AT88SA100S

A tmel AT88SA100S Atmel CryptoAuthentication Battery Authentication Chip DATASHEET Features • • • • • • • • Secure battery authentication Superior SHA-256 hash algorithm Best in class 256-bit key length Guaranteed unique 48-bit serial number High speed single wire interface Supply voltage: 2.7 – 5.25 V =3.7 V; must be 0xFFFF otherwise Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 15 6.4 GenPersonalizationKey This command generates a decryption digest that will be used by the subsequent command (LoadSram) to decrypt the key value that is to be written into the SRAM. This command must be run immediately prior to LoadSram within the same watchdog cycle. This command loads a transport key from an internal secure storage location and then uses that key along with an input seed to generate a decryption digest using SHA-256. Neither the transport key nor the decryption digest can be read from the chip. Upon completion, an internal bit is set indicating that the decryption digest has been generated and is ready to use by LoadSram. This bit is cleared (and the digest lost) when the watchdog timer expires, the chip goes to sleep or the power is cycled. Table 6-9. Input Parameters Name Opcode Param1 Param2 Data GenPers Zero KeyID Seed Size 1 1 2 16 Notes 0x20 Must be 0x00 Identification number of the personalization key to be loaded Seed for digest generation. The least significant bit of the last byte is ignored Table 6-10. Output Parameter Name Success Size 1 Notes Upon successful execution, a value of 0 will be returned by the AT88SA100S chip The SHA-256 message body used to create the decryption digest which is internally stored in the chip consists of the following 512-bits: 256-bits 64-bits 127-bits 1-bit 64-bits Stored Key[KeyID] All ones Input seed ‘1’ pad length of message in bits, fixed at 447 Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 16 6.5 LoadSram Writes 256-bits into the battery backed SRAM and locks this memory against further modification. The value in the battery backed SRAM cannot be read, it must be verified via the MAC command. If the secret value in the SRAM is already valid then this command will fail with an error response. The only way to unlock the SRAM is to remove power from the AT88SA100S. The input data (secret key) is always decrypted using the decryption digest previously generated by GenPersonalizationKey prior to being written into the battery backed SRAM. Note: Both the GenPersonalizationKey and LoadSram commands must be run consecutively within a single Wake cycle prior to the expiration of the watchdog timer. If any command is inserted between these two operations then LoadSram will fail. Table 6-11. Input Parameters Name Opcode Param1 Param2 Data LOADSRAM Zero1 Zero2 Key Size 1 1 2 32 Notes 0x10 Must be 0x00 Must be 0x0000 Encrypted value to be written into the SRAM Table 6-12. Output Parameter Name Success Size 1 Notes Upon successful execution, a value of 0 will be returned by the AT88SA100S chip The AT88SA100S chip executes the following sequence on receipt of this command. 1. 2. 3. 4. If the internal flag (indicating that a personalization key has been loaded) is not set, then return error. If the MemValid flag is set, return error Successively XOR each byte in the data (secret key) parameter with the corresponding byte from the personalization key generated by GenPersonalizationKey Transfer the resulting bytes to the battery backed SRAM Set MemValid (internal flag) to one Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 17 6.6 PauseLong Forces the chip into the pause state until the watchdog timer expires, after which it will automatically enter into the sleep state. During execution of this command the chip will ignore all activity on the IO signal. This command is used to prevent bus conflicts in a system that also includes the CryptoAuthentication host chip sharing the same signal wire. Table 6-13. Input Parameters Name Opode Param1 Param2 Data PAUSELONG Selector Zero Ignored Size 1 1 2 0 Notes 0x01 Which chip to put into the pause state, 0x00 for all chips Must be 0x0000 Table 6-14. Output Parameter Name Success Size 1 Notes If the command indicates that some other chip should go into the pause state, a value of zero will be returned by this AT88SA100S chip. If this chip goes into the pause state no value will be returned. The selector parameter provides a mechanism to select which AT88SA100S will pause if there are multiple devices on the bus: • • If the selector parameter is 0x00, then every chip receiving this command will go into the pause state and no chip will return a success code. If any of the bits of the selector parameter are set, then the chip will read the values of Fuse[84-87] and go to sleep only if those fuse values match the least significant four bits of the selector parameter. If the chip does not go into the pause state, it returns an error code of 0x0F. Otherwise, it goes into the pause state and never returns any code. Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 18 7. Pinout Table 7-1. Pin Definitions SOT-23 1 Name Signal Description IO channel to the system, open drain output. It is expected that an external pull-up resistor will be provided to pull this signal up to VCC for proper communications. When the chip is not in use this pin can be pulled to either VCC or GND. Power supply, 2.7 – 5.25 V. This pin should be bypassed with a high quality 0.1µF capacitor close to this pin with a short trace to GND Additional applications information at www.atmel.com Connect to system ground Not connected SOIC/TSSOP 5 8 2 VCC 4 1,2,3,6,7 3 -- GND NC Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 19 8. Package Drawings 3TS1 – Shrink SOT 3 GND C L E1 E 1 e1 2 Top View End View b A2 SEATING PLANE A e D A1 Side View L1 Signal SDA VCC Notes: 1. Dimension D does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.25mm per end. Dimension E1 does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side. 2. The package top may be smaller than the package bottom. Dimensions D and E1 are determined at the outermost extremes of the plastic body exclusive of mold flash, tie bar burrs, gate burrs and interlead flash, but including any mismatch between the top and bottom of the plastic body. 3. These dimensions apply to the flat section of the lead between 0.08 mm and 0.15mm from the lead tip. COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN NOM MAX NOTE This drawing is for general information only. Refer to JEDEC Drawing TO-236, Variation AB for additional information. A A1 A2 D E E1 L1 e1 b 0.89 0.01 0.88 2.80 2.10 1.20 2.90 1.30 0.54 REF 1.90 BSC 0.30 - 1.12 0.10 1.02 3.04 2.64 1.40 1,2 1,2 0.50 3 12/11/09 TITLE R Package Drawing Contact: packagedrawings@atmel.com GPC DRAWING NO. REV. 3TS1, 3-lead, 1.30mm Body, Plastic Thin Shrink Small Outline Package (Shrink SOT) TBG 3TS1 B Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 20 8X – TSSOP C 1 Pin 1 indicator this corner E1 E L1 N L Top View b A A1 End View e D A2 SYMBOL A COMMON DIMENSIONS (Unit of Measure = mm) MIN 0.05 0.80 2.90 NOM 1.00 3.00 MAX 1.20 0.15 1.05 3.10 6.40 BSC 4.30 0.19 4.40 – 0.65 BSC 0.45 0.60 1.00 REF 0.09 0.20 0.75 4.50 0.30 3, 5 4 2, 5 NOTE Side View Notes: 1. This drawing is for general information onl Refer to y. JEDEC Drawing MO-153, VariationAA, for proper dimensions, tolerances, datums, etc. 2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed 0.15mm (0.006in) per side. 3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25mm (0.010in) per side. 4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between protrusion and adjacent lead is 0.07mm. 5. Dimension D and E1 to be determined at Datum Plane H. A1 A2 D E E1 b e L L1 C 6/22/11 TITLE GPC DRAWING NO. 8X REV. D Package Drawing Contact: 8X, 8-lead 4.4mm Body, Plastic Thin packagedrawings@atmel.com Shrink Small Outline Package (TSSOP) TNR Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 21 8S1 – JEDEC SOIC C 1 E E1 N L Ø TOP VIEW END VIEW e b A A1 COMMON DIMENSIONS (Unit of Measure = mm) SYMBOL MIN A 1.35 A1 b C D E1 E e L 0.40 0° 0.10 0.31 0.17 4.80 3.81 5.79 NOM – – – – – – – 1.27 BSC – – 1.27 8° MAX 1.75 0.25 0.51 0.25 5.05 3.99 6.20 NOTE D SIDE VIEW Notes: This drawing is for general information only. Refer to JEDEC Drawing MS-012, Variation AA for proper dimensions, tolerances, datums, etc. 6/22/11 TITLE Package Drawing Contact: 8S1, 8-lead (0.150” Wide Body), Plastic Gull packagedrawings@atmel.com Wing Small Outline (JEDEC SOIC) GPC SWB DRAWING NO. 8S1 REV. G Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 22 9. Ordering Information Atmel AT88SA100S Ordering Information Atmel Ordering Code AT88SA100S-SH-CZ-T AT88SA100S -TH-CZ-T AT88SA100S -TSU-T Package Type SOIC, Tape and Reel TSSOP, Tape and Reel 3LD SOT23, Tape and Reel Temperature Range -40 °C to 85 °C -40 °C to 85 °C -40 °C to 85 °C 10. Revision History Doc. Rev. 8558F 8558E 8558D 8558C 8558B 8558A Date 09/2011 08/2010 06/2010 05/2010 04/2010 03/2009 Comments Correct references and sections numbers Section 5.1.3, Sleep Flag, change “ within 0.5V of VCC” to “within 0.3V of VCC” Update IO timeout description Update to Table 3: AC Parameters Expansion of IO Timeout specification Add TSSOP and SOIC packages Initial document release Atmel AT88SA100S [DATASHEET] 8558F−CRYPTO−9/11 23 Atmel Corporation 2325 Orchard Parkway San Jose, CA 95131 USA Tel: (+1)(408) 441-0311 Fax: (+1)(408) 487-2600 www.atmel.com Atmel Asia Limited Unit 01-5 & 16, 19F BEA Tower, Millennium City 5 418 Kwun Tong Road Kwun Tong, Kowloon HONG KONG Tel: (+852) 2245-6100 Fax: (+852) 2722-1369 Atmel Munich GmbH Business Campus Parkring 4 D-85748 Garching b. Munich GERMANY Tel: (+49) 89-31970-0 Fax: (+49) 89-3194621 Atmel Japan 9F, Tonetsu Shinkawa Bldg. 1-24-8 Shinkawa Chuo-ku, Tokyo 104-0033 JAPAN Tel: (+81)(3) 3523-3551 Fax: (+81)(3) 3523-7581 © 2011 Atmel Corporation. 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