = 2140 MHz. 8.3 Impedance information Table 9. Typical impedance at 3 dB compression point Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 °C; VDS = 28 V; IDq1 = 20 mA; IDq2 = 65 mA; tp = 100 μs; δ = 10 %; ZS = 50 Ω. Typical values unless otherwise specified. tuned for maximum output power tuned for maximum efficiency f ZL Gp(max) PL ηadd AM-PM ZL conversion Gp(max) PL ηadd AM-PM conversion (MHz) (Ω) (dB) (dBm) (%) (deg) (Ω) (dB) (dBm) (%) (deg) BLM7G1822S-20PB 1700 15.3  j14.5 33.2 42.7 50.6 8.3 28.5  j20.2 34.6 41.6 56.5 9.2 1800 16.3  j11.7 32.9 42.7 50.8 6.3 31.3  j8.60 34.1 41.6 57.1 7.0 1900 16.1  j9.70 32.1 42.8 50.8 6.1 26.5  j0.01 33.3 41.7 57.3 6.9 2000 15.5  j8.10 31.5 42.8 50.1 6.1 21.0 + j2.20 32.6 42.0 56.4 7.3 2100 14.4  j6.90 31.5 42.9 50.0 6.9 15.6 + j2.00 32.9 42.1 55.8 8.6 2200 13.7  j6.60 31.7 42.7 49.8 8.5 12.3 + j1.20 33.0 41.6 54.3 9.6 2300 12.8  j6.80 31.4 42.5 49.1 10.6 10.0 + j0.10 32.5 41.3 53.6 10.3 BLM7G1822S-20PBG 1700 15.8  j16.1 33.5 42.5 52.9 9.2 28.9  j21.8 35.1 41.6 57.9 11.1 1800 16.5  j13.8 32.9 42.5 51.2 7.7 30.6  j11.6 34.2 41.6 56.8 8.4 1900 16.7  j12.4 32.2 42.5 50.2 7.2 27.9  j4.64 33.5 41.7 55.9 7.8 2000 16.3  j9.74 31.7 42.5 51.2 7.3 20.4 + j0.45 32.7 41.7 55.6 9.0 2100 15.6  j8.61 31.5 42.6 52.0 9.5 15.9 + j0.68 32.6 41.7 56.5 11.8 2200 14.6  j8.87 31.3 42.5 49.7 10.3 12.7  j0.44 32.4 41.6 53.8 12.1 2300 13.4  j9.32 30.5 42.4 48.2 12.8 10.7  j1.98 31.7 41.6 53.7 13.2 BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 9 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 8.4 Graphs aaa-013192 36 Gp (dB) 0 RLin (dB) (1) 30 -6 24 -12 18 -18 12 aaa-013193 33 Gp (dB) RLin (dB) (1) 31 -10 29 -20 (2) -24 (2) 27 6 -30 -30 0 1000 1400 1800 2200 2600 f (MHz) -36 3000 25 -40 2080 2095 2110 2125 2140 2155 2170 2185 2200 f (MHz) Tcase = 25 C; VDS = 28 V; IDq1 = 22 mA; IDq2 = 70 mA; PL = 1.585 W. Per section. Tcase = 25 C; VDS = 28 V; IDq1 = 22 mA; IDq2 = 70 mA; PL = 1.585 W. Per section. (1) magnitude of Gp (1) magnitude of Gp (2) magnitude of RLin (2) magnitude of RLin Fig 9. 0 Wideband power gain and input return loss as function of frequency; typical values aaa-013194 33 Gp (dB) 32 60 ηD . (%) Gp Fig 10. In-band power gain and input return loss as function of frequency; typical values (. aaa-013195 6 φs21/φs21(norm) (deg) 50 2 31 40 (1) (1) (2) (2) (3) (3) 30 30 29 20 (3) (2) (1) -2 -6 ηD 28 10 27 0 20 25 30 35 40 PL (dBm) 45 Tcase = 25 C; VDS = 28 V; IDq1 = 22 mA; IDq2 = 70 mA. Per section. -10 20 25 35 40 PL (dBm) 45 Normalized at PL = 22 dBm; Tcase = 25 C; VDS = 28 V; IDq1 = 22 mA; IDq2 = 70 mA. Per section. (1) f = 2110 MHz (1) f = 2110 MHz (2) f = 2140 MHz (2) f = 2140 MHz (3) f = 2170 MHz (3) f = 2170 MHz Fig 11. Power gain and drain efficiency as function of output power; typical values 30 Fig 12. Normalized phase response as a function of output power; typical values BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 10 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC aaa-013197 -30 IMD (dBc) (1) (2) IMD3 -45 IMD5 -60 (1) (2) IMD7 (1) (2) -75 -90 1 102 10 tone spacing (MHz) 103 Tcase = 25 C; VDS = 28 V; IDq1 = 22 mA; IDq2 = 70 mA; f = 2140 MHz; 2-tone CW; PL(AV) = 0.25 W. Per section. (1) IMD low (2) IMD high Fig 13. Intermodulation distortion as a function of tone spacing; typical values aaa-013199 -25 ACPR (dBc) 45 ηD (%) -35 -45 aaa-013200 50 |2 |s12 (dB) 35 40 25 30 15 20 5 10 ACPR5M -55 ηD -65 ACPR10M -75 -5 26 28 30 32 34 36 38 PL (dBm) 40 Tcase = 25 C; VDS = 28 V; IDq1 = 22 mA; IDq2 = 70 mA; f = 2140 MHz; 1-carrier W-CDMA; test model 1; PAR = 7.2 dB at 0.01 % probability on CCDF. Per section. Fig 14. Adjacent channel power ratio and drain efficiency as function of output power; typical values 0 2025 2070 2115 2160 2205 f (MHz) 2250 Tcase = 25 C; VDS = 28 V; IDq1 = 20 mA; IDq2 = 75 mA. Per section. Measured on evaluation board. Fig 15. Isolation as a function of frequency; typical values BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 11 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 9. Package outline SOT1211-3 (18.01) (2.15) (15.44) (0.75) 7.45 15 16 A L 0.05 A R1.38 9.96(1) 16.00 9.78 15.96 B0.20 (7.04) (4.47) E 0.10 (4) P2.00 0.1Z R0.16 max. 1 14 1.50 1.00 (12x) 0.35 (14x) (3) 20.75(1) R1.00 0.10 metal protrusion 4x (ground) in corners (2) 1.57 (5) 0.22 B0.05 L 0.25 B +0.08 3.92 - 0.03 L 0.05 B R0.32 B 20.57 Min. 5.5 Min. 7.8 (0.20) molding compound around the perimeter of the heatsink R0.60(4x) pin 17 (6) L 0.25 B 5.50 (3) Min. 15.5 Min. 18.5 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1211-3 Third angle projection 1 7/26/2018 Sheet 1 of 2 Fig 16. Package outline SOT1211-3 (sheet 1 of 2) BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 12 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC SOT1211-3 Drawing Notes Description Items Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25 (1) mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm. max. At all other areas the (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The lead coplanarity over all leads is 0.1 mm maximum. (5) Dimension is measured 0.5 mm from the edge of the top package body. (6) The hatched area indicates the exposed metal heatsink. (7) The leads and exposed heatsink are plated with matte Tin (Sn). mold protrusion is maximum 0.15 mm per side. See also detail B. location of metal protrusion (2) DETAIL A SCALE 25:1 B A 0 .2 a 5m x. ( 1) lead dambar location 0 0 .6 2m 5 0.1 ax ma x. m .2 5 ax . (1 ) (1) (1) DETAIL B SCALE 50:1 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1211-3 Third angle projection 1 7/26/2018 Sheet 2 of 2 Fig 17. Package outline SOT1211-3 (sheet 2 of 2) BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 13 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC SOT1212-3 (18.01) 0.22 B0.05 (15.44) (2.15) 7.45 A (0.75) 16 L 0.05 A 15 9.78 9.96(1) (4.47) (7.04) 16 13.2 B.30 R1.38 P2 0.1Z C metal protrusion 4x (ground) in corners (2) 1.5 1 (12x) R0.16 max. 14 1 0.35 (14x) (3) L 0.25 B 20.75 (1) L 0.05 B 3.92 R1 DETAIL C SCALE 25:1 +.08 - .03 R0.32 B 20.57 0.10 0.95 B0.15 H 3.0° Min. 5.5 Min. 7.8 (0.20) compound rim all around the perimeter of the heatsink +4° - 3° 0.00 +- 0.06 0.02 (6) pin 17 (4) Gage plane 0.35 (7) Seating plane R0.60 (4x) L 0.25 B 5.5 (3) Min. 15.5 Min. 18.5 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1212-3 Third angle projection 1 7/26/2018 Sheet 1 of 2 Fig 18. Package outline SOT1212-3 (sheet 1 of 2) BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 14 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC SOT1212-3 Drawing Notes Description Items Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25 (1) mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm max. At all other areas the (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). mold protrusion is maximum 0.15 mm per side. See also detail B. (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The hatched area indicated the exposed heatsink. (5) The leads and exposed heatsink are plated with matte Tin (Sn). Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the (6) heatsink is higher than the bottom of the lead. (7) Gage plane (foot length) to be measured from the seating plane. location of metal protrusion (2) B DETAIL A SCALE 25:1 A 0 .6 2m ax . (1) lead dambar location 5 0.2 x ma ) .(1 5 0.1 x ma . (1 ) DETAIL B SCALE 50:1 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1212-3 Third angle projection 1 7/26/2018 Sheet 2 of 2 Fig 19. Package outline SOT1212-3 (sheet 2 of 2) BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 15 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 10. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. Table 10. ESD sensitivity ESD model Class Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002 C1 [1] Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001 1A [2] [1] CDM classification C1 is granted to any part that passes after exposure to an ESD pulse of 250 V. [2] HBM classification 1A is granted to any part that passes after exposure to an ESD pulse of 250 V. 11. Abbreviations Table 11. Abbreviations Acronym Description AM Amplitude Modulation 3GPP 3rd Generation Partnership Project CCDF Complementary Cumulative Distribution Function CW Continuous Wave DPCH Dedicated Physical CHannel ESD ElectroStatic Discharge GEN7 Seventh Generation GSM Global System for Mobile Communications LDMOS Laterally Diffused Metal Oxide Semiconductor LTE Long Term Evolution MMIC Monolithic Microwave Integrated Circuit MTF Median Time to Failure PAR Peak-to-Average Ratio PM Phase Modulation RoHS Restriction of Hazardous Substances VSWR Voltage Standing-Wave Ratio W-CDMA Wideband Code Division Multiple Access BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 16 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 12. Revision history Table 12. Revision history Document ID Release date Data sheet status BLM7G1822S-20PB_S-20PBG v.6 20180928 Product data sheet Modifications • Change notice Supersedes BLM7G1822S-20PB_S -20PBG v.5 Section 9 on page 12: package outline versions updated BLM7G1822S-20PB_S-20PBG v.5 20180227 Product data sheet BLM7G1822S-20PB_S -20PBG v.4 BLM7G1822S-20PB_S-20PBG v.4 20150901 Product data sheet BLM7G1822S-20PB_S -20PBG v.3 BLM7G1822S-20PB_S-20PBG v.3 20150701 Product data sheet - BLM7G1822S-20PB_ S-20PBG v.2 BLM7G1822S-20PB_S-20PBG v.2 20140626 Objective data sheet - BLM7G1822S-20PB_ S-20PBG v.1 BLM7G1822S-20PB_S-20PBG v.1 20131219 Objective data sheet - - BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 17 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 18 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’s warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’s specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’s standard warranty and Ampleon’s product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. 14. Contact information For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales BLM7G1822S-20PB_S-20PBG All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 6 — 28 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 19 of 20 BLM7G1822S-20PB(G) LDMOS 2-stage power MMIC 15. Contents 1 1.1 1.2 1.3 2 2.1 2.2 3 4 5 6 7 8 8.1 8.2 8.3 8.4 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics. . . . . . . . . . . . . . . . . . . 4 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Application information. . . . . . . . . . . . . . . . . . . 5 Possible circuit topologies . . . . . . . . . . . . . . . . 8 Ruggedness in class-AB operation. . . . . . . . . . 9 Impedance information . . . . . . . . . . . . . . . . . . . 9 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Handling information. . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Ampleon Netherlands B.V. 2018. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 28 September 2018 Document identifier: BLM7G1822S-20PB_S-20PBG
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